Flip LED lamp bead packaging method and flip LED lamp bead assembly

Abstract

The invention relates to a flip LED lamp bead packaging method and a flip LED lamp bead assembly, a plurality of packaged lamp beads are transferred to a pasting adhesive film in an array form, and then the packaged lamp beads are integrally attached to a module plate with preset scaling powder, so that the problem of low efficiency of traditional single lamp bead transfer is avoided, and the pasting efficiency is remarkably improved through batch operation of pasting the adhesive film; bayonet grooves in the back faces of the lamp beads and bonding pads of the module plates are pre-positioned through physical clamping, electrical connection is completed in combination with the through-furnace hardening process, welding stability is ensured through the structural design of the bayonet grooves, and through-furnace hardening, reliable welding is achieved through scaling powder. The side walls of the lamp beads and the top face of the module plate are covered with the adhesive film through the film breaking technology, the air tightness of the whole screen is improved, and additional steps of a traditional glue pouring technology are omitted.

Description

Technical Field

[0001] This application relates to the field of flip-chip packaging, and specifically relates to a flip-chip LED bead packaging method and a flip-chip LED bead component. Background Art

[0002] A flip-chip LED bead is a semiconductor light-emitting device with a packaging design where the active surface faces downwards. Its core structure includes: a flip-chip, whose chip electrodes are directly bonded to the substrate, eliminating the traditional wire bonding process and having an electrical surface layout facing downwards; a white glue bump, with a tapered structure that is wide at the bottom and narrow at the top, which expands the light-emitting angle by reflecting light; and a packaging glue layer, which fills the gap between the chip and the substrate, protects the circuit, and improves the light efficiency.

[0003] In the related art, in the traditional flip-chip LED bead packaging method, the beads are transferred to the module board one by one, with slow efficiency, and potting is performed after the beads are pasted, with cumbersome steps. Summary of the Invention

[0004] This application provides a flip-chip LED bead packaging method and a flip-chip LED bead component, which can solve the technical problems in the traditional LED bead packaging method where the beads are transferred to the module board one by one with slow efficiency, and potting is performed after the beads are pasted, with cumbersome steps.

[0005] In a first aspect, an embodiment of this application provides a flip-chip LED bead packaging method, and the flip-chip LED bead packaging method includes the following steps:

[0006] Transfer a plurality of packaged bead arrays to a paste film, then correspondingly attach the paste film with beads to a module board pre-coated with a soldering flux, so that the bayonet slots on the back of the beads are engaged with the pads on the module board, and then perform furnace hardening.

[0007] In combination with the first aspect, in an implementation, after the step of transferring a plurality of packaged bead arrays to a paste film, then correspondingly attaching the paste film with beads to a module board pre-coated with a soldering flux, so that the bayonet slots on the back of the beads are engaged with the pads on the module board, and then performing furnace hardening, it further includes:

[0008] Peel off the paste film on the top surface of the beads and the module board;

[0009] Or

[0010] Use a film-breaking process to make the paste film cover the side walls of the beads and the top surface of the module board.

[0011] In combination with the first aspect, in an implementation, the packaged beads include:

[0012] Process the circuit pads and pins on the front and back sides of the substrate;

[0013] Use a light-curing adhesive film, a gasket and an encapsulation adhesive to complete the printing, die bonding and encapsulation of the substrate.

[0014] Use a laser to etch the back of the substrate, remove the light-curing adhesive film at the pin area on the back of the substrate, so that a bayonet slot is formed between the remaining light-curing adhesive film and the pins, and cut the substrate to form multiple electrically isolated lamp beads.

[0015] Combined with the first aspect, in an embodiment, the processing of the circuit pads and pins on the front and back of the substrate includes:

[0016] Use a conductive metal as the substrate, stick a light-removable adhesive film 1 on the back of the substrate, and perform a photolithography process on the front of the substrate to obtain circuit pads.

[0017] Apply a nickel-gold plating to the circuit pads, and apply an ink layer on the circuit surface of the circuit pads.

[0018] Combined with the first aspect, in an embodiment, the thickness of the ink layer is at least 10 um higher than the thickness of the circuit pads, and the material of the substrate includes copper or copper alloy.

[0019] Combined with the first aspect, in an embodiment, the processing of the circuit pads and pins on the front and back of the substrate includes:

[0020] Stick a light-removable adhesive film 2 on the front of the substrate on which the circuit pads have been fabricated, and use the light-removable adhesive film 2 to flip the back of the substrate.

[0021] Use light to irradiate the back of the substrate to remove the light-removable adhesive film 1 on the back of the substrate, apply a nickel-gold plating to the pins on the back of the substrate, and then peel off the light-removable adhesive film 2.

[0022] Combined with the first aspect, in an embodiment, the use of a light-curing adhesive film, a gasket and an encapsulation adhesive to complete the printing, die bonding and encapsulation of the substrate includes:

[0023] Stick a light-curing adhesive film on the back of the substrate, stick a gasket on the bottom surface of the light-curing adhesive film on the back of the substrate, after normal printing and die bonding, remove the gasket on the bottom surface of the light-curing adhesive film.

[0024] Use the encapsulation adhesive to encapsulate on the front of the substrate, use light to irradiate the back of the substrate to cure the light-curing adhesive film on the back of the substrate, so that the cured light-curing adhesive film on the back of the substrate and the encapsulation adhesive on the front of the substrate completely wrap the sides of the lamp beads.

[0025] In a second aspect, an embodiment of the present application provides a flip-chip LED lamp bead assembly, which includes:

[0026] A plurality of lamp beads, wherein the front sides of the plurality of lamp beads are adhered with a same adhesive film, and the back sides of the lamp beads are provided with a bayonet slot;

[0027] A module plate, the top surface of which is provided with solder pads whose number is the same as that of the plurality of lamp beads, and the lamp beads are engaged and positioned with the corresponding solder pads through the bayonet grooves.

[0028] In combination with the second aspect, in one implementation, the lamp bead includes:

[0029] substrate;

[0030] The packaging glue and the light-curing adhesive film are arranged on the front side of the substrate, and the light-curing adhesive film is arranged on the back side of the substrate, and the packaging glue and the light-curing adhesive film extend and wrap around the side of the substrate.

[0031] In combination with the second aspect, in one implementation, the light-curable adhesive film does not cover the pins of the substrate, and a bayonet groove is formed between the pins and the light-curable adhesive film around them.

[0032] The beneficial effects brought by the technical solution provided in the embodiments of the present application include:

[0033] (1) A plurality of packaged lamp beads are transferred to an adhesive film in an array form, and then bonded as a whole to a module board pre-set with flux, which avoids the inefficiency of traditional single lamp bead transfer and significantly improves mounting efficiency through batch operation of adhesive film bonding; the bayonet slot on the back of the lamp bead and the soldering pad of the module board are pre-positioned by physical engagement, and the electrical connection is completed by combining the furnace hardening process. The bayonet slot structure design ensures welding stability, and the furnace hardening uses flux to achieve reliable welding;

[0034] (2) The film breaking process is used to cover the side wall of the lamp bead and the top surface of the module board with the adhesive film, thereby improving the air tightness of the entire screen and eliminating the extra steps of the traditional glue filling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 A schematic diagram of attaching a layer of light-removable adhesive film 1 to the back of a substrate;

[0037] Figure 2 A schematic diagram of processing the front side of the substrate to form a circuit pad;

[0038] Figure 3 Schematic diagram of pasting an adhesive film on the front side of the substrate;

[0039] Figure 4 Schematic diagram of pasting a light-curing adhesive film on the back side of the substrate;

[0040] Figure 5 Schematic diagram of covering an ink layer on the circuit surface of the circuit pads on the front side of the substrate;

[0041] Figure 6 Schematic diagram of pasting a gasket on the bottom surface of the light-curing adhesive film on the back side of the substrate;

[0042] Figure 7 Schematic diagram of printing and die-bonding on the front side of the substrate;

[0043] Figure 8 Schematic diagram of encapsulating the front side of the substrate and curing the light-curing adhesive film on its back side;

[0044] Figure 9 Schematic diagram of forming a bayonet slot on the light-curing adhesive film on the back side of the substrate;

[0045] Figure 10 Schematic diagram of the module board;

[0046] Figure 11 Schematic diagram of attaching the lamp beads to the module board;

[0047] Figure 12 Schematic diagram of pasting the lamp beads on the adhesive film;

[0048] Figure 13 Schematic diagram of attaching the adhesive film to the module board.

[0049] In the figure: 1. Substrate; 2. Light-removable adhesive film I; 3. Circuit pads; 4. Positioning holes; 5. Light-curing adhesive film; 6. Ink layer; 7. Pins; 8. Gasket; 9. Solder paste; 10. Chip; 11. Encapsulation glue; 12. Module board; 13. Pad; 14. Adhesive film; 15. Bayonet slot; 16. Light-removable adhesive film II. Detailed implementation manners

[0050] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0051] The embodiment of the present application provides a flip-chip LED lamp bead packaging method and a flip-chip LED lamp bead component, which can solve the technical problems in the traditional LED lamp bead packaging method. That is, when the lamp beads are transferred to the module board one by one, the efficiency is slow, and after the lamp beads are pasted, glue filling is carried out, and the steps are cumbersome.

[0052] In the first aspect, the embodiment of the present application provides a flip-chip LED lamp bead packaging method, which includes the following steps:

[0053] S100: As Figure 12 shown, transfer a plurality of packaged lamp bead arrays to the adhesive film 14, and then fit the adhesive film 14 with the lamp beads correspondingly to the module board 12 pre-coated with flux, so that the bayonet slots 15 on the back of the lamp beads are engaged with the pads 13 of the module board 12, and then pass through the furnace for hardening.

[0054] In this embodiment, in step S100, a plurality of packaged lamp beads are transferred to the adhesive film 14 in an array form, and then integrally fitted to the module board 12 pre-coated with flux, avoiding the low efficiency problem of traditional single lamp bead transfer. The mounting efficiency is significantly improved through the batch operation of the adhesive film 14; the bayonet slots 15 on the back of the lamp beads and the pads 13 of the module board 12 are pre-positioned through physical engagement, and the electrical connection is completed in combination with the furnace hardening process. The structural design of the bayonet slots 15 ensures welding stability, and furnace hardening uses flux to achieve reliable welding.

[0055] Combined with the first aspect, in an implementation manner, after S100, it includes the following steps:

[0056] S200: Peel off the adhesive film 14 on the top surface of the lamp beads and the module board 12; or as Figure 13 shown, use the film breaking process to make the adhesive film 14 cover the side walls of the lamp beads and the top surface of the module board 12.

[0057] In this embodiment, step S200 can, on the one hand, completely peel off the adhesive film 14, simply serving as a function of transferring the lamp beads and improving the transfer efficiency; on the other hand, it can also use the film breaking process to make the adhesive film 14 cover the side walls of the lamp beads and the top surface of the module board 12, saving the additional steps of the traditional glue filling process.

[0058] Combined with the first aspect, in an implementation manner, when the adhesive film 14 is a transparent adhesive film for the film breaking process, it can play a role in protecting the lamp beads. When the adhesive film 14 is a black adhesive film for the film breaking process, it can not only protect the lamp beads but also improve the contrast.

[0059] Combined with the first aspect, in an implementation manner, before S100, the module board 12 can be subjected to tin plating treatment.

[0060] In this embodiment, tin plating helps to improve the electrical connection performance of the module board 12 and ensure the reliability and stability of signal transmission.

[0061] Combined with the first aspect, in an implementation manner, in S100, the following steps are included:

[0062] S101: As shown in Figure 2 and Figure 6 and

[0063] S102: As shown in Figure 6 , Figure 7 and Figure 8 and

[0064] S103: As shown in Figure 9 and

[0065] In this embodiment, as shown in Figure 2 and Figure 6 and Figure 6 and Figure 8 and Figure 9 and

[0066] Combined with the first aspect, in an implementation manner, in S101, the following steps are included:

[0067] S101-1: As shown in Figure 1 and Figure 2As shown, a conductive metal is used as the substrate 1, a light-removable adhesive film 1-2 is pasted on the back surface of the substrate 1, and a photolithography process is performed on the front surface of the substrate 1 to obtain circuit pads 3;

[0068] S101-2: As Figure 5 and Figure 6 shown, nickel-gold plating is performed on the circuit pads 3, and an ink layer 6 is applied to the circuit surface of the circuit pads 3.

[0069] In this embodiment, a conductive metal substrate 1 is used to reduce the risk of interfacial delamination caused by thermal stress. A light-removable adhesive film 1-2 is laminated on the back surface of the substrate 1 to fix the substrate 1, facilitating subsequent circuit connection on the front surface of the substrate 1. Electroless nickel plating + immersion gold process is performed on the circuit pads 3. The nickel layer provides diffusion barrier ability, and the gold layer ensures welding wettability. An ink layer 6 is screen-printed on the circuit surface. The ink layer 6 covers the gaps of the nickel-gold plating layer, blocking the moisture penetration path and preventing short circuits and oxidation.

[0070] Combined with the first aspect, in an embodiment, the thickness of the ink layer 6 is at least 10 um higher than the thickness of the circuit pads 3, and the material of the substrate 1 includes copper or copper alloy.

[0071] In this embodiment, the ink layer 6 being 10 um higher than the circuit pads 3 can effectively prevent short circuits and oxidation. At the same time, the substrate 1 is made of high-purity oxygen-free copper or copper alloy, which has both conductivity, reduces line transmission loss, and has low cost.

[0072] Combined with the first aspect, in an embodiment, in S101, the following steps are included:

[0073] S101-3: As Figure 3 shown, a light-removable adhesive film 2-16 is pasted on the front surface of the substrate 1 on which the circuit pads 3 have been fabricated, and the back surface of the substrate 1 is flipped using the light-removable adhesive film 2-16;

[0074] S101-4: The back surface of the substrate 1 is irradiated with light to remove the light-removable adhesive film 1-2 on the back surface of the substrate 1, nickel-gold plating is performed on the pins 7 on the back surface of the substrate 1, and then the light-removable adhesive film 2-16 is peeled off.

[0075] In this embodiment, the light-removable adhesive film 2-16 is laminated on the front surface of the substrate 1, and the substrate 1 is flipped using the adhesiveness of the light-removable adhesive film 2-16 to make the back surface process side face upward. Subsequently, the back surface upward substrate 1 is irradiated with light, and the light-removable adhesive film 1-2 undergoes a photolysis reaction. Electroless nickel plating + immersion gold process is performed on the exposed pins 7, and then the light-removable adhesive film 2-16 is peeled off, and damage to the front circuit pads 3 needs to be avoided.

[0076] Combined with the first aspect, in an embodiment, in S102, the following steps are included:

[0077] S102-1: As shown in Figure 6 , Figure 7 and Figure 8 , apply a layer of light-curing adhesive film 5 on the back surface of the substrate 1, and attach a gasket 8 to the bottom surface of the light-curing adhesive film 5 on the back surface of the substrate 1. After normal printing and die bonding, remove the gasket 8 on the bottom surface of the light-curing adhesive film 5;

[0078] S102-1: As shown in Figure 8 , use the encapsulating adhesive 11 to encapsulate the front surface of the substrate 1, and irradiate the back surface of the substrate 1 with light to cure the light-curing adhesive film 5 on the back surface of the substrate 1, so that the cured light-curing adhesive film 5 on the back surface of the substrate 1 and the encapsulating adhesive 11 on the front surface of the substrate 1 completely wrap the side of the lamp bead.

[0079] In this embodiment, laminate the light-curing adhesive film 5 on the back surface of the substrate 1 to ensure that there are no bubbles at the interface between the light-curing adhesive film 5 and the substrate 1. At the same time, attach the gasket 8 to the bottom surface of the light-curing adhesive film 5 for planar support during die bonding printing, and use the mechanical peeling technique to remove the gasket 8; use the encapsulating adhesive 11 for forming to form a front encapsulation layer, and apply light to the back surface of the substrate 1 to complete the photopolymerization of the light-curing adhesive film 5, forming a continuous encapsulation interface with the front encapsulating adhesive 11 to ensure the airtightness of the side of the lamp bead.

[0080] Combined with the first aspect, in an implementation manner, the light-curing adhesive film 5 includes an ultraviolet light-curing adhesive film, which is cured by ultraviolet irradiation during curing.

[0081] On the other hand, the following is a complete description of the flip-chip LED lamp bead encapsulation method:

[0082] Step 1: As shown in Figure 1 , use a conductive metal as the substrate 1, and attach a layer of light-removing adhesive film 1 2 to the back surface of the substrate 1;

[0083] Step 2: As shown in Figure 2 and Figure 5 , perform a photolithography process on the front surface of the substrate 1 to etch the circuit pad 3 and the positioning hole 4, apply a nickel-gold plating layer to the circuit pad 3, and apply an ink layer 6 on the circuit surface of the circuit pad 3;

[0084] Step 3: As shown in Figure 3 , attach a layer of light-removing adhesive film 2 16 to the front surface of the substrate 1, and use the light-removing adhesive film 2 16 to flip the back surface of the substrate 1. Irradiate the back surface of the substrate 1 with light to remove the light-removing adhesive film 1 2 on the back surface of the substrate 1, and apply a nickel-gold plating layer to the pin 7 on the back surface of the substrate 1, and then peel off the light-removing adhesive film 2 16;

[0085] Step 4: As shown in Figure 4 , Figure 6 and Figure 7As shown, a layer of light-curing adhesive film 5 is pasted on the back surface of the substrate 1, and a gasket 8 is pasted on the bottom surface of the light-curing adhesive film 5 on the back surface of the substrate 1. After normal printing and die bonding, the gasket 8 on the bottom surface of the light-curing adhesive film 5 is removed.

[0086] Step Five: As Figure 8 shown, encapsulating glue 11 is used to encapsulate the front surface of the substrate 1, and the back surface of the substrate 1 is irradiated with light to cure the light-curing adhesive film 5 on the back surface of the substrate 1, so that the cured light-curing adhesive film 5 on the back surface of the substrate 1 and the encapsulating glue 11 on the front surface of the substrate 1 completely wrap the side surface of the lamp bead.

[0087] Step Six: As Figure 9 shown, the back surface of the substrate 1 is etched with a laser to remove the light-curing adhesive film 5 in the area of the pin 7 on the back surface of the substrate 1, so that a bayonet slot 15 is formed between the remaining light-curing adhesive film 5 and the pin 7, and the substrate 1 is cut to form a plurality of electrically isolated lamp beads.

[0088] Step Seven: As Figure 9 、 Figure 10 and Figure 12 shown, a plurality of encapsulated lamp bead arrays are transferred to the adhesive film 14, and then the adhesive film 14 with lamp beads is correspondingly attached to the module board 12 pre-coated with flux, so that the bayonet slot 15 on the back surface of the lamp bead is engaged with the pad 13 on the module board 12, and then through-furnace hardening is performed.

[0089] Step Eight: As Figure 13 shown, the adhesive film 14 on the top surface of the lamp bead and the module board 12 is peeled off; or the adhesive film 14 is covered on the side wall of the lamp bead and the top surface of the module board 12 by using a film-breaking process.

[0090] In one embodiment, after Step Six, Step Nine can be adopted to replace Step Seven and Step Eight. Step Nine specifically includes: As Figure 9 and Figure 10 and Figure 11 shown, flux is brushed on the tinned module board 12, and the lamp beads are pasted on the corresponding positions of the pads 13 on the module board 12 by using a pick-and-place machine. The light-curing adhesive film 5 at the bottom of the lamp bead forms a bayonet slot 15 and is stuck on the pad 13, and then through-furnace hardening is performed.

[0091] In a second aspect, as Figure 13 shown, an embodiment of the present application provides a flip-chip LED lamp bead assembly, which includes: a plurality of lamp beads, and the same adhesive film 14 is pasted on the front surfaces of the plurality of lamp beads. A bayonet slot 15 is formed on the back surface of the lamp bead; a module board 12, and the top surface of the module board 12 is provided with pads 13 having the same number as the plurality of lamp beads. The lamp beads are engaged and positioned with the corresponding pads 13 through the bayonet slots 15.

[0092] In this embodiment, multiple encapsulated lamp beads can be transferred to the adhesive film 14 in an array form, and the adhesive film 14 is integrally attached to the module board 12 with a pre-applied solder flux, avoiding the low efficiency problem of traditional single lamp bead transfer. The batch operation of the adhesive film 14 significantly improves the mounting efficiency. The bayonet slot 15 on the back of the lamp bead and the pad 13 of the module board 12 are pre-positioned through physical engagement, and the structure design of the bayonet slot 15 ensures welding stability.

[0093] Combined with the second aspect, in an implementation manner, the adhesive film 14 covers the side wall of the lamp bead and the top surface of the module board 12 to form a continuously covered sealing layer.

[0094] In this embodiment, the adhesive film 14 covers the side wall of the lamp bead and the top surface of the module board 12 as a continuous sealing layer, combines with the lamp bead and the module board 12, reduces the potting process, improves the airtightness after screen pasting, and protects the lamp bead.

[0095] Combined with the second aspect, in an implementation manner, as Figure 8 shown, the lamp bead includes: a substrate 1; an encapsulation glue 11 and a light-curing adhesive film 5. The encapsulation glue 11 is disposed on the front surface of the substrate 1, the light-curing adhesive film 5 is disposed on the back surface of the substrate 1, and the encapsulation glue 11 and the light-curing adhesive film 5 extend and wrap around the side surface of the substrate 1.

[0096] In this embodiment, the upper and lower surfaces of the lamp bead are encapsulated by using the light-curing adhesive film 5 and the encapsulation glue 11 to wrap the side surface of the lamp bead, block the path of water vapor entry, improve the airtightness of the lamp bead, and eliminate the direct contact interface between the side surface of the substrate 1 and the air in traditional single-sided encapsulation.

[0097] Combined with the second aspect, in an implementation manner, as Figure 9 shown, the light-curing adhesive film 5 does not cover the pin 7 of the substrate 1, and a bayonet slot 15 is formed between the pin 7 and the light-curing adhesive film 5 around its own perimeter.

[0098] In this embodiment, the light-curing adhesive film 5 around the pin 7 forms an annular wrapping area to prevent short circuit caused by solder paste overflow during welding; the bayonet slot 15 and the pad 13 of the module board 12 are pre-positioned through physical engagement to ensure welding stability.

[0099] Combined with the second aspect, in an implementation manner, the material of the substrate 1 includes copper or copper alloy.

[0100] In this embodiment, the substrate 1 is made of high-purity oxygen-free copper or copper alloy, which has both electrical conductivity, reduces line transmission loss, and has low cost.

[0101] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. Unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0102] It should be noted that in the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0103] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A flip-chip LED lamp bead packaging method, characterized in that, The flip-chip LED lamp bead packaging method includes the following steps: Transfer a plurality of packaged lamp bead arrays to the adhesive film (14), and then correspondingly attach the adhesive film (14) with the lamp beads to the module board (12) pre-coated with solder flux, so that the bayonet slots (15) on the back of the lamp beads are engaged with the pads (13) of the module board (12), and then pass through the furnace for hardening.

2. The flip-chip LED lamp bead packaging method according to claim 1, wherein: After the step of transferring a plurality of packaged lamp bead arrays to the adhesive film (14), and then correspondingly attaching the adhesive film (14) with the lamp beads to the module board (12) pre-coated with solder flux, so that the bayonet slots (15) on the back of the lamp beads are engaged with the pads (13) of the module board (12), and then passing through the furnace for hardening, it further includes: Peel off the adhesive film (14) on the top surface of the lamp beads and the module board (12); Or Use a film-breaking process to make the adhesive film (14) cover the side walls of the lamp beads and the top surface of the module board (12).

3. The flip-chip LED lamp bead packaging method according to claim 1, wherein: The packaged lamp beads include: Process the circuit pads (3) and pins (7) on the front and back sides of the substrate (1); Use the light-curing adhesive film (5), spacer (8) and encapsulation adhesive (11) to complete the printing, die bonding and encapsulation of the substrate (1); Use laser to etch the back of the substrate (1) to remove the light-curing adhesive film (5) in the area of the pins (7) on the back of the substrate (1), so that a bayonet slot (15) is formed between the remaining light-curing adhesive film (5) and the pins (7), and cut the substrate (1) to form a plurality of electrically isolated lamp beads.

4. The flip-chip LED lamp bead packaging method according to claim 3, wherein: The process of processing the circuit pads (3) and pins (7) on the front and back sides of the substrate (1) includes: Use a conductive metal as the substrate (1), attach a light-removable adhesive film one (2) to the back of the substrate (1), and perform a photolithography process on the front of the substrate (1) to obtain the circuit pads (3); Apply a nickel-gold plating to the circuit pads (3), and apply an ink layer (6) on the circuit surface of the circuit pads (3).

5. The flip-chip LED lamp bead packaging method according to claim 4, wherein: The thickness of the ink layer (6) is at least 10 um higher than the thickness of the circuit pads (3), and the material of the substrate (1) includes copper or copper alloy.

6. The flip-chip LED lamp bead packaging method according to claim 4, wherein: The process of processing the circuit pads (3) and pins (7) on the front and back sides of the substrate (1) includes: Attach a light-removable adhesive film two (16) to the front of the substrate (1) on which the circuit pads (3) have been fabricated, and use the light-removable adhesive film two (16) to flip the back of the substrate (1); Irradiate the back of the substrate (1) with light to remove the light-removable adhesive film one (2) on the back of the substrate (1), apply a nickel-gold plating to the pins (7) on the back of the substrate (1), and then peel off the light-removable adhesive film two (16).

7. The flip-chip LED lamp bead packaging method according to claim 3, wherein: The printing, die bonding, and encapsulation of the substrate (1) are completed using a light-curing adhesive film (5), a spacer (8), and an encapsulation adhesive (11), including: Attach a layer of light-curing adhesive film (5) to the back of the substrate (1), and attach a layer of spacer (8) to the bottom surface of the light-curing adhesive film (5) on the back of the substrate (1). After normal printing and die bonding, remove the spacer (8) on the bottom surface of the light-curing adhesive film (5). Use the encapsulation adhesive (11) to encapsulate the front of the substrate (1), and irradiate the back of the substrate (1) with light to cure the light-curing adhesive film (5) on the back of the substrate (1), so that the cured light-curing adhesive film (5) on the back of the substrate (1) and the encapsulation adhesive (11) on the front of the substrate (1) completely wrap the sides of the lamp beads.

8. An inverted LED lamp bead component, characterized in that It includes: Multiple lamp beads, with the same adhesive film (14) pasted on the front of the multiple lamp beads, and a bayonet slot (15) is provided on the back of the lamp beads. A module board (12), with pads (13) having the same number as the multiple lamp beads provided on the top surface of the module board (12), and the lamp beads are snap-fitted and positioned with the corresponding pads (13) through the bayonet slots (15).

9. The flip-chip LED lamp bead assembly according to claim 8, wherein The lamp bead includes: A substrate (1); An encapsulation adhesive (11) and a light-curing adhesive film (5), the encapsulation adhesive (11) is provided on the front of the substrate (1), the light-curing adhesive film (5) is provided on the back of the substrate (1), and the encapsulation adhesive (11) and the light-curing adhesive film (5) extend to wrap the sides of the substrate (1).

10. The flip-chip LED lamp bead assembly according to claim 9, wherein The light-curing adhesive film (5) does not cover the pins (7) of the substrate (1), and a bayonet slot (15) is formed between the pins (7) and the light-curing adhesive film (5) around them.

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