Workpiece machining method, machine tool, and program

Abstract

The present invention provides a workpiece processing method comprising: a step for preparing a workpiece having a plate portion including a base material and a first coating layer covering at least a portion of the base material; and a step for performing edge punching on the plate portion. When a direction from the base material toward the first cladding layer is defined as a first direction, the step of performing edge punching on the plate portion includes forming a through hole and a flange in a first region of the plate portion by moving an edge punching tool in a rotating state in the first direction. The step of removing the first cladding layer from the first region of the plate portion is performed before the step of performing the edge punching processing on the plate portion.

Description

Technical Field

[0001] The present invention relates to a workpiece processing method, a machine tool, and a program. Background Art

[0002] For a thin plate, in order to ensure sufficient thread teeth when cutting a thread, or to be able to insert a pin or a tube into the thin plate, a flanging process for forming a through-hole and a flange is known.

[0003] As a related art, a piercing tool is disclosed in Patent Document 1. The piercing tool described in Patent Document 1 is used to form a hole and a boss on a metal plate or a metal pipe wall. More specifically, the piercing tool is pressed against the metal plate or the metal pipe wall while rotating at high speed. By the frictional heat acting between the piercing tool and the metal plate or the metal pipe wall and the frictional pressure acting from the piercing tool on the metal plate or the metal pipe wall, the metal is melted. Along with this metal melting, a boss is formed while a hole is formed. Prior Art Documents

[0004] Patent Document 1: Japanese Patent Publication Gazette Shohei 5-6007 Summary of the Invention

[0005] An object of the present invention is to provide a workpiece processing method, a machine tool, and a program that can, for example, favorably form a through-hole and a flange on a plate having a coating layer such as a coating layer plated with pure zinc or a zinc alloy.

[0006] The workpiece processing method in several embodiments includes: a step of preparing a workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material; and a step of performing a flanging process on the plate portion. When the direction from the base material toward the first coating layer is defined as a first direction, the step of performing a flanging process on the plate portion includes forming a through-hole and a flange in a first region of the plate portion by moving a rotating flanging tool in the first direction. Before the step of performing a flanging process on the plate portion, a step of removing the first coating layer from the first region of the plate portion is performed.

[0007] The machine tools in several embodiments include: a workpiece support device for supporting a workpiece, the workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material; a machining head for supporting a flanging tool so as to be rotatable about a rotation axis; a rotation drive device for rotating the flanging tool about the rotation axis; a moving device for relatively moving the machining head with respect to the workpiece support device; a removing device for removing a part of the first coating layer from the workpiece; and a control device for controlling the rotation drive device, the moving device, and the removing device. The control device can execute: a removing mode for removing the first coating layer from a first region of the plate portion by at least sending a control command to the removing device; and a flanging mode for performing flanging on the plate portion by at least sending control commands to the rotation drive device and the moving device. When the direction from the base material toward the first coating layer is defined as a first direction, the flanging mode is a mode of forming a through hole and a flange in the first region from which the first coating layer has been removed using the flanging tool that moves in the first direction in a rotating state.

[0008] The program in several embodiments is used to cause a machine tool to execute a workpiece machining method, and the workpiece machining method includes: a step of removing the first coating layer from a first region of a plate portion in a state where a workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material is supported by a workpiece support device; and a step of performing flanging on the plate portion after removing the first coating layer from the first region of the plate portion. When the direction from the base material toward the first coating layer is defined as a first direction, the step of performing flanging on the plate portion includes forming a through hole and a flange in the first region of the plate portion by moving a rotating flanging tool in the first direction.

[0009] According to the present invention, it is possible to provide a workpiece machining method, a machine tool, and a program, for example, to well form a through hole and a flange on a plate material having a coating layer such as a coating of pure zinc or a zinc alloy. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic cross-sectional view showing an example of a workpiece prepared in a preparation process. Figure 2 is a schematic cross-sectional view showing a case of performing a removing process of removing the first coating layer from a first region of a plate portion. Figure 3 is a schematic cross-sectional view showing an example of a workpiece after removing the first coating layer from a first region of a plate portion. Figure 4It is a schematic cross-sectional view showing the case where the flanging tool moves toward the first region of the plate portion. Figure 5 It is a schematic cross-sectional view showing the case of flanging the first region of the plate portion. Figure 6 It is a schematic cross-sectional view showing the case where the tapping tool moves toward the through-hole. Figure 7 It is a schematic cross-sectional view showing the case of forming an internal thread on the wall surface of the through-hole. Figure 8 It is a schematic cross-sectional view showing the state after forming an internal thread on the wall surface of the through-hole. Figure 9 It is a schematic cross-sectional view showing the state of fine cracking of the flange in the comparative example. Figure 10 It is a schematic perspective view showing an example of the workpiece. Figure 11 It is a schematic perspective view showing an example of the workpiece. Figure 12 It is a schematic perspective view showing an example of the workpiece. Figure 13 It is a schematic cross-sectional view showing the case of performing a removal process of removing the first coating layer from the first region of the plate portion. Figure 14 It is a schematic cross-sectional view showing the case of performing a removal process using a chemical solution. Figure 15 It is a schematic cross-sectional view showing the case of performing a removal process using a second tool. Figure 16 It is a schematic perspective view showing an example of the flanging tool. Figure 17 It is a diagram schematically showing the machine tool in the first embodiment. Figure 18 It is a schematic cross-sectional view showing the case where there is a second wall as an obstacle between the laser head and the first region of the plate portion. Figure 19 It is a diagram schematically showing the machine tool in the first embodiment. Figure 20 It is a diagram schematically showing the machine tool in the first embodiment. Figure 21 It is a diagram schematically showing an example of the tool changing device. Figure 22 It is a diagram schematically showing the machine tool in the first embodiment. Figure 23This is a flowchart showing an example of a workpiece processing method in an embodiment. Figure 24 This is a diagram schematically showing a part of the machine tool in the second embodiment. Figure 25 This is an enlarged view showing Figure 24 a part of Figure 26 This is a diagram schematically showing the machine tool in the second embodiment. Figure 27 This is a diagram schematically showing the machine tool in the second embodiment. Figure 28 This is a diagram schematically showing a part of the machine tool in the second embodiment. Figure 29 This is a diagram schematically showing a part of the machine tool in the second embodiment. Figure 30 This is a diagram schematically showing an example of a storage medium recording a program. Detailed Embodiment

[0011] Hereinafter, with reference to the drawings, a workpiece processing method, a machine tool 1, and a program 822 in the embodiment will be described. In addition, in the following description of the embodiment, parts and components having the same function are denoted by the same reference numerals, and repeated description of the parts and components denoted by the same reference numerals is omitted.

[0012] (First Embodiment) With reference to Figures 1 to 23 , a workpiece processing method and a machine tool 1A in the first embodiment will be described. Figure 1 This is a schematic cross-sectional view showing an example of a workpiece 9 prepared in the preparation process. Figure 2 This is a schematic cross-sectional view showing the situation of performing a removal process of removing the first coating layer 93 from the first region RG1 of the plate portion 90. Figure 3 This is a schematic cross-sectional view showing an example of the workpiece 9 after removing the first coating layer 93 from the first region RG1 of the plate portion 90. Figure 4 This is a schematic cross-sectional view showing the situation where the flanging tool 10 moves toward the first region RG1 of the plate portion 90. Figure 5 This is a schematic cross-sectional view showing the situation of performing flanging on the first region RG1 of the plate portion 90. Figure 6 This is a schematic cross-sectional view showing the situation where the tapping tool 18 moves toward the through-hole 96. Figure 7 This is a schematic cross-sectional view showing the situation of forming an internal thread 96s on the wall surface of the through-hole 96. Figure 8 This is a schematic cross-sectional view showing the state after forming the internal thread 96s on the wall surface of the through-hole 96.Figure 9 is a schematic cross-sectional view showing the state of slight cracking of the flange 97 in the comparative example. Figure 10 is a schematic perspective view showing an example of the workpiece 9. Figure 11 is a schematic perspective view showing an example of the workpiece 9. Figure 12 is a schematic perspective view showing an example of the workpiece 9. Figure 13 is a schematic cross-sectional view showing the case of performing the removal process of removing the first coating layer 93 from the first region RG1 of the plate portion 90. Figure 14 is a schematic cross-sectional view showing the case of performing the removal process using the chemical solution L. Figure 15 is a schematic cross-sectional view showing the case of performing the removal process using the second tool T2. Figure 16 is a schematic perspective view showing an example of the flanging tool 10. Figure 17 is a view schematically showing the machine tool 1A in the first embodiment. Figure 18 is a schematic cross-sectional view showing the case where a second wall 99b as an obstacle exists between the laser head 51 and the first region RG1 of the plate portion 90. Figure 19 and Figure 20 is a view schematically showing the machine tool 1A in the first embodiment. Figure 21 is a view schematically showing an example of the tool changing device 6. Figure 22 is a view schematically showing the machine tool 1A in the first embodiment. Figure 23 is a flowchart showing an example of the workpiece processing method in the embodiment.

[0013] As Figure 1 illustrated, in the first step ST1, the workpiece 9 is prepared. The first step ST1 is a preparation process. The workpiece 9 prepared in the preparation process has a plate portion 90. In the example described in Figure 1 , the plate portion 90 is composed of the first wall 99a. In addition to the first wall 99a, the workpiece 9 may further have a second wall 99b. In the example described in Figure 1 , the second wall 99b is disposed opposite to the first wall 99a. In addition to the first wall 99a and the second wall 99b, the workpiece 9 may further have a third wall 99c. In the example described in Figure 1 , the third wall 99c connects the first wall 99a and the second wall 99b. The workpiece 9 may also have a fourth wall 99d disposed opposite to the third wall 99c (if necessary, refer to Figure 10 ).

[0014] In Figure 1 the example described, the plate portion 90 of the workpiece 9 includes a base material 91 and a first coating layer 93 covering at least a part of the base material 91.

[0015] As Figure 2 illustrated, in the second step ST2, the first coating layer 93 is removed from the first region RG1 of the plate portion 90. The second step ST2 is a removal process. In Figure 3 , the workpiece 9 after the execution of the removal process is shown.

[0016] As Figure 4 illustrated, in the third step ST3, the relative position of the workpiece 9 with respect to the flanging tool 10 is changed so that the flanging tool 10 faces the first region RG1 of the workpiece 9. The third step ST3 is a position change process.

[0017] As Figure 4 illustrated, in the present specification, the direction from the base material 91 toward the first coating layer 93 is defined as the first direction DR1, and the direction opposite to the first direction DR1 is defined as the second direction DR2.

[0018] After the execution of the position change process (the third step ST3), the first direction DR1 coincides with the direction from the flanging tool 10 toward the first region RG1 of the workpiece 9.

[0019] As Figure 4 and Figure 5 illustrated, in the fourth step ST4, the plate portion 90 is flanged. The fourth step ST4 is a process of flanging the plate portion 90 (hereinafter referred to as the "flanging process"). In addition, "flanging" means a process of extending the edge of a hole into a cylindrical shape. As Figure 5 illustrated, by flanging the plate portion 90, the edge of the hole extends into a cylindrical shape, and as a result, a flange 97 is formed.

[0020] In Figure 4 and Figure 5 the example described, the flanging process (the fourth step ST4) includes forming a through hole 96 and a flange 97 in the first region RG1 of the plate portion 90 by moving the rotating flanging tool 10 in the first direction DR1.

[0021] As Figure 9 illustrated, consider the case where the flanging process is performed without removing the first coating layer 93 from the first region RG1 of the plate portion 90. In this case, due to the presence of the first coating layer 93 (for example, due to the presence of the first coating layer 93 containing a zinc element), it may not be possible to form the flange 97 well. For example, as Figure 9 illustrated, due to the presence of the first coating layer 93, the flange 97 may sometimes be finely cracked.

[0022] In contrast, in the first embodiment, before the flanging process, a process of removing the first coating layer 93 from the first region RG1 of the plate portion 90 is performed (see Figure 2 ). Therefore, regardless of the material of the first coating layer 93, poor formation of the flange 97 caused by the presence of the first coating layer 93 does not occur during the flanging process. For example, the presence of the first coating layer 93 does not prevent the generation or transfer of frictional heat caused by the rotating flanging tool 10 in the first region RG1. In other words, the frictional heat generated between the flanging tool 10 and the plate portion 90 is effectively transferred to the entire first region RG1, and the through hole 96 and the flange 97 are well formed in the first region RG1 (see Figure 5 ).

[0023] (Optional additional structure) Next, with reference to Figures 1 to 23 , an optional additional structure that can be adopted in the workpiece processing method and the machine tool 1A in the first embodiment will be described.

[0024] (First coating layer 93) As Figure 4 illustrated, the first coating layer 93 is a coating layer disposed on the surface of the first region RG1 of the plate portion 90 opposite to the surface in contact with the flanging tool 10.

[0025] The first coating layer 93 is, for example, a plating layer 93a that covers at least a part of the base material 91. More specifically, the first coating layer 93 is, for example, a plating layer 93a of pure zinc or a zinc alloy (in other words, the first coating layer 93 is a plating layer 93a formed by plating at least a part of the base material 91 with pure zinc or a zinc alloy). The plating layer 93a can also be a plating layer formed in any manner. For example, the plating layer 93a can be formed on the base material 91 by electroforming, can be formed on the base material 91 by electroless plating, can be formed on the base material 91 by hot dip plating, or can be formed on the base material 91 by vacuum plating (e.g., vacuum evaporation).

[0026] Alternatively or additionally, the first coating layer 93 can also be a color coating and / or an anti-corrosion layer.

[0027] In the past, if flanging processing using frictional heat was performed on a base material covered with the first coating layer containing zinc elements, a flange could not be formed well (see Figure 9 ). In contrast, in the first embodiment, in the first region RG1, the first coating layer 93 is removed, so regardless of the material of the first coating layer 93, the through hole 96 and the flange 97 can be well formed in the first region RG1.

[0028] In Figure 10In the described example, the first coating layer 93 faces the inner region SP of the workpiece 9 (more specifically, the cavity portion defined by the workpiece 9). More specifically, in Figure 10 the described example, the workpiece 9 is a tube 9a, and the first coating layer 93 faces the inner space SP1 of the tube 9a.

[0029] Alternatively, as Figure 11 illustrated, the cross-section of the workpiece 9 perpendicular to the long side direction may also have a C-shaped configuration. In Figure 11 the described example, the first coating layer 93 also faces the inner region SP of the workpiece 9 (more specifically, the substantial cavity portion defined by the workpiece 9).

[0030] As Figure 10 and Figure 11 illustrated, when the first coating layer 93 is an inner surface coating layer that coats the inner surface of the base material 91, it is preferable that an access opening OP allowing a device for removing the first coating layer 93 to approach the first region RG1 is formed in the workpiece 9. This access opening OP may be formed in advance before performing the removal process (second step ST2), or may be formed in the workpiece 9 at the timing of performing the removal process (second step ST2). This access opening OP may be an opening OP1 of the through-hole type as Figure 10 illustrated, or may be an opening OP2 of the slit type as Figure 11 illustrated.

[0031] In Figure 2 the described example, the device for removing the first coating layer 93 includes a laser B. As Figure 13 illustrated, the device for removing the first coating layer 93 may include, in addition to the laser B, an auxiliary gas G supplied to the workpiece 9. The auxiliary gas G has functions such as removing the melt melted by the laser B from the irradiation target area of the laser B. The auxiliary gas G may be air, may be oxygen, or may also be an inert gas such as nitrogen or argon.

[0032] Alternatively or additionally, as Figure 14 illustrated, the device for removing the first coating layer 93 may also include a chemical solution L (e.g., an organic solution) for removing the first coating layer 93. In Figure 14 the described example, by applying the chemical solution L to the first coating layer 93, the first coating layer 93 is removed from the first region RG1 of the plate portion 90.

[0033] Alternatively or additionally, as Figure 15 illustrated, the device for removing the first coating layer 93 may also include a tool (e.g., a cutting tool, a file, etc.) for removing the first coating layer 93. Hereinafter, the tool for removing the first coating layer 93 will be referred to as the second tool T2. In Figure 15In the described example, by bringing the second tool T2 into contact with the first coating layer 93, the first coating layer 93 is removed from the first region RG1 of the plate portion 90.

[0034] In Figure 10 and Figure 11 the described example, the workpiece 9 has: a first wall 99a, in which a first region RG1 to be flanged (in Figure 10 and Figure 11 , the region surrounded by the dashed line is the first region RG1) is disposed; and a second wall 99b, which is disposed opposite to the first wall 99a. Further, an approach opening OP is formed in the second wall 99b. In Figure 10 and Figure 11 the described example, the approach opening OP is disposed opposite to the first region RG1 (more specifically, a removal target region RT described later). Therefore, a device for removing the first coating layer 93 (for example, a laser B for removing the first coating layer 93, a chemical solution L for removing the first coating layer 93, an implement T1 for applying the chemical solution L for removing the first coating layer 93, or a second tool T2 for removing the first coating layer 93) can easily approach the first coating layer 93 via the approach opening OP.

[0035] In Figure 3 the described example, by removing the first coating layer 93 from the first region RG1 of the plate portion 90, an exposed surface 91s on which the base material 91 is substantially exposed is formed in the first region RG1.

[0036] In this specification, a portion to be removed by the above-described removal process (or a removal device 5 described later) in the region occupied by the first coating layer 93 is defined as a removal target region RT (see Figure 1 and Figure 2 ). The above-described first direction DR1 is the same as the direction from a portion of the base material 91 that is in contact with the removal target region RT toward the removal target region RT.

[0037] In this specification, a region formed by removing the first coating layer 93 is defined as a removed region RB (see Figure 3 ). In other words, by performing the removal process (second step ST2), the removal target region RT becomes the removed region RB. The above-described first direction DR1 is the same as the direction from the exposed surface 91s toward the removed region RB.

[0038] The size of the approach opening OP may also be set according to the size of the removal target region RT or the size of a through hole 96 formed in the first region RG1 in the flanging process. For example, the larger the size of the removal target region RT or the through hole 96, the larger the size of the approach opening OP.

[0039] In Figure 3In the described example, the size of the opening OP proximity (more specifically, the opening area of the opening OP proximity) is smaller than the size of the removed region RB (more specifically, the area of the removed region RB). Since the size of the opening OP proximity is small, a reduction in the strength of the workpiece 9 caused by the presence of the opening OP proximity is suppressed. Alternatively, the size of the opening OP proximity may be equal to or larger than the size of the removed region RB.

[0040] In Figure 6 the described example, the inner diameter of the opening OP proximity is larger than the inner diameter of the through hole 96. Alternatively, the inner diameter of the opening OP proximity may be equal to or less than the inner diameter of the through hole 96. In Figure 6 the described example, the through hole 96 is disposed so as to face the opening OP proximity.

[0041] (Second coating layer 94) As Figure 1 illustrated, the plate portion 90 of the workpiece 9 includes a second coating layer 94 that is disposed on the second direction DR2 side of the base material 91 and covers at least a part of the base material 91. In Figure 1 the described example, the workpiece 9 prepared in the preparation process (first step ST1) includes a base material 91, a first coating layer 93, and a second coating layer 94. Further, the base material 91 is sandwiched between the first coating layer 93 and the second coating layer 94.

[0042] The material of the second coating layer 94 may be the same as or different from the material of the first coating layer 93.

[0043] The second coating layer 94 is, for example, a plating layer 94a that covers at least a part of the base material 91. The plating layer 94a may be a plating layer formed in any manner. For example, the plating layer 94a may be formed on the base material 91 by electroforming, may be formed on the base material 91 by electroless plating, may be formed on the base material 91 by hot dip plating, or may be formed on the base material 91 by vacuum plating (e.g., vacuum evaporation).

[0044] Alternatively or additionally, the second coating layer 94 may also be a colored coating and / or an anti-corrosion layer. The second coating layer 94 may also be a coating layer containing a zinc element. For example, the second coating layer 94 may be a plating layer of pure zinc or a zinc alloy.

[0045] In Figure 10 and Figure 11 the described example, the second coating layer 94 is an outer surface coating layer that covers the outer surface of the base material 91.

[0046] In Figure 2 and Figure 3In the described example, the second coating layer 94 is outside the object to be removed in the removal process (second step ST2). In other words, the second coating layer 94 is not removed by performing the removal process (second step ST2) but remains as it is. Alternatively, by performing the removal process (second step ST2), both the first coating layer 93 and the second coating layer 94 can be removed from the first region RG1 of the plate portion 90. Removing the first coating layer 93 and the second coating layer 94 from the first region RG1 of the plate portion 90 can be performed by laser irradiation, by a chemical solution, or by a tool such as a cutting tool (in other words, the second tool T2).

[0047] (Base material 91) The material of the base material 91 is, for example, a metal such as iron or stainless steel. The base material 91 has a sufficient thickness to be able to form the flange 97. In Figure 1 the described example, the thickness of the base material 91 is greater than the thickness of the first coating layer 93 and greater than the thickness of the second coating layer 94.

[0048] (Workpiece 9) The workpiece 9 can be, as Figure 10 illustrated, a tube, or can be, as Figure 12 illustrated, an angle bar. In addition, the workpiece 9 can be a groove member or a flat plate. The workpiece 9 can also be a long workpiece extending in a direction perpendicular to the first direction DR1.

[0049] The workpiece 9 can be a component that defines a flow path for a specified fluid, a component of a cooling and heating device, a component of a household electrical appliance, a component of an automobile, a component of a control panel, a component of a building, a component of a shelf, a component of furniture, a component of agricultural machinery, a component of kitchen equipment, or can also be a component of logistics equipment.

[0050] The thickness TH of the plate portion 90 in the first region RG1 (refer to Figure 1 ) is, for example, 0.5 mm or more and 6 mm or less.

[0051] (Removal process) In Figure 2 the described example, the process of removing the first coating layer 93 (removal process: second step ST2) includes removing the first coating layer 93 from the first region RG1 of the plate portion 90 by irradiating the first coating layer 93 with the laser B. In Figure 2 the described example, in the removal process, the traveling direction of the laser B toward the first coating layer 93 is the second direction DR2 (in other words, the direction opposite to the direction from the base material 91 toward the first coating layer 93).

[0052] AsFigure 2 As illustrated, the laser beam B emitted from the laser head 51 may also form an approach opening OP (more specifically, a through-hole for approach) in the second wall 99b of the workpiece 9. In Figure 2 the example described, the laser beam B emitted from the laser head 51 passes through the approach opening OP formed in the second wall 99b of the workpiece 9. Further, the laser beam B passing through the approach opening OP is irradiated onto the first wall 99a of the workpiece 9, whereby the first coating layer 93 is removed from a part of the first wall 99a.

[0053] Alternatively or additionally, as Figure 14 illustrated, the removing step (second step ST2) of removing the first coating layer 93 may also include removing the first coating layer 93 from the first region RG1 of the plate portion 90 by applying a chemical solution L to the first coating layer 93.

[0054] In Figure 14 the example described, the chemical solution L is supplied so as to pass through the approach opening OP formed in the second wall 99b of the workpiece 9. Further, the chemical solution L supplied so as to pass through the approach opening OP is applied to the first wall 99a of the workpiece 9, whereby the first coating layer 93 is removed from a part of the first wall 99a.

[0055] Alternatively or additionally, as Figure 15 illustrated, the removing step (second step ST2) of removing the first coating layer 93 may also include removing the first coating layer 93 from the first region RG1 of the plate portion 90 by bringing a second tool T2 such as a cutting tool into contact with the first coating layer 93.

[0056] In Figure 15 the example described, the second tool T2 such as a cutting tool is inserted into the approach opening OP formed in the second wall 99b of the workpiece 9. Further, the first coating layer 93 is removed from a part of the first wall 99a of the workpiece 9 by the second tool T2 inserted into the approach opening OP.

[0057] (Position changing step) In Figure 3 and Figure 4 the example described, after removing the first coating layer 93 from the first region RG1 of the plate portion 90 and before performing the step of flanging the plate portion 90 (flanging step: fourth step ST4), the relative position of the workpiece 9 with respect to the flanging tool 10 is changed so that the flanging tool 10 faces the first region RG1 of the workpiece 9 (hereinafter referred to as "position changing step"). As Figure 3 and Figure 4As illustrated, the position changing process may also include flipping the workpiece 9. More specifically, the position changing process may also include rotating the workpiece 9 by 180 degrees about an axis AT parallel to the long side direction of the workpiece 9.

[0058] (Flanging process) The process of flanging the plate portion 90 (flanging process: fourth step ST4) includes transferring the frictional heat generated between the rotating flanging tool 10 and the plate portion 90 to the first region RG1 of the plate portion 90, and pressing the first region RG1 of the plate portion 90 in the first direction DR1 by the rotating flanging tool 10.

[0059] By transferring the frictional heat generated between the rotating flanging tool 10 and the plate portion 90 to the first region RG1 of the plate portion 90, the first region RG1 is softened (more specifically, plasticized) by the frictional heat. In the first embodiment, before performing the process of flanging the plate portion 90 (flanging process: fourth step ST4), the first coating layer 93 covering the surface on the first direction DR1 side of the base material 91 is removed from the first region RG1 (see Figure 2 and Figure 3 ). Therefore, when performing the flanging process, the frictional heat is well transferred to the entire first region RG1, and the transfer of the frictional heat is not hindered by the presence of the first coating layer 93.

[0060] As Figure 5 illustrated, in the process of flanging the plate portion 90 (flanging process: fourth step ST4), the first region RG1 softened by the frictional heat is pressed by the flanging tool 10 in the first direction DR1. In addition, by pressing the first region RG1 softened by the frictional heat by the flanging tool 10 in the first direction DR1, a through hole 96 is formed in the first region RG1, and the edge of the through hole 96 is stretched into a cylindrical shape in the first direction DR1. In this way, a flange 97 is formed in the first region RG1. In Figure 5 the example described, in the process of flanging the plate portion 90, the formation of the through hole 96 and the formation of the flange 97 are performed simultaneously.

[0061] In addition, in this specification, forming the through hole 96 in the first region RG1 includes forming the through hole 96 through which the flanging tool 10 passes in the first region RG1 where no bottom hole is provided (see Figure 4 and Figure 5). In addition, in this specification, forming the through hole 96 in the first region RG1 includes expanding a pre-formed bottom hole in the first region RG1 to form the through hole 96 for the flanging tool 10 to pass through in the first region RG1. In other words, before performing the flanging process on the plate portion 90 (flanging process: fourth step ST4), a bottom hole may or may not be provided in the first region RG1.

[0062] As Figure 4 and Figure 5 illustrated, the process of flanging the plate portion 90 (flanging process: fourth step ST4) may also include the flanging tool 10 in a rotating state moving in the first direction DR1 in such a way as to sequentially pass through the second coating layer 94 and the base material 91. In Figure 4 and Figure 5 the examples described, before performing the flanging process, the second coating layer 94 is not removed from the first region RG1, but the second coating layer 94 is maintained as it is. By omitting the process of removing the second coating layer 94 from the first region RG1, the total time required for workpiece processing is shortened.

[0063] (flanging tool 10) In Figure 4 the examples described, the flanging tool 10 has: a front end portion 11 having a pointed shape; and a column portion 13 connected to the front end portion 11. The flanging tool 10 may also have: a front end portion 11 having a pointed shape; a column portion 13 connected to the front end portion 11; and a shoulder portion 15 connected to the column portion 13. In other words, the flanging tool 10 may also have: a front end portion 11 having a pointed shape; a shoulder portion 15; and a column portion 13 disposed between the front end portion 11 and the shoulder portion 15.

[0064] The front end portion 11 and the column portion 13 have the function of forming the through hole 96 and the flange 97 in the first region RG1 of the plate portion 90. More specifically, by pressing the first region RG1 of the plate portion 90 in the first direction DR1 with the rotating front end portion 11, the hole formed in the first region RG1 is expanded. As a result, the through hole 96 is formed in the first region RG1. In addition, by inserting the rotating column portion 13 into the through hole 96 formed in the first region RG1, the shape of the through hole 96 and the shape of the flange 97 are adjusted. When defining the cross-section perpendicular to the central axis of the flanging tool 10 as the cross-section, the size and shape of the cross-section of the column portion 13 may also be substantially constant along the central axis of the flanging tool 10.

[0065] The cross-sectional shape of the front end portion 11 of the flanging tool 10 may be circular, or as Figure 16As illustrated, it may be a rounded polygon shape (e.g., a rounded quadrilateral shape), or it may be other shapes. The cross-sectional shape of the column portion 13 of the flanging tool 10 may be a circular shape, or may be as Figure 16 illustrated, a rounded polygon shape (e.g., a rounded quadrilateral shape), or it may be other shapes.

[0066] As Figure 5 illustrated, the shoulder 15 has the function of adjusting the shape of the surface on the second direction DR2 side of the plate portion 90 of the workpiece 9. More specifically, by pressing the surface on the second direction DR2 side of the plate portion 90 with the shoulder 15 in a rotating state, the shape of this surface is adjusted.

[0067] (Tool change process) The workpiece processing method in the first embodiment may also include a process of replacing the flanging tool 10 held by the processing head 30 with a tapping tool 18 (see Figure 6 ). This process is hereinafter referred to as the "tool change process". The tool change process is performed using a tool change device, for example. Alternatively, the tool change process may also be performed manually. In addition, in the case where the machine tool in the first embodiment has a second processing head that holds the tapping tool 18 in addition to the processing head 30 that holds the flanging tool 10, the tool change process may be omitted.

[0068] (Tapping process) As Figure 6 and Figure 7 illustrated, the workpiece processing method in the first embodiment may also include a process of forming an internal thread on the wall surface 96w of the specified through hole 96 (hereinafter referred to as the "tapping process"). The tapping process is performed as the fifth step ST5 after performing the fourth step ST4 (flanging process).

[0069] In Figure 6 and Figure 7 the examples described, the tapping process (fifth step ST5) includes forming an internal thread 96s on the wall surface 96w of the specified through hole 96 by moving the rotating tapping tool 18 in the first direction DR1. Figure 8 shows the situation after performing the tapping process.

[0070] In the first embodiment, since the first coating layer 93 is removed from the first region RG1 of the plate portion 90, a flange 97 is well formed in the flanging process. In addition, since the flange 97 is well formed, by performing the tapping process, an internal thread 96s can be easily formed on the inner circumferential surface of the flange 97.

[0071] (Machine tool 1A) As Figure 17As illustrated, the machine tool 1A in the first embodiment includes a workpiece support device 2, a machining head 30, a rotation drive device 36 (e.g., a motor 36m), a moving device 4, a removing device 5, and a control device 8.

[0072] The workpiece support device 2 supports the workpiece 9. The workpiece support device 2 may have a first chuck 21 that supports a first part of the workpiece 9 and a second chuck 23 that supports a second part of the workpiece 9.

[0073] The machining head 30 supports the flanging tool 10 so as to be rotatable about the rotation axis AX. In Figure 4 the example described, the machining head 30 has a rotating body 31 and a frame 33 that supports the rotating body 31 so as to be rotatable. In Figure 4 the example described, the rotating body 31 supports the flanging tool 10 via a first tool shank HD1.

[0074] The rotation drive device 36 rotates the flanging tool 10 about a rotation axis AX that coincides with the central axis of the flanging tool 10. More specifically, the rotation drive device 36 rotates the flanging tool 10 about the rotation axis AX by rotating the rotating body 31 about a first axis AX1. In Figure 4 the example described, the first axis AX1, which is the rotation axis of the rotating body 31, is coaxial with the rotation axis AX of the flanging tool 10.

[0075] In Figure 17 the example described, the moving device 4 relatively moves the machining head 30 with respect to the workpiece support device 2. In addition, the moving device 4 relatively moves the laser head 51 with respect to the workpiece support device 2.

[0076] The removing device 5 removes a part of the first coating layer 93 from the workpiece 9. In Figure 17 the example described, the removing device 5 includes a laser irradiation device 50a having a laser head 51. Alternatively or additionally, the removing device 5 may also include a chemical solution application device 50b (see Figure 14 ) and / or a cutting device 50c (see Figure 15 ). Additionally, as Figure 15 illustrated, when a second tool T2 such as a cutting tool is mounted on the machining head 30, the machining head 30 and the second tool T2 function as the removing device 5.

[0077] The control device 8 controls the rotation drive device 36, the moving device 4, and the removing device 5. Additionally, the control device 8 may also control the workpiece support device 2.

[0078] The control device 8 can execute the removal mode M1. The removal mode M1 is a mode in which, by sending a control instruction from the control device 8 to at least the removal device 5, at least the removal device 5 is used to remove the first coating layer 93 from the first region RG1 of the plate portion 90. More specifically, as Figure 17 illustrated, the removal mode M1 includes sending an emission instruction E1 from the control device 8 to the laser irradiation device 50a so as to remove the first coating layer 93 from the first region RG1 of the plate portion 90 by the laser B emitted from the laser head 51.

[0079] For example, as Figure 17 illustrated, the control device 8 that executes the removal mode M1 sends a first movement instruction S1 for relatively moving the laser head 51 with respect to the workpiece support device 2 to the movement device 4. The movement device 4 that receives the first movement instruction S1 relatively moves the laser head 51 with respect to the workpiece support device 2 so that the first region RG1 of the plate portion 90 is located on the laser emission axis of the laser head 51. In addition, the control device 8 that executes the removal mode M1 sends an emission instruction E1 to the laser irradiation device 50a. The laser irradiation device 50a that receives the emission instruction E1 emits laser light in the direction from the laser head 51 toward the first region RG1 of the plate portion 90. In addition, the movement device 4 that receives the first movement instruction S1 relatively moves the laser head 51 with respect to the workpiece support device 2 (refer to the dashed arrow in Figure 2 ) so that the laser light emitted from the laser head 51 scans the removal target region RT. In this way, the first coating layer 93 is removed from the first region RG1 of the plate portion 90 by the laser B emitted from the laser head 51. In addition, when the spot diameter of the laser B irradiated to the first region RG1 is equal to the size of the removal target region RT, scanning of the laser B is not required.

[0080] As Figure 18 illustrated, when there is a second wall 99b of the workpiece 9 between the laser emission port 52 of the laser head 51 and the first region RG1 of the plate portion 90, if the control device 8 executes the removal mode M1, a near opening OP (refer to Figure 2 ) is formed in the second wall 99b of the workpiece 9 by the laser B emitted from the laser head 51, and the first coating layer 93 is removed from the first region RG1 of the plate portion 90 by the laser B emitted from the laser head 51.

[0081] The control device 8 can also execute a flipping mode M2 for flipping the workpiece 9. The flipping mode M2 is a mode in which, by sending a control instruction from the control device 8 to the workpiece support device 2, the workpiece support device 2 is used to flip the workpiece 9.

[0082] For example, as Figure 19As illustrated, the control device 8 that executes the flipping mode M2 sends a flipping instruction RW for flipping the workpiece 9 to the workpiece support device 2. The workpiece support device 2 that receives the flipping instruction RW flips the workpiece 9. More specifically, the workpiece support device 2 that receives the flipping instruction RW rotates the workpiece 9 by 180 degrees about an axis AT parallel to the long side direction of the workpiece 9. In Figure 19 In the example described, the flipping of the workpiece 9 is performed as follows: The workpiece support device 2 that receives the flipping instruction RW rotates the first chuck 21 and the second chuck 23 that support the workpiece 9 by 180 degrees about an axis AT parallel to the long side direction of the workpiece 9. Figure 19 Shows the state of the workpiece 9 after flipping.

[0083] The control device 8 can execute the flanging process mode M3. The flanging process mode M3 is a mode in which the plate portion 90 is flanged by sending control instructions from the control device 8 to at least the rotation drive device 36 and the moving device 4. In addition, the flanging process mode M3 is a mode in which a flanging tool 10 that moves in the first direction DR1 in a rotating state is used to form a through hole 96 and a flange 97 in the first region RG1 from which the first coating layer 93 has been removed.

[0084] For example, as Figure 20 As illustrated, the control device 8 that executes the flanging process mode M3 sends a second movement instruction S2 for relatively moving the flanging tool 10 with respect to the workpiece support device 2 to the moving device 4. The moving device 4 that receives the second movement instruction S2 relatively moves the flanging tool 10 with respect to the workpiece support device 2 so that the first region RG1 of the plate portion 90 is located on the rotation axis AX of the flanging tool 10. In addition, the control device 8 that executes the flanging process mode M3 sends a first rotation instruction R1 to the rotation drive device 36. The rotation drive device 36 that receives the first rotation instruction R1 rotates the flanging tool 10 about the rotation axis AX. Furthermore, the moving device 4 that receives the second movement instruction S2 moves the rotating flanging tool 10 in the first direction DR1 (see the arrow AR1 in Figure 4 or Figure 20 ) so that the rotating flanging tool 10 passes through the first region RG1 of the plate portion 90. In this way, a through hole 96 and a flange 97 are formed in the first region RG1 of the plate portion 90. In Figure 5 In the example described, by executing the flanging process mode M3, a through hole 96 and a flange 97 are simultaneously formed in the first region RG1 of the plate portion 90.

[0085] The control device 8 can also execute the tool change mode M4. The tool change mode M4 is a mode in which, by sending instructions from the control device 8 to at least the moving device 4 and the tool change device 6 (see Figure 21)(Send a control instruction, and at least use the mobile device 4 and the tool changing device 6 to replace the flanging tool 10 mounted on the machining head 30 with the tapping tool 18.)

[0086] For example, as Figure 21 illustrated, the control device 8 that executes the tool change mode M4 sends a movement instruction S4 to the mobile device 4. The mobile device 4 that receives the movement instruction S4 moves the machining head 30 to the tool change position P1 (refer to Figure 21 ). In addition, the control device 8 that executes the tool change mode M4 sends a tool change instruction C1 to the tool changing device 6. The tool changing device 6 that receives the tool change instruction C1 replaces the flanging tool 10 held by the machining head 30 with the tapping tool 18.)

[0087] The control device 8 can also execute the tapping mode M5. The tapping mode M5 is a mode in which an internal thread 96s is formed on the wall surface 96w of the specified through hole 96 by sending control instructions from the control device 8 to at least the rotary drive device 36 and the mobile device 4 and using at least the rotary drive device 36 and the mobile device 4.)

[0088] For example, as Figure 22 illustrated, the control device 8 that executes the tapping mode M5 sends a third movement instruction S3 for relatively moving the tapping tool 18 with respect to the workpiece support device 2 to the mobile device 4. The mobile device 4 that receives the third movement instruction S3 relatively moves the tapping tool 18 with respect to the workpiece support device 2 so that the central axis of the through hole 96 is located on the rotation axis AX of the tapping tool 18. In addition, the control device 8 that executes the tapping mode M5 sends a second rotation instruction R2 to the rotary drive device 36. The rotary drive device 36 that receives the second rotation instruction R2 rotates the tapping tool 18 around the rotation axis AX. Further, the mobile device 4 that receives the third movement instruction S3 moves the rotating tapping tool 18 in the first direction DR1 to form an internal thread 96s on the wall surface 96w of the specified through hole 96. In this way, an internal thread 96s is formed on the wall surface 96w of the specified through hole 96.)

[0089] (Second Embodiment) Refer to Figures 1 to 30 , and the workpiece processing method, the machine tool 1B, and the program 822 in the second embodiment will be described.) Figure 24 is a diagram schematically showing a part of the machine tool 1B in the second embodiment.) Figure 25 is a diagram magnifying a part of Figure 24 .) Figure 26 And Figure 27 is a diagram schematically showing the machine tool 1B in the second embodiment.) Figure 28 And Figure 29 ​This is a diagram schematically showing a part of the machine tool 1B in the second embodiment. Figure 30 This is a diagram schematically showing an example of the storage medium 82M storing the program 822.

[0090] In the second embodiment, the description will be centered on the differences from the first embodiment. On the other hand, in the second embodiment, the redundant description of the matters already described in the first embodiment will be omitted. Therefore, in the second embodiment, even if not explicitly described, of course, the matters already described in the first embodiment can be applied to the second embodiment. Conversely, all matters described in the second embodiment can be applied to the first embodiment.

[0091] As Figure 24 illustrated, the machine tool 1B in the second embodiment includes a workpiece support device 2, a machining head 30, a rotational drive device 36, a moving device 4, a removing device 5 (such as a laser irradiation device 50a), and a control device 8.

[0092] Regarding the workpiece support device 2, the machining head 30, the rotational drive device 36, the moving device 4, the removing device 5 (such as the laser irradiation device 50a), and the control device 8, they have already been described in the first embodiment, so the redundant description of these structures will be omitted.

[0093] The second embodiment achieves the same effects as the first embodiment.

[0094] The workpiece machining method in the second embodiment includes a preparation process (first step ST1), a removing process (second step ST2), and a flanging process (fourth step ST4). Additionally, the workpiece machining method in the second embodiment may further include a position changing process (third step ST3) and / or a tapping process (fifth step ST5).

[0095] Regarding the preparation process, the removing process, the position changing process, the flanging process, and the tapping process, they have already been described in the first embodiment, so the redundant description of these processes will be omitted.

[0096] (Optional additional structure) Next, with reference to Figures 1 to 30 , an optional additional structure that can be adopted in the second embodiment (or the above - mentioned first embodiment) will be described.

[0097] (Workpiece 9) As Figure 25 illustrated, the workpiece 9 has a plate portion 90, and the plate portion 90 includes a base material 91 and a first coating layer 93 covering at least a part of the base material 91. Regarding the workpiece 9, it has already been described in the first embodiment, so the redundant description of the workpiece 9 will be omitted.

[0098] (Workpiece support device 2) In Figure 26 In the example described, the workpiece support device 2 has a first chuck 21 that supports the first part of the workpiece 9 and a second chuck 23 that supports the second part of the workpiece 9.

[0099] The first chuck 21 may also have a gripping member 211 that can grip the workpiece 9. The first chuck 21 can also move together with the workpiece 9 in a direction parallel to the X-axis. Additionally, in Figure 26 In the example described, the X-axis is an axis parallel to the extending direction of the workpiece 9 gripped by the first chuck 21.

[0100] The second chuck 23 may also have a plurality of guide rollers 231 that clamp the workpiece 9. The plurality of guide rollers 231 guide the workpiece 9 (more specifically, a long workpiece) to move in a direction parallel to the X-axis.

[0101] In Figure 26 In the example described, the workpiece support device 2 has a second rotation drive device 25 that rotates the workpiece 9 about an axis AT parallel to the long side direction of the workpiece. The second rotation drive device 25 may also include: a first motor 25a that rotates a second rotating body 22 supporting the first chuck 21 about the axis AT; and a second motor 25b that rotates a third rotating body 24 supporting the second chuck 23 about the axis AT.

[0102] (Moving device 4) In Figure 24 In the example described, the moving device 4 relatively moves the machining head 30 with respect to the workpiece support device 2. In addition, the moving device 4 relatively moves the laser head 51 with respect to the workpiece support device 2.

[0103] In Figure 24 In the example described, the moving device 4 includes a first moving device 40 that moves the machining head 30. As Figure 26 Illustrated, the moving device may also include a second moving device 46 (more specifically, a motor 46m such as a servo motor) that moves the workpiece 9. In Figure 26 In the example described, the second moving device 46 moves the workpiece 9 gripped by the first chuck 21 in a direction parallel to the X-axis by moving the first chuck 21 in a direction parallel to the X-axis.

[0104] In Figure 24 In the example described, the first moving device 40 has a moving body (41a; 43a) that supports the machining head 30 and a drive device (41b; 43b) that moves the moving body (41a; 43a).

[0105] The first moving device 40 may also have a first moving body 41a and a first driving device 41b that moves the first moving body 41a in a direction parallel to the Z-axis. In Figure 24 In the example described, the first moving body 41a directly or indirectly supports the processing head 30 and can move together with the processing head 30 in a direction parallel to the Z-axis. The first moving body 41a may also directly or indirectly support the laser head 51. In addition, the first moving body 41a can also move together with the laser head 51 in a direction parallel to the Z-axis. Additionally, the Z-axis is an axis perpendicular to the X-axis. In Figure 24 In the example described, the Z-axis is an axis parallel to the vertical direction.

[0106] The first moving device 40 may also have a second moving body 43a and a second driving device 43b that moves the second moving body 43a in a direction parallel to the Y-axis. In Figure 24 In the example described, the second moving body 43a directly or indirectly supports the processing head 30 and can move together with the processing head 30 in a direction parallel to the Y-axis. The second moving body 43a may also directly or indirectly support the laser head 51. In addition, the second moving body 43a can also move together with the laser head 51 in a direction parallel to the Y-axis. Additionally, the Y-axis is an axis perpendicular to both the X-axis and the Z-axis. In Figure 24 In the example described, the Y-axis is an axis parallel to the horizontal plane.

[0107] The first moving device 40 may also have a third driving device 45b that relatively moves the processing head 30 relative to the laser head 51. In Figure 24 In the example described, the third driving device 45b relatively moves the processing head 30 relative to the laser head 51 in a direction parallel to the Z-axis.

[0108] (Laser irradiation device 50a) As Figure 24 illustrated, the laser irradiation device 50a has a laser head 51, a laser light source 53, and an optical component 55 (such as an optical fiber, etc.) that transmits laser light from the laser light source 53 to the laser head 51. The laser head 51 has a laser emission port 52 that emits laser light.

[0109] (Processing head 30) The processing head 30 supports the edge trimming tool 10 so that it can rotate around the rotation axis AX. The processing head 30 has a rotating body 31 and a frame 33 that supports the rotating body 31 so that it can rotate. In Figure 24 In the example described, the rotating body 31 supports the edge trimming tool 10 via the first tool shank HD1.

[0110] The rotation driving device 36 rotates the rotating body 31 around the first axis AX1, causing the edge trimming tool 10 to rotate around the rotation axis AX. In Figure 24In the described example, the first axis AX1, which is the rotation axis of the rotating body 31, is coaxial with the rotation axis AX of the edge-cutting tool 10.

[0111] In Figure 28 and Figure 29 the described examples, the processing head 30 can selectively hold the first tool shank HD1 (see Figure 28 ) of the edge-cutting tool 10 and the second tool shank HD2 (see Figure 29 ) that holds the tapping tool 18.

[0112] (Tool changing device 6) The machine tool 1 may also be equipped with a tool changing device 6. As Figure 21 illustrated, the tool changing device 6 can replace the first tool shank HD1 held by the processing head 30 (more specifically, the rotating body 31 of the processing head 30) with the second tool shank HD2 that holds the tapping tool 18. In addition, the tool changing device 6 can replace the second tool shank HD2 held by the processing head 30 (more specifically, the rotating body 31 of the processing head 30) with the first tool shank HD1 that holds the edge-cutting tool 10.

[0113] The tool changing device 6 may also include a tool changing arm 61, an arm rotating device 63 that rotates the tool changing arm 61, and an arm moving device 65 that linearly moves the tool changing arm 61. The arm rotating device 63 rotates the tool changing arm 61 around the second axis AX2. In addition, the arm moving device 65 moves the tool changing arm 61 in a direction parallel to the second axis AX2.

[0114] (Control device 8) The control device 8 controls the rotation drive device 36, the moving device 4 (such as the first drive device 41b, the second drive device 43b, the third drive device 45b, the motor 46m that moves the workpiece 9, etc.), and the removing device 5 (such as the laser irradiation device 50a). Additionally, the control device 8 may also control the second rotation drive device 25 and / or the tool changing device 6.

[0115] For example, in Figure 24 the described example, the control device 8 emits the laser B from the laser head 51 by sending an emission command E1 to the laser irradiation device 50a. More specifically, the control device 8 sends an emission command E1 to the laser irradiation device 50a, and the laser irradiation device 50a that receives the emission command E1 emits the laser B from the laser head 51 (more specifically, the laser emission port 52 of the laser head 51).

[0116] For example, in Figure 28 or Figure 29In the described example, the control device 8 causes the flanging tool 10 or the tapping tool 18 to rotate by sending a rotation command R to the rotation drive device 36 (e.g., the motor 36m). More specifically, the control device 8 sends the rotation command R to the rotation drive device 36, and the rotation drive device 36 that receives the rotation command R causes the flanging tool 10 or the tapping tool 18 to rotate about the rotation axis AX.

[0117] For example, in Figure 24 or Figure 28 In the described example, the control device 8 causes the processing head 30 or the laser head 51 to relatively move with respect to the workpiece support device 2 by sending a movement command S to the movement device 4. More specifically, the control device 8 sends the movement command S to the movement device 4, and the movement device 4 that receives the movement command S causes the processing head 30 or the laser head 51 to relatively move with respect to the workpiece support device 2.

[0118] As Figure 24 illustrated, the control device 8 includes a hardware processor 80 (hereinafter simply referred to as "processor 80"), a memory 82, a communication circuit 84, and an input device 86 (e.g., a display 862 with a touch panel). The processor 80, the memory 82, the communication circuit 84, and the input device 86 are interconnected via a bus 88.

[0119] The memory 82 stores data 826 and programs 822. The program 822 stored in the memory 82 may include a first program 822a for implementing the above-described removal mode M1, and may also include a third program 822c for implementing the above-described flanging processing mode M3. The program 822 may include a second program 822b for implementing the above-described flipping mode M2, and may also include a fourth program 822d for implementing the above-described tool change mode M4. In addition, the program 822 may also include a fifth program 822e for implementing the above-described tapping processing mode M5.

[0120] The memory 82 is a storage medium readable by the processor 80 of the control device 8. The memory 82 may be, for example, a non-volatile or volatile semiconductor memory such as a RAM, a ROM, a flash memory, a magnetic disk, or other forms of memory.

[0121] Data required for removing the first coating layer 93 can be input into the control device 8 via the input device 86, can also be input into the control device 8 from another computer via the communication circuit 84, or can also be calculated or derived by the control device 8. The data required for removing the first coating layer 93 (for example, workpiece data 826a including data representing the thickness of the first coating layer 93, data 826b representing the position and size of the removal target area RT, characteristic data 826c of an obstacle between the removal target area RT and the laser head 51, laser output parameters 826d, the feed speed command value 826e of the laser head 51, first path data 826f specifying the first movement path along which the removal device 5 such as the laser head 51 should move, etc.) is stored in the memory 82.

[0122] Data required for edge machining can be input into the control device 8 via the input device 86, can also be input into the control device 8 from another computer via the communication circuit 84, or can also be calculated or derived by the control device 8. The data required for edge machining (for example, workpiece data 826a, second path data 826g specifying the second movement path along which the edge cutting tool 10 should move, etc.) is stored in the memory 82.

[0123] Data required for tapping can be input into the control device 8 via the input device 86, can also be input into the control device 8 from another computer via the communication circuit 84, or can also be calculated or derived by the control device 8. The data required for tapping (for example, workpiece data 826a, third path data 826h specifying the third movement path along which the tapping tool 18 should move, etc.) is stored in the memory 82. Additionally, when data determining the length of the flange 97 along the central axis direction of the through hole 96 is stored in the memory 82, the control device 8 can also derive the third path data 826h (for example, the third path data 826h specifying the insertion depth of the tapping tool 18 relative to the first wall 99a) based on this data. Furthermore, when data determining the tool diameter of the edge cutting tool 10 is stored in the memory 82, the control device 8 can also derive the length of the flange 97 along the central axis direction of the through hole 96 based on this data.

[0124] The input device 86 is not limited to the display 862 with a touch panel. For example, the control device 8 can also be provided with input devices 86 such as buttons, switches, control levers, pointing devices, keyboards, etc., and a display for displaying the data or other information input into the input device 86. Additionally, multiple computers can cooperate to function as the control device 8. Moreover, the memory 82 can also be dispersedly arranged in multiple locations. For example, a part of the memory 82 can also be included in cloud storage.

[0125] The processor 80 of the control device 8 executes the program 822 stored in the memory 82, whereby the control device 8 generates control instructions. Further, the communication circuit 84 transmits the control instructions to the devices to be controlled (more specifically, the rotary drive device 36, the moving device 4, the laser irradiation device 50a, etc., excluding the device 5, the second rotary drive device 25, the tool changing device 6, etc.). Thus, by the processor 80 executing the program 822, the control device 8 can control the rotary drive device 36, the moving device 4, the laser irradiation device 50a, etc., such as the device 5, the second rotary drive device 25, the tool changing device 6, etc.

[0126] In Figure 24 In the example described, workpiece data 826a is stored in the memory 82. The workpiece data 826a includes, for example, shape data of the workpiece 9, data determining the position of the through-hole 96 to be formed by the edge punching process, and data determining the size of the through-hole 96 to be formed by the edge punching process (for example, data determining the inner diameter of the through-hole 96). Further, the workpiece data 826a may also include data determining the length of the flange to be formed by the edge punching process.

[0127] The control device 8 may also derive the position and size of the removal target area RT, at least based on the workpiece data 826a (more specifically, based on the shape data of the workpiece 9, the data determining the position of the through-hole 96 to be formed by the edge punching process, and the data determining the size of the through-hole 96 to be formed by the edge punching process), and store the data 826b representing the position and size of the removal target area RT in the memory 82.

[0128] Further, the control device 8 may derive the first movement path along which the removal device 5 such as the laser head 51 should move, based on the data 826b representing the position and size of the removal target area RT, and store the first path data 826f representing the derived first movement path in the memory 82.

[0129] Furthermore, the control device 8 may generate a first movement instruction S1 based on the first path data 826f, and send the first movement instruction S1 to the moving device 4 to move the removal device 5 such as the laser head 51 along the first movement path. The moving device 4 that receives the first movement instruction S1 moves the removal device 5 such as the laser head 51 along the first movement path. Thus, the first coating layer 93 is removed in the removal target area RT.

[0130] In the above example, based on the workpiece data 826a, the control device 8 automatically derives the position of the removal target area RT, the size of the removal target area RT, and the first movement path. Therefore, the operator does not need to input these data into the control device 8. As a result, the workload of the operator is reduced, and the generation of defective workpieces due to input errors of the operator is avoided.

[0131] In Figure 24 the example described, workpiece data 826a is stored in the memory 82. The workpiece data 826a includes, for example, shape data of the workpiece 9, data for determining the position of the through hole 96 to be formed by edge trimming, material data of the base material 91, plate thickness data of the base material 91, material data of the first coating layer 93, thickness data of the first coating layer 93, and the like.

[0132] The control device 8 can also determine the laser output parameters 826d based at least on the workpiece data 826a, and store the determined laser output parameters 826d in the memory 82. In addition, the laser output parameters 826d include, for example, power, pulse frequency, duty ratio, focal length, etc. Further, the control device 8 can also determine the feed speed command value of the laser head 51 based at least on the workpiece data 826a, and store the determined feed speed command value 826e in the memory 82.

[0133] The control device 8 can also determine the laser output parameters based at least on the characteristic data 826c of the obstacle (such as the second wall 99b) between the removal target area RT and the laser head 51, and store the determined laser output parameters 826d in the memory 82. Further, the control device 8 can also determine the feed speed command value of the laser head 51 based at least on the characteristic data 826c of the obstacle (such as the second wall 99b) between the removal target area RT and the laser head 51, and store the determined feed speed command value 826e in the memory 82. In addition, the characteristic data 826c of the obstacle between the removal target area RT and the laser head 51 includes, for example, at least one of the presence or absence of the obstacle, the thickness of the obstacle, and the material of the obstacle.

[0134] For example, when there is an obstacle (such as the second wall 99b) between the removal target area RT and the laser head 51, it is necessary to remove the obstacle using a laser. Therefore, in this case, it is preferable to relatively increase the laser output or relatively decrease the feed speed of the laser head 51.

[0135] For example, it can also be that the greater the thickness of the obstacle between the removal target area RT and the laser head 51, the more relatively the laser output is increased, or the more relatively the feed speed of the laser head 51 is decreased.

[0136] For example, when the material of the obstacle between the target area RT and the laser head 51 is a material that is easily melted by the laser (for example, in the case of a material with high laser absorption characteristics or a low melting point), the laser output can be relatively reduced, or the feed speed of the laser head 51 can be relatively increased.

[0137] The control device 8 can also determine the laser output parameters based on at least both the workpiece data 826a and the characteristic data 826c of the obstacle (such as the second wall 99b) between the target area RT and the laser head 51, and store the determined laser output parameters 826d in the memory 82. In addition, the control device 8 can also determine the feed speed command value of the laser head 51 based on at least both the workpiece data 826a and the characteristic data 826c of the obstacle (such as the second wall 99b) between the target area RT and the laser head 51, and store the determined feed speed command value 826e in the memory 82.

[0138] In the above example, based on at least one of the workpiece data 826a and the characteristic data 826c of the obstacle (such as the second wall 99b) between the target area RT and the laser head 51, at least one of the laser output parameters 826d and the feed speed command value 826e of the laser head 51 is automatically derived by the control device 8. Therefore, the operation burden on the operator is reduced.

[0139] (Removal mode M1) The control device 8 can execute the removal mode M1 by controlling the removal device 5 (more specifically, the laser irradiation device 50a) and the moving device 4. As Figure 2 , Figures 12 to 15 illustrated, the removal mode M1 is a mode in which removal components such as the laser B, the liquid medicine L, and the second tool T2 are applied to the first coating layer 93 to remove the first coating layer 93 from the first region RG1 of the plate portion 90. Hereinafter, an example in which the laser B is applied to the first coating layer 93 will be described.

[0140] For example, in Figure 17 or Figure 26 In the example described, the control device 8 that executes the program 822 (more specifically, the first program 822a) sends the above laser output parameters 826d and the emission command E1 to the laser irradiation device 50a. In addition, the control device 8 that executes the program 822 (more specifically, the first program 822a) sends the first movement command S1 to the moving device 4 based on the feed speed command value 826e of the laser head 51 stored in the memory 82 and the first path data 826f.

[0141] The laser irradiation device 50a that receives the laser output parameter 826d and the emission instruction E1 emits the laser corresponding to the laser output parameter 826d toward the removal target area RT. The moving device 4 that receives the first movement instruction S1 moves the laser head 51 along the first movement path. In this way, the first coating layer 93 is removed from the first area RG1 of the plate portion 90. In addition, when there is an obstacle (such as the second wall 99b) on the laser emission axis of the laser head 51, the obstacle is removed by the laser emitted toward the removal target area RT.

[0142] (Flip mode M2) The control device 8 can also execute the flip mode M2 by controlling the workpiece support device 2 (more specifically, the second rotation drive device 25).

[0143] For example, in Figure 19 or Figure 27 In the example described, the control device 8 that executes the program 822 (more specifically, the second program 822b) sends a flip instruction RW to the second rotation drive device 25. The second rotation drive device 25 that receives the flip instruction RW flips the workpiece 9. More specifically, the second rotation drive device 25 that receives the flip instruction RW flips the workpiece 9 by rotating the first chuck 21 and the second chuck 23 180 degrees around the axis AT parallel to the long side direction of the workpiece 9.

[0144] (Flanging process mode M3) The control device 8 can execute the flanging process mode M3 by controlling the rotation drive device 36 and the moving device 4.

[0145] For example, in Figure 20 or Figure 28 In the example described, the control device 8 that executes the program 822 (more specifically, the third program 822c) sends a first rotation instruction R1 to the rotation drive device 36. In addition, the control device 8 that executes the program 822 (more specifically, the third program 822c) sends a second movement instruction S2 to the moving device 4 based on the second path data 826g stored in the memory 82.

[0146] The rotation drive device 36 that receives the first rotation instruction R1 rotates the flanging tool 10 around the central axis in the long side direction of the flanging tool 10. More specifically, the rotation drive device 36 that receives the first rotation instruction R1 rotates the rotating body 31 of the processing head 30 around the first axis AX1, causing the flanging tool 10 to rotate around the rotation axis AX. In addition, the moving device 4 that receives the second movement instruction S2 moves the flanging tool 10 along the second movement path. More specifically, the first drive device 41b that receives the second movement instruction S2 moves the flanging tool 10 along the second movement path by moving the processing head 30 in the Z-axis direction. In this way, the first region RG1 of the plate portion 90 is flanged by the rotating flanging tool 10. In other words, a through hole 96 and a flange 97 are formed in the first region RG1 of the plate portion 90 by the rotating flanging tool 10.

[0147] (Tool change mode M4) The control device 8 can also execute a tool change mode M4 for replacing the flanging tool 10 held by the processing head 30 with a tapping tool 18. The control device 8 executes the tool change mode M4 by controlling the moving device 4 and the tool change device 6.

[0148] For example, in Figure 21 the example described, the control device 8 that executes the program 822 (more specifically, the fourth program 822d) sends a movement instruction S4 to the moving device 4. In addition, the control device 8 that executes the program 822 (more specifically, the fourth program 822d) sends a tool change instruction C1 to the tool change device 6. The moving device 4 that receives the movement instruction S4 moves the processing head 30 to the tool change position P1. In addition, the tool change device 6 that receives the tool change instruction C1 replaces the flanging tool 10 held by the processing head 30 with a tapping tool 18.

[0149] (Tapping mode M5) The control device 8 can execute a tapping mode M5 by controlling the rotation drive device 36 and the moving device 4.

[0150] For example, in Figure 22 or Figure 29 the example described, the control device 8 that executes the program 822 (more specifically, the fifth program 822e) sends a second rotation instruction R2 to the rotation drive device 36. In addition, the control device 8 that executes the program 822 (more specifically, the fifth program 822e) sends a third movement instruction S3 to the moving device 4 based on the third path data 826h stored in the memory 82.

[0151] The rotation drive device 36 that receives the second rotation instruction R2 rotates the tapping tool 18 about the central axis in the long side direction of the tapping tool 18. More specifically, the rotation drive device 36 that receives the second rotation instruction R2 rotates the tapping tool 18 about the rotation axis AX by rotating the rotating body 31 of the processing head 30 about the first axis AX1. In addition, the moving device 4 that receives the third movement instruction S3 moves the tapping tool 18 along the third movement path. More specifically, the first drive device 41b that receives the third movement instruction S3 moves the tapping tool 18 along the third movement path by moving the processing head 30 in the Z-axis direction. In this way, an internal thread 96s is formed on the wall surface 96w of the specified through hole 96 by the tapping tool 18 in a rotating state.

[0152] (Workpiece processing method) The workpiece processing method in the embodiment may also include the following steps: before executing the above removal step (second step ST2), the control device 8 determines at least one of the laser output parameter 826d and the feed speed command value 826e of the laser head 51 based on the above workpiece data 826a stored in the memory 82 and / or the characteristic data 826c of the obstacle (such as the above second wall 99b) between the removal target area RT and the laser head 51. In addition, the workpiece processing method in the embodiment may also include the step of storing the determined laser output parameter 826d and / or the feed speed command value 826e of the laser head 51 in the memory 82.

[0153] The above removal step (second step ST2) may also include the control device 8 generating the above first movement instruction S1 at least based on the above first path data 826f stored in the memory 82. The above removal step (second step ST2) may also include the control device 8 generating the above first movement instruction S1 at least based on the above first path data 826f and the feed speed command value 826e of the laser head 51 stored in the memory 82.

[0154] In addition, the above removal step (second step ST2) may also include the moving device 4 that receives the above first movement instruction S1 from the control device 8 moving the laser head 51 along the first movement path at a feed speed corresponding to the feed speed command value 826e, and the laser irradiation device 50a that receives the above laser output parameter 826d and the emission instruction E1 from the control device 8 emitting the laser with an output corresponding to the laser output parameter 826d to the removal target area RT. In this way, the first coating layer 93 is removed in the removal target area RT.

[0155] The above flanging step (fourth step ST4) may also include the control device 8 generating the above second movement instruction S2 at least based on the above second path data 826g stored in the memory 82.

[0156] In addition, the above-mentioned flanging process (fourth step ST4) may also include the rotation driving device 36 that receives the first rotation instruction R1 from the control device 8 to rotate the flanging tool 10 around the rotation axis AX, and the moving device 4 that receives the above-mentioned second movement instruction S2 to move the flanging tool 10 along the second movement path. In this way, the rotating flanging tool 10 moves in such a manner as to pass through the first region RG1 in a state where the first coating layer 93 has been removed. As a result, through the rotating flanging tool 10, a through hole 96 and a flange 97 are formed in the first region RG1.

[0157] The above-mentioned tapping process (fifth step ST5) may also include the control device 8 generating the above-mentioned third movement instruction S3 at least based on the above-mentioned third path data 826h stored in the memory 82.

[0158] In addition, the above-mentioned tapping process (fifth step ST5) may also include the rotation driving device 36 that receives the second rotation instruction R2 from the control device 8 to rotate the tapping tool 18 around the rotation axis AX, and the moving device 4 that receives the above-mentioned third movement instruction S3 to move the flanging tool 10 along the third movement path. In this way, the rotating tapping tool 18 moves in such a manner as to pass through the through hole 96. As a result, through the rotating tapping tool 18, an internal thread 96s is formed on the wall surface 96w of the specified through hole 96.

[0159] (Program 822) The program 822 in the embodiment is a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute at least the removing process (second step ST2) and the flanging process (fifth step ST5) in the above-mentioned workpiece processing method.

[0160] More specifically, the program 822 in the embodiment is a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece processing method, and this workpiece processing method includes: (1) a process of removing the first coating layer 93 from the first region RG1 of the plate portion 90 in a state where the workpiece 9 having the plate portion 90 including the base material 91 and the first coating layer 93 covering at least a part of the base material 91 is supported by the workpiece supporting device 2 (removing process: second step ST2); and (2) a process of performing flanging processing on the plate portion 90 after removing the first coating layer 93 from the first region RG1 of the plate portion 90 (flanging process: fourth step ST4).

[0161] As Figure 5 illustrated, the process of performing flanging processing on the plate portion 90 (fourth step ST4) includes forming a through hole 96 and a flange 97 in the first region RG1 of the plate portion 90 by moving the rotating flanging tool 10 in the above-mentioned first direction DR1.

[0162] Details of the removal process (second step ST2) and the flanging process (fourth step ST4) have been described in the above first embodiment or the above second embodiment, and thus the details of these processes are omitted.

[0163] The program 822 in the embodiment may also be a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece processing method, the workpiece processing method including: (1) the above removal process (second step ST2); (2) a process of turning over the workpiece 9 (more specifically, a process of rotating the workpiece 9 by 180 degrees around an axis AT parallel to the long side direction of the workpiece 9); and (3) the above flanging process (fourth step ST4). Further, the process of turning over the workpiece 9 is performed between the above removal process (second step ST2) and the above flanging process (fourth step ST4).

[0164] Details of the process of turning over the workpiece 9 have been described in the above first embodiment or the above second embodiment, and thus the details of this process are omitted.

[0165] The program 822 in the embodiment may also be a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece processing method, the workpiece processing method including: (1) the above removal process (second step ST2); (2) the above flanging process (fourth step ST4); and (3) a process of forming an internal thread 96s on the wall surface 96w of the specified through hole 96 (thread tapping process: fifth step ST5).

[0166] Further, a process of replacing the flanging tool 10 held by the processing head 30 with a thread tapping tool 18 may be performed between the above flanging process (fourth step ST4) and the above thread tapping process (fifth step ST5).

[0167] Details of the process of replacing the flanging tool 10 held by the processing head 30 with a thread tapping tool 18 and the thread tapping process (fifth step ST5) have been described in the above first embodiment or the above second embodiment, and thus the details of these processes are omitted.

[0168] The program 822 in the embodiment may also be a program for causing the machine tool 1 (more specifically, the control device 8 of the machine tool 1) to execute a workpiece machining method, which includes: (1) the above-described removing process (second step ST2); (2) a process of flipping the workpiece 9 (more specifically, a process of rotating the workpiece 9 by 180 degrees about an axis AT parallel to the long side direction of the workpiece 9); (3) the above-described flanging process (fourth step ST4); (4) a process of replacing the flanging tool 10 held by the machining head 30 with a tapping tool 18; and (5) the above-described tapping process (fifth step ST5).

[0169] Additionally, the program 822 in the embodiment may also include a subroutine for causing the control device 8 of the machine tool 1 to execute the following processes: (1) a process of deriving the position and size of the removal target area RT based on at least the workpiece data 826a (more specifically, based on the shape data of the workpiece 9, the data for determining the position of the through hole 96 to be formed by flanging, and the data for determining the size of the through hole 96 to be formed by flanging); (2) a process of deriving the first movement path along which the removal device 5 such as the laser head 51 should move based on the data 826b indicating the position and size of the removal target area RT; and (3) a process of sending a first movement command S1 to the movement device 4 to cause the removal device 5 such as the laser head 51 to move along the first movement path.

[0170] Additionally, the program 822 in the embodiment may also include a subroutine for causing the control device 8 of the machine tool 1 to execute the following processes: (1) a process of determining the laser output parameter 826d based on at least the workpiece data 826a; and (2) a process of sending a firing command E1 and the laser output parameter 826d to the laser irradiation device 50a to cause the laser with the output corresponding to the laser output parameter 826d to be emitted to the removal target area RT.

[0171] Additionally, the program 822 in the embodiment may also include a subroutine for causing the control device 8 of the machine tool 1 to execute the following processes: (1) a process of determining the laser output parameter 826d based on at least the characteristic data 826c of the obstacle (such as the above-described second wall 99b) between the removal target area RT and the laser head 51; and (2) a process of sending a firing command E1 and the laser output parameter 826d to the laser irradiation device 50a to cause the laser with the output corresponding to the laser output parameter 826d to be emitted to the removal target area RT.

[0172] The memory 82 in the embodiment may also be a non-volatile storage medium recording the above program 822. As Figure 30 Illustrated, the non-volatile storage medium recording the above program 822 may also be a portable storage medium 82M.

[0173] The present invention is not limited to the above-described embodiments or respective modified examples. Obviously, within the scope of the technical idea of the present invention, each embodiment or each modified example can be appropriately deformed or changed. In addition, various techniques used in each embodiment or each modified example can also be applied to other embodiments or other modified examples as long as there is no technical contradiction. Furthermore, any additional structure in each embodiment or each modified example can also be appropriately omitted. Description of Reference Numerals

[0174] 1, 1A, 1B... Machine tools, 2... Workpiece support device, 4... Moving device, 5... Removal device, 6... Tool changing device, 8... Control device, 9... Workpiece, 9a... Pipe, 10... Flanging tool, 11... Front end, 13... Column part, 15... Shoulder, 18... Tapping tool, 21... First chuck, 22... Second rotating body, 23... Second chuck, 24... Third rotating body, 25... Second rotation drive device, 25a... First motor, 25b... Second motor, 30... Machining head, 31... Rotating body, 33... Frame, 36... Rotation drive device, 36m... Motor, 40... First moving device, 41a... First moving body, 41b... First drive device, 43a... Second moving body, 43b... Second drive device, 45b... Third drive device, 46... Second moving device, 46m... Motor, 50a... Laser irradiation device, 50b... Liquid medicine application device, 50c... Machining device, 51... Laser head, 52... Laser exit port, 53... Laser light source, 55... Optical component, 61... Tool changing arm, 63... Arm rotation device, 65... Arm moving device, 80... Hardware processor, 82... Memory, 82M... Storage medium, 84... Communication circuit, 86... Input device, 88... Bus, 90... Board part, 91... Base material, 91s... Exposed surface, 93... First coating layer, 93a... Coating, 94... Second coating layer, 94a... Coating, 96... Through hole, 96s... Internal thread, 96w... Wall surface, 97... Flange, 99a... First wall, 99b... Second wall, 99c... Third wall, 99d... Fourth wall, 211... Holding member, 231... Guide roller, 822... Program, 822a... First program, 822b... Second program, 822c... Third program, 822d... Fourth program, 822e... Fifth program, 826... Data, 826a... Workpiece data, 826b... Data representing the position and size of the removal target area, 826c... Characteristic data of obstacles, 826d... Laser output parameters, 826e... Feed speed command value, 826f... First path data, 826g... Second path data, 826h... Third path data, 862... Display with touch panel, AT... Axis parallel to the long side direction of the workpiece, AX... Rotation axis, AX1... First axis, AX2... Second axis, B... Laser, C1... Tool change instruction, E1... Ejection instruction, G... Auxiliary gas, HD1... First tool shank, HD2... Second tool shank, L... Liquid medicine, M1... Removal mode, M2... Turning mode, M3... Flanging processing mode, M4... Tool change mode, M5... Tapping processing mode, OP... Approach opening, OP1... Through hole type opening, OP2... Slit type opening, P1... Tool change position, R... Rotation instruction, R1... First rotation instruction, R2... Second rotation instruction, RB... Removed area, RG1... First area, RT... Removal target area, RW... Turning instruction, S... Movement instruction, S1... First movement instruction,S2…Second movement instruction, S3…Third movement instruction, S4…Movement instruction, SP…Internal area, SP1…Internal space, T1…Apparatus for coating liquid medicine, T2…Second tool.

Claims

1. A workpiece processing method, characterized in that, Comprising: A process of preparing a workpiece, the workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material; and A process of flanging the plate portion, When defining the direction from the base material towards the first coating layer as the first direction, the process of flanging the plate portion includes forming a through hole and a flange in a first region of the plate portion by moving a rotating flanging tool in the first direction, Before the process of flanging the plate portion, a process of removing the first coating layer from the first region of the plate portion is performed.

2. The workpiece processing method according to claim 1, characterized in that, The first coating layer is a pure zinc or zinc alloy coating.

3. The workpiece processing method according to claim 1 or 2, characterized in that, In the process of flanging the plate portion, the formation of the through hole and the formation of the flange are performed simultaneously.

4. The workpiece processing method according to any one of claims 1 to 3, characterized in that, The process of removing the first coating layer includes removing the first coating layer from the first region of the plate portion by irradiating the first coating layer with a laser.

5. The workpiece processing method according to any one of claims 1 to 4, characterized in that The workpiece processing method further comprises a process of forming an internal thread on the wall surface defining the through hole.

6. The workpiece processing method according to any one of claims 1 to 5, characterized in that The first coating layer faces the internal region of the workpiece.

7. The workpiece processing method according to any one of claims 1 to 6, characterized in that When defining the direction opposite to the first direction as the second direction, the plate portion includes a second coating layer disposed on the second direction side of the base material and covering at least a part of the base material, The process of flanging the plate portion includes moving the rotating flanging tool in the first direction so that the rotating flanging tool sequentially passes through the second coating layer and the base material.

8. The workpiece processing method according to any one of claims 1 to 7, characterized in that, The workpiece processing method further comprises a process of flipping the workpiece after removing the first coating layer from the first region of the plate portion and before the process of flanging the plate portion.

9. The workpiece processing method according to any one of claims 1 to 8, characterized in that The workpiece has a first wall on which the first region is disposed and a second wall disposed opposite to the first wall, A proximity opening disposed opposite to the first region is formed in the second wall.

10. The workpiece processing method according to claim 9, characterized in that, When defining the region formed by removing the first coating layer as the removed region, the size of the proximity opening is smaller than the size of the removed region.

11. A machine tool, characterized in that Comprising: A workpiece support device for supporting a workpiece, the workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material; A processing head for supporting a flanging tool so that it can rotate around a rotation axis; A rotation driving device for rotating the flanging tool around the rotation axis; A moving device for relatively moving the processing head with respect to the workpiece support device; A removing device for removing a part of the first coating layer from the workpiece; And A control device for controlling the rotation driving device, the moving device and the removing device, The control device is capable of executing: A removing mode, by sending at least a control instruction to the removing device, removing the first coating layer from the first region of the plate portion; And The flanging process mode is to perform flanging on the plate portion by sending control commands to at least the rotary drive device and the moving device. When the direction from the base material towards the first coating layer is defined as the first direction, the flanging process mode is a mode in which a flanging tool moving in the first direction in a rotating state forms a through hole and a flange in the first region where the first coating layer has been removed.

12. The machine tool according to claim 11, characterized in that The removing device includes a laser irradiation device having a laser head. The removing mode includes sending an emission command from the control device to the laser irradiation device so as to remove the first coating layer from the first region of the plate portion by the laser emitted from the laser head.

13. The machine tool according to claim 12, characterized in that, When a portion to be removed by the removing device in the region occupied by the first coating layer is defined as the removal target region, the control device determines at least one of the laser output parameters and the feed speed command value of the laser head based at least on the characteristic data of the obstacle between the removal target region and the laser head.

14. The machine tool according to claim 11 or 12, characterized in that When a portion to be removed by the removing device in the region occupied by the first coating layer is defined as the removal target region, the control device derives at least the position and the size of the removal target region based on the workpiece data. The control device derives a first movement path along which the removing device should move based on the data representing the position and the size of the removal target region. The control device sends a first movement command to the moving device so that the removing device moves along the first movement path.

15. A program for causing a machine tool to execute a workpiece processing method, the workpiece processing method comprising: A step of removing the first coating layer from a first region of a plate portion of a workpiece while the workpiece having a plate portion including a base material and a first coating layer covering at least a part of the base material is supported by a workpiece support device; and A step of performing flanging on the plate portion after removing the first coating layer from the first region of the plate portion. The program is characterized in that When the direction from the base material towards the first coating layer is defined as the first direction, the step of performing flanging on the plate portion includes forming a through hole and a flange in the first region of the plate portion by moving a rotating flanging tool in the first direction.

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