Glue coating control method, device and electronic equipment

Abstract

The present disclosure relates to the field of industrial automation control technology, and provides a gluing control method, device and electronic equipment. The method comprises: obtaining first images of N first target objects after gluing processing by a target gluing device; wherein N is a positive integer; obtaining first offset data of a gluing trajectory of the first target object according to the first image; determining a first posture compensation value of a gluing mechanism of the target gluing device according to the first offset data; and performing deviation correction processing on the posture of the gluing mechanism according to the first posture compensation value.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of industrial automation control technology, and more specifically, to a glue coating control method, device, and electronic equipment. Background Art

[0002] In industrial production, especially in manufacturing scenarios involving precision bonding and gluing, product processing accuracy and yield are constrained by multiple factors. For example, the bonding and gluing process between the diaphragm and the steel ring presents significant challenges in the current production model.

[0003] On the one hand, material properties and tooling tolerances lead to quality fluctuations. During the bonding process between the diaphragm and the steel ring, due to a combination of factors such as the bonding accuracy of the materials themselves, the tolerances of the flow tooling, and the limitations of the product structure, the concentricity of the glue coating is difficult to stably control. This directly leads to large fluctuations in the overall project status and a continuously unstable product yield, which seriously affects production efficiency and product quality, and increases production costs and after-sales risks.

[0004] On the other hand, long-term operation of gluing equipment causes precision degradation. During extended processing, the mechanical structure of the gluing equipment will experience mechanical displacement due to continuous operation. Furthermore, key components such as the glue valve body experience performance loss after prolonged operation, leading to frequent glue path deviation issues. This precision degradation during equipment operation further exacerbates product quality fluctuations. Traditional production control systems lack effective means for dynamic monitoring of equipment status, real-time data feedback, and precise deviation correction, making it difficult to ensure stable product processing accuracy and yield in complex production environments. Summary of the Invention

[0005] One purpose of the embodiments of the present disclosure is to provide a new technical solution to improve the glue coating accuracy.

[0006] According to a first aspect of an embodiment of the present disclosure, a method for controlling gluing is provided, comprising:

[0007] Acquire first images of N first target objects after being glued by the target glue-coating device; wherein N is a positive integer;

[0008] Acquire first offset data of a gluing trajectory of the first target object according to the first image;

[0009] Determine a first posture compensation value of a gluing mechanism of the target gluing device according to the first offset data;

[0010] The posture of the gluing mechanism is corrected according to the first posture compensation value.

[0011] Optionally, determining a first pose compensation value of a gluing mechanism of the target gluing device according to the first offset data includes:

[0012] Determine an average value of first offset data of the gluing tracks of N first target objects;

[0013] The first posture compensation value is determined according to the average value.

[0014] Optionally, determining the first posture compensation value according to the average value includes:

[0015] Obtaining a set pulse number of a driving mechanism in the target gluing device, wherein the set pulse number is the number of driving pulses corresponding to a unit distance moved by the driving mechanism;

[0016] The first posture compensation value is obtained according to the average value and the set number of pulses.

[0017] Optionally, obtaining first offset data of a gluing track in the first target object according to the first image includes:

[0018] determining first position information of a gluing track of the first target object according to the first image;

[0019] First offset data of the gluing track corresponding to the first target object is obtained according to the first position information and the reference position information of the gluing track.

[0020] Optionally, the method further includes:

[0021] Eliminate the first offset data that exceeds the set range.

[0022] Optionally, before acquiring the first images of the N first target objects after the gluing process by the target gluing device, the method further includes:

[0023] Acquire second position information of a second target object in the target tooling that has not been glued by the target glue coating device;

[0024] determining second offset data of the second target object relative to the target tooling according to the second position information;

[0025] determining a second posture compensation value of the gluing mechanism according to the second offset data;

[0026] The posture of the gluing mechanism is corrected according to the second posture compensation value.

[0027] Optionally, the method further includes:

[0028] Determining a cumulative posture compensation value of the target gluing device corresponding to each deviation correction process according to the first posture compensation value and the second posture compensation value;

[0029] Generate and display a chart reflecting the changing trend of the cumulative posture compensation value of the target gluing equipment corresponding to each correction processing process.

[0030] Optionally, the performing deviation correction processing on the posture of the gluing mechanism according to the first posture compensation value includes:

[0031] The first posture compensation value is sent to a driving mechanism of the target gluing device, so that the driving mechanism drives the gluing mechanism according to the first posture compensation value.

[0032] According to a second aspect of the present disclosure, a gluing control device is provided, comprising:

[0033] An image acquisition module, configured to acquire first images of N first target objects after being glued by the target glue coating device; wherein N is a positive integer;

[0034] An offset acquisition module, configured to acquire first offset data of a gluing trajectory of the first target object according to the first image;

[0035] a compensation determination module, configured to determine a first posture compensation value of a gluing mechanism of the target gluing device according to the first offset data;

[0036] A correction processing module is used to perform correction processing on the posture of the gluing mechanism according to the first posture compensation value.

[0037] According to a third aspect of the present disclosure, an electronic device is provided, comprising a processor and a memory, wherein the memory is used to store a computer program, and the processor is used to execute the method described in the first aspect of the present disclosure under the control of the computer program.

[0038] According to a fourth aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method according to the first aspect of the present disclosure is implemented.

[0039] Through the embodiments of the present disclosure, the first offset data of the gluing trajectory of the first target object is obtained based on the first images of the N first target objects after the gluing process of the target gluing equipment, the first position compensation value of the gluing mechanism of the target gluing equipment is determined based on the first offset data, and then the position of the gluing mechanism is corrected based on the first position compensation value. In this way, the gluing accuracy of the target gluing equipment can be improved, thereby improving the yield rate of the target objects gluing process of the target gluing equipment.

[0040] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0042] Figure 1 is a block diagram showing a hardware configuration of a gluing system that can implement an embodiment of the present disclosure;

[0043] Figure 2 is a flow chart of a gluing control method according to one embodiment of the present disclosure;

[0044] Figure 3 is a block diagram of a gluing control device according to one embodiment of the present disclosure;

[0045] Figure 4 is a block diagram of an electronic device according to one embodiment of the present disclosure. DETAILED DESCRIPTION

[0046] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0047] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0048] Technologies, methods and equipment known to persons of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods and equipment should be considered part of the specification.

[0049] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0050] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0051] <Hardware Configuration>

[0052] Figure 1 is a block diagram illustrating a hardware configuration of a gluing system 1000 that can implement an embodiment of the present disclosure.

[0053] like Figure 1 As shown, the gluing system 1000 may include a gluing device 1100 , an automatic optical inspection device 1200 and an electronic device 1300 .

[0054] The gluing device 1100 may include a gluing mechanism 1110 and a driving mechanism 1120. The driving mechanism 1120 may drive the gluing mechanism 1110 to move and apply glue to the target object. The driving mechanism 1120 may include a programmable logic controller (PLC) and a motor corresponding to each axis.

[0055] In this embodiment, the driving mechanism 1120 of the glue coating device 1100 and the automatic optical inspection device 1200 can communicate with the electronic device 1300. The specific communication method can be wired or wireless, which is not limited here.

[0056] The electronic device 1300 may be a portable computer, a desktop computer, a mobile phone, a tablet computer, etc., or may be a server. Figure 1 As shown, electronic device 1300 may include a processor 1310, a memory 1320, an interface device 1330, a communication device 1340, a display device 1350, an input device 1360, a speaker 1370, a microphone 1380, and the like. Processor 1310 may be a CPU, a microprocessor MCU, or the like. Memory 1320 may include, for example, ROM (read-only memory), RAM (random access memory), or a non-volatile memory such as a hard disk. Interface device 1330 may include, for example, a USB port or a headphone jack. Communication device 1340 may enable wired or wireless communication, specifically, Wi-Fi, Bluetooth, or 2G / 3G / 4G / 5G communication. Display device 1350 may be, for example, an LCD display or a touchscreen display. Input device 1360 may include, for example, a touchscreen, a keyboard, or a motion sensor input device. Users may input and output voice information through speaker 1370 and microphone 1380.

[0057] Figure 1 The electronic device shown is merely illustrative and does not in any way limit the present disclosure, its application, or use. In the embodiments of the present disclosure, the memory 1320 of the electronic device 1300 is used to store instructions, which are used to control the processor 1310 to operate to perform any of the methods provided in the embodiments of the present disclosure. It should be understood by those skilled in the art that although Figure 1 While multiple devices are shown for electronic device 1300, the present disclosure may only relate to some of these devices. For example, electronic device 1300 may only relate to processor 1310 and memory 1320. A skilled person can design instructions based on the solutions disclosed herein. How instructions control processor operations is well known in the art and will not be described in detail here.

[0058] <Method Example>

[0059] The present disclosure provides a method for controlling glue application. The method can be implemented by an electronic device, specifically, by Figure 1 The electronic device 1300 is shown as an implementation.

[0060] Figure 2 Flowchart of a gluing control method according to an embodiment of the present disclosure.

[0061] like Figure 2 As shown, the gluing control method includes steps S2100 to S2400 as shown below:

[0062] Step S2100 , obtaining first images of N first target objects after gluing by a target gluing device; wherein N is a positive integer.

[0063] In this embodiment, the first target object may be a target object that has been glued by a target glue coating device, and the target object may be a diaphragm.

[0064] In order to protect the target object, the target object can be placed on a target tool. Specifically, at least one target object can be placed on a target tool.

[0065] In this embodiment, after the target object is glued by the target gluing device, a first target object is obtained. The automatic optical detection device 1200 can photograph the first target object to obtain a first image, and upload the first image to the electronic device 1300.

[0066] Step S2200: Acquire first offset data of a gluing trajectory of a first target object according to the first image.

[0067] In this embodiment, the first offset data may include an offset component relative to each axis of the driving mechanism. If the driving mechanism includes an X-axis and a Y-axis that are perpendicular to each other, the first offset data may include an offset component relative to the X-axis and an offset component relative to the Y-axis. If the driving mechanism includes a rotational axis R-axis and mutually perpendicular X-axis and Y-axis, the first offset data may include an offset component relative to the R-axis, an offset component relative to the X-axis, and an offset component relative to the Y-axis.

[0068] In some embodiments, the offset pixel value of the gluing track of the first target object in the first image relative to the gluing position may be determined, and the first offset data may be obtained based on the mapping relationship between the image pixels and the actual distance.

[0069] The offset pixel value may be a pixel displacement from a reference point of the first target object in the first image to a target point of the glue-spreading track.

[0070] In the case that the gluing track is circular, the target point of the gluing track may be the center of the gluing track, and the reference point of the first target object may be the center of the to-be-glued area of ​​the first target object.

[0071] In some embodiments, obtaining first offset data of the gluing track in the first target object based on the first image includes: determining first position information of the gluing track of the first target object based on the first image; and obtaining first offset data of the gluing track corresponding to the first target object based on the first position information and the reference position information of the gluing track.

[0072] In this embodiment, the first position information of the gluing track may be the actual position information of the target point of the gluing track, and the reference position information may be the actual position information of the reference point of the area to be glued on the first target object. If the gluing track is circular, the target point of the gluing track may be the center of the gluing track, and the reference point of the first target object may be the center of the area to be glued on the first target object.

[0073] In this embodiment, the first pixel position of the gluing track of the first target object in the first image may be determined, and the first position information of the gluing track may be obtained based on the mapping relationship between the pixel position and the actual position and the first pixel position.

[0074] In this embodiment, the reference position information of the gluing track may be the position information of the to-be-glued area of ​​the first target object.

[0075] In this embodiment, the first offset data may represent a displacement from a target point of the gluing track to a reference point of the to-be-glued area of ​​the first target object.

[0076] Through this embodiment, the first offset data of the gluing track of each first target object can be obtained quickly and accurately according to the first image.

[0077] In some embodiments, the method further includes: removing first offset data that exceeds a set range.

[0078] In this embodiment, the first offset data that exceeds the set range may be caused by an abnormality in the first target object or an abnormality in the position of the first target object in the target tooling, and is not caused by a position deviation of the gluing mechanism. Therefore, the first offset data that exceeds the set range needs to be eliminated.

[0079] In this embodiment, a setting range relative to each axis of the driving mechanism may be preset, and when the offset component corresponding to at least one axis in the first offset data exceeds the corresponding setting range, the first offset threshold is eliminated.

[0080] Through this embodiment, the first offset data of the gluing trajectory of the first object with unqualified gluing can be prevented from affecting the posture of the gluing mechanism, thereby improving the gluing accuracy of the target gluing equipment and improving the yield of the target object.

[0081] Step S2300: determining a first pose compensation value of a gluing mechanism of a target gluing device according to the first offset data.

[0082] In this embodiment, the first offset data may include an offset component relative to each axis of the driving mechanism, and correspondingly, the first posture compensation value also includes a compensation value component relative to each axis. In the case where the driving mechanism includes an X-axis and a Y-axis that are perpendicular to each other, the first posture compensation value may include a compensation value component relative to the X-axis and a compensation value component relative to the Y-axis. In the case where the driving mechanism includes a rotating axis R-axis and an X-axis and a Y-axis that are perpendicular to each other, the posture compensation value may include a compensation value component relative to the R-axis, a compensation value component relative to the X-axis, and a compensation value component relative to the Y-axis.

[0083] In this embodiment, the compensation value component relative to each axis in the first pose compensation value can be a positive number or a negative number, and the corresponding compensation direction can be represented by the positive and negative signs.

[0084] In some embodiments, determining the first pose compensation value of the gluing mechanism of the target gluing device based on the first offset data includes: determining the average value of the first offset data of the gluing trajectories of N first target objects; and determining the first pose compensation value based on the average value of the first offset data.

[0085] In this embodiment, the average value of the first offset data of the glue coating tracks of the N first target objects can be obtained by determining the average value of the offset components of the first offset data of the glue coating tracks of the N first target objects relative to each axis, that is, obtaining the average value of the first offset data.

[0086] In one embodiment, the first pose compensation value may be obtained according to the average value of the first offset data and the offset direction of the target point of the gluing trajectory relative to the reference point of the to-be-glued area of ​​the first target object.

[0087] In this embodiment, the numerical value of the first pose compensation value can be the same as the numerical value of the average value of the first offset data, and the sign of the first pose compensation value can be determined by the offset direction of the target point of the gluing trajectory relative to the reference point of the area to be glued of the first target object.

[0088] In some embodiments, the PLC drive motor of the driving mechanism rotates to adjust the posture of the gluing mechanism. Then, the first posture compensation value is determined based on the average value of the first offset data, including: obtaining the set pulse number of the driving mechanism in the target gluing equipment, wherein the set pulse number is the number of driving pulses corresponding to the driving mechanism driving the gluing mechanism to move a unit distance; and obtaining the first posture compensation value based on the average value of the first offset data and the set pulse number.

[0089] In this embodiment, the set pulse number may be the ratio between the driving pulse number and the distance that the driving pulse number can drive the glue coating mechanism to move. The set pulse number may be determined by the motor of the driving mechanism.

[0090] The first posture compensation value obtained according to this embodiment can represent the number of driving pulses corresponding to each axis, and the sign of each driving pulse number represents the driving direction.

[0091] Through this embodiment, the first posture compensation value is obtained according to the average value of the first offset data and the set number of pulses, and the PLC can directly control the motor to adjust the posture of the gluing mechanism according to the first posture compensation value.

[0092] Step S2400: Correct the posture of the gluing mechanism according to the first posture compensation value.

[0093] In this embodiment, the posture of the gluing mechanism is corrected according to the first posture compensation value, and the electronic device may send the obtained first posture compensation value to the driving mechanism of the target gluing device, so that the driving mechanism drives the gluing mechanism according to the first posture compensation value.

[0094] Specifically, the electronic device can be a PLC that sends the first posture compensation value to the driving mechanism of the target gluing device. When the PLC receives the first posture compensation value, it generates a driving signal corresponding to each axis corresponding to the first posture compensation value, drives the corresponding motor to rotate, and adjusts the posture of the gluing mechanism.

[0095] The drive signal corresponding to the first posture compensation value for each axis contains the same number of pulses as the numerical value of the compensation value component of the first posture compensation value corresponding to the axis, and the direction of the pulses contains matches the sign of the compensation value component of the first posture compensation value corresponding to the axis.

[0096] In this embodiment, the posture of the gluing mechanism is corrected according to the first posture compensation value, so that the moving displacement of the gluing mechanism and the displacement from the target point of the gluing trajectory represented by the average value of the first offset data to the reference point of the area to be glued of the first target object are the same.

[0097] Through the embodiments of the present disclosure, based on the first images of N first target objects after gluing processing by the target gluing equipment, the first offset data of the gluing trajectory of the first target object is obtained, and the first position compensation value of the gluing mechanism of the target gluing equipment is determined according to the first offset data. Then, the position of the gluing mechanism is corrected according to the first position compensation value. In this way, the gluing accuracy of the target gluing equipment can be improved, thereby improving the yield rate of the target objects gluing processing by the target gluing equipment.

[0098] In some embodiments, after correcting the posture of the gluing mechanism according to the first posture compensation value, the method may further include: controlling the target gluing device to perform gluing on N third target objects to be glued, to obtain N first target objects.

[0099] Furthermore, when N first target objects are obtained, steps S2100 to S2400 may be continued to be performed on the obtained N first target objects.

[0100] In some embodiments, before the target gluing device starts to apply glue to the target object, the method also includes: obtaining second position information of a second target object in the target tooling that has not been glued by the target gluing device; determining second offset data of the second target object relative to the target tooling based on the second position information; determining a second posture compensation value of the gluing mechanism based on the second offset data; and performing correction processing on the posture of the gluing mechanism based on the second posture compensation value.

[0101] In this embodiment, the second target object may be a target object that has not been glued.

[0102] In one embodiment, obtaining the second position information of the second target object includes: obtaining a second image of the second target object; and obtaining the second position information of the second target object according to the second image.

[0103] In this embodiment, the second position information of the second target object may be actual position information of a reference point of the second target object.

[0104] Furthermore, the second offset data may be determined based on the second position information of the second target object and the set initial position information of the second target object. The second offset data may represent a displacement from the initial position information to the second position information.

[0105] The initial position information may be set in advance when setting a movement trajectory of the glue coating mechanism during the glue coating process on the target object.

[0106] The second posture compensation value of the gluing mechanism is determined according to the second offset data; the specific method of correcting the posture of the gluing mechanism according to the second posture compensation value can refer to the aforementioned method of determining the first posture compensation value of the gluing mechanism according to the first offset data; the specific method of correcting the posture of the gluing mechanism according to the first posture compensation value will not be repeated here.

[0107] Through this embodiment, the posture of the gluing mechanism can be corrected in advance according to the gluing scenario of the target gluing equipment to ensure the yield of the N target objects that are first gluing by the target gluing equipment.

[0108] In some embodiments, the method also includes: determining the cumulative posture compensation value of the target gluing device corresponding to each correction processing process based on the first posture compensation value and the second posture compensation value; generating and displaying a chart reflecting the changing trend of the cumulative posture compensation value of the target gluing device corresponding to each correction processing process.

[0109] In this embodiment, the cumulative posture compensation value of the first correction process is equal to the second posture compensation value; the cumulative posture compensation value of the second correction process is equal to the sum of the cumulative posture compensation value of the first correction process and the first posture compensation value of the second correction process; and the cumulative posture compensation value of the i-th correction process is equal to the sum of the cumulative posture compensation value of the i-1-th correction process and the first posture compensation value of the i-th correction process, where i is an integer greater than 1.

[0110] In this embodiment, the generated chart may be a broken line chart or a line chart.

[0111] In some embodiments, a chart reflecting the changing trend of the posture compensation value of the target gluing device corresponding to each deviation correction process may also be generated and displayed.

[0112] In this embodiment, the pose compensation value of the first correction process is equal to the second pose compensation value; the accumulated pose compensation value of the second correction process is equal to the first pose compensation value of the second correction process; and the pose compensation value of the i-th correction process is equal to the first pose compensation value of the i-th correction process, where i is an integer greater than 1.

[0113] Through this embodiment, the changing trend of the cumulative posture compensation value of the target gluing equipment corresponding to each correction processing process and the changing trend of the posture compensation value of the target gluing equipment corresponding to each correction processing process can be visualized to facilitate timely viewing by staff.

[0114] <Device Example>

[0115] The present disclosure also provides a glue coating control device 3000, such as Figure 3 As shown, the gluing control device 3000 includes an image acquisition module 3100 , an offset acquisition module 3200 , a compensation determination module 3300 and a deviation correction processing module 3400 .

[0116] The image acquisition module 3100 is used to acquire first images of N first target objects after the target gluing device has performed the gluing process; wherein N is a positive integer.

[0117] The offset acquisition module 3200 is used to acquire first offset data of the gluing trajectory of the first target object according to the first image.

[0118] The compensation determination module 3300 is used to determine the first position compensation value of the gluing mechanism of the target gluing device according to the first offset data.

[0119] The correction processing module 3400 is used to perform correction processing on the posture of the gluing mechanism according to the first posture compensation value.

[0120] In some embodiments, determining a first pose compensation value of a gluing mechanism of the target gluing device according to the first offset data includes:

[0121] Determine an average value of first offset data of the gluing tracks of N first target objects;

[0122] The first posture compensation value is determined according to the average value.

[0123] In some embodiments, determining the first posture compensation value according to the average value includes:

[0124] Obtaining a set pulse number of a driving mechanism in the target gluing device, wherein the set pulse number is the number of driving pulses corresponding to a unit distance moved by the driving mechanism;

[0125] The first posture compensation value is obtained according to the average value and the set number of pulses.

[0126] In some embodiments, obtaining first offset data of a glue-spreading track in the first target object according to the first image includes:

[0127] determining first position information of a gluing track of the first target object according to the first image;

[0128] First offset data of the gluing track corresponding to the first target object is obtained according to the first position information and the reference position information of the gluing track.

[0129] In some embodiments, the gluing control device 3000 further includes:

[0130] A module for removing first offset data that exceeds a set range.

[0131] In some embodiments, the gluing control device 3000 further includes:

[0132] a module for acquiring second position information of a second target object in the target tooling that has not been glued by the target glue coating device;

[0133] a module for determining second offset data of the second target object relative to the target tooling according to the second position information;

[0134] A module for determining a second posture compensation value of the gluing mechanism according to the second offset data;

[0135] A module for correcting the posture of the gluing mechanism according to the second posture compensation value.

[0136] In some embodiments, the gluing control device 3000 further includes:

[0137] A module for determining a cumulative posture compensation value of the target gluing device corresponding to each deviation correction process according to the first posture compensation value and the second posture compensation value;

[0138] A module for generating and displaying a chart reflecting the changing trend of the cumulative posture compensation value of the target gluing equipment corresponding to each correction processing process.

[0139] In some embodiments, the correcting the posture of the gluing mechanism according to the first posture compensation value includes:

[0140] The first posture compensation value is sent to a driving mechanism of the target gluing device, so that the driving mechanism drives the gluing mechanism according to the first posture compensation value.

[0141] <Electronic Equipment Example>

[0142] This embodiment provides an electronic device. In one aspect, the electronic device 1300 may include the aforementioned glue application control device 3000 .

[0143] On the other hand, Figure 4 As shown, the electronic device 1300 may include a processor 1310 and a memory 1320, the memory 1320 is used to store computer programs, and the processor 1310 is used to control the electronic device to execute the method of any embodiment of the present disclosure under the control of the computer program.

[0144] <Readable Storage Medium Embodiment>

[0145] This embodiment provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the method described in any method embodiment of the present disclosure is executed.

[0146] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0147] A computer-readable storage medium can be a tangible device that can hold and store instructions for use by an instruction execution device. A computer-readable storage medium can be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or raised-in-groove structure on which instructions are stored, and any suitable combination thereof. As used herein, a computer-readable storage medium is not to be construed as a transient signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through an electrical wire.

[0148] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions to be stored in the computer-readable storage medium in each computing / processing device.

[0149] The computer program instructions for performing the operations of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, the state information of the computer-readable program instructions is used to personalize an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), so that the electronic circuit can execute the computer-readable program instructions, thereby implementing various aspects of the present invention.

[0150] Various aspects of the present invention are described herein with reference to flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present invention. It should be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer-readable program instructions.

[0151] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device is generated that implements the functions / actions specified in one or more blocks in the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium, where these instructions cause the computer, programmable data processing device, and / or other device to operate in a specific manner. Thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing various aspects of the functions / actions specified in one or more blocks in the flowchart and / or block diagram.

[0152] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operational steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more blocks in the flowchart and / or block diagram.

[0153] The flowcharts and block diagrams in the accompanying drawings show the possible implementation architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of an instruction, and the module, program segment or part of the instruction contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that implementation by hardware, implementation by software, and implementation by a combination of software and hardware are all equivalent.

[0154] While various embodiments of the present invention have been described above, the foregoing description is intended to be illustrative, non-exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technological improvements in the marketplace, or to enable others skilled in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A method for controlling glue coating, characterized in that: include: Acquire first images of N first target objects after being glued by the target glue-coating device; wherein N is a positive integer; Acquire first offset data of a gluing trajectory of the first target object according to the first image; Determine a first posture compensation value of a gluing mechanism of the target gluing device according to the first offset data; performing a posture correction process on the gluing mechanism according to the first posture compensation value; The determining, according to the first offset data, a first posture compensation value of the gluing mechanism of the target gluing device includes: Determine an average value of first offset data of the gluing tracks of N first target objects; Determine the first posture compensation value according to the average value; Determining the first posture compensation value according to the average value includes: Obtaining a set pulse number of a driving mechanism in the target gluing device, wherein the set pulse number is the number of driving pulses corresponding to a unit distance moved by the driving mechanism; Obtaining the first posture compensation value according to the average value and the set number of pulses; Before acquiring the first images of the N first target objects after the gluing process by the target gluing device, the method further includes: Acquire second position information of a second target object in the target tooling that has not been glued by the target glue coating device; determining second offset data of the second target object relative to the target tooling according to the second position information; determining a second posture compensation value of the gluing mechanism according to the second offset data; performing a deviation correction process on the posture of the gluing mechanism according to the second posture compensation value; The method further comprises: Determining a cumulative posture compensation value of the target gluing device corresponding to each deviation correction process according to the first posture compensation value and the second posture compensation value; Generate and display a chart reflecting the changing trend of the cumulative posture compensation value of the target gluing equipment corresponding to each correction processing process.

2. The method according to claim 1, characterized in that The acquiring first offset data of the gluing track in the first target object according to the first image includes: determining first position information of a gluing track of the first target object according to the first image; First offset data of the gluing track corresponding to the first target object is obtained according to the first position information and the reference position information of the gluing track.

3. The method according to claim 2, characterized in that The method further comprises: Eliminate the first offset data that exceeds the set range.

4. The method according to claim 1, wherein The correcting the posture of the gluing mechanism according to the first posture compensation value includes: The first posture compensation value is sent to a driving mechanism of the target gluing device, so that the driving mechanism drives the gluing mechanism according to the first posture compensation value.

5. A glue coating control device, characterized in that: include: An image acquisition module, configured to acquire first images of N first target objects after being glued by the target glue coating device; wherein N is a positive integer; An offset acquisition module, configured to acquire first offset data of a gluing trajectory of the first target object according to the first image; a compensation determination module, configured to determine a first posture compensation value of a gluing mechanism of the target gluing device according to the first offset data; a correction processing module, configured to perform correction processing on the posture of the gluing mechanism according to the first posture compensation value; The determining, according to the first offset data, a first posture compensation value of the gluing mechanism of the target gluing device includes: Determine an average value of first offset data of the gluing tracks of N first target objects; Determine the first posture compensation value according to the average value; Determining the first posture compensation value according to the average value includes: Obtaining a set pulse number of a driving mechanism in the target gluing device, wherein the set pulse number is the number of driving pulses corresponding to a unit distance moved by the driving mechanism; Obtaining the first posture compensation value according to the average value and the set number of pulses; The gluing control device also includes: a module for acquiring second position information of a second target object in the target tooling that has not been glued by the target glue coating device; a module for determining second offset data of the second target object relative to the target tooling according to the second position information; A module for determining a second posture compensation value of the gluing mechanism according to the second offset data; a module for correcting the posture of the gluing mechanism according to the second posture compensation value; The gluing control device also includes: A module for determining a cumulative posture compensation value of the target gluing device corresponding to each deviation correction process according to the first posture compensation value and the second posture compensation value; A module for generating and displaying a chart reflecting the changing trend of the cumulative posture compensation value of the target gluing equipment corresponding to each correction processing process.

6. An electronic device, characterized in that: The method comprises a processor and a memory, wherein the memory is used to store a computer program, and the processor is used to execute the method according to any one of claims 1 to 4 under the control of the computer program.

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