Wire drawing equipment for bonding wire production

Abstract

The invention provides wire drawing equipment for bonding wire production, and relates to the technical field of bonding wire production, and the equipment comprises a wire drawing device, a processor and a memory in which a computer program is stored; the wire drawing device comprises a plurality of wire drawing dies and tension sensors corresponding to the wire drawing dies; when a computer program is executed by a processor, a tension value collected by a tension sensor in real time in the bonding wire drawing process is obtained, and when the tension value is smaller than the minimum tension value or larger than the maximum tension value, a wire drawing die corresponding to a bonding wire corresponding to the tension value is drawn into a wire drawing die corresponding to the bonding wire corresponding to the tension value. Marking the drawn bonding wire section between a first time point corresponding to the tension value and a second time point corresponding to the tension value as a first abnormal bonding wire section, and sending first early warning information; manual intervention is reduced, the first abnormal bonding wire section can be quickly and efficiently determined, the first early warning information is sent, and the efficiency and accuracy of abnormal bonding wire section recognition are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of bonding wire production, and particularly to a wire drawing device for bonding wire production. Background Art

[0002] During the process of drawing bonding wire, it is necessary to ensure that the diameter and material distribution of the bonding wire are uniform to avoid unstable performance of the bonding wire. In the prior art, usually after the wire drawing device finishes wire drawing, several bonding wire sample segments are randomly selected from the bonding wires produced by the wire drawing device; each bonding wire sample segment is weighed and the mass of the bonding wire sample segment per unit length is calculated; based on the mass of the bonding wire sample segment per unit length, it is judged whether the bonding wire sample segment is abnormal, and further, whether the bonding wire is abnormal. The abnormality of the bonding wire sample segment or the bonding wire indicates abnormal situations such as uneven diameter or uneven material distribution of the bonding wire sample segment or the bonding wire.

[0003] However, the above method also has the following technical problems: If the selection of the bonding wire sample segments is not random enough or the quantity is insufficient, it is difficult to ensure that the test results have sufficient representativeness and cannot accurately reflect whether the bonding wire is abnormal. In addition, the above method relies on manual operations to complete steps such as sampling, weighing, and calculating the mass per unit length, with low efficiency and being greatly affected by human factors, which will affect the accuracy of judging whether the bonding wire sample segment is abnormal, and further, will affect the accuracy of judging whether the bonding wire is abnormal. Summary of the Invention

[0004] In view of the above technical problems, the technical solution adopted by the present invention is as follows: A wire drawing device for bonding wire production, the device comprising: a wire drawing device, a processor, and a memory storing a computer program; the wire drawing device includes a plurality of wire drawing dies and a tension sensor corresponding to each wire drawing die, and the tension sensor is used to detect the actual tension of the bonding wire segment drawn by the corresponding wire drawing die and located within its detection area; when the computer program is executed by the processor, the following steps are implemented: S10. For the bonding wire currently drawn by each wire drawing die, obtain the tension value Z collected in real time by the tension sensor corresponding to the bonding wire during the process of the corresponding wire drawing die drawing the bonding wire.

[0005] S20. When Z < X or Z > D, mark the bonding wire segment drawn by the wire drawing die corresponding to Z between the first time point Z1 corresponding to Z and the second time point Z2 corresponding to Z as the first abnormal bonding wire segment Z 0 , and send the first warning message corresponding to Z 0 ; X is the minimum tension value, D is the maximum tension value; Z1 = Z3 - t 0 ; Z2 = Z3 + t0 ; Z3 is the time point when Z is collected, t 0 is a preset time difference.

[0006] Before S20, the following steps are further included: S01. Obtain the performance label and the historical tension value list corresponding to each historical bonding wire segment; the historical tension value list includes several tension values corresponding to the historical bonding wire segment; the historical bonding wire segment is randomly selected from the bonding wires produced by the device in the historical time period and belonging to the same type but different batches as the currently drawn bonding wire; the length of the historical bonding wire segment is greater than the length of the detection area of the tension sensor.

[0007] S02. Take the maximum value in the historical tension value list corresponding to the historical bonding wire segment corresponding to any performance label that is the first label as D, and the minimum value as X; the first label indicates that all performance items of the bonding wire segment meet the standards.

[0008] The present invention has at least the following beneficial effects: The present invention provides a wire drawing device for bonding wire production, the device comprising: a wire drawing device, a processor, and a memory storing a computer program; the wire drawing device includes a plurality of wire drawing dies and a tension sensor corresponding to each wire drawing die; when the computer program is executed by the processor, a tension value collected in real time by the tension sensor corresponding to the bonding wire during the process of drawing the bonding wire by the wire drawing die corresponding to the bonding wire is obtained, and if the tension value is less than the minimum tension value or greater than the maximum tension value, the wire segment of the bonding wire drawn by the wire drawing die corresponding to the bonding wire corresponding to the tension value between the first time point corresponding to the tension value and the second time point corresponding to the tension value is marked as a first abnormal wire segment, and a first warning message corresponding to the first abnormal wire segment is sent; wherein, the maximum value in the historical tension value list corresponding to the historical wire segment corresponding to the performance label that is the first label is used as the maximum tension value, and the minimum value is used as the minimum tension value; the first label indicates that all performances of the wire segment of the bonding wire meet the standards. It can be seen that the present invention detects the bonding wire through the tension value collected in real time by the tension sensor during the wire drawing process of the bonding wire, determines the maximum tension value and the minimum tension value based on a plurality of tension values corresponding to the historical wire segments whose performances all meet the standards; when the tension value collected in real time is less than the minimum tension value or greater than the maximum tension value, it indicates that an abnormality occurs during the wire drawing process of the bonding wire, and the wire segment of the bonding wire drawn by the wire drawing die corresponding to the bonding wire corresponding to the tension value collected in real time between the first time point corresponding to the tension value collected in real time and the second time point corresponding to the tension value collected in real time is marked as a first abnormal wire segment, and a first warning message corresponding to the first abnormal wire segment is sent; reducing manual intervention, being able to quickly and efficiently determine the first abnormal wire segment and send the first warning message corresponding to the first abnormal wire segment, improving the efficiency and accuracy of identifying abnormal wire segments. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0010] Figure 1 It is a flowchart when the computer program of a wire drawing device for bonding wire production provided by an embodiment of the present invention is executed by a processor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0011] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0012] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned accompanying drawings are used to distinguish similar tasks, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or server comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0013] An embodiment of the present invention provides a wire drawing device for producing bonding wires. The device includes: a wire drawing device, a processor, and a memory storing a computer program; the wire drawing device includes a plurality of wire drawing dies and a tension sensor corresponding to each wire drawing die; when the computer program is executed by the processor, the following steps are implemented, as Figure 1 shown: S10. For each bonding wire currently drawn by a wire drawing die, obtain the tension value Z collected in real time by the tension sensor corresponding to the bonding wire during the process of the wire drawing die corresponding to the bonding wire drawing the bonding wire.

[0014] Specifically, the tension sensor is used to detect the actual tension of the bonding wire segment drawn by the corresponding wire drawing die and located within its detection area.

[0015] Furthermore, the tension value is used to represent the actual tension of the bonding wire segment drawn from the wire drawing die and passing through the detection area of the tension sensor.

[0016] Specifically, the tension sensor corresponding to the bonding wire is the tension sensor corresponding to the wire drawing die that draws the bonding wire.

[0017] Specifically, the device further includes: a melting and casting device and a wire winding device; the wire winding device includes a wire winding wheel corresponding to each wire drawing die.

[0018] Specifically, the melting and casting device is used to heat the raw material for making the bonding wire to a molten state.

[0019] Specifically, the wire drawing device is used to draw the raw material in a molten state into bonding wires.

[0020] Specifically, the wire winding device is used to wind the drawn bonding wires onto a wire winding wheel for subsequent storage or transportation.

[0021] Specifically, all the wire drawing dies in the wire drawing device are of the same type of wire drawing die, having the same structure and specifications.

[0022] Specifically, all the tension sensors corresponding to the wire drawing dies in the wire drawing device are of the same type of tension sensor, and the sampling frequencies of all the tension sensors are kept consistent.

[0023] Specifically, all the wire winding wheels corresponding to the wire drawing dies in the wire drawing device are of the same type of wire winding wheel, having the same structure and specifications.

[0024] In a specific embodiment, the wire drawing device further includes a guide roller corresponding to each wire drawing die, and the guide roller is used to introduce the bonding wire drawn by its corresponding wire drawing die into the wire winding device.

[0025] In a specific embodiment, the tension sensor corresponding to the wire drawing die is arranged between the wire drawing die and the guide roller corresponding to the wire drawing die.

[0026] In a specific embodiment, the tension sensor corresponding to the wire drawing die is arranged on the guide roller corresponding to the wire drawing die.

[0027] S20. When Z < X or Z > D, mark the bonding wire segment drawn by the wire drawing die corresponding to the bonding wire of Z between the first time point Z1 corresponding to Z and the second time point Z2 corresponding to Z as the first abnormal bonding wire segment Z 0 , and send the first warning message corresponding to Z 0 ; X is the minimum tension value, D is the maximum tension value; Z1 = Z3 - t 0 ; Z2 = Z3 + t 0 ; Z3 is the time point when Z is collected, and t 0 is the preset time difference.

[0028] Specifically, the preset time difference is not less than the time interval between two adjacent samplings of the tension sensor.

[0029] Specifically, the first warning message is used to prompt the user that during the process of the wire drawing die corresponding to the first abnormal bonding wire segment drawing the first abnormal bonding wire segment, the tension value of the bonding wire segment between the wire drawing die and the wire winding wheel corresponding to the wire drawing die exceeds the range between the minimum tension value and the maximum tension value.

[0030] Specifically, when the raw material for drawing bonding wires in a molten state becomes soft, has a thinner diameter, is well lubricated, or the wire drawing die is worn, the resistance at the wire drawing outlet of the wire drawing die becomes smaller, which in turn causes the tension of the bonding wire segment between the wire drawing die and the take-up reel corresponding to the wire drawing die to become smaller. Further, it will cause abnormal conditions such as uneven material mixing or uneven thickness in the bonding wire drawn by the wire drawing die. When the raw material for drawing bonding wires in a molten state becomes hard, has a thicker diameter, has uneven material mixing, the wire drawing outlet of the wire drawing die becomes blocked, or the friction increases, the resistance at the wire drawing outlet of the wire drawing die becomes larger. At this time, a greater traction force needs to be applied to maintain a constant wire drawing speed, which in turn causes the tension of the bonding wire segment between the wire drawing die and the take-up reel corresponding to the wire drawing die to become larger. Further, it will also cause abnormal conditions such as uneven material mixing or uneven thickness in the bonding wire drawn by the wire drawing die. Therefore, abnormal fluctuations in tension can be used to determine whether there are abnormal conditions such as uneven material mixing or uneven thickness in the drawn bonding wire segment.

[0031] Specifically, when X ≤ Z ≤ D, it is determined that the bonding wire segment drawn by the wire drawing die corresponding to Z between Z1 and Z2 is a normal bonding wire segment.

[0032] In a specific embodiment, the specific position of the bonding wire segment drawn by the wire drawing die within a certain period of time in the entire bonding wire can be determined according to the sampling frequency of the tension sensor, the time point when the tension sensor collects the tension value, the time point when the wire drawing die corresponding to the tension sensor starts to draw the bonding wire, and the linear speed of the take-up reel corresponding to the wire drawing die, so as to obtain the bonding wire segment drawn by the wire drawing die within a certain period of time. The linear speed of the take-up reel can be understood as the speed at which the bonding wire is wound onto the take-up reel.

[0033] Specifically, the rotation speed of the take-up reel can be automatically adjusted according to preset parameters to ensure that the linear speed of the take-up reel remains stable, so as to keep the tension of the bonding wire uniform during the entire drawing process. If the linear speed is unstable, it will cause different segments of the bonding wire to be stretched to different degrees, thereby causing tension fluctuations. Therefore, maintaining a stable linear speed helps to keep the tension of the bonding wire uniform during the entire drawing process. If the linear speed changes, the traction force received at the wire drawing outlet of the wire drawing die corresponding to the take-up reel will also change accordingly, and the diameter and material distribution of the bonding wire drawn by the wire drawing die will also change accordingly. For example, if the linear speed suddenly increases and the amount of material provided by the wire drawing die does not increase correspondingly, the bonding wire will become tense, resulting in an increase in the traction force received at the wire drawing outlet of the wire drawing die, which may over-stretch the wire material and cause the diameter of the bonding wire to become smaller, and local hardening of the bonding wire, resulting in uneven material distribution; vice versa.

[0034] Specifically, before S20, the following steps are further included: S01. Obtain the performance label and the list of historical tension values corresponding to each historical bonding wire segment; the list of historical tension values includes several tension values corresponding to the historical bonding wire segment; the historical bonding wire segment is randomly selected from the bonding wires produced by the device during the historical time period and belonging to the same type but different batches as the currently drawn bonding wire; the length of the historical bonding wire segment is greater than the length of the detection area of the tension sensor.

[0035] Specifically, the list of historical tension values includes at least 2 tension values.

[0036] Specifically, the tension sensor corresponding to the historical bonding wire segment is the tension sensor corresponding to the wire drawing die that draws the historical bonding wire segment.

[0037] Specifically, there are several historical bonding wire segments, and the number of historical bonding wire segments is a preset number, which can be set by those skilled in the art according to actual needs and will not be elaborated here.

[0038] Specifically, the historical time period is the time period before the current time point, and both the start time point and the end time point of the historical time period are preset time points, which can be set by those skilled in the art according to actual needs and will not be elaborated here.

[0039] Specifically, the tension value corresponding to the historical bonding wire segment is the tension value collected by the tension sensor corresponding to the historical bonding wire segment during the wire drawing time period corresponding to the historical bonding wire segment; the start time point of the wire drawing time period corresponding to the historical bonding wire segment is the time point when the wire drawing die corresponding to the historical bonding wire segment draws the starting point of the historical bonding wire segment; the end time point of the wire drawing time period corresponding to the historical bonding wire segment is the time point when the wire drawing die corresponding to the historical bonding wire segment draws the end point of the historical bonding wire segment.

[0040] S02. Take the maximum value in the list of historical tension values corresponding to the historical bonding wire segment corresponding to any performance label that is the first label as D, and the minimum value as X; the first label indicates that all performances of the bonding wire segment meet the standards.

[0041] Specifically, the performance label further includes a second label; the second label indicates that at least one of all performances of the bonding wire segment does not meet the standards.

[0042] Through the above steps, performance labels corresponding to historical bonding wire segments and a list of historical tension values corresponding to the historical bonding wire segments are obtained. When the performance label corresponding to a historical bonding wire segment is the first label, it indicates that all performance items of the historical bonding wire segment meet the standards. During the drawing process of the historical bonding wire segment, the tension values collected by the tension sensor corresponding to the historical bonding wire segment are all within a reasonable range. Therefore, the maximum value in the list of historical tension values corresponding to the historical bonding wire segment with any performance label being the first label is used as the maximum tension value, and the minimum value is used as the minimum tension value. The maximum tension value and the minimum tension value are used as conditions for determining whether there are abnormal fluctuations in the tension values collected in real time by the tension sensor corresponding to the bonding wire during the drawing of the bonding wire by the wire drawing die corresponding to the bonding wire, which is beneficial to improving the accuracy of determining whether there are abnormal fluctuations in the tension values collected in real time. Further, when the tension value collected in real time is less than the minimum tension value or greater than the maximum tension value, it indicates that the tension value is not within a reasonable range and there are abnormal fluctuations. Further, it indicates that there are abnormalities during the drawing of the bonding wire. The wire drawing die corresponding to the bonding wire with the tension value collected in real time is marked as the first abnormal bonding wire segment for the bonding wire segments drawn between the first time point corresponding to the tension value collected in real time and the second time point corresponding to the tension value collected in real time, and the first warning information corresponding to the first abnormal bonding wire segment is sent; this reduces manual intervention and can quickly and efficiently determine the first abnormal bonding wire segment and send the first warning information corresponding to the first abnormal bonding wire segment, improving the efficiency and accuracy of identifying abnormal bonding wire segments.

[0043] In a specific embodiment, after step S01, the following steps are further included: S011. If the performance label corresponding to the historical bonding wire segment is the first label, then the historical bonding wire segment is used as a normal bonding wire segment.

[0044] S012. The maximum value in the list of historical tension values corresponding to each normal bonding wire segment is used as the first tentative tension value to obtain a list of first tentative tension values, and the list of first tentative tension values includes several first tentative tension values.

[0045] S013. The minimum value in the list of historical tension values corresponding to each normal bonding wire segment is used as the second tentative tension value to obtain a list of second tentative tension values, and the list of second tentative tension values includes several second tentative tension values.

[0046] S014. The largest first tentative tension value in the list of first tentative tension values is used as D, and the smallest second tentative tension value in the list of second tentative tension values is used as X.

[0047] Through the above steps, the maximum and minimum tension values are obtained based on the maximum and minimum values in the historical tension value list corresponding to each normal bonding wire segment, comprehensively considering the overall performance of all normal bonding wire segments, which is beneficial to improving the accuracy of the determined maximum and minimum tension values.

[0048] Specifically, after step S10, the following steps are further included: S11. For each bonding wire drawn by the current wire drawing die, obtain the tension value list A = {A1, A2,..., A i ,..., A m}, where A i is the i-th tension value collected in real time by the tension sensor corresponding to the bonding wire during the process of the wire drawing die corresponding to the bonding wire drawing the bonding wire, 1 ≤ i ≤ m, and m is the number of tension values collected in real time by the tension sensor corresponding to the bonding wire during the process of the wire drawing die corresponding to the bonding wire drawing the bonding wire; among them, the time point of collecting A i is earlier than the time point of collecting A i+1 , and A i+1 is the (i + 1)-th tension value collected in real time by the tension sensor corresponding to the bonding wire during the process of the wire drawing die corresponding to the bonding wire drawing the bonding wire.

[0049] S12. If the variance of A i , A i+1 ,..., A i+j is greater than the preset variance, then mark the bonding wire segment drawn by the wire drawing die corresponding to the bonding wire of A during the target time period corresponding to A i , A i+1 ,..., A i+j as the second abnormal bonding wire segment, and send the second warning information corresponding to the second abnormal bonding wire segment; the start time point of the target time period corresponding to A i , A i+1 ,..., A i+j is the time point of collecting A i ; the end time point of the target time period corresponding to A i , A i+1 ,..., A i+j is the time point of collecting A i+j ; j is the preset quantity threshold; A i+j is the (i + j)-th tension value collected in real time by the tension sensor corresponding to the bonding wire of A during the process of the wire drawing die corresponding to the bonding wire drawing the bonding wire; the preset variance is a variance set in advance, which can be set by those skilled in the art according to actual needs and will not be elaborated here.

[0050] In a specific embodiment, if there is an overlapping part between two second abnormal bonding wire segments, the two second abnormal bonding wire segments are combined into one second abnormal bonding wire segment, and a second warning message corresponding to the second abnormal bonding wire segment is sent.

[0051] Specifically, the second warning message is used to prompt the user that during the process of drawing the second abnormal bonding wire segment by the wire drawing die corresponding to the second abnormal bonding wire segment, there are large fluctuations in the tension value of the bonding wire segment between the wire drawing die and the take-up reel corresponding to the wire drawing die.

[0052] Through the above steps, if the variance of a continuous number of tension values is greater than a preset variance, it indicates that the fluctuations of the several tension values are large. During the time period when the continuous number of tension values is collected, that is, within the target time period corresponding to the several tension values, there is an abnormality in the tension fluctuation of the bonding wire segment between the wire drawing die corresponding to the list of tension values where the several tension values are located and the take-up reel corresponding to the wire drawing die. Therefore, within the time period when the continuous number of tension values is collected, the bonding wire segment drawn by the wire drawing die corresponding to the list of tension values where the several tension values are located is also abnormal. Thus, when the variance of j continuous tension values is greater than the preset variance, the bonding wire segment drawn by the wire drawing die corresponding to the list of tension values where the j tension values are located within the target time period corresponding to the j tension values is marked as a second abnormal bonding wire segment, and a second warning message corresponding to the second abnormal bonding wire segment is sent; this reduces manual intervention and can quickly and efficiently determine the second abnormal bonding wire segment and send the second warning message corresponding to the second abnormal bonding wire segment, improving the efficiency and accuracy of identifying abnormal bonding wire segments.

[0053] In a specific embodiment, when the computer program is executed by a processor, the following steps are also implemented: S100. At every preset fixed time interval, obtain the set of specified tension value lists R={R1, R2, ……, R e , ……, R f} corresponding to the current time point, where R e is the specified tension value list corresponding to the bonding wire drawn by the e-th wire drawing die in the device at the current time point, 1≤e≤f, and f is the number of wire drawing dies in the device. The specified tension value list includes all the tension values collected by the tension sensor corresponding to the wire drawing die corresponding to the specified tension value list within the specified time period corresponding to the current time point; the end time point of the specified time period corresponding to the current time point is the current time point, and the duration of the specified time period is a preset specified duration; the preset specified duration is not less than the preset fixed duration.

[0054] Specifically, in the specified list of tension values, all the tension values in the specified list of tension values are sorted in the order from the earliest to the latest time point when they are collected.

[0055] Specifically, the number of tension values in different specified lists of tension values is the same.

[0056] Specifically, the preset specified duration and the preset fixed duration are preset durations, which can be set by those skilled in the art according to actual needs. For example: the preset fixed duration is 2 minutes, and the preset specified duration is 3 minutes, which will not be elaborated here.

[0057] S200. Vectorize R e to obtain the corresponding tension value vector K of R e e

[0058] S300. Obtain the average vector K of K1, K2, ……, K e , ……, K f 0

[0059] Specifically, ∑ f e=1 K eα / f = K 0 α ; K eα is the α-th vector value in K e , 1 ≤ α ≤ β, where β is the number of vector values in the tension value vector; K 0 α is the α-th vector value in K 0

[0060] S400. If the distance between K e and K 0 is greater than the preset vector distance, then mark the specified bonding wire segment corresponding to K e as the third abnormal bonding wire segment, and send the third warning information corresponding to the third abnormal bonding wire segment. The specified bonding wire segment corresponding to K e is the bonding wire segment drawn by the e-th wire drawing die during the specified time period corresponding to the current time point.

[0061] Specifically, the third warning information is used to prompt the user that during the process of drawing the third abnormal bonding wire segment by the wire drawing die corresponding to the third abnormal bonding wire segment, the tension value of the bonding wire segment between the wire drawing die and the take-up reel corresponding to the wire drawing die is abnormal.

[0062] Through the above steps, at every preset fixed time interval, obtain the list of specified tension values corresponding to the bonding wires drawn by each wire drawing die, perform vectorization processing on each list of specified tension values to obtain the tension value vector corresponding to each list of specified tension values, obtain the average vector of all tension value vectors. If the distance between a certain tension value vector and the average vector is greater than the preset vector distance, it indicates that the difference between the tension value vector and the average vector is relatively large, and there is an abnormality in the tension values in the list of specified tension values corresponding to the tension value vector. Further, it indicates that there is an abnormality in the bonding wire segment drawn by the wire drawing die corresponding to the list of specified tension values at the specified time period corresponding to the current time point. Therefore, if the distance between a certain tension value vector and the average vector is greater than the preset vector distance, mark the bonding wire segment drawn by the wire drawing die corresponding to the list of specified tension values corresponding to the tension value vector at the specified time period corresponding to the current time point as the third abnormal bonding wire segment, and send the third warning information corresponding to the third abnormal bonding wire segment, reducing manual intervention, being able to quickly and efficiently determine the third abnormal bonding wire segment and send the third warning information corresponding to the third abnormal bonding wire segment, improving the efficiency and accuracy of identifying abnormal bonding wire segments.

[0063] In a specific embodiment, after step S200, the following steps are further included: S210. Obtain the vector similarity list U = {U1, U2, ……, U g , ……, U h} corresponding to R, where U g is the g-th vector similarity corresponding to R, 1 ≤ g ≤ h, h is the number of vector similarities corresponding to R, and the vector similarity corresponding to R is the vector similarity between the tension value vectors corresponding to any two specified tension value lists in R.

[0064] Specifically, the greater the vector similarity, the more similar the two corresponding tension value vectors are.

[0065] In a specific embodiment, the cosine similarity between the tension value vectors is used as the vector similarity between the tension value vectors.

[0066] In a specific embodiment, the vector distance between the tension value vectors is converted into the vector similarity between the tension value vectors, so that the greater the vector similarity, the more similar the two corresponding tension value vectors are.

[0067] S220. If U g <U 0 , then use the two specified tension value lists corresponding to U g as the two first candidate tension value lists corresponding to U g , where U 0 is the preset similarity threshold; if U g≥U 0 , then determine U g There is no corresponding first candidate tension value list.

[0068] S230. Take U1, U2, ……, U g , ……, U h Perform deduplication on all the corresponding first candidate tension value lists to obtain the second candidate tension value list set V = {V1, V2, ……, V x , ……, V p} corresponding to U. V x is the x-th second candidate tension value list corresponding to U, where 1 ≤ x ≤ p and p is the number of second candidate tension value lists corresponding to U.

[0069] S240. If V x is the same as any one of the two first candidate tension value lists corresponding to U g , then take U g as the target similarity corresponding to V x .

[0070] S250. If the number of target similarities corresponding to V x is greater than the preset similarity number threshold, then mark the bonding wire segments drawn by the drawing die corresponding to V x during the specified time period at the current time point as the third abnormal bonding wire segments, and send the third warning information corresponding to the third abnormal bonding wire segments.

[0071] Specifically, the drawing die corresponding to V x is the drawing die corresponding to the specified tension value list corresponding to V x .

[0072] Through the above steps, a list of vector similarities corresponding to a specified set of tension values is obtained; when the vector similarity is less than a preset similarity, it indicates that the two specified tension value lists corresponding to the vector similarity are not similar, and the two specified tension value lists are used as the first candidate tension value lists corresponding to the vector similarity; the first candidate tension value lists corresponding to all vector similarities are de-duplicated to obtain several second candidate tension value lists; when any one of the first candidate tension value lists in the two first candidate tension value lists corresponding to the vector similarity is the same as the second candidate tension value list, the vector similarity is used as the target similarity corresponding to the second candidate tension value list. The more the number of target similarities corresponding to the second candidate tension value list, the more the number of specified tension value lists that are not similar to the second candidate tension value list, and the greater the probability that the tension values in the second candidate tension value list are abnormal. Further, it indicates that the probability that the bonding wire segments drawn by the wire drawing die corresponding to the second candidate tension value list during the specified time period corresponding to the current time point are abnormal is greater; therefore, if the number of target similarities corresponding to a certain second candidate tension value list is greater than a preset similarity number threshold, the bonding wire segments drawn by the wire drawing die corresponding to the second candidate tension value list during the specified time period corresponding to the current time point are marked as the third abnormal bonding wire segments, and the third warning information corresponding to the third abnormal bonding wire segments is sent, reducing manual intervention, and being able to quickly and efficiently determine the third abnormal bonding wire segments and send the third warning information corresponding to the third abnormal bonding wire segments, improving the efficiency and accuracy of abnormal bonding wire segment identification.

[0073] In a specific embodiment, when the computer program is executed by a processor, the following steps are further implemented: S1. For each bonding wire currently drawn by a wire drawing die, obtain a key tension value list B corresponding to the rotation speed change time point C of the take-up reel corresponding to the bonding wire; B includes all the tension values collected by the tension sensor Q corresponding to the take-up reel during the key time period E corresponding to C; the start time point E1 of E is initially the preset time point T corresponding to C; T = C - t1, where t1 is the first preset duration.

[0074] Specifically, the take-up reel corresponding to the bonding wire is the take-up reel corresponding to the wire drawing die that draws the bonding wire.

[0075] Specifically, the rotation speed change time point of the take-up reel can be understood as the time point when the rotation speed of the take-up reel changes.

[0076] Specifically, the tension sensor corresponding to the take-up reel is the tension sensor corresponding to the wire drawing die corresponding to the take-up reel.

[0077] Optionally, the duration of the key time period is the first preset duration.

[0078] Specifically, the first preset duration is a preset duration, which can be set by those skilled in the art according to actual needs. For example: 5 seconds, 10 seconds, 20 seconds, and will not be elaborated here.

[0079] S2. If the variance of all the tension values in B is greater than the preset variance, then let E1 = E1 + t2 to update E and enter S1; otherwise, obtain the target time period F corresponding to C; the start time point of F is T, and the end time point of F is E1; t2 is the second preset duration; t2 < t1.

[0080] Specifically, the second preset duration is a preset duration, which can be set by those skilled in the art according to actual needs. For example: 1 second, 2 seconds, 3 seconds, and will not be elaborated here.

[0081] S3. If the duration of F is not within the preset duration range, then based on all the tension values collected by Q within F, construct the tension change curve G corresponding to the bonding wire segment H drawn by the wire drawing die corresponding to Q within F.

[0082] Specifically, the preset duration range is a pre-set duration range, which can be set by those skilled in the art according to actual needs, and will not be elaborated here.

[0083] Specifically, the duration of F not being within the preset duration range can be understood as: the duration of F is less than the minimum duration within the preset duration range, or the duration of F is greater than the maximum duration within the preset duration range.

[0084] Optionally, the tension change curve is used to reflect the change trend of the tension with the sampling order. The ordinate of the tension change curve represents the tension value, and the abscissa represents the order of the tension values arranged in the order of collection time within the target time period.

[0085] S4. If among the tension change curves corresponding to several abnormal bonding wire segments corresponding to C, there is a tension change curve whose curve similarity with G is not less than the preset similarity, then determine H as the bonding wire segment with abnormal production and send the abnormal production information corresponding to H.

[0086] Specifically, the greater the curve similarity, the more similar the corresponding two tension change curves; in the prior art, any method for obtaining the curve similarity that characterizes "the higher the curve similarity, the more similar the corresponding two curves" belongs to the protection scope of the present invention and will not be elaborated here.

[0087] Specifically, the abnormal production information is used to prompt the user that a tension abnormality is detected during the drawing process of the bonding wire segment corresponding to the abnormal production information.

[0088] Specifically, in step S4, it further includes: if there is no tension change curve in the tension change curves corresponding to several abnormal bonding wire segments corresponding to C, whose curve similarity with G is not less than the preset similarity, then it is determined that H is a bonding wire segment with normal production.

[0089] In this embodiment, when the rotation speed of the take-up reel changes, the bonding wire drawn by the wire drawing die corresponding to the take-up reel may be affected by the change in the rotation speed of the take-up reel, and thus vibrate or shake, thereby applying an additional dynamic disturbance to the bonding wire, and further causing the tension value to fluctuate; through the above steps, a list of key tension values corresponding to the time points of the rotation speed change of the take-up reel corresponding to the bonding wire is obtained. The list of key tension values includes all the tension values collected by the tension sensor corresponding to the take-up reel during the key time period corresponding to the rotation speed change time point. If the variance of all the tension values in the list of key tension values is greater than the preset variance, it indicates that the fluctuation of the tension values collected during the key time period is large. At this time, the start time point of the key time period is updated so as to update the key time period, and the key tension values are obtained again; otherwise, it indicates that the fluctuation of the tension values collected during the key time period is small and has tended to be stable. At this time, the target time period corresponding to the rotation speed change time point is obtained. If the duration of the target time period is not within the preset duration range, it indicates that the duration consumed for the tension value to tend to be stable is too long or too short, and the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period may be abnormal; at this time, based on all the tension values collected by the tension sensor during the target time period, a tension change curve corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period is constructed; if there is a tension change curve in the tension change curves corresponding to several abnormal bonding wire segments corresponding to the rotation speed change time point, whose curve similarity with the tension change curve corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period is not less than the preset similarity, it indicates that the tension change curve corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period is very similar to the tension change curve corresponding to a certain abnormal bonding wire segment.

[0090] Further, it is explained that the bonding wire segments drawn by the wire drawing die corresponding to the take-up reel during the target time period are bonding wire segments with abnormal production. Therefore, if among the tension change curves corresponding to a plurality of abnormal bonding wire segments corresponding to the rotation speed change time point, there is a tension change curve whose curve similarity with the tension change curve corresponding to the bonding wire segments drawn by the wire drawing die corresponding to the take-up reel during the target time period is not less than the preset similarity, then the bonding wire segments drawn by the wire drawing die corresponding to the take-up reel during the target time period are marked as bonding wire segments with abnormal production, and the abnormal production information corresponding to the bonding wire segments drawn by the wire drawing die corresponding to the take-up reel during the target time period is sent. This reduces manual intervention and can quickly and efficiently determine the bonding wire segments with abnormal production and send the abnormal production information corresponding to the bonding wire segments with abnormal production, improving the efficiency and accuracy of identifying abnormal bonding wire segments.

[0091] Specifically, before step S4, the following steps are further included: obtaining the tension change curve corresponding to the abnormal bonding wire segments of C S001. Obtain the historical rotation speed change time point L of C. L is the time point when the rotation speed of the take-up reel changes from C1 to C2 during the process of the wire drawing die corresponding to the take-up reel drawing bonding wires of the same type but different batches as the currently drawn bonding wires during the historical time period; C1 is the rotation speed of the take-up reel before C, and C2 is the rotation speed of the take-up reel after C.

[0092] S002. Obtain the list P of key tension values corresponding to L. P includes all the starting time points W1 of the tension values W collected by Q during the key time period W corresponding to L. The starting time point W1 of W is initially the preset time point L corresponding to L 0 ; L 0 = L - t1.

[0093] S003. If the variance of all the tension values in P is greater than the preset variance, then let W1 = W1 + t2 to update W and enter step S002; otherwise, obtain the target time period L1 corresponding to L. The starting time point of L1 is L 0 , and the ending time point of L1 is W1.

[0094] S004. If the duration of L1 is not within the preset duration range, then obtain the performance label corresponding to the bonding wire segments drawn by the wire drawing die corresponding to Q within L1.

[0095] Specifically, the duration of L1 not being within the preset duration range can be understood as: the duration of L1 is less than the minimum duration within the preset duration range, or the duration of L1 is greater than the maximum duration within the preset duration range.

[0096] S005. If the performance label is the second label, the bonding wire segment corresponding to the performance label is used as the abnormal bonding wire segment corresponding to C, and a tension change curve corresponding to the abnormal bonding wire segment is constructed based on all the tension values collected by Q within L1.

[0097] Through the above steps, the historical rotation speed change time points corresponding to the rotation speed change time points of the take-up reel are obtained. Based on the list of key tension values corresponding to the historical rotation speed change time points, the target time period corresponding to the historical rotation speed change time points is obtained. If the target time period is not within the preset time range, the performance label corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel is obtained. If the performance label is the second label, indicating that at least one of the various performances of the corresponding bonding wire segment does not meet the standard, it is determined that the bonding wire segment is the abnormal bonding wire segment corresponding to the rotation speed change time point of the take-up reel, and a tension change curve corresponding to the abnormal bonding wire segment is constructed based on all the tension values collected by the tension sensor within the target time period, which is beneficial to improving the accuracy of obtaining the abnormal bonding wire segment and the tension change curve corresponding to the abnormal bonding wire segment. Further, if among the tension change curves corresponding to several abnormal bonding wire segments corresponding to the rotation speed change time point, there is a tension change curve whose curve similarity with the tension change curve corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel within the target time period is not less than the preset similarity, the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel within the target time period is marked as the bonding wire segment with abnormal production, and the abnormal production information corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel within the target time period is sent, reducing manual intervention and being able to quickly and efficiently determine the bonding wire segment with abnormal production and send the abnormal production information corresponding to the bonding wire segment with abnormal production, improving the efficiency and accuracy of abnormal bonding wire segment identification.

[0098] In the prior art, a laser diameter gauge and an X-ray fluorescence spectrometer are usually integrated in the bonding wire production equipment to monitor in real time whether there is an abnormality in the bonding wire. An abnormality in the bonding wire means that there are abnormal situations such as uneven diameter or uneven material distribution in the bonding wire. However, the cost of the laser diameter gauge and the X-ray fluorescence spectrometer is relatively high, and if there are strong vibrations or other interference factors in the working environment, for example, when the rotation speed of the take-up reel in the bonding wire production equipment changes, the bonding wire drawn by the wire drawing die corresponding to the take-up reel may be affected by the change in the rotation speed of the take-up reel, and then when it vibrates or shakes, it may affect the measurement accuracy, thereby reducing the accuracy of judging whether there is an abnormality in the bonding wire.

[0099] Through the above steps, a list of key tension values corresponding to the rotation speed change time points of the take-up reel for the bonding wire is obtained. The list of key tension values includes all the tension values collected by the tension sensor corresponding to the take-up reel during the key time period corresponding to the rotation speed change time point. If the variance of all the tension values in the list of key tension values is greater than the preset variance, the start time point of the key time period is updated so as to update the key time period, and the key tension value is obtained again; otherwise, the target time period corresponding to the rotation speed change time point is obtained. If the duration of the target time period is not within the preset duration range, based on all the tension values collected by the tension sensor during the target time period, a tension change curve corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period is constructed; if among the tension change curves corresponding to several abnormal bonding wire segments corresponding to the rotation speed change time point, there is a tension change curve whose curve similarity with the tension change curve corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period is not less than the preset similarity, the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period is marked as an abnormally produced bonding wire segment, and the abnormal production information corresponding to the bonding wire segment drawn by the wire drawing die corresponding to the take-up reel during the target time period is sent; by performing abnormal detection through the tension values collected by the tension sensor, the influence of interference factors such as vibration in the working environment can be effectively excluded, the cost is relatively low, and it is beneficial to improve the accuracy of judging whether there is an abnormality in the bonding wire segment.

[0100] In a specific embodiment, after the device produces the bonding wire, the bonding wire segments marked as the first abnormal bonding wire segment, the second abnormal bonding wire segment, the third abnormal bonding wire segment, or the abnormally produced bonding wire segment can be detected again to determine whether there are really abnormalities such as uneven diameter or uneven material distribution in the bonding wire segment.

[0101] In a specific embodiment, after the device produces the bonding wire, several bonding wire segments that are not marked as the first abnormal bonding wire segment can be randomly selected from the bonding wire as several first samples, and the bonding wire segments marked as the first abnormal bonding wire segment, the second abnormal bonding wire segment, the third abnormal bonding wire segment, or the abnormally produced bonding wire segment are used as the second samples. The first samples and the second samples are detected again to determine whether there are abnormalities such as uneven diameter or uneven material distribution in the entire bonding wire corresponding to the first samples and the second samples.

[0102] The present invention provides a wire drawing device for bonding wire production, and the device includes: a wire drawing device, a processor, and a memory storing a computer program; the wire drawing device includes a plurality of wire drawing dies and a tension sensor corresponding to each wire drawing die; when the computer program is executed by the processor, a tension value collected in real time by the tension sensor corresponding to the bonding wire during the process of drawing the bonding wire by the wire drawing die corresponding to the bonding wire is obtained. If the tension value is less than the minimum tension value or greater than the maximum tension value, the bonding wire segment drawn by the wire drawing die corresponding to the bonding wire corresponding to the tension value between the first time point corresponding to the tension value and the second time point corresponding to the tension value is marked as a first abnormal bonding wire segment, and a first warning message corresponding to the first abnormal bonding wire segment is sent; wherein, the maximum value in the historical tension value list corresponding to the historical bonding wire segment corresponding to the performance label that is the first label is used as the maximum tension value, and the minimum value is used as the minimum tension value; the first label indicates that all performances of the bonding wire segment meet the standards. It can be seen that the present invention detects the bonding wire through the tension value collected in real time by the tension sensor during the bonding wire drawing process, and determines the maximum tension value and the minimum tension value based on a plurality of tension values corresponding to the historical bonding wire segments whose performances all meet the standards; when the tension value collected in real time is less than the minimum tension value or greater than the maximum tension value, it indicates that an abnormality occurs during the bonding wire drawing process. The bonding wire segment drawn by the wire drawing die corresponding to the bonding wire corresponding to the tension value collected in real time between the first time point corresponding to the tension value collected in real time and the second time point corresponding to the tension value collected in real time is marked as a first abnormal bonding wire segment, and a first warning message corresponding to the first abnormal bonding wire segment is sent; the manual intervention is reduced, and the first abnormal bonding wire segment can be determined quickly and efficiently and the first warning message corresponding to the first abnormal bonding wire segment is sent, improving the efficiency and accuracy of identifying the abnormal bonding wire segment.

[0103] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should also understand that various modifications can be made to the embodiments without departing from the scope and spirit of the present invention.

Claims

1. A wire drawing device for producing bonding wires, characterized in that, The device includes: a wire drawing device, a processor, and a memory storing a computer program; the wire drawing device includes a plurality of wire drawing dies and a tension sensor corresponding to each wire drawing die, and the tension sensor is used to detect the actual tension of the bonding wire segment drawn by its corresponding wire drawing die and located within its detection area; when the computer program is executed by the processor, the following steps are implemented: S10. For each bonding wire currently drawn by a wire drawing die, obtain the tension value Z collected in real time by the tension sensor corresponding to the bonding wire during the process of the wire drawing die corresponding to the bonding wire drawing the bonding wire. S20. When Z < X or Z > D, mark the bonding wire segment drawn by the wire drawing die corresponding to the bonding wire of Z between the first time point Z1 corresponding to Z and the second time point Z2 corresponding to Z as the first abnormal bonding wire segment Z. 0 , and send the first warning message corresponding to Z. 0 ; X is the minimum tension value, and D is the maximum tension value; Z1 = Z3 - t. 0 ; Z2 = Z3 + t. 0 ; Z3 is the time point when Z is collected, and t. 0 is the preset time difference. Before S20, the following steps are further included: S01. Obtain the performance label and the historical tension value list corresponding to each historical bonding wire segment; the historical tension value list includes several tension values corresponding to the historical bonding wire segment; the historical bonding wire segment is randomly selected from the bonding wires produced by the device during the historical time period and of the same type but different batches as the currently drawn bonding wire; the length of the historical bonding wire segment is greater than the length of the detection area of the tension sensor. S02. Take the maximum value in the historical tension value list corresponding to the historical bonding wire segment corresponding to any performance label that is the first label as D, and the minimum value as X; the first label indicates that all performances of the bonding wire segment meet the standards.

2. The wire drawing device for bonding wire production according to claim 1, characterized in that, The tension value corresponding to the historical bonding wire segment is the tension value collected by the tension sensor corresponding to the historical bonding wire segment during the wire drawing time period corresponding to the historical bonding wire segment; the starting time point of the wire drawing time period corresponding to the historical bonding wire segment is the time point when the wire drawing die corresponding to the historical bonding wire segment draws the starting point of the historical bonding wire segment; the ending time point of the wire drawing time period corresponding to the historical bonding wire segment is the time point when the wire drawing die corresponding to the historical bonding wire segment draws the ending point of the historical bonding wire segment.

3. The wire drawing device for bonding wire production according to claim 1, characterized in that, After step S10, the following steps are further included: S11. For each bonding wire drawn by the current wire drawing die, obtain the list of tension values A = {A1, A2, ……, A i , ……, A m}, where A i is the i-th tension value collected in real time by the tension sensor corresponding to the bonding wire during the process of drawing the bonding wire by the wire drawing die corresponding to the bonding wire, 1 ≤ i ≤ m, and m is the number of tension values collected in real time by the tension sensor corresponding to the bonding wire during the process of drawing the bonding wire by the wire drawing die corresponding to the bonding wire; among them, the time point when A i is collected is earlier than the time point when A i+1 is collected, and A i+1 is the (i + 1)-th tension value collected in real time by the tension sensor corresponding to the bonding wire during the process of drawing the bonding wire by the wire drawing die corresponding to the bonding wire; S12. If A i , A i+1 , ……, A i+j has a variance greater than a preset variance, then the wire drawing die corresponding to the bonding wire of A is marked as the second abnormal bonding wire segment for the bonding wire segments drawn during the target time period corresponding to A i , A i+1 , ……, A i+j , and a second warning message corresponding to the second abnormal bonding wire segment is sent; The start time point of the target time period corresponding to A i , A i+1 , ……, A i+j is the time point when A i is collected; The end time point of the target time period corresponding to A i , A i+1 , ……, A i+j is the time point when A i+j is collected; j is a preset quantity threshold.

4. The wire drawing device for producing bonding wires according to claim 3, characterized in that, When the computer program is executed by the processor, the following steps are further implemented: S100. At every preset fixed time interval, obtain the specified tension value list set R = {R1, R2, ……, R e , ……, R f}, where R e is the specified tension value list corresponding to the bonding wire drawn by the e-th wire drawing die in the device at the current time point, 1 ≤ e ≤ f, and f is the number of wire drawing dies in the device. The specified tension value list includes all the tension values collected by the tension sensor corresponding to the wire drawing die corresponding to the specified tension value list within the specified time period corresponding to the current time point. The end time point of the specified time period corresponding to the current time point is the current time point, and the duration of the specified time period is the preset specified duration. The preset specified duration is not less than the preset fixed duration; S200. Vectorize R e to obtain the corresponding tension value vector K e of R e ; S300. Obtain the average vector $\bar{K}$ of $K_1, K_2, \ldots, K_n$ e , \ldots, K f n 0 ; S400. If K e and K 0 the distance between them is greater than the preset vector distance, then mark the specified bonding wire segment corresponding to K e as the third abnormal bonding wire segment, and send the third warning message corresponding to the third abnormal bonding wire segment. The specified bonding wire segment corresponding to K e is the bonding wire segment drawn by the e-th wire drawing die during the specified time period corresponding to the current time point.

5. The wire drawing device for bonding wire production according to claim 4, wherein, The device further includes: a wire take-up device, and the wire take-up device includes a wire take-up wheel corresponding to each wire drawing die.

6. The wire drawing device for bonding wire production according to claim 5, characterized in that, The first warning information is used to prompt the user that during the process of the wire drawing die corresponding to the first abnormal bonding wire segment drawing the first abnormal bonding wire segment, the tension value of the bonding wire segment between the wire drawing die and the wire take-up wheel corresponding to the wire drawing die exceeds the range between the minimum tension value and the maximum tension value.

7. The wire drawing device for bonding wire production according to claim 1, characterized in that, The performance label further includes a second label; the second label indicates that at least one of all performances of the bonding wire segment does not meet the standards.

8. The wire drawing device for bonding wire production according to claim 5, characterized in that, The second warning information is used to prompt the user that during the process of the wire drawing die corresponding to the second abnormal bonding wire segment drawing the second abnormal bonding wire segment, the tension value of the bonding wire segment between the wire drawing die and the wire take-up wheel corresponding to the wire drawing die fluctuates greatly.

9. The wire drawing device for bonding wire production according to claim 5, characterized in that, The third warning information is used to prompt the user that during the process of the wire drawing die corresponding to the third abnormal bonding wire segment drawing the third abnormal bonding wire segment, the tension value of the bonding wire segment between the wire drawing die and the wire take-up wheel corresponding to the wire drawing die is abnormal.

10. The wire drawing device for bonding wire production according to claim 1, characterized in that, All the wire drawing dies in the wire drawing device are of the same type of wire drawing die, having the same structure and specifications.

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