Preparation method and system of LSPR sensor array substrate

Abstract

The invention provides a preparation method and system of an LSPR sensor array substrate, and the method comprises the steps: generating a target laser path based on a preset sensor array pattern corresponding to a current to-be-prepared sensor array; after determining that a target sensor substrate corresponding to the current sensor array to be prepared in the target substrate is located in a laser scanning area in the laser processing platform, performing laser etching on the target sensor substrate according to the target laser path; after it is determined that laser etching performed on the target sensor substrate is completed, floating dust removal treatment is performed on the target sensor substrate after laser etching is completed, and an LSPR sensor array substrate is obtained; the target substrate is a substrate on which gold nanoparticles with a preset array structure are laid; the target sensor substrate is a sensing substrate formed by gold nanoparticles in a corresponding area of the current sensor array to be prepared on the target substrate. The preparation efficiency is improved, and the sensor has higher detection flux.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly to a method and system for preparing a substrate of an LSPR sensor array. Background Art

[0002] Localized Surface Plasmon Resonance (LSPR) sensing technology is an advanced detection technology. This technology is based on the fact that the change of the environmental refractive index will significantly affect the resonance mode of the surface free electrons of the metal nanostructure, causing changes in the peak position and peak intensity of the absorption spectrum characteristic peak. Furthermore, by analyzing the macroscopic spectrum, the molecular adsorption and chemical reactions near the surface of the nanostructure can be accurately detected. The LSPR sensor constructed using this detection principle has the characteristics of small size, high sensitivity, and real-time response, and can be widely applied in the fields of biomarker detection, environmental monitoring, food safety detection, etc.

[0003] In the application of existing LSPR technology, in order to process nanostructures that generate the LSPR effect and ensure that the structures have high precision and consistency, electron beam lithography process and deep reactive ion etching process are usually adopted. These processes can achieve a resolution of up to 10 nm level, play an important role in the field of nanostructure processing, and provide a reliable hardware foundation for LSPR sensing technology.

[0004] However, the electron beam lithography process and the deep reactive ion etching process also have obvious deficiencies. Their equipment is expensive and the manufacturing efficiency is low, which makes them not suitable for processing large-area array-shaped strip structures and difficult to meet the requirements of batch production and low-cost applications.

[0005] Therefore, there is an urgent need for a method and system for preparing a substrate of an LSPR sensor array to solve the above problems. Summary of the Invention

[0006] Aiming at the problems existing in the prior art, the present invention provides a method and system for preparing a substrate of an LSPR sensor array.

[0007] The present invention provides a method for preparing a substrate of an LSPR sensor array, including: Generating a target laser path based on a preset sensor array pattern corresponding to the currently to-be-prepared sensor array; After determining that the target sensor substrate corresponding to the currently to-be-prepared sensor array in the target substrate is within the laser scanning area of the laser processing platform, laser etching is performed on the target sensor substrate according to the target laser path; After determining that the laser etching of the target sensor substrate is completed, the target sensor substrate after the laser etching is subjected to dust removal treatment to obtain an LSPR sensor array substrate; Among them, the target substrate is a substrate paved with gold nanoparticles in a preset array structure; the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the currently to-be-prepared sensor array on the target substrate.

[0008] According to a method for preparing an LSPR sensor array substrate provided by the present invention, the target substrate is a square substrate or a circular substrate, and the material of the target substrate is fluorine-doped tin oxide glass, quartz wafer or silicon wafer; the gold nanoparticles in the preset array structure paved on the surface of the target substrate are prepared based on rapid annealing or self-suction nanoimprinting; the preset array structure includes a randomly distributed gold nanoparticle structure, a grating array structure, a dot array structure and a circular hole array structure.

[0009] According to a method for preparing an LSPR sensor array substrate provided by the present invention, the laser processing platform includes a laser control unit and a sample stage, wherein: The laser control unit includes a laser, a first galvanometer, a second galvanometer and a focusing prism, and is used to reflect the pulsed laser emitted by the laser to the focusing prism for focusing through the first galvanometer and the second galvanometer in sequence, so as to form a focused light spot and emit it to the target substrate on the sample stage; wherein, the first galvanometer is used to adjust the reflection angle of the pulsed laser in the horizontal direction, and the second galvanometer is used to adjust the reflection angle of the pulsed laser in the vertical direction; The sample stage is used to place the target substrate and fix the target substrate through a sample positioning card slot.

[0010] According to a method for preparing an LSPR sensor array substrate provided by the present invention, the laser is a fiber laser or a carbon dioxide laser, the pulsed laser emitted by the laser is a microsecond laser or a nanosecond laser, and the power of the laser is 20W to 50W; the wavelength of the pulsed laser is 1000nm to 1400nm, and the beam waist diameter of the pulsed laser spot is 50μm to 100μm.

[0011] According to a method for preparing an LSPR sensor array substrate provided by the present invention, the laser etching of the target sensor substrate to form an LSPR sensor array substrate includes: Laser etching is performed on the target sensor substrate according to the target laser path and a preset laser routing method; Among them, the pulse frequency corresponding to the preset laser walking mode is 20 kHz to 100 kHz, and the laser etching scanning speed is 500 mm / s to 2000 mm / s; the preset laser walking mode includes line-by-line scanning and spiral scanning; the line spacing between adjacent two laser walking paths in the preset laser walking mode is 50% to 90% of the spot radius of the pulsed laser, and in the laser walking path, the distance between the edge of the sensing unit pattern to be formed in the target sensor substrate and the laser etching area is the spot radius of the pulsed laser; the pulse laser delay at the jumping point of the laser walking path is greater than 400 μs, and the pulse laser delay at the turning point of the laser walking path is greater than 200 μs.

[0012] According to a method for preparing an LSPR sensor array substrate provided by the present invention, the method further includes: Obtaining the target laser path and the preset sensor substrate size corresponding to a plurality of the preset sensor array patterns; According to the target laser path and the sensor substrate size, sequentially performing laser etching on each corresponding etching area in the target sensor substrate to obtain the LSPR sensor array substrate corresponding to each of the preset sensor array patterns.

[0013] The present invention also provides a preparation system for an LSPR sensor array substrate, including: A path generation module, configured to generate a target laser path based on a preset sensor array pattern corresponding to a sensor array to be prepared currently in a target substrate; A laser etching module, configured to perform laser etching on the target sensor substrate according to the target laser path after determining that the target sensor substrate corresponding to the sensor array to be prepared currently is within the laser scanning area of the laser processing platform; A cleaning module, configured to perform a floating dust removal process on the target sensor substrate after laser etching is completed to obtain an LSPR sensor array substrate after determining that the laser etching on the target sensor substrate is completed; Among them, the target substrate is a substrate paved with a preset array structure of gold nanoparticles; the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the sensor array to be prepared currently on the target substrate.

[0014] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, and when the processor executes the program, it implements the method for preparing an LSPR sensor array substrate as described in any one of the above.

[0015] The present invention also provides a non-transitory computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the preparation method of the LSPR sensor array substrate as described in any one of the above is realized.

[0016] The present invention also provides a computer program product, including a computer program. When the computer program is executed by a processor, the preparation method of the LSPR sensor array substrate as described in any one of the above is realized.

[0017] The preparation method and system of the LSPR sensor array substrate provided by the present invention generate a target laser path through a preset sensor array pattern. After determining that the target sensor substrate formed by gold nanoparticles is in the laser scanning area, laser etching is performed according to the path. Then, after the etching is completed, the substrate is subjected to dust removal treatment to obtain the LSPR sensor array substrate, thereby improving the preparation efficiency and enabling the LSPR sensor to have a higher detection throughput. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a schematic flow chart of the preparation method of the LSPR sensor array substrate provided by the present invention; Figure 2 It is a schematic structural diagram of the laser processing platform provided by the present invention; Figure 3 It is a schematic diagram of parameters during the laser etching process provided by the present invention; Figure 4 It is a schematic diagram of various laser wire routing methods provided by the present invention; Figure 5 It is a schematic diagram of the processing effect of the sensor substrate provided by the present invention; Figure 6 It is a schematic diagram of the application of the sensor substrate provided by the present invention; Figure 7 It is a schematic design diagram of the sensor point array on a single sensor provided by the present invention; Figure 8 It is the preparation system of the LSPR sensor array substrate provided by the present invention; Figure 9 It is a schematic structural diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] To make the objectives, technical solutions, and advantages of the present invention clearer, the following will clearly and completely describe the technical solutions in the present invention in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] In order to achieve the ability of a single chip to analyze multiple biomarkers simultaneously and to perform multiple measurements on the same indicator using a limited sample, currently, more than 200 sensing points often need to be integrated on the LSPR sensing chip to meet the application requirements. In existing applications, electron beam lithography and deep reactive ion etching processes can achieve resolutions of up to the 10 nm level and are commonly used to fabricate nanostructures that generate the LSPR effect to ensure the high precision and consistency of the structure. However, there are problems such as expensive equipment and low manufacturing efficiency, and they are not suitable for fabricating large-area array-shaped strip structures, making it difficult to meet the requirements of mass production and low-cost applications of LSPR sensing chips.

[0022] In response to the problems existing in the above-mentioned prior art, the present invention builds a laser processing platform, adjusts the focal length and corrects errors, uses a pre-planned laser walking pattern to perform laser etching on the workpiece substrate, and finally blows the surface dust with nitrogen to obtain the LSPR sensor array substrate. The present invention adopts laser processing technology to achieve the precise mass production of the strip array substrate, has a higher preparation efficiency than existing methods such as electron beam etching and template methods, effectively reduces the processing cost, and is more conducive to personalized customization and multi-functional applications.

[0023] Figure 1 The flowchart of the method for preparing the LSPR sensor array substrate provided by the present invention is as Figure 1 shown. The present invention provides a method for preparing an LSPR sensor array substrate, including: Step 101, generating a target laser path based on a preset sensor array pattern corresponding to the sensor array to be prepared currently.

[0024] In the present invention, first, a preset sensor array pattern will be designed according to actual needs and application scenarios. This preset sensor array pattern details the positions, shapes, sizes of each sensor in the sensor array, and their relative layouts. For example, if an LSPR sensor array for biological detection is to be prepared, it can be designed as a circular or square sensor unit pattern with a specific row and column arrangement to ensure efficient detection of target molecules in the sample.

[0025] Further, key feature information of each sensor unit in the preset sensor array pattern is extracted, such as the central coordinates, boundary contours, etc. These information will serve as the basis for generating the target laser path. In the present invention, according to the extracted pattern feature information, combined with the performance parameters of the laser processing equipment (such as the diameter of the laser beam, the focal depth, and the scanning speed, etc.), the target laser path is generated.

[0026] The target laser path plans the movement trajectory of the laser beam on the target substrate, ensuring that the laser can accurately act on the position corresponding to each sensor unit in the preset sensor array pattern. For example, for a circular sensor unit, the laser path may be designed to scan along the circumference to achieve uniform etching of the entire unit.

[0027] Optionally, the generated target laser path may not be the optimal solution and needs to be optimized and adjusted. Considering factors such as the thermal effect and material properties during the laser processing, the present invention can simulate and analyze the path to avoid problems such as uneven material ablation or thermal damage caused by concentrated laser energy. By continuously adjusting the path parameters, such as the laser power, scanning pitch, etc., the target laser path can meet the processing requirements of high precision and high efficiency.

[0028] The finally generated target laser path is docked with the laser processing platform, and the target laser path is converted into control instructions that the laser processing equipment can execute. The laser processing platform precisely controls the movement of the laser beam and the processing parameters according to these instructions to achieve precise etching of the target sensor substrate, thereby preparing a sensor array that conforms to the preset pattern.

[0029] Step 102, after determining that the target sensor substrate corresponding to the currently to-be-prepared sensor array in the target substrate is already in the laser scanning area within the laser processing platform, perform laser etching on the target sensor substrate according to the target laser path.

[0030] In the present invention, the target substrate is a pre-prepared base material for carrying the sensor array, and the surface of the target substrate is paved with gold nanoparticles with a preset array structure. The target sensor substrate is the sensing substrate formed by the gold nanoparticles in the corresponding area of the currently to-be-prepared sensor array on the target substrate, and it is the key part for actually performing laser etching to form the sensor array.

[0031] Further, through a high-precision positioning system equipped on the laser processing platform, such as an optical microscope, a laser displacement sensor, etc., accurately identify the position of the target sensor substrate on the target substrate. When it is determined that the target sensor substrate is accurately in the laser scanning area within the laser processing platform, it means that the laser beam can cover and act on this substrate, preparing for the subsequent etching.

[0032] In the present invention, the target laser path is generated based on a preset sensor array pattern corresponding to the sensor array to be fabricated currently. The target laser path details the movement trajectory of the laser beam on the target sensor substrate, and this path ensures that the laser can act precisely on specific positions of the substrate according to the design requirements to form the required sensor structure and pattern.

[0033] Further, after the target sensor substrate is in the corresponding position within the laser processing platform, the laser processing platform is started, and the movement of the laser beam is controlled according to the target laser path. The laser beam is focused on the gold nanoparticles on the target sensor substrate, and the high-energy laser causes the local rapid heating of the gold nanoparticles, resulting in physical or chemical changes, such as melting, vaporization, or changing their surface morphology, etc., thereby achieving the etching of the substrate. By precisely controlling parameters such as the power, pulse width, and scanning speed of the laser, precise control of the etching depth and shape can be achieved, and finally a sensor array structure meeting the preset requirements is formed.

[0034] Step 103, after determining that the laser etching of the target sensor substrate is completed, perform a dust removal treatment on the target sensor substrate after the laser etching is completed to obtain an LSPR sensor array substrate; Wherein, the target substrate is a substrate paved with gold nanoparticles in a preset array structure; the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the currently to-be-fabricated sensor array on the target substrate.

[0035] In the present invention, it is possible to rely on the feedback signal of the laser processing equipment and preset processing parameters. For example, the equipment will comprehensively judge whether the etching process meets the expected requirements by combining parameters such as the set etching time and etching depth with information such as the laser power monitored by the sensor and the temperature change in the processing area. When it is determined that the laser etching operation on the target sensor substrate is completed, due to the interaction between the laser and the material, some tiny debris and dust and other pollutants may be generated. These floating dust will adhere to the surface of the target sensor substrate after the laser etching is completed, which will not only affect the appearance quality of the sensor array but may also interfere with the subsequent detection performance of the sensor, reducing the detection accuracy and sensitivity. Therefore, in the present invention, pure nitrogen is used for purging, and the floating dust attached to the substrate surface is blown away by the impact force of the air flow; ultrasonic cleaning can also be used, immersing the target sensor substrate in a cleaning solution, and the floating dust is detached from the substrate surface through the vibration of ultrasonic waves; electrostatic adsorption and other methods can also be used to adsorb and remove the floating dust. In the present invention, the above-mentioned dust removal methods can be used alone or in combination to ensure the complete removal of the floating dust.

[0036] After the dust removal treatment, the pollutants originally attached to the surface of the target sensor substrate are effectively removed. At this time, the obtained substrate is the LSPR sensor array substrate that meets the requirements. This sensor array substrate is based on the gold nanoparticles with a preset array structure laid on the target substrate. Through laser etching, a specific sensor array structure is formed. The gold nanoparticles and the structure formed by them have the characteristics of local surface plasmon resonance (LSPR), and can produce sensitive responses to changes in the surrounding environment, thus providing a basis for realizing the detection function of high-performance LSPR sensors.

[0037] The preparation method of the LSPR sensor array substrate provided by the present invention generates a target laser path through a preset sensor array pattern. After determining that the target sensor substrate formed by gold nanoparticles is in the laser scanning area, laser etching is carried out according to the path. Then, after the etching is completed, a dust removal treatment is performed on the substrate to obtain the LSPR sensor array substrate, thereby improving the preparation efficiency and enabling the LSPR sensor to have a higher detection throughput.

[0038] On the basis of the above embodiments, the target substrate is a square substrate or a circular substrate, and the material of the target substrate is fluorine-doped tin oxide glass, quartz wafer or silicon wafer; the gold nanoparticles with the preset array structure laid on the surface of the target substrate are prepared based on rapid annealing or self-aspirated nanoimprinting; the preset array structure includes a randomly distributed gold nanoparticle structure, a grating array structure, a dot array structure and a circular hole array structure.

[0039] In the present invention, the substrate of the LSPR sensor is composed of a hard substrate (the corresponding area in the target substrate) and a gold nanoparticle structure on the hard substrate. The target substrate can be made of silicon materials, such as quartz wafers, fluorine-doped tin oxide (FTO) glass and silicon wafers. The gold nanoparticle structure is the main body that plays the functions of surface adsorption detection and sensing. Its size, shape and arrangement will affect the peak position, sharpness and sensitivity of the absorption peak, and can be obtained by various preparation methods.

[0040] Specifically, in one embodiment, by using the rapid annealing method, randomly distributed gold nanoparticles can be prepared. The process is to first deposit a gold nano-film with a thickness of 5 nm to 10 nm on a 4-inch target substrate by electron beam evaporation, and then perform high-temperature annealing above 300 °C, so that the gold nano-film will crystallize to form dispersed nanoparticles with a size of 30 nm to 100 nm.

[0041] In another embodiment, self-suction nanoimprinting is adopted to rapidly and repeatedly fabricate periodic arrays of gold nanoparticle structures, such as nanoparticle arrays and grating arrays. In this process, a transparent soft imprinting template is made of polydimethylsiloxane (PDMS) and covered on the target substrate using a bilayer resist process; the photoresist fills the nano-grooves of the soft template through capillary action, and after further curing and development, the nanoimprinting soft template is peeled off, leaving a photoresist with a grating array morphology or a hole array morphology; then, a metal is deposited and the photoresist is removed, so that the remaining gold film on the target substrate forms a grating array structure, a dot array structure or a circular hole array structure. The periodic size of the gold nanoparticle structure is less than 500 nm, the morphology of the gold nanoparticle structure is more regular and controllable, and the sensing performance is better.

[0042] The gold nanoparticle structure constructed by the above method of the present invention will cover the surface of the target substrate, and macroscopically it is a complete film. In an LSPR sensor, however, the film on the substrate needs to be divided into micron-sized arrays, and each sensing point in the array works independently. Therefore, the present invention will further perform laser etching on the gold nanoparticle structure on the target substrate to form a strip array corresponding to the preset sensor array pattern. Moreover, a single processing can support a target substrate of 4 inches in size, and multiple sensor substrates can be divided from a single substrate, with low cost and fast processing speed, which is more suitable for mass production.

[0043] Based on the above embodiments, the laser processing platform includes a laser control unit and a sample stage, where: The laser control unit includes a laser, a first galvanometer, a second galvanometer and a focusing prism, and is used to reflect the pulsed laser emitted by the laser to the focusing prism through the first galvanometer and the second galvanometer in sequence for focusing, so as to form a focused spot and emit it to the target substrate on the sample stage; wherein, the first galvanometer is used to adjust the reflection angle of the pulsed laser in the horizontal direction, and the second galvanometer is used to adjust the reflection angle of the pulsed laser in the vertical direction; The sample stage is used to place the target substrate and fix the target substrate through a sample positioning card slot.

[0044] Figure 2 For the structural schematic diagram of the laser processing platform provided by the present invention, reference can be made to Figure 2As shown, in the present invention, the laser control unit is composed of a laser, a galvanometer, a condenser lens, etc. Its principle is that the laser outputs pulsed laser, and the galvanometer system (i.e., the first galvanometer and the second galvanometer) respectively and precisely controls the mirror angles of the X-axis in the horizontal direction (corresponding to the first galvanometer) and the Y-axis in the vertical direction (corresponding to the second galvanometer), so that the laser scans a two-dimensional pattern on the tabletop of the laser processing platform. The laser used in the present invention is preferably a microsecond laser or a nanosecond laser, with a maximum power of 30W, a wavelength of 1300nm, and a beam waist diameter of the laser spot of 50μm. Among them, the sample stage can use an optical platform to place the parts to be processed, and during batch processing, through the sample positioning card slot, the sample can be conveniently aligned and fixed at a specific position.

[0045] Optionally, in the present invention, to ensure the accurate processing of the preset sensor array pattern, it is necessary to adjust the built laser processing platform according to the processing effect, usually only once before batch production. Specifically, first, adjust the scanning height of the laser control unit, observe the processing result through a microscope, and find the best focusing height. When in the best focus, macroscopically, a clear pattern is formed on the workpiece surface, the etched area is very flat, and the boundary between the etched area and the reserved area is smooth and neat; when slightly underfocused or overfocused, although the pattern can be seen macroscopically, fish-scale patterns formed by the round pits after burning of the etched part can be seen, the surface is relatively rough, and the boundary is blurred; when the focal length deviation is large, the pattern cannot be presented on the surface of the sensing substrate.

[0046] Then, detect the scaling and distortion of the actual processing result of the laser processing platform: After calibrating the microscope with a reticle, on the X-axis in the horizontal direction and the Y-axis in the vertical direction, measure the distance between 10 periodic structures in the sensor array pattern already formed on the sensor substrate respectively, take the average value and compare it with the designed distance to calculate the scaling factor. Further, observe the outermost edge of the array pattern. If it is flush and straight, it is considered that there is no obvious distortion. Finally, according to the measurement results, finely adjust the laser scanning unit to make the center of the processed pattern coincide with the optical axis of the focusing lens, which can reduce the distortion degree of the pattern.

[0047] Based on the above embodiments, the laser is a fiber laser or a carbon dioxide laser, the pulsed laser emitted by the laser is a microsecond laser or a nanosecond laser, and the power of the laser is 20W to 50W; the wavelength of the pulsed laser is 1000nm to 1400nm, and the beam waist diameter of the pulsed laser spot is 50μm to 100μm.

[0048] Based on the above embodiments, laser-etching the target sensor substrate according to the target laser path to form an LSPR sensor array substrate includes: Laser etch the target sensor substrate according to the target laser path and the preset laser routing method; Among them, the pulse frequency corresponding to the preset laser routing method is 20 kHz to 100 kHz, and the laser etch scanning speed is 500 mm / s to 2000 mm / s; the preset laser routing method includes line-by-line scanning and spiral scanning; the line spacing between adjacent two laser routing paths in the preset laser routing method is 50% to 90% of the spot radius of the pulsed laser, and in the laser routing path, the distance between the edge of the sensing unit pattern to be formed in the target sensor substrate and the laser etch area is the spot radius of the pulsed laser; the pulse laser delay at the jump of the laser routing path is greater than 400 μs, and the pulse laser delay at the turn of the laser routing path is greater than 200 μs.

[0049] In the present invention, according to the preset sensor array pattern, the software supporting the laser control unit is used to generate the laser routing path (i.e., the target laser path), so that the routing fills the area that needs to be etched in the target sensor substrate.

[0050] In the present invention, the important parameters in the laser etching process include laser power, spot waist diameter, spot spacing, routing method, line spacing, and number of repeated routings. Figure 3 This is the schematic diagram of the parameters in the laser etching process provided by the present invention. Some important parameters in the laser etching process can be referred to Figure 3 as shown, for example, spot spacing, scanning direction, line spacing (i.e., routing spacing), and spot diameter (i.e., spot waist diameter), etc.

[0051] Specifically, the spot waist diameter is determined by the laser and the focusing mirror system. It affects the processing accuracy and the minimum size that can be achieved. During processing, the center of the laser spot moves along the path, and the area within one spot radius on both sides of the path line will be etched. Therefore, in the present invention, the routing path line is spaced one spot radius width from the reserved area (i.e., the area on the sensor substrate where laser etching is not performed).

[0052] The spot spacing is the center spacing between the circular burning marks of two adjacent pulsed lasers, which can be controlled by setting the laser scanning speed and pulse frequency. The calculation method is: spacing = (laser scanning speed / pulse frequency). A suitable spot spacing can achieve etching of a unit area with a smaller number of laser pulses, and the surface of the etched substrate is relatively flat, and the pattern edge is smoother.

[0053] The line spacing of the laser routing is the distance between adjacent two laser routing paths. This distance needs to be less than the spot waist diameter. Its adjustment process is the spot spacing between adjacent two rows of routings. Therefore, the setting requirements are similar to the spot spacing.

[0054] In the present invention, there are multiple choices for the preset laser routing method, but there are certain differences in pattern accuracy, stability, and processing speed. Figure 4 For the schematic diagrams of multiple laser routing methods provided by the present invention, reference can be made to Figure 4 As shown, according to the basic shape of the scanning path, it can be divided into Figure 4 (a) Line-by-line unidirectional scanning, Figure 4 (b) Line-by-line reciprocating scanning, Figure 4 (c) Skip line-by-line scanning, Figure 4 (d) Gap filling line-by-line scanning, Figure 4 (e) Contour scanning. Among them, in terms of processing efficiency, the efficiency of line-by-line reciprocating scanning and contour scanning is higher than that of line-by-line unidirectional scanning because the total path length is reduced. In terms of stability, line-by-line scanning is superior to contour scanning because when controlling the light spot to move along the contour path, the travel of the galvanometer system is larger and the displacement deviation accumulates more. When processing the reserved area, the path of the laser is not necessarily continuous. Therefore, according to the processing method of the scanning path for the tiny discontinuous area, it can be divided into skip line-by-line scanning and gap filling line-by-line scanning. In terms of the continuity of the path, contour scanning has more advantages when processing small-area etching regions, reducing the number of path discontinuity points and making the overall path more continuous. Followed by gap filling line-by-line scanning, and skip line-by-line scanning has more path discontinuity points.

[0055] Furthermore, the pulse laser delay includes the turn-on delay, turn-off delay, and corner delay of the pulse laser. Among them, the turn-on delay of the pulse laser is the waiting time for waiting for the laser to output stable power laser, and the turn-off delay is the waiting time for the laser to completely turn off the light source. The turn-on and turn-off delays have an obvious effect on the processing effect at the path discontinuity. During this waiting time, the position of the laser light spot does not move, avoiding the premature movement of the light spot position, resulting in some etched regions of the pattern being missed or the reserved region being damaged. The corner delay is the waiting time at the turning of the laser path, considering the inertia of the galvanometer to reduce the oscillation of the routing at the turning.

[0056] In an embodiment, the beam waist diameter of the laser light spot is 50 μm, the line pitch is 30 μm, and the routing method is gap filling line-by-line scanning. After the routing path fills the etching area, an additional path is added around the edge of the pattern to make the pattern edge straighter. In this embodiment, the pulse frequency is set to 20 kHz, the laser etching scanning speed is 1000 mm / s, the turn-on delay and turn-off delay are both 600 μs, and the delay at the routing corner is 300 μs. Figure 5 For the schematic diagram of the processing effect of the sensor substrate provided by the present invention, reference can be made to Figure 5As shown, since the movement range of the laser spot of the laser processing platform is much larger than that of a single sensor substrate, thus, a panel can be formed, and an array pattern of multiple sensors can be processed on a large target substrate at one time. In the present invention, the path of the laser spot passing through the sensor substrate will remove the nano gold particles, exposing the glass substrate, and the part not scanned by the laser spot will retain the original gold nano particle structure, achieving precise segmentation. In the microscope pattern, the light-colored area is the glass substrate exposed on the target substrate after laser scanning, and the dark-colored area is the area reserved for sensing. It can be seen that the pattern edge is smooth and straight, and the etched area is also very flat.

[0057] Finally, after the laser etching is completed, a small amount of floating dust will be deposited on the substrate surface, which is the powder and fragmented materials condensed after burning and gasification. Nitrogen can be used to purge the substrate surface to remove the deposited ash.

[0058] Through the above preparation process of the LSPR sensor array substrate, a gold nano thin film substrate corresponding to the preset sensor array pattern is obtained. After further encapsulation and biofunctionalization, the substrate can be made into an LSPR strip sensor. Figure 6 For the application schematic diagram of the sensor substrate provided by the present invention, reference can be made to Figure 6 As shown, the sample to be analyzed is injected from the injection port. Under the guidance of the microfluidic channel, the sample flows through each sensing point in turn. The detected substance in the sample is specifically adsorbed onto the gold nano structure at the sensing point. By statistically analyzing the spectral signals at the array points, sensitive detection of low-concentration markers can be achieved.

[0059] Based on the above embodiments, the method further includes: Obtaining the target laser path and the preset sensing substrate size corresponding to multiple preset sensor array patterns; According to the target laser path and the sensor substrate size, laser etching is sequentially performed on each corresponding etching area in the target sensor substrate to obtain the LSPR sensor array substrate corresponding to each preset sensor array pattern.

[0060] In the present invention, when the specified area of the sensor substrate is 2 cm × 2 cm, 200 to 400 sensing units can be accommodated on a single substrate. Figure 7 For the design schematic diagram of the sensor point array on a single sensor provided by the present invention, reference can be made to Figure 7As shown, the characteristic lengths of each structure are marked. Among them, dimension a is the width of a single sensing point square, T is the interval of the squares arranged periodically along the FTO substrate, b is the distance between the outermost sensing point square and the edge of the FTO substrate (leaving a distance of about 3 mm), and n is the number of sensing dot arrays in the horizontal or vertical direction. The operation process of laser processing is the same as that of Example 1, but there are more choices in the processed patterns. Further, multiple models can be extended under the same design framework, providing more choice space, that is, in the present invention, multiple corresponding etching regions can be divided on the target substrate according to multiple preset sensor array patterns. In one embodiment, Figure 7 The values of each feature in it can be changed and adjusted with reference to Table 1 below, so as to obtain sensor chips with different total numbers of sensing points.

[0061] Table 1 Design reference values of the sensor substrate (2 cm × 2 cm) array pattern (unit: mm)

[0062] The present invention uses laser processing to divide the sensing unit, and the processing effect has extremely high stability. The required equipment is simpler, the construction and maintenance costs of the laser processing platform are lower, which is more conducive to realizing the pipeline production of the LSPR sensing substrate, improving the preparation efficiency and reducing the production cost. At the same time, when the total area of the sensor substrate is limited, more sensing units can be accommodated per unit area, enabling a single sensor to support more types of analytes for simultaneous detection and increasing the number of repeated detections for each analyte. Moreover, the present invention can design and select different processing patterns according to the number of sensing units required for the target detection scenario, manufacture sensor substrates with different numbers of sensing positions, and there is no need to change and re-adjust the processing equipment used.

[0063] Next, the preparation system of the LSPR sensor array substrate provided by the present invention will be described. The preparation system of the LSPR sensor array substrate described below can be correspondingly referred to the preparation method of the LSPR sensor array substrate described above.

[0064] Figure 8 This is the preparation system of the LSPR sensor array substrate provided by the present invention, as Figure 8As shown in the figure, the present invention provides a preparation system for a substrate of an LSPR sensor array, including a path generation module 801, a laser etching module 802, and a cleaning module 803. Among them, the path generation module 801 is used to generate a target laser path based on a preset sensor array pattern corresponding to the sensor array to be prepared currently in a target substrate; the laser etching module 802 is used to perform laser etching on the target sensor substrate according to the target laser path after determining that the target sensor substrate corresponding to the sensor array to be prepared currently is in the laser scanning area of the laser processing platform; the cleaning module 803 is used to perform a floating dust removal process on the target sensor substrate after the laser etching is completed to obtain an LSPR sensor array substrate; where the target substrate is a substrate paved with a preset array structure of gold nanoparticles; the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the sensor array to be prepared currently on the target substrate.

[0065] The preparation system for the LSPR sensor array substrate provided by the present invention generates a target laser path through a preset sensor array pattern. After determining that the target sensor substrate formed by gold nanoparticles is in the laser scanning area, laser etching is performed according to the path. Then, after the etching is completed, a floating dust removal process is performed on the substrate to obtain an LSPR sensor array substrate, thereby improving the preparation efficiency and enabling the LSPR sensor to have a higher detection throughput.

[0066] The system provided in the embodiments of the present invention is used to execute the above method embodiments. For the specific process and detailed content, please refer to the above embodiments and will not be elaborated here.

[0067] Figure 9 It is a schematic structural diagram of the electronic device provided by the present invention, as Figure 9As shown in the figure, the electronic device may include: a processor 901, a communications interface 902, a memory 903, and a communication bus 904. Among them, the processor 901, the communications interface 902, and the memory 903 complete communication with each other through the communication bus 904. The processor 901 may call the logical instructions in the memory 903 to execute a method for preparing a substrate of an LSPR sensor array. The method includes: generating a target laser path based on a preset sensor array pattern corresponding to the sensor array to be prepared currently; after determining that the target sensor substrate corresponding to the currently to-be-prepared sensor array in the target substrate is already in the laser scanning area within the laser processing platform, performing laser etching on the target sensor substrate according to the target laser path; after determining that the laser etching on the target sensor substrate is completed, performing a floating dust removal process on the target sensor substrate after the laser etching is completed to obtain an LSPR sensor array substrate; where the target substrate is a substrate paved with a preset array structure of gold nanoparticles; the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the currently to-be-prepared sensor array on the target substrate.

[0068] In addition, when the logical instructions in the above-mentioned memory 903 can be implemented in the form of software functional units and sold or used as an independent product, they can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The foregoing storage medium includes: various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, or an optical disc that can store program codes.

[0069] On the other hand, the present invention also provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium. The computer program includes program instructions. When the program instructions are executed by a computer, the computer can execute the preparation method of the LSPR sensor array substrate provided by each of the above methods. The method includes: generating a target laser path based on a preset sensor array pattern corresponding to the sensor array to be prepared currently; after determining that the target sensor substrate corresponding to the sensor array to be prepared currently in the target substrate is in the laser scanning area within the laser processing platform, performing laser etching on the target sensor substrate according to the target laser path; after determining that the laser etching on the target sensor substrate is completed, performing dust removal treatment on the target sensor substrate after the laser etching is completed to obtain an LSPR sensor array substrate; wherein the target substrate is a substrate paved with gold nanoparticles in a preset array structure; and the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the sensor array to be prepared currently on the target substrate.

[0070] In another aspect, the present invention also provides a non-transitory computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it is configured to execute the preparation method of the LSPR sensor array substrate provided by each of the above embodiments. The method includes: generating a target laser path based on a preset sensor array pattern corresponding to the sensor array to be prepared currently; after determining that the target sensor substrate corresponding to the sensor array to be prepared currently in the target substrate is in the laser scanning area within the laser processing platform, performing laser etching on the target sensor substrate according to the target laser path; after determining that the laser etching on the target sensor substrate is completed, performing dust removal treatment on the target sensor substrate after the laser etching is completed to obtain an LSPR sensor array substrate; wherein the target substrate is a substrate paved with gold nanoparticles in a preset array structure; and the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the sensor array to be prepared currently on the target substrate.

[0071] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. A person of ordinary skill in the art can understand and implement it without creative efforts.

[0072] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on such an understanding, the essence of the above technical solution, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A preparation method of a substrate for an LSPR sensor array, characterized in that Including: Generating a target laser path based on a preset sensor array pattern corresponding to the sensor array to be prepared currently; After determining that the target sensor substrate corresponding to the currently to-be-prepared sensor array in the target substrate is in the laser scanning area within the laser processing platform, laser-etching the target sensor substrate according to the target laser path; After determining that the laser etching of the target sensor substrate is completed, performing a floating dust removal treatment on the target sensor substrate after the laser etching is completed to obtain an LSPR sensor array substrate; Wherein, the target substrate is a substrate paved with gold nanoparticles in a preset array structure; the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the currently to-be-prepared sensor array on the target substrate.

2. The preparation method of the LSPR sensor array substrate according to claim 1, wherein The target substrate is a square substrate or a circular substrate, and the material of the target substrate is fluorine-doped tin oxide glass, quartz wafer or silicon wafer; the gold nanoparticles in the preset array structure paved on the surface of the target substrate are prepared based on rapid annealing or self-aspirating nanoimprinting; the preset array structure includes a randomly distributed gold nanoparticle structure, a grating array structure, a dot array structure and a circular hole array structure.

3. The preparation method of the LSPR sensor array substrate according to claim 1, wherein, The laser processing platform includes a laser control unit and a sample stage, wherein: The laser control unit includes a laser, a first galvanometer, a second galvanometer and a focusing prism, and is used to sequentially reflect the pulsed laser emitted by the laser to the focusing prism through the first galvanometer and the second galvanometer for focusing, so as to form a focused light spot and emit it to the target substrate on the sample stage; wherein, the first galvanometer is used to adjust the reflection angle of the pulsed laser in the horizontal direction, and the second galvanometer is used to adjust the reflection angle of the pulsed laser in the vertical direction; The sample stage is used to place the target substrate and fix the target substrate through a sample positioning card slot.

4. The preparation method of the LSPR sensor array substrate according to claim 3, wherein, The laser is a fiber laser or a carbon dioxide laser, the pulsed laser emitted by the laser is a microsecond laser or a nanosecond laser, and the power of the laser is 20W to 50W; the wavelength of the pulsed laser is 1000nm to 1400nm, and the beam waist diameter of the pulsed laser spot is 50μm to 100μm.

5. The preparation method of the LSPR sensor array substrate according to claim 4, characterized in that, The laser-etching the target sensor substrate according to the target laser path to form an LSPR sensor array substrate includes: Laser-etching the target sensor substrate according to the target laser path and a preset laser routing method; Among them, the pulse frequency corresponding to the preset laser walking mode is 20 kHz to 100 kHz, and the laser etching scanning speed is 500 mm / s to 2000 mm / s; the preset laser walking mode includes line-by-line scanning and spiral scanning; the line spacing between adjacent two laser walking paths in the preset laser walking mode is 50% to 90% of the spot radius of the pulsed laser, and in the laser walking path, the distance between the edge of the sensing unit pattern to be formed in the target sensor substrate and the laser etching area is the spot radius of the pulsed laser; the pulsed laser delay at the walking jump in the laser walking path is greater than 400 μs, and the pulsed laser delay at the walking turn in the laser walking path is greater than 200 μs.

6. The preparation method of the LSPR sensor array substrate according to any one of claims 1 to 5, characterized in that, The method further includes: acquiring the target laser path and the preset sensing substrate size corresponding to a plurality of the preset sensor array patterns; sequentially performing laser etching on each corresponding etching area in the target sensor substrate according to the target laser path and the sensor substrate size, so as to obtain the LSPR sensor array substrate corresponding to each preset sensor array pattern.

7. A preparation system for a substrate of an LSPR sensor array, characterized in that, including: a path generation module, configured to generate a target laser path based on the preset sensor array pattern corresponding to the sensor array to be prepared currently in the target substrate; a laser etching module, configured to perform laser etching on the target sensor substrate according to the target laser path after determining that the target sensor substrate corresponding to the sensor array to be prepared currently is within the laser scanning area of the laser processing platform; a cleaning module, configured to perform dust removal treatment on the target sensor substrate after the laser etching is completed to obtain an LSPR sensor array substrate after determining that the laser etching on the target sensor substrate is completed; wherein, the target substrate is a substrate paved with gold nanoparticles in a preset array structure; the target sensor substrate is a sensing substrate formed by the gold nanoparticles in the corresponding area of the sensor array to be prepared currently on the target substrate.

8. An electronic device, comprising a memory, a processor, and a computer program stored on the memory and running on the processor, characterized in that, When the processor executes the computer program, it implements the method for preparing the LSPR sensor array substrate according to any one of claims 1 to 6.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the method for preparing the LSPR sensor array substrate according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the method for preparing the LSPR sensor array substrate according to any one of claims 1 to 6.

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