Machining method of double-sided polishing machine

Abstract

The invention provides a machining method of a double-sided polishing machine, and relates to the field of surface machining. The machining method comprises the following steps that S1, a clamp gear is placed on the lower fixed disc and engaged with the sun gear and the inner gear ring; s2, a to-be-polished workpiece is placed in a clamp gear, and an upper fixed disc is driven to descend; s3, polishing parameters are set; starting a double-sided polishing machine to polish the surface of the workpiece; and S4, after polishing is finished, the workpiece is taken out, and the surface of the workpiece is cleaned. The method is suitable for polishing the ground workpiece, the flatness and the parallelism of the workpiece and the light transmittance of the surface of the workpiece can be improved, and the upper surface and the lower surface of the workpiece are transparent.

Description

Technical Field

[0001] The present invention relates to the field of surface processing, and more particularly, to a processing method for a double-sided polishing machine. Background Art

[0002] Double-sided polishing means that during the polishing process, the front and back surfaces of the workpiece are simultaneously polished to remove surface defects and improve surface finish. Double-sided polishing relies on the mechanical action of the workpiece, abrasive particles, polishing liquid, and polishing disc. During the polishing process, the chemical solution and abrasive particles in the polishing liquid undergo physical and chemical changes with the workpiece surface. At the same time, under the rotational pressure of the upper polishing disc on the workpiece, the chemical reaction products generated on the workpiece surface are removed. This dual mechanical and chemical action continuously generates and simultaneously removes a very thin chemical film on the workpiece surface, thereby achieving surface treatment with high precision and low surface roughness.

[0003] Double-sided polishing has the advantages of high processing efficiency, small surface deformation, and ultra-smooth processed surface, but it is sensitive to process parameters. During the double-sided polishing process, process parameters such as polishing liquid, polishing pad, polishing pressure, and polishing time have a greater impact on the polishing effect. For the double-sided polishing of quartz products, there are problems such as poor uniformity and rotational overlay deviation. Summary of the Invention

[0004] The purpose of the present invention is to provide a processing method for a double-sided polishing machine to polish the ground workpiece. By setting the pressure value of the machine tool, applying polishing powder, and controlling the parallelism of the upper and lower fixed plates of the machine tool, in step S3 of the above steps, the flatness, parallelism of the workpiece, and the light transmittance of the workpiece surface can be improved, making the upper and lower surfaces of the workpiece transparent.

[0005] The present invention solves its technical problems by adopting the following technical solutions.

[0006] An embodiment of the present invention provides a processing method for a double-sided polishing machine, including the following steps:

[0007] S1: Place the fixture gear on the lower fixed plate and engage it with the sun gear and the internal gear ring respectively;

[0008] S2: Place the workpiece to be polished in the fixture gear and drive the upper fixed plate to descend;

[0009] S3: Set the polishing parameters; start the double-sided polishing machine to polish the workpiece surface;

[0010] S4: After the polishing is completed, take out the workpiece and clean the surface of the workpiece.

[0011] In some embodiments of the present invention, in step S3, the polishing parameters are: the pressure applied by the upper fixed plate is 45 - 100 g / cm 2, the polishing time is 1 - 99 minutes, and the spindle speed is 35 - 45 rpm. Before polishing, as the upper fixed platen approaches the workpiece, the rotational speed of the upper fixed platen gradually increases and reaches the set polishing speed when the upper fixed platen contacts the surface of the workpiece, and the workpiece is polished under this fixed value.

[0012] In some embodiments of the present invention, in the step S3, polishing liquid is further added to the surface of the workpiece. The polishing liquid includes polishing powder and water, and the mass - volume ratio of the two is 8 - 10 Kg: 60 - 80 L.

[0013] In some embodiments of the present invention, the mass - volume ratio of polishing powder and water is 8 Kg: 60 L.

[0014] In some embodiments of the present invention, the polishing powder is cerium oxide.

[0015] In some embodiments of the present invention, the particle size of the polishing powder is 1.2 - 1.7 um.

[0016] In some embodiments of the present invention, when polishing the surface of the workpiece, the upper fixed platen rotates clockwise, the lower fixed platen rotates counterclockwise, and the outer gear ring and the inner gear ring both rotate counterclockwise.

[0017] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0018] The polishing method provided by the present invention is used to polish the workpiece after grinding. A double - sided polishing machine is used for polishing treatment, and its treatment effect is high. The flatness and parallelism of the workpiece surface are good, the light transmittance of the workpiece surface is high, and the transparency of the upper and lower surfaces of the workpiece is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant information can also be obtained based on these drawings.

[0020] Figure 1 is the process flow chart of double - sided polishing in the embodiments of the present invention;

[0021] Figure 2 is the physical diagram of the workpiece after processing in Example 1;

[0022] Figure 3 is the physical diagram of the workpiece after processing in Example 2. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely below. For those not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. For reagents or instruments not specified by the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0024] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to specific embodiments.

[0025] An embodiment of the present invention provides a processing method for a double-sided polishing machine, including the following steps:

[0026] S1: Place the fixture gear on the lower fixed disk and engage it with the sun gear and the internal gear ring respectively;

[0027] S2: Place the workpiece to be polished in the fixture gear and drive the upper fixed disk to descend;

[0028] S3: Set the polishing parameters; start the double-sided polishing machine to polish the surface of the workpiece;

[0029] S4: After the polishing is completed, take out the workpiece and clean the surface of the workpiece.

[0030] In some embodiments of the present invention, in the step S2, the polishing parameters are: the pressure applied by the upper fixed disk is 45 - 100 g / cm 2 , the polishing time is 1 - 99 min, and the spindle speed is 35 - 45 rpm. It should be noted that the total pressure F applied by the upper fixed disk = N × P × S, where N is the number of workpieces, P is the processing pressure (pressure) specified in the workpiece polishing process, and S is the contact area of a single workpiece.

[0031] In some embodiments of the present invention, in the step S3, polishing liquid is also added to the surface of the workpiece. The polishing liquid includes polishing powder and water, and the mass-volume ratio of the two is 8 - 10 Kg: 60 - 80 L.

[0032] In some embodiments of the present invention, the mass-volume ratio of the polishing powder and water is 8 Kg: 60 L.

[0033] In some embodiments of the present invention, the polishing powder is cerium oxide.

[0034] In some embodiments of the present invention, the particle size of the polishing powder is 1.2 - 1.7 um.

[0035] In some embodiments of the present invention, when polishing the surface of the workpiece, the upper fixed disk rotates clockwise, the lower fixed disk rotates counterclockwise, and the outer gear ring and the internal gear ring both rotate counterclockwise.

[0036] The features and performance of the present invention will be further described in detail below in conjunction with embodiments.

[0037] Embodiment 1

[0038] The surface of the quartz product workpiece is polished by the following method:

[0039] I. Installation steps of the ring system:

[0040] 1. Turn off the operation switch of the water pump.

[0041] 2. Place the water pump in the grinding fluid tank.

[0042] 3. Insert the return pipe into the hole of the grinding fluid tank.

[0043] 4. Check whether the filter mesh bag (150 meshes) is damaged.

[0044] 5. Put the small mesh bag (150 meshes) on the liquid outlet pipe.

[0045] 6. Put the filter mesh bag on the liquid return port of the drainage device.

[0046] 7. Confirm the operation status of the water pump.

[0047] II. Preparation of the polishing fluid:

[0048] 1. Thoroughly clean the grinding fluid barrel and the water pump of the mixer.

[0049] 2. Add 60 L of filtered water and 8 kg of polishing powder into the barrel, and then continuously stir with a mixer.

[0050] 3. Add polishing powder before each cleaning and correction of the PAT (polishing pad), 1.5 - 2.0 kg each time.

[0051] Parameter setting of the double-sided polishing machine: the pressure of the upper fixed disk is 80 g / cm 2 , the polishing time is 30 min, and the spindle speed is 35 rpm.

[0052] III. Operation steps of the double-sided polishing machine processing method:

[0053] 1. Raise the upper fixed disk to the high position and lock the safety device;

[0054] 2. The internal gear ring is in the processing position, and the mixer and the water pump are in the operating state;

[0055] 3. Check whether the teeth of the fixture gear are damaged, and place the fixture gear flat on the lower fixed disk with the same interval;

[0056] 4. The fixture gear meshes with the sun gear and the internal gear ring.

[0057] 5. Place multiple workpieces into the fixture gear separately, taking care that the workpieces do not collide with each other;

[0058] 6. Rotate the lower turntable and confirm that all products are completely in the fixture holes;

[0059] 7. Press the "Emergency Descent" button on the turntable to unlock and lower the upper turntable; Align the driving lug with the groove of the driving sleeve;

[0060] 8. Press the "Slow Descent" button on the turntable. At this time, the turntable buffers and descends to the bottom.

[0061] 9. Press the operation button and slowly adjust the speed to the specified speed; Perform double-sided polishing. At this time, the upper turntable rotates clockwise, the lower turntable rotates counterclockwise, and both the outer gear ring and the inner gear ring rotate counterclockwise. Pay attention to the operating condition of the machine. If there is any abnormal sound, immediately stop it urgently;

[0062] 10. During the processing, always pay attention to the operating condition of the machine and the change of the flow rate of the grinding fluid.

[0063] 11. After the processing is completed, the water pump will automatically shut down.

[0064] 12. Press the "Slow Rise" button on the turntable to raise the turntable.

[0065] 13. Remove the products and wash them.

[0066] Example 2

[0067] Polish the surface of the quartz product workpiece according to the following method:

[0068] I. Installation steps of the ring system:

[0069] 1. Turn off the operation switch of the water pump.

[0070] 2. Place the water pump into the grinding fluid tank.

[0071] 3. Insert the return pipe into the hole of the grinding fluid tank.

[0072] 4. Check whether the filter mesh bag (150 meshes) is damaged.

[0073] 5. Put the small mesh bag (150 meshes) on the liquid outlet pipe.

[0074] 6. Put the filter mesh bag on the liquid return port of the drainage device.

[0075] 7. Confirm the operating condition of the water pump.

[0076] II. Preparation of the polishing fluid:

[0077] 1. Thoroughly clean the grinding fluid barrel, mixer and water pump.

[0078] 2. Add 60L of filtered water and 10kg of polishing powder into the bucket, and then keep stirring with a blender.

[0079] 3. Add polishing powder before each cleaning and correction of the PAT (polishing pad), 1.5 - 2.0kg each time.

[0080] Double-sided polishing machine parameter setting: Upper fixed platen pressure 100g / cm 2 , polishing time 40min, spindle speed 35rpm.

[0081] III. Operation steps of the double-sided polishing machine processing method:

[0082] 1. Raise the upper fixed platen to the high position and lock it with the safety device;

[0083] 2. The internal gear ring is in the processing position, and the blender and water pump are in operation;

[0084] 3. Check whether the teeth of the fixture gear are damaged, and place the fixture gear flat on the lower fixed platen with the same interval;

[0085] 4. The fixture gear meshes with the sun gear and the internal gear ring.

[0086] 5. Place multiple workpieces into the fixture gear respectively, taking care that the workpieces do not collide with each other;

[0087] 6. Rotate the lower fixed platen to confirm that all products are completely in the fixture holes;

[0088] 7. Press the "rapid descent" button on the fixed platen to unlock and lower the upper fixed platen; Align the drive lug with the groove of the drive sleeve;

[0089] 8. Press the "slow descent" button on the fixed platen. At this time, the fixed platen buffers and descends to the bottom.

[0090] 9. Press the operation button and slowly adjust the speed to the specified speed; Conduct double-sided polishing treatment. At this time, the upper fixed platen rotates clockwise, the lower fixed platen rotates counterclockwise, and the external gear ring and internal gear ring both rotate counterclockwise. Pay attention to the operation status of the machine. If there is any abnormal sound, stop immediately;

[0091] 10. During the processing, always pay attention to the operation of the machine and the change of the grinding fluid flow rate.

[0092] 11. After the processing is completed, the water pump will automatically shut down.

[0093] 12. Press the "slow rise" button on the fixed platen to raise the fixed platen.

[0094] 13. Remove the products and wash them.

[0095] Comparative Example 1

[0096] The workpiece is polished using a single-sided polishing machine. The polishing liquid and polishing time are the same as those in Example 1.

[0097] Comparative Example 2

[0098] The difference from Example 1 is that in this comparative example, during double-sided polishing, the pressure applied by the upper fixed plate is 30 g / cm 2 . All the other steps are the same as those in Example 1.

[0099] Experimental Example

[0100] The workpieces of Examples 1-2 and Comparative Examples 1-2 are detected, and the results are shown in Table 1.

[0101] Table 1 Surface properties of each workpiece

[0102] Flatness (mm) Parallelism Transmittance Example 1 0.02 0.02 93％ Example 2 0.02 0.02 93％ Comparative Example 1 0.05 0.05 89％ Comparative Example 2 0.03 0.03 90％

[0103] It can be concluded from Table 1 that for the workpieces after double-sided polishing in Examples 1-2, the flatness and parallelism of the workpiece surface are good, the light transmittance of the workpiece surface is high, and the transparency of the upper and lower surfaces of the workpiece is high. Compared with Examples 1-2, for the workpieces in Comparative Example 1, a single-sided polishing machine is used to polish the workpieces, and the light transmittance and surface properties of the workpieces are worse than those in the comparative example. In Comparative Example 2, for the workpieces of the same batch, a double-sided polishing machine is used for polishing, but during polishing, the pressure of the upper fixed plate is small, and the polishing degree of the workpiece surface is insufficient under the same polishing time, resulting in worse flatness and parallelism of the workpiece surface than those in Example 1, and the light transmittance of the workpiece is also poor.

[0104] In summary, the double-sided polishing method provided by the present invention is used for polishing the workpiece after grinding and polishing. The double-sided polishing machine is used for polishing treatment, and the treatment effect is good. By setting reasonable polishing parameters, the flatness and parallelism of the workpiece surface can be good, the light transmittance of the workpiece surface is high, and the transparency of the upper and lower surfaces of the workpiece is high.

[0105] The embodiments described above are some embodiments of the present invention, not all of them. The detailed description of the embodiments of the present invention is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

Claims

1. A processing method for a double-sided polishing machine, characterized in that, Including the following steps: S1: Place the fixture gear on the lower fixed plate and mesh it with the sun gear and the internal gear ring respectively; S2: Place the workpiece to be polished in the fixture gear and drive the upper fixed plate to descend; S3: Set the polishing parameters; Start the double-sided polishing machine to polish the surface of the workpiece; S4: After the polishing is completed, take out the workpiece and clean the surface of the workpiece.

2. The double-sided polishing machine processing method according to claim 1, wherein In the step S3, the polishing parameters are: the pressure applied by the upper fixed platen to the workpiece is 45 - 100 g / cm 2 , the polishing time is 1 - 99 min, and the spindle speed is 35 - 45 rpm.

3. The double-sided polishing machine processing method according to claim 1, characterized in that In the step S3, it also includes adding polishing liquid to the surface of the workpiece. The polishing liquid includes polishing powder and water, and the mass-volume ratio of the two is 8-10 Kg: 60-80 L.

4. The double-sided polishing machine processing method according to claim 3, wherein The mass-volume ratio of the polishing powder and water is 8 Kg: 60 L.

5. The double-sided polishing machine processing method according to claim 3, wherein The polishing powder is cerium oxide.

6. The double-sided polishing machine processing method according to claim 3, characterized in that, The particle size of the polishing powder is 1.2-1.7 um.

7. The double-sided polishing machine processing method according to claim 1, characterized in that, When polishing the surface of the workpiece, the upper fixed plate rotates clockwise, the lower fixed plate rotates counterclockwise, and the external gear ring and the internal gear ring both rotate counterclockwise.

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