Braid track feeding device

Abstract

According to the braid track feeding device provided by the invention, the four sides of the feeding hole position of the carrier tape pocket are designed for guiding and limiting according to the appearance characteristics of a semiconductor device, and if the semiconductor device is inclined or deviated when being transferred to the feeding hole position of the carrier tape pocket, the semiconductor device can be conveyed to the feeding hole position of the carrier tape pocket; when vertically entering the carrier tape material pocket, the semiconductor device enters the carrier tape material pocket after being guided, limited and corrected in angle by four sides, so that the pin deformation of the semiconductor device is avoided; besides, in a visual inspection station, black mechanical limiting of semiconductor device letters and pins is avoided, and the extending direction of the mechanical limiting is consistent with the direction of a braid track, so that the situation that products in the carrier tape rub the limiting to cause abnormity when the carrier tape runs is ensured; moreover, due to the fact that black mechanical limiting does not have the fuzzy problem caused by light reflection and abrasion, the visual system can accurately detect the printing and pin size of the semiconductor device, it is ensured that the abnormal semiconductor device can be accurately removed, and the quality of the semiconductor device is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor device packaging, and in particular to a taping track feeding device. Background Art

[0002] Currently, after the semiconductor device is tested, it needs to be loaded into a tape before shipment. When loading the semiconductor device into the tape, a motor or a cylinder is usually used to press down the suction nozzle, and the suction nozzle moves downward under force to press the semiconductor device into the tape. However, when the semiconductor device on the suction nozzle is transported to the feeding port position above the tape by a large turntable, the position of the semiconductor device often shifts. At this time, when the suction nozzle presses down, the pins of the semiconductor device will touch the edge of the carrier tape, causing the pins of the semiconductor device to deform.

[0003] In order to avoid the pin deformation caused by the position shift of the semiconductor device, the traditional method is to open track holes of the same size on the sapphire track at the carrier tape feeding position according to the size of the carrier tape pocket. The semiconductor device enters the carrier tape pocket through the track hole, and when the semiconductor device enters the pocket, it will be visually inspected at the next station. This station mainly detects the printing on the surface of the semiconductor device and the length difference of the pins.

[0004] However, when the position of the semiconductor device shifts during operation, the pins of the semiconductor device will rub against the edge of the track feeding hole when entering the carrier tape pocket, still causing the pins of the semiconductor device to deform. In addition, due to the reflection of the existing sapphire track and the wear of the lens, the light source is reflected, resulting in poor camera imaging. Eventually, when the printing of the semiconductor device is abnormal or the pins are abnormal, they cannot be effectively removed. Therefore, how to avoid the pin deformation of the semiconductor device caused by the position shift of the semiconductor device is an urgent problem to be solved. Summary of the Invention

[0005] The present application aims to at least solve the technical problems existing in the prior art. For this reason, in the first aspect of the present application, a taping track feeding device is proposed, which is characterized in that it includes a taping track base, a feeding cover plate, a visual inspection cover plate and a guiding cover plate. The feeding cover plate, the visual inspection cover plate and the guiding cover plate are respectively fixedly connected to the taping track base; Four limiting edges with inclined guides are provided on the feeding cover plate, and an anti-reflection coating is sprayed on the visual inspection cover plate.

[0006] In a possible implementation manner, the feeding cover plate is composed of a rectangular parallelepiped steel. An inlet hole is provided in the center of the rectangular parallelepiped steel, and four limiting edges with inclined guides are provided around the inlet hole.

[0007] In a possible implementation manner, the size of the rectangular parallelepiped steel is , and the size of the inlet hole is .

[0008] In a possible implementation, the visual inspection cover plate is made of rectangular steel, and an anti-reflective coating is sprayed on the rectangular steel. The anti-reflective coating is a black coating.

[0009] In a possible implementation, the dimensions of the rectangular steel are .

[0010] In a possible implementation, a detection hole is provided at the center of the rectangular steel. The detection hole is set according to the printing position and pin position of the semiconductor device.

[0011] In a possible implementation, mechanical limit edges are provided on the visual inspection cover plate along the running direction of the carrier tape.

[0012] In a possible implementation, the guiding cover plate is made of rectangular steel with dimensions of .

[0013] In a possible implementation, the guiding cover plate is provided with openings.

[0014] In a possible implementation, the taping track base is made of rectangular steel with dimensions of .

[0015] The technical solutions provided by the embodiments of the present application can at least achieve the following beneficial effects: The taping track feeding device provided by the embodiment of the present application includes a taping track base, a feeding cover plate, a vision inspection cover plate, and a guiding cover plate. The feeding cover plate, the vision inspection cover plate, and the guiding cover plate are respectively fixedly connected to the taping track base. Four limiting edges with inclined guides are provided on the feeding cover plate, and an anti-reflection coating is sprayed on the vision inspection cover plate. In this solution, four limiting edges with inclined guides for the loading pocket feeding holes of the carrier tape are designed according to the shape characteristics of the semiconductor device. When the semiconductor device is tilted or offset in position when it reaches the loading pocket feeding hole position through transfer, the semiconductor device will be corrected in angle by the four limiting edges with inclined guides when vertically entering the loading pocket, thus avoiding deformation of the semiconductor device pins. In addition, at the vision inspection station, by avoiding the black mechanical limits of the semiconductor device printing and pins, and the extending direction of the mechanical limit is consistent with the taping track direction, it is ensured that the products in the carrier tape will not be scratched by the limit during operation, causing abnormalities. And because there are no problems of reflection and blurring caused by wear on the black mechanical limit, the vision system can accurately detect the printing and pin dimensions of the semiconductor device, ensuring that abnormal semiconductor devices can be accurately removed, improving the quality of semiconductor devices. At the same time, by improving from the root causes of the abnormal generation and outflow of semiconductor device pins, the situation of abnormal semiconductor device pins being sent to the client is completely solved, improving the product quality, and the equipment risks can be identified in advance. And the cost of this solution is extremely low, which can reduce the equipment R & D cost and improve the processing quality of semiconductor devices. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the overall structure of a taping track feeding device provided by the embodiment of the present application; Figure 2 It is a schematic diagram of a taping track base provided by the embodiment of the present application; Figure 3 It is a schematic diagram of a feeding cover plate provided by the embodiment of the present application; Figure 4 It is a schematic diagram of a vision inspection cover plate provided by the embodiment of the present application; Figure 5 It is a schematic diagram of a guiding cover plate provided by the embodiment of the present application.

[0017] Description of the Reference Numerals: 1 - Taping track base; 2 - Feeding cover plate; 3 - Vision inspection cover plate; 4 - Guiding cover plate; 5 - Carrier tape; 6 - Inspection camera; 7 - Pressing structure; 8 - Large turntable; 201 - Feeding hole; 202 - Four - side guiding limit; 301 - Inspection hole; 302 - Mechanical limit edge; 401 - Opening. Detailed Embodiment

[0018] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0019] Currently, after the semiconductor device is tested, it needs to be loaded into a tape before it can be shipped. When loading the semiconductor device into the tape, a motor or a cylinder is usually used to press down the suction nozzle, and the suction nozzle moves downward under force to press the semiconductor device into the tape. However, when the semiconductor device on the suction nozzle is transported to the feeding port position above the tape by the main turntable, the position of the semiconductor device often shifts. At this time, when the suction nozzle presses down, the pins of the semiconductor device may touch the edge of the carrier tape, resulting in deformation of the pins of the semiconductor device. For such semiconductor devices with deformed pins, the visual system of the tape often cannot effectively remove such defects due to factors such as wear and reflection of the sapphire track lens, ultimately resulting in the shipment of defective products with defective pins.

[0020] The common practice in the industry currently is to open track holes of the same size according to the size of the carrier tape pocket at the track position of the carrier tape feeding. The semiconductor device enters the carrier tape pocket through the track hole. When the position of the semiconductor device shifts during operation, the pins of the semiconductor device will rub against the edge of the track feeding hole when entering the carrier tape pocket, resulting in deformation of the pins of the semiconductor device. In addition, when the semiconductor device enters the pocket, it will be visually inspected at the next station. This station mainly detects the printing on the surface of the semiconductor device and the length difference of the pins. However, due to the reflection and wear of the sapphire track, the light source reflects, and the camera imaging is poor, ultimately making it impossible to effectively reject the semiconductor device when the printing or the pins are abnormal.

[0021] Based on this, the present application proposes a taping track feeding device. In this solution, four limiting edges with inclined guides are designed for the feeding holes of the carrier tape pocket according to the shape characteristics of semiconductor devices. When the semiconductor device is tilted or offset in position when it reaches the feeding hole position of the carrier tape pocket through transportation, the semiconductor device will have its angle corrected by the four limiting edges with inclined guides when vertically entering the carrier tape pocket, thus avoiding deformation of the semiconductor device pins. Additionally, at the vision inspection station, by avoiding the black mechanical limits of the semiconductor device printing and pins, and the extension direction of the mechanical limits is consistent with the taping track direction, it is ensured that the products in the carrier tape will not be scratched by the limits during operation, preventing abnormalities. Moreover, since there are no problems of reflection and blurring caused by wear on the black mechanical limits, the vision system can accurately detect the printing and pin dimensions of the semiconductor device, ensuring that abnormal semiconductor devices can be accurately removed, improving the quality of semiconductor devices. At the same time, by improving from the root causes of semiconductor device pin abnormalities and the reasons for their outflow, the situation of semiconductor device pin abnormalities reaching the client is completely solved, improving product quality. Also, equipment risks can be identified in advance, and the cost of this solution is extremely low, which can reduce the equipment R & D cost and improve the processing quality of semiconductor devices.

[0022] The terms used in the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. Unless otherwise defined, the technical terms or scientific terms used in the present application should have the ordinary meanings understood by those of ordinary skill in the art to which the present application pertains. The singular forms "a", "the", and "said" used in the description of the present application specification and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items. In the description of the embodiments of the present application, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the embodiments of the present application.

[0023] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the embodiments of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0024] In the embodiments of the present application, unless otherwise clearly specified and limited, terms such as "mounted", "connected", "connected to", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0025] In the embodiments of the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the embodiments of the present application are only for illustrative purposes and do not represent the only implementation manner.

[0027] The following is an exemplary description of the tape track feeding device in the embodiments of the present application in conjunction with the attached Figures 1-5 Drawings.

[0028] As Figure 1 shown, Figure 1 FIG. is a schematic diagram of the overall structure of a tape track feeding device provided by an embodiment of the present application. Please refer to Figure 1, the taping track feeding device includes a taping track base 1, a feeding cover plate 2, a vision inspection cover plate 3, and a guiding cover plate 4. The feeding cover plate 2, the vision inspection cover plate 3, and the guiding cover plate 4 are respectively fixedly connected to the taping track base 1. Four limiting edges with inclined guides are provided on the feeding cover plate 2, and an anti-reflective coating is sprayed on the vision inspection cover plate 3.

[0029] Among them, the taping track base 1 and the feeding cover plate 2 are connected together by screws, and the four limiting edges with inclined guides on the feeding cover plate 2 realize the calibration of the position of the semiconductor device.

[0030] The taping track base 1 and the vision inspection cover plate 3 are connected together by screws. The limiting and clearance positions on the vision inspection cover plate 3 realize the limitation of the semiconductor device in the track. Moreover, the anti-reflective coating sprayed on the vision inspection cover plate 3 ensures no reflection and no shooting dead angle during vision inspection, guaranteeing the imaging effect and detection accuracy. It should be noted that a dark-colored coating can be used as the anti-reflective coating here.

[0031] The taping track base 1 and the guiding cover plate 4 are connected together by screws, and the guiding cover plate 4 realizes the limitation of the semiconductor device before the carrier tape 5 enters the sealing position. Among them, the carrier tape 5 is used for packaging semiconductor devices.

[0032] Please continue to refer to Figure 1 , the taping track feeding device may further include a detection camera 6, a pressing structure 7, and a large turntable 8. Among them, the detection camera 6 is used to realize the appearance inspection of the semiconductor device. The pressing structure 7 is used to press the semiconductor device into the track. The large turntable 8 is used to realize the position transfer of the semiconductor device.

[0033] In some alternative embodiments, as Figure 2 shown, Figure 2 is a schematic diagram of a taping track base provided by an embodiment of the present application. Among them, the taping track base 1 is composed of a rectangular steel with a size of . The sufficient size can ensure the stability of the overall structure and prevent the device from deforming or twisting. And eight counterbores are made on its bottom surface to connect other cover plate devices. Here, the other cover plate devices are the feeding cover plate 2, the vision inspection cover plate 3, and the guiding cover plate 4.

[0034] Optionally, the setting positions, sizes, shapes, and other characteristics of the eight counterbores correspond to the cover plates to be fixedly connected and can be adjusted according to actual situations.

[0035] In some alternative embodiments, as Figure 3 shown, Figure 3Schematic diagram of a feeding cover plate provided by an embodiment of the present application. The feeding cover plate 2 is made of a cuboid steel. An inlet hole 201 is provided at the center of the cuboid steel. Four limiting edges 202 with inclined guides are provided around the inlet hole 201, which can also be called four-sided guiding and limiting 202. As Figure 3 , one four-sided guiding and limiting can be provided at each end of the inlet hole 201.

[0036] Optionally, the inclination angles of the four limiting edges 202 with inclined guides can be determined according to the distances from the four sides of the semiconductor device and the distances from the pins. When the distance is smaller, the inclination angle of the four-sided guiding and limiting 202 is larger; when the distance is larger, the inclination angle of the four-sided guiding and limiting 202 is smaller.

[0037] In some optional embodiments, please continue to refer to Figure 3 , the size of the cuboid steel forming the feeding cover plate 2 is , and a space is dug out at the center of the cuboid steel as the inlet hole 201 for the semiconductor device, that is, the size of the inlet hole 201 is , and the size of this inlet hole 201 is the same as the bottom size of the carrier tape pocket used for the semiconductor device.

[0038] In some optional embodiments, as Figure 4 shown, Figure 4 Schematic diagram of a vision inspection cover plate provided by an embodiment of the present application. The vision inspection cover plate 3 is made of a cuboid steel, and an anti-reflection coating is sprayed on the cuboid steel. Preferably, the anti-reflection coating is a black coating. Optionally, the black coating can be a black matte coating, that is, the black coating can be sprayed on the front and side gaps of the cuboid steel.

[0039] In some optional embodiments, please continue to refer to Figure 4 , the size of the cuboid steel forming the vision inspection cover 3 is .

[0040] In some optional embodiments, please continue to refer to Figure 4 , a detection hole 301 is provided at the center of the cuboid steel forming the vision inspection cover 3, and the detection hole 301 is set according to the printing position and pin position of the semiconductor device.

[0041] In some optional embodiments, mechanical limiting edges 302 are provided on the vision inspection cover plate 3 along the running direction of the carrier tape.

[0042] In some optional embodiments, as Figure 5 shown, Figure 5 Schematic diagram of a guiding cover plate provided by an embodiment of the present application. The guiding cover plate 4 is made of a size of It is composed of rectangular steel.

[0043] In some alternative embodiments, please continue to refer to Figure 5 , there are openings 401 provided on the guiding cover plate 4, that is, two long holes are opened on the guiding cover plate 4, which mainly play the role of limiting the carrier tape and adjusting the position of the vision inspection cover plate 3 left and right to compensate for the dimensional accuracy of the vision inspection cover plate 3.

[0044] In the actual design process, the central hole position size of the feeding cover plate 2 and the four limiting edges with inclined guides required can be designed according to the appearance size of the corresponding semiconductor device. Ensure that when the semiconductor device is fed at possible different abnormal turning angles, it is the plastic package of the semiconductor device that first contacts the four limiting edges with inclined guides. After completion, the feeding cover plate 2 is installed on the taping track base 1 with screws of model M3.

[0045] Then, the pattern of the detection hole 301 can be designed according to the printing position of the corresponding semiconductor device and the characteristics of the pin distribution. The distance between the detection hole 301 and the printing position and pins of the semiconductor device needs to be greater than 0.5 mm to prevent misdetection during detection. In addition, a mechanical limiting edge 302 needs to be reserved along the running direction of the carrier tape, and the distance from the printing position and pins of the semiconductor device needs to be greater than 0.5 mm to ensure that the semiconductor device will not rub against the detection hole 301. Finally, black paint is sprayed on the front and side gaps of the steel to prevent poor vision imaging and misdetection caused by reflection. After completion, the vision inspection cover plate 3 and the guiding cover plate 4 are installed on the taping track base 1 with screws of model M3, finally achieving high precision and high accuracy of vision inspection, eliminating the quality hidden dangers of semiconductor devices, and improving the quality of semiconductor devices.

[0046] The embodiment of the present application provides a taping track feeding device, which includes a taping track base, a feeding cover plate, a vision inspection cover plate and a guiding cover plate. The feeding cover plate, the vision inspection cover plate and the guiding cover plate are respectively fixedly connected to the taping track base. Four limiting edges with inclined guides are provided on the feeding cover plate, and an anti-reflective coating is sprayed on the vision inspection cover plate. In this solution, four limiting edges with inclined guides for the feeding holes of the carrier tape pocket are designed according to the shape characteristics of semiconductor devices. When the semiconductor device is tilted or offset in position when it reaches the feeding hole position of the carrier tape pocket through transfer, the semiconductor device will be corrected by the four limiting edges with inclined guides when vertically entering the carrier tape pocket and then enter the carrier tape pocket, thus avoiding deformation of the semiconductor device pins. In addition, at the vision inspection station, by avoiding the black mechanical limit of the semiconductor device printing and pins, and the extending direction of the mechanical limit is consistent with the taping track direction, it is ensured that the products in the carrier tape will not be scratched by the limit during operation, resulting in abnormalities. And because there are no problems of reflection and blur caused by wear on the black mechanical limit, the vision system can accurately detect the printing and pin dimensions of the semiconductor device, ensuring that abnormal semiconductor devices can be accurately removed, improving the quality of semiconductor devices. At the same time, by improving from the root causes of semiconductor device pin abnormalities and the reasons for their outflow, the situation of semiconductor device pin abnormalities being sent to the client is completely solved, improving product quality, and equipment risks can be identified in advance. And the cost of this solution is extremely low, which can reduce the equipment R & D cost and improve the processing quality of semiconductor devices.

[0047] It is easy to understand that those skilled in the art can combine, split, recombine, etc. the embodiments of the present application based on several embodiments provided by the present application to obtain other embodiments, and these embodiments do not exceed the protection scope of the present application.

[0048] The above specific implementation manners further elaborate on the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above are only the specific implementation manners of the embodiments of the present application, and are not used to limit the protection scope of the embodiments of the present application. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application shall be included in the protection scope of the embodiments of the present application.

Claims

1. A taping track feeding device, characterized in that, It includes a taping track base, a feeding cover plate, a vision inspection cover plate and a guiding cover plate. The feeding cover plate, the vision inspection cover plate and the guiding cover plate are respectively fixedly connected to the taping track base; Four limiting edges with inclined guiding are arranged on the feeding cover plate, and an anti-reflective coating is sprayed on the vision inspection cover plate.

2. The device according to claim 1, characterized in that, The feeding cover plate is made of a rectangular parallelepiped steel. An inlet hole is arranged at the center of the rectangular parallelepiped steel, and the four limiting edges with inclined guiding are arranged around the inlet hole.

3. The device according to claim 2, characterized in that, The dimensions of the rectangular parallelepiped steel are , and the dimensions of the feeding hole are .

4. The device according to claim 1, characterized in that The vision inspection cover plate is made of a rectangular parallelepiped steel, and an anti-reflective coating is sprayed on the rectangular parallelepiped steel. The anti-reflective coating is a black coating.

5. The device according to claim 4, characterized in that, The dimensions of the rectangular parallelepiped steel are .

6. The device according to claim 4 or 5, characterized in that, A detection hole is arranged at the center of the rectangular parallelepiped steel, and the detection hole is set according to the printing position and pin position of the semiconductor device.

7. The device according to claim 6, characterized in that, Mechanical limiting edges are arranged on the vision inspection cover plate along the running direction of the carrier tape.

8. The device according to claim 1, characterized in that, The guiding cover plate is made of a rectangular steel bar with dimensions of .

9. The device according to claim 8, characterized in that, Open holes are arranged on the guiding cover plate.

10. The device according to any one of claims 1-5, characterized in that, The taping track base is made of rectangular steel with dimensions of .

Images