Test method, device and equipment for collaborative acquisition of material deformation and storage medium

Abstract

The invention discloses a material deformation collaborative acquisition test method, device and equipment and a storage medium, and relates to the technical field of material testing, and the method comprises the following steps: carrying out EBSD calibration on the sample surface of a to-be-tested sample; preparing speckles on the surface of the sample and carrying out in-situ loading so as to carry out DIC determination; removing speckles on the target to-be-tested sample, and returning to execute the step of EBSD calibration based on the to-be-tested sample after speckle removal until in-situ loading of the target to-be-tested sample reaches a preset loading target; and determining an EBSD test result and a DIC test result based on the obtained measurement results of the internal grain orientation information and the material strain information of each sample to be tested. The method does not need to consider the influence of DIC on EBSD calibration, breaks through the limitation of the electron beam on the size of speckle particles or the size of a DIC observation area in EBSD calibration, and improves the test efficiency of material deformation collaborative collection.

Description

Technical Field

[0001] The present application relates to the technical field of material testing, and particularly relates to a testing method, device, equipment and storage medium for collaborative acquisition of material deformation. Background Art

[0002] In recent years, the research on the microscopic deformation coordination behavior of metal materials has become more and more in-depth. How to accurately characterize the grain strain distribution and orientation rotation inside metal materials at different scales has become a research hotspot. In addition, since it is often necessary to analyze the quantitative relationship between microscopic local strain and grain rotation, it is also required that the strain calculation method and the orientation determination method can be carried out synchronously or alternately without obvious interference with each other. Currently, the non-contact digital image correlation (DIC, Digital Image Correlation) technology is one of the best methods for measuring the evolution of strain distribution at present, and the material micro-area orientation calibration method mainly uses the electron backscatter diffraction (EBSD, Electron Back Scatter Diffraction) technology.

[0003] The principle of DIC is to divide the region of interest in the pre-deformation image into grids, and regard each sub-region as a rigid motion. Then, for each sub-region, through a certain search method, the correlation calculation is carried out according to the pre-defined correlation function, and the region with the maximum cross-correlation coefficient with this sub-region is found in the post-deformation image, that is, the position of this sub-region after deformation, and then the displacement of this sub-region is obtained. By calculating all sub-regions, the full-field deformation information can be obtained. In order to more clearly identify the sub-regions before and after deformation, it is usually necessary to prefabricate a speckle pattern with a relatively high contrast on the surface of the specimen. For example, first spray a layer of white primer on the surface of the sample, and then spray a layer of black speckle paint after it dries to form a white background black spot pattern with random distribution. By calculating the gray-scale characteristic values of the patterns of each sub-region before and after deformation, the position information of each sub-region before and after deformation can be identified, and then the local strain can be calculated.

[0004] There are various methods for producing speckle in practical application. The principle of EBSD technology is that when the incident electron beam is scattered in the crystal sample, scattered electron waves are emitted in all directions in the space. Therefore, EBSD calibration requires the sample surface to be fresh and uncontaminated. Even if a marker needs to be introduced, the marker needs to be relatively transparent to the electron beam. Therefore, several special speckle production methods have been developed, such as the gold film modification method to pre-fabricate randomly distributed nano-scale gold particles on the sample surface (the electron beam can bypass nano-scale particles), or use micro-electrolytic corrosion to etch nano-scale corrosion pits on the sample surface (the diameter of the corrosion pit is much smaller than the diameter of the electron beam, and does not significantly affect the generation of diffraction signals), or directly deposit a layer of nano-scale silica spheres on the sample surface, etc., to minimize interference with EBSD calibration. However, since the scale of gold particles, silica particles or corrosion pits needs to be controlled below tens of nanometers, this strictly limits the area range of a single DIC observation to within 10×10μm (usually requires 1500 times or more for observation). If a larger area (such as 500×500μm) is to be observed, it is necessary to photograph each sub-area in blocks and then stitch the sub-areas together, resulting in a huge workload (for example, stitching 10×10μm into 500×500μm requires at least 2500 sub-area images).

[0005] At the same time, with the development of science and technology, EBSD calibration technology has also been greatly improved, the calibration rate can reach 1000 points / second, and the single calibration range can reach 1000×2000μm (50 times magnification can be used for observation). It can be seen that when DIC and EBSD are observed simultaneously, the observation range limit of EBSD is much greater than that of DIC because pre-made speckles that do not interfere with the electron beam must be used. This limits the size range of the speckles and the single observation range of DIC. Summary of the invention

[0006] The main purpose of this application is to provide a testing method for coordinated collection of material deformation, aiming to solve the technical problem of how to remove the limitation of the electron beam on the size of speckle particles or the size of the DIC observation area in EBSD calibration.

[0007] To achieve the above objectives, the present application proposes a testing method for collaborative collection of material deformation, the testing method for collaborative collection of material deformation comprising: Electron backscatter diffraction (EBSD) calibration is performed on the sample surface of the sample to be tested to obtain the measurement result of the internal grain orientation information of the sample to be tested; Prepare speckles on the sample surface to obtain a target sample to be tested; In-situ loading is performed on the target sample to be tested to perform a digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample to be tested; Remove the speckles on the target sample to be measured, and based on the sample to be measured after speckle removal, return to perform the step of performing electron backscatter diffraction (EBSD) calibration on the surface of the sample to be measured until the in-situ loading of the target sample to be measured reaches the preset loading target; Determine the EBSD test result of the sample to be measured based on the measurement results of the internal grain orientation information of each sample to be measured, and determine the DIC test result of the sample to be measured based on the measurement results of the material strain information of each sample to be measured.

[0008] In one embodiment, the step of performing in-situ loading on the target sample to be measured for digital image correlation (DIC) measurement includes: Take a pre-deformation sample morphology image of the target sample to be measured; Apply stress to the target sample to be measured based on a preset in-situ loading task; After the target sample to be measured reaches the deformation amount specified by the in-situ loading task, take a post-deformation sample morphology image of the target sample to be measured; Perform digital image correlation (DIC) measurement based on the pre-deformation sample morphology image and the post-deformation sample morphology image.

[0009] In one embodiment, the step of determining the DIC test result of the sample to be measured based on the measurement results of the material strain information of each sample to be measured includes: For the measurement result of the material strain information of any one sample to be measured obtained, perform image coincidence processing on the pre-deformation sample morphology image corresponding to the measurement result of the material strain information of the sample to be measured and the post-deformation sample morphology image corresponding to the measurement result of the material strain information of the sample to be measured at the previous time sequence of the target time sequence to obtain the position relationship between the speckles and the sample to be measured in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the material strain information of the sample to be measured is obtained; Based on the position relationship, accumulate the measurement result of the material strain information of the sample to be measured with the measurement result of the material strain information of the sample to be measured obtained at the previous time sequence to obtain a candidate measurement result of the sample to be measured in the current time sequence, and update the measurement result of the material strain information of the sample to be measured based on the candidate measurement result; After sequentially traversing the measurement results of the material strain information of each sample to be measured, use the measurement results of the material strain information of the sample to be measured after multiple updates as the DIC test result of the sample to be measured.

[0010] In one embodiment, before the step of removing the speckles on the target sample to be measured, the method further includes: placing the target sample to be measured on a preset positioning tooling, and taking a positioning picture of the target sample to be measured, where the positioning picture includes the target sample to be measured and the positioning tooling; The step of determining the DIC test result of the sample to be measured based on the measurement results of the strain information of each sample material to be measured obtained includes: For any measurement result of the strain information of a sample material to be measured obtained, according to the positioning picture corresponding to the measurement result of the strain information of the sample material to be measured, perform position association with the positioning picture corresponding to the measurement result of the strain information of the sample material to be measured in the previous time sequence of the target time sequence, to obtain the position relationship between the speckles and the sample to be measured in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the strain information of the sample material to be measured is obtained; Based on the position relationship, add the measurement result of the strain information of the sample material to be measured to the measurement result of the strain information of the sample material to be measured obtained in the previous time sequence, to obtain a candidate measurement result of the sample to be measured in the current time sequence, and update the measurement result of the strain information of the sample material to be measured based on the candidate measurement result; After sequentially traversing the measurement results of the strain information of each sample material to be measured, use the measurement results of the strain information of the sample material to be measured after multiple updates as the DIC test result of the sample to be measured.

[0011] In one embodiment, the speckles on the target sample to be measured include multiple sets of speckles with different particle sizes, and each set of speckles is sequentially prepared on the sample surface of the sample to be measured based on the particle size from small to large; The step of in-situ loading the target sample to be measured to perform digital image correlation (DIC) measurement includes: Taking a pre-deformation sample morphology picture of the target sample to be measured at different scales, where the scale of the picture taking corresponds to the particle size of the speckles; Applying stress to the target sample to be measured based on a preset in-situ loading task; After the target sample to be measured reaches the deformation amount specified by the in-situ loading task, taking a post-deformation sample morphology picture of the target sample to be measured at different scales; Performing digital image correlation (DIC) measurement based on the pre-deformation sample morphology picture and the post-deformation sample morphology picture at any scale to obtain the measurement results of the strain information of the sample to be measured at multiple scales.

[0012] In one embodiment, the step of preparing speckles on the sample surface to obtain the target sample to be measured includes: Spray a preset speckle suspension or deposit atomized speckle particles on the surface of the sample to obtain a candidate sample to be measured, wherein the material of the speckle particles on the candidate sample to be measured is an inert material; Heat the candidate sample to be measured to obtain a target sample to be measured.

[0013] In one embodiment, the step of removing the speckles on the target sample to be measured includes: Remove the speckles on the target sample to be measured by a preset cleaning agent, ultrasonic treatment or compressed air to obtain a sample to be measured after speckle removal.

[0014] In addition, to achieve the above object, the present application also proposes a test device for collaborative acquisition of material deformation, and the test device for collaborative acquisition of material deformation includes: An EBSD calibration module for performing electron backscatter diffraction (EBSD) calibration on the surface of a sample to be measured to obtain a measurement result of the grain orientation information inside the sample to be measured; A speckle preparation module for preparing speckles on the surface of the sample to obtain a target sample to be measured; A DIC measurement module for in-situ loading the target sample to be measured to perform digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample to be measured; A speckle removal module for removing the speckles on the target sample to be measured, and based on the sample to be measured after speckle removal, returning to execute the step of performing electron backscatter diffraction (EBSD) calibration on the surface of the sample to be measured until the in-situ loading of the target sample to be measured reaches a preset loading target; A result calculation module for determining the EBSD test result of the sample to be measured based on the obtained measurement results of the grain orientation information inside each sample to be measured, and determining the DIC test result of the sample to be measured based on the obtained measurement results of the material strain information of each sample to be measured.

[0015] In addition, to achieve the above object, the present application also proposes an electronic device, and the device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the test method for collaborative acquisition of material deformation as described above.

[0016] In addition, to achieve the above object, the present application also proposes a storage medium, the storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium, and when the computer program is executed by a processor, the steps of the test method for collaborative acquisition of material deformation as described above are implemented.

[0017] One or more technical solutions proposed by the present application have at least the following technical effects: The present application first performs electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested, obtains the measurement result of the grain orientation information inside the sample to be tested, and performs EBSD calibration before performing digital image correlation (DIC) measurement, without considering the influence of the speckle on the quality of EBSD calibration during DIC measurement; then, speckles are prepared on the sample surface to obtain the target sample to be tested, and the target sample to be tested is in-situ loaded to perform DIC measurement, so as to obtain the measurement result of the material strain information of the sample to be tested, thereby greatly reducing the electron beam-related limitations on the preparation of speckles during DIC measurement; then, the speckles on the target sample to be tested are removed, and based on the sample to be tested after the speckles are removed, the step of performing EBSD calibration on the sample surface of the sample to be tested is returned until the in-situ loading of the target sample to be tested reaches the preset loading target, thereby eliminating the interference of the speckles on EBSD calibration, ensuring the accuracy and reliability of EBSD calibration, enabling EBSD calibration and DIC measurement to be alternately performed multiple times on the same sample, and realizing continuous tracking and measurement of the grain orientation and strain information of the material at different deformation stages; finally, based on the obtained measurement results of the grain orientation information inside each sample to be tested, the EBSD test result of the sample to be tested is determined, and based on the obtained measurement results of the material strain information of each sample to be tested, the DIC test result of the sample to be tested is determined. Through the integration and analysis of multiple measurement data, the microscopic structure changes and strain distribution of the material at different loading stages can be more comprehensively and accurately reflected.

[0018] In summary, the present application first performs EBSD calibration on the sample to be tested, then prefabricates DIC speckles after the calibration is completed for in-situ loading and synchronous DIC strain measurement, and then completely cleans the prefabricated speckles to restore the fresh surface for EBSD calibration after deformation, repeating this process until all tests are completed. Since the speckles are completely removed after DIC measurement, there is no impact on subsequent EBSD calibration, and there is no need to consider the influence of DIC on the quality of EBSD calibration. Therefore, speckle materials of various particle sizes can be selected, breaking through the limitations of the electron beam on the particle size of the speckles or the size of the DIC observation area in EBSD calibration, thereby improving the test efficiency of the collaborative acquisition of material deformation. Description of the Drawings

[0019] The drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0020] Figure 1 It is a schematic flowchart provided for the first embodiment of the test method for collaborative acquisition of material deformation of the present application; Figure 2Schematic flowchart of the test method for collaborative acquisition of material deformation provided in Embodiment 1 of the present application; Figure 3 Schematic diagram of the strain accumulation scenario of the test method for collaborative acquisition of material deformation provided in Embodiment 1 of the present application; Figure 4 Schematic diagram of the sample state change of the test method for collaborative acquisition of material deformation provided in Embodiment 1 of the present application; Figure 5 Schematic flowchart provided in Embodiment 2 of the test method for collaborative acquisition of material deformation of the present application; Figure 6 Schematic diagram of the speckle particle size of the test method for collaborative acquisition of material deformation provided in Embodiment 2 of the present application; Figure 7 Schematic flowchart of the test method for collaborative acquisition of material deformation provided in Embodiment 2 of the present application; Figure 8 Schematic diagram of the module structure of the test device for collaborative acquisition of material deformation in the embodiment of the present application; Figure 9 Schematic diagram of the device structure of the hardware operating environment involved in the test method for collaborative acquisition of material deformation in the embodiment of the present application. Detailed implementation manners

[0021] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application. For a better understanding of the technical solutions of the present application, the following will be described in detail in conjunction with the accompanying drawings of the specification and specific implementation manners.

[0022] The main solution of the embodiment of the present application is: performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested to obtain the measurement result of the grain orientation information inside the sample to be tested; preparing speckles on the sample surface to obtain the target sample to be tested; performing in-situ loading on the target sample to be tested for digital image correlation (DIC) measurement to obtain the measurement result of the material strain information of the sample to be tested; clearing the speckles on the target sample to be tested, and based on the sample to be tested after speckle clearing, returning to execute the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested until the in-situ loading of the target sample to be tested reaches the preset loading target; determining the EBSD test result of the sample to be tested based on the obtained measurement results of the grain orientation information inside each sample to be tested, and determining the DIC test result of the sample to be tested based on the obtained measurement results of the material strain information of each sample to be tested.

[0023] Since the current strictly limits the area range of a single DIC observation within 10×10μm, if a larger area needs to be observed, it is necessary to photograph each sub-region in blocks and then splice the sub-regions, resulting in a huge workload. At the same time, with the development of technology, the EBSD calibration technology has also been greatly improved. The calibration rate can reach 1000 points / second, and the single calibration range can reach 1000×2000μm. It can be seen that when synchronously observing DIC and EBSD, since it is necessary to use prefabricated speckles that do not interfere with the electron beam, the observation range limit of EBSD is much larger than that of DIC. This not only limits the size range of the speckles but also limits the single observation range of DIC.

[0024] This application provides a solution. First, perform EBSD calibration on the sample to be tested. After the calibration is completed, prefabricate DIC speckles for in-situ loading and synchronously perform DIC strain measurement. Then, completely wash off the prefabricated speckles to restore the fresh surface and perform EBSD calibration after deformation. Repeat this process until all tests are completed. Since the speckles will be completely removed after DIC testing, it has no impact on subsequent EBSD calibration, and there is no need to consider the impact of DIC on the quality of EBSD calibration. Therefore, various particle size speckle materials can be selected, breaking through the limitations of the electron beam on the speckle particle size or the DIC observation area size in EBSD calibration, thereby improving the test efficiency of collaborative acquisition of material deformation.

[0025] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program running functions, such as a tablet computer, a personal computer, a mobile phone, etc., or an electronic device capable of implementing the above functions. Hereinafter, an electronic device will be taken as an example to illustrate this embodiment and the following embodiments.

[0026] Based on this, the embodiments of this application provide a test method for collaborative acquisition of material deformation, referring to Figure 1 , Figure 1 is a schematic flowchart of the first embodiment of the test method for collaborative acquisition of material deformation in this application.

[0027] In this embodiment, the test method for collaborative acquisition of material deformation includes steps S10 to S50: Step S10, perform electron backscatter diffraction EBSD calibration on the sample surface of the sample to be tested to obtain the measurement result of the grain orientation information inside the sample to be tested; It should be noted that the measurement result of the grain orientation information inside the sample to be measured refers to the detailed data of the crystallographic orientation of each grain inside the sample to be measured obtained through EBSD calibration, including parameters such as the azimuth angle and inclination angle of the grain, which can reflect the microstructure and crystallographic characteristics of the material, and can be used to analyze the texture, grain boundary characteristics, etc. of the material, providing basic information for studying the mechanical properties and deformation behavior of the material.

[0028] It can be understood that during the existing test process of coordinated acquisition of material deformation, the EBSD calibration requires that the sample surface be fresh and pollution-free. Therefore, in the EBSD calibration, the electron beam will impose corresponding restrictions on the size of the speckle particles or the size of the DIC observation area during the DIC measurement process. Otherwise, the previously prepared speckles will affect the quality of the EBSD calibration. Therefore, by performing EBSD calibration before the DIC measurement in step S10, the problem that the EBSD calibration must face a sample to be measured with speckles can be avoided, that is, the influence of the speckles on the quality of the EBSD calibration during the DIC measurement is avoided, ensuring the accuracy and reliability of the initial EBSD calibration, and thus preferentially obtaining the initial orientation information of the grains inside the sample to be measured, providing basic data for subsequent research on the change of grain orientation and its relationship with strain during the microscopic deformation process of the material.

[0029] Exemplarily, first, prepare the sample of the metal material to be measured into a size and shape suitable for EBSD testing. Usually, it is necessary to perform mechanical polishing, electrolytic polishing, vibratory polishing, or argon ion polishing on the sample surface, etc., to obtain a fresh sample surface without obvious residual stress, so as to ensure that the electron beam can clearly interact with the atomic planes in the crystal and generate high-quality diffraction patterns. Then install the sample on the sample stage of a scanning electron microscope (SEM, Scanning Electron Microscope), and use the EBSD detector to align with the sample surface. In the SEM, by scanning the electron beam to irradiate the sample surface, electron backscatter diffraction signals are excited, and these signals are received by the EBSD detector and converted into diffraction pattern images. Use special EBSD analysis software to analyze the collected diffraction pattern images, identify the grain orientation information corresponding to each diffraction pattern, and finally obtain the orientation distribution map of the grains inside the sample to be measured, that is, complete the EBSD calibration process and obtain the measurement result of the grain orientation information inside the sample to be measured.

[0030] Step S20, prepare speckles on the surface of the sample to obtain the target sample to be measured; It should be noted that the target sample to be measured refers to the sample after speckles are prepared on the surface of the original sample to be measured. This sample meets the requirement that the sample surface for EBSD calibration is fresh and pollution-free before speckle preparation, and has the speckle pattern required for DIC measurement after speckle preparation.

[0031] It can be understood that since the DIC technique requires a speckle pattern with a relatively high contrast on the sample surface to identify sub-regions before and after deformation, so as to accurately calculate local strain, performing step S20 can overcome the limitation of finding markers that not only meet the DIC speckle requirements but also do not cause obvious interference to EBSD calibration in traditional methods, reduce the stringent requirements for the material and size of the speckles. For example, it is not necessary to strictly limit the speckle particles to below the scale of dozens of nanometers. By preparing appropriate speckles, the DIC technique can be successfully applied to measure the strain information of the sample to be tested, providing data support for further analysis of the deformation behavior of the material.

[0032] Exemplarily, taking the spray-coated layered speckles as an example, first select a suitable inert material as the speckle particles, such as alumina, and prepare it into a particle suspension with a certain particle size range, for example, particles with a particle size between 1 - 10 microns. Then use a spray gun to evenly spray this speckle suspension on the surface of the sample that has been calibrated by EBSD. When spraying, control parameters such as the pressure, distance, and spraying time of the spray gun to make the speckle particles form a randomly distributed and clearly contrasted speckle pattern on the sample surface. After spraying, place the sample in an oven to dry, so that the speckle particles firmly adhere to the sample surface, thereby obtaining the target sample to be tested. It should be noted that during the spraying process, it is necessary to ensure that the distribution of the speckle particles is random enough and the density is appropriate, so as to accurately identify and track the changes in the speckle pattern in subsequent DIC measurements.

[0033] In a feasible implementation manner, step S20 may include steps S21~S22: Step S21, spraying a preset speckle suspension or depositing atomized speckle particles on the surface of the sample to obtain a candidate sample to be tested, wherein the material of the speckle particles on the candidate sample to be tested is an inert material; It should be noted that the preset speckle suspension can be other speckle suspensions such as a monolayer graphene sheet suspension or an alumina suspension; the candidate sample to be tested refers to the sample that has not been heat-treated after spraying the preset speckle suspension or depositing atomized speckle particles on the surface of the original sample to be tested. At this time, a speckle pattern has been prepared on the surface of the sample, but since the binding between the speckle particles and the sample surface is not strong enough, it cannot be directly used for in-situ loading and testing, and further heat treatment is required to obtain the target sample to be tested.

[0034] It can be understood that since the DIC technique requires a speckle pattern with a relatively high contrast on the sample surface to identify sub-regions before and after deformation, so as to accurately calculate local strain, and choosing an inert material as the speckle particles is to avoid chemical reactions between the speckle particles and the sample surface or interference with subsequent EBSD calibration. Therefore, step S21 is carried out. By spraying a preset speckle suspension with an inert material or depositing atomized speckle particles on the sample surface, it is possible to avoid the problem that the speckle particles may interact with the sample surface in the traditional method and affect the EBSD calibration signal. At the same time, it avoids the situation that the speckle pattern falls off or deforms during the loading process due to inappropriate speckle material, affecting the accuracy of DIC measurement. It can quickly and conveniently prepare a speckle pattern that meets the requirements of DIC measurement, and the use of inert material ensures that the speckle particles have good stability and reliability during subsequent loading and testing processes, providing a good basis for subsequent DIC measurement and EBSD calibration.

[0035] Step S22, heat the candidate sample to be measured to obtain a target sample to be measured.

[0036] It can be understood that since the sprayed speckle particles need to be further fixed on the sample surface to ensure that the speckle pattern does not shift or fall off during subsequent in-situ loading and testing processes, thus ensuring the accuracy of DIC measurement. At the same time, the speckle particles also tend to agglomerate on the sample surface, thus affecting the quality of the speckle particles. Therefore, step S22 is carried out. By auxiliary heating to accelerate the volatilization of the solvent, it avoids the problem that the speckle particles shift or fall off due to weak bonding during the loading process, resulting in inaccurate DIC measurement data or inability to perform effective analysis, and also reduces the agglomeration tendency of the speckle particles, thus forming a stable and clear speckle pattern, meeting the requirements of DIC measurement, and at the same time not affecting subsequent EBSD calibration, ensuring the smooth progress of the entire testing process and improving the reliability and accuracy of the test results.

[0037] In this embodiment, by spraying a preset speckle suspension or depositing atomized speckle particles on the sample surface, and choosing an inert material as the speckle particles, and then heating the candidate sample to be measured, it avoids problems such as difficulty in preparing a high-quality speckle pattern in the traditional method and interference of the speckle with subsequent EBSD calibration. At the same time, it solves the defects of weak bonding between the speckle particles and the sample surface and the agglomeration tendency of the speckle particles, realizes the formation of a speckle pattern with high contrast, uniform distribution and stability on the sample surface, ensures that the speckle does not fall off or shift during subsequent testing processes, provides a reliable basis for DIC measurement, and at the same time does not affect the accuracy of EBSD calibration, thereby improving the reliability of the test results.

[0038] Step S30: In-situ load the target sample to be measured for Digital Image Correlation (DIC) measurement to obtain the measurement result of the strain information of the sample material to be measured. It should be noted that in-situ loading means that during the test, an external load is applied to the sample to cause it to deform, and at the same time, the response information of the sample, such as strain and displacement, is monitored and collected in real time during the loading process. In this test method, the real-time changes of the material during the stress application process can be observed, which helps to deeply understand the deformation mechanism and mechanical behavior of the material. The measurement result of the strain information of the sample material to be measured refers to the strain distribution of each point inside the sample to be measured during the loading process obtained through DIC measurement, including parameters such as linear strain and shear strain, which can reflect the deformation degree and distribution law of the material when stressed, and can be used to analyze the stress-strain relationship and local deformation behavior of the material.

[0039] It can be understood that since it is necessary to monitor the strain distribution of the material in real time during the loading process to study the microscopic deformation coordination behavior of the material during actual stress application, step S30 is carried out, which realizes the real-time and dynamic acquisition of the strain distribution information inside the material during the loading process of the material, providing a powerful means for studying the microscopic deformation mechanism of the material.

[0040] Exemplarily, the target sample to be measured with speckles prepared is installed on an in-situ loading device, such as a special in-situ tensile stage, etc., to ensure that the sample can be stably subjected to an external load during the loading process. At the same time, an image acquisition device such as a high-speed camera or a CCD camera is used to take real-time pictures of the speckle pattern on the surface of the sample to record the initial morphology image of the sample before loading. Then, according to a preset loading program, such as applying tensile, compressive or bending loads to the sample at a certain strain rate or stress increment to make the sample deform. During the loading process, at certain time intervals or deformation amounts, the current morphology image of the sample is taken through the image acquisition device. The image sequences before and after these deformations are input into the DIC analysis software, and the software will calculate the displacement and strain distribution of each speckle area on the surface of the sample during the deformation process according to the preset correlation functions and search algorithms, and finally obtain the measurement result of the strain information of the sample material to be measured at different loading stages, including data such as strain distribution maps and strain-deformation curves.

[0041] In a feasible implementation manner, the step of in-situ loading the target sample to be measured in step S30 for Digital Image Correlation (DIC) measurement may include steps A31 to A34: Step A31: Take a pre-deformation sample morphology image of the target sample to be measured. It should be noted that the pre-deformation sample morphology image refers to the surface image of the target sample to be measured before in-situ loading, which records the initial position and morphology of the speckle pattern and is the reference image for DIC measurement.

[0042] It can be understood that since the DIC technique needs to compare the images before and after deformation to calculate the strain, and the pre-deformation sample morphology image is the basic data for subsequent analysis, performing step A31 can avoid the problem of being unable to accurately calculate the strain distribution after deformation due to the lack of the initial state image. Thus, by recording the initial state of the sample, it provides a reference for subsequent strain calculation and ensures the accuracy of the measurement results.

[0043] Step A32, applying stress to the target sample to be measured based on a preset in-situ loading task; It should be noted that the in-situ loading task refers to a plan or procedure for applying specific stress to the sample during the test, including the loading method (such as tension, compression), loading rate, and target deformation amount, etc., aiming to simulate the actual use conditions of the material.

[0044] It can be understood that since it is necessary to simulate the stress situation of the material in actual use to study its deformation behavior under different stress conditions, performing step A32 can achieve precise control of loading on the sample, simulate the real working conditions, and obtain the deformation response of the material under different stresses.

[0045] Step A33, after the target sample to be measured reaches the deformation amount specified by the in-situ loading task, taking a post-deformation sample morphology image of the target sample to be measured; It should be noted that the post-deformation sample morphology image refers to the surface image of the target sample to be measured after it reaches the deformation amount specified by the in-situ loading task, which records the position and morphological changes of the speckle pattern after deformation and is used to calculate the strain by comparing with the pre-deformation image.

[0046] It can be understood that since it is necessary to obtain the state of the sample at a specific deformation amount for comparison with the initial state to calculate the strain, performing step A33 can avoid overloading that may cause sample damage or excessive deformation, affecting the validity of the data. Thus, it can accurately capture the state of the sample after the expected deformation and provide accurate comparison data for strain calculation.

[0047] Step A34, performing digital image correlation (DIC) measurement based on the pre-deformation sample morphology image and the post-deformation sample morphology image.

[0048] It can be understood that since the DIC technique calculates displacement and strain by comparing the images before and after deformation, and these two images are the basis for calculation, performing step A34 can achieve full-field strain measurement, provide detailed strain distribution information, and help understand the deformation mechanism of the sample material.

[0049] Exemplarily, the morphology images of the sample before and after deformation are collected and stored at high resolution, ensuring that the illumination conditions, camera position, and parameters of the images remain consistent during the two shootings. Then, the collected images are grayscale processed to remove the interference of color information and highlight the gray features of the speckle pattern. Next, on the morphology image of the sample before deformation, the region of interest is divided into grids, and each grid sub-region is regarded as an independent analysis unit. Generally, the size of the sub-region is between 30×30 and 100×100 pixels, specifically determined according to the particle size of the speckles and the required measurement accuracy. For each sub-region, a speckle pattern with high contrast and uniqueness is selected as the template region. In the morphology image of the sample after deformation, with the template region as the center, a search is carried out within a certain range, and a predefined correlation function (such as the normalized cross-correlation function) is used to calculate the similarity between the template region and the sub-regions within the search region. Through an iterative search algorithm (such as the multi-resolution search algorithm, pyramid search algorithm, etc.), the search range is gradually narrowed to improve the search efficiency and accuracy, and the corresponding sub-region with the maximum cross-correlation coefficient with the template region is found to determine the position of the sub-region after deformation. The displacement vector of each sub-region is recorded, that is, the position change of the center of the sub-region after deformation relative to the center of the sub-region before deformation. Finally, using the displacement-strain relationship formula, the strain components at each position of the sample during the deformation process are calculated according to the displacement field, including plane strain (ε_x, ε_y) and shear strain (γ_xy), etc., and visualization results such as strain distribution contour maps and displacement vector maps are generated to intuitively display the deformation of the sample during the loading process and provide detailed data for subsequent analysis.

[0050] In this embodiment, by photographing the morphology images of the sample before and after deformation and applying stress in combination with a preset in-situ loading task, and using the digital image correlation DIC measurement technology, problems such as large measurement errors caused by sensor contact, easy interference with the deformation process, and inability to obtain full-field strain information in traditional strain measurement methods are avoided, and accurate, full-field, and non-contact measurement of the strain distribution of materials during the force-deformation process is realized, thereby dynamically tracking the microscopic deformation behavior of materials.

[0051] Step S40: Remove the speckles on the target sample to be measured, and based on the sample to be measured after the speckles are removed, return to execute the step of performing electron backscatter diffraction EBSD calibration on the surface of the sample to be measured until the in-situ loading of the target sample to be measured reaches a preset loading target; It should be noted that the preset loading target refers to the target value of the loading degree or deformation amount set according to the research purpose and material characteristics before the test. When this target value is reached, the loading and testing are stopped. The preset loading target can be a certain stress level, strain level, or deformation amount, etc., which is used to control the test process and obtain the performance information of the material at a specific deformation degree.

[0052] It is understandable that, after a DIC measurement is completed, the speckles on the sample surface will interfere with subsequent EBSD calibration, affecting the accuracy and reliability of EBSD calibration. To continue with EBSD calibration, it is necessary to remove the speckles to restore the fresh surface of the sample. Therefore, step S40 is carried out, which eliminates the interference of the speckles on EBSD calibration, ensures the quality and accuracy of EBSD calibration, enables multiple alternating EBSD calibrations and DIC measurements on the same sample, realizes continuous tracking and measurement of the grain orientation and strain information of the material at different deformation stages, and can comprehensively understand the microstructure evolution and deformation behavior of the material, providing richer and more accurate information for studying the mechanical properties of the material and optimizing the material preparation process.

[0053] Exemplarily, after an in-situ loading and DIC measurement are completed, it is necessary to remove the speckles on the sample surface for subsequent EBSD calibration. For example, the target sample to be measured can be immersed in a specific organic solvent, such as acetone or alcohol, etc. These solvents can dissolve the adhesive between the speckle particles and the sample surface or loosen the speckle particles. After soaking for a certain period of time, the sample is cleaned using an ultrasonic cleaning device. The vibration of the ultrasonic waves helps to thoroughly remove the residual speckle particles on the sample surface. After cleaning, the sample surface is rinsed with deionized water and then dried. At this time, the sample surface returns to a state close to the initial fresh state. The sample is reinstalled on the sample stage of the SEM, and the previous EBSD calibration process is repeated, that is, the grain orientation information inside the deformed sample can be re-measured, and the measurement result of the grain orientation information of the sample at this deformation stage can be obtained, providing data support for subsequent analysis. In addition, the preset loading target can be that the sample reaches a certain strain level, such as a tensile strain of 5% or the sample exhibits specific macroscopic deformation phenomena, such as obvious yield or necking phenomena, etc. During the in-situ loading process, the deformation of the sample is monitored in real time, and when the preset loading target is reached, the loading operation is immediately stopped.

[0054] In a feasible implementation manner, the step of removing the speckles on the target sample to be measured in step S40 may include step S41: Step S41, removing the speckles on the target sample to be measured by a preset cleaning agent, ultrasonic treatment, or compressed air to obtain the sample to be measured after the speckles are removed.

[0055] It is understandable that after the DIC measurement is completed, the speckle pattern on the sample surface will affect the accuracy and reliability of subsequent EBSD calibration. Therefore, it must be removed. However, common removal methods may have additional effects on the sample surface. Therefore, performing step S41 can avoid the problem that the sample with speckles may generate additional scattering signals or block the diffraction signals of the crystal under electron beam irradiation, resulting in inaccurate or incomplete diffraction patterns received by the EBSD detector, affecting the measurement accuracy of the grain orientation information, and the problem of damage to the sample surface caused by inappropriate removal methods. Thus, after the speckles are removed, the sample surface returns to a state close to the initial state, ensuring that the sample surface is free of speckle interference before each EBSD calibration, enabling multiple alternating EBSD calibrations and DIC measurements on the same sample, realizing continuous tracking and measurement of the material at different deformation stages, and thus comprehensively understanding the microscopic deformation behavior and structural evolution process of the material.

[0056] Step S50: Determine the EBSD test result of the sample to be tested based on the measurement results of the grain orientation information inside each sample to be tested obtained, and determine the DIC test result of the sample to be tested based on the measurement results of the material strain information of each sample to be tested obtained.

[0057] It should be noted that the EBSD test result of the sample to be tested refers to the final result regarding the microscopic tissue structure, texture, grain boundary characteristics, etc. of the sample obtained after analysis and processing of the measurement results of the grain orientation information inside the sample to be tested obtained through multiple EBSD calibrations, which can comprehensively reflect the crystallographic characteristics and microscopic structure changes of the material at different deformation stages; the DIC test result of the sample to be tested refers to the final result regarding the strain distribution and deformation behavior of the sample during the loading process obtained after processing such as accumulation, update, and analysis of the measurement results of the material strain information of the sample to be tested obtained through multiple DIC measurements, and can be used to evaluate the mechanical properties of the material, analyze local strain concentration phenomena, etc.

[0058] It is understandable that when the in-situ loading reaches the preset loading target, it indicates that the test of the material at the designed deformation level has been completed. At this time, it is necessary to integrate and analyze the data obtained during the entire test process to obtain the final test result. Therefore, performing step S50 can avoid unnecessary repeated tests and data accumulation, reduce the test workload and time cost, improve the test efficiency. At the same time, through the integration and analysis of multiple measurement data, it can more comprehensively and accurately reflect the microscopic structure changes and strain distribution of the material at different loading stages, providing a more reliable basis for evaluating the performance and quality of the material, guiding the application and improvement of the material.

[0059] Exemplarily, data obtained from multiple previous EBSD calibrations and DIC measurements are collected. For the determination of the EBSD test results, the measurement results of the grain orientation information obtained at different deformation stages are integrated, and the evolution law of the grain orientation during the loading process is analyzed. For example, phenomena such as the rotation angle of the grains, orientation aggregation or dispersion are observed, and an evolution map of the grain orientation distribution is drawn, so as to determine the EBSD test results of the sample to be tested. For the determination of the DIC test results, the measurement results of the strain information at each loading stage are accumulated and analyzed in chronological order or according to the amount of deformation, an evolution curve or image sequence of the strain distribution is generated, and the maximum strain, average strain in different regions of the material and the distribution of the strain concentration region are counted, etc. Finally, the DIC test results of the sample to be tested are obtained, providing a basis for comprehensively evaluating the micro-deformation behavior and mechanical properties of the material.

[0060] In a feasible implementation manner, the step of determining the DIC test results of the sample to be tested based on the measurement results of the strain information of each sample to be tested material obtained in step S50 may include steps A51 to A53: Step A51, for the measurement result of the strain information of any sample to be tested material obtained, image coincidence processing is performed on the pre-deformation sample morphology map corresponding to the measurement result of the strain information of the sample to be tested material and the post-deformation sample morphology map corresponding to the measurement result of the strain information of the sample to be tested material at the previous time sequence of the target time sequence, to obtain the position relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the strain information of the sample to be tested material is obtained; It should be noted that the position relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence refers to the displacement and deformation of the speckle relative to the surface of the sample to be tested in the corresponding loading step and the previous step. This position relationship reflects the local deformation of the material during the loading process and is the basic data for calculating the strain.

[0061] It can be understood that in order to accurately integrate and compare the strain information at different time sequences, it is necessary to clarify the displacement of the speckle on the sample surface, which requires determining the position relationship of the speckle at different time sequences. Therefore, performing step A51 can avoid the error of strain information matching caused by the change of the speckle position, prevent deviation during the data accumulation process, so as to achieve accurate tracking of the speckle position, ensure the accurate correspondence of the strain information, and provide a reliable basis for subsequent strain accumulation and data integration.

[0062] Exemplarily, retrieve the pre-deformation sample morphology image corresponding to the measurement result of the strain information of the current sample to be measured from the storage device. This image is obtained when no stress is applied and contains the initial position and morphological information of the speckle pattern. At the same time, obtain the post-deformation sample morphology image corresponding to the measurement result of the strain information of the sample to be measured obtained in the previous time sequence (i.e., the previous loading step). This image reflects the position change of the speckles on the sample after experiencing the loading in the previous time sequence. Then, use image processing software (such as MATLAB or specialized DIC analysis software) to overlap these two images, identify the speckle feature points in the two images through feature matching algorithms (such as Scale-Invariant Feature Transform (SIFT) or Oriented FAST and Rotated BRIEF (ORB), etc.), and calculate the displacement vector between them, so as to determine the positional relationship of the speckles relative to the sample to be measured in the current time sequence and the previous time sequence, that is, the displacement and deformation of the speckles on the sample surface. For example, when analyzing the strain situation during the tensile process of a certain metal material, by comparing the initial morphology image and the image after deformation in the previous time sequence, calculate the displacement of each feature point in the speckle pattern after loading, and clarify the specific position change of the speckles with the deformation of the sample, providing an accurate position correspondence for subsequent strain accumulation.

[0063] Step A52, based on the positional relationship, accumulate the measurement result of the strain information of the sample to be measured with the measurement result of the strain information of the sample to be measured obtained in the previous time sequence, obtain the candidate measurement result of the sample to be measured in the current time sequence, and update the measurement result of the strain information of the sample to be measured based on the candidate measurement result; It should be noted that the candidate measurement result refers to the temporary result obtained after accumulating the strain information of the current time sequence and the previous time sequence, and is used to update and correct the strain data to ensure its accuracy and continuity.

[0064] It can be understood that since the strain of the material is a gradually cumulative process and it is necessary to accumulate the strain information of different time sequences to reflect the overall deformation situation of the material during the loading process, so performing step A52 can avoid one-sided understanding of the overall deformation situation of the material caused by only considering the strain information of a single time sequence, prevent untimely or inaccurate data update, thereby realizing the dynamic update and accumulation of strain information, and further more truly reflecting the deformation process of the material during the loading process, improving the accuracy and integrity of the test results.

[0065] Exemplarily, after obtaining the positional relationship between the speckles and the sample to be measured in the target time sequence and the previous time sequence, first read the measurement result of the strain information of the current time sequence from the database (for example, the strain distribution matrix calculated by the DIC technology, including the strain values of each measurement point). Then, according to the previously determined positional relationship, map these strain values to the coordinate system of the previous time sequence. The measurement result of the strain information of the previous time sequence is also represented in the same way. Next, accumulate the strain matrix of the current time sequence and the strain matrix of the previous time sequence through matrix operations (such as simple matrix addition or addition operation considering weights, and the weights can be determined according to factors such as the loading step or time interval) to obtain a preliminary accumulated strain matrix, that is, the candidate measurement result. For example, if the strain matrix of the target time sequence is [[ε11, ε12], [ε21, ε22]], and the strain matrix of the previous time sequence is [[ε'11, ε'12], [ε'21, ε'22]], then the candidate measurement result matrix may be [[ε11 + ε'11, ε12 + ε'12], [ε21 + ε'21, ε22 + ε'22]] (assuming equal weights and direct addition). Finally, compare and analyze this candidate measurement result with the original strain information of the current time sequence, check whether the accumulated strain values are within a reasonable range (such as whether they conform to the strain hardening or softening law of the material), and update the measurement result of the strain information of the target time sequence, replacing it with the more accurate and comprehensive strain data after accumulation, so as to reflect the strain accumulation effect of the material during the loading process.

[0066] Step A53, after successively traversing the measurement results of the strain information of each sample material to be measured, use the measurement result of the strain information of the sample material to be measured updated multiple times as the DIC test result of the sample to be measured.

[0067] It can be understood that since it is necessary to integrate the strain information of all different time sequences to form a complete description of the strain distribution and deformation process in order to comprehensively analyze the mechanical behavior of the material, step A53 is carried out to avoid the problem of unintegrated scattered data, prevent inaccurate judgment of the material deformation mechanism caused by the lack of overall analysis, so as to realize the comprehensive strain analysis of the material during the loading process, provide a detailed strain distribution and development process, and provide a strong basis for studying the mechanical properties of the material and optimizing the design.

[0068] Exemplarily, after completing a full loading cycle (including loading steps of multiple time sequences), the strain information of all time sequences is summarized. Starting from the first time sequence, the measured results of the updated strain information of each time sequence are taken out in turn. These results have been processed by accumulation and update with the strain information of the previous time sequence and are stored in a data structure (such as a list or an array). For example, for a metal material sample that has undergone 10 time sequences of loading, we sequentially obtain the updated strain data from time sequence 1 to time sequence 10. Then, these data can be integrated. It can be to arrange the strain values of each measurement point in all time sequences in order to form a complete strain-time sequence data set; or it can be to calculate statistical features such as the mean, maximum value, and minimum value of the strain of each measurement point to reflect the overall strain behavior of the material during the loading process. During the integration process, visualization tools (such as Origin or Paraview) can also be used to plot these data into a sequence of strain contour maps or strain-time curves to intuitively display the strain changes of the material at different positions and different times. Finally, this integrated data set and the corresponding visualization results are determined as the DIC test results of the sample to be tested, which are used to comprehensively analyze the deformation mechanism and performance of the material during the loading process.

[0069] In this embodiment, by adopting technical means of image coincidence processing and data accumulation and update, the measurement errors and data one-sidedness problems caused by the change of speckle position and single-time-sequence strain information are avoided, the accurate accumulation and integration of strain information are realized, and the deformation of the material during the loading process is comprehensively reflected.

[0070] In another feasible embodiment, before step S40, step S401 may further be included: Step S401: Place the target sample to be tested on a preset positioning tooling and take a positioning picture of the target sample to be tested, where the positioning picture includes the target sample to be tested and the positioning tooling. It should be noted that the positioning picture refers to an image containing the target sample to be tested and the positioning tooling, which is used to determine the position and orientation of the sample at different shooting time points, provide a stable reference framework, and ensure the comparability of the images.

[0071] It can be understood that since the sample to be measured needs to be removed from the tensile testing machine during the speckle removal process and then reinstalled in the tensile testing machine for DIC measurement, it is necessary to ensure the accurate positioning of the target sample to be measured during multiple shootings and different loading stages, so as to accurately correlate the material strain information at different time points. The positioning tooling can provide a stable reference frame. Therefore, by performing step S401, it is possible to avoid errors in image matching and strain calculation caused by the position change of the sample at different shooting time points, thereby achieving the accurate positioning of the target sample to be measured, ensuring that the images before and after deformation can be compared and analyzed in the same coordinate system, and improving the accuracy of strain measurement.

[0072] Exemplarily, prepare a high-precision positioning tooling, such as a fixture with a V-groove, and place the target sample to be measured (assumed to be a small metal specimen) into the V-groove to ensure that the specimen is stable and fixed in position in the fixture. Then, use a high-speed camera to shoot the specimen and the positioning tooling from directly above to obtain a clear positioning picture. This picture not only contains the initial position information of the speckles on the specimen surface but also the relative position relationship between the specimen and the positioning tooling, such as the specific placement angle and position of the specimen in the V-groove. The features of the positioning tooling (such as the edges of the V-groove) are clearly visible in the picture, providing a stable reference mark for subsequent image processing. The positioning picture obtained in this way can ensure that the position change of the specimen during the subsequent loading process can be accurately tracked.

[0073] The step of determining the DIC test result of the sample to be measured based on the measurement results of the material strain information of each sample to be measured described in step S50 may include steps B51 to B53: Step B51, for the measurement result of the material strain information of any one sample to be measured obtained, perform position correlation on the positioning picture corresponding to the measurement result of the material strain information of the sample to be measured and the positioning picture corresponding to the measurement result of the material strain information of the sample to be measured in the previous time sequence of the target time sequence, to obtain the position relationship between the speckles and the sample to be measured in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the material strain information of the sample to be measured is obtained; It can be understood that since it is necessary to determine the position change of the speckles relative to the sample at different loading stages to accurately calculate the strain information, so by performing step B51, it is possible to avoid errors in strain calculation caused by unclear speckle position changes, thereby achieving precise tracking of the speckle position changes and ensuring the accuracy of the strain information.

[0074] Exemplarily, assume that for the measurement result of the strain information of the sample material to be measured at the current time sequence, we have its corresponding positioning picture (an image containing the specimen and the positioning tooling taken after applying a certain stress). At the same time, we also have the positioning picture of the previous time sequence (i.e., the previous tensile stage). First, use an image processing software (such as MATLAB) to read these two positioning pictures and extract the feature points therein, such as the corner points of the positioning tooling and the marking points on the edge of the specimen. Then, by calculating the position changes of these feature points in the two pictures, use geometric transformation methods such as affine transformation or perspective transformation to determine the position relationship between the speckle and the sample to be measured in the current time sequence and the previous time sequence. Specifically, it is to calculate the displacement vectors of the speckle pattern on the surface of the specimen, and these vectors reflect the local deformation conditions of each part of the specimen during the tensile process, providing an accurate position correspondence for subsequent strain accumulation.

[0075] Step B52: Based on the position relationship, accumulate the measurement result of the strain information of the sample material to be measured with the measurement result of the strain information of the sample material to be measured obtained in the previous time sequence to obtain a candidate measurement result of the sample to be measured at the current time sequence, and update the measurement result of the strain information of the sample material to be measured based on the candidate measurement result; It can be understood that since the strain of the material accumulates gradually, it is necessary to accumulate the strain information at different time points to reflect the true deformation condition of the material. Therefore, performing step B52 can avoid a one-sided understanding of the overall deformation condition of the material caused by only considering the strain information of a single time sequence, thereby realizing the dynamic update and accumulation of the strain information to more truly reflect the deformation process of the material during the loading process.

[0076] Exemplarily, accumulate the measurement result of the strain information at the current time sequence (such as the strain field data calculated by the DIC technology, including the strain values of each measurement point) with the measurement result of the strain information at the previous time sequence. The specific operation is as follows: Align the strain matrix of the previous time sequence (a two-dimensional array containing the strain values of each region of the specimen) with the strain matrix of the current time sequence according to the position relationship of the speckle, and then perform element-by-element addition. For example, if the strain at a certain point in the previous time sequence is ε1 and the strain at this point in the current time sequence is ε2, the accumulated strain is ε1 + ε2. In this way, a candidate measurement result matrix is obtained. Next, we compare this candidate measurement result with the strain result measured directly by DIC at the current time sequence to check whether the accumulated strain value is within a reasonable range (such as whether it conforms to the non-linear deformation characteristics of the material). If it is reasonable, update the measurement result of the strain information at the current time sequence with the accumulated candidate measurement result to ensure that it reflects the true strain accumulation condition of the material during the loading process.

[0077] Step S53: After successively traversing the measurement results of the strain information of each sample material to be measured, use the measurement results of the strain information of the sample material to be measured after multiple updates as the DIC test result of the sample to be measured.

[0078] It can be understood that since it is necessary to integrate the strain information of all different time sequences to form a complete description of the strain distribution and deformation process, performing Step B53 can avoid the problem of data dispersion and non-integration, and at the same time prevent inaccurate judgment of the material deformation mechanism caused by the lack of overall analysis, realizing a comprehensive strain analysis of the material during the loading process, and further providing a detailed strain distribution and development process.

[0079] Exemplarily, after completing the multi-stage loading experiment on a metal material specimen, the measurement results of the strain information after accumulation and update at each time sequence have been collected. Starting from the first time sequence in the initial stage of the test, the updated strain data at each time sequence are taken out in turn. These data have considered the strain accumulation effect of the previous time sequence and ensured the accuracy of the position through the association with the positioning pictures. Then, these data are integrated into a three-dimensional array, where two dimensions represent the positions on the surface of the specimen, and the third dimension represents the change of the strain value with the loading time sequence. In addition, we also used professional visualization software (such as Tecplot or Paraview) to plot these data into a sequence of strain nephograms and strain-time curves. For example, a series of color nephograms showing the change of strain at different parts of the specimen with the increase in the number of loading times, and a line graph of the strain value at the key measurement points changing with time are generated. These integrated data and visualization results finally constitute the DIC test result of the metal material specimen, comprehensively showing the strain distribution and development process of the specimen during the loading process, and providing a detailed basis for the subsequent material property analysis.

[0080] In this embodiment, by using a positioning tooling to assist in taking positioning pictures and combining position association and data accumulation and update, the strain information matching error and data incoherence problem caused by the sample position offset and the change of the speckle position are avoided, realizing the precise accumulation and integration of the material strain information, and thus accurately reflecting the overall deformation behavior of the material during the loading process.

[0081] This embodiment provides a test method for collaborative acquisition of material deformation. First, EBSD calibration is performed on the sample to be tested. After the calibration is completed, DIC speckles are prefabricated for in-situ loading, and DIC strain measurement is carried out synchronously. Then, the prefabricated speckles are completely washed off to restore the fresh surface for EBSD calibration after deformation. This process is repeated until all tests are completed. Since the speckles are completely removed after DIC testing, there is no impact on subsequent EBSD calibration, and there is no need to consider the influence of DIC on the quality of EBSD calibration. Therefore, speckle materials of various particle sizes can be selected, breaking through the limitations of the electron beam on the speckle particle size or the DIC observation area size in EBSD calibration, thereby improving the test efficiency of collaborative acquisition of material deformation.

[0082] Exemplarily, to facilitate understanding of the implementation process of the test method for collaborative acquisition of material deformation in this embodiment, please refer to Figure 2 , Figure 2 A schematic diagram of the brief process of a test method for collaborative acquisition of material deformation is provided. Specifically: First, mechanical polishing, electrolytic polishing, vibratory polishing, argon ion polishing, etc. are required on the sample surface to obtain a fresh and stress-free sample surface. Subsequently, EBSD calibration or SEM morphology imaging is performed in the electron microscope chamber. After the EBSD calibration is completed, the sample is taken out of the electron microscope chamber, and a monolayer graphene sheet suspension (or other speckle suspensions such as alumina suspension, or directly deposit atomized speckle particles on the sample surface) is sprayed on its surface. Auxiliary heating can be used if necessary to accelerate the volatilization of the solvent and reduce the agglomeration tendency of the speckle particles. Subsequently, (quasi-)in-situ loading is carried out, and DIC measurement is performed synchronously. After a single loading is completed, the sample can be placed on a positioning fixture to take a speckle morphology image (i.e., a positioning image, or directly take an overall morphology image of the sample, etc.) to accurately mark the position information of the speckle sub-region on the sample surface. Then, the speckle particles are washed off with alcohol, acetone, or other cleaning agents that do not have an additional impact on the sample surface. Ultrasonic treatment or compressed air can be used as an auxiliary cleaning method if necessary. The cleaned sample continues a new round of EBSD calibration or SEM imaging. Finally, using the positioning image, according to the principle that the strains calculated from the same position but different speckles can be accumulated, referring to Figure 3 , the results of DIC strain calculations at different stages are accumulated (i.e., εtotal = ε1 + ε2), that is, the DIC calculation results at the same position or the sub-region numbers are directly associated according to the position coordinates, thereby restoring the local strain evolution process of the entire deformation stage of the sample. It is also possible to directly calculate the position relationship of the sample part in the speckle images of the two previous and subsequent stages, establish an indirect position relationship between the front and back speckles, and achieve strain accumulation. Figure 3 In

[0083] Further, the change in the state of the sample to be measured can be referred to Figure 4 .

[0084] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar content as that in the above-mentioned Embodiment 1 can be referred to the above introduction and will not be described in detail hereinafter. On this basis, please refer to Figure 5 , the speckles on the target sample to be measured include multiple sets of speckles under different particle sizes, and each set of speckles is sequentially prepared on the sample surface of the sample to be measured based on the particle size from small to large; The step of in-situ loading the target sample to be measured in step S30 for digital image correlation (DIC) measurement may further include steps B31 to B34: Step B31, photograph the pre-deformation sample morphology of the target sample to be measured at different scales, wherein the scale of photographing corresponds to the particle size of the speckles; It can be understood that, in order to obtain the initial state information at different scales to correspond to the subsequent strain analysis at different scales, so step B31 is performed, which can avoid the problem of mismatched initial information caused by scale differences, thereby providing accurate basic data for multi-scale strain analysis and supporting the subsequent multi-scale DIC measurement.

[0085] Exemplarily, the speckle production link of the single-set speckle experiment process is changed to first spray (or prefabricate) speckles with a finer particle size (such as 50 nm silica particles), and then spray sparse speckles with a coarser particle size (such as 10 μm graphene sheets). During the DIC photographing process, photograph the pre-deformation sample morphology of the local (5000 times) fine speckles at the gap between the (50 times) coarse speckles and the coarse speckles, which can be referred to Figure 6 . It should be noted that when photographing, it is necessary to ensure that the photographing optical path is coaxial.

[0086] Step B32, apply stress to the target sample to be measured based on a preset in-situ loading task; Step B33, after the target sample to be measured reaches the deformation amount specified by the in-situ loading task, photograph the post-deformation sample morphology of the target sample to be measured at different scales; It can be understood that, in order to record the post-deformation state at different scales to compare with the initial state and perform strain analysis, so step B33 is performed, which can avoid the problem of mismatched post-deformation information caused by inconsistent scales, thereby providing detailed post-deformation data for multi-scale strain analysis and ensuring the comprehensiveness and accuracy of subsequent strain calculations.

[0087] Exemplarily, using the same high-resolution microscope camera system as before deformation, the morphology maps of the deformed samples are taken at the same magnification (such as 50 times and 5000 times). Ensure that the shooting conditions (such as lighting, camera position, and focal length) are the same as those during the pre-deformation shooting, so as to accurately record the deformation of the speckle pattern at different scales. These morphology maps of the deformed samples will correspond one by one to the pre-deformation images, providing the necessary data for subsequent multi-scale DIC measurements.

[0088] Step B34, perform digital image correlation (DIC) measurement based on the pre-deformation sample morphology map and the post-deformation sample morphology map at any scale to obtain the measurement results of the strain information of the sample material to be measured at multiple scales.

[0089] It can be understood that since it is necessary to comprehensively consider information at different scales to fully understand the deformation mechanism of the material, performing B34 can avoid one-sided understanding of the material deformation behavior caused by only considering a single scale, prevent incomplete data, and thus achieve a comprehensive analysis of the strain distribution of the material at different scales, providing more complete and detailed deformation information.

[0090] Exemplarily, after taking the morphology maps of the pre-deformation and post-deformation samples, import these images into professional DIC analysis software (such as VIC-3D or Ncorr). For each scale (such as 50 times and 5000 times magnification), select the corresponding pre-deformation and post-deformation images for analysis respectively. Set appropriate parameters in the software, such as the subset size (adjusted according to the speckle particle size, for example, a smaller subset size for 1-micron speckles and a larger subset size for 10-micron speckles), the step size, and the type of correlation function. Through the calculation of the software, the strain distribution maps of the specimen at each scale are obtained, including information such as plane strain and shear strain. Finally, integrate and compare the strain results at different scales, analyze the deformation behavior and strain distribution characteristics of the material at different scales, and provide detailed data support for the study of the micro-deformation mechanism of the material.

[0091] In this embodiment, by adopting multi-scale shooting combined with DIC measurement, it avoids the problems of being unable to comprehensively capture the strain information of different microstructural levels of the material at a single scale and the limitations of traditional strain measurement methods, realizes the accurate measurement and analysis of the strain distribution of the material at different scales, and provides detailed data for the study of the multi-scale micro-deformation behavior of the material.

[0092] Exemplarily, to help understand the implementation process of the test method for collaborative acquisition of material deformation obtained by combining this embodiment with the above Embodiment 1, please refer to Figure 7 , Figure 7A schematic diagram of the brief process of a test method for collaborative acquisition of material deformation is provided. Specifically, the test method for collaborative acquisition of material deformation for the AZ91 magnesium alloy to be tested is as follows: (1) Cut the as-cast AZ91 sample into a double-gauge tensile specimen with a thickness of 0.5 mm. Successively use sandpapers with grit sizes from 150 to 7000# to polish the surface of the sample. Subsequently, electrochemically polish the sample with an electrochemically polishing solution at low temperature to eliminate the residual stress on the sample surface.

[0093] (2) Use an EBSD probe in a field emission electron microscope to perform large-area low-magnification (50x) EBSD calibration on the surface of the undeformed sample to obtain the grain orientation information inside the sample, that is, the measurement result of the grain orientation information inside the sample to be tested.

[0094] (3) After taking out the sample, first use a 50-nm silica suspension diluted 50 times and fully dispersed to treat the surface of the specimen. Specifically, drop a drop of the suspension on the surface of the sample, wait for 2 seconds, then quickly rinse it with slow running water for 1 minute, and then quickly dry it with a cold air gun to obtain a prefabricated speckle for high-resolution DIC, that is, the candidate sample to be tested.

[0095] (4) Take about 0.1 g of graphene flakes with a diameter of about 10 μm and add them to 50 ml of alcohol, and ultrasonically disperse them fully. Subsequently, add them to the liquid storage tank of the spray gun. Place the sample on an 80°C heating stage, and spray the graphene suspension onto the surface of the sample with the spray gun for only 1 second each time. After the heat of the heating stage quickly evaporates the alcohol solvent, repeat spraying the graphene suspension until the required speckle density is reached to obtain the target sample to be tested.

[0096] (4) Place the sample in the field emission scanning electron microscope chamber and take a high-resolution (5000x) morphology image of the area covered with silica particles in the specified area 1, that is, the morphology image of the sample before deformation.

[0097] (5) After completing the high-resolution shooting, take out the sample, load it back into the tensile testing machine, and use a high-power industrial CCD camera to take pictures of the change in the speckle displacement on the surface of the sample during the tensile process. Stop loading after reaching the specified deformation amount, remove the specimen, and then load it into the field emission electron microscope to take pictures of the morphological changes in the specified area 1 after deformation, that is, the morphology image of the sample after deformation.

[0098] (6) Put the photographed specimen into a plastic test tube filled with alcohol, and use an ultrasonic cleaner to clean the specimen for a certain period of time.

[0099] (7) Put the cleaned sample back into the field emission electron microscope chamber and continue with the EBSD calibration after deformation.

[0100] (8) Summarize the data, cross - compare the changes in grain orientation before and after deformation and the differences in strain distribution at different scales, and obtain the EBSD test results and DIC test results of the sample to be tested.

[0101] This application also provides a test device for collaborative acquisition of material deformation. Please refer to Figure 8 , the test device for collaborative acquisition of material deformation includes: An EBSD calibration module 10, used to perform electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested, and obtain the measurement result of the grain orientation information inside the sample to be tested; A speckle preparation module 20, used to prepare speckles on the sample surface to obtain the target sample to be tested; A DIC measurement module 30, used to perform in - situ loading on the target sample to be tested for digital image correlation (DIC) measurement, and obtain the measurement result of the material strain information of the sample to be tested; A speckle removal module 40, used to remove the speckles on the target sample to be tested, and based on the sample to be tested after speckle removal, return to execute the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested until the in - situ loading of the target sample to be tested reaches the preset loading target; A result calculation module 50, used to determine the EBSD test result of the sample to be tested based on the obtained measurement results of the grain orientation information inside each sample to be tested, and determine the DIC test result of the sample to be tested based on the obtained measurement results of the material strain information of each sample to be tested.

[0102] Optionally, the DIC measurement module 30 is further used for: Taking a pre - deformation sample morphology image of the target sample to be tested; Applying stress to the target sample to be tested based on a preset in - situ loading task; After the target sample to be tested reaches the deformation amount specified by the in - situ loading task, taking a post - deformation sample morphology image of the target sample to be tested; Performing digital image correlation (DIC) measurement based on the pre - deformation sample morphology image and the post - deformation sample morphology image.

[0103] Optionally, the result calculation module 50 is further used for: For any obtained measurement result of the material strain information of the sample to be tested, perform image coincidence processing on the pre - deformation sample morphology image corresponding to the measurement result of the material strain information of the sample to be tested and the post - deformation sample morphology image corresponding to the measurement result of the material strain information of the sample to be tested at the previous time sequence of the target time sequence, to obtain the positional relationship between the speckles and the sample to be tested in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the material strain information of the sample to be tested is obtained; Based on the position relationship, accumulate the measurement result of the strain information of the sample material to be measured with the measurement result of the strain information of the sample material to be measured obtained in the previous time sequence, to obtain a candidate measurement result of the sample to be measured in the current time sequence, and update the measurement result of the strain information of the sample material to be measured based on the candidate measurement result; After sequentially traversing the measurement results of the strain information of each sample material to be measured, use the measurement results of the strain information of the sample material to be measured after multiple updates as the DIC test result of the sample to be measured.

[0104] Optionally, before the step of removing the speckles on the target sample to be measured, it further includes: placing the target sample to be measured on a preset positioning tooling, and taking a positioning picture of the target sample to be measured, where the positioning picture includes the target sample to be measured and the positioning tooling; The result calculation module 50 is further configured to: For any measurement result of the strain information of the sample material to be measured obtained, perform position association on the positioning picture corresponding to the measurement result of the strain information of the sample material to be measured with the positioning picture corresponding to the measurement result of the strain information of the sample material to be measured in the previous time sequence of the target time sequence, to obtain the position relationship between the speckles and the sample to be measured in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the strain information of the sample material to be measured is obtained; Based on the position relationship, accumulate the measurement result of the strain information of the sample material to be measured with the measurement result of the strain information of the sample material to be measured obtained in the previous time sequence, to obtain a candidate measurement result of the sample to be measured in the current time sequence, and update the measurement result of the strain information of the sample material to be measured based on the candidate measurement result; After sequentially traversing the measurement results of the strain information of each sample material to be measured, use the measurement results of the strain information of the sample material to be measured after multiple updates as the DIC test result of the sample to be measured.

[0105] Optionally, the speckles on the target sample to be measured include multiple sets of speckles with different particle sizes, and each set of speckles is sequentially prepared on the sample surface of the sample to be measured from small to large particle size; The DIC measurement module 30 is further configured to: Take a pre-deformation sample morphology picture of the target sample to be measured at different scales, where the scale of the photographing corresponds to the particle size of the speckles; Apply stress to the target sample to be measured based on a preset in-situ loading task; After the target sample to be measured reaches the deformation amount specified by the in-situ loading task, take a post-deformation sample morphology picture of the target sample to be measured at different scales; Perform digital image correlation (DIC) measurement based on the sample morphology map before deformation and the sample morphology map after deformation at any scale to obtain the measurement results of the strain information of the sample to be measured at multiple scales.

[0106] Optionally, the speckle preparation module 20 is further configured to: Spray a preset speckle suspension or deposit atomized speckle particles on the surface of the sample to obtain a candidate sample to be measured, wherein the material of the speckle particles on the candidate sample to be measured is an inert material; Heat the candidate sample to be measured to obtain a target sample to be measured.

[0107] Optionally, the speckle removal module 40 is further configured to: Remove the speckles on the target sample to be measured by a preset cleaning agent, ultrasonic treatment, or compressed air to obtain a sample to be measured after speckle removal.

[0108] The test device for collaborative acquisition of material deformation provided by the present application adopts the test method for collaborative acquisition of material deformation in the above embodiment, and can solve the technical problem of how to relieve the limitation of the electron beam on the size of speckle particles or the size of the DIC observation area in EBSD calibration. Compared with the prior art, the beneficial effects of the test device for collaborative acquisition of material deformation provided by the present application are the same as those of the test method for collaborative acquisition of material deformation provided by the above embodiment, and other technical features in the test device for collaborative acquisition of material deformation are the same as the features disclosed in the above embodiment method, which will not be elaborated here.

[0109] The present application provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the test method for collaborative acquisition of material deformation in the first embodiment above.

[0110] Next, refer to Figure 9 , which shows a schematic structural diagram of an electronic device suitable for implementing the embodiments of the present application. The electronic device in the embodiments of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions: tablet computers), PMPs (Portable Media Players), in-vehicle terminals (such as in-vehicle navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Figure 9The illustrated electronic device is merely an example and should not impose any limitations on the functions and scope of use of the embodiments of this application.

[0111] As Figure 9 shown, the electronic device may include a processing device 1001 (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to the program stored in the read-only memory 1002 or the program loaded from the storage device 1003 into the random access memory 1004. In the random access memory 1004, various programs and data required for the operation of the electronic device are also stored. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are connected to each other through a bus 1005. The input / output interface 1006 is also connected to the bus. Generally, the following systems may be connected to the input / output interface 1006: an input device 1007 including, for example, a touch screen, a touchpad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD: Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the electronic device to communicate with other devices wirelessly or wiredly to exchange data.

[0112] In particular, according to the embodiments disclosed in this application, the process described above with reference to the flowchart can be implemented as a computer software program, which can be downloaded and installed from the network through the communication device, or installed from the storage device 1003, or installed from the read-only memory 1002. When this computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiments disclosed in this application are executed.

[0113] The electronic device provided in this application adopts the test method of material deformation collaborative acquisition in the above-mentioned embodiments, and can solve the technical problem of how to relieve the limitation of the electron beam on the speckle particle size or the DIC observation area size in EBSD calibration. Compared with the prior art, the beneficial effects of the electronic device provided in this application are the same as those of the test method of material deformation collaborative acquisition provided in the above-mentioned embodiments, and other technical features in this electronic device are the same as those disclosed in the method of the previous embodiment, and will not be elaborated here.

[0114] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., computer programs) stored thereon, and the computer-readable program instructions are used to execute the test method of material deformation collaborative acquisition in the above-mentioned embodiments.

[0115] The computer-readable storage medium provided by the present application may be, for example, a USB flash drive, but is not limited to systems or devices of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above.

[0116] The above computer-readable storage medium carries one or more programs. When the above one or more programs are executed by an electronic device, the electronic device is enabled to: perform electron backscatter diffraction (EBSD) calibration on the sample surface of a sample to be measured to obtain a measurement result of the grain orientation information inside the sample to be measured; prepare speckles on the sample surface to obtain a target sample to be measured; perform in-situ loading on the target sample to be measured for digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample to be measured; remove the speckles on the target sample to be measured, and based on the sample to be measured after speckle removal, return to execute the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be measured until the in-situ loading of the target sample to be measured reaches a preset loading target; determine the EBSD test result of the sample to be measured based on the obtained measurement results of the grain orientation information inside each sample to be measured, and determine the DIC test result of the sample to be measured based on the obtained measurement results of the material strain information of each sample to be measured.

[0117] The readable storage medium provided by the present application is a computer-readable storage medium. The computer-readable storage medium stores computer-readable program instructions (i.e., computer programs) for executing the above test method for collaborative acquisition of material deformation, and can solve the technical problem of how to relieve the limitation of the electron beam on the speckle particle size or the DIC observation area size in EBSD calibration. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided by the present application are the same as those of the test method for collaborative acquisition of material deformation provided by the above embodiment, and will not be elaborated here.

Claims

1. A test method for collaborative acquisition of material deformation, characterized in that, The test method for collaborative acquisition of material deformation includes: Performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested to obtain the measurement result of the grain orientation information inside the sample to be tested; Preparing speckles on the sample surface to obtain the target sample to be tested; Performing in-situ loading on the target sample to be tested for digital image correlation (DIC) measurement to obtain the measurement result of the material strain information of the sample to be tested; Removing the speckles on the target sample to be tested, and based on the sample to be tested after speckle removal, returning to execute the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested until the in-situ loading of the target sample to be tested reaches a preset loading target; Determining the EBSD test result of the sample to be tested based on the measurement results of the grain orientation information inside each sample to be tested obtained, and determining the DIC test result of the sample to be tested based on the measurement results of the material strain information of each sample to be tested obtained.

2. The test method for collaborative acquisition of material deformation according to claim 1, wherein The step of performing in-situ loading on the target sample to be tested for digital image correlation (DIC) measurement includes: Taking a pre-deformation sample morphology image of the target sample to be tested; Applying stress to the target sample to be tested based on a preset in-situ loading task; After the target sample to be tested reaches the deformation amount specified by the in-situ loading task, taking a post-deformation sample morphology image of the target sample to be tested; Performing digital image correlation (DIC) measurement based on the pre-deformation sample morphology image and the post-deformation sample morphology image.

3. The test method for collaborative acquisition of material deformation according to claim 2, wherein The step of determining the DIC test result of the sample to be tested based on the measurement results of the material strain information of each sample to be tested obtained includes: For any measurement result of the material strain information of a sample to be tested obtained, performing image coincidence processing on the pre-deformation sample morphology image corresponding to the measurement result of the material strain information of the sample to be tested and the post-deformation sample morphology image corresponding to the measurement result of the material strain information of the sample to be tested at the previous time sequence of the target time sequence to obtain the position relationship between the speckles and the sample to be tested in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the material strain information of the sample to be tested is obtained; Based on the position relationship, adding the measurement result of the material strain information of the sample to be tested to the measurement result of the material strain information of the sample to be tested obtained at the previous time sequence to obtain the candidate measurement result of the sample to be tested at the current time sequence, and updating the measurement result of the material strain information of the sample to be tested based on the candidate measurement result; After sequentially traversing the measurement results of the material strain information of each sample to be tested, taking the measurement result of the material strain information of the sample to be tested after multiple updates as the DIC test result of the sample to be tested.

4. The test method for collaborative acquisition of material deformation according to claim 1, characterized in that, Before the step of removing the speckles on the target sample to be tested, it further includes: placing the target sample to be tested on a preset positioning tooling and taking a positioning image of the target sample to be tested, where the positioning image includes the target sample to be tested and the positioning tooling; The step of determining the DIC test result of the sample to be tested based on the measurement results of the material strain information of each sample to be tested obtained includes: For any measurement result of the strain information of the sample material to be measured, based on the positioning picture corresponding to the measurement result of the strain information of the sample material to be measured, perform position correlation with the positioning picture corresponding to the measurement result of the strain information of the sample material to be measured in the previous time sequence of the target time sequence, so as to obtain the position relationship between the speckle and the sample to be measured in the target time sequence and the previous time sequence, where the target time sequence is the time sequence when the measurement result of the strain information of the sample material to be measured is obtained; Based on the position relationship, add the measurement result of the strain information of the sample material to be measured to the measurement result of the strain information of the sample material to be measured obtained in the previous time sequence to obtain a candidate measurement result of the sample to be measured in the current time sequence, and update the measurement result of the strain information of the sample material to be measured based on the candidate measurement result; After sequentially traversing the measurement results of the strain information of each sample material to be measured, use the measurement results of the strain information of the sample material to be measured after multiple updates as the DIC test result of the sample to be measured.

5. The test method for collaborative acquisition of material deformation as claimed in claim 1, wherein The speckles on the target sample to be measured include multiple sets of speckles with different particle sizes, and each set of speckles is sequentially prepared on the sample surface of the sample to be measured from small to large in terms of particle size; The step of in-situ loading the target sample to be measured for digital image correlation (DIC) measurement includes: Taking pictures of the sample morphology before deformation of the target sample to be measured at different scales, where the shooting scale corresponds to the particle size of the speckle; Applying stress to the target sample to be measured based on a preset in-situ loading task; After the target sample to be measured reaches the deformation amount specified by the in-situ loading task, taking pictures of the sample morphology after deformation of the target sample to be measured at different scales; Performing digital image correlation (DIC) measurement based on the sample morphology picture before deformation and the sample morphology picture after deformation at any scale to obtain measurement results of the strain information of the sample material to be measured at multiple scales.

6. The test method for collaborative acquisition of material deformation as claimed in claim 1, wherein The step of preparing speckles on the sample surface to obtain the target sample to be measured includes: Spraying a preset speckle suspension or depositing atomized speckle particles on the sample surface to obtain a candidate sample to be measured, where the material of the speckle particles on the candidate sample to be measured is an inert material; Heating the candidate sample to be measured to obtain the target sample to be measured.

7. The test method for collaborative acquisition of material deformation as described in claim 1, wherein The step of removing the speckles on the target sample to be measured includes: Removing the speckles on the target sample to be measured through a preset cleaning agent, ultrasonic treatment, or compressed air to obtain the sample to be measured after speckle removal.

8. A test device for collaborative acquisition of material deformation, characterized in that, The test device for collaborative acquisition of material deformation includes: An EBSD calibration module for performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be measured to obtain the measurement result of the grain orientation information inside the sample to be measured; A speckle preparation module for preparing speckles on the sample surface to obtain the target sample to be measured; A DIC measurement module for performing in-situ loading on the target sample to be measured for digital image correlation (DIC) measurement to obtain the measurement result of the strain information of the sample material to be measured; A speckle removal module, configured to remove the speckles on the target sample to be measured, and based on the sample to be measured after speckle removal, return to perform the step of performing electron backscatter diffraction (EBSD) calibration on the surface of the sample to be measured until the in-situ loading of the target sample to be measured reaches a preset loading target; A result calculation module, configured to determine the EBSD test result of the sample to be measured based on the measurement results of the internal grain orientation information of each sample to be measured obtained, and determine the DIC test result of the sample to be measured based on the measurement results of the material strain information of each sample to be measured obtained.

9. An electronic device, characterized in that, The device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the test method for collaborative acquisition of material deformation as described in any one of claims 1 to 7.

10. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium, and when the computer program is executed by a processor, it implements the steps of the test method for collaborative acquisition of material deformation as described in any one of claims 1 to 7.

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