Intelligent detection method and system for power management chip pin status

Abstract

The present application provides a method and system for intelligent detection of the pin status of a power management chip. The method includes: inputting the temperature difference into a gradient heat conduction compensation structure, generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal; performing frequency component separation processing on the reference voltage signal, and extracting electromagnetic interference characteristic data from the frequency component; performing time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting the interference suppression parameters through closed-loop control, and applying the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detecting the pin status of the power management chip according to the pin status detection signal. The present application improves the pin voltage stability and status detection accuracy of the power management chip.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a method and system for intelligently detecting the pin status of a power management chip. Background Art

[0002] Highly integrated, high-current power management chips face significant challenges in applications such as server power supplies, new energy vehicle electronic controls, and high-end communications equipment. The pin area bears significant current loads during operation, causing rapid local temperature increases and the formation of complex, dynamic temperature gradients. Furthermore, switching noise and high-frequency signals within and around the chip induce strong electromagnetic interference (EMI). These dynamic temperature gradients couple with EMI, severely disrupting the stability and accuracy of the pin voltage signals. To achieve real-time and accurate monitoring of chip pin status, an intelligent detection method is urgently needed.

[0003] Existing detection methods rely on a network of external temperature sensors combined with voltage fluctuation analysis. This approach deploys multiple discrete temperature sensor nodes around the periphery of the power management chip package or in specific areas to collect approximate temperature distribution information on the chip surface. Simultaneously, a sampling circuit uses a high-precision analog-to-digital converter to acquire real-time voltage fluctuation signals from the target pins. The system uses this collected temperature data to estimate the impact of temperature on pin voltage drift using a pre-set algorithm model and performs preliminary static or quasi-static compensation. A fixed digital filtering technique is then applied to the compensated voltage signal to suppress electromagnetic interference within known frequency bands. Finally, the pin's operating status is determined by comparing the processed voltage signal with a preset threshold.

[0004] However, existing solutions have limited ability to detect subtle, dynamic temperature gradients within the chip. Peripheral sensors struggle to accurately capture transient, high-resolution temperature differences in the pin connection area, leading to significant errors in temperature drift compensation models. Their electromagnetic interference suppression typically relies on fixed, preset filtering parameters, making them inadequate for the dynamic changes in electromagnetic interference spectrum characteristics under complex operating conditions and lacking adaptability. Summary of the Invention

[0005] The present application provides a method and system for intelligent detection of the pin status of a power management chip, which is used to solve the problems of low accuracy of power management chip pin status detection caused by insufficient accuracy of high-resolution dynamic temperature gradient perception, insufficient adaptability of electromagnetic interference suppression, and lack of dynamic coupling correlation processing between temperature and electromagnetic interference in the prior art.

[0006] In a first aspect, the present application provides a method for intelligently detecting the pin status of a power management chip, comprising:

[0007] A temperature gradient distribution monitoring structure consisting of multiple micro-temperature sensing units is constructed within the power management chip to obtain temperature distribution data of the pin connection area of ​​the power management chip and voltage fluctuation signals of the pins during operation. The temperature distribution data includes the temperature difference between adjacent micro-temperature sensing units.

[0008] Inputting the temperature difference into the gradient heat conduction compensation structure, and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material;

[0009] Superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal;

[0010] performing frequency component separation processing on the reference voltage signal and extracting electromagnetic interference characteristic data from the frequency components;

[0011] The electromagnetic interference characteristic data is time-series correlated with the temperature distribution data, and the interference suppression parameters are dynamically adjusted through closed-loop control based on the timing correlation results. The adjusted interference suppression parameters are applied to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and the pin status of the power management chip is detected according to the pin status detection signal.

[0012] Optionally, inputting the temperature difference into a gradient heat conduction compensation structure and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material includes:

[0013] Based on the temperature difference, constructing a temperature gradient vector in the gradient heat conduction compensation structure;

[0014] Taking the temperature gradient vector as a reference axis, the temperature field distribution in the copper-based composite material is decomposed into an axial conduction component and a radial circulation component;

[0015] generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component;

[0016] Performing Fourier harmonic decomposition on the radial circulation component to extract the main component of the eddy heat flow of the radial circulation component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the eddy heat flow;

[0017] The axial compensation current component and the radial component of the reverse spiral current path are subjected to three-dimensional vector synthesis to obtain a compensation current that is opposite to the temperature gradient vector.

[0018] Optionally, generating the axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component includes:

[0019] Along the direction of the temperature gradient vector, the heat conduction field of the copper-based composite material is divided into a plurality of continuous heat flow micro-elements, each of which corresponds to a material cross-section layer perpendicular to the temperature gradient vector;

[0020] Measuring a heat flux density attenuation rate between adjacent heat flux micro-elements, and generating spatial distribution data according to the heat flux density attenuation rate, wherein the spatial distribution data includes an attenuation gradient of the heat flux density along a temperature gradient vector direction;

[0021] Establishing a carrier migration trajectory based on the attenuation gradient, and mapping the attenuation gradient into a topological constraint condition of the carrier migration trajectory through the lattice vibration spectrum characteristics of the copper-based composite material;

[0022] Based on the trajectory tangent direction distribution in the topological constraint condition, the output signals of the distributed current source array deployed in the gradient heat conduction compensation structure are subjected to phase coherent superposition to generate an axial compensation current component.

[0023] Optionally, performing Fourier harmonic decomposition on the radial circulation component to extract the main component of the eddy heat flow of the radial circulation component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the eddy heat flow, includes:

[0024] Taking the temperature gradient vector as the origin, performing polar coordinate transformation on the radial circulation component to generate a mapping result of the circulation field in a polar coordinate system;

[0025] Performing Fourier harmonic decomposition on the mapping result to generate an angular Fourier series expansion of the circulation field and radial Bessel basis projection coefficients;

[0026] Extracting the principal component of the vortex heat flow based on the angular Fourier series expansion and the radial Bessel basis projection coefficient, combined with the spatial distribution density of the circulation field and the maximum circulation kinetic energy ratio;

[0027] Determining a handedness mapping rule for the spiral current path based on the angular phase gradient direction of the main component of the eddy heat flow, and calculating a pitch parameter of the spiral current path based on the circulation density distribution gradient of the main component of the eddy heat flow;

[0028] An initial spiral current path is constructed using the handedness mapping rule and the pitch parameter, and based on the electrical and thermal coupling frequency response characteristics of the copper-based composite material, the initial spiral current path is phase modulated to generate a modulated current path in which the wavefront propagation velocity matches the rotational angular velocity of the main component of the vortex heat flow;

[0029] The modulated current path is subjected to a mirror symmetry operation along the normal plane of the temperature gradient vector to generate a reverse spiral current path on the surface of the pin metal layer.

[0030] Optionally, extracting the main component of the vortex heat flow based on the angular Fourier series expansion and the radial Bessel basis projection coefficient, in combination with the spatial distribution density of the circulation field and the maximum circulation kinetic energy ratio, includes:

[0031] Establishing a mapping relationship between each order harmonic component in the angular Fourier series expansion and the phase singular point of the circulating flow field, and counting the occurrence frequency of the phase singular point in a preset spatial grid unit to generate a phase singular point density distribution map;

[0032] Performing a modulus square weighted integration operation on the radial Bessel basis projection coefficients to obtain a circulating kinetic energy spectrum density function corresponding to each order harmonic, identifying a global maximum of the circulating kinetic energy spectrum density function to determine a dominant order;

[0033] Matching the local maximum position in the phase singular point density distribution map with the global maximum position in spatial coordinates to generate a position set;

[0034] Based on the position set, extracting the phase singular point density value of the corresponding position in the phase singular point density distribution map, and when the phase singular point density value exceeds a preset multiple threshold of the average density of the circulating flow field, determining the dominant order harmonic component as a candidate vortex heat flow main component;

[0035] Based on the lattice vibration cutoff frequency of the copper-based composite material and taking the frequency corresponding to the Debye temperature as the upper limit, the candidate vortex heat flux main components are subjected to frequency band screening, and the harmonic components below the upper limit are retained to generate the vortex heat flux main components.

[0036] Optionally, the step of performing time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting an interference suppression parameter through closed-loop control based on a time-series correlation result, and applying the adjusted interference suppression parameter to an interference suppression process of the reference voltage signal to generate a pin status detection signal includes:

[0037] Converting the temperature distribution data into a time series of thermally excited carrier concentration distribution, and extracting the interference source azimuth angle change rate and harmonic clustering factor from the frequency phase spectrum of the electromagnetic interference characteristic data;

[0038] By means of a carrier tunneling effect, the time series of the thermally excited carrier concentration distribution is temporally correlated with the time-varying phase angle of the harmonic clustering factor;

[0039] Calculating the carrier injection phase offset according to the phase deviation gradient of the timing correlation result and the azimuth angle change rate of the interference source;

[0040] Utilizing the carrier injection phase offset to adjust the output level of the gate voltage control array, and generating dynamically updated interference suppression parameters;

[0041] Loading the dynamically updated interference suppression parameter onto the surface of the carrier migration channel of the reference voltage signal;

[0042] Phase synchronization compensation is performed on the carrier migration process of the reference voltage signal on the surface of the carrier migration channel to generate a pin state detection signal.

[0043] Optionally, the superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal includes:

[0044] Decomposing the compensation current into an axial compensation current component and a radial compensation current component;

[0045] An asymmetric spiral inductor structure is established on the surface of the pin metal layer to drive the radial compensation current component to form a ring-shaped magnetic field along a spiral path;

[0046] Based on the interaction between the annular magnetic field and the voltage fluctuation signal, a voltage-current coupling constraint condition is constructed;

[0047] generating a carrier injection phase synchronization factor according to a heat flux attenuation gradient distribution of the axial compensation current component;

[0048] Modulating the carrier migration trajectory of the voltage fluctuation signal using the carrier injection phase synchronization factor to generate a modulated voltage fluctuation signal;

[0049] Inputting the modulated voltage fluctuation signal into the center tap of the asymmetric spiral inductor structure, and simultaneously loading the axial compensation current component into the outer ring of the asymmetric spiral inductor structure;

[0050] Based on the voltage-current coupling constraint condition, combined with the Seebeck coefficient of the copper-based composite material and the mutual inductance effect of the asymmetric spiral inductor structure, the modulated voltage fluctuation signal and the axial compensation current component are three-dimensionally vector superimposed to generate a reference voltage signal.

[0051] In a second aspect, the present application provides a power management chip pin status intelligent detection system, comprising:

[0052] A construction module is used to construct a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside the power management chip, and obtain temperature distribution data of the pin connection area of ​​the power management chip and voltage fluctuation signals of the pins in the operating state. The temperature distribution data includes the temperature difference between adjacent micro temperature sensing units;

[0053] An input module, configured to input the temperature difference into the gradient heat conduction compensation structure, and generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material;

[0054] a superposition coupling module, configured to superpose and couple the voltage fluctuation signal with the compensation current to generate a reference voltage signal;

[0055] a separation and extraction module, configured to perform frequency component separation processing on the reference voltage signal and extract electromagnetic interference characteristic data from the frequency components;

[0056] An adjustment module is used to adjust the timing association between the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the timing association results, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal, generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

[0057] In a third aspect, the present application provides a computing device comprising a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are used to be called and executed by the processing component to implement a power management chip pin status intelligent detection method as described in any one of the first aspects.

[0058] In a fourth aspect, the present application provides a computer storage medium storing a computer program. When the computer program is executed by a computer, it implements a power management chip pin status intelligent detection method as described in any one of the first aspects.

[0059] In the present application, a method for intelligent detection of the pin status of a power management chip is provided, the method comprising: constructing a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside the power management chip, and obtaining temperature distribution data of the pin connection area of ​​the power management chip and a voltage fluctuation signal of the pin in the operating state, the temperature distribution data including the temperature difference between adjacent micro temperature sensing units; inputting the temperature difference into a gradient heat conduction compensation structure, and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal; performing frequency component separation processing on the reference voltage signal, and extracting electromagnetic interference characteristic data from the frequency component; performing time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting the interference suppression parameter through closed-loop control based on the time-series correlation result, and applying the adjusted interference suppression parameter to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detecting the pin status of the power management chip according to the pin status detection signal.

[0060] This application realizes high-resolution, real-time dynamic temperature gradient distribution monitoring of the pin connection area by constructing an array of micro temperature sensing units inside the chip; utilizes a gradient heat conduction compensation structure to actively generate a counteracting compensation current based on the monitored temperature difference, effectively neutralizing the impact of the temperature gradient on the voltage signal; by superimposing and coupling the compensation current with the original voltage fluctuation signal, the temperature drift noise is suppressed and a more stable reference voltage signal is generated; the frequency components of the reference voltage signal are separated to accurately extract the contained electromagnetic interference characteristic data; the electromagnetic interference characteristic data and the temperature distribution data are then subjected to time-series correlation analysis, and based on this, the interference suppression parameters are dynamically optimized through closed-loop control, and finally these parameters are applied in the interference suppression process to deeply filter out the residual noise dynamically related to the temperature, thereby greatly improving the accuracy and reliability of the pin status detection signal, and realizing high-precision intelligent detection of the pin status of the power management chip.

[0061] Furthermore, based on the monitored temperature difference, a temperature gradient vector is constructed within the gradient heat conduction compensation structure. Using this vector as the reference axis, the temperature field distribution within the copper-based composite material is decomposed into an axial conduction component along the vector direction and a radial circulation component surrounding the axis. For the axial conduction component, based on the characteristic that heat flux decays with conduction distance, the heat conduction field is discretized into continuous heat flux micro-layers along the temperature gradient vector direction. The heat flux density decay rate and its spatial gradient between adjacent micro-layers are measured. This attenuation gradient is used to establish a carrier migration trajectory model. Combined with the lattice vibration spectrum characteristics of the copper-based composite material, the attenuation gradient is mapped as a topological constraint on the trajectory. Finally, based on the distribution of the trajectory tangent direction within the constraint, the output signals of the distributed current source array are phase-coherently superimposed to generate the axial compensation current component.

[0062] Furthermore, the radial circulation component is subjected to Fourier harmonic decomposition to extract the principal component of the dominant eddy heat flow. Based on its rotational direction, a reverse spiral current path with the opposite direction is induced on the surface of the pin metal layer. Finally, the generated axial compensation current component is combined with the radial component generated by the reverse spiral current path for a three-dimensional vector synthesis, resulting in a compensation current with the opposite direction of the original temperature gradient vector. This solution achieves high-precision, physically essential compensation for the complex temperature field inside the chip: by precisely decomposing the temperature field into axial conduction and radial circulation components, and designing targeted compensation mechanisms for each. Axial compensation utilizes heat flow element discretization to accurately capture the heat flow attenuation characteristics, combined with lattice vibration spectrum mapping to ensure that the compensation current accurately matches the physical process of heat conduction in terms of amplitude and phase, effectively offsetting the linear heat diffusion effect. Radial compensation identifies and locks the dominant eddy heat flow through Fourier decomposition, using the reverse spiral current path to directly counteract the heat circulation at the physical level, effectively suppressing thermal eddy disturbances. The final three-dimensional vector synthesis technology realizes the all-round and adaptive reverse cancellation of the temperature gradient vector by the compensation current in the spatial dimension, improving the accuracy, dynamic response capability and spatial coverage of the temperature gradient compensation, and laying a solid foundation for subsequent high-precision signal processing.

[0063] These and other aspects of the present application will become more readily apparent from the description of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0065] Figure 1 A flowchart of a method for intelligently detecting the pin status of a power management chip provided in an embodiment of the present application;

[0066] Figure 2 A schematic diagram of the structure of an intelligent detection system for the pin status of a power management chip provided in an embodiment of the present application;

[0067] Figure 3 A schematic diagram of the structure of a computing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0068] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0069] In some of the processes described in the specification and claims of this application and the above-mentioned figures, multiple operations that appear in a specific order are included, but it should be clearly understood that these operations may not be executed in the order in which they appear in this document or may be executed in parallel. The serial numbers of the operations, such as 11, 12, etc., are only used to distinguish between different operations, and the serial numbers themselves do not represent any order of execution. In addition, these processes may include more or fewer operations, and these operations may be executed in sequence or in parallel. It should be noted that the descriptions of "first", "second", etc. in this document are used to distinguish different messages, devices, modules, etc., and do not represent a sequential order, nor do they limit "first" and "second" to being different types.

[0070] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0071] The prior art treats temperature compensation and electromagnetic interference suppression as relatively independent processes, failing to deeply analyze and utilize the strong temporal coupling correlation between dynamic changes in temperature distribution and electromagnetic interference characteristics. This results in significant temperature-dependent noise components remaining in the signal after interference suppression, ultimately limiting the accuracy and reliability of pin status detection, especially under extreme or rapidly changing operating conditions. To address the problems of poor pin status detection in power management chips caused by insufficient high-resolution dynamic temperature gradient sensing accuracy, insufficient electromagnetic interference suppression adaptability, and the lack of dynamic temperature-electromagnetic interference correlation processing in the prior art, the present invention provides an intelligent pin status detection method for power management chips. The method adopts the following concepts: integrating a micro-temperature sensor array within the chip to monitor the temperature gradient in the pin area in real time with high precision; utilizing this gradient data to generate a reverse compensation current in a dedicated compensation structure to actively offset the effect of temperature on voltage; performing spectral analysis on the compensated signal to extract electromagnetic interference characteristics; the key innovation lies in temporally correlating the interference characteristics with real-time temperature data to dynamically optimize interference suppression parameters; and finally applying the optimized parameters to deeply filter out noise, generating a high-fidelity detection signal and achieving accurate pin status diagnosis.

[0072] Figure 1 This is a flow chart of a method for intelligently detecting the pin status of a power management chip provided in an embodiment of the present application, such as Figure 1 As shown, the method includes:

[0073] S11. Construct a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside the power management chip, and obtain the temperature distribution data of the pin connection area of ​​the power management chip and the voltage fluctuation signal of the pin in the operating state. The temperature distribution data includes the temperature difference between adjacent micro temperature sensing units.

[0074] Among them, the power management chip can be an integrated circuit for power conversion and distribution, including functional modules such as voltage regulation and charge and discharge control. Multiple micro temperature sensing units are integrated in the form of an array of thermocouples or thermistors on the chip substrate to collect temperature values ​​in microscopic areas. The temperature gradient distribution monitoring structure is a grid topology network composed of sensing units, with nodes being temperature sampling points and edges reflecting the heat conduction relationship between adjacent points. The pin connection area refers to the physical area on the power management chip where the pins are connected to the external circuit, including pads or contacts, which are used to transmit electrical signals and withstand thermal stress. The voltage fluctuation signal refers to the voltage change signal generated by the pin during operation, including noise or interference components, and reflects electrical instability based on sensor acquisition. The temperature difference refers to the temperature difference between adjacent micro temperature sensing units, including positive or negative deviations. It is obtained by calculating the difference in unit temperature values ​​and is used to quantify the thermal gradient.

[0075] In an embodiment of the present application, first, a plurality of miniature temperature sensing units are integrated on the base of the pin connection area of ​​the power management chip through a photolithography process to form a temperature gradient distribution monitoring structure with a grid topology; secondly, the temperature values ​​of all sensing units are collected in real time, the temperature difference between adjacent units is calculated and a temperature difference matrix is ​​generated; at the same time, the voltage fluctuation signal of the pin in the operating state is synchronously obtained through a high-impedance probe; finally, the temperature difference matrix and the voltage fluctuation signal are encapsulated into a time-space aligned original data set.

[0076] S12. Input the temperature difference into the gradient heat conduction compensation structure, and generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material.

[0077] The gradient heat conduction compensation structure refers to a compensation mechanism designed based on thermodynamic principles, including a copper-based composite material layer that generates a reverse current based on the temperature field distribution and neutralizes thermal effects. A copper-based composite material is a hybrid material with a copper matrix that includes an added thermal conductivity enhancer to optimize thermal conductivity and simulate heat flow based on the temperature field distribution. The compensation current refers to the current signal output by the gradient heat conduction compensation structure, including its magnitude and direction characteristics. It is designed based on the opposite temperature gradient vector to offset thermal interference.

[0078] In an embodiment of the present application, the temperature difference matrix is ​​first input into a three-dimensional thermodynamic simulation model to generate a temperature gradient vector reflecting the direction and intensity of heat conduction; secondly, a detection current is injected into the copper-based composite material cavity of the gradient heat conduction compensation structure, and the internal temperature field is inverted according to the temperature distribution on the cavity surface; then, based on the thermal-electric equivalence principle, the module length of the temperature gradient vector is converted into current intensity, and the direction is opposite to the vector; finally, the distributed current source array in the compensation structure is controlled to output a synthetic compensation current.

[0079] S13: Superimpose and couple the voltage fluctuation signal with the compensation current to generate a reference voltage signal.

[0080] Among them, the reference voltage signal refers to a stable voltage signal that has been compensated and superimposed, including a reference value component, which is used for subsequent interference analysis and is generated based on the fusion of the voltage fluctuation signal and the compensation current.

[0081] In an embodiment of the present application, the pin voltage fluctuation signal is first conditioned by a preamplifier; secondly, the compensation current is converted into an equivalent voltage signal by a transimpedance amplifier; then, the two signals are input into the positive and negative input terminals of a differential adder, and the gain ratio is set according to the thermoelectric conversion coefficient; finally, a reference voltage signal with a compressed fluctuation amplitude is generated by weighted superposition.

[0082] S14: performing frequency component separation processing on the reference voltage signal, and extracting electromagnetic interference characteristic data from the frequency components.

[0083] Frequency components refer to the frequency components of the separated reference voltage signal, including high and low frequency bands, obtained through Fourier transform and reflecting the signal's spectral characteristics. Electromagnetic interference signature data refers to interference-related information extracted from the frequency components, including amplitude, frequency, and pattern characteristics, used to identify external interference sources.

[0084] In an embodiment of the present application, a reference voltage signal is first subjected to high-speed analog-to-digital conversion to obtain a digital signal stream; secondly, the signal is decomposed into a preset frequency band through a parallel digital filter group; then, a Hilbert transform is performed on the components of each frequency band to extract the instantaneous amplitude and phase; finally, the frequency points whose amplitude exceeds the dynamic threshold are screened, and their center frequency, peak amplitude and phase offset are recorded as electromagnetic interference characteristic data.

[0085] S15. Perform time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the time-series correlation results, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

[0086] Among them, the timing correlation result refers to the analysis result of electromagnetic interference signature data and temperature distribution data after time alignment. Closed-loop control refers to a feedback control system that dynamically adjusts parameters, including sensors, controllers, and actuators, to optimize performance based on the correlation results. Interference suppression parameters refer to the configuration values ​​used to suppress signal interference. The pin status detection signal refers to the detection signal generated after interference suppression, including a status indicator value used to determine whether the pin is normal. It is processed and output based on the reference voltage signal. The pin status refers to the operating status of the power management chip pin, including open circuit, short circuit, or normal state, and is evaluated based on the pin status detection signal.

[0087] In an embodiment of the present application, a timestamp alignment sequence of electromagnetic interference characteristic data and temperature distribution data is first established; secondly, the delay value of temperature change and interference enhancement is calculated through a cross-correlation algorithm; then, when the delay is lower than the set threshold, the filter order is adjusted according to the temperature difference change rate, and the cutoff frequency is reset according to the temperature difference amplitude; finally, the optimized interference suppression parameters are loaded into the adaptive filter to process the reference voltage signal, generate a pin status detection signal and output the diagnostic result.

[0088] The following is a specific example: 24 micro-temperature sensors are integrated into the pin connection area of ​​a certain power management chip. These sensors collect real-time temperature data and calculate the temperature difference between adjacent sensors, such as a 3.2°C temperature difference between adjacent points. Simultaneously, a high-impedance probe acquires the raw voltage signal from pin 5 at a sampling rate of 1 billion times per second. This temperature difference data is input into a copper-based composite compensation structure. The heat conduction direction vector is first calculated, such as a heat flux intensity of 12°C / mm and a 35° angle. The temperature field is then decomposed into axial and rotational components, with the axial component having a heat flux density of 8.7 W / m² and the rotational component having a heat flux density of 4.1 W / m². Based on a 0.38 V / Kelvin conversion factor, an axial compensation current is generated, and the core vortex characteristics of the rotational component are extracted, such as a main frequency of 217 MHz and clockwise rotation. A counter-spiral current path is formed on the metal surface, such as a 20-micron pitch and a left-hand rotation. The resulting composite compensation current has a peak value of 4.5 mA.

[0089] In a special inductor structure, the present embodiment can input a rotating component current into the outer ring of the inductor to form a magnetic field, such as one with a strength of 0.3 Tesla. The original voltage signal is processed using a phase factor modulated by temperature difference data, such as 0.05 radians per degree. Based on the thermoelectric characteristic of 42 microvolts per kelvin, the processed voltage signal is superimposed with the axial current in three dimensions to generate a reference voltage with a ripple reduced from 120 millivolts to 18 millivolts. This embodiment can perform dynamic diagnosis: analyzing the reference voltage spectrum to extract interference features, such as a center frequency of 217 MHz and an intensity of 28 decibels; correlating temperature data with the interference phase change rate, such as a delay of 2 milliseconds; and dynamically optimizing the filter to increase the order to 10 and reduce the cutoff frequency to 200 MHz. Finally, the output diagnostic signal has a signal-to-noise ratio of 41 decibels, indicating that pin 5 is in a normal state.

[0090] By executing S11~S15, the embodiment of the present application effectively neutralizes the influence of the thermal effect of the chip pin area on the voltage signal by constructing a temperature gradient monitoring and heat conduction compensation mechanism. At the same time, combined with electromagnetic interference feature extraction and timing correlation analysis, dynamic optimization of interference suppression parameters is achieved, thereby improving the accuracy and reliability of pin status detection, and ensuring the stability and life of the power management chip in complex operating environments.

[0091] In a possible embodiment, S12, inputting the temperature difference into the gradient heat conduction compensation structure, and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material, includes:

[0092] Step 121: Construct a temperature gradient vector in the gradient heat conduction compensation structure based on the temperature difference.

[0093] Among them, the temperature gradient vector refers to a space vector constructed by the temperature difference, including magnitude and direction attributes, which is used to characterize the directional intensity of heat conduction inside the chip.

[0094] Step 122: Using the temperature gradient vector as a reference axis, decompose the temperature field distribution in the copper-based composite material into an axial conduction component and a radial circulation component.

[0095] The reference axis refers to the coordinate axis referenced by the temperature gradient vector and is used to decompose the spatial components of the temperature field distribution. The axial conduction component refers to the heat conduction component along the reference axis, including linear heat flow characteristics, and is derived from the scalar value of the temperature field projected onto the axial direction. The radial circulation component refers to the annular heat flow component perpendicular to the reference axis, including vortex characteristics, and is calculated based on the circulation of the temperature field in the radial plane.

[0096] Step 123: Generate an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component.

[0097] The heat flux attenuation characteristic, which refers to the physical law that axial heat flux decays exponentially with distance, includes the attenuation coefficient and distance function and is used to calculate changes in heat flux intensity. The axial compensation current component, which counteracts the effects of axial heat flux and includes a reverse current parameter, is generated based on the heat flux attenuation characteristic.

[0098] Step 124 , perform Fourier harmonic decomposition on the radial circulation component, extract the main component of the eddy heat flow of the radial circulation component, and generate a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the eddy heat flow.

[0099] Among them, Fourier harmonic decomposition refers to the technology of decomposing the radial circulation component into the fundamental frequency and higher harmonics, including spectrum amplitude extraction, which is used to identify the dominant heat flow pattern. The main component of the vortex heat flow refers to the harmonic component with the largest amplitude in the radial circulation component, including the rotation direction and intensity characteristics, reflecting the main vortex heat flow morphology. The reverse spiral current path refers to the reverse spiral current distribution generated on the surface of the metal layer to offset the vortex heat flow, including the spatial path topology structure.

[0100] Step 125 : Perform three-dimensional vector synthesis on the axial compensation current component and the radial component of the reverse spiral current path to obtain a compensation current that is opposite to the temperature gradient vector.

[0101] Among them, three-dimensional vector synthesis refers to the spatial vector superposition of the axial current component and the radial component of the spiral path, including the weighted fusion of the components in each direction to generate the final compensation current.

[0102] The following is a specific example: First, a temperature gradient vector is constructed based on the temperature difference between adjacent micro-temperature sensing units. Secondly, using this vector as the reference axis, the temperature field of the copper-based composite material is decomposed into an axial conduction component and a radial circulation component. An axial compensation current component is then generated based on the heat flux attenuation characteristics of the axial component. Simultaneously, the radial circulation component is subjected to Fourier harmonic decomposition and the main component of the eddy heat flux is extracted. Based on its rotation direction, a reverse spiral current path is generated on the surface of the pin metal layer. Finally, a three-dimensional vector synthesis is performed on the axial compensation current component and the radial component of the reverse spiral path to output a compensation current opposite to the temperature gradient vector.

[0103] By executing steps 121 to 125, the embodiment of the present application achieves three-dimensional dynamic cancellation of the complex temperature field in the copper-based composite material through precise construction and spatial decomposition of the temperature gradient vector, combined with the reverse current generation of axial heat flux attenuation compensation and radial vortex heat flux, thereby improving the matching accuracy of the compensation current and the thermal gradient.

[0104] In a possible embodiment, step 123, generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component, includes:

[0105] Step a1: Divide the heat conduction field of the copper-based composite material into a plurality of continuous heat flow elements along the direction of the temperature gradient vector, each heat flow element corresponding to a material cross-section layer perpendicular to the temperature gradient vector.

[0106] Among them, the heat conduction field refers to the spatial area of ​​heat conduction inside the copper-based composite material, including the temperature field distribution range, which is defined based on the heat flow transfer path. The heat flow element refers to a tiny heat conduction unit divided along the temperature gradient direction, including an independent cross-sectional layer, which is used to discretize and analyze local heat flow characteristics. In the embodiment of the present application, the heat conduction field of the copper-based composite material is first divided into a plurality of continuous heat flow elements along the temperature gradient vector direction. Each heat flow element corresponds to a material cross-sectional layer perpendicular to the vector, and a heat flow analysis model is established through spatial discretization.

[0107] Step a2: Measure the heat flux density attenuation rate between adjacent heat flux elements, and generate spatial distribution data based on the heat flux density attenuation rate. The spatial distribution data includes the attenuation gradient of the heat flux density along the direction of the temperature gradient vector.

[0108] The heat flux attenuation rate refers to the ratio of heat flux intensity attenuation per unit distance between adjacent heat flux elements, including the rate of change parameter. It is calculated by dividing the heat flux difference by the distance. Spatial distribution data refers to the spatial distribution of the heat flux attenuation rate. The attenuation gradient refers to the rate of change in the heat flux intensity attenuation along the direction of the temperature gradient vector.

[0109] Step a3: establishing a carrier migration trajectory based on the attenuation gradient, and mapping the attenuation gradient into a topological constraint condition of the carrier migration trajectory through the lattice vibration spectrum characteristics of the copper-based composite material.

[0110] The carrier migration trajectory is a model of the path of electrons in the material, including trajectory curvature and length parameters, constructed based on the spatial variation of the attenuation gradient. The lattice vibration spectrum refers to the vibration frequency distribution characteristics of the atomic lattice of the copper-based composite material, including phonon spectrum data, which is used to correlate heat conduction and electron migration. Topological constraints are spatial restrictions on the carrier migration trajectory, including the curvature upper limit and the tangent direction range, generated based on the attenuation gradient and lattice vibration mapping.

[0111] Step a4: Based on the trajectory tangent direction distribution in the topological constraint condition, the output signals of the distributed current source array deployed in the gradient heat conduction compensation structure are subjected to phase coherent superposition to generate an axial compensation current component.

[0112] The tangent direction distribution of the carrier trajectory refers to the set of tangent directions at each point on the carrier trajectory, including angular distribution characteristics, which are used to guide current phase control. A distributed current source array refers to a collection of spatially distributed microcurrent sources in a gradient thermal conduction compensation structure, including independently controllable output units for generating compensation current components. Phase-coherent superposition is a technique for aligning and fusing multiple current source signals with zero phase difference.

[0113] The following is a specific example: First, the thermal conduction field of the copper-based composite material is divided into continuous heat flow elements along the temperature gradient vector, with each element corresponding to a vertical cross-sectional layer. Next, the heat flux density decay rate between adjacent heat flow elements is measured to generate spatially distributed data containing the attenuation gradient. Carrier migration trajectories are then established based on the attenuation gradient, and the attenuation gradient is mapped to the topological constraints of the trajectory through the lattice vibration spectrum characteristics. Finally, based on the tangential direction distribution of the trajectory in the constraint conditions, the output signals of the distributed current source array are phase-coherently superimposed to generate the axial compensation current component.

[0114] By executing steps a1 to a4, the embodiment of the present application accurately quantifies the thermal conduction attenuation characteristics through the discretization of heat flow elements, and combines the constraining effect of the lattice vibration spectrum on the carrier trajectory to achieve phase-coherent control of the distributed current source array, thereby generating an axial compensation current component that is highly matched with the heat flow attenuation, thereby improving the physical consistency of thermal conduction compensation.

[0115] In one possible embodiment, step 124, performing Fourier harmonic decomposition on the radial circulating current component, extracting the main component of the eddy heat flow of the radial circulating current component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the eddy heat flow, includes:

[0116] Step b1: Taking the temperature gradient vector as the origin, perform polar coordinate transformation on the radial circulation component to generate a mapping result of the circulation field in the polar coordinate system.

[0117] Polar coordinate transformation is a mathematical operation that converts Cartesian coordinate data into radii and angles, including coordinate remapping, to simplify circulation field analysis. The polar coordinate mapping of the circulation field represents the transformed data representation of the radial circulation component, including the three-dimensional distribution of radius, angle, and heat flux.

[0118] Step b2: Perform Fourier harmonic decomposition on the mapping result to generate the angular Fourier series expansion of the circulation field and radial Bessel basis projection coefficients.

[0119] Among them, the angular Fourier series expansion of the circulation field refers to the harmonic decomposition expression of the circulation field in the angular direction, including the amplitude of each order harmonic, reflecting the angular periodic characteristics. The radial Bessel basis projection coefficient refers to the expansion coefficient of the circulation field on the Bessel function basis, including the order parameter, which is used to describe the radial distribution pattern. The angular Fourier series expansion of the circulation field is: ,in, is the thermal circulation distribution function in the polar coordinate system, for The radial amplitude distribution of the order harmonics, is the angular harmonic order, is the angular harmonic basis. The formula for the radial Bessel basis projection coefficient is: ,in, for m Step n Expansion coefficients of the sub-Bessel basis, is the first kind m-order Bessel function, is the eigenvalue determined by the boundary conditions, For the n A positive root, is the boundary radius of the circulation field.

[0120] Step b3: extract the main components of the vortex heat flow based on the angular Fourier series expansion and the radial Bessel basis projection coefficients, combined with the spatial distribution density of the circulation field and the maximum circulation kinetic energy ratio.

[0121] The maximum circulation kinetic energy ratio refers to the ratio of the kinetic energy of the principal component of the vortex heat flux to the total kinetic energy of the circulation field, including a percentage parameter, which is used to identify the dominant vortex. The principal component of the vortex heat flux refers to the core vortex structure after energy ratio screening, including the rotation direction and intensity distribution, reflecting the main thermal circulation form.

[0122] Step b4: Determine the rotational mapping rule of the spiral current path based on the angular phase gradient direction of the main component of the vortex heat flow, and calculate the pitch parameter of the spiral current path according to the circulation density distribution gradient of the main component of the vortex heat flow.

[0123] Among them, the angular phase gradient refers to the phase change rate of the main component of the vortex heat flow in the angular direction. The spiral current path refers to the spiral conductive channel designed to offset the thermal vortex. The rotation mapping rule refers to the spiral rotation correspondence defined according to the direction of the angular phase gradient, including left-handed or right-handed matching logic. The circulation density distribution gradient refers to the intensity change rate of the main component of the vortex heat flow in the radial direction. The pitch parameter refers to the distance control value between adjacent rings in the spiral current path, including the length dimension, and is generated based on the circulation density gradient.

[0124] Step b5: construct an initial spiral current path using the rotational mapping rule and pitch parameters. Based on the electrical and thermal coupling frequency response characteristics of the copper-based composite material, phase modulate the initial spiral current path to generate a modulated current path in which the wavefront propagation velocity matches the rotational angular velocity of the main component of the vortex heat flow.

[0125] The initial spiral current path refers to a spiral path constructed solely by the handedness rule and pitch, including unmodulated geometric models. The thermal coupling frequency response refers to the frequency response characteristics of the electrical and thermal interaction in the copper-based composite material. The wavefront propagation velocity refers to the propagation rate of the current signal in the path. The modulated current path refers to the phase-modulated spiral path.

[0126] Step b6: Perform a mirror symmetry operation on the modulated current path along the normal plane of the temperature gradient vector to generate a reverse spiral current path on the surface of the pin metal layer.

[0127] The mirror symmetry operation refers to a spatial symmetry transformation with the normal plane as the mirror, including geometric flipping processing, which is used to generate a reverse path.

[0128] The following is a specific example: First, the radial circulation component is transformed into polar coordinates with the temperature gradient vector as the origin to generate the polar coordinate mapping result of the circulation field. Secondly, Fourier harmonic decomposition is performed on the result to obtain the angular Fourier series expansion and radial Bessel projection coefficients. Then, the main components of the vortex heat flow are extracted based on the spatial distribution density and the maximum circulation kinetic energy ratio. Then, the rotational mapping rule is determined according to the angular phase gradient direction of the main component, and the pitch parameters are calculated according to the circulation density distribution gradient to construct the initial spiral current path. The initial path is then phase modulated based on the electrothermal coupling frequency response characteristics so that the current wavefront propagation speed matches the angular velocity of the thermal vortex rotation. Finally, the modulated path is mirrored along the normal plane of the temperature gradient vector to generate a reverse spiral current path on the surface of the pin metal layer.

[0129] By executing steps b1 to b6, the embodiment of the present application accurately quantifies the thermal vortex characteristics through polar coordinate transformation and harmonic decomposition, generates an adaptive spiral path by combining the rotational direction mapping and pitch parameters, and realizes dynamic matching of the current wavefront and the thermal vortex based on the electrothermal coupling characteristics, and finally generates a physically achievable compensation current path through a mirror operation.

[0130] In a possible embodiment, step b3, extracting the main component of the vortex heat flow based on the angular Fourier series expansion and the radial Bessel basis projection coefficient, combined with the spatial distribution density of the circulation field and the maximum circulation kinetic energy ratio, includes:

[0131] Step b31: Establish a mapping relationship between each order harmonic component in the angular Fourier series expansion and the phase singularity of the circulating flow field, and count the occurrence frequency of the phase singularity in the preset spatial grid unit to generate a phase singularity density distribution map.

[0132] Among them, harmonic components of various orders refer to harmonic components of different orders in the angular Fourier series expansion, including fundamental waves and higher harmonics, reflecting the multi-scale characteristics of the circulation field. The phase singularity of the circulation field refers to the point where the phase value in the circulation field is discontinuous or abrupt. The preset spatial grid unit refers to a pre-divided regular spatial area, including cubic or hexahedral units, which is used to discretize the statistical singularity distribution. The phase singularity density distribution map refers to the spatial distribution map of the number of phase singularities per unit volume.

[0133] Step b32: Perform a modulus square weighted integration operation on the radial Bessel basis projection coefficients to obtain the circulating kinetic energy spectrum density function corresponding to each order harmonic, identify the global maximum of the circulating kinetic energy spectrum density function, and determine the dominant order.

[0134] The modulus square weighted integral operation refers to the radial integration of the modulus squared Bessel projection coefficients. The circulating kinetic energy spectrum density function refers to the kinetic energy distribution function corresponding to each order harmonic. The dominant order refers to the harmonic order corresponding to the maximum energy in the circulating kinetic energy spectrum density function. The formula for the circulating kinetic energy spectrum density function is: ,in, For the m The circulating kinetic energy spectrum density corresponding to the angular harmonics is: is the radial Bessel basis projection coefficient, is the square of the projection coefficient, is the radial weight function, is the polar coordinate integral measure, is the maximum effective radius of the circulation field, and r is the radius.

[0135] Step b33: Match the spatial coordinates of the local maximum position in the phase singular point density distribution diagram with the global maximum position to generate a position set.

[0136] The local maximum position refers to the coordinates of the regional peak in the phase singularity density distribution diagram, including the spatial coordinate values, extracted using the neighborhood comparison algorithm. The position set refers to the set of spatial points after the local maximum position is matched with the dominant order coordinates, including the coordinate set of the candidate vortex core.

[0137] Step b34: Based on the position set, extract the phase singular point density value of the corresponding position in the phase singular point density distribution diagram. When the phase singular point density value exceeds the preset multiple threshold of the average density of the circulating flow field, determine the dominant order harmonic component as the candidate vortex heat flow main component.

[0138] The phase singularity density value refers to the singularity density value corresponding to each point in the position set. The harmonic component refers to the individual components of the Fourier series expansion. The candidate eddy heat flux principal component refers to the harmonic component that has been screened by the position and density thresholds, including the order identifier, as a candidate for the principal component.

[0139] Step b35: Based on the lattice vibration cutoff frequency of the copper-based composite material and with the frequency corresponding to the Debye temperature as the upper limit, perform frequency band screening on the candidate vortex heat flux main components, retain the harmonic components below the upper limit, and generate the vortex heat flux main components.

[0140] The lattice vibration cutoff frequency refers to the maximum frequency limit of the atomic lattice vibration of the copper-based composite material, including frequency value parameters, which is determined by the Debye temperature. The Debye temperature is the characteristic temperature parameter of the material's lattice vibration, including the Kelvin dimension, and is used to calculate the upper limit of the cutoff frequency.

[0141] The following is a specific example: First, a mapping relationship between each order harmonic component and the phase singularity of the circulation field is established, and the frequency of the singularity is counted within the preset spatial grid unit to generate a phase singularity density distribution map. Secondly, the radial Bessel basis projection coefficient is subjected to a modulus square weighted integral operation to generate a circulation kinetic energy spectrum density function and identify the dominant order. Subsequently, the local maximum position of the density map is matched with the dominant order coordinates to generate a position set. The phase singularity density value of the position set is then extracted, and when it exceeds a preset multiple of the average density of the circulation field, the dominant order harmonic is determined to be a candidate vortex heat flux principal component. Finally, the candidate components are subjected to frequency band screening with the frequency corresponding to the Debye temperature as the upper limit, and the low-frequency components are retained to generate the vortex heat flux principal component.

[0142] By executing steps b31 to b35, the embodiment of the present application accurately locates the vortex core through a joint analysis of the phase singularity density and the circulation kinetic energy, and combines frequency band screening to filter out harmonics that do not conform to the physical properties of the material, ensuring that the extracted main components of the vortex heat flow have both spatial aggregation and thermodynamic feasibility.

[0143] In a possible embodiment, S15, performing time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting the interference suppression parameter through closed-loop control based on the time-series correlation result, and applying the adjusted interference suppression parameter to the interference suppression process of the reference voltage signal to generate a pin status detection signal, including:

[0144] Step 151: Convert the temperature distribution data into a time series of thermally excited carrier concentration distribution, and extract the interference source azimuth angle change rate and harmonic clustering factor from the frequency phase spectrum of the electromagnetic interference characteristic data. The thermally excited carrier concentration distribution time series refers to the spatial distribution data of thermally excited carrier density that changes with time, including a concentration value matrix sequence, which is generated based on the temperature distribution data conversion. The interference source azimuth angle change rate refers to the rate of change of the electromagnetic interference source direction angle over time. The harmonic clustering factor refers to a quantitative parameter that characterizes the degree of harmonic energy aggregation, including the amplitude clustering coefficient, which is calculated based on the kurtosis characteristics of the electromagnetic interference spectrum.

[0145] Step 152: Correlate the time series of the thermally excited carrier concentration distribution with the time-varying phase angle of the harmonic clustering factor using the carrier tunneling effect. The carrier tunneling effect refers to the quantum mechanical phenomenon of carriers crossing a potential barrier. The phase deviation gradient refers to the change in phase deviation per unit time in the time series correlation result.

[0146] Step 153: Calculate the carrier injection phase offset based on the phase deviation gradient of the timing correlation result and the azimuth angle change rate of the interference source. The carrier injection phase offset refers to the carrier injection phase correction value required to compensate for phase distortion, including the angular dimension, and is synthesized based on the phase deviation gradient and the azimuth angle change rate.

[0147] Step 154: Regulate the output level of the gate voltage control array using the carrier injection phase offset to generate dynamically updated interference suppression parameters. The gate voltage control array refers to an array of voltage control devices composed of programmable gates, including an independent control unit for outputting dynamic level signals.

[0148] Step 155: Load the dynamically updated interference suppression parameters onto the carrier migration channel surface of the reference voltage signal. The dynamically updated interference suppression parameters refer to interference suppression configuration values ​​that adjust in real time with the environment, including voltage amplitude and phase parameters, generated based on the carrier injection phase offset. The carrier migration channel surface refers to the interface region where carriers move in the reference voltage signal transmission path, including the semiconductor surface layer, and is used for applying electric field control.

[0149] Step 156: Perform phase synchronization compensation on the carrier migration process of the reference voltage signal on the surface of the carrier migration channel to generate a pin status detection signal. Phase synchronization compensation refers to a control action that corrects phase offset in real time during the carrier migration process, including synchronous application of an electric field to ensure that carrier motion is synchronized with the reference signal.

[0150] The following is a specific example: First, the temperature distribution data is converted into a time series of thermally excited carrier concentration distributions. Simultaneously, the interference source azimuth angle change rate and harmonic clustering factor are extracted from the electromagnetic interference signature data. Secondly, the carrier concentration series is time-correlated with the time-varying phase angle of the harmonic clustering factor through the carrier tunneling effect. The carrier injection phase offset is then calculated based on the phase deviation gradient and azimuth angle change rate of the correlation results. This offset is then used to adjust the output level of the gate voltage control array to generate dynamic interference suppression parameters. This parameter is then applied to the carrier migration channel surface of the reference voltage signal. Finally, phase synchronization compensation is performed on the migration surface to generate a pin status detection signal.

[0151] By executing steps 151 to 156, the embodiment of the present application accurately quantifies the thermal-electric coupling distortion through the dynamic correlation between the hot carrier concentration and the electromagnetic interference phase, and generates interference suppression parameters in real time based on the carrier injection mechanism, and finally realizes phase synchronization compensation at the carrier migration interface, effectively improving the anti-interference performance and detection accuracy of the pin status signal.

[0152] In a possible embodiment, S13, superimposing and coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal, includes:

[0153] Step 131: Decompose the compensation current into an axial compensation current component and a radial compensation current component.

[0154] Step 132: Establish an asymmetric spiral inductor structure on the pin metal layer surface to drive the radial compensation current component along a spiral path to form a toroidal magnetic field. The asymmetric spiral inductor structure refers to a geometrically asymmetric spiral conductive device, including a center tap and an outer ring electrode, for directionally controlling the magnetic field distribution. The toroidal magnetic field is the closed magnetic field formed by the radial compensation current in the spiral path, including the magnetic field intensity vector, generated based on Ampere's loop law.

[0155] Step 133: Based on the interaction between the annular magnetic field and the voltage fluctuation signal, a voltage-current coupling constraint condition is constructed. The voltage-current coupling constraint condition refers to the physical equation that describes the interaction between the magnetic field and the voltage signal, including the induced electromotive force relationship, which is used to constrain the signal modulation process.

[0156] Step 134: Generate a carrier injection phase synchronization factor based on the heat flux attenuation gradient distribution of the axial compensation current component. The carrier injection phase synchronization factor refers to a parameter for regulating the carrier migration phase, including an angle offset, and is calculated and generated based on the heat flux attenuation gradient distribution.

[0157] Step 135: Use the carrier injection phase synchronization factor to modulate the carrier migration trajectory of the voltage fluctuation signal to generate a modulated voltage fluctuation signal. The carrier migration trajectory refers to the path of carrier movement under the action of the electric field, including a spatial curve model, which is dynamically adjusted by the phase factor. The modulated voltage fluctuation signal refers to the voltage signal modulated by the carrier trajectory, including a phase correction component to offset thermally induced distortion.

[0158] Step 136: Input the modulated voltage fluctuation signal into the center tap of the asymmetric spiral inductor structure, while simultaneously applying the axial compensation current component to the outer ring of the asymmetric spiral inductor structure. The center tap refers to the central access electrode of the asymmetric spiral inductor structure, including an electrical contact point for inputting the voltage signal. The outer ring of the asymmetric spiral inductor structure refers to the outer conductive layer of the spiral path, including a ring conductor, for applying the axial compensation current component.

[0159] Step 137: Based on the voltage-current coupling constraint, combined with the Seebeck coefficient of the copper-based composite material and the mutual inductance effect of the asymmetric spiral inductor structure, perform a three-dimensional vector superposition of the modulated voltage fluctuation signal and the axial compensation current component to generate a reference voltage signal. The Seebeck coefficient refers to the thermoelectric conversion characteristic parameter of the copper-based composite material, including the voltage-temperature gradient ratio, which reflects the efficiency of converting thermal energy into electrical energy. The mutual inductance effect of the asymmetric spiral inductor structure refers to the electromagnetic coupling between current and voltage signals within the spiral structure, including the mutual inductance coefficient, which is used to enhance the signal superposition effect.

[0160] The following is a specific example: First, the compensation current is decomposed into axial and radial components. Next, an asymmetric spiral inductor structure is constructed in the pin metal layer to drive the radial component to form a ring-shaped magnetic field. Voltage-current coupling constraints are then established based on the interaction between the magnetic field and the voltage fluctuation signal. A carrier injection phase synchronization factor is then generated based on the heat flux attenuation gradient of the axial component to modulate the carrier migration trajectory of the voltage signal. The modulated voltage signal is then input into the center tap of the spiral inductor, while the axial current component is simultaneously applied to the outer ring of the inductor. Finally, based on the coupling constraints, the modulated voltage and axial current are subjected to three-dimensional vector superposition in combination with the Seebeck coefficient and mutual inductance effect to generate a reference voltage signal.

[0161] By executing steps 131 to 137, the embodiment of the present application realizes magnetic field directional control through an asymmetric spiral inductor structure, combines carrier phase synchronization with thermoelectric and electromagnetic coupling mechanisms, and accurately integrates thermal compensation current and modulation voltage signals in three-dimensional vector superposition, effectively improving the anti-interference and temperature stability of the reference voltage.

[0162] Figure 2 This is a schematic diagram of a power management chip pin status intelligent detection system provided in an embodiment of the present application, as shown in FIG. Figure 2As shown, the system includes:

[0163] Construction module 21 is used to construct a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside the power management chip, and obtain temperature distribution data of the pin connection area of ​​the power management chip and the voltage fluctuation signal of the pin in the operating state. The temperature distribution data includes the temperature difference between adjacent micro temperature sensing units.

[0164] The input module 22 is used to input the temperature difference into the gradient heat conduction compensation structure, and generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material.

[0165] The superposition coupling module 23 is used to superpose and couple the voltage fluctuation signal with the compensation current to generate a reference voltage signal.

[0166] The separation and extraction module 24 is used to perform frequency component separation processing on the reference voltage signal and extract electromagnetic interference characteristic data from the frequency components.

[0167] The adjustment module 25 is used to adjust the timing association between the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the timing association results, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal, generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

[0168] Figure 2 The power management chip pin status intelligent detection system can perform Figure 1 The implementation principle and technical effects of the method for intelligently detecting the pin status of a power management chip described in the illustrated embodiment will not be elaborated on here. The specific manner in which each module and unit performs operations in the intelligent detection system for the pin status of a power management chip in the above embodiment has been described in detail in the embodiments of the method and will not be elaborated on here.

[0169] In one possible design, Figure 2 The power management chip pin status intelligent detection system of the embodiment shown can be implemented as a computing device, such as Figure 3 As shown, the computing device may include a storage component 31 and a processing component 32 .

[0170] The storage component 31 stores one or more computer instructions, wherein the one or more computer instructions are called and executed by the processing component 32 .

[0171] The processing component 32 is configured to construct a temperature gradient distribution monitoring structure composed of multiple micro-temperature sensing units within the power management chip, and acquire temperature distribution data of the pin connection area of ​​the power management chip and voltage fluctuation signals of the pins during operation. The temperature distribution data includes the temperature difference between adjacent micro-temperature sensing units. The temperature difference is input into the gradient heat conduction compensation structure, which generates a compensation current vector opposite to the temperature gradient based on the temperature field distribution within the copper-based composite material. The voltage fluctuation signal and the compensation current are superimposed and coupled to generate a reference voltage signal. The reference voltage signal is subjected to frequency component separation processing and electromagnetic interference signature data is extracted from the frequency components. The electromagnetic interference signature data is time-correlated with the temperature distribution data. Based on the time-correlation results, interference suppression parameters are dynamically adjusted through closed-loop control. The adjusted interference suppression parameters are applied to the interference suppression process of the reference voltage signal to generate a pin status detection signal. The pin status of the power management chip is detected based on the pin status detection signal.

[0172] The processing component 32 may include one or more processors to execute computer instructions to complete all or part of the steps in the above method. Of course, the processing component may also be implemented as one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above method.

[0173] The storage component 31 is configured to store various types of data to support operations on the terminal. The storage component can be implemented by any type of volatile or non-volatile memory device, or a combination thereof, such as random access memory (RAM), static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0174] Of course, a computing device may also include other components, such as input / output interfaces, display components, communication components, etc.

[0175] The input / output interface provides an interface between the processing component and the peripheral interface module, which can be an output device, an input device, etc.

[0176] The communication component is configured to facilitate, among other things, wired or wireless communications between the computing device and other devices.

[0177] Among them, the computing device can be a physical device or an elastic computing host provided by a cloud computing platform, etc. In this case, the computing device can refer to a cloud server, and the above-mentioned processing components, storage components, etc. can be basic server resources rented or purchased from the cloud computing platform.

[0178] The present application also provides a computer storage medium storing a computer program, wherein the computer program can achieve the above-mentioned Figure 1 The embodiment shown is a method for intelligently detecting the pin status of a power management chip.

[0179] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0180] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0181] Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented using software plus a necessary general-purpose hardware platform, or of course, hardware. Based on this understanding, the essence of the above technical solution, or the portion that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, or an optical disk, and includes a number of instructions for causing a computer device (such as a personal computer, server, or network device) to execute the methods described in each embodiment or certain portions of the embodiments.

[0182] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for intelligently detecting the pin status of a power management chip, characterized in that: include: A temperature gradient distribution monitoring structure consisting of multiple micro-temperature sensing units is constructed within the power management chip to obtain temperature distribution data of the pin connection area of ​​the power management chip and voltage fluctuation signals of the pins during operation. The temperature distribution data includes the temperature difference between adjacent micro-temperature sensing units. Inputting the temperature difference into the gradient heat conduction compensation structure, and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; Superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal; performing frequency component separation processing on the reference voltage signal and extracting electromagnetic interference characteristic data from the frequency components; The electromagnetic interference characteristic data is time-series correlated with the temperature distribution data, and the interference suppression parameters are dynamically adjusted through closed-loop control based on the timing correlation results. The adjusted interference suppression parameters are applied to the interference suppression process of the reference voltage signal to generate a pin status detection signal, and the pin status of the power management chip is detected according to the pin status detection signal.

2. The method according to claim 1, characterized in that Inputting the temperature difference into the gradient heat conduction compensation structure and generating a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material includes: Based on the temperature difference, constructing a temperature gradient vector in the gradient heat conduction compensation structure; Taking the temperature gradient vector as a reference axis, the temperature field distribution in the copper-based composite material is decomposed into an axial conduction component and a radial circulation component; generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component; Performing Fourier harmonic decomposition on the radial circulation component to extract the main component of the eddy heat flow of the radial circulation component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the eddy heat flow; The axial compensation current component and the radial component of the reverse spiral current path are subjected to three-dimensional vector synthesis to obtain a compensation current that is opposite to the temperature gradient vector.

3. The method according to claim 2, characterized in that The step of generating an axial compensation current component according to the heat flow attenuation characteristic of the axial conduction component includes: Along the direction of the temperature gradient vector, the heat conduction field of the copper-based composite material is divided into a plurality of continuous heat flow micro-elements, each of which corresponds to a material cross-section layer perpendicular to the temperature gradient vector; Measuring a heat flux density attenuation rate between adjacent heat flux micro-elements, and generating spatial distribution data according to the heat flux density attenuation rate, wherein the spatial distribution data includes an attenuation gradient of the heat flux density along a temperature gradient vector direction; Establishing a carrier migration trajectory based on the attenuation gradient, and mapping the attenuation gradient into a topological constraint condition of the carrier migration trajectory through the lattice vibration spectrum characteristics of the copper-based composite material; Based on the trajectory tangent direction distribution in the topological constraint condition, the output signals of the distributed current source array deployed in the gradient heat conduction compensation structure are subjected to phase coherent superposition to generate an axial compensation current component.

4. The method according to claim 2, characterized in that The method of performing Fourier harmonic decomposition on the radial circulation component to extract the main component of the eddy heat flow of the radial circulation component, and generating a reverse spiral current path on the surface of the pin metal layer according to the rotation direction of the main component of the eddy heat flow, includes: Taking the temperature gradient vector as the origin, performing polar coordinate transformation on the radial circulation component to generate a mapping result of the circulation field in a polar coordinate system; Performing Fourier harmonic decomposition on the mapping result to generate an angular Fourier series expansion of the circulation field and radial Bessel basis projection coefficients; Extracting the principal component of the vortex heat flow based on the angular Fourier series expansion and the radial Bessel basis projection coefficient, combined with the spatial distribution density of the circulation field and the maximum circulation kinetic energy ratio; Determining a handedness mapping rule for the spiral current path based on the angular phase gradient direction of the main component of the eddy heat flow, and calculating a pitch parameter of the spiral current path based on the circulation density distribution gradient of the main component of the eddy heat flow; An initial spiral current path is constructed using the handedness mapping rule and the pitch parameter, and based on the electrical and thermal coupling frequency response characteristics of the copper-based composite material, the initial spiral current path is phase modulated to generate a modulated current path in which the wavefront propagation velocity matches the rotational angular velocity of the main component of the vortex heat flow; The modulated current path is subjected to a mirror symmetry operation along the normal plane of the temperature gradient vector to generate a reverse spiral current path on the surface of the pin metal layer.

5. The method according to claim 4, characterized in that The extraction of the main components of the vortex heat flow based on the angular Fourier series expansion and the radial Bessel basis projection coefficient, combined with the spatial distribution density of the circulation field and the maximum circulation kinetic energy ratio, includes: Establishing a mapping relationship between each order harmonic component in the angular Fourier series expansion and the phase singular point of the circulating flow field, and counting the occurrence frequency of the phase singular point in a preset spatial grid unit to generate a phase singular point density distribution map; Performing a modulus square weighted integration operation on the radial Bessel basis projection coefficients to obtain a circulating kinetic energy spectrum density function corresponding to each order harmonic, identifying a global maximum of the circulating kinetic energy spectrum density function to determine a dominant order; Matching the local maximum position in the phase singular point density distribution map with the global maximum position in spatial coordinates to generate a position set; Based on the position set, extracting the phase singular point density value of the corresponding position in the phase singular point density distribution map, and when the phase singular point density value exceeds a preset multiple threshold of the average density of the circulating flow field, determining the dominant order harmonic component as a candidate vortex heat flow main component; Based on the lattice vibration cutoff frequency of the copper-based composite material and taking the frequency corresponding to the Debye temperature as the upper limit, the candidate vortex heat flux main components are subjected to frequency band screening, and the harmonic components below the upper limit are retained to generate the vortex heat flux main components.

6. The method according to claim 1, characterized in that The method of performing time-series correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting the interference suppression parameter through closed-loop control based on the time-series correlation result, and applying the adjusted interference suppression parameter to the interference suppression process of the reference voltage signal to generate a pin status detection signal includes: Converting the temperature distribution data into a time series of thermally excited carrier concentration distribution, and extracting the interference source azimuth angle change rate and harmonic clustering factor from the frequency phase spectrum of the electromagnetic interference characteristic data; By means of a carrier tunneling effect, the time series of the thermally excited carrier concentration distribution is temporally correlated with the time-varying phase angle of the harmonic clustering factor; Calculating the carrier injection phase offset according to the phase deviation gradient of the timing correlation result and the azimuth angle change rate of the interference source; Utilizing the carrier injection phase offset to adjust the output level of the gate voltage control array, and generating dynamically updated interference suppression parameters; Loading the dynamically updated interference suppression parameter onto the surface of the carrier migration channel of the reference voltage signal; Phase synchronization compensation is performed on the carrier migration process of the reference voltage signal on the surface of the carrier migration channel to generate a pin state detection signal.

7. The method according to claim 1, characterized in that The step of superimposing and coupling the voltage fluctuation signal with the compensation current to generate a reference voltage signal includes: Decomposing the compensation current into an axial compensation current component and a radial compensation current component; An asymmetric spiral inductor structure is established on the surface of the pin metal layer to drive the radial compensation current component to form a ring-shaped magnetic field along a spiral path; Based on the interaction between the annular magnetic field and the voltage fluctuation signal, a voltage-current coupling constraint condition is constructed; generating a carrier injection phase synchronization factor according to a heat flux attenuation gradient distribution of the axial compensation current component; Modulating the carrier migration trajectory of the voltage fluctuation signal using the carrier injection phase synchronization factor to generate a modulated voltage fluctuation signal; Inputting the modulated voltage fluctuation signal into the center tap of the asymmetric spiral inductor structure, and simultaneously loading the axial compensation current component into the outer ring of the asymmetric spiral inductor structure; Based on the voltage-current coupling constraint condition, combined with the Seebeck coefficient of the copper-based composite material and the mutual inductance effect of the asymmetric spiral inductor structure, the modulated voltage fluctuation signal and the axial compensation current component are three-dimensionally vector superimposed to generate a reference voltage signal.

8. An intelligent detection system for the pin status of a power management chip, characterized in that: include: A construction module is used to construct a temperature gradient distribution monitoring structure formed by multiple micro temperature sensing units inside the power management chip, and obtain temperature distribution data of the pin connection area of ​​the power management chip and voltage fluctuation signals of the pins in the operating state. The temperature distribution data includes the temperature difference between adjacent micro temperature sensing units; An input module, configured to input the temperature difference into the gradient heat conduction compensation structure, and generate a compensation current opposite to the temperature gradient vector based on the temperature field distribution in the copper-based composite material; a superposition coupling module, configured to superpose and couple the voltage fluctuation signal with the compensation current to generate a reference voltage signal; a separation and extraction module, configured to perform frequency component separation processing on the reference voltage signal and extract electromagnetic interference characteristic data from the frequency components; An adjustment module is used to adjust the timing association between the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjust the interference suppression parameters through closed-loop control based on the timing association results, and apply the adjusted interference suppression parameters to the interference suppression process of the reference voltage signal, generate a pin status detection signal, and detect the pin status of the power management chip according to the pin status detection signal.

9. A computing device, characterized in that It includes a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are used to be called and executed by the processing component to implement a power management chip pin status intelligent detection method as described in any one of claims 1 to 7.

10. A computer storage medium, characterized in that A computer program is stored, and when the computer program is executed by a computer, the method for intelligently detecting the pin status of a power management chip according to any one of claims 1 to 7 is implemented.

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