High-integration transceiver assembly

Abstract

The invention discloses a high-integration transmitting and receiving assembly, relates to the technical field of radar seekers, and adopts a mode of integrating one-path transmitting and four-path receiving frequency conversion channels to realize an advanced design idea of an active and passive composite radar seeker. Functions of a local oscillator power divider, a receiving frequency conversion circuit, a switch filter bank circuit, a serial port control conversion circuit, a control signal driving anti-interference circuit, a power supply management circuit, a frequency conversion amplification emission circuit and the like are integrated, a calibration loop is arranged in the circuit, and small size and high integration level are realized based on a 3D-SiP integrated active board level integration technology. And the system has the characteristics of modularization and extensibility in use. Through optimization scheme design and high-frequency interconnection fine simulation design, low stray, large dynamic range and high transmit-receive channel isolation of an ultra-wideband receiving channel are realized in terms of technical indexes.

Description

Technical Field

[0001] The present invention relates to the technical field of radar seekers, and in particular to a highly integrated transceiver module. Background Art

[0002] In modern warfare, the battlefield environment is becoming increasingly complex, and a single guidance method has difficulty meeting the requirements for good tactical performance in complex battlefields. Whether it is pure active guidance or passive guidance, there are inherent defects and they cannot meet the actual combat needs. As the core component for a missile to achieve precise guidance, the design of a radar seeker needs to meet many stringent conditions: adopt a standard module design to have expandability; due to the space limitation of the missile body, there are extremely strict requirements for volume; because of the large number of units used, the cost needs to be controlled; as a space product, the quality level requirements are extremely high.

[0003] The radio frequency unit, as a key component of the radar seeker, consists of a frequency conversion channel and a frequency synthesis unit. Among them, the frequency conversion channel undertakes the tasks of signal spectrum shifting and amplification, and the frequency synthesis unit is responsible for providing the frequency conversion local oscillator and the whole machine clock. Existing frequency conversion transceiver modules usually contain a total of 5 channels, one transmitting channel and four receiving channels, and an internal calibration circuit is provided. During down-conversion, the echo signal is subjected to image rejection filtering by a switched filter, and then the radio frequency signal is pre-processed to the baseband through two-stage frequency conversion; during up-conversion, after the baseband signal undergoes two-stage up-conversion, it is filtered and amplified to the saturation state to form an excitation signal covering the Ku band (12 - 18 GHz microwave band) to drive the subsequent TR module to work.

[0004] Although with the development of advanced packaging and radio frequency microsystem technologies, the integrated active board-level integration technology based on 3D-SiP has significantly improved the integration level of the frequency conversion transceiver circuit, showing advantages such as high integration level, simple interface, good consistency, and strong manufacturability, providing a new idea for the integrated design of high-frequency seeker receivers. However, in practical applications, small-aperture seekers have put forward stringent requirements of high performance, miniaturization, and low cost for the frequency conversion transceiver channels. On the one hand, existing frequency conversion transceiver modules mostly adopt a method of dispersedly arranging multiple functional modules, resulting in a relatively large volume and making it difficult to meet the space limitations of small-aperture seekers; on the other hand, the working frequency band coverage range of the frequency conversion transceiver channels involved in this technology is wide, and the problem of high-frequency broadband interconnection has long restricted the improvement of microwave circuit performance. At the same time, the electromagnetic compatibility problem of the transceiver calibration signal brought about by the small volume also needs to be solved urgently. Therefore, there is an urgent need to develop a highly integrated transceiver module to overcome the defects of the existing technology and meet the actual application requirements. Summary of the Invention

[0005] The present invention provides a highly integrated transceiver module, which has a high integration level, excellent performance, can achieve modular assembly, and works stably and reliably.

[0006] To achieve the above object, a highly integrated transceiver component provided by the present invention includes: a transmitting link, a receiving link, a local oscillator and power distribution circuit, and a control and power management; the transmitting link includes an intermediate frequency filtering circuit, a second-stage frequency conversion and amplification transmitting circuit, and a filtering, amplification and multi-functional excitation circuit; the receiving link includes a four-channel high-band receiving frequency conversion circuit, a four-channel low-band receiving frequency conversion circuit, and a four-way switch filter bank circuit; the local oscillator and power distribution circuit includes a first local oscillator power distribution circuit and a second local oscillator power distribution circuit; the control and power management includes a digital control attenuation serial port control conversion circuit, a control signal driving anti-interference circuit, a first +5V low-dropout power management circuit, a second +5V low-dropout power management circuit, and a -5V low-dropout power management circuit; the intermediate frequency filtering circuit is connected to the second-stage frequency conversion and amplification transmitting circuit, processes the baseband signal and outputs it to the second-stage frequency conversion and amplification transmitting circuit; the second-stage frequency conversion and amplification transmitting circuit is connected to the filtering, amplification and multi-functional excitation circuit, converts the processed baseband signal into a radio frequency transmitting signal and outputs it to the filtering, amplification and multi-functional excitation circuit; the filtering, amplification and multi-functional excitation circuit further processes the radio frequency transmitting signal to generate an excitation signal; the filtering, amplification and multi-functional excitation circuit is connected to the four-channel high-band receiving frequency conversion circuit, and provides a receiving correction signal to the four-channel high-band receiving frequency conversion circuit; the four-channel high-band receiving frequency conversion circuit receives a radio frequency receiving signal and a receiving correction signal, mixes them and outputs a first intermediate frequency signal; the four-channel low-band receiving frequency conversion circuit is connected to the four-channel high-band receiving frequency conversion circuit, further processes the first intermediate frequency signal, and outputs a second intermediate frequency signal; the four-way switch filter bank circuit is respectively connected to the four-channel low-band receiving frequency conversion circuit, and filters the second intermediate frequency signal in a broadband or narrowband mode; the first local oscillator power distribution circuit is respectively connected to the four-channel high-band receiving frequency conversion circuit and the second-stage frequency conversion and amplification transmitting circuit, and provides a first local oscillator signal required for mixing to the receiving link and the transmitting link; the second local oscillator power distribution circuit is respectively connected to the four-channel low-band receiving frequency conversion circuit and the second-stage frequency conversion and amplification transmitting circuit, and provides a second local oscillator signal required for mixing to the receiving link and the transmitting link; the digital control attenuation serial port control conversion circuit is connected to the control signal driving anti-interference circuit; the control signal driving anti-interference circuit is connected to the four-channel high-band receiving frequency conversion circuit and the filtering, amplification and multi-functional excitation circuit; the first +5V low-dropout power management circuit is respectively connected to the four-channel high-band receiving frequency conversion circuit, the four-channel low-band receiving frequency conversion circuit, and the control signal driving anti-interference circuit; the second +5V low-dropout power management circuit is respectively connected to the filtering, amplification and multi-functional excitation circuit, the second-stage frequency conversion and amplification transmitting circuit, and the control signal driving anti-interference circuit; the -5V low-dropout power management circuit is respectively connected to the second-stage frequency conversion and amplification transmitting circuit, the filtering, amplification and multi-functional excitation circuit, and the four-channel high-band receiving frequency conversion circuit.

[0007] In some embodiments, the high-band receiving frequency conversion circuit includes a coupler, a limiter, a first digital control attenuator, a first amplifier, a second digital control attenuator, a first RF switch filter bank, a second amplifier, a first mixer, a first fixed attenuator, a first low-pass filter, a third amplifier, a first band-pass filter, and a first temperature-compensated attenuator connected in sequence. The coupler is configured to receive a radio frequency (RF) receiving signal and a receiving calibration signal sent from the filtering and amplifying multifunctional excitation circuit. The first amplifier is used for the first-stage low-noise coefficient amplification of the RF receiving signal. The first RF switch filter bank is connected to a radio frequency preselection filter bank by two single-pole four-throw switches and is configured to filter out-of-band clutter signals and image frequency signals of the RF receiving signal in different frequency bands. The first digital control attenuator and the second digital control attenuator are both used for six-bit digital control attenuation gain adjustment of signals. The first low-pass filter is configured to filter out signals higher than the frequency of the RF receiving signal. The first fixed attenuator is used to adjust the matching of the front and rear stage circuits and adjust the gain of the receiving link. The first mixer mixes the RF receiving signal sent by the second amplifier with the first local oscillator signal input via the first local oscillator power distribution circuit to generate the first intermediate frequency signal. The second amplifier and the third amplifier are respectively used for gradually amplifying the power signal. The first temperature-compensated attenuator is used to compensate for the gain fluctuation of the circuit due to high and low temperature operation in the frequency range of the first intermediate frequency signal.

[0008] In some embodiments, the low-band receiving frequency conversion circuit includes a second fixed attenuator, a fourth amplifier, a second band-pass filter, a second mixer, a second temperature-compensated attenuator, a second low-pass filter, a fifth amplifier, a third low-pass filter, and a third temperature-compensated attenuator connected in sequence. The second fixed attenuator is used to adjust the matching of the front and rear stage circuits and adjust the gain of the receiving link. The fourth amplifier is used to further amplify the first intermediate frequency signal. The second band-pass filter is used to filter out signals outside the bandwidth of the first intermediate frequency signal frequency. The second mixer mixes the first intermediate frequency signal sent by the band-pass filter with the second local oscillator signal input via the second local oscillator power distribution circuit to generate the second intermediate frequency signal. The second temperature-compensated attenuator and the third temperature-compensated attenuator are used to gradually compensate for the gain fluctuation of the circuit due to high and low temperature operation in the frequency range of the second intermediate frequency signal. The second low-pass filter and the third low-pass filter are used to gradually filter out signals higher than the frequency of the second intermediate frequency signal. The fifth amplifier is used for the last-stage power amplification of the second intermediate frequency signal.

[0009] In some embodiments, the secondary frequency conversion and amplification transmission circuit includes a fourth temperature compensation attenuator, a fourth low-pass filter, a sixth amplifier, a third mixer, a third band-pass filter, a seventh amplifier, a fourth band-pass filter, a fifth temperature compensation attenuator, a fourth mixer, a second RF switch filter bank, and an eighth amplifier, which are connected in sequence. The fourth low-pass filter is used to filter out the high-frequency noise of the baseband signal. The sixth amplifier, seventh amplifier, and eighth amplifier are used to amplify the signal at the baseband frequency, intermediate frequency, and radio frequency, respectively. The third mixer mixes the baseband signal with the second local oscillator signal input via the second local oscillator power distribution circuit to generate a first intermediate frequency transmission signal. The third band-pass filter and the fourth band-pass filter are used to filter out the signals outside the bandwidth of the first intermediate frequency transmission signal generated after passing through the third mixer. The fourth mixer mixes the first intermediate frequency transmission signal with the second local oscillator signal input via the first local oscillator power distribution circuit to generate a radio frequency transmission signal. The second RF switch filter bank is connected by two single-pole four-throw switches and a radio frequency rejection filter bank, and is used to filter out harmonics, intermodulation components, and other out-of-band spurious signals generated by mixing in the transmission link in different frequency bands.

[0010] In some embodiments, the filtering, amplifying, and multifunctional excitation circuit includes a ninth amplifier, a third RF switch filter bank, a tenth amplifier, a fifth low-pass filter, a coupling and detection circuit, a power splitter, and a third fixed attenuator, which are connected in sequence. The ninth amplifier and the tenth amplifier amplify the power of the radio frequency transmission signal in stages. The third RF switch filter bank is connected by two single-pole four-throw switches and a radio frequency shaping filter bank, and selects the operating frequency of the excitation signal by switching filters in different frequency bands. The fifth low-pass filter is used to filter out the high-frequency noise of the radio frequency transmission signal. The coupling and detection circuit detects and judges whether the output power of the radio frequency transmission signal is lower than a threshold value, and outputs a judgment result. The power splitter outputs an excitation signal to the transmission channel and receives a calibration signal to the reception channel at the same time. The third fixed attenuator is used to adjust the matching of the front and rear stage circuits and adjust the gain of the transmission link.

[0011] In some embodiments, each of the four-way switch filter bank circuits includes two microwave switches, a switchable LC filter, and a fixed narrowband surface acoustic wave filter. The LC filter and the surface acoustic wave filter are topologically connected through the microwave switches, where the LC filter is configured in a wideband filtering mode and the surface acoustic wave filter is configured in a narrowband filtering mode. The switch filter bank circuit selects two operating modes of wideband or narrowband by switching the microwave switches, and is used to filter out-of-band spurious signals of the second intermediate frequency signal.

[0012] In some embodiments, the first +5V low-dropout power management circuit, the second +5V low-dropout power management circuit, and the -5V low-dropout power management circuit all include an ultra-low-dropout linear voltage regulator chip, a feedback network composed of resistors, a filter capacitor bank connected in parallel at the input end of the chip, and a filter circuit connected in parallel at the output end; the feedback network is connected between the output end of the voltage regulator chip and the ground pin for setting the output voltage value; the filter capacitor bank is composed of at least two ceramic capacitors with different capacitance values connected in parallel for suppressing high-frequency ripples at the power input end.

[0013] In some embodiments, the numerically controlled attenuation serial port control conversion circuit includes a group of logic inverters; the input end of the group of logic inverters is connected to an external timing control circuit, and the output end of the group of logic inverters is connected to the control pins of the first numerically controlled attenuator and the second numerically controlled attenuator.

[0014] In some embodiments, the control signal driving anti-interference circuit includes an eight-way transmitter. The input end of the eight-way transmitter receives a TTL control signal from an external timing control circuit, and the output end of the eight-way transmitter is connected to the enable ports of each radio frequency switch and each amplifier.

[0015] The present invention also provides a three-dimensional integrated structure of a highly integrated transceiver module, including: a box body, and a multi-layer microstrip board arranged in a double-sided layout inside the box body; the front side of the multi-layer microstrip board is divided into two parts by a undulating partition wall; the four-channel receive high-band frequency conversion circuit, the four-channel receive low-band frequency conversion circuit, and the four-way switch filter bank circuit of the receive link are integrated in one part; the intermediate frequency filter circuit, the second-stage frequency conversion and amplification transmission circuit, and the filter amplification multifunctional excitation circuit of the transmit link are integrated in the other part; the first local oscillator power distribution circuit, the second local oscillator power distribution circuit, the numerically controlled attenuation serial port control conversion circuit, the control signal driving anti-interference circuit, the first +5V low-dropout power management circuit, the second +5V low-dropout power management circuit, and the -5V low-dropout power management circuit are integrated on the back side of the multi-layer microstrip board; the circuits on the front and back sides of the multi-layer microstrip board are electromagnetically isolated through an intermediate ground layer; multiple SMP connectors are assembled on the side wall of the box body as radio frequency input, intermediate frequency input / output, and local oscillator interfaces, and the SMP connectors are fixed by conductive adhesive and welded to the signal layer of the multi-layer microstrip board; the four-channel receive high-band frequency conversion circuit, the four-channel receive low-band frequency conversion circuit, the second-stage frequency conversion and amplification transmission circuit, and the filter amplification multifunctional excitation circuit all adopt a 3D package microwave SIP design, and signals are transmitted internally through a high-frequency broadband vertical interconnection structure and are welded to the surface of the microstrip board with a grid ball array externally.

[0016] Compared with the related art, a highly integrated transceiver module provided by the present invention has the following beneficial effects:

[0017] The present invention provides a highly integrated transceiver module, which adopts a mode of integrating one transmitting and four receiving frequency conversion channels, realizes the advanced design concept of the active and passive composite radar seeker, integrates functions such as local oscillator power distribution, receiving frequency conversion circuit, switch filter bank circuit, serial port control conversion circuit, control signal driving anti-interference circuit, power management circuit, frequency conversion amplification transmitting circuit, etc., has a built-in calibration loop, and realizes small volume and high integration degree based on the integrated active board-level technology of 3D-SiP. It also has the characteristics of modularity and expandable use. Through optimized scheme design and fine simulation design of high-frequency interconnection, low spurious, large dynamic range and high isolation degree between transmitting and receiving channels are achieved in technical indicators. Description of the Drawings

[0018] Figure 1 is the circuit schematic diagram of the highly integrated transceiver module according to an embodiment of the present invention;

[0019] Figure 2 is the circuit schematic diagram of the four-channel high-band receiving frequency conversion circuit according to an embodiment of the present invention;

[0020] Figure 3 is the circuit schematic diagram of the four-channel low-band receiving frequency conversion circuit according to an embodiment of the present invention;

[0021] Figure 4 is the circuit schematic diagram of the second-stage frequency conversion amplification transmitting circuit according to an embodiment of the present invention;

[0022] Figure 5 is the circuit schematic diagram of the filter amplification multifunctional excitation circuit according to an embodiment of the present invention;

[0023] Figure 6 is the front layout schematic diagram of the structure of the highly integrated transceiver module according to an embodiment of the present invention;

[0024] Figure 7 is the reverse layout schematic diagram of the structure of the highly integrated transceiver module according to an embodiment of the present invention;

[0025] Figure 8 is the side layout schematic diagram of the structure of the highly integrated transceiver module according to an embodiment of the present invention;

[0026] Figure 9 is the schematic diagram of the switch filter bank circuit according to an embodiment of the present invention;

[0027] Figure 10 is the schematic diagram of the low-dropout power management circuit according to an embodiment of the present invention;

[0028] Figure 11 is the schematic diagram of the numerically controlled attenuation serial port control conversion circuit according to an embodiment of the present invention;

[0029] Figure 12 is the schematic diagram of the control signal driving anti-interference circuit according to an embodiment of the present invention.

[0030] Reference Numerals in the Figures: 100, multi-layer microstrip board; 200, box body; 1, first local oscillator power divider circuit; 2, second local oscillator power divider circuit; 3, four-channel receive high-band frequency conversion circuit; 4, four-channel receive low-band frequency conversion circuit; 51, first switch filter bank circuit; 52, second switch filter bank circuit; 53, third switch filter bank circuit; 54, fourth switch filter bank circuit; 6, digital control attenuation serial port control conversion circuit; 7, control signal drive anti-interference circuit; 8, first +5V low-dropout power management circuit; 9, second +5V low-dropout power management circuit; 10, -5V low-dropout power management circuit; 11, intermediate frequency filter circuit; 12, second frequency conversion amplification transmission circuit; 13, filter amplification multifunctional excitation circuit; 101, coupler; 102, limiter; 103, first digital control attenuator; 104, second digital control attenuator; 105, first radio frequency switch filter bank; 106, first fixed attenuator; 107, first low-pass filter; 108, first band-pass filter; 109, first temperature compensated attenuator; 1010, second fixed attenuator; 1011, second band-pass filter; 1012, second temperature compensated attenuator; 1013, second low-pass filter; 1014, third low-pass filter; 1015, third temperature compensated attenuator; 1016, fourth temperature compensated attenuator; 1017, fourth low-pass filter; 1018, third band-pass filter; 1019, fourth band-pass filter; 1020, fifth temperature compensated attenuator; 1021, second radio frequency switch filter bank; 1022, third radio frequency switch filter bank; 1023, fifth low-pass filter; 1024, coupling detection circuit; 1025, power divider; 1026, third fixed attenuator; 201, first amplifier; 202, second amplifier; 203, third amplifier; 204, fourth amplifier; 205, fifth amplifier; 206, sixth amplifier; 207, seventh amplifier; 208, eighth amplifier; 209, ninth amplifier; 2010, tenth amplifier; 301, first mixer; 302, second mixer; 303, third mixer; 304, fourth mixer. Detailed Implementation Manner

[0031] Embodiment 1

[0032] This embodiment provides a highly integrated transceiver module, such as Figure 1As shown, it is the circuit schematic diagram of the embodiment of the present invention. The embodiment of the present invention includes: a transmitting link, a receiving link, a local oscillator and power distribution circuit, and control and power management; the transmitting link includes an intermediate frequency filtering circuit 11, a second-stage frequency conversion and amplification transmitting circuit 12, and a filtering, amplification and multifunctional excitation circuit 13; the receiving link includes a four-channel high-band receiving frequency conversion circuit 3, a four-channel low-band receiving frequency conversion circuit 4, and a four-way switch filter bank circuit; the local oscillator and power distribution circuit includes a first local oscillator power distribution circuit 1 and a second local oscillator power distribution circuit 2; the control and power management includes a numerically controlled attenuation serial port control conversion circuit 6, a control signal driving anti-interference circuit 7, a first +5V low-dropout power management circuit 8, a second +5V low-dropout power management circuit 9, and a -5V low-dropout power management circuit 10;

[0033] The intermediate frequency filtering circuit 11 is connected to the second-stage frequency conversion and amplification transmitting circuit 12, and after processing the baseband signal (BB), it outputs to the second-stage frequency conversion and amplification transmitting circuit 12; the second-stage frequency conversion and amplification transmitting circuit 12 is connected to the filtering, amplification and multifunctional excitation circuit 13, converts the processed baseband signal into a radio frequency transmission signal (RF_TX) and outputs to the filtering, amplification and multifunctional excitation circuit 13; the filtering, amplification and multifunctional excitation circuit 13 further processes the radio frequency transmission signal (RF_TX) to generate an excitation signal (DRV); the filtering, amplification and multifunctional excitation circuit 13 is connected to the four-channel high-band receiving frequency conversion circuit 3, and provides a receiving correction signal (CAL_RX) to the four-channel high-band receiving frequency conversion circuit 3;

[0034] The four-channel high-band receiving frequency conversion circuit 3 receives a radio frequency receiving signal (RF_RX) and a receiving correction signal (CAL_RX), and after mixing, outputs a first intermediate frequency signal (IF1); the four-channel low-band receiving frequency conversion circuit 4 is connected to the four-channel high-band receiving frequency conversion circuit 3, further processes the first intermediate frequency signal (IF1), and outputs a second intermediate frequency signal (IF2); the four-way switch filter bank circuit is respectively connected to the four-channel low-band receiving frequency conversion circuit 4, and filters the second intermediate frequency signal (IF2) in a broadband or narrowband mode;

[0035] The first local oscillator power distribution circuit 1 is respectively connected to the four-channel high-band receiving frequency conversion circuit 3 and the second-stage frequency conversion and amplification transmitting circuit 12, and provides a first local oscillator signal (LO1) required for mixing to the receiving link and the transmitting link; the second local oscillator power distribution circuit 2 is respectively connected to the four-channel low-band receiving frequency conversion circuit 4 and the second-stage frequency conversion and amplification transmitting circuit 12, and provides a second local oscillator signal (LO2) required for mixing to the receiving link and the transmitting link;

[0036] The numerically controlled attenuation serial port control conversion circuit 6 is connected to the control signal driving anti-interference circuit 7; the control signal driving anti-interference circuit 7 is connected to the four-channel receiving high-band frequency conversion circuit 3 and the filtering, amplifying and multifunctional excitation circuit 13; the first +5V low-dropout power management circuit 8 is respectively connected to the four-channel receiving high-band frequency conversion circuit 3, the four-channel receiving low-band frequency conversion circuit 4, and the control signal driving anti-interference circuit 7; the second +5V low-dropout power management circuit 9 is respectively connected to the filtering, amplifying and multifunctional excitation circuit 13, the secondary frequency conversion and amplification transmitting circuit 12, and the control signal driving anti-interference circuit 7; the -5V low-dropout power management circuit 10 is respectively connected to the secondary frequency conversion and amplification transmitting circuit 12, the filtering, amplifying and multifunctional excitation circuit 13, and the four-channel receiving high-band frequency conversion circuit 3.

[0037] In this embodiment, after the baseband signal (BB) is preprocessed by the intermediate frequency filtering circuit 11 in the transmitting link, two frequency conversion processes are completed by the secondary frequency conversion and amplification transmitting circuit 12, and finally a high-quality radio frequency transmission signal (RF_TX) is output through the filtering, amplifying and multifunctional excitation circuit 13; in the receiving link, the four-channel receiving high-band frequency conversion circuit 3 and the four-channel receiving low-band frequency conversion circuit 4 work together to cooperate with the four-way switch filter bank circuit to achieve wide-band signal reception. The local oscillator and power splitter circuit provides a stable mixing reference signal for the whole system, while the control and power management module ensures the precise control and stable power supply of each circuit module.

[0038] Among them, the secondary frequency conversion architecture (the secondary frequency conversion and amplification transmitting circuit 12 and four mixers) combined with the four-channel receiving design significantly improves the dynamic range of the system. The actual measurement shows that the dynamic range of its receiving system is improved by about 45dB compared with the traditional design. Secondly, through the collaborative design of the first local oscillator power splitter circuit 1 and the second local oscillator power splitter circuit 2, a high isolation degree (>60dB) of the local oscillator signals of the transmitting and receiving links is achieved, effectively reducing the system intermodulation interference. Furthermore, the combined use of the numerically controlled attenuation serial port control conversion circuit 6 and the control signal driving anti-interference circuit 7 enables the system gain control accuracy to reach ±(0.8 + 4%*ATTEN)dB. In addition, the three-power supply architecture of the first +5V low-dropout power management circuit 8 and the second +5V low-dropout power management circuit 9 combined with the -5V low-dropout power management circuit 10 enables the system power consumption to be controllable and has a fast short-circuit protection function, and the short-circuit protection intermittent time reaches 15ms. Finally, the system self-calibration function is realized through the coupling detection circuit 1024 and the power splitter 1025 in the filtering, amplifying and multifunctional excitation circuit 13, greatly improving the long-term working stability. The organic combination of these technical features makes this transceiver module have significant advantages in terms of volume, performance and reliability.

[0039] Such as Figure 2As shown, the high-band frequency conversion circuit 3 for reception includes a coupler 101, a limiter 102, a first digital control attenuator 103, a first amplifier 201, a second digital control attenuator 104, a first RF switch filter bank 105, a second amplifier 202, a first mixer 301, a first fixed attenuator 106, a first low-pass filter 107, a third amplifier 203, a first band-pass filter 108, and a first temperature-compensated attenuator 109, which are connected in sequence.

[0040] The coupler 101 is used to receive a radio frequency reception signal (RF_RX) and a reception calibration signal (CAL_RX) sent from the filtering, amplifying, and multifunctional excitation circuit 13.

[0041] The first amplifier 201 is used for the first-stage low-noise coefficient amplification of the radio frequency reception signal.

[0042] The first RF switch filter bank 105 is connected to the radio frequency preselection filter bank by two single-pole four-throw switches and is used to filter out out-of-band clutter signals and image frequency signals of the radio frequency reception signal in different frequency bands.

[0043] The first digital control attenuator 103 and the second digital control attenuator 104 are both used for six-bit digital control attenuation gain adjustment of the signal.

[0044] The first low-pass filter 107 is used to filter out signals higher than the frequency of the radio frequency reception signal.

[0045] The first fixed attenuator 106 is used to adjust the matching of the front and rear stage circuits and adjust the gain of the reception link.

[0046] The first mixer 301 mixes the radio frequency reception signal (RF_RX) sent by the second amplifier 202 with the first local oscillator signal (LO1) input via the first local oscillator power distribution circuit 1 to generate a first intermediate frequency signal (IF1).

[0047] The second amplifier 202 and the third amplifier 203 are respectively used to amplify the power signal stage by stage.

[0048] The first temperature-compensated attenuator 109 is used to compensate for the gain fluctuation of the circuit due to high and low temperature operation in the frequency range of the first intermediate frequency signal (IF1).

[0049] Working process of the four-channel receiving high-band frequency conversion circuit 3: The echo signal is transmitted into the coupler 101 through the connector and the microstrip line. In addition to receiving the circuit signal, this coupler 101 can also couple the received calibration signal (CAL_RX) sent from the filter and multi-functional excitation circuit 13. The signal output by the coupler 101 enters the limiter 102. After limiting the excessive power level, it enters the first digital control attenuator 103, where 1-bit 31dB digital control attenuation gain adjustment can be performed. Then it is sent to the first amplifier 201 with adjustable low noise for the first-stage low-noise coefficient power amplification. Then it enters the second digital control attenuator 104 for 5-bit 31dB digital control attenuation gain adjustment. Then it enters the first radio frequency switch filter bank 105 to filter out the out-of-band clutter signals and image frequency signals of the received signal in different frequency bands within the Ku band range. Then it enters the second amplifier 202 to amplify the radio frequency power signal again. Then it is sent to the first mixer 301 to mix the radio frequency signal with the first local oscillator signal (LO1) to generate the first intermediate frequency signal (IF1). Then it enters the fixed attenuator 106 to adjust the link gain and perform circuit matching. Then it enters the first low-pass filter 107 to filter the signal generated by the mixing. Then it is sent to the third amplifier 203 for another power amplification. After passing through the first band-pass filter 108 for out-of-band filtering, finally, the signal passes through the first temperature-compensated attenuator 109 to adjust the gain fluctuation range during the high and low temperature operation of the circuit within the frequency range of the first intermediate frequency signal (IF1), and then is sent to the four-channel receiving low-band frequency conversion circuit 4.

[0050] As Figure 3 shown, the receiving low-band frequency conversion circuit 4 includes a second fixed attenuator 1010, a fourth amplifier 204, a second band-pass filter 1011, a second mixer 302, a second temperature-compensated attenuator 1012, a second low-pass filter 1013, a fifth amplifier 205, a third low-pass filter 1014, and a third temperature-compensated attenuator 1015 connected in sequence;

[0051] The second fixed attenuator 1010 is used to adjust the circuit matching between the front and rear stages and adjust the receiving link gain;

[0052] The fourth amplifier 204 is used to further amplify the first intermediate frequency signal (IF1);

[0053] The second band-pass filter 1011 is used to filter out the signals outside the bandwidth of the first intermediate frequency signal (IF1) frequency;

[0054] The second mixer 302 mixes the first intermediate frequency signal (IF1) sent by the band-pass filter 1011 with the second local oscillator signal (LO2) input via the second local oscillator power distribution circuit 2 to generate the second intermediate frequency signal (IF2);

[0055] The second temperature-compensated attenuator 1012 and the third temperature-compensated attenuator 1015 are used to compensate for the gain fluctuations of the circuit at high and low temperatures step by step in the frequency range of the second intermediate frequency signal (IF2).

[0056] The second low-pass filter 1013 and the third low-pass filter 1014 are used to filter out the signals higher than the frequency of the second intermediate frequency signal (IF2) step by step.

[0057] The fifth amplifier 205 is used to perform the last-stage power amplification on the second intermediate frequency signal (IF2).

[0058] The working process of the receiving low-band frequency conversion circuit 4 is as follows: The first intermediate frequency signal (IF1) sent from the four-channel receiving high-band frequency conversion circuit 3 enters the second fixed attenuator 1010 to adjust the link gain and perform circuit matching, and then is sent to the fourth intermediate frequency amplifier 204 for power amplification. After that, it passes through the second band-pass filter 1011 for out-of-band filtering of the signal, and then is sent to the second mixer 302 to mix the signal with the second local oscillator signal (LO2) to generate the second intermediate frequency signal (IF2). Then, it is sent to the second temperature-compensated attenuator 1012 to roughly adjust the gain magnitude of the second intermediate frequency signal (IF2) during high and low temperature operations for the first time, and then enters the second low-pass filter 1013 to filter the mixed signal. After that, it is sent to the fifth amplifier 205 for power amplification of the second intermediate frequency signal (IF2), and then enters the third low-pass filter 1014 to filter the amplified signal. Finally, the signal passes through the third temperature-compensated attenuator 1015 to finely adjust the gain fluctuation of the circuit at high and low temperatures at the end of the circuit, and then is sent to the switch filter bank circuit.

[0059] As Figure 4 shown, the secondary frequency conversion and amplification transmitting circuit 12 includes a fourth temperature-compensated attenuator 1016, a fourth low-pass filter 1017, a sixth amplifier 206, a third mixer 303, a third band-pass filter 1018, a seventh amplifier 207, a fourth band-pass filter 1019, a fifth temperature-compensated attenuator 1020, a fourth mixer 304, a second radio frequency switch filter bank 1021, and an eighth amplifier 208 connected in sequence;

[0060] The fourth low-pass filter 1017 is used to filter out the high-frequency noise of the baseband signal (BB).

[0061] The sixth amplifier 206, the seventh amplifier 207, and the eighth amplifier 208 are used to amplify the signal at the baseband frequency, intermediate frequency, and radio frequency respectively.

[0062] The third mixer 303 mixes the baseband signal BB with the second local oscillator signal (LO2) input via the second local oscillator power distribution circuit 2 to generate the first intermediate frequency transmission signal (IF_TX1).

[0063] The third band-pass filter 1018 and the fourth band-pass filter 1019 are used to filter out signals outside the bandwidth of the first intermediate-frequency transmission signal (IF_TX1) generated after passing through the third mixer 303;

[0064] The fourth mixer 304 mixes the first intermediate-frequency transmission signal (IF_TX1) with the second local oscillator signal (LO2) input via the first local oscillator power splitter circuit 2 to generate a radio-frequency transmission signal (RF_TX);

[0065] The second radio-frequency switch filter bank 1021, which is connected to the radio-frequency rejection filter bank by two single-pole four-throw switches, is used to filter out harmonic waves, intermodulation components, and other out-of-band spurious signals generated by mixing in the transmission link in different frequency bands.

[0066] The working process of the second-stage frequency conversion and amplification transmission circuit 12 is as follows: The digital transmission first sends the baseband signal (BB) into the intermediate-frequency filtering circuit 11 through a connector and a microstrip line, and then into the second-stage frequency conversion and amplification transmission circuit 12. After the fourth temperature compensation attenuator 1016 adjusts the gain fluctuation range during high and low temperature operation of the baseband frequency adjustment circuit, it is sent into the fourth low-pass filter 1017 to filter out higher-frequency clutter signals, and then into the sixth amplifier 206 for the first-stage power amplification of the transmission. After that, it is sent into the third mixer 303 to mix the signal with the second local oscillator signal (LO2) to generate the first intermediate-frequency transmission signal (IF_TX1). After passing through the third band-pass filter 1018 for out-of-band filtering, it is sent into the seventh amplifier 207 for the second-stage power amplification of the transmission. After passing through the fourth band-pass filter 1019 for the second out-of-band filtering, and then through the fifth temperature compensation attenuator 1020 to adjust the gain fluctuation range during high and low temperature operation of the first intermediate-frequency transmission signal (IF_TX1) frequency range adjustment circuit, and then sent into the fourth mixer 304 to mix the first intermediate-frequency transmission signal (IF_TX1) with the second local oscillator signal (LO2) to generate the radio-frequency transmission signal (RF_TX). Then it enters the second radio-frequency switch filter bank 1021 to filter out out-of-band clutter signals of the transmission signal in different frequency bands within the radio-frequency working range. Finally, the signal is pushed to a certain power level at the end of the circuit by the radio-frequency eighth amplifier 208 and then sent into the filtering, amplifying, and multifunctional excitation circuit 13.

[0067] As Figure 5 shown, the filtering, amplifying, and multifunctional excitation circuit 13 includes a ninth amplifier 209, a third radio-frequency switch filter bank 1022, a tenth amplifier 2010, a fifth low-pass filter 1023, a coupling and detection circuit 1024, a power splitter 1025, and a third fixed attenuator 1026 connected in sequence;

[0068] The ninth amplifier 209 and the tenth amplifier 2010 amplify the power of the radio-frequency transmission signal (RF_TX) in stages;

[0069] The third RF switch filter bank 1022 is connected to the RF shaping filter bank by two single-pole four-throw switches, and selects the operating frequency of the excitation signal by switching filters in different frequency bands;

[0070] The fifth low-pass filter 1023 is used to filter out high-frequency noise of the RF transmit signal (RF_TX);

[0071] The coupling detection circuit 1024 detects and judges whether the output power of the RF transmit signal (RF_TX) is lower than the threshold value, and outputs the judgment result;

[0072] The power splitter 1025 outputs the excitation signal (DRV) to the transmit channel, and at the same time receives the calibration signal (CAL_RX) to the receive channel;

[0073] The third fixed attenuator 1026 is used to adjust the matching of the front and rear stage circuits and adjust the gain of the transmit link.

[0074] The working process of the filtering, amplifying and multifunctional excitation circuit 13 is as follows: The RF transmit signal (RF_TX) from the second-stage frequency conversion and amplification transmit circuit 12 is first sent to the ninth amplifier 209 for the first-stage power amplification of the transmit, then enters the third RF switch filter bank 1022 to filter out the out-of-band clutter signals of the transmit signal in different frequency bands within the RF working range, and then sent to the tenth amplifier 2010 for the second-stage power amplification of the transmit, and then sent to the fifth low-pass filter 1023 to filter out the clutter signals higher than the RF working frequency, and then sent to the coupling detection circuit 1024 to detect and judge whether the output power of the transmit signal is lower than the threshold value, and output the judgment result, and then enter the power splitter 1025, which can output the excitation signal (DRV) to the transmit excitation channel, and at the same time output a receive calibration signal (CAL_RX) to the four-channel receive high-band frequency conversion circuit 3 for internal calibration of the channel, and then enter the third fixed attenuator 1026 to adjust the link gain and circuit matching. Finally, the signal output by the filtering, amplifying and multifunctional excitation circuit 13 is output through the microstrip board and the transmit connector output component.

[0075] Among them, as Figure 9 shown, the four-way switch filter bank circuit includes a first switch filter bank circuit 51, a second switch filter bank circuit 52, a third switch filter bank circuit 53, and a fourth switch filter bank circuit 54, all of which include two microwave switches, a switchable LC filter, and a fixed narrow-band SAW filter;

[0076] The LC filter and the SAW filter are topologically connected through a microwave switch, where the LC filter is configured in a wide-band filtering mode and the SAW filter is configured in a narrow-band filtering mode;

[0077] The switched filter bank circuit selects two operating modes, wideband or narrowband, through the switching of microwave switches, and is used to filter out-of-band spurious signals from the second intermediate frequency signal (IF2).

[0078] As Figure 10 shown, the first +5V low-dropout power management circuit 8, the second +5V low-dropout power management circuit 9, and the -5V low-dropout power management circuit 10 all include an ultra-low-dropout linear voltage regulator chip, a feedback network composed of resistors, a filter capacitor bank connected in parallel at the chip input, and a filter circuit connected in parallel at the output; the feedback network consists of R6 and R5; the filter capacitor at the input is composed of C13; the filter circuit at the output is composed of at least two ceramic capacitors C15 and C16 with different capacitance values connected in parallel.

[0079] The feedback network is connected between the output terminal of the voltage regulator chip and the ground pin, and is used to set the output voltage value;

[0080] The filter circuit at the output is composed of at least two ceramic capacitors with different capacitance values connected in parallel, and is used to suppress high-frequency ripples at the power supply output terminal.

[0081] As Figure 11 shown, the numerically controlled attenuation serial port control conversion circuit 6 includes a group of logic inverters; the input terminals of the group of logic inverters are connected to an external timing control circuit, and the output terminals of the group of logic inverters are connected to the control pins of the first numerically controlled attenuator 103 and the second numerically controlled attenuator 104. Resistors R7, R8, and R9 are respectively connected in series at the input terminals to prevent signal interference. Two capacitors C17 and C18 with different capacitance values need to be connected in parallel for power supply filtering. The output terminals are 6Y, 5Y, and 4Y.

[0082] As Figure 12 shown, the control signal driven anti-interference circuit 7 includes an eight-way transmitter. The input terminal of the eight-way transmitter receives TTL control signals from an external timing control circuit, and the output terminal of the eight-way transmitter is connected to the enable ports of each radio frequency switch and amplifier. Resistors R1 - R8 are respectively connected in series to each path of the input signals to filter out useless signals. Two capacitors C19 and C20 with different capacitance values need to be connected in parallel for power supply filtering of the drive chip. The corresponding output terminal signals are output as A1 - A8.

[0083] The main technical indicators of this embodiment are as follows:

[0084] Operating frequency band: Ku band; receiving gain: 50dB ± 2dB; gain in-band fluctuation: ≤1dB; transceiver isolation: ≥40dB; spurious suppression: ≥55dBc.

[0085] As Figures 6 - 8As shown in the figure, this embodiment provides a three-dimensional integrated structure of a highly integrated transceiver component, including a box body 200 and a multi-layer microstrip board 100 arranged in a double-sided layout within the box body 200; the front side of the multi-layer microstrip board 100 is divided into a receiving link and a transmitting link by undulating partition walls; a four-channel high-band receiving frequency conversion circuit 3, a four-channel low-band receiving frequency conversion circuit 4, and a four-way switch filter bank circuit are integrated in the receiving link, and physical shielding is achieved between the receiving link and the transmitting link channels through partition ribs, improving the transceiver isolation degree, reducing the spatial interference between signals, and reducing the cavity effect; an intermediate frequency filtering circuit 11, a second-stage frequency conversion and amplification transmitting circuit 12, and a filtering and amplification multifunctional excitation circuit 13 are integrated in the transmitting link; a first local oscillator power distribution circuit 1, a second local oscillator power distribution circuit 2, a numerically controlled attenuation serial port control conversion circuit 6, a control signal driving anti-interference circuit 7, a first +5V low-dropout power management circuit 8, a second +5V low-dropout power management circuit 9, and a -5V low-dropout power management circuit 10 are integrated on the back side of the multi-layer microstrip board 100; the circuits on the front and back sides of the multi-layer microstrip board 100 achieve electromagnetic isolation through an intermediate grounding layer;

[0086] Among them, the power supply, control signals, and the first and second local oscillator signals are interconnected with the receiving and transmitting channels through the internal wiring of the multi-layer microstrip board 100. The first and second local oscillator signals pass through discrete partition ribs to reduce the interference of the local oscillator signals on other circuits, and discrete partition ribs are arranged at the multi-channel input / output connectors to improve the isolation degree between channels.

[0087] A plurality of SMP connectors are assembled on the side wall of the box body 200 as radio frequency inputs, intermediate frequency inputs / outputs, and local oscillator interfaces. The SMP connectors are fixed by conductive adhesive and welded to the signal layer of the multi-layer microstrip board 100;

[0088] The four-channel high-band receiving frequency conversion circuit 3, the four-channel low-band receiving frequency conversion circuit 4, the second-stage frequency conversion and amplification transmitting circuit 12, and the filtering and amplification multifunctional excitation circuit 13 all adopt a 3D packaged microwave SIP design. The signals are transmitted through a high-frequency broadband vertical interconnection structure inside, and are welded to the surface of the microstrip board in a grid ball array on the outside.

[0089] A first local oscillator input connector I1, a second local oscillator input connector I2, a first radio frequency input connector I3, a second radio frequency input connector I4, a third radio frequency input connector I5, a fourth radio frequency input connector I6, a first intermediate frequency output connector O1, a second intermediate frequency output connector O2, a third intermediate frequency output connector O3, a fourth intermediate frequency output connector O4, a low-frequency connector I7, an intermediate frequency input connector I8, and a transmitting output connector O5 are assembled on the side of the box body 200 in the form of SMP.

[0090] As Figure 1As shown in the figure, the first local oscillator input connector I1 is connected to the first local oscillator power splitter circuit 1; the second local oscillator input connector I2 is connected to the second local oscillator power splitter circuit 2; the first radio frequency input connector I3, the second radio frequency input connector I4, the third radio frequency input connector I5, and the fourth radio frequency input connector I6 are connected to the four-channel receive high-band frequency conversion circuit 3; the first intermediate frequency output connector O1 is connected to the first switch filter bank circuit 51; the second intermediate frequency output connector O2 is connected to the second switch filter bank circuit 52; the third intermediate frequency output connector O3 is connected to the third switch filter bank circuit 53; the fourth intermediate frequency output connector O4 is connected to the fourth switch filter bank circuit 54; the low-frequency connector I7 is respectively connected to the first +5V low-dropout power management circuit 8, the second +5V low-dropout power management circuit 9, and the control signal drive anti-interference circuit 7; the intermediate frequency input connector I8 is connected to the intermediate frequency filter circuit 11; the transmit output connector O5 is connected to the filter amplifier multifunctional excitation circuit 13.

[0091] In summary, through the adoption of the high-integration sip design technology, the embodiment of the present invention realizes the integrated frequency conversion transceiver of ultra-wideband one-channel transmission and four-channel reception. By adopting the multi-layer microwave board lamination technology, the BGA radio frequency interconnection technology, and the refined link simulation design technology, functions such as local oscillator power splitting, receive frequency conversion circuit, switch filter bank circuit, serial port control conversion circuit, control signal drive anti-interference circuit, power management circuit, and frequency conversion amplification transmission circuit are integrated into one, achieving small volume and high integration. The embodiment of the present invention has the characteristics of modularization and expandable use. Through the optimization of the scheme design, low spurious, large dynamic range, and high isolation degree of the transceiver channels are achieved in terms of technical indicators.

Claims

1. A highly integrated transceiver component, characterized in that, Including: A transmitting link, a receiving link, a local oscillator and power splitting circuit, and control and power management; the transmitting link includes an intermediate frequency filtering circuit, a second-stage frequency conversion and amplification transmitting circuit, and a filtering, amplification and multifunctional excitation circuit; the receiving link includes a four-channel high-band receiving frequency conversion circuit, a four-channel low-band receiving frequency conversion circuit, and a four-way switch filter bank circuit; the local oscillator and power splitting circuit includes a first local oscillator power splitting circuit and a second local oscillator power splitting circuit; the control and power management includes a numerically controlled attenuation serial port control conversion circuit, a control signal driving anti-interference circuit, a first +5V low-dropout power management circuit, a second +5V low-dropout power management circuit, and a -5V low-dropout power management circuit; The intermediate frequency filtering circuit is connected to the second-stage frequency conversion and amplification transmitting circuit, processes the baseband signal and outputs it to the second-stage frequency conversion and amplification transmitting circuit; the second-stage frequency conversion and amplification transmitting circuit is connected to the filtering, amplification and multifunctional excitation circuit, converts the processed baseband signal into a radio frequency transmitting signal and outputs it to the filtering, amplification and multifunctional excitation circuit; the filtering, amplification and multifunctional excitation circuit further processes the radio frequency transmitting signal to generate an excitation signal; the filtering, amplification and multifunctional excitation circuit is connected to the four-channel high-band receiving frequency conversion circuit, and provides a receiving correction signal to the four-channel high-band receiving frequency conversion circuit; The four-channel high-band receiving frequency conversion circuit receives a radio frequency receiving signal and a receiving correction signal, mixes them and outputs a first intermediate frequency signal; the four-channel low-band receiving frequency conversion circuit is connected to the four-channel high-band receiving frequency conversion circuit, further processes the first intermediate frequency signal, and outputs a second intermediate frequency signal; the four-way switch filter bank circuit is respectively connected to the four-channel low-band receiving frequency conversion circuit, and filters the second intermediate frequency signal in a broadband or narrowband mode; The first local oscillator power splitting circuit is respectively connected to the four-channel high-band receiving frequency conversion circuit and the second-stage frequency conversion and amplification transmitting circuit, and provides a first local oscillator signal required for mixing to the receiving link and the transmitting link; the second local oscillator power splitting circuit is respectively connected to the four-channel low-band receiving frequency conversion circuit and the second-stage frequency conversion and amplification transmitting circuit, and provides a second local oscillator signal required for mixing to the receiving link and the transmitting link; The numerically controlled attenuation serial port control conversion circuit is connected to the control signal driving anti-interference circuit; the control signal driving anti-interference circuit is connected to the four-channel high-band receiving frequency conversion circuit and the filtering, amplification and multifunctional excitation circuit; the first +5V low-dropout power management circuit is respectively connected to the four-channel high-band receiving frequency conversion circuit, the four-channel low-band receiving frequency conversion circuit, and the control signal driving anti-interference circuit; the second +5V low-dropout power management circuit is respectively connected to the filtering, amplification and multifunctional excitation circuit, the second-stage frequency conversion and amplification transmitting circuit, and the control signal driving anti-interference circuit; the -5V low-dropout power management circuit is respectively connected to the second-stage frequency conversion and amplification transmitting circuit, the filtering, amplification and multifunctional excitation circuit, and the four-channel high-band receiving frequency conversion circuit.

2. The high-integration transceiver component according to claim 1, wherein The receiving high-band frequency conversion circuit includes a coupler, a limiter, a first digital controlled attenuator, a first amplifier, a second digital controlled attenuator, a first radio frequency switch filter bank, a second amplifier, a first mixer, a first fixed attenuator, a first low-pass filter, a third amplifier, a first band-pass filter, and a first temperature compensated attenuator connected in sequence; The coupler is used to receive a radio frequency receiving signal and a receiving calibration signal sent from the filtering and amplifying multifunctional excitation circuit; The first amplifier is used for the first-stage low-noise coefficient amplification of the radio frequency receiving signal; The first radio frequency switch filter bank is connected to a radio frequency preselection filter bank by two single-pole four-throw switches and is used to filter out out-of-band clutter signals and image frequency signals of the radio frequency receiving signal in different frequency bands; Both the first digital controlled attenuator and the second digital controlled attenuator are used for six-bit digital controlled attenuation gain adjustment of the signal; The first low-pass filter is used to filter out signals higher than the frequency of the radio frequency receiving signal; The first fixed attenuator is used to adjust the matching of the front and rear stage circuits and adjust the gain of the receiving link; The first mixer mixes the radio frequency receiving signal sent by the second amplifier with the first local oscillator signal input via the first local oscillator power distribution circuit to generate the first intermediate frequency signal; The second amplifier and the third amplifier are respectively used for gradually amplifying the power signal; The first temperature compensated attenuator is used to compensate for the gain fluctuation of the circuit due to high and low temperature operation in the first intermediate frequency signal frequency range.

3. The high-integration transceiver component according to claim 1, characterized in that The receiving low-band frequency conversion circuit includes a second fixed attenuator, a fourth amplifier, a second band-pass filter, a second mixer, a second temperature compensated attenuator, a second low-pass filter, a fifth amplifier, a third low-pass filter, and a third temperature compensated attenuator connected in sequence; The second fixed attenuator is used to adjust the matching of the front and rear stage circuits and adjust the gain of the receiving link; The fourth amplifier is used to further amplify the first intermediate frequency signal; The second band-pass filter is used to filter out signals outside the bandwidth of the first intermediate frequency signal frequency; The second mixer mixes the first intermediate frequency signal sent by the band-pass filter with the second local oscillator signal input via the second local oscillator power distribution circuit to generate the second intermediate frequency signal; The second temperature compensated attenuator and the third temperature compensated attenuator are used to gradually compensate for the gain fluctuation of the circuit due to high and low temperature operation in the second intermediate frequency signal frequency range; The second low-pass filter and the third low-pass filter are used to gradually filter out signals higher than the second intermediate frequency signal frequency; The fifth amplifier is used for the last-stage power amplification of the second intermediate frequency signal.

4. The high-integration transceiver component according to claim 1, characterized in that The secondary frequency conversion and amplification transmitting circuit includes a fourth temperature compensated attenuator, a fourth low-pass filter, a sixth amplifier, a third mixer, a third band-pass filter, a seventh amplifier, a fourth band-pass filter, a fifth temperature compensated attenuator, a fourth mixer, a second radio frequency switch filter bank, and an eighth amplifier connected in sequence; The fourth low-pass filter is used to filter out high-frequency noise of the baseband signal; The sixth amplifier, the seventh amplifier, and the eighth amplifier are used to amplify the signal at the baseband frequency, intermediate frequency, and radio frequency respectively; The third mixer mixes the baseband signal with the second local oscillator signal input via the second local oscillator power divider circuit to generate a first intermediate frequency transmission signal; The third band-pass filter and the fourth band-pass filter are used to filter out signals outside the bandwidth of the first intermediate frequency transmission signal generated after passing through the third mixer; The fourth mixer mixes the first intermediate frequency transmission signal with the second local oscillator signal input via the first local oscillator power divider circuit to generate a radio frequency transmission signal; The second radio frequency switch filter bank is connected to the radio frequency rejection filter bank by two single-pole four-throw switches and is used to filter out harmonics, intermodulation components and other out-of-band spurious signals generated by mixing in the transmission link in different frequency bands.

5. A highly integrated transceiver component according to claim 1, characterized in that, The filter amplification multifunctional excitation circuit includes a ninth amplifier, a third radio frequency switch filter bank, a tenth amplifier, a fifth low-pass filter, a coupling detection circuit, a power divider, and a third fixed attenuator connected in sequence; The ninth amplifier and the tenth amplifier amplify the power of the radio frequency transmission signal in stages; The third radio frequency switch filter bank is connected to the radio frequency shaping filter bank by two single-pole four-throw switches and selects the operating frequency of the excitation signal by switching filters in different frequency bands; The fifth low-pass filter is used to filter out high-frequency noise of the radio frequency transmission signal; The coupling detection circuit detects and judges whether the output power of the radio frequency transmission signal is lower than the threshold value and outputs a judgment result; The power divider outputs an excitation signal to the transmission channel and receives a calibration signal to the receiving channel at the same time; The third fixed attenuator is used to adjust the matching of the front and rear stage circuits and adjust the gain of the transmission link.

6. The high-integration transceiver component according to claim 1, characterized in that, Each of the four-way switch filter bank circuits includes two microwave switches, a switchable LC filter, and a fixed narrow-band surface acoustic wave filter; The LC filter and the surface acoustic wave filter are topologically connected by a microwave switch, where the LC filter is configured in a wide-band filtering mode and the surface acoustic wave filter is configured in a narrow-band filtering mode; The switch filter bank circuit selects two operating modes of wide band or narrow band by switching the microwave switch and is used to filter out-of-band spurious signals of the second intermediate frequency signal.

7. A highly integrated transceiver component according to claim 1, characterized in that The first +5V low-dropout power management circuit, the second +5V low-dropout power management circuit, and the -5V low-dropout power management circuit all include an ultra-low dropout linear voltage regulator chip, a feedback network composed of resistors, a filter capacitor bank connected in parallel at the input end of the chip, and a filter circuit connected in parallel at the output end; The feedback network is connected between the output end of the voltage regulator chip and the ground pin and is used to set the output voltage value; The filter capacitor bank is composed of at least two ceramic capacitors with different capacitance values connected in parallel and is used to suppress high-frequency ripples at the power input end.

8. The high-integration transceiver component according to claim 1, characterized in that The digital control attenuation serial port control conversion circuit includes a logic inverter group; the input end of the logic inverter group is connected to an external timing control circuit, and the output end of the logic inverter group is connected to the control pins of the first digital control attenuator and the second digital control attenuator.

9. The high-integration transceiver component according to claim 8, characterized in that The control signal-driven anti-interference circuit includes an eight-channel transmitter. The input end of the eight-channel transmitter receives a TTL control signal from an external timing control circuit, and the output end of the eight-channel transmitter is connected to the enable ports of each radio frequency switch and each amplifier.

10. A three-dimensional integrated structure of a highly integrated transceiver component as described in any one of claims 1-9, characterized in that, Comprising: A box body and a multi-layer microstrip board arranged in a double-sided layout within the box body; the front side of the multi-layer microstrip board is divided into two parts by a undulating partition wall; the four-channel receive high-band frequency conversion circuit, the four-channel receive low-band frequency conversion circuit, and the four-channel switch filter bank circuit of the receive link are integrated in one part; the intermediate frequency filter circuit, the second-stage frequency conversion and amplification transmission circuit, and the filter amplification multifunctional excitation circuit of the transmit link are integrated in the other part; the first local oscillator power distribution circuit, the second local oscillator power distribution circuit, the numerically controlled attenuation serial port control conversion circuit, the control signal-driven anti-interference circuit, the first +5V low-dropout power management circuit, the second +5V low-dropout power management circuit, and the -5V low-dropout power management circuit are integrated on the back side of the multi-layer microstrip board; the circuits on the front and back sides of the multi-layer microstrip board are electromagnetically isolated through an intermediate ground layer; A plurality of SMP connectors are assembled on the side wall of the box body as radio frequency input, intermediate frequency input / output, and local oscillator interfaces, and the SMP connectors are fixed by conductive adhesive and welded to the signal layer of the multi-layer microstrip board; The four-channel receive high-band frequency conversion circuit, the four-channel receive low-band frequency conversion circuit, the second-stage frequency conversion and amplification transmission circuit, and the filter amplification multifunctional excitation circuit all adopt a 3D packaged microwave SIP design, and the signals are transmitted internally through a high-frequency broadband vertical interconnection structure and are welded to the surface of the microstrip board by a grid ball array externally.

Images