Polymer-coated and laser-roughened photomask

Abstract

The invention provides a polymer-coated and laser-roughened photomask, which comprises a transparent substrate, and the transparent substrate comprises a middle area and an edge area surrounding the middle area; the circuit pattern is located in the middle area of the transparent substrate, is a geometric pattern formed by a light-proof material and is used for defining a circuit structure of the semiconductor device; the film frame is an annular frame which is subjected to local laser etching and is adhered to the edge area of the transparent substrate, the annular frame surrounds the circuit pattern to form a closed space, and the film frame is coated with one or more layers of fluorine-containing polymer coating glue which is used for blocking release of sulfate radicals and ammonium radicals; and the protective film covers the film frame, forms a closed space with the film frame and is used for isolating the circuit pattern from the external environment. The fluorine-containing high polymer material is coated on the surface of the membrane frame, so that release of sulfate radicals and ammonium radicals is effectively blocked, and generation of mist is inhibited. And local laser etching is carried out on the film frame, so that the situation that the bonding performance of the bonding glue is reduced due to the fact that the surface is coated with the high-molecular coating glue is avoided.

Description

Technical Field

[0001] The invention relates to the field of semiconductor mask plate materials, and in particular to a polymer-coated and laser-roughened photomask. Background Art

[0002] In the field of semiconductor manufacturing, photomasks are key components of the photolithography process. The finished product structure consists of the photomask itself and the protective frame film tightly attached to it. In the current production and manufacturing of high-end photomasks, it is necessary to avoid the residual sulfate and ammonium radicals. This is because, during the use of the back-end mask, as the number of uses increases, these residual sulfate and ammonium radicals will undergo a photochemical reaction, gradually transform into mist, and gradually gather on the pattern of the photomask. Figure 1 As shown in the figure, the generation of photomask mist can be clearly seen. The presence of these mists will seriously damage the circuit structure of the mask plate, causing circuit short circuit failures, and ultimately causing a large number of chips to be scrapped due to failure to work properly, causing huge economic losses to semiconductor manufacturers.

[0003] In-depth investigation of the reasons, during the photomask manufacturing process, both the photomask body and the protective frame film contain sulfate (SO4 2- ) and ammonium ion (NH4 + ) Risk of residual ions. In the photomask body, the sulfuric acid-based solution used in the etching process will inevitably leave residues on its surface. During the etching process, the sulfuric acid-based solution reacts chemically with the material of the photomask body, and some sulfate ions will be embedded in the microstructure of the material, which is difficult to completely remove with subsequent conventional cleaning operations.

[0004] As for the protective frame film, it is usually manufactured using an anodizing process, and the electrolyte used contains H2SO4. During the anodizing process, a series of complex chemical reactions will occur on the surface of the aluminum frame, causing sulfate ions to be firmly adsorbed on the surface of the aluminum frame. These adsorbed sulfate ions become potential hazards for subsequent photochemical reactions.

[0005] During the subsequent use of the mask, after multiple exposures, the residual sulfate and ammonium ions will undergo a series of complex photochemical reactions under the action of light, eventually generating ammonium sulfate crystals. These ammonium sulfate crystals will continue to accumulate in the graphic area, and over time, gradually lead to the emergence of line short circuit problems. Especially in the 193nm process, this phenomenon has a particularly significant impact on the chip yield. Relevant data show that the chip yield of the 193nm process may drop to below 50%, seriously restricting the production efficiency and quality of semiconductor products.

[0006] More problematically, chemical bonds will form between sulfate radicals and the aluminum oxide layer. The existence of such chemical bonds makes it impossible to completely remove sulfate radicals using traditional cleaning methods, such as cleaning with deionized water. Moreover, the enclosed space formed between the protective film of the photomask and the photomask provides favorable conditions for the deposition of reaction products. In this relatively enclosed environment, the ammonium sulfate crystals formed by the reaction cannot effectively diffuse and can only accumulate continuously, thereby accelerating the formation of foggy substances.

[0007] From the perspective of the existing technology, the aluminum frame plays a crucial supporting and protecting role in the photomask structure. Therefore, it must have good rigidity and heat resistance to ensure stable physical properties during the exposure process (the temperature can be as high as 150 °C during exposure). However, there are many insurmountable problems when traditional coating technologies are applied to the aluminum frame. On the one hand, traditional coatings are prone to peeling or decomposition in high-temperature environments and cannot continuously provide effective protection for the aluminum frame. On the other hand, during the coating application process, it is also necessary to avoid having an adverse impact on the adhesion between the aluminum frame and the protective film, otherwise it will lead to a decrease in the stability of the protection structure. Taking the parylene evaporation coating technology as an example, although this technology can provide protection for the aluminum frame to a certain extent, it has the problems of high cost and low production efficiency, which undoubtedly increases the production cost of enterprises and reduces the production efficiency, and is greatly restricted in large-scale production applications.

[0008] In summary, in the face of the many problems existing in the current photomask manufacturing process, there is an urgent need for a new and effective solution to solve a series of problems brought about by sulfate radical and ammonium radical residues, so as to improve the overall level and economic benefits of semiconductor manufacturing. Summary of the Invention

[0009] The present invention provides a photomask with polymer coating and laser roughening, which is characterized by comprising:

[0010] A transparent substrate, the transparent substrate includes a middle region and an edge region surrounding the middle region;

[0011] A circuit pattern, located in the middle region of the transparent substrate, is a geometric pattern formed by opaque materials and is used to define the circuit structure of semiconductor devices;

[0012] A film frame, the film frame is locally laser-etched and adhered to the annular frame in the edge region of the transparent substrate, the annular frame surrounds the circuit pattern to form an enclosed space, and one or more layers of fluorine-containing polymer coating adhesives are coated on the film frame to block the release of sulfate radicals and ammonium radicals;

[0013] A protective film, covering the film frame, forms an enclosed space with the film frame, and is used to isolate the circuit pattern and the external environment.

[0014] In an embodiment of the present invention, it further includes an adhesive layer disposed on the upper and lower sides of the film frame for fixing the film frame on the transparent substrate and fixing the protective film on the film frame.

[0015] In an embodiment of the present invention, it is characterized in that the lower side of the film frame is locally laser-etched or both the upper and lower sides are locally laser-etched.

[0016] In an embodiment of the present invention, the fluorine-containing polymer coating glue is:

[0017] Fully covering on all four sides, with the fluorine-containing polymer coating glue coated on all outer surfaces of the film frame; or

[0018] Covering on both the inner and outer sides, with the fluorine-containing polymer coating glue coated on the inner and outer sides of the film frame, avoiding the upper and lower sides; or

[0019] Covering on the single outer side, with the fluorine-containing polymer coating glue coated on the outer side of the film frame, avoiding the other three sides.

[0020] In an embodiment of the present invention, the film frame is an aluminum frame.

[0021] In an embodiment of the present invention, the fluorine-containing polymer coating glue includes polytetrafluoroethylene, polyvinylidene fluoride, fluorinated acrylate, or any other polymer coating glue with a fluorine content higher than 20%.

[0022] The present invention also provides a method for manufacturing a photomask frame with polymer coating and laser roughening, which is characterized by including:

[0023] Removing oil stains, oxide layers, dust impurities on the surface of the film frame to ensure the adhesion of the coating;

[0024] Preparing the fluorine-containing polymer coating glue;

[0025] Coating one to several layers of fluorine-containing polymer coating glue on the film frame;

[0026] Crosslinking the polymer resin into a film to improve hardness and chemical resistance;

[0027] Performing local laser etching on the film frame;

[0028] Performing detection and functional verification.

[0029] In an embodiment of the present invention, the coating of one to several layers of fluorine-containing polymer coating glue on the film frame includes:

[0030] Spraying method, evenly spraying the surface of the film frame through a spray gun, controlling the thickness of a single coating layer. If multiple layers need to be coated, each layer needs to be dried before coating the next layer;

[0031] Brushing method: Use a brush or roller to dip the coating material and evenly brush it on the surface of the membrane frame, and achieve multi-layer coating through multiple thin coatings.

[0032] Immersion method: Completely immerse the membrane frame in the coating tank, keep it for a certain time, slowly lift the membrane frame, control the dripping to avoid too thick coating, and drain and dry it.

[0033] In an embodiment of the present invention, the performing of detection and functional verification includes:

[0034] Visually or microscopically observe the coating uniformity, without air bubbles, cracks or missed coating.

[0035] Use the cross-cut method to evaluate the adhesion between the coating and the membrane frame.

[0036] Detect the ammonium sulfate residue through IC test.

[0037] The present invention has the following beneficial effects:

[0038] (1) Effectively block the release of ammonium sulfate: Coating one to several layers of fluorine-containing polymer glue on the aluminum frame to form a physical barrier, and structurally prevent the release of ammonium sulfate on the aluminum frame. This design specifically solves the root cause of the problem caused by the sulfate and ammonium residues in the protective frame film, and provides a basic guarantee for the stable use of the photomask. Experiments have proved that this solution can lock the aluminum frame release substances in the glue. For the aluminum frame with ammonium sulfate content exceeding 200 ppb in the original IC test (ammonium ion detection), after being coated with fluorine-containing polymer glue, the ammonium sulfate can reach the non-detectable level. This achievement greatly reduces the problems such as the aggregation of fog and short circuits in the photomask caused by ammonium sulfate residue, and significantly improves the yield rate of the chip.

[0039] (2) Flexible coating methods: Provide various coating methods such as spraying, brushing, and immersion, which can be flexibly selected according to the shape, size of the aluminum frame and the actual production requirements. The processing temperature range from room temperature to 400 degrees adapts to the requirements of different materials and production environments. Different coating surface designs, such as four-sided full coating, inner and outer two-sided coating, and outer single-sided coating, meet diverse application scenarios, ensuring the protection effect while taking into account the compatibility with other components. This solution has 3 usage states, and different coating methods correspond to different ammonium sulfate release levels. The four-sided full coating has the best coating property, and the ammonium sulfate release is non-detectable or <2 ppb; for the inner and outer two-sided coating, considering that there are other bonding glues on the upper and lower sides and avoiding coating, the ammonium sulfate release is non-detectable or <5 ppb; for the outer single-sided coating, considering that there are other bonding glues on the upper, inner and three sides and avoiding coating, the ammonium sulfate release is non-detectable or <10 ppb. This characteristic enables the product to operate stably under different working conditions and environments, and improves the applicability and reliability of the photomask.

[0040] (3) By locally laser-etching the contact surface between the membrane frame and the bonding adhesive layer, it is possible to avoid changes in surface characteristics caused by coating with polymer adhesive, resulting in a decrease in the adhesive force of the adhesive and causing problems such as membrane frame peeling or glue peeling. By performing a local laser processing process on the bonding surface, the surface roughness is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 FIG. shows the generation phenomenon diagram of fog on a photomask plate in the prior art;

[0042] Figure 2 FIG. shows a schematic diagram of a photomask structure with polymer coating and laser roughening in an embodiment of the present invention;

[0043] Figure 3 FIG. shows a flowchart of manufacturing a photomask frame with polymer coating and laser roughening in an embodiment of the present invention; and

[0044] Figure 4 FIG. shows a schematic diagram of manufacturing a photomask frame with polymer coating and laser roughening in an embodiment of the present invention;

[0045] Figure 5 FIG. shows a schematic diagram of the structure of a photomask frame with polymer coating and laser roughening in an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0046] In the following description, the present invention is described with reference to the embodiments. However, those skilled in the art will recognize that the embodiments can be implemented without one or more specific details or in combination with other alternative and / or additional methods, materials, or components. In other cases, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the inventive points of the present invention. Similarly, for the purpose of explanation, specific quantities, materials, and configurations are set forth to provide a comprehensive understanding of the embodiments of the present invention. However, the present invention is not limited to these specific details.

[0047] In the present invention, the embodiments are merely intended to illustrate the solutions of the present invention and should not be construed as restrictive.

[0048] In this specification, the reference to "an embodiment" or "the embodiment" means that the specific features, structures, or characteristics described in connection with the embodiment are included in at least one embodiment of the present invention. The phrase "in an embodiment" appearing throughout this specification does not necessarily refer to the same embodiment.

[0049] In addition, the numbering of the steps of the methods of the present invention does not limit the execution order of the method steps. Unless otherwise specified, the method steps can be executed in different orders.

[0050] The present invention will be further described below with reference to the accompanying drawings in conjunction with the specific embodiments.

[0051] Figure 2 The schematic diagram of the polymer-coated and laser-roughened photomask structure in an embodiment of the present invention is shown.

[0052] As Figure 2 shown, the polymer-coated and laser-roughened photomask in an embodiment of the present invention includes:

[0053] A transparent substrate 10, the transparent substrate includes an intermediate region and an edge region surrounding the intermediate region. In this embodiment, quartz glass is used as the material of the transparent substrate 10, which has the following advantages:

[0054] High light transmittance: The light transmittance to 193 nm deep ultraviolet light needs to be > 90%, ensuring the effective transmission of exposure energy.

[0055] Low coefficient of thermal expansion: Close to quartz glass (0.55×10 -6 / °C), avoiding pattern distortion caused by temperature changes.

[0056] Chemical stability: Resistant to corrosion by etching solutions (such as H2SO4, HF) and cleaning solvents.

[0057] Surface flatness: Nanometer-level precision (such as TTV < 50 nm), ensuring the uniformity of circuit patterns.

[0058] A circuit pattern 20, located in the intermediate region of the transparent substrate 10, is a geometric pattern formed by an opaque material, used to define the circuit structure of a semiconductor device. Usually made of metal materials such as chromium (Cr), molybdenum silicide (MoSi), etc., and deposited on the transparent substrate 10 through sputtering or evaporation processes.

[0059] A mask frame 30, an annular frame adhered to the edge region of the transparent substrate 10, the annular frame surrounds the circuit pattern 20 to form a sealed space. A layer or multiple layers of fluorine-containing polymer coating is applied on the mask frame 30 to block the release of sulfate and ammonium radicals. And as Figure 5 shown, local laser etching treatment is performed on the lower layer of the mask frame 30, or local laser etching treatment is performed on both the upper and lower sides.

[0060] A protective film 40, covering the mask frame, cooperating with the mask frame to form a sealed space, preventing the surfaces of the intermediate region of the photomask frame 30 and the circuit pattern 20 from contacting the outside.

[0061] The bonding adhesive layer 50. The bonding adhesive is used to fix the protective film 40 on the film frame 30 and fix the film frame 30 on the transparent substrate 10, forming a sealed space to protect the photomask circuit pattern 20. Its material needs to meet strict requirements such as high bonding strength, high temperature resistance, chemical corrosion resistance and low volatility. Usually, acrylate adhesives, silicone adhesives, epoxy resin adhesives or fluoropolymer adhesives are used.

[0062] In the prior art, the accumulation process of ammonium sulfate crystallization is specifically divided into four steps:

[0063] Sulfide oxidation: The sulfate residue in the aluminum frame or the protective film decomposes into sulfide ions, which are oxidized to sulfur dioxide under the irradiation of 193nm light.

[0064]

[0065] Active oxygen generation: The 193nm light energy decomposes oxygen molecules into active oxygen atoms, which further oxidize sulfur dioxide to sulfur trioxide.

[0066] SO2(adsorbed)+O(gaseous)→SO3(adsorbed).

[0067] Sulfuric acid formation: SO3 combines with water vapor in the air to form sulfuric acid.

[0068] SO3(adsorbed)+H2O(gaseous)→H2SO4(adsorbed).

[0069] Ammonium sulfate crystallization: Sulfuric acid reacts with ammonia (NH3) in the environment to form white ammonium sulfate crystals.

[0070] H3SO4(adsorbed)+2NH3(gaseous)→(NH4)2SO4(crystals).

[0071] In the present invention, by coating a fluorine-containing polymer material on the surface of the aluminum frame, the release of sulfate ions and ammonium ions can be effectively blocked, thereby inhibiting the occurrence of the above reactions.

[0072] Figure 3 The flowchart of manufacturing a photomask frame with polymer coating and laser roughening in an embodiment of the present invention is shown.

[0073] As Figure 3 shown, the manufacturing process of the photomask frame with polymer coating and laser roughening is as follows:

[0074] Film frame pretreatment 100:

[0075] Surface cleaning: Remove impurities such as oil stains, oxide layers, and dust on the surface of the aluminum frame to ensure the adhesion of the coating. The operation process is as follows:

[0076] Use an alkaline solution (such as NaOH) or an organic solvent (such as acetone) for ultrasonic cleaning to remove grease;

[0077] Rinse with deionized water and dry.

[0078] In an embodiment of the present invention, this step further includes surface roughening: increasing the surface roughness of the aluminum frame to improve the mechanical bonding force of the coating. The operation process is as follows:

[0079] Chemical etching (such as a mixed solution of H2SO4 + HNO3) or sandblasting;

[0080] Clean and dry again.

[0081] Preparation of fluorine-containing polymer coating glue 200: Fluorine-containing polymers are usually polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), or fluorinated acrylic polyester, or any other polymer coating glue with a fluorine content higher than 20%. Selection should be based on heat resistance, adhesion, cost, etc. For example, PTFE is heat-resistant (up to 260 °C), but requires high-temperature sintering. PVDF has good chemical resistance and can be cured at room temperature. The specific process is as follows:

[0082] Dissolve the fluorine-containing polymer resin in a solvent (such as NMP, DMF) to prepare a solution with a concentration above 20%. If powder coatings are used, electrostatic spraying or fluidized bed dipping is required.

[0083] Coating the membrane frame 300:

[0084] Spraying method, suitable for complex shapes, and is carried out by an air spray gun or an electrostatic spray gun. The process is as follows:

[0085] Adjust the spray gun pressure (such as 0.3 - 0.5 MPa) and the coating flow rate;

[0086] Uniformly spray the surface of the aluminum frame, and control the single-layer coating thickness (usually 5 - 20 μm);

[0087] If multiple layers of coating are required, each layer needs to be dried before applying the next layer.

[0088] Brushing method, suitable for small-sized or complex-shaped membrane frames. The process is as follows:

[0089] Dip a brush or roller into the coating and evenly brush it on the surface of the aluminum frame;

[0090] Achieve multiple-layer coating through multiple thin coatings.

[0091] Immersion method, suitable for batch processing or membrane frames that require a uniform coating. The process is as follows:

[0092] Completely immerse the aluminum frame in the coating tank for a certain period of time (such as 1 - 5 minutes);

[0093] Slowly lift the aluminum frame and control the dripping to avoid excessive coating thickness;

[0094] Dry and then dry.

[0095] Curing process 400: Put the coated membrane frame into an oven or curing furnace, process it according to the set temperature and time, and take it out after cooling to room temperature.

[0096] The purpose is to crosslink the polymer resin into a film to improve hardness and chemical resistance. The temperature can be selected according to the material (for example, PVDF can be cured at room temperature, and PTFE needs to be sintered at 375 °C). The time-consuming is usually 30 minutes to 2 hours.

[0097] Laser etching 500:

[0098] Perform local laser etching treatment on the upper and lower sides or the upper side of the membrane frame to increase the adhesion between the membrane frame and the bonding adhesive layer.

[0099] Post-treatment and inspection 600:

[0100] Surface inspection, visually or under a microscope to observe the coating uniformity, without bubbles, cracks or missed coating.

[0101] Adhesion test, use the cross-cut method (ASTM D3359) to evaluate the bonding strength between the coating and the membrane frame.

[0102] Function verification, detect the ammonium sulfate residue according to the IC test method to ensure no detection or <10 ppb.

[0103] In an embodiment of the present invention, the protective film 40 formed by fluorine-containing polymer coating covering the membrane frame 30 is divided into three cases:

[0104] Full four-sided coverage: All outer surfaces of the membrane frame 30 (including the four sides of up, down, left and right) need to be coated with glue.

[0105] Two-sided coverage of the inner and outer sides: Only coat the inner and outer sides of the membrane frame 30, avoiding the upper and lower sides (if there is a need for tape sticking).

[0106] Single-sided coverage of the outer side: Only coat the outer side of the membrane frame 30, avoiding the other three sides.

[0107] Figure 4 Shows a schematic diagram of the production of a photomask frame with polymer coating and laser roughening in an embodiment of the present invention.

[0108] As Figure 4 shown, after the membrane frame is coated with glue and cured by the membrane frame gluing 300, it is then subjected to laser etching 500. Local laser etching treatment is performed on the upper and lower sides or the upper side of the membrane frame to increase the adhesion between the membrane frame and the bonding adhesive layer. After passing through the bonding adhesive layer 700, the bonding with the bonding adhesive layer 50 is completed.

[0109] After the membrane frame undergoes local laser etching, the surface roughness increases, thus avoiding the decrease in adhesion caused by the surface coating of polymer glue. And it has been proven by experiments that the original ammonium sulfate content in the aluminum frame IC test (ammonium ion detection) exceeded 200 ppb. After being coated with a fluorine-containing polymer glue and undergoing local laser etching, the ammonium sulfate can reach <10 ppb or the non-detection level, and this operation can still limit the release of ammonium sulfate from the aluminum frame.

[0110] Figure 5 The schematic structural diagram of the photomask frame with polymer coating and laser roughening in an embodiment of the present invention is shown.

[0111] As Figure 5 described, the membrane frame 30 includes:

[0112] A fluorine-containing polymer glue layer 31, and the fluorine-containing polymer glue includes polytetrafluoroethylene, polyvinylidene fluoride, fluorinated acrylate or any other polymer glue with a fluorine content higher than 20%.

[0113] A local laser etching area 32, which performs local laser etching treatment on the upper and lower sides or the lower side of the membrane frame 30 to increase the roughness of the surface of the membrane frame 30, so as to increase the adhesion between the membrane frame 30 and the bonding glue layer 50.

[0114] Although the embodiments of the present invention have been described above, it should be understood that they are presented only as examples and not as limitations. It will be obvious to those skilled in the relevant art that various combinations, deformations and changes can be made to them without departing from the spirit and scope of the present invention. Therefore, the width and scope of the present invention disclosed herein should not be limited by the above-disclosed exemplary embodiments, but should be defined only by the appended claims and their equivalents.

Claims

1. A polymer-coated and laser-roughened photomask, characterized in that, Comprising: A transparent substrate, the transparent substrate including a middle region and an edge region surrounding the middle region; A circuit pattern, located in the middle region of the transparent substrate, being a geometric pattern formed of a light-impermeable material and used to define the circuit structure of a semiconductor device; A film frame, the film frame being locally laser-etched and adhered to an annular frame in the edge region of the transparent substrate, the annular frame surrounding the circuit pattern to form a sealed space, and one or more fluorine-containing polymer coatings being applied to the film frame for blocking the release of sulfate radicals and ammonium radicals; And A protective film, covering the film frame and forming a sealed space with the film frame for isolating the circuit pattern from the external environment.

2. The polymer-coated and laser-roughened photomask according to claim 1, wherein It further includes an adhesive layer, which is arranged on both the upper and lower sides of the film frame for fixing the film frame on the transparent substrate and fixing the protective film on the film frame.

3. The photomask for laser roughening of a polymer-coated surface according to claim 2, characterized in that, The lower side of the film frame is locally laser-etched or both the upper and lower sides are locally laser-etched.

4. The polymer-coated and laser-roughened photomask according to claim 1, wherein The fluorine-containing polymer coating is: Fully coated on all four sides, with the fluorine-containing polymer coating being coated on all outer surfaces of the film frame; or Coated on both the inner and outer sides, with the fluorine-containing polymer coating being coated on the inner and outer sides of the film frame, avoiding the upper and lower sides; or Coated on the outer side only, with the fluorine-containing polymer coating being coated on the outer side of the film frame, avoiding the other three sides.

5. The polymer-coated and laser-roughened photomask according to claim 1, wherein The film frame is an aluminum frame.

6. The polymer-coated and laser-roughened photomask according to claim 1, wherein The fluorine-containing polymer coating includes polytetrafluoroethylene, polyvinylidene fluoride, fluorinated acrylate, or any other polymer coating with a fluorine content higher than 20%.

7. A manufacturing method of a polymer-coated and laser-roughened photomask frame, characterized in that, Comprising: Removing oil stains, oxide layers, dust impurities on the surface of the film frame to ensure the adhesion of the coating; Preparing a fluorine-containing polymer coating; Coating one to several layers of fluorine-containing polymer coating on the film frame; Crosslinking the polymer resin into a film to improve hardness and chemical resistance; Performing local laser etching on the film frame; Conducting inspection and function verification.

8. The manufacturing method of the polymer-coated and laser-roughened photomask frame according to claim 7, characterized in that, The coating of one to several layers of fluorine-containing polymer coating on the film frame includes: Spraying method, evenly spraying the surface of the film frame through a spray gun, controlling the thickness of a single coating layer, and if multiple layers need to be coated, each layer needs to be dried before coating the next layer; Brushing method, dipping a brush or roller in the coating material and evenly brushing it on the surface of the film frame, and achieving multiple-layer coating through multiple thin coatings; Immersion method, completely immersing the film frame in a coating tank, maintaining for a certain time, slowly lifting the film frame, controlling the dripping to avoid excessive coating thickness, and draining and drying.

9. The manufacturing method of the polymer-coated and laser-roughened photomask frame according to claim 7, characterized in that, The conducting of inspection and function verification includes: Visually or microscopically observing the coating uniformity, without bubbles, cracks or missed coating; Evaluating the adhesion of the coating to the film frame using the cross-cut method; Detecting ammonium sulfate residue through IC testing.

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