A glue coating and developing machine

Abstract

The present application relates to wafer processing equipment processing technical field, specifically for a kind of glue coating developing machine, including handling mechanical arm, for transporting wafer;Container, for storing photoresist, further include opening and closing mechanism, it is set to the top of container, the open state of the top of container can be controlled;The opening and closing mechanism includes slidingly arranged in the top end of container opening and closing component and the transmission sleeve ring movably fitted in the outside of container.This application when handling mechanical arm drives wafer to move to container through transmission sleeve ring, can extrude transmission sleeve ring to move downwards, in turn drive opening and closing component to open to the lateral side of container, open the top end of container, to realize the dipping of wafer to photoresist;When wafer completes dip glue and centrifugal coating, handling mechanical arm drives wafer to separate from container, opening and closing component can reset and close container again, ensure that container is in closed state under non-working state, to avoid the influence of solvent volatilization in photoresist on coating quality.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, specifically to a coating and developing machine. Background Technology

[0002] A photoresist coating and developing machine generally consists of a transmission system, a coating system, a heating system, and a developing system. It integrates photoresist coating, heating and drying, and developing functions to automate the batch coating and developing of wafers. Traditional wafer coating uses an upright, static spin-coating process, which suffers from problems such as the difficulty in recovering the photoresist ejected by centrifugation.

[0003] For example, patent CN116943983B discloses a wafer photoresist coating apparatus and method, including a container, a material handling unit, a power unit, and a heating unit. The container is used to hold photoresist, the material handling unit is used to fix the wafer, the heating unit is disposed on the material handling unit and used to heat the wafer, the material handling unit is located above the container, and the power unit is connected to the material handling unit and used to drive the material handling unit to move up and down, so that the wafer contacts and detaches from the photoresist. The power unit is also used to drive the material handling unit to rotate around the central axis of the wafer. This can throw excess photoresist into the container, improving the photoresist utilization rate.

[0004] In the prior art of the aforementioned patent, the wafer is driven inverted by a power unit into a container to pick up photoresist, and centrifugal coating is completed within the container, enabling convenient recycling of the photoresist. However, since the container is always open, the solvent in the photoresist will evaporate to the outside, causing the photoresist viscosity to increase and affecting the subsequent coating effect. Therefore, there is an urgent need for a photoresist coating and developing machine to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a coating and developing machine to overcome the above-mentioned shortcomings of the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a photoresist coating and developing machine, including a transport robotic arm for transporting wafers; a container for holding photoresist; and an opening and closing mechanism disposed on the top of the container to control the open state of the top of the container.

[0007] The opening and closing mechanism includes an opening and closing component slidably disposed on the top of the container and a transmission collar movably fitted on the outside of the container, wherein the transmission collar and the opening and closing component are connected by transmission.

[0008] When the transport robot arm moves the wafer through the middle of the transmission collar into the container, it can squeeze the transmission collar downward. During the downward movement, the transmission collar can push the opening and closing component to move outward of the container, opening the top of the container. When the transport robot arm moves the wafer away from the wafer, the opening and closing component can reset and close the top of the container again.

[0009] Preferably, the end effector of the handling robotic arm is provided with an adsorption and rotation mechanism for adsorbing the wafer and driving the wafer to rotate around its central axis.

[0010] Preferably, the adsorption rotation mechanism includes an air guide rod, which is rotatably mounted on the end effector of the handling robotic arm. The bottom end of the air guide rod is fixedly connected to a vacuum suction cup for adsorbing the wafer, and the top end of the air guide rod is fixedly connected to a rotary joint.

[0011] Preferably, the adsorption rotation mechanism further includes a servo motor, which is fixedly installed at the end of the handling robotic arm to provide power for the rotation of the air guide rod.

[0012] Preferably, the opening and closing components can completely cover the top of the container after assembly. The opening and closing components include an opening and closing plate, the part of the opening and closing plate that cooperates with the top of the container is fan-shaped, and a tension spring is provided at one end of the opening and closing plate near the periphery of the container to drive the opening and closing plate to return to its original position.

[0013] Preferably, the opening and closing mechanism further includes a transmission arm, which is disposed between the opening and closing component and the transmission collar. The transmission collar drives the opening and closing component to move outward of the container through the transmission arm.

[0014] Preferably, the container is provided with a blowing mechanism, which is connected to the transmission collar. When the transmission collar moves down, it can drive the blowing mechanism to blow the photoresist in the central area inside the container to form an upwardly protruding blowing part.

[0015] Preferably, the blowing mechanism includes a piston rod and a blowing tube. The blowing tube is fixedly installed on the container, with one end extending to the central area inside the container and the other end extending to the outside of the container. The piston rod is fixedly installed on the transmission collar and is inserted into the portion of the blowing tube located on the outside of the container.

[0016] Preferably, a lifting blower head is movably fitted at one end of the blowing tube located inside the container, and the outlet of the lifting blower head is a tapered opening. When the piston rod moves down inside the blowing tube and pushes the photoresist to flow inside the blowing tube, the photoresist discharged along the outlet of the blowing tube can push the lifting blower head upward.

[0017] Preferably, an isolation ring is provided on the periphery of the lifting blower head. When the wafer dips into the photoresist, the isolation ring can move upward under the action of the lifting blower head and abut against the bottom of the wafer.

[0018] In the above technical solution, the beneficial effects of the present invention are as follows: when the handling robot arm drives the wafer through the transmission sleeve into the container, it can squeeze the transmission sleeve downward, thereby driving the opening and closing component to open to the periphery of the container, opening the top of the container to realize the wafer's dipping in photoresist; after the wafer completes the dipping and centrifugal coating, the handling robot arm drives the wafer to detach from the container, and the opening and closing component can reset to close the container again, ensuring that the container is in a closed state when not in operation, thereby avoiding the evaporation of solvent in the photoresist from affecting the coating quality; in addition, after the wafer dips in the photoresist, it is completely centrifugally coated in the container, and excess photoresist can be directly thrown into the container for recycling, improving the utilization rate of photoresist.

[0019] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this disclosure.

[0020] This application provides an overview of various implementations or examples of the technology described in this disclosure, and is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of the overall assembled structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the overall structure of the adsorption rotation mechanism of the present invention;

[0024] Figure 3 This is a schematic diagram of the cross-sectional structure of the opening and closing mechanism of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the opening and closing component of the present invention installed on the top of the container;

[0026] Figure 5 This is a schematic diagram of the overall structure of the opening and closing component of the present invention;

[0027] Figure 6 This is a schematic diagram of the transmission collar of the present invention;

[0028] Figure 7This is a schematic diagram of the working structure of the blowing mechanism of the present invention;

[0029] Figure 8 This is a schematic diagram of the structure of the blowing part of the present invention in conjunction with the wafer;

[0030] Figure 9 This is a schematic diagram of the structure of the present invention after the blowing pipe, the lifting blowing head and the isolation ring are combined.

[0031] Figure 10 This is a top view of the structure of the blowing part of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] In the diagram: 1. Support frame; 2. Handling robotic arm;

[0034] 3. Adsorption rotation mechanism; 31. Air guide rod; 32. Vacuum suction cup; 33. Rotary joint; 34. Servo motor; 35. Synchronous transmission gear; 36. Synchronous transmission toothed belt;

[0035] 4. Serving vessels;

[0036] 5. Opening and closing mechanism; 51. Opening and closing components; 511. Opening and closing plate; 512. Tension spring; 513. Guide groove; 514. Guide rail; 52. Transmission collar; 53. Transmission arm; 54. Pressure plate; 55. Clearance groove;

[0037] 6. Blowing mechanism; 61. Piston rod; 62. Blowing pipe; 63. Lifting blower head; 64. Isolation ring; 65. Connecting arm; 66. Blowing section;

[0038] 7. Wafer; 8. Solenoid valve; 9. Liquid level sensor. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0040] Please see Figure 1-10 The present invention provides a technical solution: a photoresist coating and developing machine, including a handling robotic arm 2 for transporting wafers 7; and a container 4 for holding photoresist;

[0041] The coating and developing machine of this application also includes a carrier frame 1, a transport robotic arm 2 fixedly installed on one side of the carrier frame 1, and a container 4 fixedly installed on the other side of the carrier frame 1; the transport robotic arm 2 is the prior art, which can drive the wafer 7 to perform horizontal transport and vertical lifting, and at the same time, a rotating component can be added to the execution end of the transport robotic arm 2 as needed to achieve 180° rotation of the wafer 7;

[0042] It also includes an opening and closing mechanism 5, which is located on the top of the container 4 and can control the open state of the top of the container 4;

[0043] The opening and closing mechanism 5 includes an opening and closing component 51 that is slidably disposed on the top of the container 4 and a transmission collar 52 that is movably fitted on the outside of the container 4. The transmission collar 52 and the opening and closing component 51 are connected by transmission.

[0044] When the handling robot arm 2 moves the wafer 7 through the middle of the transmission collar 52 into the container 4, it can squeeze the transmission collar 52 to move downward. During the downward movement, the transmission collar 52 can push the opening and closing component 51 to move outward of the container 4, opening the top of the container 4. When the handling robot arm 2 moves the wafer 7 away from the wafer 7, the opening and closing component 51 can reset and close the top of the container 4 again.

[0045] Specifically, under the control of the existing technology control system, the handling robotic arm 2 adsorbs the wafer 7 supplied in place by the existing technology feeding mechanism, and under the control of the control system, moves the wafer 7 to the top position of the opening and closing mechanism 5. After the wafer 7 is in place, it is on the central axis of the transmission sleeve 52. The handling robotic arm 2 continues to move the wafer 7 down into the container 4 under the control of the control system. The height at which the handling robotic arm 2 moves the wafer 7 down is always kept constant by the control system. When the handling robotic arm 2 moves the wafer 7 down into the container 4, it simultaneously squeezes the transmission sleeve. As ring 52 moves downward, the transmission collar 52 drives the opening and closing component 51 to move outward of the container 4, opening the top of the container 4 and providing a channel for the wafer 7 to enter the container 4. After the wafer 7 completes the photoresist coating and centrifugal coating in the container 4, the transport robot arm 2 drives the wafer 7 to detach from the container 4 and directly transports the coated wafer 7 to the subsequent processing step. After the wafer 7 detaches from the container 4, the transport robot arm 2 simultaneously releases the downward pressure on the transmission collar 52, and the opening and closing component 51 resets and closes again, sealing the top of the container 4 to prevent the solvent in the photoresist from evaporating.

[0046] Compared with the prior art, the present invention, when the transport robotic arm 2 moves the wafer 7 through the transmission collar 52 into the container 4, can squeeze the transmission collar 52 downward, thereby causing the opening and closing component 51 to open to the periphery of the container 4, opening the top of the container 4 to achieve the wafer 7 to dip in photoresist; after the wafer 7 has completed the dip in photoresist and centrifugal coating, the transport robotic arm 2 moves the wafer 7 away from the container 4, and the opening and closing component 51 can reset to close the container 4 again, ensuring that the container 4 is in a closed state when not in operation, thereby avoiding the impact of solvent evaporation in the photoresist on the coating quality; in addition, after the wafer 7 dips in photoresist and completes the centrifugal coating in the container 4, the excess photoresist can be directly thrown into the container 4 for recycling, improving the utilization rate of photoresist.

[0047] The photoresist coating and developing machine of this application also includes a liquid level sensor 9 fixedly installed inside the container 4 and a solenoid valve 8 fixedly installed at the bottom of the container 4. Since the photoresist is coated on the wafer 7, the photoresist inside the container 4 is continuously consumed. During the interval between two working cycles of coating the wafer 7, the liquid level sensor 9 detects the liquid level of the photoresist inside the container 4, and the solenoid valve 8 is controlled by the control system in the prior art. Photoresist can be added to the container 4 through the glue supply component in the prior art. The solenoid valve 8 and the liquid level sensor 9 are common existing technologies.

[0048] In one embodiment of the present invention, the end of the handling robotic arm 2 is provided with an adsorption and rotation mechanism 3 for adsorbing the wafer 7 and driving the wafer 7 to rotate around its central axis. Specifically, after the adsorption and rotation mechanism 3 has adsorbed the wafer 7 and the handling robotic arm 2 has transported the wafer 7 into the container 4, the adsorption and rotation mechanism 3 can drive the wafer 7 to rotate and centrifugally coat the bottom of the wafer 7 with photoresist.

[0049] In one embodiment of the present invention, the adsorption rotation mechanism 3 includes an air guide rod 31, which is rotatably mounted on the execution end of the handling robotic arm 2. The bottom end of the air guide rod 31 is fixedly connected to a vacuum suction cup 32 for adsorbing the wafer 7. The top end of the air guide rod 31 is fixedly connected to a rotary joint 33. Specifically, the air guide rod 31 is rotatably mounted on the execution end of the handling robotic arm 2 via a bearing, which enables communication between the vacuum suction cup 32 and the rotary joint 33. The rotary joint 33 is connected to the gas supply system in the prior art, and under the control of the control system, the working state of the vacuum suction cup 32 can be controlled, thereby enabling the vacuum suction cup 32 to adsorb or release the wafer 7. At the same time, the air guide rod 31 can rotate at the execution end of the handling robotic arm 2, thereby driving the wafer 7 to perform centrifugal coating. The rotary joint 33 is provided at the top end of the air guide rod 31 to satisfy the gas conduction of the air guide rod 31 while enabling the air guide rod 31 to rotate stably.

[0050] In another embodiment of the present invention, the adsorption rotation mechanism 3 further includes a servo motor 34, which is fixedly installed at the end of the handling robotic arm 2 to provide power for the rotation of the air guide rod 31. Specifically, the output shaft of the servo motor 34 and the upper part of the air guide rod 31 are both fixedly fitted with synchronous transmission gears 35, and the two sets of synchronous transmission gears 35 are externally meshed with synchronous transmission belts 36. The servo motor 34 and the air guide rod 31 are transmitted through the synchronous transmission gears 35 and the synchronous transmission belts 36. Under the control of the control system, the servo motor 34 can drive the air guide rod 31 and the vacuum suction cup 32 to rotate, so as to realize the centrifugal coating of the wafer 7 after dipping in photoresist. After the wafer 7 dips in photoresist, it completes the centrifugal coating in the container 4. The excess photoresist can be directly thrown into the container 4 for recycling, which improves the utilization rate of photoresist.

[0051] In another embodiment of the present invention, the opening and closing components 51 can completely cover the top of the container 4 after assembly. The opening and closing components 51 include an opening and closing plate 511. The part of the opening and closing plate 511 that cooperates with the top of the container 4 is fan-shaped. A tension spring 512 is provided at one end of the opening and closing plate 511 near the periphery of the container 4 to drive the opening and closing plate 511 to reset. Specifically, a number of opening and closing components 51 are slidably installed on the top of the container 4 in a circular array. The fan-shaped parts of the number of opening and closing plates 511 can be combined into a complete circle to achieve full coverage of the top of the container 4. When the container 4 is in a non-working state, the tension spring 512 applies a pulling force to the opening and closing plate 511, which can cover the top of the container 4 and seal the container 4 to prevent the solvent in the photoresist from evaporating outward.

[0052] In another embodiment of the present invention, the opening and closing mechanism 5 further includes a transmission arm 53, which is disposed between the opening and closing component 51 and the transmission collar 52. The transmission collar 52 drives the opening and closing component 51 to move outward of the container 4 through the transmission arm 53. Specifically, the opening and closing mechanism 5 also includes a pressure plate 54, which is movably fitted outside the air guide rod 31 and fixedly installed on the execution end of the handling robot arm 2. One end of the transmission arm 53 is hinged to the inner ring of the transmission collar 52, and the other end is hinged to the end of the opening and closing plate 511 near the outside of the container 4. When the handling robot arm 2 moves the wafer 7 downward into the container 4, it can simultaneously squeeze the transmission collar 52 through the pressure plate 54, pushing the transmission collar 52 downward. The transmission arm 53 drives several opening and closing plates 511 to overcome the elastic force of the tension spring 512 and move them to the outside of the container 4, opening the top of the container 4 and providing a channel for the wafer 7 to enter the container 4. The bottom of the opening and closing plate 511 is fixedly installed with a guide rail 514, and the top of the container 4 is provided with a guide groove 513 that cooperates with the guide rail 514. The guide groove 513 cooperates with the guide rail 514 to restrict the opening and closing plate 511 and ensure its stability when moving at the top of the container 4. The transmission collar 52 is provided with a clearance groove 55 that cooperates with the opening and closing component 51. When the opening and closing component 51 moves to the periphery of the container 4, a clearance space is provided in the transmission collar 52 to meet the movement requirements of the opening and closing component 51.

[0053] As can be seen from the above embodiments, the wafer 7 is moved inverted to the container 4 by the transport robot arm 2 for photoresist dipping and centrifugal coating. However, the wafer 7 is relatively thin. When dipping the bottom of the wafer 7, the photoresist is easy to spread along the edge of the wafer 7 to its back side, increasing the difficulty of back-end cleaning. In this regard, the following embodiments are proposed to solve this problem.

[0054] In one embodiment of the present invention, a blowing mechanism 6 is provided on the container 4, which is connected to the transmission collar 52. When the transmission collar 52 moves downward, it can drive the blowing mechanism 6 to blow the photoresist in the central area inside the container 4 to form an upwardly protruding blowing part 66. Specifically, during the process of the wafer 7 moving down into the container 4, the transmission collar 52 is driven to move downward simultaneously, and the transmission collar 52 drives the blowing mechanism 6 to blow the photoresist inside the container 4, thereby forming an upwardly protruding blowing part 66 in the central area of ​​the photoresist liquid surface. This ensures that only the bottom central area of ​​the wafer 7 contacts the photoresist during the process of moving down and dipping in the container 4, thereby avoiding the adhesion of photoresist to the back of the wafer 7 and reducing the subsequent cleaning process of the back of the wafer 7.

[0055] In one embodiment of the present invention, the blowing mechanism 6 includes a piston rod 61 and a blowing tube 62. The blowing tube 62 is fixedly installed on the container 4, with one end extending to the central region inside the container 4 and the other end extending to the outside of the container 4. The piston rod 61 is fixedly installed on the transmission collar 52 and is inserted into the portion of the blowing tube 62 located outside the container 4. In this application, the blowing tubes 62 are arranged in a ring array on the container 4, and the positions of the piston rod 61 and the blowing tubes 62 correspond one-to-one and are arranged on the transmission collar 52. It should be noted that the blowing tubes 62 include, but are not limited to, the arrangement and number indicated in this application, to ensure that the blowing section 66 formed by a plurality of blowing tubes 62 can be dipped in adhesive at the bottom center region of the wafer 7. Specifically, during the process of the wafer 7 moving down to the container 4... The transmission collar 52 drives the piston rod 61 to move downwards synchronously. The piston rod 61 moves in the blowing tube 62, pushing the photoresist to move in the blowing tube 62 and extrude it along the outlet end of the blowing tube 62. The extruded photoresist can form a blowing part 66 at the outlet end of the blowing tube 62, which is higher than the photoresist liquid surface. The height of the blowing part 66 is higher than the height of the wafer 7 after it has moved to the bottom, which satisfies the requirement of the wafer 7 to pick up the photoresist in the blowing part 66 during the downward movement. When the wafer 7 and the opening and closing component 51 have moved to the bottom, the transmission collar 52 stops driving the piston rod 61 to move. At this time, the blowing part 66 disappears, avoiding the blowing part 66 from affecting the subsequent centrifugal coating of the wafer 7. When the transmission collar 52 moves upwards to reset, it can pull the piston rod 61 to move upwards synchronously. The piston rod 61 can re-pump the photoresist into the blowing tube 62, which is convenient for the subsequent continuous blowing operation.

[0056] In another embodiment of the present invention, a lifting blower head 63 is movably fitted at one end of the blowing tube 62 located inside the container 4, and the outlet of the lifting blower head 63 is a tapered opening. When the piston rod 61 moves downward inside the blowing tube 62, pushing the photoresist to flow inside the blowing tube 62, the photoresist discharged along the outlet of the blowing tube 62 can push the lifting blower head 63 upward. It should be noted that, due to the high viscosity of the photoresist, the photoresist extruded along the outlet end of the blowing tube 62 is insufficient to form the blowing section 66 that meets the height requirements. When the bottom of the wafer 7 dips into the photoresist at the blowing section 66, the distance between the bottom of the wafer 7 and the surface of the photoresist liquid is small. During centrifugal coating, when excess photoresist is splashed onto the photoresist surface, there is still a possibility that the splashed photoresist may be sputtered onto the back side of wafer 7. By moving the blower head 63 at the outlet end of the blower tube 62 and designing a constricted outlet for the blower head 63, the photoresist extruded from the outlet end of the blower tube 62 enters and is blocked by the constricted outlet of the blower head 63. This can push the blower head 63 upward and extrude along the constricted outlet of the blower head 63 to form the blower section 66. This can increase the formation height of the blower section 66, thereby reducing the downward height of wafer 7, increasing the distance between the bottom of wafer 7 and the photoresist surface, and preventing photoresist from sputtering onto the back side of wafer 7 during centrifugal coating.

[0057] In another embodiment of the present invention, an isolation ring 64 is provided on the periphery of the lifting blow head 63. When the wafer 7 dips in photoresist, the isolation ring 64 can move upward under the action of the lifting blow head 63 and abut against the bottom of the wafer 7. Specifically, during the blowing stage, the lifting blow head 63 lifts and simultaneously drives the connecting arm 65 to move upward, and abuts against the bottom of the wafer 7 during the downward movement of the wafer 7, so as to avoid the blown part 66 being too large and causing the photoresist to spread to the back of the wafer 7. After the transmission collar 52 drives the piston rod 61 to move down to the position, the lifting blow head 63 loses the lifting force brought by the flowing photoresist, and the formed blowing section 66 disappears. The lifting blow head 63 and the connecting arm 65 are reset by gravity, avoiding interference during the centrifugal coating of the wafer 7. After the blowing section 66 moves down and resets at the outlet end of the blowing tube 62, the top of the lifting blow head 63 is lower than the height of the photoresist liquid surface, which makes it easier for the piston rod 61 to reset and re-pump the photoresist into the blowing tube 62.

[0058] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A photoresist coating and developing machine, comprising a handling robotic arm (2) for transporting wafers (7); and a container (4) for holding photoresist, characterized in that, It also includes an opening and closing mechanism (5), which is located on the top of the container (4) and can control the open state of the top of the container (4); The opening and closing mechanism (5) includes an opening and closing component (51) slidably disposed on the top of the container (4) and a transmission collar (52) movably fitted on the outside of the container (4). The transmission collar (52) and the opening and closing component (51) are connected by transmission. When the transport robot arm (2) drives the wafer (7) through the middle of the transmission collar (52) into the container (4), it can squeeze the transmission collar (52) to move downward. During the downward movement, the transmission collar (52) can push the opening and closing component (51) to move outward to the container (4) and open the top of the container (4). When the transport robot arm (2) drives the wafer (7) to detach from the wafer (7), the opening and closing component (51) can reset and close the top of the container (4) again. The container (4) is provided with a blowing mechanism (6), which is connected to the transmission collar (52). When the transmission collar (52) moves down, it can drive the blowing mechanism (6) to blow the photoresist in the central area inside the container (4) to form an upwardly protruding blowing part (66).

2. The coating and developing machine according to claim 1, characterized in that, The handling robotic arm (2) is equipped with an adsorption and rotation mechanism (3) at its execution end, which is used to adsorb the wafer (7) and drive the wafer (7) to rotate around its central axis.

3. The coating and developing machine according to claim 2, characterized in that, The adsorption rotation mechanism (3) includes an air guide rod (31), which is rotatably mounted on the execution end of the handling robot arm (2). The bottom end of the air guide rod (31) is fixedly connected to a vacuum suction cup (32) for adsorbing the wafer (7). The top end of the air guide rod (31) is fixedly connected to a rotary joint (33).

4. A coating and developing machine according to claim 3, characterized in that, The adsorption rotation mechanism (3) also includes a servo motor (34), which is fixedly installed at the end of the handling robotic arm (2) to provide power for the rotation of the air guide rod (31).

5. A coating and developing machine according to claim 1, characterized in that, The opening and closing components (51) can completely cover the top of the container (4) after assembly. The opening and closing components (51) include an opening and closing plate (511). The part of the opening and closing plate (511) that cooperates with the top of the container (4) is fan-shaped. A tension spring (512) is provided at one end of the opening and closing plate (511) near the periphery of the container (4) to drive the opening and closing plate (511) to reset.

6. A coating and developing machine according to claim 1, characterized in that, The opening and closing mechanism (5) also includes a transmission arm (53) and is disposed between the opening and closing component (51) and the transmission collar (52). The transmission collar (52) drives the opening and closing component (51) to move to the outside of the container (4) through the transmission arm (53).

7. A coating and developing machine according to claim 1, characterized in that, The blowing mechanism (6) includes a piston rod (61) and a blowing tube (62). The blowing tube (62) is fixedly installed on the container (4), and one end of the blowing tube (62) extends to the central area inside the container (4), and the other end extends to the outside of the container (4). The piston rod (61) is fixedly installed on the transmission collar (52), and the piston rod (61) is inserted into the part of the blowing tube (62) located outside the container (4).

8. A coating and developing machine according to claim 7, characterized in that, The blowing tube (62) is movably fitted with a lifting blowing head (63) at one end inside the container (4), and the outlet of the lifting blowing head (63) is a tapered opening. When the piston rod (61) moves down inside the blowing tube (62) to push the photoresist to flow inside the blowing tube (62), the photoresist discharged along the outlet of the blowing tube (62) can push the lifting blowing head (63) upward.

9. A coating and developing machine according to claim 8, characterized in that, An isolation ring (64) is provided on the periphery of the lifting blow head (63). When the wafer (7) dips in photoresist, the isolation ring (64) can move upward and abut against the bottom of the wafer (7) under the action of the lifting blow head (63).

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