Process and device for recycling quartz crystal resonator base

Abstract

The invention discloses a technology and device for recycling a quartz crystal resonator base, and particularly relates to the technical field of quartz crystal resonators, and the technology comprises the following steps: 1, pouring the quartz crystal resonator base and a degumming agent into a box at the same time, carrying out water bath heating for 60 minutes, dissolving a conductive adhesive, and separating a wafer from the base; 2, a degumming agent is poured into the standby box, the quartz crystal resonator base is washed five times with hot water at the temperature of 50 DEG C, and the residual degumming agent and the wafer are washed clean; step 3, pouring the washed quartz crystal resonator base into a box filled with citric acid, and heating in a water bath for 30 minutes to remove potassium silicate on the surface of the quartz crystal resonator base; according to the invention, the conductive adhesive is decomposed by using potassium hydroxide, so that the quartz crystal resonator base is separated from the wafer, the bottleneck of base reutilization in the current crystal industry is solved, and the production cost of the quartz crystal resonator is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of quartz crystal resonators, and specifically to a process and device for the recycling of quartz crystal resonator bases. Background Art

[0002] A quartz crystal resonator is an electronic component that utilizes the piezoelectric effect of a quartz crystal to generate and maintain a stable frequency signal. It mainly consists of a crystal wafer, a resonant cavity, electrodes, a base, a package and leads, and a compensation network, etc., and is widely used in electronic devices. Among them, the base of a quartz crystal resonator is mainly made of ceramic, metal or plastic materials, which can support and fix the crystal wafer, and at the same time provide a stable environmental protection to prevent the influence of moisture and pollutants.

[0003] In the manufacturing process of a quartz crystal resonator, it needs to go through multiple processes of processing and production: chip arranging, cleaning, silvering, dispensing, trimming, sealing welding, etc. The base starts to be used from the dispensing process, and 1 - 2% of defective products will be generated during the production process before sealing welding. These defects are mainly caused by defective characteristics such as glue dots, chip mounting, chip frequency, and chip resistance. However, currently, the defective products after dispensing and trimming are directly scrapped, resulting in waste of materials and increased production costs. Therefore, we propose a process and device for the recycling of quartz crystal resonator bases to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a process and device for the recycling of quartz crystal resonator bases to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A process for the recycling of quartz crystal resonator bases, including the following steps:

[0006] Step 1: Pour the quartz crystal resonator base and the degumming agent into a box at the same time, and perform water bath heating for 60 minutes to dissolve the conductive glue and separate the crystal wafer from the base;

[0007] Step 2: Pour the degumming agent into a spare box, and rinse the quartz crystal resonator base with 50 - degree hot water 5 times to rinse off the residual degumming agent and the crystal wafer;

[0008] Step 3: Pour the rinsed - clean quartz crystal resonator base into a box containing citric acid, and perform water bath heating for 30 minutes to remove the potassium silicate on the surface of the quartz crystal resonator base;

[0009] Step 4: Pour the citric acid into a spare box, and rinse the quartz crystal resonator base with 50 - degree hot water 5 times to rinse off the residual citric acid and decomposition products;

[0010] Step 5: Place the rinsed quartz crystal resonator base in an oven at 150°C for baking; after baking, transplant the quartz crystal resonator base into the corresponding tray.

[0011] Step 6: Place the transplanted quartz crystal resonator base into the equipment for ion cleaning to remove foreign matters in the cavity of the resonator base, and finally perform vacuum packaging.

[0012] As a preferred technical solution of the present invention, the component of the degumming agent is potassium hydroxide, and the ratio of the resonator to potassium hydroxide is 70 g: 1000 g.

[0013] As a preferred technical solution of the present invention, the component of the citric acid is HOOCCH2C(OH)(COOH)CH2COOH, and the ratio of the quartz crystal resonator base to citric acid is 100 g: 500 g.

[0014] A processing device for applying the process of recycling quartz crystal resonator bases includes a box frame. A door frame is hinge-mounted on one side of the box frame. A plurality of lifting cylinders are fixedly installed on the inner upper wall of the box frame. The driving ends of the plurality of lifting cylinders are fixedly installed with a clamping device. A material placing device is arranged at the bottom of the clamping device. An upper baking device is arranged above the material placing device. A lower baking device is arranged below the material placing device. A limiting frame is fixedly installed on the inner lower wall of the box frame.

[0015] As a preferred technical solution of the present invention, the clamping device includes a clamping outer frame fixedly installed at the driving ends of the plurality of lifting cylinders. Two groups of symmetrically distributed connecting pieces are slidably clamped inside the clamping outer frame. The connecting pieces include two symmetrically distributed connecting frames that are slidably clamped inside the clamping outer frame. A first double-directional telescopic rod corresponding to the connecting piece is fixedly installed inside the clamping outer frame. The driving end of the first double-directional telescopic rod is fixedly installed with the two connecting frames in the corresponding connecting piece. The bottom ends of the connecting frames at the same side position in the two groups of connecting pieces are fixedly installed with positioning cross frames.

[0016] As a preferred technical solution of the present invention, the material placing device includes a plurality of material placing mechanisms evenly distributed. The material placing mechanism includes a material placing frame, and the plurality of material placing mechanisms are fixedly installed with each other through the material placing frame. A plurality of evenly distributed material placing grooves are formed in the material placing frame. Transverse sliding grooves are formed on both sides of the plurality of material placing grooves. Transverse sliding frames are slidably clamped in the transverse sliding grooves. Transverse sliding racks are slidably clamped in the transverse sliding frames. A positioning frame is fixedly installed on one side of the transverse sliding rack close to the transverse sliding groove. The positioning frame is slidably clamped on the material placing frame. One end of the positioning frame away from the transverse sliding rack extends into the corresponding material placing groove. A positioning wheel is rotatably installed at one end of the positioning frame away from the transverse sliding rack. Electric telescopic rods are fixedly installed at one ends of the transverse sliding frames. The driving ends of the electric telescopic rods are fixedly installed with the ends of the corresponding transverse sliding racks. Positioning clamping rods are fixedly installed in the middle of the side ends of the material placing frames. Driving longitudinal columns are fixedly installed at the bottoms of the transverse sliding frames. The driving longitudinal columns are slidably clamped at the bottoms of the material placing frames. The bottoms of the driving longitudinal columns extend out of the bottoms of the material placing frames and are fixedly installed with driving seats. A second bidirectional telescopic rod is fixedly installed on one side of the bottom of the material placing frame close to the driving seat. The driving end of the second bidirectional telescopic rod is fixedly installed with the corresponding driving seat. A protective cover is fixedly installed at the bottom of the material placing frame. The second bidirectional telescopic rod is located in the protective cover.

[0017] As a preferred technical solution of the present invention, a positioning card slot corresponding to the positioning clamping rod is formed at the top of the positioning cross rack, and the positioning clamping rod is movably clamped in the corresponding positioning card slot.

[0018] As a preferred technical solution of the present invention, the upper baking device includes two first linear electric rails symmetrically distributed. The first linear electric rails are fixedly installed on the inner side walls of the box frame. The driving ends of the first linear electric rails are fixedly installed with first seats. A first spray tube is arranged between the two first seats. A plurality of evenly distributed first spray grooves are formed at the bottom of the first spray tube. A first pipe is fixedly installed at one end of the first spray tube. The first pipe is fixedly clamped in the middle of the corresponding first seat. A first connector is fixedly installed at one end of the first pipe away from the first spray tube.

[0019] As a preferred technical solution of the present invention, the lower baking device includes two second linear electric rails symmetrically distributed. The second linear electric rails are fixedly installed on the inner lower wall of the box frame. The driving ends of the second linear electric rails are fixedly installed with second seats. A second spray tube is arranged between the two second seats. A plurality of evenly distributed second spray grooves are formed at the bottom of the second spray tube. A second pipe is fixedly installed at one end of the second spray tube. The second pipe is fixedly clamped in the middle of the corresponding second seat. A second connector is fixedly installed at one end of the second pipe away from the second spray tube.

[0020] As a preferred technical solution of the present invention, the processing device further includes a bottom support frame. An installation card slot corresponding to the positioning clamping rod is opened at the top of the bottom support frame. A plurality of positioning clamping rods in the material placing device are movably clamped in the corresponding installation card slots, and the bottom support frame can be movably clamped in the limit frame.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] 1. By using potassium hydroxide to decompose the conductive adhesive, the present invention separates the quartz crystal resonator base and the wafer, solves the bottleneck of the reuse of the base in the current crystal industry, and greatly reduces the production cost of the quartz crystal resonator.

[0023] 2. By means of the chemical reaction of citric acid and silicic acid, the present invention removes the potassium silicate attached to the surface of the base, solves the solderability problem of the quartz crystal resonator product, and improves the reliability of the quartz crystal resonator product.

[0024] 3. By arranging the processing device, the present invention can comprehensively dry the upper and lower positions of a plurality of quartz crystal resonator bases, reduce the drying time of the quartz crystal resonator bases, and improve the overall recycling efficiency of the quartz crystal resonator bases.

[0025] 4. By arranging the processing device, the present invention can adjust the position of the positioning wheel on the surface of the quartz crystal resonator base, does not affect the positioning of the quartz crystal resonator base, and can dry the original positioned position, so that the quartz crystal resonator base is completely dried. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 It is the process flow diagram of the cyclic reuse of the quartz crystal resonator base in the present invention.

[0028] Figure 2 It is the structural schematic diagram of the processing device in the present invention.

[0029] Figure 3 It is the structural connection schematic diagram after the processing device in the present invention is disassembled.

[0030] Figure 4 It is the structural connection schematic diagram of the clamping device and the material placing device in the present invention.

[0031] Figure 5For the present invention Figure 4 An enlarged view of part A in the present invention

[0032] Figure 6 A schematic structural view of the material placing device in the present invention

[0033] Figure 7 For the present invention Figure 6 An enlarged view of part B in the present invention

[0034] Figure 8 A partial schematic structural view of the material placing device in the present invention

[0035] Figure 9 A partial schematic structural view of the material placing device in the present invention

[0036] Figure 10 For the present invention Figure 9 An enlarged view of part C in the present invention

[0037] Figure 11 A schematic structural view of the upper baking device in the present invention

[0038] Figure 12 A schematic structural view of the lower baking device in the present invention

[0039] Figure 13 A schematic structural connection view of the material placing device and the bottom support frame in the present invention

[0040] Figure 14 A schematic structural view of the limiting frame in the present invention

[0041] In the figure: 1. Box frame; 11. Door frame; 2. Lifting cylinder; 3. Clamping device; 4. Material placing device; 5. Upper baking device; 6. Lower baking device; 7. Limiting frame; 8. Bottom support frame; 801. Installation card slot; 31. Clamping outer frame; 32. Connecting frame; 33. First double-direction telescopic rod; 34. Positioning cross frame; 341. Positioning card slot; 41. Material placing mechanism; 42. Material placing frame; 421. Horizontal sliding groove; 422. Material placing groove; 43. Horizontal sliding frame; 431. Driving longitudinal column; 432. Driving seat; 433. Second double-direction telescopic rod; 44. Horizontal sliding rack; 45. Positioning frame; 451. Positioning wheel; 46. Electric telescopic rod; 47. Positioning clamping rod; 48. Protective cover; 51. First linear electric rail; 52. First seat; 53. First spray nozzle; 531. First spray groove; 54. First pipe; 55. First connector; 61. Second linear electric rail; 62. Second seat; 63. Second spray nozzle; 631. Second spray groove; 64. Second pipe; 65. Second connector. Detailed implementation manners

[0042] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0043] Embodiment: As Figure 1-14 shown, the present invention provides a process for recycling a quartz crystal resonator base, including the following steps:

[0044] Step 1: Pour the quartz crystal resonator base and the degumming agent into a box at the same time, and perform water bath heating for 60 minutes to dissolve the conductive adhesive and separate the wafer from the base; the composition of the degumming agent is: potassium hydroxide, and the ratio of the resonator to potassium hydroxide is 70 g: 1000 g;

[0045] Among them, the main components of the silicone resin of the conductive adhesive are: methyltrichlorosilane (CH3CL3Si), dichlorodimethylsilane (C2H6CL2Si), phenyltrichlorosilane (C6H5CL3Si), diphenyldichlorosilane (C 12 H 10 CL2Si), methylphenyldichlorosilane (C7H8CL2Si), hereinafter replaced by Si 4+ ions;

[0046] The chemical reaction equation of the conductive adhesive and the degumming agent potassium hydroxide (KOH) is as follows: Si 4+ + 2KOH → K2SiO3 + H 2 ↑ + 4e - ; among them, K2SiO3 (potassium silicate) is insoluble in water, alcohol and potassium hydroxide, so it will adhere to the surface of the quartz crystal resonator base;

[0047] Step 2: Pour the degumming agent into a spare box, and rinse the quartz crystal resonator base 5 times with 50-degree hot water to rinse off the residual degumming agent and the wafer;

[0048] Step 3: Pour the rinsed quartz crystal resonator base into a box containing citric acid, and perform water bath heating for 30 minutes to remove the potassium silicate on the surface of the quartz crystal resonator base; among them, the composition of citric acid is: HOOCCH2C(OH)(COOH)CH2COOH, and the ratio of the quartz crystal resonator base to citric acid is 100 g: 500 g;

[0049] The chemical reaction equation of potassium silicate and citric acid solution is as follows: HOOCCH2C(OH)(COOH)CH2COOH + 3K2SiO3 → 3H2SiO3↓ + 2KOOCCH2C(OH)(COOK)CH2COOK; among them, KOOCCH2C(OH)(COOK)CH2COOK (potassium citrate) is soluble in water but insoluble in alcohol, so it can be washed away by water;

[0050] Step 4: Pour citric acid into the spare box, and rinse the quartz crystal resonator base 5 times with 50-degree hot water to rinse off the residual citric acid and decomposition products;

[0051] Step 5: Place the rinsed quartz crystal resonator base in an oven at 150 degrees for baking; after baking, transplant the quartz crystal resonator base into the corresponding tray;

[0052] Step 6: Place the transplanted quartz crystal resonator base into the equipment for ion cleaning to remove foreign objects in the cavity of the resonator base, and finally perform vacuum packaging.

[0053] A processing device for applying the process of recycling quartz crystal resonator bases includes a box frame 1. A door frame 11 is hinge-mounted on one side of the box frame 1 to facilitate the rotation and opening of the door frame 11. A plurality of lifting cylinders 2 are fixedly installed on the inner upper wall of the box frame 1. A clamping device 3 is fixedly installed at the driving ends of the plurality of lifting cylinders 2. Control the opening of the plurality of lifting cylinders 2 to drive the clamping device 3 to lift and lower. A material placing device 4 is provided at the bottom of the clamping device 3. An upper baking device 5 is provided above the material placing device 4. A lower baking device 6 is provided below the material placing device 4. A limiting frame 7 is fixedly installed on the inner lower wall of the box frame 1.

[0054] The clamping device 3 includes a clamping outer frame 31, which is fixedly installed at the driving ends of the plurality of lifting cylinders 2. Two groups of symmetrically distributed connecting pieces are slidably clamped inside the clamping outer frame 31. The connecting pieces include two symmetrically distributed connecting frames 32, and the connecting frames 32 are slidably clamped inside the clamping outer frame 31. A first double-directional telescopic rod 33 corresponding to the connecting pieces is fixedly installed inside the clamping outer frame 31. The driving end of the first double-directional telescopic rod 33 is fixedly installed with the two connecting frames 32 in the corresponding connecting piece. The bottom ends of the connecting frames 32 at the same side position in the two groups of connecting pieces are all fixedly installed with positioning cross frames 34. By controlling the opening of the first double-directional telescopic rod 33, drive the two connecting frames 32 on both sides to move towards each other, thereby controlling the two positioning cross frames 34 on both sides to move towards each other. By controlling the opening of the first double-directional telescopic rod 33, drive the two connecting frames 32 on both sides to move away from each other, thereby controlling the two positioning cross frames 34 on both sides to move away from each other.

[0055] The material placing device 4 includes a plurality of material placing mechanisms 41 evenly distributed. The material placing mechanism 41 includes a material placing frame 42. A plurality of the material placing mechanisms 41 are fixedly installed with each other through the material placing frame 42. A plurality of evenly distributed material placing grooves 422 are formed in the material placing frame 42. By providing a plurality of material placing grooves 422, it is convenient to place a plurality of quartz crystal resonator bases to be baked. Horizontal sliding grooves 421 are formed on both sides of the plurality of material placing grooves 422. Horizontal sliding frames 43 are slidably clamped in the horizontal sliding grooves 421. Horizontal sliding frames 44 are slidably clamped in the horizontal sliding frames 43. A positioning frame 45 is fixedly installed on one side of the horizontal sliding frame 44 close to the horizontal sliding groove 421. The positioning frame 45 is slidably clamped on the material placing frame 42. One end of the positioning frame 45 away from the horizontal sliding frame 44 extends into the corresponding material placing groove 422. A positioning wheel 451 is rotatably installed at one end of the positioning frame 45 away from the horizontal sliding frame 44. Electric telescopic rods 46 are fixedly installed at one ends of the horizontal sliding frames 43. The driving ends of the electric telescopic rods 46 are fixedly installed with the ends of the corresponding horizontal sliding frames 44. By controlling the opening of the electric telescopic rods 46 to drive the horizontal sliding frames 44 to slide horizontally in the horizontal sliding frames 43, the positioning frame 45 and the positioning wheel 451 are driven to slide horizontally. Positioning clamping rods 47 are fixedly installed in the middle of the side ends of the material placing frame 42. Driving longitudinal columns 431 are fixedly installed at the bottoms of the horizontal sliding frames 43. The driving longitudinal columns 431 are slidably clamped at the bottoms of the material placing frame 42. The bottoms of the driving longitudinal columns 431 extend out of the bottoms of the material placing frame 42 and are fixedly installed with driving seats 432. A second bidirectional telescopic rod 433 is fixedly installed on one side of the bottom of the material placing frame 42 close to the driving seat 432. The driving end of the second bidirectional telescopic rod 433 is fixedly installed with the corresponding driving seat 432. By controlling the opening of the second bidirectional telescopic rod 433 to expand and contract, the two driving seats 432, the driving longitudinal columns 431 and the horizontal sliding frames 43 are driven to move towards each other, so as to control the two groups of positioning wheels 451 to move towards each other to position the quartz crystal resonator bases placed in the plurality of material placing grooves 422;

[0056] A protective cover 48 is fixedly installed at the bottom of the material placing frame 42. The second bidirectional telescopic rod 433 is located in the protective cover 48. The protective cover 48 is provided to protect the second bidirectional telescopic rod 433.

[0057] A positioning clamping groove 341 corresponding to the positioning clamping rod 47 is formed at the top of the positioning horizontal frame 34. The positioning clamping rod 47 is movably clamped in the corresponding positioning clamping groove 341 for positioning and installing the material placing device 4 and the clamping device 3.

[0058] The upper drying device 5 includes two first linear electric rails 51 symmetrically distributed. The first linear electric rails 51 are fixedly installed on the inner side walls of the box frame 1. A first seat 52 is fixedly installed at the driving end of the first linear electric rail 51. A first spray tube 53 is provided between the two first seats 52. A plurality of first spray grooves 531 evenly distributed are formed at the bottom of the first spray tube 53. A first tube 54 is fixedly installed at one end of the first spray tube 53. The first tube 54 is fixedly clamped in the middle of the corresponding first seat 52. A first connector 55 is fixedly installed at the end of the first tube 54 away from the first spray tube 53. During use, the end of the first connector 55 is connected to the output port of the heat flow output system. The heat flow output system is controlled to be turned on. The heat flow is introduced into the first spray tube 53 through the first connector 55 and the first tube 54. Subsequently, it is evenly sprayed through the plurality of first spray grooves 531. At the same time, the first linear electric rail 51 is controlled to be turned on to drive the first spray tube 53 to move horizontally. The heat flow is evenly sprayed above the material placing device 4 to perform upper drying on the plurality of quartz crystal resonator bases in the material placing device 4.

[0059] The lower drying device 6 includes two second linear electric rails 61 symmetrically distributed. The second linear electric rails 61 are fixedly installed on the inner lower wall of the box frame 1. A second seat 62 is fixedly installed at the driving end of the second linear electric rail 61. A second spray tube 63 is provided between the two second seats 62. A plurality of second spray grooves 631 evenly distributed are formed at the bottom of the second spray tube 63. A second tube 64 is fixedly installed at one end of the second spray tube 63. The second tube 64 is fixedly clamped in the middle of the corresponding second seat 62. A second connector 65 is fixedly installed at the end of the second tube 64 away from the second spray tube 63. During use, the end of the second connector 65 is connected to the output port of the heat flow output system. The heat flow output system is controlled to be turned on. The heat flow is introduced into the second spray tube 63 through the second connector 65 and the second tube 64. Subsequently, it is evenly sprayed through the plurality of second spray grooves 631. At the same time, the second linear electric rail 61 is controlled to be turned on to drive the second spray tube 63 to move horizontally. The heat flow is evenly sprayed below the material placing device 4 to perform lower drying on the plurality of quartz crystal resonator bases in the material placing device 4. In this way, the upper and lower positions of the plurality of quartz crystal resonator bases are effectively dried, the drying time of the quartz crystal resonator bases is reduced, and the overall recycling efficiency of the quartz crystal resonator bases is improved.

[0060] The processing device further includes a bottom support frame 8. An installation card slot 801 corresponding to the positioning clamping rod 47 is provided at the top of the bottom support frame 8. A plurality of positioning clamping rods 47 in the feeding device 4 are movably clamped in the corresponding installation card slots 801. The bottom support frame 8 can be movably clamped in the limiting frame 7. After the quartz crystal resonator base is washed clean, first, the feeding device 4 is movably clamped in the corresponding installation card slots 801 through a plurality of positioning clamping rods 47 to install the feeding device 4 and the bottom support frame 8. Subsequently, the quartz crystal resonator bases are evenly and limitedly transplanted into a plurality of feeding slots 422 in the feeding device 4, supported by the bottom end of the bottom support frame 8, and positioned using the positioning wheels 451. Subsequently, the feeding device 4, the bottom support frame 8, and the positioned plurality of quartz crystal resonator bases are placed in the box frame 1, and the bottom support frame 8 is movably clamped in the limiting frame 7 to position the feeding device 4, facilitating the subsequent lifting of the feeding device 4 and the plurality of quartz crystal resonator bases.

[0061] Working principle: Connect the end of the first connector 55 to the output port of the heat flow output system, and connect the end of the second connector 65 to the output port of the heat flow output system;

[0062] After the quartz crystal resonator base is washed clean, first, the feeding device 4 is movably clamped in the corresponding installation card slots 801 through a plurality of positioning clamping rods 47 to install the feeding device 4 and the bottom support frame 8. Subsequently, the quartz crystal resonator bases are evenly and limitedly transplanted into a plurality of feeding slots 422 in the feeding device 4, supported by the bottom end of the bottom support frame 8;

[0063] Subsequently, by controlling the opening of the second double telescopic rod 433 to expand and contract, driving the two side driving seats 432, driving longitudinal columns 431, and transverse sliding frames 43 to move towards each other, thereby controlling the plurality of positioning wheels 451 on both sides to move towards each other to position the quartz crystal resonator bases placed in a plurality of feeding slots 422;

[0064] Subsequently, the feeding device 4, the bottom support frame 8, and the positioned plurality of quartz crystal resonator bases are placed in the box frame 1, and the bottom support frame 8 is movably clamped in the limiting frame 7 to position the feeding device 4;

[0065] Subsequently, control the opening of a plurality of lifting cylinders 2 to drive the clamping device 3 to descend, thereby controlling the two side positioning cross frames 34 to descend, so that the positioning cross frames 34 descend to a position obliquely below the plurality of positioning clamping rods 47. Subsequently, control the opening of the first double telescopic rod 33 to drive the two side connecting frames 32 to move towards each other, thereby controlling the two side positioning cross frames 34 to move towards each other, and the positioning clamping rods 47 are movably clamped in the corresponding positioning card slots 341 to install and position the feeding device 4 and the clamping device 3;

[0066] Subsequently, control is used to activate multiple lifting cylinders 2 to drive the clamping device 3 to move upward, thereby driving the material placing device 4 and multiple positioned quartz crystal resonator bases to move upward, so that the material placing device 4 moves between the upper baking device 5 and the lower baking device 6;

[0067] Subsequently, control is used to activate the heat flow output system. The heat flow is introduced into the first spray tube 53 through the first connector 55 and the first pipe 54. Subsequently, it is evenly sprayed out through multiple first spray grooves 531. At the same time, control is used to activate the first linear electric rail 51 to drive the first spray tube 53 to move horizontally. The heat flow is evenly sprayed above the material placing device 4 to perform upper drying on multiple quartz crystal resonator bases in the material placing device 4;

[0068] And the heat flow is introduced into the second spray tube 63 through the second connector 65 and the second pipe 64. Subsequently, it is evenly sprayed out through multiple second spray grooves 631. At the same time, control is used to activate the second linear electric rail 61 to drive the second spray tube 63 to move horizontally. The heat flow is evenly sprayed below the material placing device 4 to perform lower drying on multiple quartz crystal resonator bases in the material placing device 4, thereby effectively drying the upper and lower positions of multiple quartz crystal resonator bases, reducing the drying time of the quartz crystal resonator bases, and improving the overall recycling efficiency of the quartz crystal resonator bases;

[0069] During drying, control can be used to activate the electric telescopic rod 46 to drive the cross-sliding frame 44 to slide horizontally in the cross-sliding frame 43, thereby driving the positioning frame 45 and the positioning wheels 451 to slide horizontally, adjusting the positions of the positioning wheels 451 on the surface of the quartz crystal resonator base, without affecting the positioning of the quartz crystal resonator base, and enabling the original positioned positions to be dried, so that the quartz crystal resonator base is completely dried;

[0070] Until multiple quartz crystal resonator bases are dried, the material placing device 4 and the quartz crystal resonator bases can be directly taken out for subsequent ion cleaning, without the need to place the quartz crystal resonator bases again.

[0071] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A process for the recycling of a quartz crystal resonator base, characterized in that, It includes the following steps: Step 1: Pour the quartz crystal resonator base and the degumming agent into a box at the same time, heat them in a water bath for 60 minutes to dissolve the conductive adhesive and separate the wafer from the base; Step 2: Pour the degumming agent into a spare box, rinse the quartz crystal resonator base 5 times with hot water at 50 degrees to rinse off the residual degumming agent and the wafer; Step 3: Pour the rinsed quartz crystal resonator base into a box containing citric acid, heat it in a water bath for 30 minutes to remove the potassium silicate on the surface of the quartz crystal resonator base; Step 4: Pour the citric acid into a spare box, rinse the quartz crystal resonator base 5 times with hot water at 50 degrees to rinse off the residual citric acid and decomposition products; Step 5: Place the rinsed quartz crystal resonator base in an oven at 150 degrees for baking; after baking, transplant the quartz crystal resonator base into the corresponding tray; Step 6: Place the transplanted quartz crystal resonator base into the equipment for ion cleaning to remove foreign matters in the cavity of the resonator base, and finally perform vacuum packaging.

2. The device for the process of recycling a quartz crystal resonator base according to claim 1, characterized in that: The composition of the degumming agent is: potassium hydroxide, and the ratio of the resonator to potassium hydroxide is 70 g: 1000 g.

3. The device for the process of recycling a quartz crystal resonator base according to claim 1, characterized in that: The composition of the citric acid is: HOOCCH2C(OH)(COOH)CH2COOH, and the ratio of the quartz crystal resonator base to citric acid is 100 g: 500 g.

4. A processing device for applying the process of recycling the quartz crystal resonator base described in claim 1, comprising a box frame (1), characterized in that: One side of the box frame (1) is hinge-mounted with a door frame (11). A plurality of lifting cylinders (2) are fixedly installed on the inner upper wall of the box frame (1). A clamping device (3) is fixedly installed at the driving ends of the plurality of lifting cylinders (2). A feeding device (4) is arranged at the bottom of the clamping device (3). An upper baking device (5) is arranged above the feeding device (4). A lower baking device (6) is arranged below the feeding device (4). A limiting frame (7) is fixedly installed on the inner lower wall of the box frame (1).

5. The device for the process of recycling a quartz crystal resonator base according to claim 4, characterized in that: The clamping device (3) includes a clamping outer frame (31). The clamping outer frame (31) is fixedly installed at the driving ends of the plurality of lifting cylinders (2). Two groups of symmetrically distributed connecting pieces are slidably clamped inside the clamping outer frame (31). The connecting pieces include two symmetrically distributed connecting frames (32). The connecting frames (32) are slidably clamped inside the clamping outer frame (31). A first double-direction telescopic rod (33) corresponding to the connecting pieces is fixedly installed inside the clamping outer frame (31). The driving end of the first double-direction telescopic rod (33) is fixedly installed with two connecting frames (32) in the corresponding connecting piece. The bottom ends of the connecting frames (32) at the same side position in the two groups of connecting pieces are fixedly installed with positioning cross frames (34).

6. The device for the process of recycling a quartz crystal resonator base according to claim 5, characterized in that: The feeding device (4) includes a plurality of feeding mechanisms (41) evenly distributed. The feeding mechanism (41) includes a feeding frame (42). A plurality of the feeding mechanisms (41) are fixedly installed with each other through the feeding frame (42). A plurality of evenly distributed feeding grooves (422) are formed in the feeding frame (42). Horizontal sliding grooves (421) are formed on both sides of the plurality of feeding grooves (422). Horizontal sliding frames (43) are slidably clamped in the horizontal sliding grooves (421). Horizontal sliding racks (44) are slidably clamped in the horizontal sliding frames (43). A positioning frame (45) is fixedly installed on one side of the horizontal sliding rack (44) close to the horizontal sliding groove (421). The positioning frame (45) is slidably clamped on the feeding frame (42). One end of the positioning frame (45) away from the horizontal sliding rack (44) extends into the corresponding feeding groove (422). A positioning wheel (451) is rotatably installed at one end of the positioning frame (45) away from the horizontal sliding rack (44). Electric telescopic rods (46) are fixedly installed at one ends of the horizontal sliding frames (43). The driving ends of the electric telescopic rods (46) are fixedly installed with the ends of the corresponding horizontal sliding racks (44). Positioning clamping rods (47) are fixedly installed in the middle of the side ends of the feeding frame (42). Driving longitudinal columns (431) are fixedly installed at the bottom ends of the horizontal sliding frames (43). The driving longitudinal columns (431) are slidably clamped at the bottom ends of the feeding frame (42). The bottoms of the driving longitudinal columns (431) extend out of the bottom ends of the feeding frame (42) and are fixedly installed with driving seats (432). A second bidirectional telescopic rod (433) is fixedly installed on one side of the bottom end of the feeding frame (42) close to the driving seat (432). The driving end of the second bidirectional telescopic rod (433) is fixedly installed with the corresponding driving seat (432). A protective cover (48) is fixedly installed at the bottom end of the feeding frame (42). The second bidirectional telescopic rod (433) is located in the protective cover (48).

7. An apparatus for the process of recycling a quartz crystal resonator base according to claim 6, characterized in that: A positioning card slot (341) corresponding to the positioning clamping rod (47) is formed at the top end of the positioning cross rack (34). The positioning clamping rod (47) is movably clamped in the corresponding positioning card slot (341).

8. The device for the process of recycling a quartz crystal resonator base according to claim 4, characterized in that: The upper drying device (5) includes two first linear electric rails (51) symmetrically distributed. The first linear electric rails (51) are fixedly installed on the inner side walls of the box frame (1). The driving ends of the first linear electric rails (51) are fixedly installed with first seats (52). A first spray tube (53) is arranged between the two first seats (52). A plurality of evenly distributed first spray grooves (531) are formed at the bottom of the first spray tube (53). A first pipe (54) is fixedly installed at one end of the first spray tube (53). The first pipe (54) is fixedly clamped in the middle of the corresponding first seat (52). A first connector (55) is fixedly installed at one end of the first pipe (54) away from the first spray tube (53).

9. The device for the process of recycling a quartz crystal resonator base according to claim 4, characterized in that: The lower drying device (6) includes two second linear electric rails (61) symmetrically distributed. The second linear electric rails (61) are fixedly installed on the inner lower wall of the box frame (1). The driving end of the second linear electric rail (61) is fixedly installed with a second seat (62). A second spray tube (63) is arranged between the two second seats (62). A plurality of second spray grooves (631) evenly distributed are formed at the bottom of the second spray tube (63). One end of the second spray tube (63) is fixedly installed with a second pipe (64). The second pipe (64) is fixedly clamped in the middle of the corresponding second seat (62). One end of the second pipe (64) away from the second spray tube (63) is fixedly installed with a second connector (65).

10. The device for the process of recycling the quartz crystal resonator base according to claim 6, characterized in that: The processing device further includes a bottom support frame (8). An installation card slot (801) corresponding to the positioning latch (47) is formed at the top end of the bottom support frame (8). A plurality of positioning latches (47) in the material placing device (4) are movably clamped in the corresponding installation card slots (801). The bottom support frame (8) can be movably clamped in the limit frame (7).

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