Voltage processing method and device, electronic equipment and computer readable medium

Abstract

The invention provides a voltage processing method and device, electronic equipment and a computer readable medium. The method comprises the following steps: acquiring a bias voltage currently input into an amplification electrode; the current temperature of the loudspeaker is determined on the basis of the bias voltage currently input into the amplification electrode and serves as the target temperature, and the bias voltage is in positive correlation with the target temperature; if the target temperature is larger than a temperature threshold value, the bias voltage input into the amplification electrode is reduced. As the root of heating of the loudspeaker is heating of the audio electric signal loaded on the loudspeaker, and the audio electric signal for driving the loudspeaker to vibrate is generated by the bias voltage of the amplification electrode of the last electrode of the audio power amplifier, the current temperature of the loudspeaker can be calculated based on the bias voltage, and the loudspeaker can be controlled to vibrate in combination with the temperature. And when the temperature is determined to be greater than the temperature threshold value, the bias voltage is reduced, so that the calorific value of the loudspeaker is reduced.

Description

Technical Field

[0001] This application relates to the technical field of mobile terminals, and more particularly, to a voltage processing method, apparatus, electronic device, and computer-readable medium. Background Art

[0002] Most current mobile phones adopt intelligent power amplifier (PA) technology to improve audio output power and sound quality. However, since the PA output voltage is relatively high, if it works at a high power state for a long time, it may cause the mobile phone speaker to bear too much current, resulting in excessive heat generation. Overheating can damage the components inside the speaker, causing the speaker temperature to be too high, and then entering an over-temperature state. Eventually, it may burn out the speaker, affecting the audio performance of the mobile phone and even causing hardware damage. Therefore, reasonable thermal management and power control become particularly important. Summary of the Invention

[0003] This application provides a voltage processing method, apparatus, electronic device, and computer-readable medium.

[0004] In a first aspect, this application provides a voltage processing method applied to an audio processor in an audio playback circuit. The audio playback circuit further includes an audio amplifier and a speaker. The audio amplifier includes an amplification stage. The audio processor, the amplification stage, and the speaker are connected in sequence. The method includes: obtaining the bias voltage currently input to the amplification stage; determining the current temperature of the speaker based on the bias voltage currently input to the amplification stage as a target temperature, where the bias voltage is positively correlated with the target temperature; and if the target temperature is greater than a temperature threshold, reducing the bias voltage input to the amplification stage.

[0005] In a second aspect, this application further provides a voltage processing apparatus applied to an audio processor in an audio playback circuit. The audio playback circuit further includes an audio amplifier and a speaker. The audio amplifier includes an amplification stage. The audio processor, the amplification stage, and the speaker are connected in sequence. The apparatus includes: an obtaining unit, a determining unit, and an adjusting unit. The obtaining unit is configured to obtain the bias voltage currently input to the amplification stage; the determining unit is configured to determine the current temperature of the speaker based on the bias voltage currently input to the amplification stage as a target temperature, where the bias voltage is positively correlated with the target temperature; and the adjusting unit is configured to reduce the bias voltage input to the amplification stage if the target temperature is greater than a temperature threshold.

[0006] In a third aspect, this application further provides an audio playback circuit, characterized by including an audio processor, an audio amplifier, and a speaker. The audio amplifier includes an amplification stage. The audio processor, the amplification stage, and the speaker are connected in sequence. The audio processor is configured to execute the above method.

[0007] In a fourth aspect, the present application also provides an electronic device, including: the above-mentioned audio playback circuit, a memory; one or more application programs, where the one or more application programs are stored in the memory and configured to be executed by a processor of the audio playback circuit, and the one or more application programs are configured to execute the above-mentioned method.

[0008] For the voltage processing method, device, electronic device and computer-readable medium provided by the present application, a bias voltage currently input to the amplification stage is obtained; a current temperature of the speaker is determined based on the bias voltage currently input to the amplification stage as a target temperature, where the bias voltage is positively correlated with the target temperature; if the target temperature is greater than a temperature threshold, the bias voltage input to the amplification stage is reduced. Since the root cause of the speaker heating is the heating of the audio electrical signal loaded on the speaker, and this audio electrical signal that drives the speaker to vibrate is generated by the bias voltage of the last-stage amplification stage of the audio power amplifier, therefore, the current temperature of the speaker can be deduced based on this bias voltage, and then combined with this temperature, when it is determined that the temperature is greater than the temperature threshold, the magnitude of the bias voltage is reduced, thereby reducing the heat generation of the speaker.

[0009] Other features and advantages of the present application will be described in the subsequent specification, and, in part, will be obvious from the specification, or will be understood by implementing the present application. The objectives and other advantages of the present application can be achieved and obtained by the structures specifically pointed out in the written specification, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following described drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0011] Figure 1 Shows the audio circuit provided by the present application;

[0012] Figure 2 Shows a schematic diagram of an audio playback circuit provided by an embodiment of the present application;

[0013] Figure 3 Shows a flowchart of a voltage processing method provided by an embodiment of the present application;

[0014] Figure 4 Shows a schematic diagram of an audio playback circuit provided by another embodiment of the present application;

[0015] Figure 5The method flow diagram of the voltage processing method provided by another embodiment of the present application is shown;

[0016] Figure 6 The schematic diagram of the relationship between the bias voltage and the audio signal provided by an embodiment of the present application is shown;

[0017] Figure 7 The module block diagram of the voltage processing device provided by an embodiment of the present application is shown;

[0018] Figure 8 The structural block diagram of the electronic device provided by the embodiment of the present application is shown;

[0019] Figure 9 The storage unit for storing or carrying the program code for implementing the method according to the embodiment of the present application provided by the embodiment of the present application is shown. Detailed implementation manners

[0020] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Usually, the components of the embodiments of the present application described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application to be protected, but only represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0021] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0022] Most current mobile phones adopt intelligent power amplifier (PA) technology to improve the audio output power and sound quality. However, since the PA output voltage is relatively high, if it works at a high power state for a long time, it may cause the mobile phone speaker to bear too much current, thus generating too much heat. Overheating will damage the components inside the speaker, resulting in too high a temperature of the speaker, and then entering the over-temperature state. Eventually, the speaker may be burned out, affecting the audio performance of the mobile phone and even causing hardware damage. Therefore, reasonable thermal management and power control become particularly important.

[0023] Currently, in order to control the heat generation of the speaker, the smart power amplifier is set to have the function of real-time detecting the speaker temperature. As Figure 1 shown, the working process of this temperature detection module is as follows: the smart power amplifier needs to design two detection pins and lead them to the speaker end; an ADC module is used to convert the collected analog data; after the IV processing module (i.e., the module for processing the input voltage signal) finishes processing, the data is then returned to the application processor / AP ADSP module for processing.

[0024] The inventor found in the research that the current temperature detection module increases the hardware cost. Specifically, it additionally increases the pins / leads of the audio power amplifier, occupying the layout space and the number of pins of the BTB connector; the ADC analog conversion module and the preprocessing module for the signals generated by the ADC module; the smart power amplifier needs to send a Pilot tone signal to generate a signal for detecting the speaker temperature, and the algorithm design is extremely complex. And when switching between multiple scenarios, pop sounds often occur, that is, in electronic devices or audio systems, sudden noises usually caused by unnecessary electrical interference, instantaneous voltage changes or signal peaks, similar to "click" or "patter" sounds. It usually appears in audio signals, especially in devices such as speakers, headphones, and power amplifiers, and is common when the audio signal starts or stops, or when the device is working unstably.

[0025] Therefore, in order to overcome the above defects, the embodiment of the present application provides an audio playback circuit, as Figure 2 shown, the audio playback circuit includes an audio processor 110, an audio amplifier 120 and a speaker 130. The audio amplifier 120 includes an amplification stage 121, and the audio processor 110, the amplification stage 121 and the speaker 130 are connected in sequence.

[0026] The main function of the audio processor 110 is to process the input audio signal. It may include various functions, such as sound effect adjustment (equalization, filtering, mixing, etc.), audio format decoding, volume control, etc. The audio processor 110 is responsible for processing the input audio signal and converting it into a signal suitable for amplifying and driving the speaker. For example, if the input signal is a digital audio, the audio processor will perform digital-to-analog conversion and may process the signal such as filtering and equalization, and output the processed analog signal.

[0027] The audio amplifier 120 is responsible for amplifying the signal from the audio processor to drive the speaker. The audio amplifier usually contains multiple components to ensure that the signal is fully amplified. The amplification stage 121 is a key component of the audio amplifier 120. In the embodiment of the present application, this amplification stage refers to the last-stage amplification component, which is usually the last-stage power amplifier, and it is used to increase the amplitude of the audio signal to drive the speaker and output a high-power signal.

[0028] The function of the speaker 130 is to convert the electrical signal output from the power amplifier into sound waves. Through the principle of electromagnetic induction, it drives the diaphragm of the speaker with the electrical signal, causing air vibrations and ultimately forming sound that can be heard by the user.

[0029] As an implementation, in addition to the amplification stage, the audio amplifier 120 may further include a preamplifier, a filter, a gain control, and other components. The output terminal of the audio processor 110 is connected to the input terminal of the preamplifier, the output terminal of the preamplifier is connected to the input terminal of the gain control circuit, the output terminal of the gain control circuit is connected to the input terminal of the filter, the output terminal of the filter is connected to the input terminal of the amplification stage, and the output terminal of the amplification stage is connected to the speaker.

[0030] Specifically, the preamplifier is responsible for initially amplifying the audio signal from the audio processor. The signal output by the audio processor is usually weak, and the preamplifier increases its gain to a sufficient level for subsequent amplification. The gain control circuit is used to adjust the gain (i.e., the volume) of the audio signal to ensure that the signal intensity is within an appropriate range, avoiding being too strong or too weak. If the signal is too strong, the gain control circuit will reduce its gain; if the signal is too weak, it will increase the gain of the signal. The filter is used to remove noise or unwanted frequency components in the signal to ensure a pure audio signal and better sound quality. It can perform high-pass, low-pass, band-pass, and other types of filtering to remove high-frequency noise or low-frequency interference. The amplification stage is the key part of the audio amplifier and is responsible for amplifying the audio signal that has been pre-amplified, gain-adjusted, and filtered to sufficient power to drive the speaker.

[0031] Please refer to Figure 3 , which shows a voltage processing method provided by an embodiment of the present application. This method is applied to the above audio playback circuit, and the execution subject of this method is the audio processor of the audio playback circuit. Then this method includes: S301 to S303.

[0032] S301: Obtain the bias voltage currently input to the amplification stage.

[0033] It can be understood that this amplification stage is the last-stage amplification element of the audio amplifier. For example, it can be a power amplifier, which is used to increase the amplitude of the audio signal output by the audio processor to drive the speaker to vibrate.

[0034] Bias Voltage refers to a static voltage that is usually applied in an audio power amplifier circuit to enable electronic devices (such as transistors, vacuum tubes, etc.) to operate at an appropriate operating point. The role of the bias voltage is to ensure that the amplifier can operate within an appropriate linear region, thereby avoiding distortion. The bias voltage is used to control the static operating point of the transistor or tube. The correct bias voltage ensures that the amplifier can respond to the input signal without distortion and can linearly amplify the signal.

[0035] As an implementation, after the audio amplifier sets the bias voltage for the amplification stage, it sends the bias voltage to the audio processor. Exemplarily, the audio amplifier further includes a bias voltage setting module, such as Figure 4 shown, the aforementioned audio processor can be Figure 4 the Audio Digital Signal Processing (ADSP) in

[0036] S302: Determine the current temperature of the speaker based on the bias voltage currently input to the amplification stage as the target temperature, where the bias voltage is positively correlated with the target temperature.

[0037] As an implementation, the root cause of the speaker heating is the heating of the audio electrical signal loaded on the speaker, and this audio electrical signal that drives the speaker to vibrate is generated by the bias voltage of the amplification stage of the last stage of the audio amplifier. It can be understood that the bias voltage is the voltage set by the last stage (output stage) of the audio amplifier to ensure that the power amplifier can work effectively and provide sufficient current to the load (i.e., the speaker). That is to say, the bias voltage itself does not directly generate the audio signal, but provides a stable operating point for the power amplifier, thereby ensuring that the audio signal can be amplified. Therefore, the bias voltage determines the current range at the output end in the audio amplifier. As the bias voltage is adjusted, the output power of the audio amplifier changes, so it also affects the magnitude of the current passing through the voice coil of the speaker, thereby affecting the heating of the speaker.

[0038] It can be understood that the bias voltage will affect the output amplitude of the power amplifier, thereby indirectly affecting the magnitude of the signal current transmitted to the speaker. A higher bias voltage may cause the power amplifier to provide more power in some audio signals, thereby increasing the vibration amplitude of the speaker and the number of currents flowing through the voice coil, resulting in more heat generation. Therefore, there is a certain relationship between the bias voltage and the heat generation of the speaker, and this heat generation can directly affect the current temperature of the speaker, and the bias voltage is positively correlated with the target temperature.

[0039] As an implementation manner, the mapping relationship between the bias voltage and the temperature of the speaker can be determined in advance through a large number of experiments. The mapping relationship can be a corresponding relationship or a functional relationship. Among them, the corresponding relationship refers to the corresponding relationship between the voltage range of the bias voltage and the temperature range of the speaker. For example, at each bias voltage, a certain audio signal (which can be a signal with a fixed amplitude) is applied, and then the audio playback circuit is operated for a certain period of time (such as several minutes to more than ten minutes) to allow the speaker to operate stably. During the experiment, the temperature change of the speaker is monitored in real time through a temperature sensor. Thus, the temperature range corresponding to different bias voltages can be obtained.

[0040] In addition, the mapping relationship can also be a functional relationship, that is, the functional relationship between the bias voltage and the temperature of the speaker. Based on the foregoing experiment, the bias voltage and the final stable temperature of the speaker are recorded in each experiment. To improve the accuracy of the data, multiple measurements can be performed to ensure the reliability of the data. After the experiment is completed, a data set of the bias voltage and the speaker temperature can be obtained. Statistical analysis methods (such as regression analysis) are used to fit the experimental data. For example, linear regression or non-linear regression (such as quadratic curve, exponential curve, etc.) can be selected. Through regression analysis, a mathematical formula or model can be obtained to describe the relationship between the bias voltage and the speaker temperature. Subsequently, after obtaining the bias voltage of the current input amplification stage, based on this corresponding relationship or functional relationship, the current temperature of the speaker corresponding to this bias voltage, that is, the target temperature, can be obtained.

[0041] As another implementation manner, a relational expression of the temperature of the speaker can also be constructed based on the impedance of the speaker and the bias voltage of the amplification stage. Based on this relational expression, the current temperature of the speaker corresponding to this bias voltage can be obtained. Specifically, it will be described in subsequent embodiments.

[0042] S303: If the target temperature is greater than the temperature threshold, reduce the bias voltage input to the amplification stage.

[0043] As described above, since the bias voltage can affect the current temperature of the speaker, and the bias voltage is positively correlated with the current temperature of the speaker, therefore, when it is determined that the target temperature is greater than the temperature threshold, the heat generation of the speaker can be reduced by reducing the bias voltage of the amplification stage, and then the temperature of the speaker can be reduced.

[0044] As an implementation manner, the amplitude of reducing the bias voltage can be a fixed value, for example, the first value. Then, the implementation manner of S303 can be that if the target temperature is greater than the temperature threshold, the bias voltage of the amplifying pole is reduced by the first value, and the reduced bias voltage is input to the bias voltage of the amplifying pole, that is, the reduced bias voltage is used as the new current bias voltage input to the amplifying pole, and then return to execute S301 and subsequent operations until the temperature of the speaker is not greater than the temperature threshold.

[0045] Therefore, in the embodiment of the present application, obtain the bias voltage currently input to the amplifying pole; determine the current temperature of the speaker based on the bias voltage currently input to the amplifying pole as the target temperature, where the bias voltage is positively correlated with the target temperature; if the target temperature is greater than the temperature threshold, reduce the bias voltage input to the amplifying pole. Since the root cause of the speaker heating is the heating of the audio electrical signal loaded on the speaker, and this audio electrical signal that drives the speaker to vibrate is generated by the bias voltage of the amplifying pole of the last stage of the audio power amplifier, therefore, the current temperature of the speaker can be deduced based on this bias voltage, and then combined with this temperature, when it is determined that the temperature is greater than the temperature threshold, the magnitude of the bias voltage is reduced, thereby reducing the heat generation of the speaker.

[0046] Please refer to Figure 5 , which shows a voltage processing method provided by an embodiment of the present application. This method is applied to the above audio playback circuit, and the execution subject of this method is the audio processor of the audio playback circuit. Then, this method includes: S501 to S504.

[0047] S501: Obtain the bias voltage currently input to the amplifying pole.

[0048] S502: Determine the heat generation of the speaker based on the impedance of the speaker and the bias voltage of the amplifying pole.

[0049] It can be understood that the heat generation of the speaker mainly comes from the current passing through the impedance of the speaker and being converted into heat through electric power. According to Ohm's law and the power formula, the heat generation can be determined by calculating the electric power of the speaker. Specifically, the electric power of the speaker can be calculated by the current flowing through the speaker and the impedance of the speaker, and the current flowing through the speaker can in turn be calculated by the bias voltage and the impedance of the speaker.

[0050] It should be noted that, as mentioned above, the bias voltage can determine the output voltage of the amplification stage, that is, the voltage input to the speaker. When the resistance of the amplification stage is relatively small, the bias voltage can be directly equivalent to the output voltage of the amplification stage. For example, the relatively small resistance of the amplification stage can mean that the resistance of the amplification stage is less than a specified resistance value. For example, the specified resistance value can be obtained by measurement in advance, that is, by measuring the influence of the bias voltage and the output voltage of the amplification stage under different resistances of the amplification stage, the internal resistance of the amplification stage that enables the bias voltage to be directly equivalent to the output voltage of the amplification stage can be found.

[0051] Exemplarily, the specified resistance value can be 0.5 ohm. That is to say, when selecting the amplification stage, an amplification stage with an internal resistance less than the specified resistance value can be selected for use in the audio amplifier of the present application. Of course, the resistance of the amplification stage can also be controlled to be less than the specified resistance value by setting the resistance value of the resistor connected in parallel with the amplification stage.

[0052] Therefore, taking Figure 4 as an example, the audio amplifier feeds back the real-time bias voltage of the amplification stage to the ADSP PA at the AP end. For example, the bias voltage is sent to the AP through the I2SData in signal line of the audio power amplifier. Then, the audio processor determines the heat generation of the speaker based on the impedance of the speaker and the bias voltage of the amplification stage. Specifically, assuming that the impedance of the speaker is R and the current bias voltage of the amplification stage is V, the heat generation of the speaker is V^2÷R. It can be understood that when the internal resistance of the amplification stage is small enough, for example, less than the specified resistance value, the bias voltage of the amplification stage can be equivalent to the output voltage of the amplification stage, that is, equivalent to the input voltage of the speaker. Therefore, the result of V^2÷R can be used to obtain the heat generation of the speaker.

[0053] S503: Determine the current temperature of the speaker according to the heat generation of the speaker as the target temperature.

[0054] The heat generation of the speaker is mainly caused by the conversion of electrical energy into heat energy due to its resistance. During the operation of the speaker, when current passes through the coil, due to the existence of resistance, a part of the electrical energy will be converted into heat energy. The relationship between this heat energy and temperature is usually non-linear, specifically depending on the material, structure of the speaker, and the efficiency of heat conduction and heat dissipation. It can be understood that the increase in the temperature of the speaker (i.e., the temperature change) is proportional to the heat generation. If the heat generated by the speaker increases, the temperature increase will also increase. At the same time, the mass and specific heat capacity of the speaker also affect its temperature change. The larger the mass or the larger the specific heat capacity, the smaller the temperature increase.

[0055] As an implementation manner, the corresponding relationship between the heat generation amount of the speaker and the temperature of the speaker can be determined through experiments. Thus, after obtaining the heat generation amount of the speaker, the current temperature of the speaker can be obtained through this corresponding relationship.

[0056] It can be understood that the temperature of the speaker is jointly affected by factors such as the heat generation amount, heat dissipation efficiency, and specific heat capacity of the material. Therefore, the implementation manner of determining the current temperature of the speaker according to the heat generation amount of the speaker may include obtaining the heat dissipation parameter of the speaker; determining the current temperature of the speaker according to the heat dissipation parameter and the heat generation amount of the speaker as the target temperature.

[0057] It can be understood that the heat dissipation parameter of the speaker can determine the heat dissipated by the speaker per unit time, and thus can reduce the heat of the speaker per unit time. That is to say, the heat dissipation parameter of the speaker can characterize the heat dissipation ability of the speaker.

[0058] As an implementation manner, the heat dissipation parameter of the speaker can be the heat dissipation amount of the speaker, and this heat dissipation amount can determine the temperature drop amplitude of the speaker. It can be understood that the heat dissipation ability (or heat dissipation performance) of the speaker refers to the ability of the speaker to conduct heat from its interior to the external environment during operation. The heat dissipation ability of the speaker is related to its surface heat dissipation ability, specifically manifested as the heat transferred from the speaker surface to the environment per unit time.

[0059] In the embodiment of the present application, the heat dissipation amount of the speaker is determined by: determining the heat dissipation amount (also called heat dissipation ability) of the speaker according to the current structure stacking form and the area of graphene pasted on the speaker front cover. Specifically, the heat dissipation area of the speaker refers to the part of the speaker in contact with the environment, and the larger this area is, the stronger the heat dissipation ability. If graphene is pasted on the front cover of the speaker, it is assumed that the graphene completely covers the surface of the speaker front cover, and the heat dissipation area of the front cover is the actual area of the front cover. If the graphene only covers part of the front cover, it can be adjusted according to the covered area.

[0060] As an implementation paradigm, the heat dissipation amount of the speaker can be determined based on formula (1).

[0061] H1 = h * A * (Ts - Ta) (1)

[0062] Among them, h is the heat convection coefficient, A is the surface area of the speaker, which can be the surface area of the aforementioned graphene, Ts is the reference temperature of the speaker, and Ta is the ambient temperature. The heat convection coefficient h is a parameter that describes the ability of heat to transfer between a fluid (such as air) and a solid surface. It represents the amount of heat passing through a unit area per unit time under a unit temperature difference. It is usually related to factors such as surface properties, the flow state of the fluid (such as natural convection or forced convection), the thermal conductivity of the fluid, and surface roughness.

[0063] As an implementation manner, the reference temperature of the speaker can be the temperature of the speaker obtained before determining the current temperature of the speaker during the process of the speaker playing audio. For example, when the speaker is working, for example, when the speaker is playing audio, the initial temperature Tc of the speaker can be set. Based on this Tc, the heat dissipation of the speaker can be obtained. Then, according to the heat dissipation parameter and the heat generation of the speaker, the current temperature of the speaker is determined. Then, the initial temperature Tc is updated to the current temperature. For subsequent temperature detection processes, this method can be referred to. Through a recursive method, the heat dissipation of the speaker can be updated in real time. As another implementation manner, the reference temperature of the speaker can be a conventional value. For example, 25 degrees Celsius. Based on this conventional value, the heat dissipation capacity of the speaker, that is, the heat dissipation ability, can be estimated for use in determining the current temperature of the speaker.

[0064] In addition, considering that the current temperature of the speaker is also related to the remaining playing duration of the audio data currently played by the speaker. This is because the speaker continuously generates heat during operation, and its temperature gradually rises with the accumulation of heat generation. Specifically, when the speaker plays audio, heat is generated due to the current and mechanical movements (such as the vibration of the diaphragm) inside the speaker. These heats are conducted to the air through the surface of the speaker or dissipated through other heat dissipation methods (such as convection, radiation). As the playing time increases, the temperature inside and on the surface of the speaker gradually rises. The longer the remaining playing duration, the more heat accumulates, resulting in an increase in the temperature of the speaker.

[0065] Based on the foregoing analysis of the heat dissipation, it can be known that during operation, the temperature of the speaker is determined by two main factors: one is the heat generated internally (i.e., the heat generation of the speaker), and the other is the heat dissipated through the heat dissipation mechanism (such as convection, radiation, etc.) (i.e., the heat dissipation of the speaker). The temperature of the speaker is usually the result of the dynamic balance between the two. The heat generation of the speaker is usually related to the power of the played audio, and the power is usually related to factors such as the playing duration and the volume of the audio. For example, playing audio at a high volume or for a long time at a relatively high power will cause an increase in the heat generation of the speaker, thereby increasing the temperature. Moreover, during a long-time playback process, the temperature of the speaker may gradually increase, especially in the case of insufficient heat dissipation. The playing duration affects the heat accumulated in the speaker, and thus affects its final temperature.

[0066] Therefore, an implementation manner of determining the current temperature of the speaker as the target temperature according to the heat dissipation parameter and the heat generation of the speaker may be to obtain the current playing duration to be played; determine the current temperature of the speaker as the target temperature according to the playing duration to be played, the heat dissipation parameter, and the heat generation of the speaker. Specifically, the current temperature of the speaker can be obtained based on the following formula (2).

[0067] T = γ * ∫(H2 - H1)dt + T0 (2)

[0068] Where γ is the conversion coefficient between heat and temperature, T0 is the initial temperature of the environment, t is the current playing duration to be played, H2 is the heat generation of the speaker, and H1 is the heat dissipation parameter.

[0069] Specifically, according to the current structural stacking form and the area of graphene pasted on the front cover of the speaker, the heat dissipation capacity H1 of the speaker is calculated, that is, this H1 is the aforementioned heat dissipation parameter or heat dissipation. According to the real-time bias voltage V applied to the amplification stage of the audio amplifier, and then divided by the impedance R of the speaker, the heat generation of the speaker is obtained: H2 = V^2 ÷ R, that is, the ratio of the square result of the bias voltage to the impedance of the speaker is used as the heat generation of the speaker. Then, based on the above formula (2), the instantaneous temperature of the speaker, that is, the current temperature of the speaker, which is also the target temperature, is obtained.

[0070] It should be noted that the current playing duration to be played can be the playing duration to be played of the current played audio, or it can be understood as the time span of the current played audio. Then this current playing duration to be played can be determined based on the current playing scenario.

[0071] If the current playback scenario is a video playback scenario, the current duration to be played can be the difference between the total video duration and the played duration of the video. If the current playback scenario is a song playback scenario, determine the total duration corresponding to the current playback scenario, which can be determined based on the current playlist. Determine the total duration of all songs to be played based on the current playlist as the duration to be played. If the current playback scenario is a voice call, the duration to be played can be determined based on user data. Specifically, based on user data, a user profile can be determined, which can include: the historical call duration and frequency between the user and different contacts (such as family, friends, colleagues); the call duration that the user usually likes, whether the user prefers long calls or short calls; when the user usually makes calls (for example, more inclined to long calls at night), that is, the user's call time period; the call duration corresponding to different types of call purposes, such as business calls may be shorter, while calls between relatives and friends may be longer. Then, in the voice call scenario, determine the total call duration corresponding to the scenario based on the user profile, and then, based on the duration of the call that has been made in this scenario, the absolute value of the difference between the two is used as the duration to be played. For example, determine the call object of the current voice call scenario, and determine the statistical duration corresponding to the call object as the total call duration of this scenario. It can also be to determine the call type of the current voice call scenario, and determine the statistical duration corresponding to the call type as the total call duration of this scenario, where the call type can be pre-set types such as business calls, strange calls, and relative and friend calls, and the statistical duration of each type of call can be pre-statistically obtained.

[0072] S504: If the target temperature is greater than the temperature threshold, reduce the bias voltage input to the amplifier electrode.

[0073] As an implementation, the method further includes: if the target temperature is less than the specified threshold, increase the bias voltage input to the amplifier electrode, where the specified threshold is less than or equal to the temperature threshold.

[0074] That is to say, the temperature threshold can be the target threshold or close to the target threshold. For example, the temperature threshold is less than the target threshold, and the difference between the target threshold and the temperature threshold is less than the specified value, and the specified value is a small value. For example, it can be a value in the range of 0 - 5.

[0075] It can be understood that if the target temperature is less than the specified threshold, the method of increasing the bias voltage input to the amplifier electrode can refer to the implementation method of reducing the bias voltage input to the amplifier electrode when the target temperature is greater than the temperature threshold mentioned above. For example, if the target temperature is less than the specified threshold, the bias voltage of the amplifier electrode is increased by a second value, and then the increased bias voltage is input to the amplifier electrode, that is, the increased bias voltage is used as the new current bias voltage input to the amplifier electrode, and return to execute S501 and subsequent operations until the temperature of the speaker is not greater than the temperature threshold.

[0076] Therefore, in the embodiment of the present application, based on the bias voltage of the amplifier electrode, the real-time temperature of the speaker, that is, the target temperature, can be analyzed in real time. Based on this real-time temperature, the output amplitude of the audio signal and the bias voltage of the amplifier electrode can be dynamically adjusted. As Figure 6 shown, Figure 6 shows a schematic diagram of the dynamic change of the bias voltage. Based on the embodiment of the present application, the bias voltage basically remains consistent with the peak value of the audio electrical signal.

[0077] In addition, the audio amplifier uses a front-end voltage modulation scheme, that is, the voltage of the input signal is suppressed within a certain fixed threshold to ensure that the speaker temperature does not exceed the standard and operates within a safe range. That is, the gain value of the aforementioned preamplifier is fixed within a preset range.

[0078] Therefore, in the embodiment of the present application, based on the technical solution of voltage detection, the built-in ADC digital-to-analog conversion module and IV processing module of the intelligent power amplifier are saved, and the number of pins and wiring space of the intelligent power amplifier are also saved, and the solution is more simplified and reliable.

[0079] Please refer to Figure 7 , which shows a structural block diagram of a voltage processing device 700 provided by an embodiment of the present application. The device is applied to an audio processor of an audio playback circuit of the previous year number. The device may include: an acquisition unit 701, a determination unit 702, and an adjustment unit 703.

[0080] The acquisition unit 701 is configured to acquire the bias voltage currently input to the amplifier electrode.

[0081] The determination unit 702 is configured to determine the current temperature of the speaker as the target temperature based on the bias voltage currently input to the amplifier electrode, where the bias voltage is positively correlated with the target temperature.

[0082] Further, the determination unit 702 is further configured to determine the heat generation amount of the speaker based on the impedance of the speaker and the bias voltage of the amplifier electrode; and determine the current temperature of the speaker as the target temperature according to the heat generation amount of the speaker.

[0083] Further, the determination unit 702 is further configured to obtain the heat dissipation parameter of the speaker; determine the current temperature of the speaker according to the heat dissipation parameter and the heat generation amount of the speaker, and use it as the target temperature.

[0084] Further, the determination unit 702 is further configured to obtain the current duration to be played; determine the current temperature of the speaker according to the duration to be played, the heat dissipation parameter and the heat generation amount of the speaker, and use it as the target temperature.

[0085] Further, the determination unit 702 is further configured to obtain the target temperature according to a target formula, where the target formula is: T = γ * ∫(H2 - H1)dt + T0; where γ is the conversion coefficient between heat and temperature, T0 is the initial temperature of the environment, t is the duration to be played of the currently played audio data, H2 is the heat generation amount of the speaker, and H1 is the heat dissipation parameter.

[0086] Further, the determination unit 702 is further configured to use the ratio of the square result of the bias voltage to the impedance of the speaker as the heat generation amount of the speaker.

[0087] The adjustment unit 703 is configured to reduce the bias voltage input to the amplification stage if the target temperature is greater than the temperature threshold.

[0088] Further, the adjustment unit 703 is further configured to increase the bias voltage input to the amplification stage if the target temperature is less than the specified threshold, where the specified threshold is less than or equal to the temperature threshold.

[0089] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described devices and modules can refer to the corresponding processes in the foregoing method embodiments, and will not be described herein again.

[0090] In several embodiments provided in the present application, the coupling between modules may be electrical, mechanical, or other forms of coupling.

[0091] In addition, in each embodiment of the present application, each functional module may be integrated in a processing module, or each module may exist physically alone, or two or more modules may be integrated in one module. The above-mentioned integrated modules may be implemented in the form of hardware or in the form of software functional modules.

[0092] Please refer to Figure 8, which shows a structural block diagram of an electronic device provided by an embodiment of the present application. The electronic device 100 may be an electronic device capable of running application programs such as a smart phone, a tablet computer, an e-book, etc. The electronic device 100 in the present application may include one or more of the following components: a processor 110, a memory 120, an audio playback circuit, and one or more application programs, where one or more application programs may be stored in the memory 120 and configured to be executed by one or more processors 110. Among them, the audio playback circuit is used to execute the above method, and the processor, as the core processor of the electronic device, is used to send the audio data to be played to the audio playback circuit, for example, to the audio processor of the audio playback circuit.

[0093] The processor 110 may include one or more processing cores. The processor 110 uses various interfaces and lines to connect various parts within the entire electronic device 100, and executes various functions of the electronic device 100 and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 120, and calling data stored in the memory 120. Optionally, the processor 110 may be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), or programmable logic array (PLA). The processor 110 may integrate one or several combinations of a central processing unit (CPU), a graphics processing unit (GPU), and a modem, etc. Among them, the CPU mainly processes the operating system, user interface, application programs, etc.; the GPU is responsible for rendering and drawing the displayed content; the modem is used to process wireless communication. It can be understood that the above modem may not be integrated into the processor 110 and may be implemented separately through a communication chip.

[0094] The memory 120 may include a Random Access Memory (RAM), or may also include a Read-Only Memory. The memory 120 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 120 may include a program storage area and a data storage area. Among them, the program storage area can store instructions for implementing an operating system, instructions for implementing at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the following various method embodiments, etc. The data storage area can also store data created during the use of the electronic device 100 (such as a phone book, audio and video data, chat record data), etc.

[0095] Please refer to Figure 9 , which shows a structural block diagram of a computer-readable medium provided by an embodiment of the present application. Program code is stored in the computer-readable medium 900, and the program code can be called by a processor to execute the method described in the above method embodiments.

[0096] The computer-readable medium 900 can be an electronic memory such as a flash memory, an EEPROM (Electrically Erasable Programmable Read-Only Memory), an EPROM, a hard disk, or a ROM. Optionally, the computer-readable medium 900 includes a non-transitory computer-readable storage medium. The computer-readable medium 900 has a storage space for the program code 910 for executing any method step in the above method. These program codes can be read out from or written into one or more computer program products. The program code 910 can be compressed in an appropriate form, for example.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A voltage processing method, characterized in that, An audio processor applied to an audio playback circuit, the audio playback circuit further comprising an audio amplifier and a speaker, the audio amplifier including an amplification stage, the audio processor, the amplification stage and the speaker being connected in sequence, the method comprising: Obtain the bias voltage currently input to the amplification stage; Determine the current temperature of the speaker based on the bias voltage currently input to the amplification stage as the target temperature, wherein the bias voltage is positively correlated with the target temperature; If the target temperature is greater than the temperature threshold, reduce the bias voltage input to the amplification stage.

2. The method according to claim 1, wherein The determining the current temperature of the speaker based on the bias voltage currently input to the amplification stage as the target temperature includes: Determine the heat generation of the speaker based on the impedance of the speaker and the bias voltage of the amplification stage; Determine the current temperature of the speaker according to the heat generation of the speaker as the target temperature.

3. The method according to claim 2, wherein The determining the current temperature of the speaker according to the heat generation of the speaker as the target temperature includes: Obtain the heat dissipation parameter of the speaker; Determine the current temperature of the speaker according to the heat dissipation parameter and the heat generation of the speaker as the target temperature.

4. The method according to claim 3, characterized in that, The determining the current temperature of the speaker according to the heat dissipation parameter and the heat generation of the speaker as the target temperature includes: Obtain the current duration to be played; Determine the current temperature of the speaker according to the duration to be played, the heat dissipation parameter and the heat generation of the speaker as the target temperature.

5. The method according to claim 4, characterized in that The determining the current temperature of the speaker according to the duration to be played, the heat dissipation parameter and the heat generation of the speaker as the target temperature includes: Obtain the target temperature according to the target formula, wherein the target formula is: T = γ * ∫(H2 - H1)dt + T0; where γ is the conversion coefficient between heat and temperature, T0 is the initial temperature of the environment, t is the duration to be played of the currently played audio data, H2 is the heat generation of the speaker, and H1 is the heat dissipation parameter.

6. The method according to claim 2, wherein The determining the heat generation of the speaker based on the impedance of the speaker and the bias voltage of the amplification stage includes: Taking the ratio of the square result of the bias voltage to the impedance of the speaker as the heat generation of the speaker.

7. The method according to any one of claims 1 to 6, characterized in that, Further comprising: If the target temperature is less than the specified threshold, increase the bias voltage input to the amplification stage, wherein the specified threshold is less than or equal to the temperature threshold.

8. A voltage processing device, characterized in that, An audio processor applied to an audio playback circuit, the audio playback circuit further comprising an audio amplifier and a speaker, the audio amplifier including an amplification stage, the audio processor, the amplification stage and the speaker being connected in sequence, the apparatus comprising: An acquisition unit for acquiring the bias voltage currently input to the amplification stage; A determination unit for determining the current temperature of the speaker based on the bias voltage currently input to the amplification stage as the target temperature, wherein the bias voltage is positively correlated with the target temperature; An adjustment unit for reducing the bias voltage input to the amplification stage if the target temperature is greater than the temperature threshold.

9. An audio playback circuit, characterized in that, Comprising an audio processor, an audio amplifier, and a speaker, the audio amplifier including an amplification stage, the audio processor, the amplification stage, and the speaker being connected in sequence, the audio processor being configured to execute the method according to any one of claims 1-7.

10. An electronic device, characterized in that, Comprising: The audio playback circuit according to claim 9; A memory; One or more applications, wherein the one or more applications are stored in the memory and are configured to be executed by a processor of the audio playback circuit, the one or more applications being configured to execute the method according to any one of claims 1-7.

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