Loudspeaker core, loudspeaker module and electronic equipment

Abstract

The invention provides a loudspeaker core, a loudspeaker module and electronic equipment, which are used for improving the driving force of the loudspeaker core and improving the sound production performance of the loudspeaker core. The loudspeaker inner core comprises a basin frame, a voice diaphragm, a first voice coil and a second voice coil, the voice diaphragm is installed on the basin frame, the first voice coil and the second voice coil are both located on the inner side of the basin frame and are both installed on the voice diaphragm, and the second voice coil is located on the inner side of the first voice coil and is spaced from the first voice coil; wherein the first voice coil is provided with a first end face facing the voice diaphragm, the second voice coil is provided with a second end face facing the voice diaphragm, and the second end face is located on the side, facing the voice diaphragm, of the first end face.

Description

Technical Field

[0001] This application relates to the technical field of speakers, and particularly to a speaker core, a speaker module, and an electronic device. Background Art

[0002] With the continuous development of science and technology, electronic devices such as mobile phones have been widely used in people's daily life and work and have become essential daily necessities for people. In existing electronic devices, a moving coil type speaker core is often used to realize the sound generation of the electronic device. However, in the existing moving coil type speaker core, a single voice coil is often used to drive the diaphragm to vibrate and generate sound, and the driving force of the speaker core is small, and the sound generation performance of the speaker core is poor. Summary of the Invention

[0003] This application provides a speaker core, a speaker module, and an electronic device, which are used to improve the driving force of the speaker core and enhance the sound generation performance of the speaker core.

[0004] In a first aspect, this application provides a speaker core, including a chassis, a sound film, a first voice coil, and a second voice coil. The sound film is installed on the chassis. Both the first voice coil and the second voice coil are located inside the chassis and are both installed on the sound film. The second voice coil is located inside the first voice coil and is spaced apart from the first voice coil.

[0005] Wherein, the first voice coil has a first end face facing the sound film, and the second voice coil has a second end face facing the sound film. The second end face is located on the side of the first end face facing the sound film.

[0006] In this application, the speaker core uses the first voice coil and the second voice coil to jointly drive the sound film to vibrate to generate vibration and sound. The first voice coil and the second voice coil can cooperate with the magnetic circuit component to shorten the magnetic conduction path, make full use of the driving magnetic field provided by the magnetic circuit component, improve the magnetic field utilization rate of the magnetic circuit component, which is equivalent to realizing the high driving force of the speaker core, enhancing the sound generation sensitivity of the speaker core, and helping to improve the sound generation performance of the speaker core. Moreover, the first voice coil and the second voice coil are designed on different height planes, which can further make full use of the driving magnetic field provided by the magnetic circuit component, realize the high driving force of the speaker core, enhance the sound generation sensitivity of the speaker core, and help to improve the sound generation performance of the speaker core.

[0007] In one implementation, the sound film includes a main body and a convex bulge. The main body is installed on the chassis, and the convex bulge is connected to the main body and protrudes away from the chassis relative to the main body.

[0008] The first voice coil is installed on the main body, and the second voice coil is installed on the convex bulge, so that the first voice coil and the second voice coil are designed at different height surfaces, which can fully utilize the driving magnetic field provided by the magnetic circuit component to achieve high driving force of the speaker core, thereby improving the sound sensitivity of the speaker core and helping to improve the sound performance of the speaker core.

[0009] In one embodiment, the ratio of the area of the convex hull to the area of the sound membrane is between 1 / 4 and 1 / 3.

[0010] The area of the convex part is relatively small compared to the area of the sound diaphragm, that is, the area occupied by the convex part on the sound diaphragm is relatively small, and the other areas on the sound diaphragm except the convex part can be used for air flow, which can reduce the height of the speaker core near the sound hole and increase the cross-sectional area of the sound hole to achieve a reduction in air flow rate, which helps to improve the external sound quality of the speaker module and enhance the sound performance of the speaker module.

[0011] In one embodiment, the height of the second voice coil is greater than that of the first voice coil. Compared with the first voice coil, the height of the second voice coil is larger, which is equivalent to using a long voice coil structure to drive the sound membrane, which can achieve low distortion of the speaker core and effectively improve the external sound quality of the speaker module.

[0012] In one embodiment, the speaker core further includes a first magnetic conductive plate, a first magnet, a second magnet and a third magnet, wherein the first magnetic conductive plate is located on a side of the basin frame away from the sound membrane and is spaced apart from the basin frame, the first magnet, the second magnet and the third magnet are all located on a surface of the first magnetic conductive plate facing the basin frame, the second magnet is located on the inner side of the first magnet and forms a first gap with the first magnet, and the third magnet is located on the inner side of the second magnet and forms a second gap with the second magnet;

[0013] The end of the first voice coil away from the sound membrane is located in the first gap, and the end of the second voice coil away from the sound membrane is located in the second gap. That is, the end of the first voice coil away from the sound membrane and the end of the second voice coil away from the sound membrane are both located in the magnetic field provided by the magnetic circuit assembly. When the first voice coil and the second voice coil receive the audio signal transmitted by the flexible circuit board, the first voice coil and the second voice coil move up and down along the Z-axis direction to cut the magnetic lines of force of the magnetic field and drive the sound membrane to vibrate.

[0014] In one embodiment, the second magnet includes a magnet body and a magnet protrusion. The magnet body is located on the surface of the first magnetic conductive plate facing the basin frame and forms a first sub-gap with the third magnet. The magnet protrusion is connected to the surface of the magnet body facing away from the first magnetic conductive plate and forms a second sub-gap with the third magnet. The second sub-gap is connected to the first sub-gap, and the second gap includes the first sub-gap and the second sub-gap.

[0015] The first magnet, the second magnet, and the third magnet adopt a high-low matching structure. A low magnetic circuit structure is designed to cooperate with the first voice coil, and a high magnetic circuit structure is designed to cooperate with the second voice coil. This enables the first voice coil and the second voice coil to make full use of the driving magnetic field provided by the magnetic circuit component, achieving a high driving force for the speaker core, improving the sound generation sensitivity of the speaker core, and helping to improve the sound generation performance of the speaker core.

[0016] In one embodiment, the speaker core further includes a second magnetic conduction plate, a third magnetic conduction plate, and a fourth magnetic conduction plate;

[0017] The second magnetic conduction plate is located on the surface of the first magnet facing away from the first magnetic conduction plate. The third magnetic conduction plate is located on the surface of the second magnet facing away from the first magnetic conduction plate, and is located inside the second magnetic conduction plate, forming a third gap with the second magnetic conduction plate. The third gap communicates with the first gap. The fourth magnetic conduction plate is located on the surface of the third magnet facing away from the first magnetic conduction plate, and is located inside the third magnetic conduction plate, forming a fourth gap with the third magnetic conduction plate. The fourth gap communicates with the second gap;

[0018] Among them, the end of the first voice coil facing away from the sound film is also located in the third gap, and the end of the second voice coil facing away from the sound film is also located in the fourth gap. That is, the ends of the first voice coil and the second voice coil facing away from the sound film are both located in the magnetic field provided by the magnetic circuit component. When the first voice coil and the second voice coil receive the audio signal transmitted by the flexible circuit board, the first voice coil and the second voice coil move up and down along the Z-axis direction to cut the magnetic force lines of the magnetic field, and drive the sound film to vibrate.

[0019] In one embodiment, the third magnetic conduction plate includes a magnetic conduction plate body and a magnetic conduction protrusion. The magnetic conduction plate body is located on the surface of the second magnet facing away from the first magnetic conduction plate, and forms a third sub-gap with the fourth magnetic conduction plate. The magnetic conduction protrusion is connected to the surface of the magnetic conduction plate body facing away from the first magnetic conduction plate, and forms a fourth sub-gap with the fourth magnetic conduction plate. The second sub-gap communicates the first sub-gap and the second gap. The fourth gap includes the third sub-gap and the fourth sub-gap.

[0020] The second magnetic conduction plate, the third magnetic conduction plate, and the fourth magnetic conduction plate adopt a high-low matching structure. A low magnetic circuit structure is designed to cooperate with the first voice coil, and a high magnetic circuit structure is designed to cooperate with the second voice coil. This enables the first voice coil and the second voice coil to make full use of the driving magnetic field provided by the magnetic circuit component, achieving a high driving force for the speaker core, improving the sound generation sensitivity of the speaker core, and helping to improve the sound generation performance of the speaker core.

[0021] In one embodiment, the first voice coil has a third end face disposed opposite to the first end face, and the second voice coil has a fourth end face disposed opposite to the second end face, and the third end face is flush with the fourth end face, so as to ensure that the third end face of the first voice coil and the fourth end face of the second voice coil are both located in the magnetic field provided by the magnetic circuit component. When the first voice coil and the second voice coil receive the audio signal transmitted by the flexible circuit board, the first voice coil and the second voice coil move up and down along the Z-axis direction to cut the magnetic lines of force of the magnetic field and drive the sound membrane to vibrate.

[0022] In one embodiment, the speaker core further includes a first frame and a second frame, both of which are located inside the basin frame, the first frame is connected between the sound membrane and the first voice coil, the second frame is connected between the sound membrane and the second voice coil, and is located inside the first frame and spaced apart from the first frame;

[0023] The height of the first frame is greater than the height of the second frame to ensure that the end of the first voice coil away from the sound membrane and the end of the second voice coil away from the sound membrane are both located in the magnetic field provided by the magnetic circuit assembly. When the first voice coil and the second voice coil receive the audio signal transmitted by the flexible circuit board, the first voice coil and the second voice coil move up and down along the Z-axis direction to cut the magnetic field lines of the magnetic field and drive the sound membrane to vibrate.

[0024] In one embodiment, the speaker core further comprises a flexible circuit board, which is mounted on the basin frame and electrically connected to the first voice coil and the second voice coil;

[0025] The first frame is provided with a first avoidance groove, the opening of the first avoidance groove is located on the surface of the first frame facing the sound membrane, the first avoidance groove runs through the inner side surface of the first frame and the outer side surface of the first frame, and avoids the flexible circuit board to avoid mutual interference between the first frame and the flexible circuit board, thereby ensuring the reliability of the speaker core.

[0026] In one embodiment, the third magnetic conductive plate is provided with a second avoidance groove, the opening of the second avoidance groove is located on the surface of the third magnetic conductive plate facing the basin frame, the second avoidance groove penetrates the inner side surface of the third magnetic conductive plate and the outer side surface of the third magnetic conductive plate, and avoids the flexible circuit board to avoid mutual interference between the third magnetic conductive plate and the flexible circuit board, thereby ensuring the reliability of the speaker core.

[0027] In one embodiment, the sound membrane includes a diaphragm and a dome, the diaphragm includes a first fixing portion, a second fixing portion and a folding ring portion, the first fixing portion is installed on a basin frame, the second fixing portion is located on the inner side of the first fixing portion and is spaced apart from the first fixing portion, the folding ring portion is connected between the first fixing portion and the second fixing portion, and is recessed toward the direction of the basin frame to reduce the height of the speaker core near the sound outlet, which can increase the cross-sectional area of the sound outlet to achieve a reduction in air flow rate, which helps to improve the external sound quality of the speaker module and enhance the sound performance of the speaker module.

[0028] The dome is mounted on the second fixing part, and both the first voice coil and the second voice coil are mounted on the dome.

[0029] In a second aspect, the present application provides a speaker module, including a first housing and any one of the above speaker cores. The speaker core is mounted in the first housing, a front sound cavity is formed between the sound membrane and the first housing, and the first housing is provided with a sound outlet hole, and the sound outlet hole communicates the front sound cavity with the outside of the speaker module.

[0030] In the present application, the speaker core uses the first voice coil and the second voice coil to jointly drive the sound membrane to vibrate to achieve vibration and sound generation. The first voice coil and the second voice coil can cooperate with the magnetic circuit component to shorten the magnetic conduction path, and can make full use of the driving magnetic field provided by the magnetic circuit component, improving the magnetic field utilization rate of the magnetic circuit component. This is equivalent to achieving a high driving force of the speaker core, improving the sound generation sensitivity of the speaker core, and helping to improve the sound generation performance of the speaker core. Moreover, the first voice coil and the second voice coil are designed on different height planes, which can further make full use of the driving magnetic field provided by the magnetic circuit component, achieve a high driving force of the speaker core, improve the sound generation sensitivity of the speaker core, and help to improve the sound generation performance of the speaker module.

[0031] In one implementation, the speaker module further includes a second housing, the second housing and the first housing are fixed to each other, the speaker core is located inside the second housing and the first housing, and a rear sound cavity is formed on the side of the sound membrane facing away from the front sound cavity.

[0032] In a third aspect, the present application provides an electronic device, including a processor and any one of the above speaker modules, and the speaker module is electrically connected to the processor.

[0033] In the present application, the speaker core uses the first voice coil and the second voice coil to jointly drive the sound membrane to vibrate to achieve vibration and sound generation. The first voice coil and the second voice coil can cooperate with the magnetic circuit component to shorten the magnetic conduction path, and can make full use of the driving magnetic field provided by the magnetic circuit component, improving the magnetic field utilization rate of the magnetic circuit component. This is equivalent to achieving a high driving force of the speaker core, improving the sound generation sensitivity of the speaker core, and helping to improve the sound generation performance of the speaker core. Moreover, the first voice coil and the second voice coil are designed on different height planes, which can further make full use of the driving magnetic field provided by the magnetic circuit component, achieve a high driving force of the speaker core, improve the sound generation sensitivity of the speaker core, and help to improve the sound generation performance of the electronic device. Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments of the present application will be described below.

[0035] Figure 1 It is a schematic structural diagram of the first electronic device provided by the embodiment of the present application;

[0036] Figure 2 is Figure 1 a schematic cross-sectional structure diagram of a speaker module in the electronic device shown;

[0037] Figure 3 is Figure 2 a schematic structure diagram of a speaker core in the speaker module shown;

[0038] Figure 4 is Figure 3 a schematic exploded structure diagram of the speaker core shown;

[0039] Figure 5 is Figure 4 a schematic structure diagram of a vibration component in the speaker core shown;

[0040] Figure 6 is Figure 5 a schematic exploded structure diagram of the vibration component shown;

[0041] Figure 7 is Figure 5 a schematic cross-sectional structure diagram of the vibration component after being cut along the I-I position;

[0042] Figure 8 is Figure 6 a schematic structure diagram of a sounding diaphragm in the vibration component shown;

[0043] Figure 9 is Figure 8 a schematic exploded structure diagram of the sounding diaphragm shown;

[0044] Figure 10 is Figure 8 a schematic cross-sectional structure diagram of the sounding diaphragm after being cut along the II-II position;

[0045] Figure 11 is Figure 5 a schematic partial structure diagram of the vibration component shown;

[0046] Figure 12 is Figure 4 a schematic assembled structure diagram of a chassis and a vibration component in the speaker core shown;

[0047] Figure 13 is Figure 12 a schematic structure diagram of the assembled structure of the chassis and the vibration component from another angle;

[0048] Figure 14 is Figure 12 a schematic cross-sectional structure diagram of the assembled structure of the chassis and the vibration component after being cut along the III-III position;

[0049] Figure 15 is Figure 4Schematic diagram of the structure of the magnetic circuit component in the shown speaker core;

[0050] Figure 16 is Figure 15 Exploded structure schematic diagram of the shown magnetic circuit component;

[0051] Figure 17 is Figure 15 Cross-sectional structure schematic diagram of the shown magnetic circuit component after being cut along IV-IV;

[0052] Figure 18 is Figure 15 Partial structure schematic diagram of the shown magnetic circuit component;

[0053] Figure 19 is Figure 3 Cross-sectional structure schematic diagram of the shown speaker core after being cut along V-V;

[0054] Figure 20 is the cross-sectional structure schematic diagram of the speaker core in the second electronic device provided by this application after being cut along V-V. Detailed implementation manners

[0055] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application.

[0056] Please refer to Figure 1 , Figure 1 is the schematic diagram of the structure of the electronic device 1000 provided by the embodiment of this application.

[0057] The electronic device 1000 can be an electronic product with an audio playback function such as a mobile phone, a tablet computer, a notebook computer, a car machine, a smart watch, a smart bracelet, a POS machine (point of sales terminal), etc. Next, the embodiment of this application will be described by taking the electronic device 1000 as a mobile phone as an example.

[0058] The electronic device 1000 includes a housing 100, a display module 200, a circuit board 300, a processor 400, and a speaker module 500. The display module 200, the circuit board 300, the processor 400, and the speaker module 500 are all installed in the housing 100.

[0059] The housing 100 is provided with a sound hole 1001 which communicates the inner side and the outer side of the housing 100. In this embodiment, the housing 100 includes a middle frame 110 and a rear cover 120. The middle frame 110 is provided with the sound hole 1001. The rear cover 120 is installed on one side of the middle frame 110. Exemplarily, the rear cover 120 can be installed on the middle frame 110 in a detachable manner to facilitate the repair and replacement of internal components or modules of the electronic device 1000. Alternatively, the rear cover 120 can be integrally formed with the middle frame 110 to increase the overall strength of the housing 100. Among them, the rear cover 120 can be the battery cover of the electronic device 1000.

[0060] The display module 200 is installed on the side of the middle frame 110 facing away from the rear cover 120. When the user uses the electronic device 1000, the display module 200 is placed facing the user, and the rear cover 120 is placed facing away from the user. Among them, the display module 200 includes a cover plate and a display screen (not shown in the figure) fixed to the cover plate. The cover plate can be made of a transparent material such as glass. The display screen can be an LCD (liquid crystal display) or an OLED (organic light-emitting diode display) or other display screens for displaying information such as images or texts.

[0061] The circuit board 300, the processor 400, and the speaker module 500 are all installed inside the housing 100. Specifically, the circuit board 300, the processor 400, and the speaker module 500 are all installed inside the middle frame 110. The processor 400 is installed on the circuit board 300 and is electrically connected to the circuit board 300. Among them, the circuit board 300 can be the main board of the electronic device 1000, and the processor 400 can be the CPU (central processing unit) of the electronic device 1000. The speaker module 500 is connected to the circuit board 300 and is electrically connected to the processor 400 through the circuit board 300. The speaker module 500 can receive the audio signal sent by the processor 400 through the circuit board 300 and vibrate and emit sound according to the audio signal. The sound diffuses to the external environment through the sound hole 1001, realizing the sound emission of the electronic device 1000.

[0062] Please refer to Figure 2 , Figure 2 which Figure 1 is the schematic cross-sectional structure diagram of the speaker module 500 in the electronic device 1000 shown.

[0063] The speaker module 500 includes a first housing 510, a second housing 520, and a speaker core 530. The first housing 510 and the second housing 520 are docked with each other and enclose to form a sound cavity 501. The first housing 510 is provided with a sound outlet hole 511. The sound outlet hole 511 penetrates the first housing 510 along the thickness direction of the second housing 520 and communicates the sound cavity 501 with the external environment. The speaker core 530 is located in the sound cavity 501 and is electrically connected to the circuit board 300 to realize the electrical connection between the speaker module 500 and the circuit board 300. The speaker core 530 includes a sounding diaphragm 21. The sounding diaphragm 21 divides the sound cavity 501 into a front sound cavity 502 and a rear sound cavity 503. Among them, a front sound cavity 502 is formed between the sounding diaphragm 21 and the first housing 510, and the front sound cavity 502 is communicated with the sound outlet hole 511. The rear sound cavity 503 is located on the side of the sounding diaphragm 21 away from the front sound cavity 502.

[0064] Please refer to Figure 3 and Figure 4 , Figure 3 is Figure 2 the schematic structural diagram of the speaker core 530 in the speaker module 500 shown in Figure 4 is Figure 3 the exploded structural diagram of the speaker core 530 shown in

[0065] Among them, for the convenience of description, the width direction of the speaker core 530 is defined as the X-axis direction, the length direction of the speaker core 530 is defined as the Y-axis direction, and the height direction of the speaker core 530 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other in pairs.

[0066] The speaker core 530 includes a chassis 10, a vibration assembly 20, and a magnetic circuit assembly 30. The vibration assembly 20 and the magnetic circuit assembly 30 are both installed on the chassis 10. The chassis 10 has a first mounting surface 101 and a second mounting surface 102. Along the height direction of the chassis 10, the first mounting surface 101 and the second mounting surface 102 are arranged opposite to each other. Exemplarily, the chassis 10 is in a square ring shape, and both the first mounting surface 101 and the second mounting surface 102 are parallel to the XY plane.

[0067] Please refer to Figures 5 to 7 , Figure 5 is Figure 4 the schematic structural diagram of the vibration assembly 20 in the speaker core 530 shown in Figure 6 is Figure 5 the exploded structural diagram of the vibration assembly 20 shown in Figure 7 is Figure 5 the cross-sectional structural diagram of the vibration assembly 20 after being cut along the I-I position. Among them, cutting along the I-I position means cutting along the plane where the I-I line is located. Similar descriptions of the drawings in the following text can be understood in the same way.

[0068] The vibration assembly 20 includes a sounding diaphragm 21, a first voice coil 22, a second voice coil 23, a first bobbin 24, a second bobbin 25, and a flexible circuit board 26. The first voice coil 22, the second voice coil 23, the first bobbin 24, the second bobbin 25, and the flexible circuit board 26 are all located on the lower side of the sounding diaphragm 21. The second voice coil 23 is located inside the first voice coil 22 and is spaced apart from the first voice coil 22. The first bobbin 24 is located between the sounding diaphragm 21 and the first voice coil 22 and is connected between the sounding diaphragm 21 and the first voice coil 22. The second bobbin 25 is located between the sounding diaphragm 21 and the second voice coil 23 and is connected between the sounding diaphragm 21 and the second voice coil 23, is located inside the first bobbin 24, and is also spaced apart from the first bobbin 24. One end of the flexible circuit board 26 is electrically connected to the first voice coil 22 and the second voice coil 23, and the other end is electrically connected to the circuit board 300 (as Figure 1 shown), so as to realize the electrical connection between the speaker core 530 and the circuit board 300.

[0069] It should be noted that the orientation terms such as "upper", "lower", "inner side", and "outer side" used when describing the speaker core 530 in the embodiments of the present application are mainly described based on the display orientation of the speaker core 530 in the drawings. "Taking the direction towards the positive direction of the Z-axis as "upper", taking the direction towards the negative direction of the Z-axis as "lower", taking the direction towards the middle part of the speaker core 530 as "inner side", and taking the direction away from the middle part of the speaker core 530 as "outer side", which does not form a limitation on the orientation of the speaker core 530 in the actual application scenario.

[0070] Please refer to Figures 8 to 10 , Figure 8 which Figure 6 is the schematic structural diagram of the sounding diaphragm 21 in the vibration assembly 20 shown, Figure 9 which Figure 8 is the exploded structural diagram of the sounding diaphragm 21 shown, Figure 10 which Figure 8 is the schematic cross-sectional structure diagram of the sounding diaphragm 21 after being cut along the II-II position shown.

[0071] The sounding diaphragm 21 includes a main body 211 and a convex portion 212. The convex portion 212 is located inside the main body 211 and is connected to the main body 211. The convex portion 212 protrudes upward relative to the main body 211. That is, the convex portion 212 protrudes relative to the main body 211 in the direction away from the first voice coil 22 and the second voice coil 23. The setting of the convex portion 212 can save the space on the lower side of the sounding diaphragm 21, allow the first voice coil 22, the second voice coil 23, the magnetic circuit assembly 30, etc. located on the lower side of the sounding diaphragm 21 to be set with larger height dimensions, can increase the driving force of the speaker core 530, and helps to improve the sound generation performance of the speaker core 530. Exemplarily, the main body 211 is generally in a square ring shape, and the convex portion 212 is generally in a rounded rectangular shape.

[0072] Among them, the area ratio of the convex hull part 212 to the sounding film 21 is between 1 / 4 and 1 / 3. For example, the area ratio of the convex hull part 212 to the sounding film 21 can be 1 / 4, 7 / 24 or 1 / 3. It should be noted that the area ratio of the convex hull part 212 to the sounding film 21 is small, that is, the area occupied by the convex hull part 212 on the sounding film 21 is small, and other areas of the sounding film 21 except the convex hull part 212 can be used for air flow, which can reduce the height of the speaker core 530 near the sound outlet hole 511, and can increase the cross-sectional area of the sound outlet hole 511 to achieve a reduction in air flow velocity, which helps to improve the external sound quality of the speaker module 500 and enhance the sound generation performance of the speaker module 500.

[0073] In this embodiment, the sounding film 21 includes a diaphragm 27 and a dome 28, and the dome 28 is mounted on the diaphragm 27. Exemplarily, the diaphragm 27 is generally square-ring-shaped. The diaphragm 27 includes a first fixing part 271, a second fixing part 272 and a surround part 273. The second fixing part 272 is located inside the first fixing part 271 and is spaced apart from the first fixing part 271. The surround part 273 is connected between the first fixing part 271 and the second fixing part 272. Exemplarily, the first fixing part 271, the second fixing part 272 and the surround part 273 are all generally square-ring-shaped. The surround part 273 can be deformed when subjected to an external force so that the second fixing part 272 can move relative to the first fixing part 271.

[0074] Among them, the surround part 273 is concave downward relative to the first fixing part 271 and the second fixing part 272. That is, the surround part 273 is concave away from the dome 28 relative to the first fixing part 271 and the second fixing part 272, so as to reduce the height of the speaker core 530 near the sound outlet hole 511, and can increase the cross-sectional area of the sound outlet hole 511 to achieve a reduction in air flow velocity, which helps to improve the external sound quality of the speaker module 500 and enhance the sound generation performance of the speaker module 500. In some other embodiments, the surround part 273 can also be convex upward relative to the first fixing part 271 and the second fixing part 272. That is, the surround part 273 can also protrude toward the dome 28 relative to the first fixing part 271 and the second fixing part 272, and the present application does not make specific restrictions on this.

[0075] The dome 28 is mounted on the second fixing portion 272 of the diaphragm 27. The dome 28 includes a third fixing portion 281, a convex portion 212 and a first connecting portion 282. The third fixing portion 281 is located at the lower side of the second fixing portion 272 and is mounted on the second fixing portion 272 to achieve assembly between the dome 28 and the diaphragm 27. The convex portion 212 is located on the inner side of the third fixing portion 281 and is spaced apart from the third fixing portion 281. The first connecting portion 282 is connected between the third fixing portion 281 and the convex portion 212. Exemplarily, the third fixing portion 281 and the first connecting portion 282 are both roughly square ring-shaped. Among them, the body 211 includes a first fixing portion 271, a second fixing portion 272, a folding ring portion 273, a third fixing portion 281 and a first connecting portion 282.

[0076] See also Figure 6 and Figure 7 , the first voice coil 22, the second voice coil 23, the first skeleton 24 and the second skeleton 25 are all located on the lower side of the dome 28. The first voice coil 22 is located on the lower side of the body 211 and is installed on the body 211. Specifically, the first voice coil 22 is located on the lower side of the third fixing portion 281 and is installed on the third fixing portion 281. The first voice coil 22 has a first end face 221 and a third end face 222. Along the height direction of the first voice coil 22, the first end face 221 and the third end face 222 are arranged opposite to each other. Among them, the first end face 221 is the end face of the first voice coil 22 facing the sound membrane 21, and the third end face 222 is the end face of the first voice coil 22 away from the sound membrane 21. Exemplarily, the first voice coil 22 is a rounded rectangle.

[0077] The second voice coil 23 is located at the lower side of the convex portion 212 and is installed on the convex portion 212. The second voice coil 23 has a second end face 231 and a fourth end face 232. Along the height direction of the second voice coil 23, the second end face 231 and the fourth end face 232 are arranged opposite to each other. Among them, the second end face 231 is the end face of the second voice coil 23 facing the sound membrane 21, and is located on the side of the first end face 221 facing the sound membrane 21. The fourth end face 232 is the end face of the second voice coil 23 away from the sound membrane 21, and is flush with the third end face 222. In some other embodiments, the fourth end face 232 may not be flush with the third end face 222, and the present application does not make specific restrictions on this. Exemplarily, the second voice coil 23 is a rounded rectangle.

[0078] Among them, the height h1 of the first voice coil 22 is less than the height h2 of the second voice coil 23. In this embodiment, the speaker core 530 uses the first voice coil 22 and the second voice coil 23 to jointly drive the vibration of the diaphragm 21 to achieve vibration and sound generation. The first voice coil 22 and the second voice coil 23 can cooperate with the magnetic circuit component 30 to shorten the magnetic conduction path, make full use of the driving magnetic field provided by the magnetic circuit component 30, improve the magnetic field utilization rate of the magnetic circuit component 30, which is equivalent to achieving a high driving force of the speaker core 530, improving the sound generation sensitivity of the speaker core 530, and helping to improve the sound generation performance of the speaker core 530. Moreover, the first voice coil 22 and the second voice coil 23 are designed on different height planes, which can further make full use of the driving magnetic field provided by the magnetic circuit component 30, achieve a high driving force of the speaker core 530, improve the sound generation sensitivity of the speaker core 530, and help to improve the sound generation performance of the speaker core 530. Furthermore, the height h2 of the second voice coil 23 is greater than the height h1 of the first voice coil 22, which is equivalent to using a long voice coil structure to drive the diaphragm 21, can achieve low distortion of the speaker core 530, and can effectively improve the external sound quality of the speaker module 500.

[0079] The first skeleton 24 is located between the third fixing part 281 and the first voice coil 22, and is connected between the third fixing part 281 and the first voice coil 22. The first skeleton 24 has a first surface 241 and a second surface 242. Along the height direction of the first skeleton 24 (the Z-axis direction shown in the figure), the first surface 241 and the second surface 242 are arranged in opposite directions. Among them, the first surface 241 is the surface of the first skeleton 24 facing the diaphragm 21, and the second surface 242 is the surface of the first skeleton facing away from the diaphragm 21.

[0080] The first skeleton 24 is provided with a first avoidance groove 243, and the opening of the first avoidance groove 243 is located on the first surface 241. The first avoidance groove 243 is recessed from the first surface 241 in the direction of the second surface 242 (the negative Z-axis direction shown in the figure), and penetrates the inner side surface and the outer side surface of the first skeleton 24. Among them, there are four first avoidance grooves 243, and the four first avoidance grooves 243 are arranged at intervals around the first skeleton 24. Exemplarily, the first skeleton 24 is in a square ring shape, and the four first avoidance grooves 243 are respectively located at the four corners of the first skeleton 24.

[0081] The second skeleton 25 is located between the convex part 212 and the second voice coil 23, and is connected between the convex part 212 and the second voice coil 23. Exemplarily, the second skeleton 25 is in a square ring shape. Among them, the height h4 of the second skeleton 25 is less than the height h3 of the first skeleton 24, so that the third end surface 222 of the first voice coil 22 and the fourth end surface 232 of the second voice coil 23 can both be located in the driving magnetic field of the magnetic circuit component 30, ensuring that the first voice coil 22 and the second voice coil 23 can drive the diaphragm 21 to vibrate under the action of the driving magnetic field of the magnetic circuit component 30.

[0082] In this embodiment, the first skeleton 24 can prevent the first voice coil 22 from directly contacting the sounding film 21, and the second skeleton 25 can prevent the second voice coil 23 from directly contacting the sounding film 21. The first skeleton 24 and the second skeleton 25 can play a role in heat dissipation, preventing the first voice coil 22 and the second voice coil 23 from overheating and damaging the sounding film 21, and ensuring the reliability of use of the speaker core 530. In some other embodiments, the speaker core 530 may not include the first skeleton 24, and the first voice coil 22 can be directly installed on the sounding film 21, and / or the speaker core 530 may not include the second skeleton 25, and the second voice coil 23 can be directly installed on the sounding film 21, so as to streamline the structure of the speaker core 530 and contribute to the realization of the thin and light design of the speaker core 530.

[0083] Please refer to Figure 6 and Figure 11 , Figure 11 is Figure 5 a partial structural schematic diagram of the vibration assembly 20 shown in the figure. Among them, Figure 11 the sounding film 21 is not shown.

[0084] The flexible circuit board 26 includes four sub-flexible circuit boards 29. The four sub-flexible circuit boards 29 are all connected to the second skeleton 25 and are arranged at intervals around the second skeleton 25. Specifically, one end of each sub-flexible circuit board 29 is electrically connected to the first voice coil 22 and the second voice coil 23, and the other end is electrically connected to the circuit board 300. Exemplarily, each sub-flexible circuit board 29 can be electrically connected to the first voice coil 22 and the second voice coil 23 through a wire (not shown in the figure). Among them, each sub-flexible circuit board 29 passes through a first avoidance groove 243. That is, each first avoidance groove 243 avoids a sub-flexible circuit board 29 to prevent interference between the first skeleton 24 and the flexible circuit board 26 and ensure the reliability of use of the speaker core 530.

[0085] Exemplarily, the four sub-flexible circuit boards 29 have the same structure. Each sub-flexible circuit board 29 includes a fourth fixing portion 291, an electrical connection portion 292, and a second connection portion 293. The fourth fixing portion 291 is located below the first fixing portion 271 of the vibrating diaphragm 27. The electrical connection portion 292 is located inside the fourth fixing portion 291 and below the dome 28, and is electrically connected to the first voice coil 22 and the second voice coil 23. Among them, the electrical connection portion 292 passes through the first avoidance groove 243. That is, the first avoidance groove 243 avoids the electrical connection portion 292. The second connection portion 293 is located below the folded edge portion 273 of the vibrating diaphragm 27 and is connected between the fourth fixing portion 291 and the electrical connection portion 292.

[0086] Please refer to Figures 12 to 14 , Figure 12 is Figure 4Schematic diagram of the assembly structure of the chassis 10 and the vibration assembly 20 in the shown speaker core 530 Figure 13 is Figure 12 Schematic diagram of the assembly structure of the chassis 10 and the vibration assembly 20 shown from another angle Figure 14 is Figure 12 Schematic diagram of the cross-sectional structure of the assembly structure of the chassis 10 and the vibration assembly 20 shown after being cut along III-III

[0087] The vibration assembly 20 is installed on the first mounting surface 101 of the chassis 10. Part of the vibration assembly 20 is fixed relative to the chassis 10, and part of the vibration assembly 20 can vibrate relative to the chassis 10. Specifically, the diaphragm 21 is installed on the first mounting surface 101 of the chassis 10. The first voice coil 22, the second voice coil 23, the first skeleton 24, and the second skeleton 25 are all located inside the chassis 10 and are spaced apart from the chassis 10. The flexible circuit board 26 is installed on the second mounting surface 102 of the chassis 10. Among them, the first fixing portion 271 of the diaphragm 27 is installed on the first mounting surface 101 of the chassis 10. The fourth fixing portion 291 of the sub-flexible circuit board 29 is located on the lower side of the chassis 10 and is installed on the second mounting surface 102 of the chassis 10.

[0088] When the first voice coil 22 and the second voice coil 23 move relative to the chassis 10, the first voice coil 22 and the second voice coil 23 drive the dome 28 of the diaphragm 21, the first skeleton 24, and the second skeleton 25 to move relative to the chassis 10. In the diaphragm 27 of the diaphragm 21, the first fixing portion 271 is fixed relative to the chassis 10, and the second fixing portion 272 moves relative to the chassis 10 driven by the dome 28. The folding ring portion 273 moves relative to the chassis 10 and deforms driven by the second fixing portion 272. In the flexible circuit board 26, the fourth fixing portion 291 of the sub-flexible circuit board 29 is fixed relative to the chassis 10, the electrical connection portion 292 of the sub-flexible circuit board 29 moves relative to the chassis 10 following the first voice coil 22 and the second voice coil 23, and the second connection portion 293 of the sub-flexible circuit board 29 moves relative to the chassis 10 driven by the electrical connection portion 292.

[0089] Please refer to Figures 15 to 17 , Figure 15 is Figure 4 Schematic diagram of the structure of the magnetic circuit assembly 30 in the shown speaker core 530 Figure 16 is Figure 15 Exploded schematic diagram of the magnetic circuit assembly 30 shown Figure 17 is Figure 15 Schematic diagram of the cross-sectional structure of the magnetic circuit assembly 30 shown after being cut along IV-IV

[0090] The magnetic circuit component 30 includes a first magnetic conductive plate 31, a first magnet 32, a second magnet 33, a third magnet 34, a second magnetic conductive plate 35, a third magnetic conductive plate 36, and a fourth magnetic conductive plate 37. The first magnet 32, the second magnet 33, the third magnet 34, the second magnetic conductive plate 35, the third magnetic conductive plate 36, and the fourth magnetic conductive plate 37 are all located on the upper side of the first magnetic conductive plate 31.

[0091] The first magnetic conductive plate 31 has a third surface 311 and a fourth surface 312. Along the thickness direction of the first magnetic conductive plate 31, the third surface 311 and the fourth surface 312 are arranged in opposite directions. Among them, the third surface 311 is the surface of the first magnetic conductive plate 31 facing the chassis 10, and the fourth surface 312 is the surface of the first magnetic conductive plate 31 facing away from the chassis 10. Exemplarily, both the third surface 311 and the fourth surface 312 are parallel to the XY plane.

[0092] Please refer to Figure 18 , Figure 18 is Figure 15 a partial structural schematic diagram of the magnetic circuit component 30 shown. Among them, Figure 18 the second magnetic conductive plate 35, the third magnetic conductive plate 36, and the fourth magnetic conductive plate 37 are not shown.

[0093] The first magnet 32, the second magnet 33, and the third magnet 34 are all located on the third surface 311. The first magnet 32 is located at the edge of the third surface 311. The first magnet 32 includes two first magnet parts 321 and two second magnet parts 322. The two first magnet parts 321 are arranged at intervals along the X-axis direction. The two second magnet parts 322 are arranged at intervals along the Y-axis direction and are both arranged at intervals from the two first magnet parts 321. Among them, a first corner gap 323 is formed between each first magnet part 321 and a second magnet part 322.

[0094] The second magnet 33 is located inside the first magnet 32, and a first gap 331 is formed between the second magnet 33 and the first magnet 32. Among them, the first gap 331 communicates with the four first corner gaps 323. Exemplarily, both the first gap 331 and the second magnet 33 are in an elliptical ring shape. The third magnet 34 is located inside the second magnet 33. A second gap 341 is formed between the third magnet 34 and the second magnet 33. Exemplarily, the second gap 341 is in an elliptical ring shape. Among them, the height h6 of the third magnet 34 is greater than the height h5 of the second magnet 33.

[0095] Please refer to Figures 15 to 17, the second magnetic conduction plate 35 is located on the surface of the first magnet 32 facing away from the first magnetic conduction plate 31. The second magnetic conduction plate 35 includes a magnetic conduction frame 351, two first magnetic conduction parts 352, and two second magnetic conduction parts 353. The magnetic conduction frame 351 is located on the surfaces of the two first magnet parts 321 and the two second magnet parts 322 facing away from the first magnetic conduction plate 31. The two first magnetic conduction parts 352 and the second magnetic conduction parts 353 are both located inside the magnetic conduction frame 351 and are connected to the magnetic conduction frame 351. Each first magnetic conduction part 352 is located on the surface of a first magnet part 321 facing away from the first magnetic conduction plate 31, and each second magnetic conduction part 353 is located on the surface of a second magnet part 322 facing away from the first magnetic conduction plate 31. Among them, a second corner gap 354 is formed between each first magnetic conduction part 352 and a second magnetic conduction part 353, and each second corner gap 354 communicates with a first corner gap 323.

[0096] The third magnetic conduction plate 36 is located on the surface of the second magnet 33 facing away from the first magnetic conduction plate 31, and is located inside the second magnetic conduction plate 35, and a third gap 361 is formed between the third magnetic conduction plate 36 and the second magnetic conduction plate 35. Among them, the third gap 361 communicates with the first gap 331 and the four second corner gaps 354. The third magnetic conduction plate 36 is provided with a second avoidance groove 362, and the opening of the second avoidance groove 362 is located on the surface of the third magnetic conduction plate 36 facing away from the second magnet 33. The second avoidance groove 362 penetrates through the inner side surface and the outer side surface of the third magnetic conduction plate 36 and communicates with the third gap 361. Among them, there are four second avoidance grooves 362, and the four second avoidance grooves 362 are arranged around the third magnetic conduction plate 36 at intervals. Exemplarily, the third magnetic conduction plate 36 is in a square ring shape, and the four second avoidance grooves 362 are respectively located at the four corner parts of the third magnetic conduction plate 36.

[0097] In this embodiment, the third magnetic conduction plate 36 includes a magnetic conduction plate body 363 and a magnetic conduction protrusion 364. The magnetic conduction plate body 363 is located on the surface of the second magnet 33 facing away from the first magnetic conduction plate 31. The magnetic conduction protrusion 364 is connected to the surface of the magnetic conduction plate body 363 facing away from the second magnet 33 and is located on the side of the magnetic conduction plate body 363 far from the second magnetic conduction plate 35. Among them, the inner side surface of the magnetic conduction protrusion 364 is flush with the inner side surface of the magnetic conduction plate body 363, and the outer side surface of the magnetic conduction protrusion 364 is located on the side of the outer side surface of the magnetic conduction plate body 363 facing away from the second magnetic conduction plate 35. At this time, the inner side surface of the third magnetic conduction plate 36 includes the inner side surface of the magnetic conduction plate body 363 and the inner side surface of the magnetic conduction protrusion 364, and the outer side surface of the third magnetic conduction plate 36 is the outer side surface of the magnetic conduction plate body 363. In some other embodiments, the inner side surface of the magnetic conduction protrusion 364 and the inner side surface of the magnetic conduction plate body 363 may not be flush.

[0098] The fourth magnetic conduction plate 37 is located on the surface of the third magnet 34 facing away from the first magnetic conduction plate 31, and is located inside the third magnetic conduction plate 36, and a fourth gap 371 is formed between the fourth magnetic conduction plate 37 and the third magnetic conduction plate 36. Specifically, a third sub-gap 372 is formed between the fourth magnetic conduction plate 37 and the magnetic conduction plate body 363, and the third sub-gap 372 communicates with the second gap 341 and the four second avoidance grooves 362. A fourth sub-gap 373 is formed between the fourth magnetic conduction plate 37 and the magnetic conduction protrusion 364, and the fourth sub-gap 373 communicates with the third sub-gap 372 and the four second avoidance grooves 362. Among them, the fourth gap 371 includes the third sub-gap 372 and the fourth sub-gap 373. Exemplarily, the fourth gap 371 is in a square ring shape.

[0099] Please refer to Figure 19 , Figure 19 is Figure 3 the schematic cross-sectional structure diagram of the speaker core 530 shown after being cut along V-V.

[0100] The magnetic circuit assembly 30 is installed on the second mounting surface 102 of the chassis 10. The magnetic circuit assembly 30 is fixed relative to the chassis 10 and provides a driving magnetic field for the vibration assembly 20. Specifically, the first magnetic conduction plate 31 is located on the side of the chassis 10 facing away from the sound film 21 and is spaced from the chassis 10. The first magnet 32, the second magnet 33, the third magnet 34, and the second magnetic conduction plate 35 are all located between the first magnetic conduction plate 31 and the chassis 10. Among them, the second magnetic conduction plate 35 is installed on the second mounting surface 102 of the chassis 10. The third magnetic conduction plate 36 and the fourth magnetic conduction plate 37 are both located inside the chassis 10. At this time, the four second avoidance grooves 362 of the third magnetic conduction plate 36 respectively avoid the electrical connection parts 292 of the four sub-flexible circuit boards 29, so as to avoid interference between the magnetic circuit assembly 30 and the flexible circuit board 26 and ensure the use reliability of the speaker core 530.

[0101] The end of the first voice coil 22 facing away from the sound film 21 is located in the first gap 331 and the third gap 361, and the end of the second voice coil 23 facing away from the sound film 21 is located in the second gap 341 and the fourth gap 371. In some other embodiments, the end of the first voice coil 22 facing away from the sound film 21 may be located in the first gap 331 or the third gap 361, and / or the end of the second voice coil 23 facing away from the sound film 21 may be located in the second gap 341 or the fourth gap 371. That is, the ends of the first voice coil 22 and the second voice coil 23 facing away from the sound film 21 are both located in the magnetic field provided by the magnetic circuit assembly 30. When the first voice coil 22 and the second voice coil 23 receive the audio signal transmitted by the flexible circuit board 26, the first voice coil 22 and the second voice coil 23 move up and down along the Z-axis direction to cut the magnetic force lines of the magnetic field, and drive the sound film 21 and the flexible circuit board 26 to vibrate.

[0102] In the magnetic circuit assembly 30 of the speaker core 530 shown in this embodiment, the first magnet 32, the second magnet 33, the third magnet 34, the second magnetic conductive plate 35, the third magnetic conductive plate 36, and the fourth magnetic conductive plate 37 adopt a high-low matching structure. A low magnetic circuit structure is designed to cooperate with the first voice coil 22, and a high magnetic circuit structure is designed to cooperate with the second voice coil 23. This enables the first voice coil 22 and the second voice coil 23 to make full use of the driving magnetic field provided by the magnetic circuit assembly 30, achieving a high driving force of the speaker core 530, improving the sound generation sensitivity of the speaker core 530, and helping to improve the sound generation performance of the speaker core 530.

[0103] Please refer to Figure 20 , Figure 20 which is a schematic cross-sectional structure diagram of the speaker core along the IV-IV section in the second electronic device provided by this application.

[0104] The difference between the speaker core 530 shown in this embodiment and the speaker core 530 shown in the above first embodiment is that the second magnet 33 includes a magnet body 332 and a magnet protrusion 333. The magnet body 332 is located on the third surface 311. Among them, the magnet body 332 is in a square ring shape. The magnet protrusion 333 is connected to the surface of the magnet body 332 facing away from the third surface 311 and is located on the side of the magnet body 332 away from the first magnet 32. Among them, the inner side surface of the magnet protrusion 333 is flush with the inner side surface of the magnet body 332, and the outer side surface of the magnet protrusion 333 is located on the side of the outer side surface of the magnet body 332 away from the first magnet 32. At this time, the inner side surface of the second magnet 33 includes the inner side surface of the magnet body 332 and the inner side surface of the magnet protrusion 333, and the outer side surface of the second magnet 33 includes the outer side surface of the magnet body 332. In some other embodiments, the inner side surface of the magnet protrusion 333 and the inner side surface of the magnet body 332 may not be flush.

[0105] Specifically, a first sub-gap 342 is formed between the magnet body 332 and the third magnet 34. A second sub-gap 343 is formed between the magnet protrusion 333 and the third magnet 34, and the second sub-gap 343 communicates with the first sub-gap 342 and the fourth gap 371. Among them, the second gap 341 includes the first sub-gap 342 and the second sub-gap 343.

[0106] In this embodiment, the speaker core 530 uses the first voice coil 22 and the second voice coil 23 to jointly drive the vibration of the diaphragm 21 to achieve vibration and sound generation. The first voice coil 22 and the second voice coil 23 can cooperate with the magnetic circuit component 30 to shorten the magnetic conduction path. The first voice coil 22 and the second voice coil 23 can make full use of the driving magnetic field provided by the magnetic circuit component 30, improve the magnetic field utilization rate of the magnetic circuit component 30, which is equivalent to achieving a high driving force of the speaker core 530, improving the sound generation sensitivity of the speaker core 530, and contributing to improving the sound generation performance of the speaker core 530. Moreover, the first voice coil 22 and the second voice coil 23 are designed on different height planes and can cooperate with the high-low combined magnet structure in the magnetic circuit component 30 to further make full use of the driving magnetic field provided by the magnetic circuit component 30, achieve a high driving force of the speaker core 530, improve the sound generation sensitivity of the speaker core 530, and contribute to improving the sound generation performance of the speaker core 530. Furthermore, the height h2 of the second voice coil 23 is greater than the height h1 of the first voice coil 22, which is equivalent to using a long voice coil structure to drive the diaphragm 21, can achieve low distortion of the speaker core 530, and can effectively improve the external sound quality of the speaker module 500. In addition, a convex portion 212 that cooperates with the second voice coil 23 is designed on the diaphragm 21, and a lower height can be designed near the sound outlet hole 511 of the speaker core 530, which can increase the sound outlet area to reduce the air flow velocity and improve the external sound quality of the speaker module 500.

[0107] The above description is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application; without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A speaker core, characterized in that, The invention comprises a basin frame, a sound membrane, a first voice coil and a second voice coil, wherein the sound membrane is installed on the basin frame, the first voice coil and the second voice coil are both located on the inner side of the basin frame and are both installed on the sound membrane, and the second voice coil is located on the inner side of the first voice coil and is spaced apart from the first voice coil; The first voice coil has a first end surface facing the sound membrane, the second voice coil has a second end surface facing the sound membrane, and the second end surface is located on a side of the first end surface facing the sound membrane.

2. The loudspeaker core according to claim 1, characterized in that, The sound membrane includes a body and a convex bulge, wherein the body is mounted on the basin frame, and the convex bulge is connected to the body and protrudes in a direction away from the basin frame relative to the body; The first voice coil is installed on the body, and the second voice coil is installed on the convex hull.

3. The speaker core according to claim 2, wherein The ratio of the area of the convex hull to the area of the sound membrane is between 1 / 4 and 1 / 3.

4. The speaker core according to any one of claims 1 to 3, characterized in that The height of the second voice coil is greater than the height of the first voice coil.

5. The loudspeaker core according to claim 4, wherein, The speaker core further includes a first magnetic conductive plate, a first magnet, a second magnet and a third magnet. The first magnetic conductive plate is located on a side of the basin frame away from the sound membrane and is spaced apart from the basin frame. The first magnet, the second magnet and the third magnet are all located on a surface of the first magnetic conductive plate facing the basin frame. The second magnet is located on the inner side of the first magnet and forms a first gap with the first magnet. The third magnet is located on the inner side of the second magnet and forms a second gap with the second magnet. The end of the first voice coil away from the sound membrane is located in the first gap, and the end of the second voice coil away from the sound membrane is located in the second gap.

6. The loudspeaker core according to claim 5, wherein, The second magnet includes a magnet body and a magnet protrusion. The magnet body is located on the surface of the first magnetic conductive plate facing the basin frame and forms a first sub-gap with the third magnet. The magnet protrusion is connected to the surface of the magnet body facing away from the first magnetic conductive plate and forms a second sub-gap with the third magnet. The second sub-gap is connected to the first sub-gap, and the second gap includes the first sub-gap and the second sub-gap.

7. The loudspeaker core according to claim 5 or 6, characterized in that The speaker core also includes a second magnetic conductive plate, a third magnetic conductive plate and a fourth magnetic conductive plate; The second magnetic conductive plate is located on a surface of the first magnet facing away from the first magnetic conductive plate, the third magnetic conductive plate is located on a surface of the second magnet facing away from the first magnetic conductive plate, and is located on the inner side of the second magnetic conductive plate, and a third gap is formed between the third magnetic conductive plate and the second magnetic conductive plate, and the third gap is connected to the first gap, the fourth magnetic conductive plate is located on a surface of the third magnet facing away from the first magnetic conductive plate, and is located on the inner side of the third magnetic conductive plate, and a fourth gap is formed between the third magnetic conductive plate and the third magnetic conductive plate, and the fourth gap is connected to the second gap; The end of the first voice coil facing away from the sound membrane is also located in the third gap, and the end of the second voice coil facing away from the sound membrane is also located in the fourth gap.

8. The loudspeaker core according to claim 7, characterized in that The third magnetic conductive plate includes a magnetic conductive plate body and magnetic conductive protrusions. The magnetic conductive plate body is located on the surface of the second magnet facing away from the first magnetic conductive plate, and a third sub-gap is formed between the magnetic conductive plate body and the fourth magnetic conductive plate. The magnetic conductive protrusions are connected to the surface of the magnetic conductive plate body facing away from the first magnetic conductive plate, and a fourth sub-gap is formed between the magnetic conductive protrusions and the fourth magnetic conductive plate. The second sub-gap communicates with the first sub-gap and the second gap. The fourth gap includes the third sub-gap and the fourth sub-gap.

9. The loudspeaker core according to any one of claims 5 to 8, characterized in that The first voice coil has a third end surface disposed opposite to the first end surface, and the second voice coil has a fourth end surface disposed opposite to the second end surface. The third end surface is flush with the fourth end surface.

10. The speaker core according to claim 9, wherein, The speaker core further includes a first skeleton and a second skeleton. Both the first skeleton and the second skeleton are located inside the speaker frame. The first skeleton is connected between the sound film and the first voice coil. The second skeleton is connected between the sound film and the second voice coil, and is located inside the first skeleton and spaced apart from the first skeleton. Wherein, the height of the first skeleton is greater than the height of the second skeleton.

11. The speaker core according to claim 10, wherein, The speaker core further includes a flexible circuit board. The flexible circuit board is installed on the speaker frame and electrically connects the first voice coil and the second voice coil. The first skeleton is provided with a first avoidance groove. The opening of the first avoidance groove is located on the surface of the first skeleton facing the sound film. The first avoidance groove penetrates through the inner side surface and the outer side surface of the first skeleton and avoids the flexible circuit board.

12. The loudspeaker core according to claim 11, wherein The third magnetic conductive plate is provided with a second avoidance groove. The opening of the second avoidance groove is located on the surface of the third magnetic conductive plate facing the speaker frame. The second avoidance groove penetrates through the inner side surface and the outer side surface of the third magnetic conductive plate and avoids the flexible circuit board.

13. The speaker core according to any one of claims 1 to 12, characterized in that, The sound film includes a diaphragm and a dome. The diaphragm includes a first fixing portion, a second fixing portion, and a surround portion. The first fixing portion is installed on the speaker frame. The second fixing portion is located inside the first fixing portion and spaced apart from the first fixing portion. The surround portion is connected between the first fixing portion and the second fixing portion and is recessed in the direction of the speaker frame. The dome is installed on the second fixing portion. Both the first voice coil and the second voice coil are installed on the dome.

14. A speaker module, characterized in that, It includes a first housing and the speaker core according to any one of claims 1 to 13. The speaker core is installed in the first housing. A front sound cavity is formed between the sound film and the first housing. The first housing is provided with a sound outlet hole, and the sound outlet hole communicates the front sound cavity with the outside of the speaker module.

15. The loudspeaker module according to claim 14, wherein, The speaker module further includes a second housing. The second housing and the first housing are fixed to each other. The speaker core is located inside the second housing and the first housing. A rear sound cavity is formed on the side of the sound film facing away from the front sound cavity.

16. An electronic device, characterized in that, It includes a processor and the speaker module according to claim 14 or 15. The speaker module is electrically connected to the processor.

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