Baking support frame of multilayer circuit board

Abstract

The invention discloses a baking support frame for a multilayer circuit board, and the support frame comprises a main frame body which is provided with a plurality of support units. The supporting unit comprises a supporting plate, a plurality of telescopic columns are arranged on the supporting plate, and positioning pad nets are arranged at the telescopic ends of the telescopic columns. According to the baking supporting frame of the multilayer circuit board, the multiple supporting units are arranged on the main frame body, the number of circuit boards baked at a time is larger, the circuit boards abut against the lower portions of the supporting plates of the previous supporting units through the positioning pad nets and the telescopic columns, it can be guaranteed that the circuit boards are heated evenly through the positioning pad nets, and deformation of the circuit boards is restrained.

Description

Technical Field

[0001] The present invention relates to the technical field of motor production, and particularly to a baking support frame for a multi-layer circuit board. Background Art

[0002] During processes such as lamination, curing, and surface treatment of multi-layer circuit boards, high-temperature baking (usually at a temperature of 120 - 250 °C) is required.

[0003] In the current baking process, directly baking the multi-layer circuit board without certain support may cause problems such as deformation of the board surface, and the current baking process can only bake a single circuit board at a time. Summary of the Invention

[0004] To solve the deficiencies in the prior art, the present invention provides a baking support frame for a multi-layer circuit board. The baking support frame for the multi-layer circuit board has more circuit boards baked at a single time by arranging a plurality of support units on the main frame body. The circuit board is pushed under the support plate of the previous support unit through the positioning cushion net and the telescopic column. The positioning cushion net can ensure uniform heating of the circuit board and inhibit its deformation.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention provides a baking support frame for a multi-layer circuit board, including a main frame body, and a plurality of support units are arranged on the main frame body;

[0007] The support unit includes a support plate, a plurality of telescopic columns are arranged on the support plate, and a positioning cushion net is arranged on the telescopic end of the telescopic column.

[0008] In a further technical solution, the support plate is a hollow structure.

[0009] The hollow support plate further facilitates the free flow of the drying gas, and the drying effect of the circuit board is better.

[0010] In a further technical solution, the main frame body is a hollow structure.

[0011] The hollow main frame body further facilitates the free flow of the drying gas, and the drying effect of the circuit board is better.

[0012] In a further technical solution, the support unit further includes an operator, the operator includes a linkage plate, the linkage plate connects the telescopic ends of a plurality of telescopic columns into one body, and a pressing plate extending out of the support unit is arranged on the linkage plate.

[0013] The lifting of the telescopic column can be conveniently operated through the pressing plate, simplifying the operation process.

[0014] In a further technical solution, the telescopic column includes a bottom column, a movable column and a spring. The spring is arranged inside the bottom column, and the movable column is movably arranged inside the bottom column and connected to the spring.

[0015] The mechanical spring structure ensures that it can always work under high-temperature drying.

[0016] The beneficial effects are as follows:

[0017] 1. The baking support frame for multi-layer circuit boards has more circuit boards baked at one time by arranging a plurality of support units on the main frame body. The circuit board is pushed under the support plate of the previous support unit through the positioning cushion net and the telescopic column. The positioning cushion net can ensure uniform heating of the circuit board and prevent its deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the baking support frame for multi-layer circuit boards according to an embodiment of the present invention;

[0019] Figure 2 is a schematic structural diagram of the support unit of the baking support frame for multi-layer circuit boards according to an embodiment of the present invention.

[0020] 10. Main frame body; 20. Only bear the original; 21. Support plate; 22. Telescopic column; 23. Positioning cushion net; 24. Operator; 241. Linking plate; 242. Pressing plate. DETAILED DESCRIPTION OF THE INVENTION

[0021] The present invention will be further described below with reference to the accompanying drawings:

[0022] Embodiment:

[0023] A baking support frame for multi-layer circuit boards, as Figure 1 and Figure 2 shown, includes a main frame body 10, and a plurality of support units are arranged on the main frame body 10;

[0024] The support unit includes a support plate 21, a plurality of telescopic columns 22 are arranged on the support plate 21, and a positioning cushion net 23 is arranged on the telescopic end of the telescopic column 22.

[0025] During drying, the circuit board to be dried is placed on the positioning cushion net 23, and the positioning cushion net 23 is pushed upward by the telescopic column 22, so that the circuit board to be dried is pressed against the lower surface of the support plate 21 of the previous support unit, that is, the positioning is completed. After all the circuit boards are positioned, drying can be started. During the drying process, the positioning cushion net 23 always has an upward force to fix the circuit board and prevent its deformation due to heat.

[0026] The baking support frame of the multi-layer circuit board has multiple support units provided on the main frame body 10, and more circuit boards can be baked at one time. The circuit board is pushed under the support plate 21 of the previous support unit through the positioning cushion net 23 and the telescopic column 22. The positioning cushion net 23 can ensure uniform heating of the circuit board and suppress its deformation.

[0027] In another embodiment, the support plate 21 is a hollow structure.

[0028] The hollow support plate 21 further facilitates the free flow of the drying gas, and the drying effect of the circuit board is better.

[0029] In another embodiment, the main frame body 10 is a hollow structure.

[0030] The hollow main frame body 10 further facilitates the free flow of the drying gas, and the drying effect of the circuit board is better.

[0031] In another embodiment, the support unit further includes an operator 24. The operator 24 includes a linkage plate 241. The linkage plate 241 connects the telescopic ends of the plurality of telescopic columns 22 into one body, and a pressing plate 242 extending out of the support unit is provided on the linkage plate 241.

[0032] The lifting of the telescopic column 22 can be conveniently operated through the pressing plate 242, and the operation process is simplified.

[0033] In another embodiment, the telescopic column 22 includes a bottom column, a movable column and a spring. The spring is arranged in the bottom column, and the movable column is movably arranged in the bottom column and connected with the spring.

[0034] The mechanical spring structure ensures that it can always work under high-temperature drying.

[0035] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A baking support frame for a multi-layer circuit board, characterized in that, It includes a main frame body, and a plurality of support units are arranged on the main frame body; The support unit includes a support plate, a plurality of telescopic columns are arranged on the support plate, and a positioning cushion net is arranged on the telescopic end of the telescopic column.

2. The baking support frame for the multi-layer circuit board according to claim 1, wherein The support plate is of a hollow structure.

3. The baking support frame for the multi-layer circuit board according to claim 1, characterized in that, The main frame body is of a hollow structure.

4. The baking support frame for the multi-layer circuit board according to claim 1, characterized in that, The support unit further includes an operator, the operator includes a linkage plate, the linkage plate connects the telescopic ends of a plurality of telescopic columns into one body, and a pressing plate extending out of the support unit is arranged on the linkage plate.

5. The baking support frame of the multilayer circuit board according to claim 1, characterized in that The telescopic column includes a bottom column, a movable column and a spring, the spring is arranged in the bottom column, and the movable column is movably arranged in the bottom column and connected with the spring.

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