Soldering equipment and solder paste

Abstract

The present application discloses a soldering device and solder paste, which relate to the field of soldering technology. The device includes a processing unit, an image acquisition unit, a patch unit, a solder paste application unit, and a heating unit. The image acquisition unit is fixed to the surface of the patch unit. The patch unit grabs the electronic device. The image acquisition unit is used to acquire a depth image of the pads of the circuit board and the electronic device. The processing unit controls the patch unit to move the position of the electronic device according to the depth image. The solder paste application unit applies solder paste to the pads. The patch unit attaches the electronic device to the solder paste-coated pads. The heating unit heats the solder paste between the pads and the electronic device to solder the electronic device to the pads. By controlling the patch unit to move the position of the electronic device according to the depth image, the electronic device and the pad are accurately aligned. Therefore, after the subsequent application of solder paste and soldering, the pins of the device are accurately soldered to the pads, thereby increasing the yield rate of the device.

Description

Technical Field

[0001] The present application relates to the field of welding technology, and in particular to a welding device and solder paste. Background Art

[0002] Surface mount soldering is one of the core processes in the assembly of printed circuit boards. This process places extremely high demands on component placement accuracy, component size control, solder paste quality, and printing accuracy.

[0003] With the development of miniaturization in the manufacturing industry and the widespread application of micro devices such as 0201 and 01005, even a slight deviation of the device during the welding process will cause the yield and quality of the device to decline, or even make it unusable. Summary of the Invention

[0004] The present application provides a soldering device and solder paste to at least solve the problem in the related art that a slight deviation during the soldering process will cause the yield and quality of the device to decrease, or even make it unusable.

[0005] The present application provides a welding device, comprising: a processing unit, an image acquisition unit, a patch unit, a solder paste smearing unit, and a heating unit; the image acquisition unit is fixed on the surface of the patch unit, and the image acquisition unit is oriented in the direction of the electronic device grasped by the patch unit; the patch unit grasps the electronic device; the image acquisition unit is used to acquire a depth image of the soldering pad of the circuit board and the electronic device; the processing unit controls the patch unit to move the position of the electronic device according to the depth image; the solder paste smearing unit smears solder paste on the soldering pad; the patch unit attaches the electronic device to the soldering pad coated with solder paste; the heating unit heats the solder paste between the soldering pad and the electronic device, so that the electronic device is soldered to the soldering pad.

[0006] The present application also provides a solder paste for use in the soldering device of the first aspect, comprising: tin-silver-copper solder, titanium nitride nanowires doped in the tin-silver-copper solder, and graphene quantum dots doped in the tin-silver-copper solder, wherein the weight of the titanium nitride nanowires accounts for 0.6% to 1.2% of the weight of the solder paste, and the weight of the graphene quantum dots accounts for 0.1% to 0.4% of the weight of the solder paste.

[0007] The image acquisition unit fixed on the surface of the patch unit of this application captures depth images of the electronic device and the solder pad, and the patch unit is controlled to move the position of the electronic device according to the depth image, so that the electronic device and the solder pad are accurately aligned, so that the pins of the device are accurately soldered to the solder pad after subsequent application of solder paste and soldering, thereby increasing the yield and quality of the device after soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 Schematic diagram of the structure of the welding device provided in the embodiment of the present application Figure 1 ;

[0010] Figure 2 A schematic diagram of the structure of the patch unit provided in an embodiment of the present application;

[0011] Figure 3 Schematic diagram of the structure of the welding device provided in the embodiment of the present application Figure 2 ;

[0012] Figure 4 Schematic diagram of the structure of the heating unit provided in the embodiment of the present application Figure 1 ;

[0013] Figure 5 Schematic diagram of the structure of the heating unit provided in the embodiment of the present application Figure 2 ;

[0014] Figure 6 Schematic diagram of the structure of the heating unit provided in the embodiment of the present application Figure 3 .

[0015] The above drawings include the following reference numerals:

[0016] 100-Welding device;

[0017] 101-processing unit;

[0018] 102-image acquisition unit;

[0019] 103-patch unit;

[0020] 104-Solder paste applying unit;

[0021] 105-heating unit;

[0022] 1031-Piezoelectric ceramic micro-motion platform;

[0023] 1032-displacement module and;

[0024] 1033-Placement head;

[0025] 1051-transmission unit;

[0026] 1052-vacuum pump;

[0027] 1053-Low pressure chamber;

[0028] 1054-infrared heating unit;

[0029] 531-First entry hatch;

[0030] 532-First Isolation Chamber;

[0031] 533-Second entry door;

[0032] 534-heating chamber;

[0033] 535-first exit hatch;

[0034] 536-Second isolation chamber;

[0035] 537-Second exit hatch;

[0036] 106- temperature detection unit;

[0037] 107-Laser assisted heating unit;

[0038] 1055-heating wire;

[0039] 1056-thermal insulation layer;

[0040] 1057-Fan. DETAILED DESCRIPTION

[0041] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0043] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0044] Figure 1 Schematic diagram of the structure of the welding device provided in the embodiment of the present application Figure 1 .like Figure 1 As shown, the soldering device 100 includes: a processing unit 101, an image acquisition unit 102, a patch unit 103, a solder paste applying unit 104, and a heating unit 105.

[0045] The image acquisition unit 102 is fixed on the surface of the patch unit 103 , and the image acquisition unit 102 faces the direction of the electronic device captured by the patch unit 103 .

[0046] The image acquisition unit can be fixed to the surface of the patch unit using bolts / screws, can be fixed to the surface of the patch unit using slots / clip buckles, or can be welded / glued to the surface of the patch unit. The image acquisition unit 102 can be fixed to the side surface of the patch unit or to the surface of the patch unit close to the electronic device.

[0047] The patch unit 103 picks up the electronic device.

[0048] The patch unit 103 may include a displacement module and a placement head connected to the displacement module. The displacement module may be composed of a motor, a slide rail, or a robotic arm. The placement head may be composed of a suction cup or a gripper.

[0049] The image acquisition unit 102 is used to acquire depth images of the pads of the circuit board and electronic components. The image acquisition unit is a depth camera that can also integrate near-infrared and visible light imaging to obtain a three-dimensional image containing depth information through multi-spectral confocal imaging.

[0050] The image acquisition unit acquires the depth image in response to receiving an instruction from the processing unit, or acquires the depth image periodically.

[0051] The processing unit 101 controls the patch unit 103 to move the position of the electronic device according to the depth image.

[0052] The processing unit uses the depth image to determine whether the electronic device is aligned with the pad. If not, it controls the placement of the patch unit to align the electronic device with the pad. This determination can be achieved using a proportional, integral, and derivative (PID) algorithm and a neural network model.

[0053] The solder paste applying unit 104 applies solder paste to the pads.

[0054] Among them, the solder paste smearing unit may include a solder paste storage tank, a paste pump, a scraper, etc. The solder paste storage tank is used to store solder paste, the paste pump is used to pump out the solder paste in the solder paste storage tank, and the scraper is used to smear the solder paste on the surface of the pad.

[0055] The patch unit 103 attaches electronic components to pads coated with solder paste.

[0056] Among them, the patch unit presses or places the electronic device on the pad coated with solder paste by moving the position, and releases the clamping claw or suction cup to keep the device on the surface of the pad.

[0057] The heating unit 105 heats the solder paste between the pad and the electronic component so that the electronic component is soldered to the pad.

[0058] The heating unit can heat the solder paste using infrared radiation, hot air, or other methods to melt the solder paste, and then complete the soldering of the electronic components after the solder paste cools. The heating unit can be fixed to the surface of the patch unit or independent of the patch unit.

[0059] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure capture depth images of electronic devices and solder pads by an image acquisition unit fixed on the surface of the patch unit, and control the patch unit to move the position of the electronic device according to the depth image, so that the electronic device and the solder pad are accurately aligned, so that the pins of the device are accurately soldered to the solder pads after the subsequent application of solder paste and soldering, thereby increasing the yield and quality of the device after soldering.

[0060] In a possible implementation, the processing unit 101 inputs the depth image into the position control model to obtain a displacement signal output by the position control model.

[0061] Among them, the position control model can be obtained by staff using experimental data to train the convolutional neural network model.

[0062] The patch unit 103 is controlled to move the position of the electronic device according to the displacement signal.

[0063] Specifically, the method may include sending a displacement signal to a displacement module in the patch unit, so that the displacement module in the patch unit drives the placement head to move a corresponding distance.

[0064] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure use a position control model to output a displacement signal, thereby making the position control of the patch unit more accurate, thereby achieving better welding effects and reducing the probability of cold soldering.

[0065] Figure 2 A schematic diagram of the structure of a patch unit provided in an embodiment of the present application. In one possible implementation, the patch unit 103 includes a piezoelectric ceramic micro-motion platform 1031 and may also include a displacement module 1032 and a placement head 1033 connected to the displacement module.

[0066] The piezoelectric ceramic fine-motion platform 1031 moves the position of the electronic device according to the instruction of the processing unit 101 .

[0067] The piezoelectric ceramic fine-motion platform 1031 is mounted on the rear side of the placement head 1032. It can be composed of at least one piezoelectric ceramic element. The processing unit applies voltage to the piezoelectric ceramic element, causing it to deform, thereby changing the position of the placement head of the patch unit and thereby repositioning the electronic device.

[0068] As can be seen from the description of the above embodiments, the embodiments of the present disclosure achieve higher precision in moving electronic devices by providing a piezoelectric ceramic micro-motion platform in the patch unit, thereby making the welding process of the electronic devices more accurate.

[0069] Figure 3 Schematic diagram of the structure of the welding device provided in the embodiment of the present application Figure 2 .like Figure 3 As shown, the heating unit 105 includes: a transmission unit 1051, at least one vacuum pump 1052, a low-pressure chamber 1053 and an infrared heating unit 1054.

[0070] Among them, the transmission unit 1051 can be composed of a conveyor belt and a motor, which is used to move the circuit board and the electronic components placed on the circuit board into the low-pressure warehouse 1053, and the infrared heating unit 1054 can be an infrared lamp tube or a focused infrared emitter, etc., which is used to heat the solder paste between the electronic components and the solder pads in the low-pressure warehouse.

[0071] The infrared heating unit 1054 is installed in the low-pressure chamber 1053.

[0072] The infrared heating unit 1054 can be installed on the inner wall of the low-pressure chamber 1053, or fixed to the inner side of the low-pressure chamber using other components.

[0073] The vacuum pump 1052 is connected to the low-pressure chamber 1053 and is used to extract the gas in the low-pressure chamber 1053.

[0074] Among them, the vacuum pump can be a rotary vane vacuum pump, a scroll vacuum pump, a screw vacuum pump, etc.

[0075] The transmission unit 1051 transmits the circuit board with the electronic components attached to the low-voltage chamber 1053 .

[0076] The transmission unit can transfer circuit boards to the low-voltage compartment based on signals sent by the processing unit. It can also rotate continuously or intermittently, moving electronic devices and circuit boards placed on the transmission unit toward the low-voltage compartment. The transmission unit is also used to transport soldered circuit boards inside the low-voltage compartment to outside the compartment.

[0077] The infrared heating unit 1054 heats the solder paste between the electronic components and the solder pads in the low-pressure chamber 1053, and after the solder paste cools, the electronic components are soldered to the solder pads.

[0078] Among them, the infrared heating unit can be controlled by the processing unit to heat the electronic devices in the low-pressure chamber, and can also heat the space in the low-pressure chamber in sections according to preset temperatures.

[0079] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure achieve welding in a low-pressure environment by arranging a vacuum pump, a low-pressure chamber and an infrared heating unit in the heating unit, thereby suppressing solder joint oxidation and bubble generation.

[0080] Figure 4 Schematic diagram of the structure of the heating unit provided in the embodiment of the present application Figure 1 .like Figure 4 As shown, the low-pressure chamber 1053 includes: a first inlet door 531 , a first isolation chamber 532 , a second inlet door 533 , a heating chamber 534 , a first outlet door 535 , a second isolation chamber 536 and a second outlet door 537 .

[0081] The processing unit 101 controls the first loading hatch 531 to open.

[0082] The first entry hatch may include a hatch and a motor, the motor being in transmission connection with the hatch and configured to control the hatch to open or close. The processing unit may notify the first entry hatch to open when the circuit board needs to enter the heating unit based on the location of the electronic device and the circuit board.

[0083] The transport unit 1051 transports the circuit board with the electronic components attached thereto into the first isolation chamber 532 .

[0084] The transmission unit transports the circuit board into the first isolation compartment by rolling the conveyor belt.

[0085] The processing unit 101 controls the first entry door 531 to be closed, and the vacuum pump 1052 extracts the gas between the first entry door 531 and the second entry door 533 .

[0086] Among them, the processing unit can determine whether the circuit board enters the first isolation chamber according to the transmission distance of the transmission unit, control the first input hatch to close, and the vacuum pump starts working to extract the gas.

[0087] The processing unit 101 controls the second loading hatch 533 to open.

[0088] After the vacuum pump has operated for a preset time, the processing unit controls the second entry hatch 533 to open. In one possible implementation, pressure sensors can be added to the first isolation chamber, the second isolation chamber, and the heating chamber, and the processing unit determines whether to open the hatch based on the pressure detected by the pressure sensors.

[0089] The transport unit 1051 transports the circuit board with the electronic components attached thereto to the heating chamber 534 and moves the circuit board within the heating chamber 534 .

[0090] The transmission unit may transmit the circuit board at a constant speed, or may transmit the circuit board at a variable speed according to a preset speed curve.

[0091] The infrared heating unit 1054 heats the electronic components in the heating chamber 534 and the solder paste between the pads.

[0092] Among them, the infrared heating unit can be composed of multiple parts, so that the heating rate of each section in the heating chamber is different to meet the welding requirements.

[0093] The processing unit 101 controls the first exit door 535 to open.

[0094] The processing unit may control the first exit door to open after the transmission unit transmits a preset distance.

[0095] The transport unit 1051 transports the circuit board with the electronic components attached thereto to the second isolation chamber 536 .

[0096] Among them, after the first exit door is opened, the transmission unit transmits the circuit board to the second isolation warehouse according to the instruction of the processing unit, or continues to transmit the circuit board to the second isolation warehouse.

[0097] The processing unit 101 controls the first exit hatch 535 to close.

[0098] The processing unit may send a signal to the motor of the first exit hatch, causing the motor of the first exit hatch to rotate and close the first exit hatch.

[0099] The vacuum pump 1052 extracts gas from the second isolation chamber 536 .

[0100] The vacuum pump may extract the gas in the second isolation chamber 536 according to the instruction received from the processing unit, or may extract the gas after detecting that the first exit hatch 535 is closed.

[0101] The processing unit 101 controls the second exit door 537 to open.

[0102] The processing unit may send a control signal to the motor of the second discharge hatch after the vacuum pump has been operating for a preset period of time, causing the motor to rotate, thereby opening the second discharge hatch.

[0103] The transport unit 1051 transports the circuit board with soldered electronic components to the outside of the second isolation chamber 536 .

[0104] Among them, the transmission unit transports the soldered circuit board to the outside of the second isolation warehouse.

[0105] From the description of the above embodiments, it can be seen that the embodiment of the present disclosure maintains a low-pressure environment in the low-pressure chamber by adding four hatches in the low-pressure chamber, reduces the working time of the vacuum pump, and increases welding efficiency.

[0106] In a possible implementation, the system further includes: a temperature detection unit 106 and a laser-assisted heating unit 107 .

[0107] The temperature detection unit may be an infrared temperature sensor or an infrared camera to detect the temperature of the solder paste in a non-contact manner. The laser-assisted heating unit may be any type of laser and may also include a robotic arm.

[0108] The temperature detection unit is used to detect the temperature of the solder paste between the pad and the electronic component, and send the temperature to the processing unit 101.

[0109] If the processing unit 101 determines that the temperature has not reached the preset temperature, it controls the laser auxiliary heating unit to perform auxiliary heating.

[0110] Wherein, when the processing unit 101 determines that the solder paste on the circuit board has not reached a preset temperature based on the temperature data transmitted by the temperature detection unit, it controls the laser auxiliary heating unit to face the area with lower solder paste temperature and outputs laser.

[0111] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure heat the solder with a lower temperature by adding a temperature detection unit and a laser-assisted heating unit, so that the solder can accurately reach the required temperature, avoiding the problem of cold solder joints caused by insufficient heating temperature.

[0112] In a possible implementation, the processing unit 101 is configured to determine an electronic device densely populated area based on a depth image.

[0113] The processing unit may use a pre-trained neural network model to identify areas with dense electronic device density.

[0114] The laser-assisted heating unit 107 assists in heating the solder paste of electronic components in the electronic component-intensive area.

[0115] Among them, the laser-assisted heating unit can heat the solder paste in the electronic device dense area according to the instructions of the processing unit.

[0116] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure heat the solder paste in the electronic device dense area through the laser-assisted heating unit, so that the heating rate of the component dense area is increased, the thermal stress difference between the component dense area and the component sparse area is reduced, thermal stress damage is avoided, and the reliability of the circuit board after welding is increased.

[0117] Figure 5 Schematic diagram of the structure of the heating unit provided in the embodiment of the present application Figure 2 In a possible implementation, the laser-assisted heating unit 107 and the temperature detection unit 106 are installed in the heating chamber 534 .

[0118] The temperature detection unit 106 detects the temperature of solder paste in each area between the electronic device and the pad.

[0119] Processing unit 101 obtains the location of the electronic device and solder pad. Based on the temperature and location, it determines whether there is a target area of ​​the solder paste that requires auxiliary heating. If auxiliary heating is required, laser auxiliary heating unit 107 is controlled to irradiate the target area to a preset temperature corresponding to the location.

[0120] Among them, the processing unit can determine the position of the electronic device and the solder pad based on the infrared image taken by the temperature detection unit, and judge whether the solder paste needs auxiliary heating based on the temperature of the solder paste between the electronic device and the solder pad in the infrared image.

[0121] For example, if there are five electronic components that need to be soldered, and the solder paste temperature of one of them is lower than a preset temperature, the processing unit will control the laser-assisted heating unit 107 to irradiate the solder paste of this component to increase the temperature of the solder paste of this electronic component. For another example, if there is a square electronic component that needs to be soldered, and the solder paste forms four sides, and the temperature of one side is lower than a preset temperature, the processing unit will control the laser-assisted heating unit 107 to irradiate this side to increase the temperature of this side to the preset temperature.

[0122] The preset temperature can correspond to the position of the circuit board in the heating unit. Figure 5 For example, the circuit board passes through the heating unit from left to right, and goes through the preheating stage, insulation stage, welding stage, and cooling stage in sequence. Different stages correspond to different temperatures, so the processing unit can determine the corresponding preset temperature based on the position of the circuit board in the infrared image.

[0123] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure heat the area where the temperature does not meet the standard by adding a laser-assisted heating unit and a temperature detection unit to the heating unit, so that the heating temperature meets the requirements, thereby increasing the yield and quality of the circuit board after welding.

[0124] Figure 6 Schematic diagram of the structure of the heating unit provided in the embodiment of the present application Figure 3 .like Figure 6 As shown, the heating unit 105 includes a heating wire 1055 , a heat insulation layer 1056 and a fan 1057 .

[0125] The heating wire can be made of nickel-chromium alloy, iron-chromium-aluminum alloy, or other materials. The insulation layer can be made of a combination of ceramic fiber or aerogel and glass fiber cloth. The fan can use an alloy impeller combined with a water-cooled motor to prevent overheating.

[0126] The heating wire 1055 is installed in the insulation layer 1056 , and the fan 1057 is installed behind the heating wire 1055 .

[0127] The rear of the heating wire may be in the opposite direction to the wind direction of the fan.

[0128] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure use a heating wire, an insulation layer and a fan to form a heating unit, and can use hot air to heat the solder paste without establishing low-pressure welding conditions, thereby reducing the manufacturing cost of the welding device.

[0129] An embodiment of the present application also provides a solder paste, which is applied to the welding device of any of the above embodiments, including: tin-silver-copper solder, titanium nitride nanowires doped in the tin-silver-copper solder, and graphene quantum dots doped in the tin-silver-copper solder, wherein the weight of the titanium nitride nanowires accounts for 0.6% to 1.2% of the weight of the solder paste, and the weight of the graphene quantum dots accounts for 0.1% to 0.4% of the weight of the solder paste.

[0130] The graphene quantum dots may be graphene fragments with a diameter less than 100 nanometers and a number of layers less than 10.

[0131] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure improve the welding strength by doping titanium nitride nanowires and graphene quantum dots into the tin-silver-copper solder.

[0132] In one possible implementation, titanium nitride nanowires account for 0.8% of the solder paste's weight, and graphene quantum dots account for 0.2%. Using these components increases the solder joint's tensile strength by 35%, thermal conductivity by 40%, and solder fluidity to less than 0.3% voiding.

[0133] The above is a detailed introduction to a soldering device and solder paste provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A welding device, characterized in that: include: Processing unit (101), image acquisition unit (102), patch unit (103), solder paste application unit (104), heating unit (105); The image acquisition unit (102) is fixed on the surface of the patch unit (103), and the image acquisition unit (102) faces the direction of the electronic device captured by the patch unit (103); The patch unit (103) grabs the electronic device; The image acquisition unit (102) is used to acquire depth images of pads and electronic components on a circuit board; The processing unit (101) controls the patch unit (103) to move the position of the electronic device according to the depth image; The solder paste applying unit (104) applies solder paste to the solder pad; The patch unit (103) attaches the electronic device to the solder pad coated with solder paste; The heating unit (105) heats the solder paste between the solder pad and the electronic device, so that the electronic device is soldered to the solder pad; Wherein, the patch unit (103) comprises a piezoelectric ceramic micro-motion platform (1031); The piezoelectric ceramic micro-motion platform (1031) moves the position of the electronic device according to the instruction of the processing unit (101); The heating unit (105) comprises: a transmission unit (1051), at least one vacuum pump (1052), a low-pressure chamber (1053), and an infrared heating unit (1054); The infrared heating unit (1054) is installed in the low-pressure chamber (1053); The vacuum pump (1052) is connected to the low-pressure chamber (1053) and is used to extract the gas in the low-pressure chamber (1053); The transmission unit (1051) transmits the circuit board with the electronic device attached to the low-pressure chamber (1053); The infrared heating unit (1054) heats the solder paste between the electronic device and the solder pad in the low-pressure chamber (1053), and after the solder paste cools, the electronic device is soldered to the solder pad.

2. The welding device according to claim 1, characterized in that The processing unit (101) inputs the depth image into a position control model to obtain a displacement signal output by the position control model; The patch unit (103) is controlled to move the position of the electronic device according to the displacement signal.

3. The welding device according to claim 1, characterized in that The low-pressure chamber (1053) includes a first inlet door (531), a first isolation chamber (532), a second inlet door (533), a heating chamber (534), a first outlet door (535), a second isolation chamber (536), and a second outlet door (537); The processing unit (101) controls the first feed hatch (531) to open; The transmission unit (1051) transmits the circuit board with the electronic device attached thereto into the first isolation chamber (532); The processing unit (101) controls the first feed hatch (531) to close, and the vacuum pump (1052) extracts gas between the first feed hatch (531) and the second feed hatch (533); The processing unit (101) controls the second entry hatch (533) to open; The transport unit (1051) transports the circuit board with the electronic device attached thereto to the heating chamber (534), and moves the circuit board within the heating chamber (534); The infrared heating unit (1054) heats the electronic device in the heating chamber (534) and the solder paste between the pads; The processing unit (101) controls the first exit hatch (535) to open; The transmission unit (1051) transmits the circuit board with the electronic device attached to the second isolation chamber (536); The processing unit (101) controls the first exit hatch (535) to close; The vacuum pump (1052) extracts gas from the second isolation chamber (536); The processing unit (101) controls the second exit hatch (537) to open; The transmission unit (1051) transmits the circuit board on which the electronic device is welded to the outside of the second isolation chamber (536).

4. The welding device according to claim 1 or 2, characterized in that: Also includes: A temperature detection unit (106) and a laser-assisted heating unit (107); The temperature detection unit is used to detect the temperature of the solder paste between the solder pad and the electronic device, and send the temperature to the processing unit (101); If the processing unit (101) determines that the temperature has not reached the preset temperature, the laser auxiliary heating unit is controlled to perform auxiliary heating.

5. The welding device according to claim 4, characterized in that The processing unit (101) is used to determine an electronic device dense area based on the depth image; The laser-assisted heating unit (107) assists in heating the solder paste of the electronic devices in the electronic device dense area.

6. The welding device according to claim 3, characterized in that Also includes: A temperature detection unit (106) and a laser-assisted heating unit (107); The laser-assisted heating unit (107) and the temperature detection unit (106) are installed in the heating chamber (534); The temperature detection unit (106) detects the temperature of the solder paste in each area between the electronic device and the solder pad; The processing unit (101) obtains the position of the electronic device and the solder pad; determines whether there is a target area of ​​the solder paste that requires auxiliary heating based on the temperature and the position; and if auxiliary heating is required, controls the laser auxiliary heating unit (107) to irradiate the target area so that the target area reaches a preset temperature corresponding to the position.

7. The welding device according to claim 1 or 2, characterized in that: The heating unit (105) comprises a heating wire (1055), a heat insulating layer (1056) and a fan (1057); The heating wire (1055) is installed in the heat insulation layer (1056), and the fan (1057) is installed behind the heating wire (1055).

8. A solder paste, characterized in that: The soldering device according to any one of claims 1 to 7 comprises: tin-silver-copper solder, titanium nitride nanowires doped in the tin-silver-copper solder, and graphene quantum dots doped in the tin-silver-copper solder, wherein the weight of the titanium nitride nanowires accounts for 0.6% to 1.2% of the weight of the solder paste, and the weight of the graphene quantum dots accounts for 0.1% to 0.4% of the weight of the solder paste.

Images