Semiconductor packaging lead welding device

Abstract

The invention belongs to the technical field of semiconductor production, and provides a semiconductor packaging lead welding device which comprises a base, a sliding plate is slidably mounted on the base, a first telescopic part for driving the sliding plate to move is fixedly mounted on the base, and a clamping plate for clamping a semiconductor is arranged on the sliding plate. A second telescopic piece is fixedly installed in the middle of the base, a protective cover is fixedly installed at the output end of the second telescopic piece, an opening of the protective cover faces the base, the projection of the protective cover to the base is located on the moving track of the sliding plate, an exhaust fan is fixedly installed at the top of the protective cover, and the exhaust fan communicates with a first branch pipe. Compared with the prior art, the welding fume collecting device has the following beneficial effects that fume generated by welding can be completely extracted, the welding fume collecting effect is improved, and the environmental protection property and safety of equipment use are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production, and particularly relates to a semiconductor package lead welding device. Background Art

[0002] Etching and wiring are performed on a semiconductor sheet to fabricate a semiconductor device capable of realizing a certain function. Not only silicon chips, but also common semiconductor materials such as gallium arsenide (gallium arsenide is toxic) and germanium. Welding, also known as fusion welding, is a manufacturing process and technology for joining metals or other thermoplastic materials such as plastics by heating, high temperature or high pressure.

[0003] At present, there are still certain defects in the semiconductor package lead welding devices on the market during use. For example, when using a semiconductor package lead welding device, it is difficult for the semiconductor package lead welding device to remove the harmful gases generated during welding, and users will inhale the harmful gases. For the above technical problems, the Chinese patent with the patent publication number CN208913407U, when in use, removes the fumes generated by welding by placing an air extraction pipe head near the welding position to extract air. However, since there is no restriction on the welding area, even if air is extracted through the air extraction pipe head, it is still impossible to restrict the air from flowing completely into the air extraction pipe head, resulting in some fumes diffusing into the surrounding air and the collection effect of the fumes being poor. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor package lead welding device, aiming to solve the technical problem that in the prior art, fumes will diffuse into the surrounding air and the collection effect of the fumes is poor.

[0005] The present invention is realized as follows: A semiconductor package lead welding device includes a base. A sliding plate is slidably installed on the base, and a first telescopic member for driving the sliding plate to move is fixedly installed on the base. A clamping plate for clamping a semiconductor is arranged on the sliding plate. A second telescopic member is fixedly installed in the middle of the base, and a protective cover is fixedly installed at the output end of the second telescopic member. The protective cover opens towards the base, and the projection of the protective cover on the base is located on the movement track of the sliding plate. An exhaust fan is fixedly installed at the top of the protective cover. The exhaust fan is communicated with a first branch pipe. The first branch pipe extends into the protective cover, and a second branch pipe is communicated with the first branch pipe. Solenoid valves are arranged on both the first branch pipe and the second branch pipe. An air inlet pipe is communicated with the opening of the protective cover, and a welding torch is arranged in the protective cover.

[0006] Further technical solution: Two sets of mounting frames are fixedly installed on the sliding plate. Two sets of clamping plates are arranged on the mounting frames, and a threaded rod for driving the two sets of clamping plates to move in opposite directions simultaneously is rotatably installed on the mounting frames.

[0007] Further technical solution: A substrate is fixedly installed inside the protective cover, and a through hole is formed in the middle of the substrate. A mounting ring is rotatably installed on the surface of the substrate away from the base. A rotating power member for driving the mounting ring to rotate is provided on the substrate. Two symmetrically distributed vertical rods are fixedly installed on the mounting ring. A lifting frame is slidably installed on the vertical rods. Third telescopic members are fixedly installed at both ends of the lifting frame, and the ends of the third telescopic members away from the lifting frame are fixedly connected to the ends of the vertical rods. The welding torch is arranged on the lifting frame.

[0008] Further technical solution: A moving block is slidably installed on the lifting frame, the welding torch is fixedly installed on the moving block, and a servo module for driving the moving block to move is provided on the lifting frame.

[0009] Further technical solution: The output shafts of the rotating power member are distributed along the radial direction of the mounting ring. A gear is fixedly installed at the end of the output shaft of the rotating power member, and the gear meshes with a toothed ring fixedly installed on the mounting ring. The toothed ring is coaxially arranged with the mounting ring.

[0010] Further technical solution: A plurality of symmetrically distributed guide rods are fixedly installed inside the mounting ring. Semi-circular closing plates are arranged on both sides of the guide rods. The closing plates are in sliding contact with the substrate. Second electromagnets are fixedly installed on the sides of the closing plates close to each other. The through hole is covered when the two closing plates contact each other.

[0011] Further technical solution: Two limiting blocks are fixedly installed on the guide rods. The limiting blocks are located at the ends and the middle of the guide rods. A buffer pad is fixedly installed on the limiting block at the end of the guide rod.

[0012] Further technical solution: Two support plates are arranged inside the mounting ring. The support plates are slidably installed on the guide rods. A support rod is slidably installed on the support plates. The support rod is fixedly connected to the corresponding closing plate. A permanent magnet is fixedly installed at the end of the support rod away from the closing plate. The permanent magnet is used in cooperation with a first electromagnet fixedly installed on the support plate.

[0013] Further technical solution: The first branch pipe is rotatably connected with a connecting hard pipe. The end of the connecting hard pipe away from the first branch pipe is communicated with a connecting hose. The connecting hose is fixedly connected to one of the closing plates. The connecting hose is communicated with the area below the substrate.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Through the setting of the protective cover, the welding area is completely covered and only one air inlet position is reserved, so that the air inside the protective cover can flow in a set direction, and the welding fumes generated can be completely extracted, avoiding the welding fumes from diffusing into the surrounding air and being inhaled by the staff, improving the collection effect of the welding fumes, and improving the environmental protection and safety of the equipment use.

[0015] 2. After welding is completed, the welding torch returns to its original position. Then, the second electromagnets are energized. After the two groups of second electromagnets are energized, they attract each other, causing the two sets of closing plates to connect and form a complete circular plate. Then, the first electromagnet is de-energized. Under the action of gravity and the magnetic force of the permanent magnet, the closing plate moves downward to contact the base plate, completing the closing of the through-hole. The through-hole is quickly closed through the closing plate, thereby achieving the separation of the upper and lower regions inside the protective cover. During the process of the welding torch returning to its original position after welding is completed, the welding fumes generated move above the base plate driven by the air. After being separated by the base plate and the closing plate, the protective cover can be lifted upward without having to extract all the fumes inside the protective cover, reducing the waiting time after welding is completed and improving the welding efficiency.

[0016] 3. By energizing and de-energizing the first electromagnet, the closing plate moves without contacting the base plate, avoiding frictional wear of the closing plate during use, which may cause incomplete sealing of the through-hole, improving the sealing performance of the through-hole closure, preventing welding fumes from leaking, and further enhancing the safety and environmental protection of the equipment during use.

[0017] 4. When welding is completed and the through-hole is closed by the closing plate, the solenoid valve on the first branch pipe is opened and the solenoid valve on the second branch pipe is closed. At this time, the exhaust fan directly extracts the air in the area below the base plate inside the protective cover through the first branch pipe, the connecting rigid pipe, and the connecting hose. Thus, during the upward movement of the protective cover, the air at the welding position can be continuously extracted, further reducing the probability of fume residue and further enhancing the safety and environmental protection of the equipment during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic cross-sectional structure diagram of the protective cover in the present invention.

[0020] Figure 3 It is a schematic structure diagram of the base plate in the present invention.

[0021] Figure 4 It is a schematic structure diagram of the mounting ring in the present invention.

[0022] Figure 5 is Figure 3 an enlarged schematic diagram of area A1 in

[0023] Figure 6 is Figure 3 an enlarged schematic diagram of area A2 in

[0024] Figure 7 is Figure 4 an enlarged schematic diagram of area A3 in

[0025] In the attached drawings: 1, base; 2, slide plate; 3, first telescopic member; 4, mounting bracket; 5, clamping plate; 6, threaded rod; 7, second telescopic member; 8, protective cover; 9, substrate; 10, through hole; 11, mounting ring; 12, rotary power member; 13, gear; 14, gear ring; 15, vertical rod; 16, third telescopic member; 17, lifting frame; 18, moving block; 19, servo module; 20, welding torch; 21, exhaust fan; 22, first branch pipe; 23, second branch pipe; 24, air inlet pipe; 25, guide rod; 26, support plate; 27, limit block; 28, support rod; 29, closing plate; 30, permanent magnet; 31, first electromagnet; 32, buffer pad; 33, second electromagnet; 34, connecting rigid pipe; 35, connecting flexible pipe. Detailed implementation manners

[0026] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the attached drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0027] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0028] As Figures 1-7 shown, a semiconductor package lead welding device provided by the present invention includes a base 1, a slide plate 2 is slidably mounted on the base 1, and a first telescopic member 3 for driving the slide plate 2 to move is fixedly mounted on the base 1. A clamping plate 5 for clamping a semiconductor is arranged on the slide plate 2. Two groups of mounting brackets 4 are fixedly mounted on the slide plate 2, two groups of clamping plates 5 are arranged on the mounting brackets 4, and a threaded rod 6 for driving the two groups of clamping plates 5 to move in opposite directions simultaneously is rotatably mounted on the mounting brackets 4. A second telescopic member 7 is fixedly mounted in the middle of the base 1, and an output end of the second telescopic member 7 is fixedly mounted with a protective cover 8. The opening of the protective cover 8 faces the base 1, and a projection of the protective cover 8 on the base 1 is located on a moving track of the slide plate 2. An exhaust fan 21 is fixedly mounted on the top of the protective cover 8. The exhaust fan 21 is communicated with a first branch pipe 22. The first branch pipe 22 extends into the protective cover 8, and a second branch pipe 23 is communicated with the first branch pipe 22. Solenoid valves are arranged on both the first branch pipe 22 and the second branch pipe 23. An air inlet pipe 24 is communicated with an opening of the protective cover 8, and a welding torch 20 is arranged in the protective cover 8.

[0029] In actual application of this embodiment, the semiconductor to be welded is placed on the slide plate 2 and located between the two groups of clamping plates 5. The threaded rod 6 is rotated to drive the two groups of clamping plates 5 to clamp the semiconductor. Then, the first telescopic member 3 drives the slide plate 2 to move so that the semiconductor moves to directly below the protective cover 8. Then, the second telescopic member 7 drives the protective cover 8 to move downward to contact the slide plate 2, and the position where the semiconductor is located is completely covered by the protective cover 8. At the same time, a semiconductor can be installed and fixed in the other group of mounting brackets 4; Afterwards, adjust the position of the welding torch 20 for welding. While welding, turn on the exhaust fan 21. The exhaust fan 21 extracts the air inside the protective cover 8 through the second branch pipe 23. At the same time, the outside air enters the protective cover 8 through the air inlet pipe 24, enabling the air inside the protective cover 8 to flow continuously from bottom to top. The fumes generated during welding follow the air and are directly extracted by the exhaust fan 21 through the second branch pipe 23 and transported to the external gas treatment equipment. After welding is completed, wait for the set time to enable the exhaust fan 21 to extract all the remaining fumes inside the protective cover 8, avoiding the residue of fumes inside the protective cover 8. Afterwards, the protective cover 8 resets, and the slide plate 2 moves in the reverse direction to move another group of semiconductors to the lower part of the protective cover 8 to continue the welding operation. Through the setting of the protective cover 8, the welding area is completely covered and only one air inlet position is reserved, enabling the air inside the protective cover 8 to flow in the set direction, being able to completely extract all the fumes generated by welding, avoiding the dispersion of the fumes generated by welding into the surrounding air and being inhaled by the staff, improving the collection effect of the welding fumes, and enhancing the environmental protection and safety of the equipment use.

[0030] In an example of this embodiment, the first telescopic member 3 and the second telescopic member 7 are respectively a first electric telescopic rod and a second electric telescopic rod. Of course, they can also be other components such as hydraulic cylinders that can actively change their lengths. The slide plate 2 is driven to move by the first electric telescopic rod, and the protective cover 8 is driven to move up and down by the second electric telescopic rod.

[0031] As Figures 2-5 shown, a semiconductor package lead welding device provided by the present invention. A substrate 9 is fixedly installed inside the protective cover 8, and a through hole 10 is opened in the middle of the substrate 9. A camera and a lighting lamp are arranged on the surface of the substrate 9 close to the base 1. A mounting ring 11 is rotatably installed on the surface of the substrate 9 away from the base 1. A rotary power member 12 for driving the mounting ring 11 to rotate is arranged on the substrate 9. Two groups of symmetrically distributed vertical rods 15 are fixedly installed on the mounting ring 11. A lifting frame 17 is slidably installed on the vertical rods 15. Third telescopic members 16 are fixedly installed at both ends of the lifting frame 17. The end of the third telescopic member 16 away from the lifting frame 17 is fixedly connected to the end of the vertical rod 15. The welding torch 20 is arranged on the lifting frame 17.

[0032] Specifically, a moving block 18 is slidably installed on the lifting frame 17, and the welding torch 20 is fixedly installed on the moving block 18. A servo module 19 for driving the moving block 18 to move is arranged on the lifting frame 17.

[0033] Specifically, the output shafts of the rotary power member 12 are distributed along the radial direction of the mounting ring 11. A gear 13 is fixedly installed at the end of the output shaft of the rotary power member 12. The gear 13 meshes with a toothed ring 14 fixedly installed on the mounting ring 11, and the toothed ring 14 is coaxially arranged with the mounting ring 11.

[0034] In actual application of this embodiment, after the protective cover 8 contacts the slide plate 2, the semiconductor is illuminated by the lighting lamp, and the welding position on the semiconductor is detected by the camera. After determining the welding position, the rotation power member 12 drives the mounting ring 11 to rotate through the gear 13 and the gear ring 14. The mounting ring 11 drives the lifting frame 17 to rotate through the vertical rod 15, so that the projection of the welding position on the lifting frame 17 is located on the movement track of the moving block 18. Then, the servo module 19 drives the moving block 18 to move, so that the welding torch 20 moves to directly above the welding position. At this time, the third telescopic member 16 drives the lifting frame 17 to move downward, so that the welding torch 20 welds the welding position, realizing flexible adjustment of the position of the welding torch 20 and improving the convenience of welding.

[0035] In an example of the present invention, the rotation power member 12 is a motor. Of course, it can also be other components such as a hydraulic motor that can output rotational power. The motor drives the mounting ring 11 to rotate to adjust the position of the welding torch 20. The third telescopic member 16 is a third electric telescopic rod. Of course, it can also be other components such as a hydraulic cylinder that can actively change its length. The third electric telescopic rod drives the lifting frame 17 to move up and down.

[0036] As Figures 3-7 shown, a semiconductor package lead welding device provided by the present invention is shown. A plurality of groups of symmetrically distributed guide rods 25 are fixedly installed in the mounting ring 11. Semi-circular closing plates 29 are arranged on both sides of the guide rods 25. The closing plates 29 are in sliding contact with the substrate 9. Second electromagnets 33 are fixedly installed on the mutually approaching sides of the closing plates 29. When the two closing plates 29 contact, the through hole 10 is covered.

[0037] Specifically, two groups of limit blocks 27 are fixedly installed on the guide rod 25. The limit blocks 27 are located at the ends and the middle of the guide rod 25. A buffer pad 32 is fixedly installed on the limit block 27 at the end of the guide rod 25.

[0038] Specifically, two groups of support plates 26 are arranged in the mounting ring 11. The support plates 26 are slidably installed on the guide rods 25. A support rod 28 is slidably installed on the support plates 26. The support rod 28 is fixedly connected to the corresponding closing plate 29. A permanent magnet 30 is fixedly installed at the end of the support rod 28 away from the closing plate 29. The permanent magnet 30 is used in cooperation with the first electromagnet 31 fixedly installed on the support plate 26.

[0039] In practical application of this embodiment, in the initial state, the two sets of closing plates 29 are far away from each other. The first electromagnet 31 is energized. After the first electromagnet 31 is energized, under the action of magnetic force, the permanent magnet 30 is pushed upward to move, so that the closing plate 29 does not contact the substrate 9. A gap for the movement of the welding torch 20 is left between the two sets of closing plates 29. After welding is completed, the welding torch 20 resets. Then, the second electromagnet 33 is energized. After the two sets of second electromagnets 33 are energized, they adsorb each other, so that the two sets of closing plates 29 are connected to form a complete circular plate. Then, the first electromagnet 31 is powered off. Under the action of gravity and the magnetic force of the permanent magnet 30, the closing plate 29 moves downward to contact the substrate 9 to complete the closing of the through hole 10. The through hole 10 is quickly closed by the closing plate 29, thereby realizing the separation of the upper and lower regions in the protective cover 8. After welding is completed, during the reset process of the welding torch 20, the welding fumes generated move above the substrate 9 driven by the air. After being separated by the substrate 9 and the closing plate 29, the protective cover 8 can be opened upward without exhausting all the fumes in the protective cover 8, reducing the waiting time after welding is completed and improving the welding efficiency. When the protective cover 8 contacts the slide plate 2 again for welding, first, the first electromagnet 31 is energized to make the closing plate 29 move away from the substrate 9 again. Then, the current direction of one of the second electromagnets 33 is reversed, so that the two sets of second electromagnets 33 repel and separate from each other. The limiting block 27 is used to prevent the closing plate 29 from moving excessively. The buffer pad 32 ensures that the two sets of closing plates 29 can be tightly connected and aligned with the through hole 10, ensuring that the closing plate 29 can close the through hole 10. By energizing and powering off the first electromagnet 31, the closing plate 29 does not contact the substrate 9 when moving, avoiding friction loss of the closing plate 29 during use and resulting in incomplete sealing of the through hole 10, improving the sealing performance of the through hole 10, avoiding welding fume leakage, and further improving the safety and environmental protection of equipment use.

[0040] As Figure 3 、 Figure 4 、 Figure 6 shown, a semiconductor package lead welding device provided by the present invention is shown. The first branch pipe 22 is rotatably connected with a connecting hard pipe 34. One end of the connecting hard pipe 34 far away from the first branch pipe 22 is communicated with a connecting hose 35. The connecting hose 35 is fixedly connected with one of the closing plates 29. The connecting hose 35 is communicated with the area below the substrate 9.

[0041] In actual application of this embodiment, when the welding is completed and the closing plate 29 closes the through hole 10, the solenoid valve on the first branch pipe 22 is opened and the solenoid valve on the second branch pipe 23 is closed. At this time, the exhaust fan 21 directly extracts the air in the area below the substrate 9 in the protective cover 8 through the first branch pipe 22, the connecting rigid pipe 34 and the connecting hose 35. Thus, during the upward movement of the protective cover 8, the air at the welding position can be continuously extracted, further reducing the probability of smoke residue and further improving the safety and environmental protection of equipment use. When welding again later, the states of the solenoid valves on the first branch pipe 22 and the second branch pipe 23 are interchanged.

[0042] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

[0043] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor package lead soldering device, comprising a base (1), characterized in that, A sliding plate (2) is slidably mounted on the base (1), and a first telescopic member (3) for driving the sliding plate (2) to move is fixedly mounted on the base (1). A clamping plate (5) for clamping a semiconductor is arranged on the sliding plate (2). A second telescopic member (7) is fixedly mounted in the middle of the base (1). The output end of the second telescopic member (7) is fixedly mounted with a protective cover (8). The opening of the protective cover (8) faces the base (1), and the projection of the protective cover (8) on the base (1) is located on the moving track of the sliding plate (2). A suction fan (21) is fixedly mounted on the top of the protective cover (8). The suction fan (21) is communicated with a first branch pipe (22). The first branch pipe (22) extends into the protective cover (8), and a second branch pipe (23) is communicated with the first branch pipe (22). Solenoid valves are arranged on both the first branch pipe (22) and the second branch pipe (23). An air inlet pipe (24) is communicated with the opening of the protective cover (8). A welding torch (20) is arranged in the protective cover (8).

2. The semiconductor package lead soldering device according to claim 1, wherein Two groups of mounting frames (4) are fixedly mounted on the sliding plate (2). Two groups of clamping plates (5) are arranged on the mounting frames (4). A threaded rod (6) for driving the two groups of clamping plates (5) to move in opposite directions simultaneously is rotatably mounted on the mounting frames (4).

3. The semiconductor package lead soldering device according to claim 1, characterized in that, A substrate (9) is fixedly mounted in the protective cover (8), and a through hole (10) is formed in the middle of the substrate (9). An installation ring (11) is rotatably mounted on the surface of the substrate (9) away from the base (1). A rotary power member (12) for driving the installation ring (11) to rotate is arranged on the substrate (9). Two groups of symmetrically distributed vertical rods (15) are fixedly mounted on the installation ring (11). A lifting frame (17) is slidably mounted on the vertical rods (15). Third telescopic members (16) are fixedly mounted at both ends of the lifting frame (17). The ends of the third telescopic members (16) away from the lifting frame (17) are fixedly connected to the ends of the vertical rods (15). The welding torch (20) is arranged on the lifting frame (17).

4. The semiconductor package lead soldering device according to claim 3, characterized in that, A moving block (18) is slidably mounted on the lifting frame (17). The welding torch (20) is fixedly mounted on the moving block (18). A servo module (19) for driving the moving block (18) to move is arranged on the lifting frame (17).

5. The semiconductor package lead soldering device according to claim 3, wherein, The output shafts of the rotary power member (12) are distributed along the radial direction of the installation ring (11). The end of the output shaft of the rotary power member (12) is fixedly mounted with a gear (13). The gear (13) meshes with a toothed ring (14) fixedly mounted on the installation ring (11). The toothed ring (14) is coaxially arranged with the installation ring (11).

6. A semiconductor package lead welding device according to claim 3, characterized in that, A plurality of groups of symmetrically distributed guide rods (25) are fixedly mounted in the installation ring (11). Semi-circular closing plates (29) are arranged on the guide rods (25) on both sides. The closing plates (29) are in sliding contact with the substrate (9). Second electromagnets (33) are fixedly mounted on the mutually approaching side surfaces of the closing plates (29). When the two closing plates (29) are in contact, they cover the through hole (10).

7. A semiconductor package lead soldering device according to claim 6, characterized in that, Two groups of limit blocks (27) are fixedly mounted on the guide rods (25). The limit blocks (27) are located at the ends and the middle of the guide rods (25). A buffer pad (32) is fixedly mounted on the limit block (27) at the end of the guide rod (25).

8. A semiconductor package lead soldering device according to claim 7, wherein, Two sets of support plates (26) are arranged inside the installation ring (11). The support plates (26) are slidably mounted on the guide rods (25). A support rod (28) is slidably mounted on the support plates (26). The support rod (28) is fixedly connected to the corresponding closing plate (29). A permanent magnet (30) is fixedly installed at one end of the support rod (28) away from the closing plate (29). The permanent magnet (30) is used in cooperation with the first electromagnet (31) fixedly installed on the support plate (26).

9. A semiconductor package lead soldering device according to claim 6, wherein, The first branch pipe (22) is rotatably connected to a connecting hard pipe (34). One end of the connecting hard pipe (34) away from the first branch pipe (22) is communicated with a connecting hose (35). The connecting hose (35) is fixedly connected to one of the closing plates (29). The connecting hose (35) is communicated with the area below the substrate (9).

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