A red copper plate surface treatment device and method

Abstract

The present application relates to red copper plate processing technical field, especially to a kind of red copper plate surface treatment device, including support seat, two support seat are connected with round shell, electric push rod is installed in the top surface of round shell evenly spaced along circumference, the push rod of electric push rod is connected with lower polishing disc and passes through round shell top, round shell top is equipped with lifting mechanism, lifting mechanism is connected with the upper polishing disc of annular distribution and is spaced, U-shaped mounting plate is installed on the outer wall of round shell evenly spaced along circumference, each U-shaped mounting plate is equipped with carousel, each carousel is equipped with clamp for clamping red copper plate, round shell is equipped with driving assembly for driving carousel rotation. By annular interval setting lower polishing disc, upper polishing disc, carousel and clamp on round shell, not only can simultaneously polish and polish multiple red copper plates, but also can realize the synchronous polishing and polishing of double sides of red copper plate, greatly shorten polishing cycle, significantly improve the efficiency of red copper plate surface treatment.

Description

Technical Field

[0001] This invention relates to the field of copper plate processing technology, and in particular to a copper plate surface treatment device and method. Background Technology

[0002] Copper sheet is a type of sheet material made of pure copper or high-purity copper alloy, named for its color. Copper possesses excellent electrical and thermal conductivity, corrosion resistance, and ductility, making it widely used in electrical appliances, electronics, construction, decoration, and chemical industries. For example, it is used in the electrical industry to manufacture wires and cables; in the construction and decoration industry to produce various decorative materials and handicrafts; and in the chemical industry to manufacture corrosion-resistant parts.

[0003] Before applying copper sheets, surface polishing is crucial. This process is a vital step in copper sheet processing, removing defects such as oxide layers and scratches to create a mirror-like finish, significantly improving the smoothness and uniformity of the copper sheet surface. Furthermore, polishing removes verdigris, rust, and oxide layers from the copper sheet surface, reducing the risk of subsequent corrosion. The smooth surface also lowers the coefficient of friction in mechanical applications, helping to extend the service life of the copper sheet in precision components.

[0004] Currently, although polishing the surface of copper plates using polishing equipment has become commonplace, existing equipment still has the following shortcomings:

[0005] 1. It can only grind and polish a single copper plate, resulting in low efficiency.

[0006] 2. It is not possible to polish both sides of the copper plate at the same time. One side needs to be polished first, and then the copper plate needs to be flipped over to polish the other side, which increases the polishing cycle and reduces the overall polishing efficiency. Summary of the Invention

[0007] This invention provides a copper plate surface treatment device, which aims to simultaneously grind and polish multiple copper plates to improve the efficiency of copper plate surface treatment, and simultaneously grind and polish copper plates on both sides to shorten the grinding cycle.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a surface treatment device for copper plates, comprising a support base, a circular shell with an open bottom connected between two support bases, electric push rods evenly spaced along the circumference of the inner top surface of the circular shell, the push rods of the electric push rods passing through the top of the circular shell and connected to a lower grinding disc for grinding and polishing the lower surface of the copper plate, a lifting mechanism provided at the top of the circular shell, an upper grinding disc arranged in a ring connected at intervals on the lifting mechanism for grinding and polishing the upper surface of the copper plate, the upper grinding discs and lower grinding discs corresponding one to one, the upper grinding disc being located directly above its corresponding lower grinding disc, U-shaped mounting plates evenly spaced along the circumference of the outer wall of the circular shell, each U-shaped mounting plate having a turntable, each turntable having an opening for accommodating the copper plate, each turntable having a clamp for holding the copper plate, and a driving component for driving the turntable to rotate on the circular shell.

[0009] Preferably, the clamp includes two clamping plates slidably connected in the opening and two screws rotatably connected to the turntable, with the two screws threadedly connected to the two clamping plates respectively.

[0010] Preferably, each turntable is provided with a drive mechanism for driving the screw to rotate. The drive mechanism includes two guide rods symmetrically connected to the top of the turntable. An L-shaped plate is slidably connected to each of the two guide rods. The L-shaped plate is slidably engaged with the turntable. When the lower grinding disc moves down, it can contact the L-shaped plate and push the L-shaped plate down. A spring is connected between the L-shaped plate and the turntable. A rack is connected to the L-shaped plate. A spur gear is connected to the screw through a one-way clutch. The rack can move up and down to mesh with the adjacent spur gear.

[0011] Preferably, the lifting mechanism includes a mounting frame installed in the middle of the top of the round shell, a cylinder installed on the top of the mounting frame, a lifting plate connected to the cylinder, telescopic rods evenly spaced on the lifting plate, a spring connecting the inner and outer rods of the telescopic rods, an upper grinding disc corresponding to each telescopic rod, and the upper grinding disc connected to its corresponding telescopic rod.

[0012] Preferably, an air pump is installed on the outer wall of each U-shaped mounting plate, and an air jet pipe for spraying gas onto the copper plate is connected to the top of each U-shaped mounting plate. The air jet pipe and the air pump connected to the same U-shaped mounting plate are in communication.

[0013] Preferably, the top of the round shell has a chip discharge port spaced apart for discharging waste chips.

[0014] Preferably, the bottom of the round shell is connected to a guide hopper for collecting and guiding waste.

[0015] Preferably, the drive assembly includes a motor mounted in the middle of the circular shell, a drive gear connected to the output shaft of the motor, and a gear ring connected to the circumferential sidewall of each turntable, the gear ring meshing with the drive gear.

[0016] Preferably, the clamping part of the clamping plate is connected to a rubber clamp for cushioning and protecting the copper plate.

[0017] A method for surface treatment of copper plates includes the following steps:

[0018] S1. Place the copper plate. First, control the electric push rod to drive the lower grinding disc to move upward. Then place the copper plate on the lower grinding disc. The copper plate is positioned between the two clamping plates by the support of the lower grinding disc.

[0019] S2. Clamp the copper plate and manually rotate the two screws to bring the two clamping plates closer together, clamping and fixing the copper plate on the turntable.

[0020] S3. Double-sided polishing of copper plate: control cylinder to drive lifting plate to move down, thereby driving upper polishing plate to move down and contact copper plate through telescopic rod. Then control motor to drive drive gear to rotate. Drive gear to rotate gear ring to drive turntable to rotate. Turntable rotation drives copper plate to rotate through clamp, so that both upper and lower surfaces are polished by upper and lower polishing plates at the same time.

[0021] S4. Remove the copper plate, control the cylinder to drive the lifting plate to move up, thereby driving the upper grinding disc to move up and separate from the copper plate. Then manually control the two screws to drive the two clamping plates to move away from each other and loosen the copper plate. Finally, remove the copper plate for replacement.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] 1. By setting the lower grinding disc, upper grinding disc, turntable and fixture in a ring at intervals on the round shell, it is possible not only to grind and polish multiple copper plates at the same time, but also to achieve double-sided synchronous grinding and polishing of copper plates, which greatly shortens the grinding cycle and significantly improves the efficiency of copper plate surface treatment.

[0024] 2. When the lower grinding disc moves down, it drives the drive mechanism to work, thereby driving the screw to rotate and causing the two clamping plates to move away from each other, thus loosening the copper plate. This makes it easier to pick up and put down the copper plate later, eliminating the need for manual rotation of the screw to loosen the clamping plates, thereby saving time and effort and improving work efficiency.

[0025] 3. With the cooperation of air pump and jet pipe, the waste chips on the lower grinding disc and copper plate can be blown off, thus cleaning the lower grinding disc and copper plate. The waste chips are discharged downward into the guide hopper through the chip discharge port. The guide hopper can collect and guide the waste chips to discharge downward to avoid the waste chips scattering everywhere, so as to facilitate the subsequent centralized recycling of waste chips. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0027] Figure 2 This is a partial three-dimensional structural schematic diagram of the present invention.

[0028] Figure 3 This is a three-dimensional structural diagram of the driving component of the present invention.

[0029] Figure 4 This is a three-dimensional structural diagram of the fixture of the present invention.

[0030] Figure 5 This is a schematic diagram of the installation of the lifting mechanism and the drive mechanism of the present invention.

[0031] Figure 6 This is a three-dimensional structural diagram of the driving mechanism of the present invention.

[0032] Figure 7 This is a schematic diagram of the installation of the air pump and jet pipe of the present invention.

[0033] Figure 8 This is a schematic diagram of the installation of the feed hopper of the present invention.

[0034] The markings in the attached diagram are as follows: 1-Support base, 2-Round shell, 21-Chip discharge port, 22-Guide hopper, 3-Electric push rod, 4-Lower grinding disc, 51-Mounting frame, 52-Cylinder, 53-Lifting plate, 54-Telescopic rod, 55-Spring 1, 6-Upper grinding disc, 7-U-shaped mounting plate, 8-Turntable, 81-Pass through, 91-Clamping plate, 92-Screw, 93-Rubber clamping plate, 101-Motor, 102-Drive gear, 103-Gear ring, 111-Guide rod, 112-L-shaped plate, 113-Spring 2, 114-Rack, 115-Columnar gear, 12-Air pump, 13-Air jet pipe, 14-Copper plate. Detailed Implementation

[0035] Please see Figures 1-4A surface treatment device for copper plates includes an L-shaped support base 1. A circular shell 2 with an open bottom is connected between two support bases 1. Four electric push rods 3 are evenly spaced along the circumference of the inner top surface of the circular shell 2. The push rods of the electric push rods 3 pass through the top of the circular shell 2 and are connected to a lower grinding disc 4 for grinding and polishing the lower surface of the copper plate 14. A lifting mechanism is provided at the top of the circular shell 2. The lifting mechanism includes a mounting frame 51 installed in the middle of the top of the circular shell 2. A cylinder 52 is mounted on the top of the mounting frame 51. A cross-shaped lifting plate 53 is connected to the piston rod of the cylinder 52. Four telescopic rods 54 are evenly spaced along the circumference at the bottom of the 53. A spring 55 is fitted onto the inner rod of each telescopic rod 54, with the two ends of the spring 55 connected to the inner and outer rods of the telescopic rod 54, respectively. Each of the four telescopic rods 54 is connected to an upper grinding disc 6 for polishing the upper surface of the copper plate 14. The four upper grinding discs 6 correspond one-to-one with the four lower grinding discs 4, with each upper grinding disc 6 located directly above its corresponding lower grinding disc 4. Four U-shaped mounting plates 7 are evenly spaced along the circumference on the outer wall of the circular shell 2. Each U-shaped mounting plate 7 has an arc-shaped groove on its upper part. Each of the arc-shaped grooves 7 has a turntable 8 slidably connected to it. Each turntable 8 has an opening 81 for accommodating a copper plate 14. Each turntable 8 is equipped with a clamp for holding the copper plate 14. The clamp includes a clamping plate 91 and a screw 92. There are grooves on both sides of the opening 81, and two clamping plates 91 are slidably connected between the two grooves. Two screws 92 are rotatably connected to the turntable 8. The two screws 92 are threadedly connected to the two clamping plates 91 respectively. A rubber clamp 93 is connected to the clamping part of the clamping plate 91. The rubber clamp 93 can increase the clamping force between the clamping plate 91 and the copper plate 14. The friction between the plates 14 ensures that the copper plate 14 is firmly clamped and also cushions and protects the copper plate 14 to avoid damage to the copper plate 14 caused by the clamping plate 91 directly and hard squeezing it. The circular shell 2 is provided with a drive assembly for driving the turntable 8 to rotate. The drive assembly includes a motor 101 installed in the middle of the circular shell 2. The motor 101 is located directly below the mounting bracket 51. The output shaft of the motor 101 is connected to a drive gear 102 located inside the mounting bracket 51. A gear ring 103 is connected to the circumferential side wall of each turntable 8. The gear ring 103 meshes with the drive gear 102.

[0036] First, the electric push rod 3 drives the lower grinding disc 4 upward, then the copper plate 14 is placed on the lower grinding disc 4, which supports the copper plate 14, positioning it between the two clamping plates 91. Next, the two screws 92 are manually rotated, bringing the two clamping plates 91 closer together and clamping the copper plate 14 onto the turntable 8. Then, the cylinder 52 drives the lifting plate 53 downward, which in turn moves the upper grinding disc 6 downward through the telescopic rod 54 to contact the copper plate 14. Once the upper grinding disc 6 contacts the copper plate 14, it can no longer move downward, causing the telescopic rod 54 to continue moving downward and compress the spring 55. The spring force of the spring 55 ensures that the upper grinding disc 6 maintains good contact with the copper plate 14, ensuring uniform pressure applied to the copper plate 14 during grinding, thus achieving efficient and uniform double-sided grinding and polishing. Then, the motor 101 drives the drive gear 102 to rotate, which in turn drives the gear ring 103 to rotate the turntable 8. The rotation of the turntable 8 drives the copper plate 14 to rotate through the clamp. When the copper plate 14 rotates, its upper and lower surfaces can be simultaneously polished by the upper polishing disc 6 and the lower polishing disc 4. After the copper plate 14 is polished, the cylinder 52 drives the lifting plate 53 to move upward, thereby causing the upper polishing disc 6 to move upward and disengage from the copper plate 14. Then, the two screws 92 are manually controlled to drive the two clamping plates 91 to move away from each other, releasing the copper plate 14. The copper plate 14 can then be removed for replacement. In this way, by setting the lower polishing disc 4, the upper polishing disc 6, the turntable 8, and the clamp in a ring at intervals on the circular shell 2, this device can not only polish multiple copper plates 14 at the same time, but also achieve double-sided synchronous polishing of the copper plate 14, which greatly shortens the polishing cycle and significantly improves the efficiency of the surface treatment of the copper plate 14.

[0037] Please see Figures 5-6 Each turntable 8 is equipped with a drive mechanism for driving the screw 92 to rotate. The drive mechanism includes two guide rods 111 symmetrically connected to the top of the turntable 8. An L-shaped plate 112 is slidably connected to each of the two guide rods 111. The L-shaped plate 112 is slidably engaged with the turntable 8. When the lower grinding disc 4 moves down, it can contact the L-shaped plate 112 and push the L-shaped plate 112 down. A second spring 113 is sleeved on the guide rod 111. The two ends of the second spring 113 are respectively connected to the upper part of the L-shaped plate 112 and the top of the turntable 8. A rack 114 is connected to the L-shaped plate 112. A spur gear 115 is connected to the screw 92 through a one-way clutch. The rack 114 can move up and down to mesh with the adjacent spur gear 115.

[0038] After the copper plate 14 is polished, the electric push rod 3 drives the lower polishing disc 4 to move down. The lower polishing disc 4 moves down and contacts the L-shaped plate 112, pushing the L-shaped plate 112 and the rack 114 down, compressing the spring 113. The rack 114 moves down and meshes with the spur gear 115, pushing the spur gear 115 to rotate, thereby driving the screw 92 to rotate. This drives the two clamping plates 91 to move away from each other and release the copper plate 14, so that the copper plate 14 can be picked up and put down later. This eliminates the need to manually rotate the screw 92 to release the clamping plates 91, thus saving time and effort and improving work efficiency. Before placing the next batch of copper plates 14, control the electric push rod 3 to drive the lower grinding disc 4 to move upward and reset. The lower grinding disc 4 moves upward and releases the L-shaped plate 112. Under the reset action of the spring 113, the L-shaped plate 112 is pushed to move upward and reset along with the rack 114. Due to the action of the one-way clutch, when the rack 114 moves upward, it drives the spur gear 115 to rotate freely, without driving the screw 92 to rotate.

[0039] Please see Figures 7-8 Each U-shaped mounting plate 7 is equipped with an air pump 12 on its outer wall. Each U-shaped mounting plate 7 is connected to a jet pipe 13 for spraying gas onto the copper plate 14. The jet pipe 13 connected to the same U-shaped mounting plate 7 is connected to the air pump 12. The top of the round shell 2 is spaced circumferentially with four sets of chip discharge ports 21. The four sets of chip discharge ports 21 correspond one-to-one with four electric push rods 3. Each set of chip discharge ports 21 has four chip discharge ports 21. The four chip discharge ports 21 in each set are arranged in a ring. The four chip discharge ports 21 in each set are arranged with their corresponding electric push rod 3 as the center. The top surface of the round shell 2 adopts a slope design with a high middle and low outer surface to guide the waste chips to the chip discharge ports 21 for downward discharge. The bottom of the round shell 2 is connected to a conical guide hopper 22.

[0040] After completing one grinding and polishing operation on the copper plate 14, the air pump 12 is activated to deliver external air into the air jet pipe 13. The air jet pipe 13 then sprays the air onto the lower grinding disc 4 and the copper plate 14, thereby blowing off the waste chips on the lower grinding disc 4 and the copper plate 14, thus cleaning the lower grinding disc 4 and the copper plate 14. The waste chips blown off from the lower grinding disc 4 and the copper plate 14 fall onto the cylindrical shell 2 and are discharged downwards into the guide hopper 22 through the chip discharge port 21. The guide hopper 22 collects and guides the waste chips to discharge them downwards, preventing them from scattering and facilitating subsequent centralized recycling.

[0041] A method for surface treatment of copper plates includes the following steps:

[0042] S1. Place the copper plate 14. First, control the electric push rod 3 to drive the lower grinding plate 4 to move upward. Then place the copper plate 14 on the lower grinding plate 4. The copper plate 14 is positioned between the two clamping plates 91 by the support of the lower grinding plate 4.

[0043] S2. Clamp the copper plate 14 and manually rotate the two screws 92 to bring the two clamping plates 91 closer together, clamping and fixing the copper plate 14 on the turntable 8.

[0044] S3. Double-sided polishing of copper plate 14: Control cylinder 52 drives lifting plate 53 to move down, thereby driving upper polishing disc 6 to move down and contact copper plate 14 through telescopic rod 54. Then control motor 101 to drive drive gear 102 to rotate. Drive gear 102 rotates and drives gear ring 103 to drive turntable 8 to rotate. Turntable 8 rotates and drives copper plate 14 to rotate through clamp, so that both its upper and lower surfaces are polished by upper polishing disc 6 and lower polishing disc 4 at the same time.

[0045] S4. Remove the copper plate 14, control the cylinder 52 to drive the lifting plate 53 to move upward, thereby driving the upper grinding disc 6 to move upward and disengage from the copper plate 14. Then manually control the two screws 92 to drive the two clamping plates 91 to move away from each other and loosen the copper plate 14. Finally, remove the copper plate 14 for replacement.

Claims

1. A surface treatment device for copper plates, characterized in that, The system includes a support base (1), and a circular shell (2) with an open bottom is connected between the two support bases (1). Electric push rods (3) are evenly spaced along the circumference of the inner top surface of the circular shell (2). The push rods of the electric push rods (3) pass through the top of the circular shell (2) and are connected to a lower grinding disc (4) for grinding and polishing the lower surface of the copper plate (14). A lifting mechanism is provided at the top of the circular shell (2), and upper grinding discs (6) arranged in a ring are connected at intervals on the lifting mechanism for grinding and polishing the upper surface of the copper plate (14). (6) corresponds one-to-one with the lower grinding disc (4). The upper grinding disc (6) is located directly above the lower grinding disc (4) corresponding to it. U-shaped mounting plates (7) are evenly spaced along the circumference on the outer wall of the round shell (2). Each U-shaped mounting plate (7) is equipped with a turntable (8). Each turntable (8) has an opening (81) for accommodating the copper plate (14). Each turntable (8) is equipped with a clamp for holding the copper plate (14). The round shell (2) is equipped with a drive assembly for driving the turntable (8) to rotate. The fixture includes two clamping plates (91) that are slidably connected in the opening (81) and two screws (92) that are rotatably connected to the turntable (8). The two screws (92) are threadedly connected to the two clamping plates (91) respectively. Each turntable (8) is provided with a drive mechanism for driving the screw (92) to rotate. The drive mechanism includes two guide rods (111) symmetrically connected to the top of the turntable (8). An L-shaped plate (112) is slidably connected to each of the two guide rods (111). The L-shaped plate (112) is slidably engaged with the turntable (8). The lower grinding disc (4) moves down to contact the L-shaped plate (112) and pushes the L-shaped plate (112) down. A spring (113) is connected between the L-shaped plate (112) and the turntable (8). A rack (114) is connected to the L-shaped plate (112). A spur gear (115) is connected to the screw (92) through a one-way clutch. The rack (114) can move up and down to mesh with the adjacent spur gear (115).

2. The copper plate surface treatment device according to claim 1, characterized in that, The lifting mechanism includes a mounting frame (51) installed in the middle of the top of the round shell (2). A cylinder (52) is installed on the top of the mounting frame (51). A lifting plate (53) is connected to the cylinder (52). Telescopic rods (54) are evenly spaced on the lifting plate (53). A spring (55) is connected between the inner rod and the outer rod of the telescopic rod (54). The upper grinding disc (6) and the telescopic rod (54) correspond one-to-one. The upper grinding disc (6) is connected to the corresponding telescopic rod (54).

3. The copper plate surface treatment device according to claim 2, characterized in that, An air pump (12) is installed on the outer wall of each U-shaped mounting plate (7), and an air jet pipe (13) for spraying gas onto the copper plate (14) is connected to the top of each U-shaped mounting plate (7). The air jet pipe (13) connected to the same U-shaped mounting plate (7) is connected to the air pump (12).

4. The copper plate surface treatment device according to claim 3, characterized in that, The top of the round shell (2) has a chip discharge port (21) for discharging waste chips.

5. The copper plate surface treatment device according to claim 4, characterized in that, The bottom of the round shell (2) is connected to a guide hopper (22) for collecting and guiding waste.

6. The copper plate surface treatment device according to claim 5, characterized in that, The drive assembly includes a motor (101) installed in the middle of the circular shell (2), a drive gear (102) connected to the output shaft of the motor (101), and a gear ring (103) connected to the circumferential sidewall of each turntable (8), which meshes with the drive gear (102).

7. The copper plate surface treatment device according to claim 6, characterized in that, A rubber clamp (93) for cushioning and protecting the copper plate (14) is connected to the clamping part of the clamping plate (91).

8. A method for surface treatment of copper plates, based on the copper plate surface treatment apparatus according to claim 7, characterized in that, Includes the following steps: S1. Place the copper plate (14). First, control the electric push rod (3) to drive the lower grinding plate (4) to move upward. Then place the copper plate (14) on the lower grinding plate (4). The copper plate (14) is positioned between the two clamping plates (91) by the support of the lower grinding plate (4). S2. Clamp the copper plate (14), manually rotate the two screws (92) to bring the two clamping plates (91) closer to each other, and clamp the copper plate (14) onto the turntable (8); S3. Double-sided polishing of copper plate (14): control cylinder (52) to drive lifting plate (53) to move down, thereby driving upper polishing disc (6) to move down and contact copper plate (14) through telescopic rod (54). Then control motor (101) to drive drive gear (102) to rotate. Drive gear (102) rotates to drive gear ring (103) to drive turntable (8) to rotate. Turntable (8) rotates through clamp to drive copper plate (14) to rotate, so that the upper and lower surfaces are polished by upper polishing disc (6) and lower polishing disc (4) at the same time. S4. Remove the copper plate (14), control the cylinder (52) to drive the lifting plate (53) to move upward, thereby driving the upper grinding disc (6) to move upward and separate from the copper plate (14). Then manually control the two screws (92) to drive the two clamping plates (91) to move away from each other and loosen the copper plate (14). Finally, remove the copper plate (14) for replacement.

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