Detection device, dressing device, and method for detecting restorer

Abstract

The invention discloses a detection device, a trimming device and a detection method of a restorer, the detection device is used for detecting a working surface of the restorer, the detection device comprises a carrier plate, a scanner and a processor, the scanner is arranged on one side of the carrier plate, the scanner comprises a scanning port, and the scanning port is located on one side, away from the carrier plate, of the scanner; the scanning port is used for scanning the working surface of the restorer and forming scanning information; the processor is connected with the scanner, reference information is stored in the processor, the processor is configured to receive the scanning information and compare the scanning information with the reference information to output a comparison result, and the comparison result is used for representing state information of the working face. The detection device provided by the invention can be used for detecting the state of the working surface of the restorer, so that the restorer can be replaced in time, and the finishing effect of the restorer is improved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and particularly relates to a detection method for a detection device, a trimming device, and a repairer. Background Art

[0002] Before the chemical mechanical polishing process, a repairer is required to trim the polishing pad. When there are defects in the repairer itself, it is likely to affect the trimming effect of the polishing pad, and thus, after the subsequent polishing of the object to be polished using the polishing pad, it is likely to result in a poor yield of the object to be polished. Summary of the Invention

[0003] The purpose of this application is to at least solve the problem of how to improve the trimming yield of the repairer. This purpose is achieved through the following technical solutions:

[0004] A first aspect of this application provides a detection device for detecting the working surface of a repairer, including:

[0005] A carrier plate;

[0006] A scanner disposed on one side of the carrier plate. The scanner includes a scanning port located on the side of the scanner facing away from the carrier plate. The scanning port is used to scan the working surface of the repairer and form scanning information.

[0007] A processor connected to the scanner. Reference information is stored in the processor. The processor is configured to receive the scanning information and compare the scanning information with the reference information to output a comparison result, and the comparison result is used to represent the status information of the working surface.

[0008] The detection device provided by this application can detect the working surface of the repairer to determine the status of the repairer, so as to facilitate timely replacement or repair of the repairer when the status of the working surface of the repairer is poor, thereby improving the yield of the polishing pad to be trimmed by the repairer, and further improving the yield of the object to be polished to be polished by the polishing pad, and reducing the probability of scratches on the object to be polished after being polished by the polishing pad.

[0009] A second aspect of this application further provides a trimming device, including any one of the detection devices provided in the first aspect of this application;

[0010] It further includes a repairer and a moving component. The repairer includes a bearing surface, and a plurality of diamonds are arranged at intervals on the bearing surface. The side of the diamond facing away from the bearing surface forms a working surface;

[0011] The moving component includes a rotating part and a lifting part. One end of the rotating part is connected to the side of the repairer away from the working surface, and the other end of the rotating part is connected to the lifting part. The moving component is used to control the relative position of the working surface of the repairer and the detection device.

[0012] The third aspect of the present application further provides a method for detecting a repairer, which is detected by using any one of the detection devices provided in the first aspect of the present application, wherein the repairer includes a working surface, and the method for detecting the repairer includes:

[0013] Scanning the working surface arranged opposite to the scanning port through the scanning port and forming scanning information;

[0014] receiving the scan information through the processor, and comparing the scan information with the reference information to output a comparison result, wherein the comparison result is used to represent the state information of the working surface;

[0015] The state information of the repairer is generated according to the comparison result. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0017] Figure 1 is a schematic structural diagram of a first detection device provided in an embodiment of the present application;

[0018] Figure 2 This is a reference diagram of the use status of the first detection device provided in the embodiment of the present application;

[0019] Figure 3 is a schematic diagram of the structure of a second detection device provided in an embodiment of the present application;

[0020] Figure 4 It is a structural schematic diagram of a repair device provided in an embodiment of the present application;

[0021] Figure 5 is a schematic diagram of the structure of another repair device provided in an embodiment of the present application;

[0022] Figure 6 is a schematic structural diagram of a third detection device provided in an embodiment of the present application;

[0023] Figure 7 is a structural schematic diagram of a fourth detection device provided in an embodiment of the present application;

[0024] Figure 8 It is a schematic structural diagram of the fifth detection device provided by an embodiment of the present application;

[0025] Figure 9 It is a schematic structural diagram of the sixth detection device provided by an embodiment of the present application;

[0026] Figure 10 It is a schematic structural diagram of a trimming device provided by an embodiment of the present application;

[0027] Figure 11 It is a reference diagram of the usage state of a trimming device provided by an embodiment of the present application;

[0028] Figure 12 It is a flowchart of a detection method for a repairer provided by an embodiment of the present application.

[0029] The reference signs are as follows:

[0030] 1. Detection device; 11. Carrier plate; 12. Scanner; 121. Scanning port; 13. Transparent cover plate; 14. Side plate; 141. Drain port; 15. Accommodating space; 16. Connection plate; 17. Cleaning module; 171. Liquid supply chamber; 1711. Liquid outlet; 172. Ultrasonic generator; 2. Trimming device; 21. Repairer; 210. Working surface; 211. Bearing surface; 212. Diamond; 221. Rotating part; 222. Lifting part; 22. Moving assembly; 3. Polishing pad; 4. Abrasive liquid; 5. Carrier. Detailed implementation manners

[0031] Hereinafter, the exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be completely conveyed to those skilled in the art.

[0032] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and thus specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless an order of performance is expressly stated. It should also be understood that additional or alternative steps may be used.

[0033] Although the terms first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly dictates otherwise, terms such as "first", "second", and other numerical terms when used herein do not imply an order or sequence. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0034] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. These relative relationship terms, such as "inner", "outer", "inside", "outside", "below", "beneath", "above", "over", etc. are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "beneath" other elements or features will then be oriented "above" or "over" the other elements or features. Thus, the example term "below" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial relative relationship descriptors used herein are to be interpreted accordingly.

[0035] Before the chemical mechanical polishing (CMP) process, it is necessary to trim the polishing pad with a dresser. Through trimming, the surface roughness of the polishing pad can be restored and its polishing performance can be improved. The polishing pad is used to transfer pressure and abrasive liquid. During the polishing process, the polishing pad contacts the surface of the object to be polished. Through rotational motion and applied pressure, the removal of materials and the flattening of the surface of the object to be polished are achieved. The dresser is installed on the trimming arm of the trimming device. Before and after the polishing pad trimming process, the dresser is cleaned with deionized water to reduce the residue of debris on the dresser, thereby reducing the adverse effects on the polishing pad. However, when there are defects in the structure of the dresser itself, it is also easy to affect the trimming effect of the polishing pad, resulting in a poor yield of the object to be polished after subsequent polishing with the polishing pad. Through research, it is found that multiple diamonds are provided on one side surface of the dresser. The defects of the dresser itself include: the diamonds of the dresser fall off, and / or, there are defects in the coating of the dresser. When the diamonds of the dresser fall off, the diamonds are easily embedded in the polishing pad or fall on the surface of the polishing pad. When there are defects in the diamond coating, it is easy to cause the aggregation of diamond particles, which is likely to cause micro-scratches during the polishing process, thus affecting the quality of the object to be polished. Therefore, the present application provides a detection device, a trimming device, and a detection method for the dresser to confirm the state of the dresser, thereby improving the yield of the polishing pad and further improving the yield of the object to be polished.

[0036] As Figure 1 and Figure 2 shown, according to an embodiment of the present application, a detection device 1 is proposed. The detection device 1 is used to detect the working surface 210 of the dresser 21. The detection device 1 includes a carrier plate 11, a scanner 12, and a processor (not shown in the figure). The scanner 12 is disposed on one side of the carrier plate 11. The scanner 12 includes a scanning port 121. The scanning port 121 is located on the side of the scanner 12 facing away from the carrier plate 11. The scanning port 121 is used to scan the working surface 210 of the dresser 21 and form scanning information. The processor is connected to the scanner 12. Reference information is stored in the processor. The processor is configured to receive the scanning information and compare the scanning information with the reference information to output a comparison result. The comparison result is used to represent the state information of the working surface 210.

[0037] The detection device 1 provided in this application is used to detect the working surface 210 of the repairer 21 to determine the state of the working surface 210, so as to facilitate the judgment of whether the repairer 21 can continue to be used. The detection device 1 includes a carrier plate 11, a scanner 12 and a processor. The carrier plate 11 is used to carry the scanner 12. The scanner 12 is arranged on one side of the carrier plate 11. The scanner 12 can be fixed to the carrier plate 11, or the scanner 12 is placed on the carrier plate 11 and not fixed to the carrier plate 11. The scanner 12 includes a scanning port 121. The scanning port 121 is located on the side of the scanner 12 facing away from the carrier plate 11. The scanning port 121 is used to scan the working surface 210 of the repairer 21 and form scanning information. The processor may not be located on the carrier plate 11. The processor is connected to the scanner 12, and the connection methods include wired connection and wireless connection. The processor stores reference information, and the reference information can be stored after the scanning information is obtained by scanning through the scanner 12 before the repairer 21 is first used. The processor is configured to receive the scanning information and compare the scanning information with the reference information to output a comparison result, and the comparison result is used to represent the state information of the working surface 210. The comparison result can be percentage information characterizing the damage degree of the working surface 210, or can be two kinds of information of needing replacement and not needing replacement. The specific form of the comparison result can be selected according to actual needs.

[0038] Specifically, the working surface 210 of the repairer 21 is the surface used to contact the polishing pad in the repairer 21. As Figure 3 shown, a plurality of diamond particles 212 are arranged at intervals on the bearing surface 211 of the repairer 21, and the side of the diamond particles 212 facing away from the bearing surface 211 forms the working surface 210. During the process of comparing the scanning information with the reference information, the comparison content may include: comparing the number of diamond particles 212 in the scanning information with the number of diamond particles 212 in the reference information to judge whether the diamond particles 212 fall off. As Figure 3 and Figure 4 shown, Figure 4The middle dotted area is the area where the diamond 212 falls off. A coating may be provided on the surface of the diamond 212 facing away from the bearing surface 211. The surface of the coating facing away from the diamond 212 forms a working surface 210. The main functions of the coating are to improve the wear resistance of the repair tool 21, reduce the friction coefficient, enhance the chemical stability, and improve the dressing efficiency. Specifically, the coating (such as diamond-like carbon DLC) has extremely high hardness, which can significantly improve the wear resistance of the diamond disk, thereby extending its service life; the coating can reduce the friction coefficient between the repair tool 21 and the polishing pad, reduce wear, and improve the dressing effect; the coating has good chemical stability and can maintain its performance in harsh environments such as strong acids and strong alkalis; the coating can improve the material removal rate (MRR) of the repair tool 21 to ensure an efficient dressing effect. In addition, the coating can also reduce the defects of the working surface 210 of the repair tool 21. Specifically, the coating can significantly reduce the wear rate of the repair tool 21 and reduce the surface defects caused by wear; the coating can reduce the detachment of the diamond 212 to ensure the stability of the dressing process. Therefore, the comparison content may further include comparing the parameter information of the coating in the scan information with the parameter information of the coating in the reference information to determine whether there are any defects in the coating. The parameter information includes the area, roughness, etc. of the coating.

[0039] The detection device 1 provided by the present application can detect the working surface 210 of the repair tool 21 to determine the state of the working surface 210 of the repair tool 21, so as to facilitate timely replacement or repair of the repair tool 21 when the state of the working surface 210 of the repair tool 21 is poor, thereby improving the yield of the polishing pad to be dressed by the repair tool 21, and further improving the yield of the object to be polished polished by the polishing pad, and reducing the probability of scratches appearing on the object to be polished after being polished by the polishing pad.

[0040] The detection device 1 provided by the present application detects the state of the repair tool 21 before the dressing process, and replaces the repair tool 21 when the state of the repair tool 21 is poor, so as to eliminate the root cause that affects the dressing result due to the poor state of the repair tool 21, thereby greatly improving the dressing yield. Compared with the repair process in the related art where the state of the repair tool 21 is not determined before dressing, the detection device 1 provided by the present application can detect the repair tool 21 before repair, thereby reducing the damage to the polishing pad and the polished product, thereby greatly saving the waste of manufacturing equipment and product materials in the product manufacturing process, and thus greatly saving the manufacturing cost.

[0041] Specifically, the object to be polished may be a wafer.

[0042] Specifically, the scan information may include image information, and the reference information may include image information.

[0043] In a feasible implementation manner, such as Figure 5As shown, the detection device 1 further includes a transparent cover plate 13 disposed opposite to the carrier plate 11. The scanner 12 is located between the carrier plate 11 and the transparent cover plate 13, and the scanning port 121 faces the transparent cover plate 13.

[0044] In the above embodiment, the transparent cover plate 13 can be a glass cover plate or an acrylic cover plate.

[0045] In the above embodiment, on the one hand, the transparent cover plate 13 is used to protect the scanner 12 to prevent the scanner 12 from contacting other components and being damaged; on the other hand, the anti-pollution of the scanner 12 can be achieved through the transparent cover plate 13 to avoid affecting the scanning quality of the scanning port 121. Moreover, the transparent cover plate 13 is flat, which is more convenient to clean than the scanner 12.

[0046] In a feasible embodiment, as Figure 5 shown, the orthographic projection of the transparent cover plate 13 on the carrier plate 11 covers the orthographic projection of the scanning port 121 on the carrier plate 11.

[0047] In the above embodiment, the orthographic projection of the transparent cover plate 13 on the carrier plate 11 covers the orthographic projection of the scanning port 121 on the carrier plate 11, so that the entire area of the scanning port 121 is within the coverage range of the transparent cover plate 13. On the one hand, a better dust-proof effect on the scanning port 121 can be achieved; on the other hand, it can be avoided that the edge of the transparent cover plate 13 is within the scanning range of the scanning window and affects the scanning quality.

[0048] In a feasible embodiment, as Figure 5 shown, the detection device 1 further includes a side plate 14. The side plate 14 is connected to the peripheral side of the carrier plate 11, and the side plate 14 is connected to the peripheral side of the transparent cover plate 13. The end of the side plate 14 away from the carrier plate 11 is flush with the side of the transparent cover plate 13 facing away from the carrier plate 11, or the end of the side plate 14 away from the carrier plate 11 is located on the side surface of the transparent cover plate 13 facing away from the carrier plate 11 and close to the side of the carrier plate 11. That is, the end of the side plate 14 away from the carrier plate 11 does not extend beyond the side surface of the transparent cover plate 13 facing away from the carrier plate 11. At this time, the side plate 14 only plays a role in supporting the carrier plate 11 and the transparent cover plate 13.

[0049] In another feasible embodiment, as Figure 6 shown, the detection device 1 further includes a side plate 14. The side plate 14 is connected to the peripheral side of the carrier plate 11, and the side plate 14 is connected to the peripheral side of the transparent cover plate 13. The end of the side plate 14 away from the carrier plate 11 and the transparent cover plate 13 enclose an accommodation space 15, and the accommodation space 15 is located on the side of the transparent cover plate 13 facing away from the carrier plate 11.

[0050] In the above embodiments, the side plate 14 can support and fix the position of the carrier plate 11 and the transparent cover plate 13, and a closed space can be enclosed among the side plate 14, the carrier plate 11 and the transparent cover plate 13, thereby further reducing the contamination of the scanner 12.

[0051] In the above embodiments, one end of the side plate 14 away from the carrier plate 11 and the transparent cover plate 13 enclose to form an accommodation space 15. The accommodation space 15 is located on the side of the transparent cover plate 13 facing away from the carrier plate 11. The accommodation space 15 can define the alignment range of the repairer 21, facilitating the alignment of the working surface 210 and the scanner 12.

[0052] In the above embodiments, the side plate 14 can be made of a light-shielding material, thereby reducing the adverse effects of external light on the scanning quality of the scanner 12.

[0053] In a feasible embodiment, as Figure 7 shown, the peripheral side of the transparent cover plate 13 is connected to the side plate 14 through a connecting plate 16.

[0054] In the above embodiments, the connecting plate 16 can be made of a light-shielding material, thereby further reducing the adverse effects of external light on the scanning quality of the scanner 12.

[0055] In the above embodiments, the connecting plate 16 and the side plate 14 can be integrally formed, thereby improving the fixing strength between the connecting plate 16 and the side plate 14.

[0056] In the above embodiments, the connecting plate 16 and the transparent cover plate 13 can be fixedly bonded or fixed by means of screw connection, etc.

[0057] In the above embodiments, by providing the connecting plate 16 to achieve the indirect connection between the side plate 14 and the transparent cover plate 13, the contact area between the connecting plate 16 and the transparent cover plate 13 can be increased, thereby reducing the connection difficulty between the transparent cover plate 13 and the side plate 14 and improving the connection strength between the connecting plate 16 and the transparent cover plate 13.

[0058] In a feasible embodiment, as Figure 8 shown, the detection device 1 further includes a cleaning module 17, and the cleaning module 17 is arranged on the side of the side plate 14 facing the accommodation space 15.

[0059] In the above-described embodiment, the detection device 1 further includes a cleaning module 17. On the one hand, the cleaning module 17 can be used to clean the transparent cover plate 13 to avoid adverse effects on the scanning quality of the scanner 12 caused by dust, polished material residues on the repair device 21, etc.; on the other hand, the cleaning module 17 can be used to clean the repair device 21 before and after the repair device 21 trims the polishing pad, so as to clean the material residues on the repair device 21 and avoid affecting the trimming effect of the polishing pad when the repair device 21 is used next time.

[0060] In the above-described embodiment, the processes of detecting and cleaning the repair device 21 can be combined into one, thereby reducing the non-working time of the repair device 21, and further improving the production efficiency. At the same time, since the cleaning module 17 is located inside the detection device 1, only one alignment between the repair device 21 and the detection device 1 is required to complete the two processes of detecting and cleaning the repair device 21, saving the alignment time and further improving the production efficiency.

[0061] In a feasible embodiment, as Figure 8 shown, the cleaning module 17 includes a liquid supply chamber 171. A liquid outlet 1711 is provided on one side of the liquid supply chamber 171 facing the center of the accommodation space 15, and a liquid discharge port 141 communicating with the accommodation space 15 is formed on the side plate 14.

[0062] In the above-described embodiment, the cleaning module includes a liquid supply chamber 171. The liquid supply chamber 171 contains a cleaning liquid. The cleaning liquid may include deionized water (DIW). The deionized water has been specially treated to remove various impurities and ions in the water and has extremely high purity. The deionized water can deeply clean the tiny gaps of the repair device 21 and thoroughly remove stains and residues. The deionized water does not contain harmful substances and will not cause corrosion and damage to the coating of the repair device 21. This helps to extend the service life of the repair device 21 and keep it in good working condition. Almost no pollutants are generated during the preparation and use of deionized water, which is more environmentally friendly. The deionized water will not leave any mineral or chemical residues during the cleaning process, so that the repair device 21 can remain in a impurity-free state after cleaning, avoiding performance degradation caused by residues. In the above-described embodiment, a liquid outlet 1711 is provided on one side of the liquid supply chamber 171 facing the center of the accommodation space 15, and a liquid discharge port 141 communicating with the accommodation space 15 is formed on the side plate 14, so that the cleaning liquid in the liquid supply chamber 171 can flow into the accommodation space 15 through the liquid outlet 1711, so as to facilitate contact with the transparent cover plate 13 and the repair device 21, thereby cleaning the two, and can be discharged through the liquid discharge port 141 after cleaning, so as to avoid affecting the scanning quality of the scanner 12.

[0063] Specifically, an automatic valve or a manual valve can be provided on the liquid discharge port 141. During the cleaning process, the valve is closed to seal the liquid discharge port 141, preventing the cleaning liquid from flowing out of the accommodation space 15. After the cleaning is completed, the valve can be opened to facilitate the outflow of the cleaning liquid from the liquid discharge port 141.

[0064] Specifically, the valve can be opened after the liquid outlet 1711 has been open for a period of time. Then, the liquid outlet 1711 is closed and the valve is opened. After the waste water formed after the cleaning liquid has cleaned the repairer 21 and the transparent cover plate 13 has been discharged completely, the valve and the liquid outlet 1711 are opened synchronously again, and the transparent cover plate 13 is rinsed again with the cleaning liquid to prevent residues.

[0065] In the above embodiment, the detection device 1 can also be provided with a drying module (not shown in the figure) to dry the accommodation space 15, especially to dry the transparent cover plate 13, which helps to further reduce the influence of the transparent cover plate 13 on the scanning quality. The drying module can be located inside the accommodation space 15 and does not block the scanning port 121.

[0066] In the above embodiment, the detection device 1 can also include a dust collection module (not shown in the figure). The dust collection module can include a suction component, which sucks the residues, debris, dust, etc. inside the accommodation space 15 by extracting the air inside the accommodation space 15, thereby maintaining the cleanliness of the accommodation space 15. The dust collection module can be located inside the accommodation space 15 and does not block the scanning port 121.

[0067] In a feasible embodiment, a pressure booster (not shown in the figure) is provided inside the liquid supply chamber 171, and the pressure booster is used to pressurize the cleaning liquid inside the liquid supply chamber 171.

[0068] In the above embodiment, by providing a pressure booster inside the liquid supply chamber 171, the liquid outlet pressure of the cleaning liquid can be increased, so as to improve the cleaning effectiveness of the cleaning liquid, and further improve the cleanliness of the repairer 21 and the transparent cover plate 13.

[0069] Specifically, an atomizer (not shown in the figure) can also be provided inside the liquid supply chamber 171, so that the cleaning liquid is ejected in a spray form from the liquid outlet 1711.

[0070] In a feasible embodiment, as Figure 9 shown, the cleaning module 17 further includes an ultrasonic generator 172, and the ultrasonic generator 172 is used to emit ultrasonic waves to the cleaning liquid inside the accommodation space 15. The ultrasonic generator 172 is provided on the side of the liquid supply chamber 171 facing the accommodation space 15, or the ultrasonic generator 172 is provided on the side of the connecting plate 16 facing away from the carrier plate 11.

[0071] In the above embodiments, the cleaning module 17 further includes an ultrasonic generator 172, which is configured to emit ultrasonic waves to the cleaning liquid in the accommodation space 15, thereby further enhancing the cleaning intensity to improve the cleanliness of the repairer 21 and the transparent cover plate 13.

[0072] The ultrasonic generator 172 can be disposed on the side of the liquid supply chamber 171 facing the accommodation space 15. The orthographic projection of the ultrasonic generator 172 on the carrier plate 11 does not overlap with the orthographic projection of the scanning port 121 on the carrier plate 11, so as to avoid the ultrasonic generator 172 blocking the scanning port 121 and affecting the scanning quality. Alternatively, the ultrasonic generator 172 is disposed on the side of the connecting plate 16 facing away from the carrier plate 11. The orthographic projection of the connecting plate 16 on the carrier plate 11 does not overlap with the orthographic projection of the scanning port 121 on the carrier plate 11, so as to avoid the ultrasonic generator 172 and the connecting plate 16 blocking the scanning port 121 and affecting the scanning quality.

[0073] The present application also provides a trimming device 2, as Figure 10 shown, including any one of the detection devices 1 provided in the above embodiments.

[0074] In the above embodiments, the trimming device 2 is used to trim the polishing pad 3. The trimming device 2 including the above detection device 1 can improve the performance of the trimming device 2, thereby improving the yield of trimming.

[0075] Specifically, wafer manufacturing includes photolithography, etching, thin film growth, diffusion, ion implantation, chemical mechanical polishing, metallization, etc. Chemical mechanical polishing (CMP) process is a surface treatment technology used in semiconductor manufacturing and other precision machining fields. It combines the dual effects of chemical etching and physical grinding. By chemical reaction, the surface of the material is softened, and then it is polished to a smooth state by mechanical grinding. During wafer manufacturing, CMP can make the surface of the wafer reach a flatter state. As Figure 11 shown, the CMP process uses a special grinding liquid 4 (slurry) and a polishing pad 3 (polishing pad). The grinding liquid 4 contains corrosive chemical substances and tiny abrasive particles, which can chemically modify and physically remove the material. During the polishing process, the object to be polished is fixed on the carrier 5. Before polishing, alignment is performed so that the object to be polished is located on the surface of the carrier 5 facing the polishing pad 3. The polishing pad 3 contacts the surface of the object to be polished (such as a wafer), and through rotational movement and the applied pressure F, material removal and surface planarization are achieved.

[0076] In addition, in the CMP process, the repairer 21 of the trimming device 2 is also used to adjust, clean or restore the polishing pad 3. That is, the repairer 21 is used to restore the surface properties of the polishing pad 3 after polishing.

[0077] Generally, the dresser 21 uses a diamond 212 disk. The diamond 212 disk includes a main body and a plurality of diamond 212s spaced apart on one surface of the main body. Specifically, the main body can be made of a metal material. Specifically, the diamond 212 disk can be formed by the following process:

[0078] The diamond 212 particles can be mixed with metal powder and then sintered at high temperature to make the diamond 212 disk. The diamond disk made by the sintering process has a long service life. Or, the diamond 212 particles can be fixed on the metal main body by electroplating. The electroplating process can provide a high bonding strength. Or, the diamond 212 particles are fixed on the main body using brazing technology, and this method can provide a high bonding strength and wear resistance. Or, the dresser 21 includes a diamond 212 coating, and the diamond 212 coating is deposited on the substrate by chemical vapor deposition (CVD) technology, and this method can provide high chemical stability and wear resistance.

[0079] The polishing pad 3 will gradually wear during use, the surface becomes smooth and a glazed layer is formed, resulting in uneven distribution of the polishing liquid and reducing the material removal rate (MRR). Therefore, dressing is required. The dressing process includes: the diamond 212 disk rotates on the surface of the polishing pad 3, and the diamond 212 on its surface removes the worn layer, deposits and glazed layer on the surface of the polishing pad 3 through mechanical cutting. During the dressing process, the diamond 212 of the diamond 212 disk can effectively cut the uneven parts on the surface of the polishing pad 3 and restore its roughness and pore structure. After dressing, the polishing pad 3 is cleaned with deionized water or other cleaning liquids to remove the residual diamond 212 particles and cutting debris on the surface. The dressed polishing pad 3 can distribute the polishing liquid more effectively, improve the material removal rate, and ensure the efficiency of the polishing process. By removing the deposits and abrasive debris layer on the surface of the polishing pad 3, the scratches and defects caused by the uneven surface of the polishing pad 3 can be reduced. Regular dressing can delay the replacement frequency of the polishing pad 3 and reduce production costs. The dressing process can improve the flatness of the surface of the polishing pad 3 and improve the polishing quality of the object to be polished (such as a wafer).

[0080] In a feasible implementation, as Figure 10 shown, the dressing device 2 further includes a dresser 21 and a moving component 22. The dresser 21 includes a bearing surface 211, and a plurality of diamond 212s are arranged at intervals on the bearing surface 211. A working surface 210 is formed on the side of the diamond 212 facing away from the bearing surface 211. The moving component 22 includes a rotating part 221 and a lifting part 222. One end of the rotating part 221 is connected to the side of the dresser 21 facing away from the working surface 210, and the other end of the rotating part 221 is connected to the lifting part 222. The moving component 22 is used to control the relative position of the working surface 210 of the dresser 21 and the detection device 1.

[0081] In the above embodiments, the moving component 22 is used to move the repairer 21 so as to change the position of the repairer 21. The moving component 22 includes a rotating part 221 and a lifting part 222. The rotating part 221 is used to change the position of the repairer 21 along a plane parallel to the first direction x, and the lifting part 222 is used to change the position of the repairer 21 along a second direction y perpendicular to the first direction x. The repairer 21 can be aligned with the detection device 1 and the polishing pad 3 under the control of the moving component 22.

[0082] The present application also provides a detection method for the repairer 21, which is detected by using any one of the detection devices 1 provided in the above embodiments. The repairer 21 includes a working surface 210. As Figure 12 shown, the detection method for the repairer 21 includes:

[0083] S200, scanning the working surface 210 opposite to the scanning port 121 through the scanning port 121 to form scanning information.

[0084] Specifically, the alignment process between the scanning port 121 and the working surface 210 can be completed by the moving component 22 in the trimming device 2. The position of the repairer 21 is moved by the moving component 22, so as to realize the alignment between the scanning port 121 and the working surface 210. The alignment process includes: moving the position of the repairer 21 by the rotating part 221, so that the repairer 21 and the scanning port 121 are oppositely arranged along the second direction y. Then, the position of the repairer 21 along the second direction y is adjusted by the lifting part 222, so that a preset distance is provided between the working surface 210 and the scanning port 121.

[0085] Specifically, when the side plate 14 on the side away from the carrier plate 11 exceeds the side of the transparent cover plate 13 away from the carrier plate 11, the position of the repairer 21 along the second direction y can be adjusted by the lifting part 222 in the moving component 22, so as to move the repairer 21 into the accommodation space 15.

[0086] Specifically, the scanning port 121 being oppositely arranged with the working surface 210 means that the scanning port 121 is parallel to the working surface 210.

[0087] S400, receiving the scanning information by the processor, and comparing the scanning information with the reference information to output a comparison result, and the comparison result is used to represent the state information of the working surface 210.

[0088] Specifically, the processor can be a computer, or a CPU in a computer host, or a mobile phone or a chip in a mobile phone, etc.

[0089] Specifically, the comparison result can be percentage information representing the damage degree of the working surface 210, or can be two kinds of information of needing to be replaced and not needing to be replaced.

[0090] The S600 generates status information of the repairer 21 according to the comparison result.

[0091] Specifically, the status information of the repairer 21 includes percentage information representing the degree of damage of the repairer 21, or may be two types of information: the need to replace the repairer 21 and the need not to replace the repairer 21.

[0092] In the above embodiment, the generated status information of the repairer 21 can be presented through a display screen, and / or presented in ways such as voice, red and green indicator lights, etc., to remind the user whether the repairer 21 needs to be replaced.

[0093] The detection method of the repairer 21 provided in this application can detect the status of the repairer 21 before and after each use of the repairer 21. Detecting the status of the repairer 21 after use can, to a certain extent, represent the trimming result of the polishing pad 3. For example, when damage to the repairer 21 is detected after the repairer 21 finishes trimming, it may be damage during the trimming process. Thus, it can be inferred that the repairer 21 caused a certain degree of poor trimming of the polishing pad 3 due to its own defect during the trimming process, so as to make a timely remedy; when no damage to the repairer 21 is detected after the repairer 21 finishes trimming, it can be inferred that the repairer 21 has a good trimming effect on the polishing pad 3. Detecting the status of the repairer 21 before use can determine whether to continue using this repairer 21 to trim the polishing pad 3. If no bad status of the repairer 21 is found after detecting the status of the repairer 21 before use, this repairer 21 can be used to repair the polishing pad 3; if a bad status of the repairer 21 is found after detecting the status of the repairer 21 before use, the repairer 21 can be replaced in time to avoid affecting the trimming yield of the polishing pad 3 by continuing to use this repairer 21 to repair the polishing pad 3. The detection method of this repairer 21 can improve the yield of the polishing pad 3, thereby improving the polishing yield of the object to be polished, reducing the damage to the object to be polished, and reducing the cost waste caused by the damage.

[0094] In the above embodiment, the detection method of the repairer 21 is convenient and can be combined with the existing cleaning process of the repairer 21, so that no new alignment process is added, greatly reducing the operation difficulty and operation time.

[0095] Before trimming the polishing pad 3, using this detection method to detect the repairer 21 can timely avoid the adverse effects on the polishing pad 3 caused by the defect of the repairer 21 itself, prevent problems before they occur, greatly reduce the cost of damage to the polishing pad 3 and the object to be polished, and thus improve the production capacity and yield.

[0096] The above are only the preferred specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A detection device for detecting the working surface of a repairer, characterized in that, Comprising: A carrier board; A scanner disposed on one side of the carrier board. The scanner includes a scanning port located on the side of the scanner facing away from the carrier board. The scanning port is configured to scan the working surface of the repair device and form scanning information; A processor connected to the scanner. Reference information is stored in the processor. The processor is configured to receive the scanning information and compare the scanning information with the reference information to output a comparison result, and the comparison result is used to represent the status information of the working surface.

2. The detection device according to claim 1, wherein, The detection device further includes a transparent cover plate disposed opposite to the carrier board. The scanner is located between the carrier board and the transparent cover plate, and the scanning port faces the transparent cover plate.

3. The detection device according to claim 2, wherein The orthographic projection of the transparent cover plate on the carrier board covers the orthographic projection of the scanning port on the carrier board.

4. The detection device according to claim 2, wherein The detection device further includes a side plate connected to the peripheral side of the carrier board and also connected to the peripheral side of the transparent cover plate. One end of the side plate away from the carrier board and the transparent cover plate enclose a receiving space, and the receiving space is located on the side of the transparent cover plate facing away from the carrier board.

5. The detection device according to claim 4, characterized in that, The peripheral side of the transparent cover plate is connected to the side plate through a connecting plate.

6. The detection device according to claim 5, wherein, The detection device further includes a cleaning module disposed on the side of the side plate facing the receiving space.

7. The detection device according to claim 6, characterized in that, The cleaning module includes a liquid supply chamber. A liquid outlet is provided on the side of the liquid supply chamber facing the center of the receiving space, and a drain port communicating with the receiving space is formed on the side plate.

8. The detection device according to claim 7, characterized in that A pressure booster is disposed in the liquid supply chamber, and the pressure booster is configured to pressurize the cleaning liquid in the liquid supply chamber.

9. The detection device according to claim 7, wherein The cleaning module further includes an ultrasonic generator configured to emit ultrasonic waves to the cleaning liquid in the receiving space. The ultrasonic generator is disposed on the side of the liquid supply chamber facing the receiving space, or the ultrasonic generator is disposed on the side of the connecting plate facing away from the carrier board.

10. A dressing device, characterized in that, Including the detection device according to any one of claims 1-9; Further including a repair device and a moving assembly. The repair device includes a bearing surface, and a plurality of diamonds are disposed at intervals on the bearing surface. A working surface is formed on the side of the diamond facing away from the bearing surface; The moving assembly includes a rotating portion and a lifting portion. One end of the rotating portion is connected to the side of the repair device facing away from the working surface, and the other end of the rotating portion is connected to the lifting portion. The moving assembly is configured to control the relative position of the working surface of the repair device and the detection device.

11. A detection method for a repair device, characterized in that, When detecting by using the detection device according to any one of claims 1-9, the repair device includes a working surface, and the detection method of the repair device includes: Scanning the working surface disposed opposite to the scanning port through the scanning port and forming scanning information; Receiving the scanning information through the processor, and comparing the scanning information with the reference information to output a comparison result, and the comparison result is used to represent the status information of the working surface; Generating the status information of the repair device according to the comparison result.

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