Bending-resistant graphene heat dissipation material applied to folding screen module

Abstract

The invention discloses a bending-resistant graphene heat dissipation material applied to a folding screen module, and relates to the technical field of graphene heat dissipation materials, and the graphene is prepared from the following raw materials in parts by weight: 3-23 parts of physical graphene, 2-12 parts of a dispersing agent, 3-23 parts of a binder, 42-72 parts of a diluent, 0.1-0.6 part of a defoaming agent, 0.5-5 parts of a silane coupling agent and 0.3-3 parts of a thickening agent. According to the graphene heat dissipation material, the horizontal heat conductivity coefficient is increased to 2300 W / (m.k), and the heat dissipation performance is better; the graphene heat dissipation material can be directly used in a die cutting manner by adopting a conventional slurry coating method, so that the process is simplified, and the cost is reduced by about 20%; meanwhile, the graphene heat dissipation material provided by the invention can reduce the use of materials with low heat-conducting property, reduce the thickness of the system and improve the bending resistance.

Description

Technical Field

[0001] The present invention relates to the technical field of graphene heat dissipation materials, and specifically to a bend-resistant graphene heat dissipation material applied to a folding screen module. Background Art

[0002] The application of traditional artificial graphite heat dissipation film materials in the field of folding screens has the following three problems: First, the in-plane thermal conductivity of the material is not high. Patent CN117565484A prepares a composite material combining a graphite-based heat dissipation material with ductile materials such as carbon fiber and basalt fiber. The in-plane thermal conductivity of the artificial graphite heat dissipation film in the X-Y axis reaches a maximum of only 2000 W / (m·K); Second, the artificial graphite heat dissipation film uses a polyimide PI film as the raw material, first carbonizes, then graphitizes, and finally obtains the graphite heat dissipation film through a calendering process. It is not bend-resistant, and powder is likely to fall off during the bending process, affecting the thermal performance. It does not meet the strong bend resistance required for folding screens, and the overall production and processing process is relatively complex and costly; Third, when the artificial graphite heat dissipation film is applied to product heat dissipation, double-sided tape needs to be coated on both sides, increasing the use of low-heat-transfer materials, which will cause a certain degree of decline in heat dissipation performance and also increase the overall thickness of the product. Therefore, a bend-resistant graphene heat dissipation material applied to a folding screen module is proposed. Summary of the Invention

[0003] Based on this, the purpose of the present invention is to provide a bend-resistant graphene heat dissipation material applied to a folding screen module to solve the technical problems of poor heat dissipation performance, not bend-resistant, complex process, and large product thickness of the traditional artificial graphene heat dissipation film material mentioned in the above background.

[0004] To achieve the above purpose, the present invention provides the following technical solution: A bend-resistant graphene heat dissipation material applied to a folding screen module, and the composition of the preparation raw materials of the graphene by weight is: 3-23 parts of physically prepared graphene, 2-12 parts of dispersant, 3-23 parts of binder, 42-72 parts of diluent, 0.1-0.6 parts of defoamer, 0.5-5 parts of silane coupling agent, and 0.3-3 parts of thickener.

[0005] As a preferred technical solution, the raw material of the graphene is a graphene material prepared by a physical method.

[0006] As a preferred technical solution, the aqueous dispersant is one or a combination of polyvinylpyrrolidone PVP K30, Disperbyk 760W, AE-NO1, and AE-NO2.

[0007] As a preferred technical solution, the binder is one or a combination of polyurethane resin, acrylic resin, and epoxy resin.

[0008] As a preferred technical solution, the diluent is one or a combination of ultrapure water, ethyl acetate, ethanol and isopropanol.

[0009] As a preferred technical solution, the defoamer is a silicone-based polymer, such as one or a combination of BYK-018, BYK-530, and Efka 2508.

[0010] As a preferred technical solution, the thickener is one or a combination of polyurethane thickeners and acrylic thickeners.

[0011] As a preferred technical solution, the silane coupling agent is one or a combination of KH550, KH560, and KRN8027.

[0012] The preparation process of a graphene heat dissipation material with bend resistance applied to a folding screen module according to any one of claims 1 to 7 includes the following steps:

[0013] Step 1: First, mix a diluent, a dispersant, a defoamer, and physically exfoliated graphene in a certain ratio, and use high-speed stirring until the slurry is uniformly dispersed (stirring parameters: rotation speed 2000 r / min, time 10 - 20 min), and then grind it with a horizontal sand mill to obtain heat dissipation slurry A (the fineness of the slurry is less than 30 μm);

[0014] Step 2: Add a binder, a thickener, and a silane coupling agent to heat dissipation slurry A according to a certain formula ratio and stir evenly at a low speed (stirring parameters: rotation speed 400 r / min, time 10 - 20 min) to obtain material B for heat dissipation of electronic products.

[0015] Step 3: Adopt the conventional slurry coating method to coat heat dissipation material B with a thickness of about 10 - 30 μm on a release film substrate with a thickness of about 10 - 30 μm, and then it can be die-cut for use.

[0016] In summary, the present invention mainly has the following beneficial effects:

[0017] The graphene heat dissipation material of the present invention has an improved in-plane thermal conductivity of 2300 W / (m·K), and better heat dissipation performance;

[0018] The graphene heat dissipation material of the present invention can be directly die-cut by using the conventional slurry coating method, which simplifies the process and reduces the cost by about 20%;

[0019] The graphene heat dissipation material of the present invention can reduce the use of materials with low thermal conductivity and reduce the thickness of the system;

[0020] The graphene heat dissipation material of the present invention has improved bend resistance. Description of the Drawings

[0021] Figure 1 This is the process flow chart for the preparation of the present invention.

[0022] Figure 2 This is the test structure diagram of the heat dissipation material. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as a limitation to the present invention.

[0024] Next, the embodiments of the present invention will be described according to the overall structure of the present invention.

[0025] Embodiment 1

[0026] A graphene heat dissipation material with bending resistance applied to a folding screen module, wherein the composition of the preparation raw materials of the graphene by weight is: 3-23 parts of physically prepared graphene, 2-12 parts of dispersant, 3-23 parts of binder, 42-72 parts of diluent, 0.1-0.6 parts of defoamer, 0.5-5 parts of silane coupling agent, and 0.3-3 parts of thickener.

[0027] The raw material of the graphene is a graphene material prepared by a physical method.

[0028] The aqueous dispersant is one of polyvinylpyrrolidone PVP K30, Disperbyk 760W, AE-NO1, and AE-NO2.

[0029] The binder is one or a combination of polyurethane resin, acrylic resin, and epoxy resin.

[0030] The diluent is one or a combination of ultrapure water, ethyl acetate, ethanol, and isopropanol.

[0031] The defoamer is an organosilicon polymer, such as one or a combination of BYK-018, BYK-530, and Efka 2508.

[0032] The thickener is one or a combination of polyurethane thickener and acrylic thickener.

[0033] The silane coupling agent is one or a combination of KH550, KH560, and KRN8027.

[0034] The preparation process of a graphene heat dissipation material with bending resistance applied to a folding screen module according to any one of claims 1 to 7 includes the following steps:

[0035] Step 1: First, mix 20 parts of graphene, 0.5 part of dispersant AE-NO1, 1 part of dispersant AE-NO2, 70 parts of isopropanol, and 0.1 part of defoamer BYK-530, and then stir at high speed until evenly dispersed (stirring parameters: rotation speed 2000 r / min, time 10 - 20 min). Then, grind with a horizontal sand mill to obtain heat dissipation slurry A (the fineness of the slurry is less than 30 μm).

[0036] Step 2: According to the ratio of 60 parts of heat dissipation slurry A, 55 parts of binder, 2 parts of thickener, and 1 part of silane coupling agent, stir evenly at low speed (stirring parameters: rotation speed 400 r / min, time 10 - 20 min) to obtain material B for heat dissipation of electronic products.

[0037] Step 3: Adopt the conventional slurry coating method to coat heat dissipation material B with a thickness of about 10 - 30 μm on a release film substrate with a thickness of about 10 - 30 μm, and then it can be die-cut for use.

[0038] Example Two

[0039] A bend-resistant graphene heat dissipation material applied to a folding screen module, and the composition of the preparation raw materials of the graphene by weight is: 3 - 23 parts of physical method graphene, 2 - 12 parts of dispersant, 3 - 23 parts of binder, 42 - 72 parts of diluent, 0.1 - 0.6 parts of defoamer, 0.5 - 5 parts of silane coupling agent, and 0.3 - 3 parts of thickener.

[0040] The raw material of the graphene is a graphene material prepared by a physical method.

[0041] The aqueous dispersant is one of polyvinylpyrrolidone PVP K30, Disperbyk 760W, AE-NO1, and AE-NO2.

[0042] The binder is one or a combination of polyurethane resin, acrylic resin, and epoxy resin.

[0043] The diluent is one or a combination of ultrapure water, ethyl acetate, ethanol, and isopropanol.

[0044] The defoamer is an organosilicon polymer, such as one or a combination of BYK-018, BYK-530, and Efka 2508.

[0045] The thickener is one or a combination of polyurethane thickener and acrylic thickener.

[0046] The silane coupling agent is one or a combination of KH550, KH560, and KRN8027.

[0047] The preparation process of a graphene heat dissipation material with bending resistance applied to a folding screen module according to any one of claims 1 to 7 includes the following steps:

[0048] Step 1: First, mix 20 parts of graphene, 0.5 part of dispersant AE-NO1, 1 part of dispersant AE-NO2, 70 parts of isopropanol, and 0.1 part of defoamer BYK-530, and stir at high speed until evenly dispersed (stirring parameters: rotation speed 2000 r / min, time 10 - 20 min), then grind with a horizontal sand mill to obtain heat dissipation slurry A (slurry fineness less than 30 μm);

[0049] Step 2: According to the ratio of 70 parts of heat dissipation slurry A, 45 parts of binder, 2 parts of thickener, and 1 part of silane coupling agent, stir evenly at low speed (stirring parameters: rotation speed 400 r / min, time 10 - 20 min) to obtain material B for heat dissipation of electronic products.

[0050] Step 3: Adopt the conventional slurry coating method to coat heat dissipation material B with a thickness of about 10 - 30 μm on a release film substrate with a thickness of about 10 - 30 μm, and then it can be die-cut for use.

[0051] Example Three

[0052] A graphene heat dissipation material with bending resistance applied to a folding screen module, the composition of the preparation raw materials of the graphene by weight is: 3 - 23 parts of physical method graphene, 2 - 12 parts of dispersant, 3 - 23 parts of binder, 42 - 72 parts of diluent, 0.1 - 0.6 part of defoamer, 0.5 - 5 parts of silane coupling agent, and 0.3 - 3 parts of thickener.

[0053] The raw material of the graphene is a graphene material prepared by a physical method.

[0054] The aqueous dispersant is one of polyvinylpyrrolidone PVP K30, Disperbyk 760W, AE-NO1, and AE-NO2.

[0055] The binder is one or a combination of polyurethane resin, acrylic resin, and epoxy resin.

[0056] The diluent is one or a combination of ultrapure water, ethyl acetate, ethanol, and isopropanol.

[0057] The defoamer is an organosilicon polymer, such as one or a combination of BYK-018, BYK-530, and Efka 2508.

[0058] The thickener is one or a combination of polyurethane thickener and acrylic thickener.

[0059] The silane coupling agent is one or a combination of more than one of KH550, KH560, and KRN8027.

[0060] The preparation process of a graphene heat dissipation material with bend resistance for use in a folding screen module according to any one of claims 1 to 7 includes the following steps:

[0061] Step 1: First, mix 20 parts of graphene, 0.5 part of dispersant AE-NO1, 1 part of dispersant AE-NO2, 70 parts of isopropanol, and 0.1 part of defoamer BYK-530, and then stir at high speed until evenly dispersed (stirring parameters: rotation speed 2000 r / min, time 10 - 20 min). Then, grind with a horizontal sand mill to obtain heat dissipation slurry A (slurry fineness less than 30 μm);

[0062] Step 2: According to the ratio of 80 parts of heat dissipation slurry A, 35 parts of binder, 2 parts of thickener, and 1 part of silane coupling agent, stir evenly at low speed (stirring parameters: rotation speed 400 r / min, time 10 - 20 min) to obtain material B for heat dissipation of electronic products.

[0063] Step 3: Adopt the conventional slurry coating method to coat heat dissipation material B with a thickness of about 10 - 30 μm on a release film substrate with a thickness of about 10 - 30 μm, and then it can be die-cut for use.

[0064] Example 4

[0065] A graphene heat dissipation material with bend resistance for use in a folding screen module, the composition of the raw materials of the graphene by weight is: 3 - 23 parts of physically prepared graphene, 2 - 12 parts of dispersant, 3 - 23 parts of binder, 42 - 72 parts of diluent, 0.1 - 0.6 part of defoamer, 0.5 - 5 parts of silane coupling agent, and 0.3 - 3 parts of thickener.

[0066] The raw material of the graphene is a graphene material prepared by a physical method.

[0067] The aqueous dispersant is one of polyvinylpyrrolidone PVP K30, Disperbyk 760W, AE-NO1, and AE-NO2.

[0068] The binder is one or a combination of more than one of polyurethane resin, acrylic resin, and epoxy resin.

[0069] The diluent is one or a combination of more than one of ultrapure water, ethyl acetate, ethanol, and isopropanol.

[0070] The defoamer is an organosilicon polymer, such as one or a combination of more than one of BYK-018, BYK-530, and Efka 2508.

[0071] The thickener is one or a combination of polyurethane thickener and acrylic thickener.

[0072] The silane coupling agent is one or a combination of KH550, KH560 and KRN8027.

[0073] The preparation process of the graphene heat dissipation material with bending resistance applied to the folding screen module according to any one of claims 1 to 7 includes the following steps:

[0074] Step 1: First, mix 20 parts of graphene, 0.5 part of dispersant AE-NO1, 1 part of dispersant AE-NO2, 70 parts of isopropanol, and 0.1 part of defoamer BYK-530, and stir at high speed until evenly dispersed (stirring parameters: rotation speed 2000 r / min, time 10 - 20 min), then grind with a horizontal sand mill to obtain heat dissipation slurry A (slurry fineness less than 30 μm);

[0075] Step 2: According to the ratio of 90 parts of heat dissipation slurry A, 25 parts of binder, 2 parts of thickener, and 1 part of silane coupling agent, stir evenly at low speed (stirring parameters: rotation speed 400 r / min, time 10 - 20 min) to obtain material B for heat dissipation of electronic products.

[0076] Step 3: Adopt the conventional slurry coating method to coat heat dissipation material B with a thickness of about 10 - 30 μm on a release film substrate with a thickness of about 10 - 30 μm, and then it can be die-cut for use.

[0077] The heat dissipation material formulations in Step 2 of Examples 1 to 4 are shown in Table 1 below:

[0078] Table 1 Heat dissipation material formulations of each example

[0079] Component Example 1 Example 2 Example 3 Example 4 Heat Dissipation Slurry A 60 parts 70 parts 80 parts 90 parts Binder 55 parts 45 parts 35 parts 25 parts Thickener 2 parts 2 parts 2 parts 2 parts Silane Coupling Agent 1 part 1 part 1 part 1 part

[0080] Comparative example: Domestic artificial graphite heat dissipation film with a thickness of 25 microns

[0081] Cut Examples 1 to 4 into rectangles of 6 cm * 22 cm and directly attach them to an aluminum plate of 6 cm * 22 cm. The specific structure is as Figure 2 shown; for the comparative example, use the existing market method to stick 10 μm double-sided tape on both sides of a 6 cm * 22 cm artificial graphite heat dissipation film and attach them to the aluminum plate respectively. In a constant temperature and humidity laboratory, attach a thermocouple to the center of the back of the aluminum plate, and record the temperatures after T1 - T4 are stable under the same heat power. T1 is the surface temperature of the thermocouple, T2 is the temperature at the center of the uppermost layer of the material after 60 min of placement, and T3 and T4 are the temperatures at the center points 1 cm away from the edges at both ends of the uppermost layer of the material after 60 min of placement. The above temperature indicators are each tested in 5 groups and the average values are taken. The results are shown in Table 2.

[0082] Table 2 Comparison of parameters and temperatures of each example and comparative example

[0083]

[0084] Table 3 Price comparison between examples and comparative examples

[0085]

[0086]

[0087] Table 4 Comparison of in-plane thermal conductivity between examples and comparative examples

[0088]

[0089] From the data in Table 2, it can be obtained that: T1 of Examples 1 to 4 is lower than that of the comparative example, and T2, T3, and T4 are lower than those of the comparative example. That is, the stable temperature of the heat source after heat dissipation of the materials in Examples 1 to 4 is low, and the temperature centers at the center and both sides of the coating material on the upper layer are on the low side. The overall heat dissipation efficiency of the systems in Examples 1 to 4 is better than that of the comparative example. Generally speaking, the heat dissipation effect of adding graphene heat dissipation material is better than that of artificial graphite sheets.

[0090] Combining Table 1, Table 2, Table 3, and Table 4, it can be concluded that the graphene heat dissipation material with bend resistance prepared in Examples 1 to 4 of the present invention has the following advantages compared with the comparative example:

[0091] 1. The in-plane thermal conductivity of the graphene heat dissipation material of the present invention is improved to 2300 W / m·K, and the heat dissipation performance is better.

[0092] 2. The graphene heat dissipation material of the present invention can be directly die-cut for use by the conventional slurry coating method, which simplifies the process and reduces the cost.

[0093] 3. The graphene heat dissipation material of the present invention can reduce the use of materials with low thermal conductivity and reduce the system thickness.

[0094] 4. The graphene heat dissipation material of the present invention has improved bend resistance.

[0095] Parts not involved in the present invention are the same as the prior art or can be implemented by the prior art.

[0096] Although embodiments of the present invention have been shown and described, the specific embodiments are merely explanations of the present invention and are not limitations thereof. The specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations that do not make a creative contribution to the embodiments as needed, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A bend-resistant graphene heat dissipation material applied to a foldable screen module, characterized in that, The raw materials for preparing the graphene are composed of 3 to 23 parts of physical graphene, 2 to 12 parts of dispersant, 3 to 23 parts of binder, 42 to 72 parts of diluent, 0.1 to 0.6 parts of defoamer, 0.5 to 5 parts of silane coupling agent and 0.3 to 3 parts of thickener in parts by weight.

2. The bend-resistant graphene heat dissipation material applied to the folding screen module according to claim 1, wherein: The raw material of the graphene is a graphene material prepared by a physical method.

3. The bend-resistant graphene heat dissipation material applied to the folding screen module according to claim 1, wherein: The aqueous dispersant is polyvinyl pyrrolidone PVP K30.

4. The bend-resistant graphene heat dissipation material applied to a folding screen module according to claim 1, wherein: The binder is polyurethane resin.

5. The bend-resistant graphene heat dissipation material applied to a folding screen module according to claim 1, characterized in that: The diluent is ultrapure water.

6. The bend-resistant graphene heat dissipation material applied to a foldable screen module according to claim 1, wherein: The defoamer is a silicone polymer, such as BYK-018.

7. The bend-resistant graphene heat dissipation material applied to the folding screen module according to claim 1, wherein: The thickener is a polyurethane thickener.

8. The bend-resistant graphene heat dissipation material applied to the folding screen module according to claim 1, wherein: The silane coupling agent is KH550.

9. The preparation process of a bend-resistant graphene heat dissipation material applied to a folding screen module according to any one of claims 1 to 7, characterized in that The steps include: Step 1: firstly mix a certain ratio of diluent, dispersant, defoamer and physical graphene, stir at high speed until the slurry is evenly dispersed (stirring parameters are: speed 2000r / min, time 10-20min), and then grind with a horizontal sand mill to obtain heat dissipation slurry A (slurry fineness is less than 30μm); Step 2: Add a binder, a thickener, and a silane coupling agent to the heat dissipation slurry A according to a certain formula ratio and stir evenly at a low speed (stirring parameters are: speed 400r / min, time 10-20min) to obtain material B for heat dissipation of electronic products. Step 3: adopt a conventional slurry coating method to coat the heat dissipation material B with a thickness of about 10 to 30 μm on a release film substrate with a thickness of about 10 to 30 μm, and then die-cut it for use.

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