Copper-clad plate etching bath liquid flow gradient distribution adjusting mechanism based on porous splitter plate

Abstract

The invention relates to the technical field of copper-clad plate etching processing, and discloses a copper-clad plate etching bath liquid flow gradient distribution adjusting mechanism based on porous splitter plates, which comprises a case with an etching bath mounted at the upper end, a plurality of splitter plates uniformly mounted on the inner wall of the etching bath from top to bottom, and a return pipe mounted on the outer wall of the case in a penetrating manner, one end of the return pipe is communicated with the bottom end of the etching tank, and the other end penetrates through the upper side of the etching tank. The copper-clad plate etching tank liquid flow gradient distribution adjusting mechanism based on the porous splitter plate can effectively solve the problems that in the prior art, traditional spraying etching equipment needs to be additionally provided with a turnover and backflow mechanism for secondary etching, the etching efficiency is influenced by tedious steps, and the etching efficiency is influenced by the complex steps in the immersion etching process of an etching tank. The problems that the gradient attenuation phenomenon exists in the liquid flow concentration of etching liquid due to the gravity effect, a local over-etching or under-etching area is easily formed due to uneven liquid flow distribution, the double-sided consistency cannot be guaranteed, and over-etching is caused by residual liquid medicine after the double-sided copper-clad plate is etched are solved.

Description

Technical Field

[0001] The invention relates to the technical field of copper-clad plate etching processing, and in particular to a liquid flow gradient distribution regulating mechanism of a copper-clad plate etching tank based on a porous diverter plate. Background Art

[0002] Copper clad laminate is the core substrate for electronic circuit manufacturing. It is composed of a composite of substrate and copper foil. It has the properties of conductivity, insulation, mechanical strength and heat resistance. It is a plate-like material with one or both sides covered with copper foil and made by hot pressing. Etching is the core link in the processing of copper clad laminate. The copper foil in the non-circuit area is removed by chemical or physical methods to form a conductive pattern.

[0003] In this regard, the present application designs a liquid flow gradient distribution adjustment mechanism for a copper-clad laminate etching tank based on a porous diverter plate. Traditional copper-clad laminate etching devices mostly adopt a single spray or etching tank etching method. Among them, when the spray etching equipment performs precision etching on the double-sided copper-clad laminate, it is necessary to additionally set up a flipping and reflux mechanism for secondary etching. The cumbersome steps affect the etching efficiency. When the etching is carried out by immersion etching in the etching tank, the liquid flow concentration of the etching solution in the etching tank due to gravity has a gradient attenuation phenomenon, and the uneven liquid flow distribution can easily form local over-etching or under-etching areas. The consistency of both sides cannot be guaranteed. After the double-sided copper-clad laminate is etched, there is a problem of excessive etching caused by residual liquid. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a liquid flow gradient distribution adjustment mechanism in a copper-clad laminate etching tank based on a porous diverter plate, which can effectively solve the problem in the prior art that, when performing precision etching on double-sided copper-clad laminates, traditional spray etching equipment needs to additionally set up a flipping and reflux mechanism for secondary etching, and the cumbersome steps affect the etching efficiency. When etching by immersion in the etching tank, the liquid flow concentration of the etching solution in the etching tank due to gravity has a gradient attenuation phenomenon, and the uneven liquid flow distribution easily forms local over-etching or under-etching areas, and the consistency of both sides cannot be guaranteed; after the double-sided copper-clad laminate is etched, there is a problem of excessive etching caused by residual liquid.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: The present invention provides a liquid flow gradient distribution regulating mechanism for a copper-clad plate etching tank based on a porous diverter plate, comprising: A chassis with an etching tank body is installed at the upper end, a plurality of guide plates are evenly installed on the inner wall of the etching tank body from top to bottom, a return pipe is installed through the outer wall of the chassis, one end of the return pipe is connected to the bottom end of the etching tank body, and the other end is installed through the upper side of the etching tank body, and the return pipe is connected to a circulation pump installed at the bottom end of the etching tank body, a supplementary pipe is installed through the chassis and the lower side of the outer wall of the etching tank body, and a conveying part and a receiving part are respectively provided on the chassis and the etching tank body; Among them, the conveying part includes material passing openings respectively arranged on the upper side of the right end and the lower side of the left end of the outer wall of the chassis, installation cavities are respectively arranged on the upper side of the left end and the lower side of the right end of the inner wall of the chassis, a plurality of communication holes evenly distributed from top to bottom are respectively arranged on the left and right ends of the inner wall of the etching tank body, and a plurality of conveying groups are jointly arranged on the chassis and the etching tank body; Among them, the guiding part includes limiting rods symmetrically installed front and back on the inner walls of the bottoms of the two installation cavities. Sliding sleeves are sleeved on the limiting rods. A support plate is installed at the bottom end of the sliding sleeve. A material receiving plate is jointly connected by a plurality of compression springs on the front and back support plates. An inclination group is jointly arranged on the sliding sleeve, the support plate and the material receiving plate.

[0006] Further, the plurality of conveying groups are evenly distributed from top to bottom. The conveying group includes a plurality of rotating shafts jointly installed through the chassis and the etching tank body. The plurality of rotating shafts are symmetrically arranged in two groups, upper and lower. Sleeve rollers are also sleeved on the outer walls of the plurality of rotating shafts through compression springs. The upper and lower rotating shafts in the upper conveying group are horizontally arranged, the upper and lower rotating shafts in the middle and lower conveying groups are arranged in slopes, and the diameters of the plurality of sleeve rollers in the upper conveying group are shorter than those of the plurality of sleeve rollers in the middle and lower conveying groups.

[0007] Further, the inclination group includes avoidance holes symmetrically arranged front and back at the upper end of the material receiving plate. Accommodating chutes are respectively arranged on the inner walls of the left and right ends of the avoidance holes. Sliding plates are slidably installed in the accommodating chutes through compression springs. The opposite ends of the left and right sliding plates are respectively hinged to the outer wall of the sliding sleeve.

[0008] Further, the inclination group also includes a mounting plate installed on the upper end of the material receiving plate near one side of the etching tank body. A counterweight pushing plate is slidably installed on the side of the upper end of the material receiving plate away from the etching tank body. Guide grooves are symmetrically arranged front and back at one end of the mounting plate away from the etching tank body. Guide rods slidably connected to the corresponding guide grooves are symmetrically installed at the front and back ends of the counterweight pushing plate facing the mounting plate. Compression springs are sleeved on the parts of the guide rods between the counterweight pushing plate and the mounting plate.

[0009] Further, the inclination group also includes a mounting chute arranged in the middle of the end of the material receiving plate away from the etching tank body. A pressing plate is slidably installed in the mounting chute through a compression spring. One end of the pressing plate away from the etching tank body is movably abutted against the inner wall of the installation cavity. A stop bar is installed on the lower side of the inner wall of the end of the installation cavity away from the etching tank body.

[0010] Further, cushion plates are jointly installed on the front and back inner walls of the etching tank body corresponding to the middle and lower conveying groups respectively. The upper and lower cushion plates are arranged in a left-right staggered manner and face in opposite directions. Jacking plates are also arranged on the left and right sides of the cushion plates. A connecting rod sliding through the corresponding diversion plate is jointly installed between the upper and lower jacking plates on the same side. Support rods sliding through the bottom end of the etching tank body are installed at the lower ends of the left and right jacking plates on the lower side.

[0011] Furthermore, water draining grooves are symmetrically formed in the front and rear at the upper end of the material receiving plate. A plurality of cleaning nozzles are evenly installed in the middle of the installation cavity on the outer wall of the etching tank body. Discharge holes are formed on the outer walls at the left and right ends of the chassis, and the left and right discharge holes are respectively communicated with the lower ends of the corresponding installation cavities.

[0012] Furthermore, a cover plate that fits actively on the inner wall of the etching tank body is fixedly sleeved at the upper end of the return pipe. A plurality of spray nozzles evenly distributed in a rectangle are installed on both the inner and outer sides of the lower end of the cover plate. The plurality of outer spray nozzles all slide through the corresponding flow guiding plates, and the plurality of spray nozzles are all communicated with the return pipe.

[0013] The technical solution provided by the present invention has the following beneficial effects compared with the prior art: The copper clad laminate etching tank liquid flow gradient distribution adjustment mechanism based on a porous flow dividing plate provided by the present invention supplements high-concentration etching liquid through a supplement pipe to compensate the concentration of the etching liquid at the bottom of the etching tank body. A plurality of flow guiding plates with gradually decreasing apertures from top to bottom are adopted. The upper flow guiding plate can realize the preliminary diffusion of the etching liquid and reduce the fluid impact force. The middle flow guiding plate can eliminate the etching liquid vortex and refine the liquid flow path. The lower flow guiding plate can realize micron-level flow control, and the liquid flow is evenly distributed. Therefore, it can avoid the problem that the liquid flow concentration in the etching tank decays in a gradient due to the gravity of the etching liquid, and can also avoid the problem of local over-etching or under-etching areas, effectively improving the consistency of double-sided etching.

[0014] During material connection, the left material receiving plate is driven by an external device to move downward along the corresponding front and rear limiting rods. During this period, the left end of the pressing plate on the left will always fit on the inner wall of the installation cavity, thus playing an auxiliary supporting role in the stability of the material receiving plate. When the left material receiving plate drives the front and rear double-sided copper clad laminates to move downward to the middle of the installation cavity, a plurality of cleaning nozzles are controlled to wash and clean the upper ends of the front and rear double-sided copper clad laminates. At this time, the purified water sprayed by some cleaning nozzles will wash into the front and rear water draining grooves and gradually fill the water draining grooves. Since the bottom surfaces of the front and rear double-sided copper clad laminates are respectively attached to the corresponding water draining grooves, and the accumulated water in the water draining grooves is in a flowing state, the effect of washing the bottom surfaces of the front and rear double-sided copper clad laminates is realized. The waste water from the washing will fall to the bottom of the installation cavity and be discharged through the discharge holes for centralized treatment, which can avoid the problem of excessive etching caused by the residual medicine after the double-sided copper clad laminate is spray-etched. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 is a schematic diagram of a three-dimensional structure in an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a three-dimensional partial cross section in an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a three-dimensional partial cross section of an etching tank body in an embodiment of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the receiving part in the embodiment of the present invention; Figure 5 It is a schematic diagram of the structure in which the receiving part is three-dimensionally separated in an embodiment of the present invention; Figure 6 It is a schematic diagram of the front cross-sectional structure of the etching tank body in an embodiment of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the backing plate and the ejector plate in the embodiment of the present invention; Figure 8 It is a schematic diagram of the structure in which the rotating shaft and the sleeve roller are three-dimensionally separated in an embodiment of the present invention; Figure 9 Schematic diagram of the three-dimensional structure of the cover plate and the shower head in an embodiment of the present invention; Figure 10 It is a schematic diagram of the working state transformation structure of the support plate and the receiving plate in an embodiment of the present invention.

[0017] The numbers in the figure represent: 1. chassis; 2. etching tank body; 21. pad; 22. push plate; 23. connecting rod; 24. support rod; 3. guide plate; 4. return pipe; 41. cover plate; 42. sprinkler head; 5. circulation pump; 6. replenishment pipe; 7. conveying part; 71. conveying group; 711. rotating shaft; 712. sleeve roller; 8. guiding part; 81. limiting rod; 82. sliding sleeve; 83. support plate; 84. receiving plate; 85. tilting group; 851. sliding plate; 852. mounting plate; 853. counterweight push plate; 854. guide rod; 855. tightening plate; 856. drain trough; 857. baffle; 858. cleaning nozzle. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] The present invention will be further described below in conjunction with the embodiments.

[0020] Embodiment:

[0021] Please refer to Figures 1 - 10 , the present invention provides a technical solution: an adjusting mechanism for the liquid flow gradient distribution of a copper clad laminate etching tank based on a porous flow dividing plate, including: A chassis 1 with an etching tank body 2 installed at the upper end. A plurality of flow guiding plates 3 are evenly installed on the inner wall of the etching tank body 2 from top to bottom. The apertures of the plurality of flow guiding plates 3 gradually become smaller from top to bottom. A return pipe 4 is installed through the outer wall of the chassis 1. The return pipe 4 is in a U-shaped structure. One end of the return pipe 4 communicates with the bottom end of the etching tank body 2, and the other end is installed through the upper side of the etching tank body 2. And a circulation pump 5 installed at the bottom end of the etching tank body 2 is communicated with the return pipe 4. A supplementary pipe 6 is installed through the chassis 1 and the etching tank body 2 together. The supplementary pipe 6 is located below the lowermost flow guiding plate 3. A conveying part 7 and a receiving part 8 are respectively provided on the chassis 1 and the etching tank body 2 together; Among them, the conveying part 7 includes material passing ports respectively opened on the upper right side and the lower left side of the outer wall of the chassis 1. Installation cavities are respectively opened on the upper left side and the lower right side of the inner wall of the chassis 1. A plurality of communication holes evenly distributed from top to bottom are respectively opened on the left and right ends of the inner wall of the etching tank body 2. The plurality of communication holes respectively communicate with the corresponding material passing ports and installation cavities. A plurality of conveying groups 71 evenly distributed from top to bottom are provided on the chassis 1 and the etching tank body 2 together; Among them, the receiving part 8 includes two front and rear limiting rods 81 respectively installed on the inner walls of the bottoms of the two installation cavities. A sliding sleeve 82 is slidably sleeved on the limiting rod 81. A support plate 83 is installed at the bottom end of the sliding sleeve 82. A receiving plate 84 is connected to the front and rear two support plates 83 together through a plurality of compression springs. An inclined group 85 is provided on the sliding sleeve 82, the support plate 83 and the receiving plate 84 together.

[0022] The plurality of conveying groups 71 are evenly distributed from top to bottom. The conveying group 71 includes a plurality of rotating shafts 711 installed through the chassis 1 and the etching tank body 2 together. The plurality of rotating shafts 711 are symmetrically arranged in two upper and lower groups. Sleeve rollers 712 are sleeved on the outer walls of the plurality of rotating shafts 711 through compression springs. The upper and lower two groups of rotating shafts 711 in the upper conveying group 71 are horizontally arranged. The upper and lower two groups of rotating shafts 711 in the middle and lower conveying groups 71 are in a slope setting. And the diameters of the plurality of sleeve rollers 712 in the upper conveying group 71 are shorter than the diameters of the plurality of sleeve rollers 712 in the middle and lower conveying groups 71. The front and rear ends of the plurality of sleeve rollers 712 in the middle and lower conveying groups 71 are closely attached to the inner wall of the etching tank body 2 through sealing rings.

[0023] The inclined group 85 includes avoidance holes symmetrically opened at the front and rear of the upper end of the receiving plate 84. Accommodation chutes are respectively opened on the inner walls of the left and right ends of the avoidance holes. Sliding plates 851 are slidably installed in the accommodation chutes through compression springs. The relative ends of the left and right two sliding plates 851 are respectively hinged to the outer wall of the sliding sleeve 82.

[0024] The tilting group 85 also includes a mounting plate 852 installed at the middle of the upper end of the receiving plate 84 close to one side of the etching tank body 2, a counterweight push plate 853 is slidably installed at the middle of the upper end of the receiving plate 84 away from the etching tank body 2, and guide grooves are symmetrically provided at one end of the mounting plate 852 away from the etching tank body 2, and guide rods 854 slidably connected to the corresponding guide grooves are symmetrically installed at one end of the counterweight push plate 853 toward the mounting plate 852, and a compression spring is sleeved on the part of the guide rod 854 located between the counterweight push plate 853 and the mounting plate 852.

[0025] The tilting group 85 also includes an installation groove opened in the middle of the end of the receiving plate 84 away from the etching trough body 2, and a clamping plate 855 is slidably installed in the installation groove through a compression spring. The end of the clamping plate 855 away from the etching trough body 2 is movably abutted against the inner wall of the installation cavity, and a baffle 857 is installed on the lower side of the inner wall of the end of the installation cavity away from the etching trough body 2.

[0026] Pads 21 are respectively installed on the inner walls at the front and rear ends of the etching trough body 2 corresponding to the middle and lower conveying groups 71. The upper and lower pads 21 are staggered left and right and face opposite directions. Push plates 22 are also arranged on the left and right sides of the pads 21. A connecting rod 23 that slides through the corresponding guide plate 3 is installed between the upper and lower push plates 22 on the same side. The lower ends of the left and right push plates 22 on the lower side are installed with support rods 24 that slide through the bottom end of the etching trough body 2.

[0027] A drainage trough 856 is symmetrically provided at the upper end of the receiving plate 84, and a plurality of cleaning nozzles 858 are evenly installed on the outer wall of the etching tank body 2 in the middle of the installation cavity. Discharge holes are provided on the outer walls at both ends of the chassis 1, and the two discharge holes on the left and right are respectively connected to the corresponding lower ends of the installation cavity.

[0028] A cover plate 41 that is movably fitted on the inner wall of the etching tank body 2 is fixedly sleeved on the upper end of the return pipe 4, and multiple rectangular and evenly distributed spray heads 42 are installed on both inner and outer sides of the lower end of the cover plate 41. The multiple outer spray heads 42 are all slidably penetrated on the corresponding guide plates 3, and the multiple spray heads 42 are all connected to the return pipe 4.

[0029] When implementing: First of all, all parts in the present application that will come into contact with the etching liquid are made of corrosion-resistant materials. The upper and lower groups of rotating shafts 711 in each conveying group 71 are set in opposite directions, and the multiple groups of rotating shafts 711 are driven and controlled by an external device to rotate synchronously. The bottom of the etching tank body 2 is initially filled with etching liquid, and high-concentration etching liquid is always replenished through the replenishing pipe 6 to compensate the concentration of the etching liquid at the bottom of the etching tank body 2, and multiple guide plates 3 with apertures gradually decreasing from top to bottom are used, among which the upper guide plate 3 can realize the initial diffusion of the etching liquid and reduce the fluid impact force. The middle guide plate 3 can eliminate the etching liquid vortex and refine the liquid flow path. The lower guide plate 3 can realize micron-level flow control, and the liquid flow is evenly distributed, thereby avoiding the gradient attenuation of the liquid flow concentration of the etching liquid in the etching tank due to gravity, and can also avoid the problem of local over-etching or under-etching areas, effectively improving the consistency of double-sided etching.

[0030] When loading, the multiple double-sided copper clad laminates to be etched are placed in turn between the upper and lower sets of rollers 712 in the feeding port on the upper right end, and driven to move uniformly to the left as a whole through the corresponding upper and lower sets of rollers 712. During this period, under the action of the compression spring, the upper and lower sets of rollers 712 will jointly exert a flexible squeezing effect on the double-sided copper clad laminates, driving the double-sided copper clad laminates to move uniformly to the left without causing damage to them. At the same time, the circulating pump 5 is controlled to extract the etching liquid from the bottom of the etching tank 2 through the reflux pipe 4. After the impurities in the etching liquid are filtered out by the external filter, the upper end of the double-sided copper clad laminates is sprayed and initially etched through the multiple spray heads 42 on the inner side of the cover plate 41, and the lower end of the double-sided copper clad laminates is sprayed and initially etched through the multiple spray heads 42 on the outer side.

[0031] During the reception, it should be noted that the left and right support plates 83 and the receiving plate 84 are initially located at the upper position in the corresponding installation cavity. The upper conveying group 71 will continue to convey the sprayed double-sided copper-clad laminate through the corresponding connecting hole to the left installation cavity, so that it stays at the upper end of the left receiving plate 84 and corresponds to the front and rear drainage grooves 856 respectively. At this time, the left ends of the front and rear double-sided copper-clad laminates are movably fitted on the counterweight push plate 853, and then the left receiving plate 84 is controlled by an external drive to move downward along the corresponding front and rear limit rods 81. The left receiving plate 84 will drive the corresponding front and rear sliding sleeves 82 and the support plate 83 to move downward synchronously. During this period, under the action of the compression spring, the left end of the left clamping plate 855 will always fit on the inner wall of the installation cavity, thereby playing an auxiliary supporting role in the stability of the receiving plate 84.

[0032] When the left material receiving plate 84 drives the front and rear double-sided copper clad laminates to move downward to the middle of the installation cavity, control multiple cleaning nozzles 858 to flush and clean the upper ends of the front and rear double-sided copper clad laminates. At this time, the purified water sprayed by some of the cleaning nozzles 858 will wash into the front and rear drain troughs 856 and gradually fill the drain troughs 856. Since the bottom end faces of the front and rear double-sided copper clad laminates are respectively attached to the corresponding drain troughs 856, and the accumulated water in the drain troughs 856 is in a flowing state, the effect of flushing the bottom end faces of the front and rear double-sided copper clad laminates is achieved. The flushing wastewater will fall to the bottom of the installation cavity and be discharged through the discharge holes for centralized treatment, which can avoid the problem of excessive etching caused by the residual etching solution on the double-sided copper clad laminate after spray etching.

[0033] During the downward movement of the left material receiving plate 84, it should be noted that the upper ends of the front and rear support plates 83 are connected to the bottom end of the material receiving plate 84 through two sets of front and rear compression springs. Under the action of the two sets of front and rear compression springs, the material receiving plate 84 always maintains a horizontal state. When the left end of the left material receiving plate 84 contacts the corresponding stop bar 857, under the blocking action of the stop bar 857, the left material receiving plate 84 will tilt towards the etching tank body 2. Multiple sliding plates 851 on the left material receiving plate 84 will respectively make adaptive sliding compensation along the corresponding receiving chutes. The left pressing plate 855 will extend out of the installation chute under the action of the compression spring, and the counterweight pushing plate 853 will, under the action of gravity, push the front and rear double-sided copper clad laminates to slide towards the installation plate 852 synchronously. At this time, the front and rear guide rods 854 will respectively insert into the corresponding guiding grooves until the front and rear double-sided copper clad laminates slide between the upper and lower roller sets 712 on the middle conveying group 71, and are jointly driven by the upper and lower two sets of roller sets 712 to move the front and rear double-sided copper clad laminates to the right at a constant speed, thus achieving the effect of feeding the upper double-sided copper clad laminate onto the middle conveying group 71.

[0034] After the front and rear double-sided copper clad laminates are completely separated from the left material receiving plate 84, the peripheral drive is used to control the left material receiving plate 84 to move upward along the corresponding front and rear limit rods 81 to return to its original position. When the left material receiving plate 84 is away from the stop bar 857, under the action of the compression spring, the left material receiving plate 84 will return to a horizontal state, and the counterweight pushing plate 853 will also slide away from the installation plate 852 under the action of the compression spring to return to its original position. At this time, the front and rear guide rods 854 will respectively make adaptive sliding compensation along the corresponding guiding grooves.

[0035] During immersion etching, when the middle conveying group 71 drives the front and rear double-sided copper-clad laminates to be conveyed to the right, it should be noted that since the apertures of the multiple guide plates 3 gradually decrease from top to bottom, etching liquid of sufficient depth will accumulate at the upper end of the middle guide plate 3, and an ultrasonic device is provided on the etching tank body 2, which can effectively increase the etching effect and avoid the problem of blockage of multiple holes on the guide plate 3. After the front and rear double-sided copper-clad laminates are conveyed to the middle horizontal section, the front and rear double-sided copper-clad laminates will be immersed in the etching liquid, thereby achieving the effect of secondary etching of the upper and lower ends of the double-sided copper-clad laminates at the same time. As the front and rear double-sided copper-clad laminates are conveyed to the right into the right installation cavity, they stay at the upper end of the right receiving plate 84 and correspond to the front and rear drainage grooves 856 respectively. At this time, the right ends of the front and rear double-sided copper-clad laminates are movably fitted on the counterweight push plate 853.

[0036] Then repeat the above-mentioned step of moving the left side receiving plate 84 downward, and control the right side receiving plate 84 to move downward along the corresponding front and rear limit rods 81 by the external drive, and the right side receiving plate 84 will drive the corresponding front and rear sliding sleeves 82 and the support plate 83 to move downward synchronously. Similarly, when the right side receiving plate 84 drives the front and rear double-sided copper-clad plates to move downward to the middle of the installation cavity, control multiple cleaning nozzles 858 to rinse and clean the upper ends of the front and rear double-sided copper-clad plates, and the right end of the right side receiving plate 84 will contact the corresponding blocking bar 857. Under the blocking effect of the blocking bar 857, the right side The receiving plate 84 will tilt toward one side of the etching tank body 2, and the multiple sliding plates 851 on the right side of the receiving plate 84 will perform adaptive sliding compensation along the corresponding accommodating slide grooves respectively. The right side clamping plate 855 will extend out of the installation slide groove under the action of the compression spring, and the counterweight push plate 853 will push the front and rear double-sided copper clad plates to slide synchronously toward the installation plate 852 under the action of gravity, until the front and rear double-sided copper clad plates slide respectively between the upper and lower rollers 712 on the lower conveying group 71, and the upper and lower rollers 712 jointly drive the front and rear double-sided copper clad plates to move to the left at a uniform speed.

[0037] When the lower conveying group 71 drives the front and rear double-sided copper clad laminates to be conveyed to the left, it should be noted that the bottom liquid in the etching tank 2 will also accumulate etching liquid of sufficient depth. After the front and rear double-sided copper clad laminates are conveyed to the middle horizontal section, the front and rear double-sided copper clad laminates will be immersed in the etching liquid, thereby achieving the effect of simultaneously performing the final etching on the upper and lower ends of the double-sided copper clad laminates. Through the cooperation of the conveying part 7 and the receiving part 8, multiple double-sided copper clad laminates can be continuously subjected to spray etching, secondary immersion etching and final immersion etching. While ensuring the etching efficiency, the etching accuracy can be significantly improved. As the front and rear double-sided copper clad laminates are conveyed to the left, they will be sent out from the left material port for final cleaning and anti-oxidation treatment.

[0038] It should also be noted that when the middle and lower conveying group 71 drives the front and rear double-sided copper clad laminates to be conveyed to one side, first, it is conveyed downward along the slope section formed by the upper and lower sets of sleeve rollers 712, then conveyed to one side along the horizontal section formed by the upper and lower sets of sleeve rollers 712, and finally conveyed upward along the slope section formed by the upper and lower sets of sleeve rollers 712. The upper and lower sleeve rollers 712 on the left and right sides in the middle and lower conveying group 71, which are located in the communication holes, should have a spacing from the adjacent upper and lower sets of sleeve rollers 712 to meet the avoidance control when the double-sided copper clad laminate is conveyed from the slope section to the communication hole. At the same time, combined with the elastic compensation between the upper and lower sets of sleeve rollers 712 and the strength of the double-sided copper clad laminate itself, it is sufficient to enable the double-sided copper clad laminate to be smoothly conveyed from the slope section to the communication hole and transform into a horizontal state.

[0039] In addition, whenever the front and rear double-sided copper clad laminates are transferred from the slope section to the horizontal section, or from the horizontal section to the slope section, to ensure smooth turning of the double-sided copper clad laminate, the left and right support rods 24 driven by an external device can be controlled to drive the corresponding jacking plates 22 to move upward. The left and right lower jacking plates 22 will respectively drive the corresponding upper jacking plates 22 to move upward synchronously through the connecting rods 23, so as to assist in lifting one end of the double-sided copper clad laminate being conveyed for turning. Moreover, the function of the upper and lower cushion plates 21 is that when the double-sided copper clad laminate passes through the corresponding cushion plate 21 and is about to turn, the cushion plate 21 can support the lower end of the double-sided copper clad laminate with a lower turning angle, avoiding the problem of it slipping downward between two adjacent sleeve rollers 712 due to lack of support. In addition, when the double-sided copper clad laminate is conveyed by the upper and lower sets of sleeve rollers 712, when the double-sided copper clad laminate is immersed in the etching solution, the problem of the double-sided copper clad laminate shifting in position due to buoyancy can be avoided, ensuring the stability of conveying.

[0040] In summary, the present application has the following advantages: Advantage 1: By the supplementary pipe 6 to supplement the high-concentration etching solution, the concentration of the etching solution at the bottom of the etching tank body 2 is compensated. And multiple flow guiding plates 3 with gradually decreasing pore diameters from top to bottom are adopted. The upper flow guiding plate 3 can realize the preliminary diffusion of the etching solution, reducing the fluid impact force. The middle flow guiding plate 3 can eliminate the etching solution vortex and refine the liquid flow path. The lower flow guiding plate 3 can realize micron-level flow control, with uniform liquid flow distribution. Thus, it can avoid the phenomenon of gradient attenuation of the liquid flow concentration caused by the gravity of the etching solution in the etching tank, and can also avoid the problem of local over-etching or under-etching areas, effectively improving the consistency of double-sided etching.

[0041] Advantage 2: When loading, the upper and lower sets of rollers 712 will jointly exert a flexible squeezing effect on the double-sided copper clad laminate, driving the double-sided copper clad laminate to move to the left at a uniform speed without causing damage to it. At the same time, the circulating pump 5 is controlled to extract the etching liquid at the bottom of the etching tank 2 through the reflux pipe 4. After the impurities in the etching liquid are filtered out by the external filter, the upper end of the double-sided copper clad laminate is sprayed and initially etched through the multiple spray heads 42 on the inner side of the cover plate 41, and the lower end of the double-sided copper clad laminate is sprayed and initially etched through the multiple spray heads 42 on the outer side.

[0042] Advantage three, during the reception, the left side receiving plate 84 is controlled by an external drive to move downward along the corresponding front and rear limit rods 81. During this period, the left end of the left side clamping plate 855 will always be in contact with the inner wall of the installation cavity, thereby playing an auxiliary supporting role in the stability of the receiving plate 84. When the left side receiving plate 84 drives the front and rear double-sided copper-clad plates to move downward to the middle of the installation cavity, multiple cleaning nozzles 858 are controlled to rinse and clean the upper ends of the front and rear double-sided copper-clad plates. At this time, the clean water sprayed by some cleaning nozzles 858 will be flushed into the front and rear drain grooves 856 and gradually fill up the drain grooves 856. Since the bottom end surfaces of the front and rear double-sided copper-clad plates are respectively in contact with the corresponding drain grooves 856, the accumulated water in the drain grooves 856 is in a flowing state, thereby achieving the effect of flushing the bottom end surfaces of the front and rear double-sided copper-clad plates. The flushing waste water will fall into the bottom of the installation cavity and be discharged from the discharge hole for centralized treatment, which can avoid the problem of residual liquid after spray etching of the double-sided copper-clad plates, resulting in excessive etching.

[0043] Advantage four, during the downward movement of the left-side receiving plate 84, under the blocking action of the baffle 857, the left-side receiving plate 84 will tilt toward the side of the etching tank body 2, and the counterweight push plate 853 will, under the action of gravity, push the front and rear double-sided copper-clad laminates to slide synchronously toward the mounting plate 852 until the front and rear double-sided copper-clad laminates slide respectively between the upper and lower sets of rollers 712 on the middle conveying group 71, and the upper and lower sets of rollers 712 jointly drive the front and rear double-sided copper-clad laminates to move at a uniform speed to the right, thereby achieving the effect of sending the upper double-sided copper-clad laminate to the middle conveying group 71.

[0044] Advantage five, during immersion etching, since the apertures of multiple guide plates 3 gradually decrease from top to bottom, etching liquid of sufficient depth will accumulate on the upper end of the middle guide plate 3, and an ultrasonic auxiliary device is provided on the etching tank body 2, which can effectively increase the etching effect and avoid the problem of blockage of multiple holes on the guide plate 3. When the front and rear double-sided copper clad laminates are transported to the middle horizontal section, the front and rear double-sided copper clad laminates will be immersed in the etching liquid, thereby achieving the effect of secondary etching of the upper and lower ends of the double-sided copper clad laminates at the same time.

[0045] Advantage six, when the lower conveying group 71 drives the front and rear double-sided copper clad laminates to be conveyed to the left, when the front and rear double-sided copper clad laminates are conveyed to the middle horizontal section, the front and rear double-sided copper clad laminates will be immersed in the etching liquid, thereby achieving the effect of simultaneously performing the final etching on the upper and lower ends of the double-sided copper clad laminates. Through the cooperation of the conveying part 7 and the receiving part 8, multiple double-sided copper clad laminates can be continuously subjected to spray etching, secondary immersion etching and final immersion etching, which ensures the etching efficiency and significantly improves the etching accuracy.

[0046] Advantage seven, whenever the front and rear double-sided copper clad laminates are transferred from the slope section to the horizontal section, or from the horizontal section to the slope section, in order to ensure smooth turning of the double-sided copper clad laminates, the left and right support rods 24 can be controlled by an external drive to drive the corresponding push plates 22 to move upward, and the lower left and right push plates 22 will respectively drive the corresponding upper push plates 22 to move upward synchronously through the connecting rods 23, thereby assisting in lifting up one end of the double-sided copper clad laminate that is being turned and transported, and the role of the upper and lower pads 21 is that when the double-sided copper clad laminate passes through the corresponding pad 21 and is about to turn, the pad 21 can support the lower end of the double-sided copper clad laminate to avoid the problem of sliding downward between the two adjacent rollers 712 due to lack of support. In addition, the upper and lower sets of rollers 712 are used to transport the double-sided copper clad laminate. When the double-sided copper clad laminate is immersed in the etching solution, the problem of position displacement of the double-sided copper clad laminate due to buoyancy can be avoided, thereby ensuring the stability of transportation.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A regulating mechanism for the etching bath liquid flow gradient distribution of a copper clad laminate based on a porous flow dividing plate, characterized in that, Including: A chassis (1) with an etching tank body (2) installed at the upper end. A plurality of flow guiding plates (3) are evenly installed on the inner wall of the etching tank body (2) from top to bottom. A reflux pipe (4) is installed through the outer wall of the chassis (1). One end of the reflux pipe (4) is communicated with the bottom end of the etching tank body (2), and the other end is installed through the upper side of the etching tank body (2). And a circulation pump (5) installed at the bottom end of the etching tank body (2) is communicated with the reflux pipe (4). A supplementary pipe (6) is installed through the lower sides of the outer walls of the chassis (1) and the etching tank body (2). A conveying part (7) and a receiving part (8) are respectively and jointly arranged on the chassis (1) and the etching tank body (2). Among them, the conveying part (7) includes material passing openings respectively opened on the upper side of the right end and the lower side of the left end of the outer wall of the chassis (1). Installation cavities are respectively opened on the upper side of the left end and the lower side of the right end of the inner wall of the chassis (1). A plurality of communication holes evenly distributed from top to bottom are respectively opened at the left and right ends of the inner wall of the etching tank body (2). A plurality of conveying groups (71) are jointly arranged on the chassis (1) and the etching tank body (2). Among them, the receiving part (8) includes limiting rods (81) symmetrically installed before and after on the inner walls of the bottoms of the two installation cavities. A sliding sleeve (82) is slidably sleeved on the limiting rod (81). A support plate (83) is installed at the bottom end of the sliding sleeve (82). A receiving plate (84) is connected by a plurality of compression springs on the front and rear support plates (83). An inclined group (85) is jointly arranged on the sliding sleeve (82), the support plate (83) and the receiving plate (84).

2. The flow gradient distribution adjusting mechanism of the copper clad laminate etching tank solution based on the porous flow dividing plate according to claim 1, characterized in that: The plurality of conveying groups (71) are evenly distributed from top to bottom. The conveying group (71) includes a plurality of rotating shafts (711) jointly installed through the chassis (1) and the etching tank body (2). The plurality of rotating shafts (711) are symmetrically arranged in two groups, upper and lower. Sleeve rollers (712) are also sleeved on the outer walls of the plurality of rotating shafts (711) through compression springs. The upper and lower rotating shafts (711) in the upper conveying group (71) are horizontally arranged. The upper and lower rotating shafts (711) in the middle and lower conveying groups (71) are arranged in a slope. And the diameters of the plurality of sleeve rollers (712) in the upper conveying group (71) are shorter than the diameters of the plurality of sleeve rollers (712) in the middle and lower conveying groups (71).

3. The flow gradient distribution adjusting mechanism of the copper clad laminate etching tank solution based on the porous flow dividing plate according to claim 1, wherein: The inclined group (85) includes avoidance holes symmetrically opened at the front and rear of the upper end of the receiving plate (84). Accommodation chutes are respectively opened on the inner walls of the left and right ends of the avoidance holes. A sliding plate (851) is slidably installed in the accommodation chute through a compression spring. The opposite ends of the left and right sliding plates (851) are respectively hinged to the outer wall of the sliding sleeve (82).

4. The flow gradient distribution adjusting mechanism of the copper clad laminate etching tank solution based on the porous flow dividing plate according to claim 3, wherein: The inclined group (85) further includes a mounting plate (852) installed at the middle of the upper end of the material receiving plate (84) near one side of the etching tank body (2). A counterweight push plate (853) is slidably installed on the side of the middle of the upper end of the material receiving plate (84) far from the etching tank body (2). Guide grooves are symmetrically formed at the front and rear ends of the end of the mounting plate (852) far from the etching tank body (2). Symmetrically installed at the front and rear ends of the end of the counterweight push plate (853) facing the mounting plate (852) are guide rods (854) slidably connected to the corresponding guide grooves. A compression spring is sleeved on the part of the guide rod (854) located between the counterweight push plate (853) and the mounting plate (852).

5. The regulating mechanism for the flow gradient distribution of the etchant solution in the copper clad laminate etching tank based on the porous flow dividing plate according to claim 4, characterized in that: The inclined group (85) further includes a mounting chute formed at the middle of the end of the material receiving plate (84) far from the etching tank body (2). A pressing plate (855) is slidably installed in the mounting chute through a compression spring. The end of the pressing plate (855) far from the etching tank body (2) is movably abutted against the inner wall of the mounting cavity. A stop bar (857) is installed on the lower side of the inner wall of the end of the mounting cavity far from the etching tank body (2).

6. The regulating mechanism for the etching bath fluid flow gradient distribution of a copper clad laminate based on a porous flow dividing plate according to claim 5, characterized in that: Pads (21) are commonly installed on the inner walls of the front and rear ends of the etching tank body (2) corresponding to the middle and lower conveying groups (71) respectively. The upper and lower pads (21) are arranged in a left-right staggered manner and face in opposite directions. Jacking plates (22) are further arranged on the left and right sides of the pads (21). A connecting rod (23) that slidably penetrates through the corresponding flow guiding plate (3) is commonly installed between the upper and lower jacking plates (22) on the same side. Support rods (24) that slidably penetrate through the bottom end of the etching tank body (2) are installed at the lower ends of the left and right jacking plates (22) on the lower side.

7. An adjusting mechanism for the flow gradient distribution of the etchant solution in a copper clad laminate etching tank based on a porous flow dividing plate according to claim 5, characterized in that: Drainage grooves (856) are symmetrically formed at the front and rear ends of the upper end of the material receiving plate (84). A plurality of cleaning nozzles (858) are evenly installed on the outer wall of the etching tank body (2) at the middle of the mounting cavity. Drainage holes are formed on the outer walls of the left and right ends of the chassis (1), and the left and right drainage holes are respectively communicated with the lower ends of the corresponding mounting cavities.

8. An adjusting mechanism for regulating the liquid flow gradient distribution of the copper clad laminate etching tank based on a porous flow distribution plate according to claim 1, characterized in that: A cover plate (41) that is movably attached to the inner wall of the etching tank body (2) is fixedly sleeved on the upper end of the return pipe (4). A plurality of spray nozzles (42) evenly distributed in a rectangular shape are installed on the inner and outer sides of the lower end of the cover plate (41). The outer spray nozzles (42) all slidably penetrate through the corresponding flow guiding plates (3), and the plurality of spray nozzles (42) are all communicated with the return pipe (4).

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