Semiconductor temperature control system

Abstract

The invention relates to a semiconductor temperature control system which comprises a cabinet body, a refrigerating system and a cooling liquid circulating system, wherein the refrigerating system and the cooling liquid circulating system are arranged in the cabinet body; the refrigerating system comprises a first refrigerant circulating device and a second refrigerant circulating device; the first refrigerant circulating device comprises a first compressor, a condenser, a liquid storage tank, a dryer, a first electronic expansion valve and a first evaporator; the second refrigerant circulating device comprises a second compressor, an oil separator, a filter, a second electronic expansion valve and a second evaporator; an oil outlet of the oil separator is communicated to an air suction port of the second compressor; the cooling liquid circulating system is provided with a cooling liquid inlet and a cooling liquid outlet which are used for being in butt joint with external load equipment, and the cooling liquid circulating system comprises a circulating pump and a heating device. According to the semiconductor temperature control system, a better refrigeration effect can be achieved, the influence of the environment temperature on the refrigeration effect is reduced, and the load capacity and the control precision are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid temperature control systems, and particularly to a semiconductor temperature control system. Background Art

[0002] In some technical fields such as semiconductor manufacturing testing and packaging equipment, in order to meet the process requirements, some test items need to be carried out under temperature conditions of -60°C or even lower. Therefore, this also requires the use of a coolant with a lower temperature to provide normal operation under this temperature condition. Currently, the equipment for temperature control of the coolant on the market only has one refrigerant circulation loop, that is, after the refrigerant releases heat through the condenser, it enters the evaporator to absorb heat and releases heat to the coolant in the heat release path of the evaporator for cooling. And the condensers are basically air-cooled condensers. When the ambient temperature is too high, the condenser cannot cool the refrigerant in it well, which will lead to insufficient temperature control effect at the evaporation end. Thus, it can be seen that the ambient temperature has a greater impact on the equipment.

[0003] Based on this, it is necessary to design a temperature control device with more efficient temperature control to reduce the influence of the ambient temperature on the refrigerant, so that the refrigerant for heat exchange with the coolant can reach a lower temperature. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to overcome the deficiencies of the prior art and provide a semiconductor temperature control system.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0006] A semiconductor temperature control system, which includes: a cabinet body and a temperature control system and a coolant circulation system arranged in the cabinet body;

[0007] The temperature control system includes a first refrigerant circulation device and a second refrigerant circulation device;

[0008] The first refrigerant circulation device includes a first compressor, a condenser, a liquid storage tank, a dryer, a first electronic expansion valve, and a first evaporator. The exhaust port of the first compressor, the condenser, the liquid storage tank, the dryer, the first electronic expansion valve, the heat absorption path of the first evaporator, and the suction port of the first compressor are sequentially connected to form a first refrigeration circuit;

[0009] The second refrigerant circulation device includes a second compressor, an oil separator, a filter, a second electronic expansion valve, and a second evaporator. The exhaust port of the second compressor, the oil separator, the heat release path of the first evaporator, the filter, the second electronic expansion valve, the heat absorption path of the second evaporator, and the suction port of the second compressor are sequentially connected to form a second refrigeration circuit. The oil outlet of the oil separator is connected to the suction port of the second compressor;

[0010] The coolant circulation system has a coolant inlet and a coolant outlet for docking with an external load device. The coolant circulation system includes a circulation pump and a heating device. The coolant inlet is connected to the coolant outlet after passing through the circulation pump, the heat release path of the second evaporator, and the heating device in sequence.

[0011] In the semiconductor temperature control system of the present application, the first refrigerant circulation device and the second refrigerant circulation device form a two-stage refrigeration system. The first refrigerant in the first refrigeration circuit can fully absorb the heat of the second refrigerant in the second refrigeration circuit to obtain a second refrigerant with a lower temperature, so that the second refrigerant can absorb more heat of the coolant in the heat absorption path of the second evaporator, greatly improving the refrigeration effect on the coolant. Compared with the prior art, the present application adopts two refrigeration circuits, which can achieve a better refrigeration effect, reduce the influence of the ambient temperature on the refrigeration effect, improve the load capacity and control accuracy, and at the same time meet the cooling requirements of various coolants with different temperatures. And the semiconductor temperature control system of the present application can reduce the complexity of the equipment, reduce the size of the equipment, expand the scope of use, improve the use efficiency of the temperature control system, and meet wider needs.

[0012] As an implementation manner, the coolant circulation system further includes a liquid expansion tank. The liquid inlet end of the liquid expansion tank is connected to the coolant inlet, and the liquid expansion tank has a first liquid discharge port.

[0013] As an implementation manner, the second refrigerant circulation device further includes a gas expansion tank. The inlet end of the gas expansion tank is connected to the pipeline between the oil separator and the heat release path of the first evaporator.

[0014] As an implementation manner, a solenoid valve is provided at the inlet end of the gas expansion tank.

[0015] As an implementation manner, the first refrigerant circulation device further includes a first sight glass, and the first sight glass is arranged on the pipeline between the liquid storage tank and the dryer.

[0016] As an implementation manner, the second refrigerant circulation device further includes a second sight glass, and the second sight glass is arranged on the pipeline between the oil outlet of the oil separator and the suction port of the second compressor.

[0017] As an implementation manner, a second liquid discharge port is provided on the heating device, and a third liquid discharge port is provided on the circulation pump.

[0018] As an implementation manner, the semiconductor temperature control system further includes a main control board and a temperature sensor. The first electronic expansion valve, the second electronic expansion valve and the temperature sensor are electrically connected to the main control board. The temperature sensor is arranged at the coolant inlet, and is used to obtain the liquid temperature at the coolant inlet and output the current temperature data to the main control board. The main control board compares the current temperature data with the preset temperature data to adjust the opening degrees of the first electronic expansion valve and the second electronic expansion valve.

[0019] As an implementation manner, a heat dissipation hole plate is arranged on the side wall of the cabinet body. The condenser is arranged inside the heat dissipation hole plate, and a plurality of heat dissipation fans are arranged inside the cabinet body to dissipate heat from the condenser.

[0020] As an implementation manner, a plurality of pulleys are arranged at the bottom of the cabinet body.

[0021] For better understanding and implementation, the present invention will be described in detail below with reference to the accompanying drawings. Description of the Drawings

[0022] Figure 1 It is a schematic structural diagram of the semiconductor temperature control system in the embodiment of the present application;

[0023] Figure 2 It is a schematic internal structure diagram of the semiconductor temperature control system in the embodiment of the present application;

[0024] Figure 3 It is a schematic connection diagram of the semiconductor temperature control system in the embodiment of the present application;

[0025] Description of the Reference Numerals:

[0026] 1. Cabinet body; 11. Heat dissipation hole plate; 12. Heat dissipation fan; 13. Pulley; 21. First compressor; 22. Condenser; 23. Liquid storage tank; 24. Dryer; 25. First electronic expansion valve; 26. First evaporator; a. Heat absorption path; b. Heat release path; 27. First liquid sight glass; 31. Second compressor; 32. Oil separator; 33. Filter; 34. Second electronic expansion valve; 35. Second evaporator; 36. Gas expansion tank; 37. Solenoid valve; 38. Second liquid sight glass; 41. Coolant inlet; 42. Coolant outlet; 43. Circulation pump; 431. Third liquid discharge port; 44. Heating device; 441. Second liquid discharge port; 45. Liquid expansion tank; 451. First liquid discharge port. Specific Embodiments

[0027] To further illustrate the embodiments, the present invention provides accompanying drawings. These drawings are part of the disclosure of the present invention, mainly used to illustrate the embodiments, and can be combined with the relevant descriptions in the specification to explain the operating principle of the embodiments. With reference to these contents, those of ordinary skill in the art should be able to understand other possible embodiments and the advantages of the present invention.

[0028] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present invention.

[0029] Please refer to Figures 1 to 3 , this embodiment provides a semiconductor temperature control system, which includes: a cabinet 1 and a temperature control system and a coolant circulation system arranged in the cabinet 1.

[0030] The temperature control system includes a first refrigerant circulation device and a second refrigerant circulation device. The first refrigerant circulation device includes a first compressor 21, a condenser 22, a liquid storage tank 23, a dryer 24, a first electronic expansion valve 25, and a first evaporator 26. The second refrigerant circulation device includes a second compressor 31, an oil separator 32, a filter 33, a second electronic expansion valve 34, and a second evaporator 35. Among them, both the first evaporator 26 and the second evaporator 35 have a heat absorption passage a and a heat release passage b.

[0031] The exhaust port of the first compressor 21, the condenser 22, the liquid storage tank 23, the dryer 24, the first electronic expansion valve 25, the heat absorption passage a of the first evaporator 26, and the suction port of the first compressor 21 are sequentially connected to form a first refrigeration circuit, and there is a first refrigerant in the first refrigeration circuit.

[0032] The exhaust port of the second compressor 31, the oil separator 32, the heat release passage b of the first evaporator 26, the filter 33, the second electronic expansion valve 34, the heat absorption passage a of the second evaporator 35, and the suction port of the second compressor 31 are sequentially connected to form a second refrigeration circuit, and the oil outlet of the oil separator 32 is connected to the suction port of the second compressor 31. There is a second refrigerant in the second refrigeration circuit.

[0033] The coolant circulation system has a coolant inlet 41 and a coolant outlet 42 for docking with an external load device. The coolant circulation system includes a circulation pump 43 and a heating device 44. The coolant inlet 41 is connected to the coolant outlet 42 after passing through the circulation pump 43, the heat release path b of the second evaporator 35, and the heating device 44 in sequence. The coolant of an external load device (such as a semiconductor testing and packaging device, etc.) can enter through the coolant inlet 41, pass through the circulation pump 43, the heat release path b of the second evaporator 35, and the heating device 44 in sequence, and then flow to the coolant outlet 42 and return to the load device again.

[0034] As can be seen from the above solution, in the first refrigeration circuit, after being compressed by the first compressor 21, the medium-high temperature first refrigerant enters the condenser 22 to condense and release heat, and then can exchange heat with the second refrigerant in the heat release path b of the first evaporator 26 in the heat absorption path a of the first evaporator 26, evaporate after fully absorbing the heat of the second refrigerant, and return to the first compressor 21 to continue the next refrigeration cycle after evaporation. In the second refrigeration circuit, the heat release path b of the first evaporator 26 functions as a condenser 22. The medium-high temperature second refrigerant after being compressed by the second compressor 31 enters the heat release path b of the first evaporator 26 to condense and release heat, and then can exchange heat with the coolant in the heat release path b of the second evaporator 35 in the heat absorption path a of the second evaporator 35, evaporate after fully absorbing the heat of the coolant, and return to the second compressor 31 to continue the next refrigeration cycle after evaporation. When the coolant passes through the heat release path b of the second evaporation, it can exchange heat with the low-temperature second refrigerant to reduce the temperature.

[0035] In the semiconductor temperature control system of the present application, the first refrigerant circulation device and the second refrigerant circulation device form a two-stage refrigeration system. The first refrigerant in the first refrigeration circuit can fully absorb the heat of the second refrigerant in the second refrigeration circuit to obtain a second refrigerant with a lower temperature, so that the second refrigerant can absorb more heat of the coolant in the heat absorption path a of the second evaporator 35, greatly improving the refrigeration effect on the coolant. Compared with the prior art, the present application adopts two refrigeration circuits, which can achieve a better refrigeration effect, reduce the influence of the ambient temperature on the refrigeration effect, improve the load capacity and control accuracy, and at the same time meet the cooling requirements of various coolants with different temperatures. And the semiconductor temperature control system of the present application can reduce the complexity of the equipment, reduce the equipment size, expand the use range, improve the use efficiency of the refrigeration system, and meet more extensive requirements.

[0036] Among them, in the first refrigerant circulation device, the liquid storage tank 23 can effectively store the high-pressure liquid from the condenser 22, reduce the burden on the condenser 22, ensure its continuous and efficient operation. The main functions of the dryer 24 include filtering impurities, absorbing moisture, preventing ice blockage and dirt blockage, so as to ensure the normal operation of the refrigeration system and extend its service life. In the second refrigerant circulation device, the main function of the oil separator 32 is to separate the lubricating oil ejected by the compressor from the refrigerant vapor, prevent the lubricating oil from entering the first evaporator 26 and the second evaporator 35, thus avoiding the formation of an oil film on the heat transfer wall surface, affecting the heat transfer effect and reducing the refrigeration efficiency. The main functions of the filter 33 include filtering impurities and absorbing moisture.

[0037] In the coolant circulation system, the water pump is used to drive the coolant to circulate, suck it in from the coolant inlet 41, and smoothly discharge it from the coolant outlet 42, thus completing the heat exchange. Among them, the heating device 44 is in the off state under normal conditions, and when the temperature of the required coolant needs to be increased, it is turned on to moderately heat the coolant. The heating device 44 can be a liquid electric heater or other heaters with the function of heating liquids.

[0038] Preferably, the coolant circulation system further includes a liquid expansion tank 45. The liquid inlet end of the liquid expansion tank 45 is connected to the coolant inlet 41, and the liquid expansion tank 45 has a first liquid discharge port 451. The liquid expansion tank 45 can store a certain amount of coolant and has a certain pressure. When the coolant pressure decreases, the gas pressure in the liquid expansion tank 45 is greater than the pressure of the coolant. At this time, the gas expands and squeezes out the coolant in the airbag to supplement the circulating pump 43, ensuring the normal circulation of the coolant. The first liquid discharge port 451 can discharge the liquid in the liquid expansion tank 45, facilitating the user to maintain the liquid expansion tank 45.

[0039] Among them, the second refrigerant circulation device further includes a gas expansion tank 36. The inlet end of the gas expansion tank 36 is connected to the pipeline between the oil separator 32 and the heat release path b of the first evaporator 26. It should be noted here that since the refrigerant is gaseous at normal temperature and expands greatly, and is liquid at low temperature, but when the machine stops and returns to normal temperature, the internal pressure of the pipeline will be extremely high. Therefore, a gas expansion tank 36 is set on the pipeline, which can increase the volume of the whole system. After the refrigerant expands, the internal pressure of the pipeline will not increase extremely high, effectively improving the safety of the semiconductor temperature control system.

[0040] Among them, a solenoid valve 37 is provided at the inlet end of the gas expansion tank 36. By setting the solenoid valve 37, the amount of refrigerant entering the gas expansion tank 36 can be controlled.

[0041] Preferably, the first refrigerant circulation device further includes a first sight glass 27, and the first sight glass 27 is arranged on the pipeline between the liquid storage tank 23 and the dryer 24. The quality and water content of the first refrigerant in the first refrigeration circuit can be determined through the first sight glass 27, and maintenance can be carried out in a timely manner when abnormalities occur.

[0042] The second refrigerant circulation device further includes a second sight glass 38, and the second sight glass 38 is arranged on the pipeline between the oil outlet of the oil separator 32 and the suction port of the second compressor 31. The quality and water content of the second refrigerant in the second refrigeration circuit can be determined through the second sight glass 38, and maintenance can be carried out in a timely manner when abnormalities occur.

[0043] Preferably, a second drain port 441 is provided on the heating device 44, and a third drain port 431 is provided on the circulation pump 43. The coolant corresponding to the heating device 44 can be discharged through the second drain port 441, which is convenient for maintenance. The coolant on the circulation pump 43 can be discharged through the third drain port 431, which is convenient for maintenance.

[0044] Preferably, the semiconductor temperature control system further includes a main control board and a temperature sensor. The first electronic expansion valve 25, the second electronic expansion valve 34, and the temperature sensor are electrically connected to the main control board. The temperature sensor is arranged at the coolant inlet 41. The temperature sensor is used to obtain the liquid temperature of the coolant inlet 41 and output the current temperature data to the main control board. The main control board compares the current temperature data with the preset temperature data to adjust the opening degrees of the first electronic expansion valve 25 and the second electronic expansion valve 34. Thus, the opening degrees of the first electronic expansion valve 25 and the second electronic expansion valve 34 can be adjusted in real time by detecting the coolant temperature, so as to adjust the temperature control effect in real time, avoid insufficient or excessive refrigeration effect on the coolant, keep it within a reasonable range, which is beneficial to controlling the overall energy consumption, with better user experience and more intelligent overall equipment.

[0045] Preferably, a heat dissipation hole plate 11 is provided on the side wall of the cabinet 1, the condenser 22 is arranged inside the heat dissipation hole plate 11, and a plurality of heat dissipation fans 12 are arranged in the cabinet 1 to dissipate heat from the condenser 22. In this way, the condensation effect of the condenser 22 can be improved, and the cooling effect on the first refrigerant can be increased.

[0046] Preferably, a plurality of pulleys 13 are provided at the bottom of the cabinet 1. By providing the pulleys 13, it is convenient for users to move the whole machine, and the user experience is better.

[0047] The above-described embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all fall within the protection scope of the present invention.

Claims

1. A semiconductor temperature control system, characterized in that, Comprising: a cabinet body, a refrigeration system and a coolant circulation system disposed within the cabinet body; the refrigeration system includes a first refrigerant circulation device and a second refrigerant circulation device; the first refrigerant circulation device includes a first compressor, a condenser, a liquid storage tank, a dryer, a first electronic expansion valve and a first evaporator, and the exhaust port of the first compressor, the condenser, the liquid storage tank, the dryer, the first electronic expansion valve, the heat absorption path of the first evaporator and the suction port of the first compressor are sequentially connected to form a first refrigeration circuit; the second refrigerant circulation device includes a second compressor, an oil separator, a filter, a second electronic expansion valve and a second evaporator, and the exhaust port of the second compressor, the oil separator, the heat release path of the first evaporator, the filter, the second electronic expansion valve, the heat absorption path of the second evaporator and the suction port of the second compressor are sequentially connected to form a second refrigeration circuit, and the oil outlet of the oil separator is connected to the suction port of the second compressor; the coolant circulation system has a coolant inlet and a coolant outlet for connecting to an external load device, the coolant circulation system includes a circulation pump and a heating device, and the coolant inlet is sequentially connected to the coolant outlet through the circulation pump, the heat release path of the second evaporator and the heating device.

2. The semiconductor temperature control system according to claim 1, wherein: the semiconductor temperature control system further includes a liquid expansion tank, and the liquid inlet end of the liquid expansion tank is connected to the coolant inlet, and the liquid expansion tank has a first liquid discharge port.

3. The semiconductor temperature control system according to claim 1, wherein: the second refrigerant circulation device further includes a gas expansion tank, and the inlet end of the gas expansion tank is connected to the pipeline between the heat release paths of the suction.

4. The semiconductor temperature control system according to claim 3, wherein: a solenoid valve is provided at the inlet end of the gas expansion tank.

5. The semiconductor temperature control system according to claim 1, wherein: the first refrigerant circulation device further includes a first sight glass, and the first sight glass is provided on the pipeline between the liquid storage tank and the dryer.

6. The semiconductor temperature control system according to claim 1, wherein: the second refrigerant circulation device further includes a second sight glass, and the second sight glass is provided on the pipeline between the oil outlet of the oil separator and the suction port of the second compressor.

7. The semiconductor temperature control system according to claim 1, wherein: a second liquid discharge port is provided on the heating device, and a third liquid discharge port is provided on the circulation pump.

8. The semiconductor temperature control system according to any one of claims 1-7, wherein: The semiconductor temperature control system further includes a main control board and a temperature sensor. The first electronic expansion valve, the second electronic expansion valve and the temperature sensor are electrically connected to the main control board. The temperature sensor is arranged at the coolant inlet. The temperature sensor is used to obtain the liquid temperature at the coolant inlet and output the current temperature data to the main control board. The main control board compares the current temperature data with the preset temperature data to adjust the opening degrees of the first electronic expansion valve and the second electronic expansion valve.

9. The semiconductor temperature control system according to claim 8, wherein: A heat dissipation hole plate is arranged on the side wall of the cabinet body. The condenser is arranged inside the heat dissipation hole plate, and a plurality of heat dissipation fans are arranged in the cabinet body to dissipate heat from the condenser.

10. The semiconductor temperature control system according to claim 9, wherein: A plurality of pulleys are arranged at the bottom of the cabinet body.

Images