Intelligent phase insulation monitoring plug
Through the intelligent phase insulation monitoring plug with integrated voltage and temperature sensors, the problem that traditional plugs cannot be monitored in real time is solved, and accurate state perception and real-time data transmission of medium and high-voltage power transmission and distribution equipment are realized, improving the level of security and intelligence.
Patent Information
- Application Number
- CN202510708175.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-29
- Publication Date
- 2025-07-25
AI Technical Summary
Traditional phase insulation plugs cannot monitor voltage and temperature data in real time, resulting in delayed monitoring of electrical accidents, and lack of communication modules cannot be used for timely warning, which poses safety hazards.
Design an intelligent phase insulation monitoring plug, integrates a voltage acquisition module, a temperature acquisition module, a microprocessing unit and a communication module, converts high voltage into a safe signal through high-precision electromagnetic isolation technology, and uses edge computing to perform data processing and real-time transmission.
It realizes accurate monitoring of medium and high voltage transmission and distribution scenarios, timely senses the conductor status, improves monitoring accuracy and safety, eliminates the interface air gap problem of traditional structures, and has the ability to early warning of faults.
Smart Images

Figure CN120369048A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of power transmission and distribution, and particularly relates to an intelligent phase insulation monitoring plug. Background Art
[0002] In high-voltage circuits such as ring main units and gas-insulated switchgear, the main function of the phase insulation plug is to provide insulation protection for the circuit. It can effectively isolate conductors (cables) of different phases, preventing electrical accidents caused by direct contact or short circuit between conductors. The traditional plug housing is integrally cast with epoxy resin. Due to the too strong shielding effect of the epoxy resin casting body, it is difficult for external sensors to penetrate and obtain internal voltage fluctuation data, resulting in a large measurement error. In addition, with the temperature fluctuation during conductor transmission, the traditional plug lacks an integrated temperature sensing module and relies only on manual inspection or off-line detection, resulting in the inability to give timely warnings of abnormal temperature rise. For example, local high temperatures caused by poor contact at the T-type cable joints of ring main units often lead to melting accidents due to lagging monitoring. There are potential safety hazards in the entire high-voltage line, and without a communication module, it is impossible to perform fault warning processing. Moreover, traditional plugs generally do not have a communication module and cannot upload temperature, voltage and other data to the cloud platform in real time. Summary of the Invention
[0003] The purpose of the present invention is to provide an intelligent phase insulation monitoring plug, aiming to solve the technical problem of the non-intelligent plug in the prior art.
[0004] To achieve the above purpose, an embodiment of the present invention provides an intelligent phase insulation monitoring plug for providing insulation protection for a conductor and detecting its value. It includes a main body integrally cast, which is internally connected with a front-end guiding part, a middle-end functional part and a rear-end processing part in sequence along the axis. The front-end guiding part is provided with a conductor accommodating channel penetrating along the axis, and its end is sealed for the conductor to extend into and connect. The middle-end functional part is embedded with a voltage acquisition module and a temperature acquisition module. The rear-end processing part includes a microprocessing unit and a communication module. The input end of the microprocessing unit is electrically connected to the voltage acquisition module and the temperature acquisition module respectively, and the communication module is connected to the output end of the microprocessor unit to transmit data to a remote terminal.
[0005] Further, the conductor accommodating channel is connected to a through threaded part, the end of the threaded part is sealed, the conductor extends to the end of the threaded part and abuts; one end of the threaded part relative to the conductor is connected to a copper bar, one end of the copper bar is connected to a copper plate, and the other end face of the copper plate is connected to the voltage acquisition module and the temperature acquisition module.
[0006] Further, the non-contact voltage acquisition module includes a voltage power-taking capacitor connected to the copper plate and a power-taking function module located in the rear-end processing part; the temperature acquisition module is arranged on one side of the voltage power-taking capacitor.
[0007] Further, the power-taking function module includes a first filtering module, a first operational amplification module, a first signal conditioning module, and a first output module. The first end of the voltage-taking capacitor is in contact with the copper plate; the second end of the voltage-taking capacitor is connected to the input end of the first filtering module; the output end of the first filtering module is connected to the input end of the first operational amplification module; the output end of the first operational amplification module is connected to the input end of the first signal conditioning module; the output end of the first signal conditioning module is connected to the first output module.
[0008] Further, the contact-type voltage acquisition module includes a voltage sampling capacitor located on the copper plate and a sampling function module located in the back-end processing unit. The voltage sampling capacitor is a hollow ring structure, and the temperature acquisition module is arranged in the middle of the voltage sampling capacitor; the upper and lower parts of the voltage sampling capacitor are electrodes, and the high voltage is divided into low voltage after passing through the voltage sampling capacitor.
[0009] Further, the sampling function module includes a second filtering module, a second operational amplification module, a second signal conditioning module, and a second output module. The first end of the voltage sampling capacitor is in contact with the copper plate; the second end of the voltage sampling capacitor is connected to the input end of the second filtering module; the output end of the second filtering module is connected to the input end of the second operational amplification module; the output end of the second operational amplification module is connected to the input end of the second signal conditioning module; the output end of the second signal conditioning module is connected to the second output module.
[0010] Further, the second signal conditioning module includes an eighth resistor, a ninth resistor, and a nineteenth capacitor. The first end of the eighth resistor is connected to the output end of the operational amplifier; the second end of the eighth resistor is connected to the first end of the ninth resistor, the first end of the nineteenth capacitor, and the signal output interface of the second output module; the second ends of the ninth resistor and the nineteenth capacitor are grounded.
[0011] Further, the temperature acquisition module includes a heat-conducting core rod located on the copper plate and a thermistor arranged on the heat-conducting core rod. The heat generated by the conductor is sequentially conducted to the copper rod, the copper plate, the heat-conducting core rod, and the thermistor, and the thermistor is electrically connected to the microprocessor unit to transmit the signal value changed by heat.
[0012] Further, the heat-conducting core rod is formed of aluminum nitride with a purity of 99%.
[0013] Further, the communication module uses either a 4G or Bluetooth transmission method for communication.
[0014] One or more of the above technical solutions in the intelligent phase insulation monitoring plug provided by the embodiments of the present invention have at least one of the following technical effects:
[0015] The intelligent phase insulation monitoring plug proposed in this patent significantly improves the intelligent level of power transmission and distribution equipment status monitoring through innovative integrated design. Its integrated casting process not only eliminates the interface air gap problem that may exist in the traditional combined structure but also maintains stable mechanical and electrical properties. By synchronously installing high-precision voltage and temperature sensors to timely sense the conductor status, this voltage acquisition module is specially designed for medium and high-voltage power transmission and distribution scenarios and can accurately sense the primary voltage in the wide range of 10KV - 33.8KV. Through high-precision electromagnetic isolation technology, it converts the dangerous high voltage into a safe 3.25V secondary signal output. The temperature sensor has its own power supply and can achieve independent signal transmission. Combining the edge computing ability of the built-in microprocessor, it can complete data and feature extraction locally and send the data to the terminal through the communication module, ensuring the monitoring accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0017] Figure 1 It is a schematic diagram of the non-contact overall structure of the intelligent phase insulation monitoring plug provided by the embodiment of the present invention;
[0018] Figure 2 It is a disassembled view of the non-contact intelligent phase insulation monitoring plug provided by the embodiment of the present invention;
[0019] Figure 3 It is a circuit diagram of the non-contact intelligent phase insulation monitoring plug provided by the embodiment of the present invention;
[0020] Figure 4 It is a schematic diagram of the contact overall structure of the intelligent phase insulation monitoring plug provided by the embodiment of the present invention;
[0021] Figure 5 It is a disassembled view of the contact intelligent phase insulation monitoring plug provided by the embodiment of the present invention;
[0022] Figure 6 It is a circuit diagram of the contact intelligent phase insulation monitoring plug provided by the embodiment of the present invention.
[0023] Among them, the reference numerals in the drawings:
[0024] 100, main body;
[0025] 200, Front-end guiding part; 210, Conductor accommodation channel; 211, Threaded part; 212, Copper rod; 213, Copper plate;
[0026] 300, Middle-end functional part; 310, Voltage acquisition module; 320, Temperature acquisition module; 321, Heat-conducting core rod;
[0027] 322, Thermistor;
[0028] 400, Rear-end processing part; 410, Microprocessing unit; 420, Communication module. Detailed implementation mode
[0029] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the embodiments of the present invention, and should not be construed as a limitation to the present invention.
[0030] In the description of the embodiments of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.
[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present invention, "a plurality" means two or more unless otherwise specifically defined.
[0032] In the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.
[0033] In the first embodiment of the present invention, as Figures 1-3As shown, an intelligent phase insulation monitoring plug is provided for providing insulation protection for a conductor and detecting its value. It includes a main body 100 integrally cast, which is internally connected with a front-end guiding part 200, a middle-end functional part 300, and a rear-end processing part 400 in sequence along the axial direction. The front-end guiding part 200 is provided with a conductor accommodation channel 210 penetrating along the axial direction, and its end is sealed for the conductor to extend into and connect. The middle-end functional part 300 is embedded with a voltage acquisition module 310 and a temperature acquisition module 320. The rear-end processing part 400 includes a microprocessing unit 410 and a communication module 420. The input end of the microprocessing unit 410 is electrically connected to the voltage acquisition module 310 and the temperature acquisition module 320 respectively, and the communication module 420 is connected to the output end of the microprocessor unit to transmit data to a remote terminal.
[0034] Specifically, the intelligent phase insulation monitoring plug proposed in this patent significantly improves the intelligent level of power transmission and distribution equipment status monitoring through innovative integrated design. Its integrated casting process not only eliminates the possible interface air gap problem of traditional combined structures but also maintains stable mechanical and electrical properties. By synchronously embedding high-precision voltage and temperature sensors to timely perceive the conductor status, the voltage acquisition module 310 is specially designed for medium and high-voltage power transmission and distribution scenarios and can accurately perceive the primary voltage in a wide range of 10KV - 33.8KV. Through high-precision electromagnetic isolation technology, it converts dangerous high voltage into a safe 3.25V secondary signal output. The temperature sensor has its own power supply and can achieve autonomous signal transmission. Combining the edge computing ability of the built-in microprocessor, it can complete data and feature extraction locally and send the data to the terminal through the communication module 420, ensuring the monitoring accuracy.
[0035] Further, as Figures 1-3 shown, the conductor accommodation channel 210 is connected to a through-threaded part 211, and the end of the threaded part 211 is sealed. The conductor extends to the end of the threaded part 211 and abuts; one end of the threaded part 211 relative to the conductor is connected to a copper bar 212, one end of the copper bar 212 is connected to a copper plate 213, and the other end face of the copper plate 213 is connected to the voltage acquisition module 310 and the temperature acquisition module 320. Specifically, the threaded part 211 is also made of copper. When the conductor contacts the threaded part 211, heat and voltage are supplied to the voltage acquisition module 310 and the temperature acquisition module 320 through the conduction mode of the threaded part 211 - copper bar 212 - copper plate 213.
[0036] In the second embodiment, as Figures 1-3As shown in the figure, the non-contact voltage acquisition module 310 includes a voltage power-taking capacitor connected to the copper plate 213 and a power-taking function module located in the back-end processing unit 400; the temperature acquisition module 320 is arranged on one side of the voltage power-taking capacitor. The power-taking function module includes a first filtering module, a first operational amplification module, a first signal conditioning module, and a first output module. The first end of the voltage power-taking capacitor abuts against the copper plate 213; the second end of the voltage power-taking capacitor is connected to the input end of the first filtering module; the output end of the first filtering module is connected to the input end of the first operational amplification module; the output end of the first operational amplification module is connected to the input end of the first signal conditioning module; the output end of the first signal conditioning module is connected to the first output module.
[0037] Specifically, the non-contact voltage acquisition module 310 mainly uses the voltage power-taking capacitor as a medium for isolation voltage transformation and transmission. The advantage of the voltage power-taking capacitor is to obtain energy from the power supply and improve the stability of power supply. The second end of the voltage power-taking capacitor is connected to the input end of the first filtering module, and the first filtering module filters out the clutter and AC components in the input signal after voltage reduction; the output end of the first filtering module is connected to the input end of the first operational amplification module to amplify the filtered input signal for easy observation of the filtered input signal; the output end of the first operational amplification module is connected to the input end of the first signal conditioning module to determine the output impedance of the circuit and calibrate the phase difference of the operational amplifier output signal; the output end of the first signal conditioning module is connected to the first output module, and the first output module finally transmits the monitored voltage data to the terminal through the communication module 420 for real-time monitoring.
[0038] Furthermore, as Figure 3 shown, the first signal conditioning module includes an eighth resistor R8, a ninth resistor R9, and a nineteenth capacitor C19. The first end of the eighth resistor R8 is connected to the output end of the operational amplifier; the second end of the eighth resistor R8 is connected to the first end of the ninth resistor R9, the first end of the nineteenth capacitor C19, and the signal output interface of the first output module; the second ends of the ninth resistor R9 and the nineteenth capacitor C19 are grounded. Specifically, the first end of the eighth resistor R8 is connected to the output end of the operational amplifier U5; the second end of the eighth resistor R8 is connected to the first end of the ninth resistor R9, the first end of the nineteenth capacitor C19, and the signal output interface of the first output module; the second ends of the ninth resistor R9 and the nineteenth capacitor C19 are grounded. The ninth resistor R9 and the nineteenth capacitor C19 together form an RC parallel network for determining the output impedance and calibrating the output phase difference; the eighth resistor R8 and the ninth resistor R9 are used to adjust the output voltage amplitude.
[0039] Furthermore, as Figure 3As shown, the first filtering module includes a sixth resistor R6, a fifteenth capacitor C15, and a sixteenth capacitor C16, where: the first end of the sixth resistor R6 is connected to the second end of the voltage-dividing capacitor C; the second end of the sixth resistor R6 is connected to the first end of the fifteenth capacitor C15, the first end of the sixteenth capacitor C16, and the input end of the operational amplifier module; the second ends of the fifteenth capacitor C15 and the sixteenth capacitor C16 are grounded. The sixth resistor R6 functions to reduce current noise and common-mode noise, and at the same time can also improve the stability and reliability of the circuit; the fifteenth capacitor C15 and the sixteenth capacitor C16 together form a multi-capacitor parallel connection, which is used to filter out the clutter and AC components in the input signal after voltage reduction.
[0040] Further, as Figure 3 shown, the first operational amplifier module includes an eighteenth capacitor C18, a fourth resistor R4, a fourteenth capacitor C14, a seventeenth capacitor C17, a seventh resistor R7, a fifth resistor R5, and an operational amplifier U5, where: the negative input gain adjustment pin RG- of the operational amplifier U5 is connected to the first end of the fourth resistor R4; the positive input gain adjustment pin RG+ of the operational amplifier U5 is connected to the second end of the fourth resistor R4; the differential input negative pin IN- of the operational amplifier U5 is connected to the second end of the fifth resistor R5; the first end of the fifth resistor R5 is grounded; the differential input positive pin IN+ of the operational amplifier U5 is connected to the second end of the sixth resistor R6; the negative power supply pin VS- of the operational amplifier U5 is connected to the second end of the eighteenth capacitor C18 and the negative power supply VEE; the first end of the eighteenth capacitor C18 is grounded; the positive power supply pin VS+ of the operational amplifier U5 is connected to the first end of the fourteenth capacitor C14 and the positive power supply VCC; the second end of the fourteenth capacitor C14 is grounded; the reference voltage input pin REF of the operational amplifier U5 is connected to the first end of the seventeenth capacitor C17 and the first end of the seventh resistor R7; the second ends of the seventeenth capacitor C17 and the seventh resistor R7 are grounded; the output pin OUT of the operational amplifier U5 is connected to the first end of the eighth resistor R8. The fourth resistor R4 and the fifth resistor R5 are operational amplifier adjustment resistors, which jointly adjust the gain of the operational amplifier. The seventh resistor R7 and the seventeenth capacitor C17 together form an RC parallel network, which is used to provide a midpoint voltage; the fourteenth capacitor C14 and the eighteenth capacitor C18 are filtering capacitors, which are respectively used to filter out the clutter and AC components in the positive power supply and the negative power supply.
[0041] Further, as Figure 3As shown, the first output module further includes a power supply port VCC and a ground port GND. In a specific embodiment of the present invention, the first output module does not undertake the signal adjustment function, but only outputs the output signal adjusted by the signal conditioning module. Therefore, in order to fully minimize the circuit structure, the first output module is organically integrated with the power supply module. The first output module can be a socket with an output interface, a power supply interface, and a ground interface.
[0042] In the third embodiment, as Figures 4-6 shown, the contact voltage acquisition module 310 includes a voltage sampling capacitor located on the copper plate 213 and a sampling function module located in the backend processing unit 400. The voltage sampling capacitor is a hollow ring structure, and the temperature acquisition module 320 is arranged at the middle end of the voltage sampling capacitor; the upper and lower parts of the voltage sampling capacitor are electrodes, and the high voltage is divided into a low voltage after passing through the voltage sampling capacitor. The sampling function module includes a second filtering module, a second operational amplifier module, a second signal conditioning module, and a second output module. The first end of the voltage sampling capacitor is in contact with the copper plate 213; the second end of the voltage sampling capacitor is connected to the input end of the second filtering module; the output end of the second filtering module is connected to the input end of the second operational amplifier module; the output end of the second operational amplifier module is connected to the input end of the second signal conditioning module; the output end of the second signal conditioning module is connected to the second output module.
[0043] Specifically, the advantages of the voltage sampling capacitor are high precision and small signal distortion. The conductor extends into the conductor accommodating channel 210, and the first end of the voltage sampling capacitor is electrically connected to the conductor. The voltage sampling capacitor is used to reduce the voltage of the high-voltage input signal. Otherwise, the 10KV, 50Hz high-voltage input signal adopted in the specific embodiment of the present invention will overvoltage breakdown the operational amplifier and damage the circuit components; the second end of the voltage sampling capacitor is connected to the input end of the second filtering module, and the second filtering module filters out the clutter and AC components in the input signal after voltage reduction; the output end of the second filtering module is connected to the input end of the second operational amplifier module to amplify the input signal after the second filtering for easy observation of the filtered input signal; the output end of the second operational amplifier module is connected to the input end of the second signal conditioning module to determine the output impedance of the circuit and calibrate the phase difference of the operational amplifier output signal; the output end of the second signal conditioning module is connected to the second output module, and the second output module finally transmits the monitored voltage data to the terminal through the communication module 420 for real-time monitoring.
[0044] Further, as Figures 4-6As shown, the second signal conditioning module includes an eighth resistor R8, a ninth resistor R9, and a nineteenth capacitor C19. The first end of the eighth resistor R8 is connected to the output end of the operational amplifier; the second end of the eighth resistor R8 is connected to the first end of the ninth resistor R9, the first end of the nineteenth capacitor C19, and the signal output interface of the second output module; the second end of the ninth resistor R9 and the second end of the nineteenth capacitor C19 are grounded. Specifically, the first end of the eighth resistor R8 is connected to the output end of the operational amplifier U5; the second end of the eighth resistor R8 is connected to the first end of the ninth resistor R9, the first end of the nineteenth capacitor C19, and the signal output interface of the second output module; the second end of the ninth resistor R9 and the second end of the nineteenth capacitor C19 are grounded. The ninth resistor R9 and the nineteenth capacitor C19 together form an RC parallel network for determining the output impedance and calibrating the output phase difference; the eighth resistor R8 and the ninth resistor R9 are used to adjust the output voltage amplitude.
[0045] Further, as Figures 4-6 shown, the second filtering module includes a sixth resistor R6, a fifteenth capacitor C15, and a sixteenth capacitor C16, where: the first end of the sixth resistor R6 is connected to the second end of the voltage-dividing capacitor C; the second end of the sixth resistor R6 is connected to the first end of the fifteenth capacitor C15, the first end of the sixteenth capacitor C16, and the input end of the operational amplification module; the second end of the fifteenth capacitor C15 and the second end of the sixteenth capacitor C16 are grounded. The sixth resistor R6 functions to reduce current noise and common-mode noise, and at the same time can also improve the stability and reliability of the circuit; the fifteenth capacitor C15 and the sixteenth capacitor C16 together form a multi-capacitor parallel connection for filtering out the clutter and AC components in the stepped-down input signal.
[0046] Further, as Figures 4-6As shown, the second operational amplifier module includes the eighteenth capacitor C18, the fourth resistor R4, the fourteenth capacitor C14, the seventeenth capacitor C17, the seventh resistor R7, the fifth resistor R5, and the operational amplifier U5, where: the negative input gain adjustment pin RG- of the operational amplifier U5 is connected to the first end of the fourth resistor R4; the positive input gain adjustment pin RG+ of the operational amplifier U5 is connected to the second end of the fourth resistor R4; the differential input negative pin IN- of the operational amplifier U5 is connected to the second end of the fifth resistor R5; the first end of the fifth resistor R5 is grounded; the differential input positive pin IN+ of the operational amplifier U5 is connected to the second end of the sixth resistor R6; the negative power supply pin VS- of the operational amplifier U5 is connected to the second end of the eighteenth capacitor C18 and the negative power supply VEE; the first end of the eighteenth capacitor C18 is grounded; the positive power supply pin VS+ of the operational amplifier U5 is connected to the first end of the fourteenth capacitor C14 and the positive power supply VCC; the second end of the fourteenth capacitor C14 is grounded; the reference voltage input pin REF of the operational amplifier U5 is connected to the first end of the seventeenth capacitor C17 and the first end of the seventh resistor R7; the second end of the seventeenth capacitor C17 and the second end of the seventh resistor R7 are grounded; the output pin OUT of the operational amplifier U5 is connected to the first end of the eighth resistor R8. The fourth resistor R4 and the fifth resistor R5 are operational amplifier adjustment resistors, jointly adjusting the gain of the operational amplifier. The seventh resistor R7 and the seventeenth capacitor C17 jointly form an RC parallel network for providing a midpoint voltage; the fourteenth capacitor C14 and the eighteenth capacitor C18 are filter capacitors, respectively used to filter out the clutter and AC components in the positive power supply and the negative power supply.
[0047] Further, as Figures 4-6 shown, the second output module further includes a power supply port VCC and a ground port GND. In a specific embodiment of the present invention, the second output module does not undertake the signal adjustment function, but only outputs the output signal adjusted by the signal conditioning module. Therefore, in order to fully minimize the circuit structure, the second output module is organically integrated with the power supply module. The second output module can be a socket with an output interface, a power supply interface, and a ground interface.
[0048] In the fourth embodiment, as Figure 3As shown, the temperature acquisition module 320 includes a heat-conducting mandrel 321 located on the copper plate 213 and a thermistor 322 disposed on the heat-conducting mandrel 321. The threaded portion 211 is also made of copper material. The heat generated by the conductor is sequentially conducted to the threaded portion 211, the copper rod 212, the copper plate 213, the heat-conducting mandrel 321, and the thermistor 322. The thermistor 322 is electrically connected to the microprocessor unit to transmit the signal value changed by heat. The heat-conducting mandrel 321 is formed of aluminum nitride with a purity of 99%. Heat is conducted from the threaded portion 211 to the heat-conducting mandrel 321 and then to the thermistor 322, forming a heat transfer chain of "heat source - copper rod 212 - copper plate 213 - heat-conducting mandrel 321 - thermistor 322".
[0049] Furthermore, the communication module 420 uses either a 4G or Bluetooth transmission method for communication.
[0050] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. An intelligent phase insulation monitoring plug, which is used to provide insulation protection for a conductor and detect its value, and is characterized in that, It includes a main body integrally cast, which is axially connected with a front-end guiding part, a middle-end functional part and a rear-end processing part in sequence inside; the front-end guiding part is provided with a conductor accommodating channel penetrating axially, and its end is sealed for the conductor to extend in and connect; the middle-end functional part is embedded with a voltage acquisition module and a temperature acquisition module; the rear-end processing part includes a microprocessing unit and a communication module, the input ends of the microprocessing unit are electrically connected to the voltage acquisition module and the temperature acquisition module respectively, and the communication module is connected to the output end of the microprocessor unit to transmit data to a remote terminal.
2. The intelligent phase insulation monitoring plug according to claim 1, wherein The conductor accommodating channel is connected to a penetrating threaded part, the end of the threaded part is sealed, and the conductor extends to the end of the threaded part and abuts; one end of the threaded part relative to the conductor is connected to a copper bar, one end of the copper bar is connected to a copper plate, and the other end face of the copper plate is connected to the voltage acquisition module and the temperature acquisition module.
3. The intelligent phase insulation monitoring plug according to claim 2, characterized in that, The non-contact voltage acquisition module includes a voltage power-taking capacitor connected to the copper plate and a power-taking functional module located in the rear-end processing part; the temperature acquisition module is arranged on one side of the voltage power-taking capacitor.
4. The intelligent phase insulation monitoring plug according to claim 3, wherein, The power-taking functional module includes a first filtering module, a first operational amplification module, a first signal conditioning module and a first output module. The first end of the voltage power-taking capacitor abuts against the copper plate; the second end of the voltage power-taking capacitor is connected to the input end of the first filtering module; the output end of the first filtering module is connected to the input end of the first operational amplification module; the output end of the first operational amplification module is connected to the input end of the first signal conditioning module; the output end of the first signal conditioning module is connected to the first output module.
5. The intelligent phase insulation monitoring plug according to claim 2, wherein The contact voltage acquisition module includes a voltage sampling capacitor located on the copper plate and a sampling functional module located in the rear-end processing part. The voltage sampling capacitor is a hollow ring structure, and the temperature acquisition module is arranged in the middle of the voltage sampling capacitor; the upper and lower parts of the voltage sampling capacitor are electrodes, and the high voltage is divided into low voltage after passing through the voltage sampling capacitor.
6. The intelligent phase insulation monitoring plug according to claim 2, characterized in that, The sampling functional module includes a second filtering module, a second operational amplification module, a second signal conditioning module and a second output module. The first end of the voltage sampling capacitor abuts against the copper plate; the second end of the voltage sampling capacitor is connected to the input end of the second filtering module; the output end of the second filtering module is connected to the input end of the second operational amplification module; the output end of the second operational amplification module is connected to the input end of the second signal conditioning module; the output end of the second signal conditioning module is connected to the second output module.
7. The intelligent phase insulation monitoring plug according to claim 6, wherein, The second signal conditioning module includes an eighth resistor, a ninth resistor and a nineteenth capacitor. The first end of the eighth resistor is connected to the output end of the operational amplifier; the second end of the eighth resistor is connected to the first end of the ninth resistor, the first end of the nineteenth capacitor and the signal output interface of the second output module; the second ends of the ninth resistor and the nineteenth capacitor are grounded.
8. The intelligent phase insulation monitoring plug according to claim 2, wherein, The temperature acquisition module includes a heat-conducting mandrel located on the copper plate and a thermistor arranged on the heat-conducting mandrel. The heat generated by the conductor is sequentially conducted to the copper bar, the copper plate, the heat-conducting mandrel, and the thermistor. The thermistor is electrically connected to the microprocessor unit to transmit the signal value changed by heat.
9. The intelligent phase insulation monitoring plug according to claim 7, characterized in that, The heat-conducting mandrel is formed of aluminum nitride with a purity of 99%.
10. The intelligent phase insulation monitoring plug according to claim 1, characterized in that, The communication module uses either a 4G or Bluetooth transmission method for communication.