Wafer box shipment inspection equipment, method and application

Abstract

The present invention discloses a wafer box shipment inspection device, method and application. The device includes: a positioning module, a reflection module, an image acquisition module and an image processing module; the reflection module includes a long strip reflector and a plurality of positioning marks, the length direction of the long strip reflector is parallel to the axial direction of the wafer, and the positioning marks correspond to the storage positions of the wafers one by one; the image acquisition module at least captures the reflection image of the wafer in the reflector and the positioning marks to form an inspection image; the image processing module includes an image recognition model for identifying whether the actual storage position of the wafer matches the target storage position. The present invention uses mirror reflection imaging to obtain an inspection image of the wafer placed in the wafer box, avoiding stray interference caused by direct light, and at the same time uses the positioning marks set on the reflection surface to assist the image recognition model to recognize the wafer pattern, significantly improving the recognition speed and accuracy.

Description

Technical Field

[0001] The present invention relates to the field of wafer packaging and testing technology, and in particular to a wafer box packaging and shipping detection device, method and application. Background Art

[0002] The wafer testing production process involves batching, where some wafers are separated from a parent batch into sub-batches for separate shipment. This can lead to issues like incorrect wafer counts or incorrect extraction of wafers with different wafer numbers, which currently cannot be effectively intercepted through management systems. Another issue currently facing the industry is that after wafer testing production is completed, the wafers must be placed in drying bags and vacuum-packed before shipment. This can lead to quality issues, such as incorrect number of drying bags or incorrect use of vacuum bags.

[0003] For the above situations, if Figure 1 As shown in the figure, the current common practice in the industry is that operators of the shipment and packaging process enter the MES (manufacturing execution system) accounting system (hereinafter referred to as MES) and then manually visually inspect the quantity, piece number, and packaging materials of the products according to the document specifications to determine whether they are consistent with the documents. If they are consistent, the MES system will ship the product out of the station; if they are inconsistent, the operation will be detained and stopped. The judgment of the consistency of the shipment quantity, piece number, and packaging materials with the specifications depends entirely on manual visual inspection, which is inefficient and has low accuracy.

[0004] Moreover, for wafer shipments, since the surface of the wafer box is reflective and the lights in the wafer factory are relatively bright, a lot of stray interference will be generated, resulting in deviations in the detection of the wafer position in the wafer box, whether it is manual identification or using intelligent identification methods, causing production accidents. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention aims to provide a wafer box shipment inspection device, method and application.

[0006] To achieve the aforementioned object of the invention, the technical solutions adopted by the present invention include:

[0007] In a first aspect, the present invention provides a wafer box shipment detection device for detecting whether the contents in a wafer box are correctly placed, wherein the contents include wafers, and the wafer box shipment detection device includes: a positioning module, a reflection module, an image acquisition module, and an image processing module;

[0008] The positioning module is used to locate the posture of the wafer box; the reflection module includes a long strip reflector provided next to the wafer box when the wafer box is positioned and a plurality of positioning marks provided on the reflection surface of the long strip reflector, the length direction of the long strip reflector is parallel to the axial direction of the wafer, and the positioning marks correspond to the accommodation positions of the wafers one by one;

[0009] The image acquisition module at least captures the reflection image of the wafer in the reflector and the positioning mark to form an inspection image; the image processing module includes an image recognition model, which is used to identify whether the actual storage position of the wafer matches the target storage position based on the inspection image.

[0010] In a second aspect, the present invention further provides a wafer box shipment detection method based on the above-mentioned wafer box shipment detection device, which comprises:

[0011] Providing a plurality of training wafer boxes, wherein a plurality of wafers are arranged in a training arrangement state, and the training arrangement state is used as a true value label;

[0012] Placing the training wafer box on a positioning module and obtaining a training image using an image acquisition module;

[0013] Using the training images and the true value labels as a training set, updating the parameters of the initial image recognition model to obtain an image recognition model;

[0014] Placing the wafer box to be inspected on the positioning module and acquiring an inspection image;

[0015] The image recognition model is used to identify whether the actual accommodation position of the wafer matches the target accommodation position based on the inspection image.

[0016] In a third aspect, the present invention also provides an application of the above-mentioned wafer box shipment detection method in the field of wafer packaging detection.

[0017] Based on the above technical solution, compared with the prior art, the beneficial effects of the present invention include at least:

[0018] The shipment inspection equipment and method provided by the present invention utilizes mirror reflection imaging to obtain an inspection image of the wafer placed in the wafer box, avoiding stray interference caused by direct light, and at the same time utilizes the positioning marks set on the reflective surface to assist the image recognition model to recognize the wafer graphics, significantly improving the recognition speed and accuracy, replacing manual visual inspection for shipment inspection, and ultimately significantly improving the accuracy and efficiency of wafer box shipment inspection, and has broad application prospects.

[0019] The above description is only an overview of the technical solution of the present invention. In order to enable those skilled in the art to more clearly understand the technical means of this application and implement them according to the contents of the specification, the following is an explanation of the preferred embodiments of the present invention with detailed drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a flow chart of manual visual inspection of shipments provided by the background technology of the present invention;

[0021] Figure 2 It is a structural diagram of a wafer box shipment inspection device provided by a typical embodiment of the present invention;

[0022] Figure 3 This is an exemplary inspection image obtained by a wafer box shipment inspection device provided in a typical embodiment of the present invention;

[0023] Figure 4 It is a flow chart of a wafer box shipment inspection method provided by a typical implementation case of the present invention. DETAILED DESCRIPTION

[0024] In view of the shortcomings of the prior art, the inventors of this case, after long-term research and extensive practice, have proposed the technical solution of the present invention. The following will further explain this technical solution, its implementation process and principles.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0026] Moreover, relational terms such as “first” and “second” are merely used to distinguish one component or method step from another with the same name, but do not necessarily require or imply any actual relationship or order between these components or method steps.

[0027] like Figure 2As shown, an embodiment of the present invention provides a wafer box loading and shipping detection device for detecting whether the contents in the wafer box are correctly placed, the contents including wafers, and the wafer box loading and shipping detection device including: a positioning module, a reflection module, an image acquisition module and an image processing module; the positioning module is used to locate the posture of the wafer box; the reflection module includes a long strip reflector arranged next to the wafer box when the wafer box is positioned and a plurality of positioning marks arranged on the reflection surface of the long strip reflector, the length direction of the long strip reflector is parallel to the axial direction of the wafer, and the positioning marks correspond one-to-one to the storage position of the wafer; the image acquisition module at least captures the reflection image of the wafer in the reflector and the positioning marks to form an inspection image; the image processing module includes an image recognition model, and the image recognition model is used to identify whether the actual storage position of the wafer matches the target storage position based on the inspection image.

[0028] As a typical example, see Figure 2 As shown, the positioning module may include a limiting structure provided at the bottom of the wafer box, which is usually some protrusions corresponding to the bottom slots of the wafer box. It is generally a common structure in the semiconductor field, but is not limited to this. Any mechanical structure that can play a role in positioning the wafer box can be used; the reflection module in this example is Figure 2 The mirror is a long strip and is installed near the back of the wafer box (i.e., the side facing away from the opening of the wafer box), with the mirror facing the wafer box. Of course, it can be replaced by other components with reflective functions as shown below; the image acquisition module is Figure 2 The industrial camera used in the invention can still obtain the corresponding image even if it is replaced by an ordinary electronic camera, but its stability is not as good as that of a professional industrial camera. The present invention does not impose any specific restrictions on the specific selection of these modules.

[0029] When addressing the issues of low efficiency and accuracy of manual visual inspection, the inventors of the present invention first considered using a method of directly capturing images of the wafers inside a transparent wafer cassette for AI image recognition, thereby determining whether the wafers in the cassette are correctly placed. However, in actual application, it was found that this implementation still had some difficult-to-overcome problems. After analysis, the main reason was that the surface of the wafer cassette is reflective to a certain extent, and the lighting in the semiconductor factory is relatively bright, and there is frequent movement of personnel and equipment, which can easily cause light interference around the inspection equipment, thereby interfering with the accuracy of image recognition and causing misjudgment. To address the above problems, the present invention first adopts a long strip reflector imaging method, so that the side edges of the vertically stacked wafers (the edges of the wafers are most obvious in the image) are imaged in the image acquisition module through the reflector. The strip reflector limits the angle of incidence of light, largely avoiding interference caused by external light. In addition, the present invention also combines the method of reflective marking with positioning marks to strengthen the indication of the wafer position in the image, introducing additional prompt information for the training and recognition of the image recognition model, thereby significantly improving the training and recognition efficiency and accuracy of the image recognition model. By integrating various technical means, the wafer box packaging and shipment inspection equipment and corresponding method provided by the present invention realize the detection of the wafer presence in the wafer box with almost no misjudgment, greatly improving the efficiency and accuracy of the wafer box packaging and shipment inspection process.

[0030] In the technical solution of the present invention, the length of the long strip reflector is generally equal to or greater than the height of the space for accommodating wafers in the wafer box, and its width can be set by itself, for example, 3-5 cm or a similar size, as long as it can limit the line of sight and avoid stray light. Its light reflection principle can adopt the coating reflection principle or the total reflection principle, and there are no excessive restrictions on this; at the same time, the image acquisition module can be any optical electronic device such as an industrial camera that can obtain images that are sufficiently recognizable; in addition, for the image processing module and the image recognition model it contains, various existing pre-trained image recognition models can be used. Specifically, the image recognition model in the embodiment of the present invention is obtained after training using a purchased image recognition software product, and different types of wafer box samples are used during the training process (different types of wafer boxes have different wafer storage positions and corresponding positioning marks); the role of the positioning mark is to introduce eye-catching prompts in the inspection image and enhance the model's sensitivity to the edge graphics and color of the wafer. It can be numbers, graphics, letters and their combinations, for example, it can be numbers marked in sequence, or it can be arrows pointing to different slots, preferably a combination of letters, numbers and arrows, such as the arrangement of Slot1→, Slot2→...Slot25→.

[0031] In order to further improve the prompt intensity, the preferred embodiment of the present invention also uses color difference to make the prompt more obvious, that is, in some embodiments, the reflective surface is divided into rectangular heterochromatic areas and primary color areas. For specific exemplary divisions, please refer to Figure 3 As shown, the heterochromatic area (e.g. Figure 3 The left half of the green area shown) and the primary color area (e.g. Figure 3 The dividing line of the right half transparent area shown in the figure is parallel to the length direction of the long strip reflector, the color of the different color area is optional, and the color of the primary color area is still the original color of the mirror, that is, the transparent color, which is generally colorless and transparent or bright silver. The color of the different color area is a contrasting color with the background color of the wafer box. For example, the color of the wafer box is usually transparent, gray or brown, and the ambient light color is usually white or yellow. Therefore, the color of the different color area can usually be selected from brighter colors, such as green, red, etc.; observed from the shooting angle of the image acquisition module, the reflected image is at least imaged in the primary color area; the positioning mark is arranged in the different color area, and the color of the positioning mark is a contrasting color with the color of the different color area. For example, when the color of the different color area is green, the color of the positioning mark can be designed to be red, black, etc., which forms a clear contrast with green.

[0032] Specifically in some embodiments, the color of the heterochromatic region includes any one of green, blue, red, and yellow, but is not limited thereto. A relatively bright color is usually selected to distinguish it from the background color.

[0033] In addition, an embodiment of the present invention also provides a technical solution for further eliminating stray light interference by utilizing the difference of symmetrical shooting, that is, in some embodiments, the image acquisition module includes a first camera and a second camera, and the first camera and the second camera are symmetrically arranged on both sides with the elongated reflector as the central axis, and the shooting angles of the first camera and the second camera are both directed towards the elongated reflector; when acquiring the inspection image, the first camera obtains the first image and the second camera obtains the second image, and the difference image between the first image and the second image is used as the inspection image, and the difference image removes the difference between the first image and the second image.

[0034] The above example illustrates an implementation in which multiple cameras share a single strip reflector. In other embodiments, the number of strip reflectors can be multiple, evenly spaced, with each strip reflector corresponding to a camera. For example, the first camera is directed at one of the strip reflectors to obtain a first image, while the second camera is directed at another of the strip reflectors to obtain a second image. This acquisition of inspection images can further improve the accuracy of shipping inspections.

[0035] In a specific implementation, taking an RGB color image as an example, a first image and a second image can be obtained first, and then the first image and the second image can be scaled, rotated, and other adjustments can be performed using an image processing program to align the positioning marks of the two. Then, the pixel difference value in the two aligned images is calculated based on the RGB value of each pixel. When the pixel difference value is above a preset threshold (that is, the difference value of a certain area in the two images is too large), the pixel point is eliminated, and only some pixel points with a pixel difference value less than the preset threshold are retained. In this way, the difference processing of the two symmetrically shot images can further eliminate the interference caused by external light, thereby further improving the recognition accuracy.

[0036] In addition, in response to another technical problem mentioned in the above background technology, that is, when packaging for box shipment, it is often easy to use the wrong packaging material or omit the placement of accessories such as desiccants. Therefore, a better embodiment of the present invention also proposes a technical solution for further detecting whether the shipping packaging is qualified by weighing. That is, in some embodiments, the wafer box is wrapped with a packaging body, and the packaging body contains accessories, and the accessories include at least desiccant. The wafer box shipment detection equipment also includes a weighing module, which is arranged at the positioning module for weighing the total mass of the wafer box, packaging body and accessories.

[0037] The accounting system stores the ideal mass of the accessories, the ideal mass of the packaging materials, and the ideal mass of the wafer box and the wafers therein. Therefore, by weighing, it is possible to first determine whether the total mass is correct. At the same time, it is also possible to determine which item has an abnormality based on the size of the difference between the actual mass and the total mass. For example, if the size of the difference is exactly equal to the mass of a wafer or its multiple, it can be identified that there is an abnormality in the number of wafers; and if the difference is very close to the mass of the desiccant, it can be considered that there is a problem with the placement of the desiccant, and so on.

[0038] Corresponding to the composition and structure of the above-mentioned device, a second aspect of the embodiment of the present invention further provides a wafer box shipment detection method based on the wafer box shipment detection device provided in any of the above-mentioned embodiments, which includes the following steps:

[0039] Providing a plurality of training wafer boxes, wherein a plurality of wafers are arranged in a training arrangement state, and the training arrangement state is used as a true value label;

[0040] Placing the training wafer box on a positioning module and obtaining a training image using an image acquisition module;

[0041] Using the training images and the true value labels as a training set, updating the parameters of the initial image recognition model to obtain an image recognition model;

[0042] Placing the wafer box to be inspected on the positioning module and acquiring an inspection image;

[0043] The image recognition model is used to identify whether the actual accommodation position of the wafer matches the target accommodation position based on the inspection image.

[0044] In some embodiments, the wafer box shipment inspection method may specifically include the following process:

[0045] Using a first camera and a second camera, a first image and a second image are acquired at symmetrical viewing angles with the long strip reflector as an axis;

[0046] performing image difference processing on the first image and the second image to obtain a difference image, wherein the difference portion between the first image and the second image is removed from the difference image;

[0047] During training, the differential image is used as the training image for parameter update, and during detection, the differential image is used as the test image for image recognition.

[0048] In addition, in combination with weighing measurement, in some embodiments, the wafer box shipment detection method may further include the following steps:

[0049] Calculating a target mass based on the theoretical number of wafers in the wafer box, the theoretical mass of the wafer box, the theoretical mass of the packaging body, and the theoretical mass of the appendages;

[0050] Weighing the actual total mass of the wafer box, packaging body and accessories;

[0051] Based on the matching of the actual total mass and the target mass, it is determined whether the number of wafers in the wafer box, the selection of the packaging body and the presence of the accessories are normal.

[0052] Regarding wafer box shipment management, in some embodiments, the wafer box shipment inspection method may further include the following steps:

[0053] When any one of the actual accommodation position of the wafer, the number of wafers in the wafer box, the selection of the packaging body and the presence of the accessories is abnormal, the wafer box to be inspected is marked as a retained state.

[0054] As a typical example of the above technical solution, the specific process of the wafer box shipment inspection method can be found in Figure 4 As shown, it mainly includes:

[0055] 1. Implement AI recognition function of the equipment: obtain the number of wafer products and slot number, automatically compare them with the MES system, and store the comparison results; 2. Implement weighing function of the equipment: the MES system calculates the quality difference data before and after packaging, outputs the packaging material quality, compares it with the packaging material quality set by the MES system, and stores the comparison results; 3. Implement automatic shutdown alarm function of the equipment: automatically alarm after FAIL (abnormal) compared with the MES system; 4. MES system card control: the MES system grabs the equipment for entry and exit and compares the information. If it is not Pass, the MES system will forcibly detain the wafer box; 5. MES system backup function: implement the function of backing up key data in the MES system database.

[0056] A third aspect of the embodiments of the present invention further provides an application of the wafer box shipment detection method provided by any of the above-mentioned embodiments in the field of wafer packaging detection.

[0057] The technical solution of the present invention is further described in detail below through several embodiments and in conjunction with the accompanying drawings. However, the selected embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. Example 1

[0058] In this embodiment, a device is designed to detect the number of wafers, slot numbers, and packaging materials before shipment and compare them with the MES system. If they fail, they cannot be shipped. This is to control the mixing of materials and the inconsistency of packaging with requirements during the final shipment process of wafer testing.

[0059] The specific operation process of the equipment is: the product is placed on the equipment platform, the image recognition model of the equipment is used to identify the quantity and piece number of the product, and the output quantity and piece number of the product are compared with MES for consistency. If they are inconsistent, the device will trigger an alarm, and if they are consistent, the results will be automatically saved; the weighing module of the equipment is used to extract the actual mass before packaging (T1) and the mass after packaging (T2), and automatically output the packaging material mass (T2-T1). It is compared with the quality standards stored in the background of the equipment system for consistency. If they are inconsistent, the device will alarm, and if they are consistent, the results will be automatically saved.

[0060] The MES system retrieves the consistency comparison results stored in the equipment when entering and leaving the station. If the stored result is PASS, the station can exit normally in the MES system. If the stored result is not PASS, the station cannot exit and will be forcibly detained.

[0061] Extraction of wafer product quantity and wafer number: A product placement positioning module is added to the equipment platform to ensure that the product placement direction and angle are exactly the same each time. The equipment uses two high-resolution industrial cameras to ensure image clarity. The embedded AI computing module is used to establish an AI model to collect a large number of product images, covering different lighting conditions and backgrounds, and annotate the products in the image. The annotation content includes images of different slots from Slot 1 to Slot 25 (the spacing between Slot 1 to Slot 25 is exactly the same and gradually increases). A large number of annotations are used to strengthen the training model and optimize the recognition accuracy. The product quantity is obtained by the number of identified slots, and the slot number is obtained by the identified slot number. Then, the AI ​​module is used to parse and output the product quantity and wafer number.

[0062] Specifically, a long strip of reflective mirror is located near the back of the wafer box (i.e., the side facing away from the opening of the wafer box), facing the wafer box. Two high-precision cameras use mirror reflection to photograph the wafer placement inside the wafer box from the left and right sides of the wafer box. The obtained image is differentially processed to retain some similar pixels and remove pixels with obvious differences (the specific method is to use the pixel RGB three-channel algorithm of the image recognition software to set the brightness threshold. If the brightness is higher than the pixel threshold, the pixel difference is considered to be too large). It is best to set the Slot ID number on the mirror and also set some triangles or arrows to indicate the slot position of the wafer. The wafer on the imaging mirror corresponds one-to-one to the Slot ID mark, which helps to improve the AI ​​image recognition capability of the recognition model.

[0063] In addition, one side of the mirror surface of the long strip reflector is painted green, and the Slot ID number is set in the painted area. Other colors that are significantly different from the painted color are selected to increase the contrast between the wafer and the background color, further helping to improve AI image recognition capabilities.

[0064] In addition, the wafer box shipment inspection system provided in this embodiment also measures quality data, theoretical number of wafers, and theoretical outer box mass through an electronic scale, calculates theoretical data, and weights the AI ​​recognition quantity to improve AI accuracy.

[0065] This embodiment used the above-mentioned equipment and method to perform a six-month test verification on the No. 1 shipment inspection equipment in the production line, and found that customer complaints regarding the number of wafers, slot numbers, packaging materials, and internal desiccant in wafer box shipments were reduced to zero. Example 2

[0066] This embodiment is substantially the same as the first embodiment, with the main differences being:

[0067] One of the two symmetrical high-precision cameras is retained, and the images taken by this camera are used for training and shipment inspection.

[0068] During the aforementioned six-month period, parallel verification was conducted on the No. 2 shipment inspection equipment in the production line. It was found that there were still a small number of customer complaints regarding the number of wafers and slot numbers for products shipped from this machine, but the frequency of customer complaints was significantly lower than that of manual visual inspections. Example 3

[0069] This embodiment is substantially the same as the first embodiment, with the main differences being:

[0070] One side of the long reflector is not painted.

[0071] During the aforementioned six-month period, parallel verification was conducted on the No. 3 shipment inspection equipment in the production line. It was found that there were still a small number of customer complaints regarding the number of wafers and slot numbers for products shipped from this machine, but the frequency of customer complaints was significantly lower than that of manual visual inspections. Comparative Example 1

[0072] This comparative example is substantially the same as Example 1, with the main difference being that, instead of using a reflector, a single high-precision camera is used to directly capture the wafer placement image inside the wafer box for training and detection.

[0073] This implementation method is the technical solution adopted in the early research and development process of the present invention. Compared with manual visual inspection, customer complaints about the number of wafers and slot numbers will be improved to a certain extent, but the improvement is limited. The frequency of customer complaints is about 3 times that of Examples 2 and 3.

[0074] Based on the above embodiments and comparative examples, it can be clearly seen that the shipment inspection equipment and method provided by the embodiments of the present invention utilize mirror reflection imaging to obtain an inspection image of the wafer placed in the wafer box, thereby avoiding stray interference caused by direct light, and at the same time utilizing the positioning marks provided on the reflective surface to assist the image recognition model in identifying wafer graphics, thereby significantly improving the recognition speed and accuracy, and replacing manual visual inspection for shipment inspection, ultimately significantly improving the accuracy and efficiency of wafer box shipment inspection, and having broad application prospects.

[0075] It should be understood that the above embodiments are merely illustrative of the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent variations or modifications made in accordance with the spirit and substance of the present invention are intended to be encompassed within the scope of protection of the present invention.

Claims

1. A wafer box shipment inspection device, used to detect whether the contents in the wafer box are correctly placed, the contents including wafers, characterized in that: The wafer box shipment inspection equipment includes: a positioning module, a reflection module, an image acquisition module and an image processing module; The positioning module is used to locate the posture of the wafer box; the reflection module includes a long strip reflector provided next to the wafer box when the wafer box is positioned and a plurality of positioning marks provided on the reflection surface of the long strip reflector, the length direction of the long strip reflector is parallel to the axial direction of the wafer, and the positioning marks correspond to the accommodation positions of the wafers one by one; The image acquisition module at least captures the reflection image of the wafer in the reflector and the positioning mark to form an inspection image; the image processing module includes an image recognition model, which is used to identify whether the actual storage position of the wafer matches the target storage position based on the inspection image.

2. The wafer box shipment inspection equipment according to claim 1, characterized in that: The reflective surface is divided into rectangular heterochromatic areas and primary color areas, the boundary between the heterochromatic areas and the primary color areas is parallel to the length direction of the long strip reflector, and the color of the heterochromatic areas is in contrast to the background color of the wafer box; Observed from the shooting angle of the image acquisition module, the reflected image is at least formed in the primary color area; the positioning mark is set in the different color area, and the color of the positioning mark and the color of the different color area are contrasting colors.

3. The wafer box shipment inspection equipment according to claim 2, characterized in that: The color of the heterochromatic area includes any one of green, blue, red and yellow.

4. The wafer box shipment inspection device according to claim 1 or 2, characterized in that: The image acquisition module includes a first camera and a second camera, the first camera and the second camera are symmetrically arranged on both sides of the long strip reflector as the central axis, and the shooting angles of the first camera and the second camera are both directed towards the long strip reflector; When acquiring the inspection image, the first camera obtains a first image, the second camera obtains a second image, and a difference image between the first image and the second image is used as the inspection image, wherein the difference image removes the difference portion between the first image and the second image.

5. The wafer box shipment inspection equipment according to claim 1, characterized in that: The wafer box is wrapped with a packaging body, and the packaging body contains accessories, and the accessories include at least a desiccant. The wafer box loading and shipping inspection equipment also includes a weighing module, which is arranged at the positioning module and is used to weigh the total mass of the wafer box, packaging body and accessories.

6. A wafer box shipment detection method based on the wafer box shipment detection device according to any one of claims 1 to 5, characterized in that: include: Providing a plurality of training wafer boxes, wherein a plurality of wafers are arranged in a training arrangement state, and the training arrangement state is used as a true value label; Placing the training wafer box on a positioning module and obtaining a training image using an image acquisition module; Using the training images and the true value labels as a training set, updating the parameters of the initial image recognition model to obtain an image recognition model; Placing the wafer box to be inspected on the positioning module and acquiring an inspection image; The image recognition model is used to identify whether the actual accommodation position of the wafer matches the target accommodation position based on the inspection image.

7. The wafer box shipment detection method according to claim 6, characterized in that: The image acquisition module includes a first camera and a second camera, the first camera and the second camera are symmetrically arranged on both sides of the long strip reflector as the central axis, and the shooting angles of the first camera and the second camera are both directed towards the long strip reflector; The wafer box shipment inspection method specifically includes: Using the first camera and the second camera, a first image and a second image are acquired at symmetrical viewing angles with the long strip reflector as an axis; performing image difference processing on the first image and the second image to obtain a difference image, wherein the difference portion between the first image and the second image is removed from the difference image; During training, the differential image is used as the training image for parameter update, and during detection, the differential image is used as the test image for image recognition.

8. The wafer box shipment detection method according to claim 6, characterized in that: The wafer box is wrapped with a packaging body, and the packaging body contains accessories, and the accessories include at least a desiccant. The wafer box loading and shipping detection equipment also includes a weighing module, which is arranged at the positioning module and is used to weigh the total mass of the wafer box, the packaging body and the accessories; The wafer box shipment detection method further includes: Calculating a target mass based on the theoretical number of wafers in the wafer box, the theoretical mass of the wafer box, the theoretical mass of the packaging body, and the theoretical mass of the appendages; Weighing the actual total mass of the wafer box, packaging body and accessories; Based on the matching of the actual total mass and the target mass, it is determined whether the number of wafers in the wafer box, the selection of the packaging body and the presence of the accessories are normal.

9. The wafer box shipment detection method according to claim 6, characterized in that: The wafer box is wrapped with a packaging body, and the packaging body contains accessories, and the accessories include at least a desiccant. The wafer box loading and shipping detection equipment also includes a weighing module, which is arranged at the positioning module and is used to weigh the total mass of the wafer box, the packaging body and the accessories; The wafer box shipment detection method further includes: When any one of the actual accommodation position of the wafer, the number of wafers in the wafer box, the selection of the packaging body and the presence of the accessories is abnormal, the wafer box to be inspected is marked as a retained state.

10. Application of the wafer box shipment detection method according to any one of claims 6 to 9 in the field of wafer packaging detection.

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