Accurate motion control system for automatic die bonder

Abstract

The invention provides a precise motion control system for an automatic die bonder, which comprises an FPGA (Field Programmable Gate Array) connected with an upper computer, a data acquisition device connected with the FPGA and a motor control device connected with the FPGA, the FPGA is connected with a storage module, the storage module is used for storing and extracting data, the data acquisition device comprises a sensor module and an image acquisition module which are connected with the FPGA, and the motor control device is connected with the FPGA. A sensor module and an image acquisition module; the motor control device comprises a motor driving module connected with the FPGA; the FPGA presets a preset position and a preset motion trail of the mounting bonding head, controls the motor to move through the motor control device, is matched with the data acquisition device to acquire the motion trail of the motor, checks and compares the motion trail of the motor with the preset position and the preset motion trail and feeds back the motion trail to the FPGA, and the FPGA adjusts data in real time and adjusts and corrects the motion trail of the mounting bonding head; according to the invention, the die bonding precision and the production efficiency are improved, the intervention of manual operation is reduced, and the stability and reliability of long-term operation are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic die bonder control systems, and particularly to a precise motion control system for an automatic die bonder. Background Art

[0002] With the continuous development of conductor packaging technology, die bonding technology has been widely applied in the process of integrated circuit production. The die bonding process refers to the key step of precisely fixing a chip on a substrate, and its accuracy and stability directly affect the performance and reliability of the packaged product. As the core equipment to achieve this process, the performance and efficiency of the fully automatic die bonder are crucial to the automation level and product quality of the production line.

[0003] In the operation of a fully automatic die bonder, the precise positioning and motion control of the mounting head are key factors to ensure the die bonding quality. However, with long-term use of the equipment or environmental changes, the die bonder may have position deviations or errors, resulting in inaccurate alignment between the wafer and the substrate, thus affecting the die bonding quality. Therefore, the calibration of the die bonder and the accuracy and stability of the motion control system are particularly important.

[0004] Currently, for the motion control of the mounting head of a pick-and-place machine without image recognition and real-time control, it mainly relies on simple sensors and manual intervention. The motion process is usually manually adjusted by an operator, using basic photoelectric sensors and limit switches to detect the position information of the head. The sensor feedback helps to judge whether the suction nozzle correctly grasps the component, and ensures the accurate positions of each axis (X, Y, Z) through limit switches. The operator adjusts the machine according to these feedback data to ensure that the head can accurately place the component at the correct position on the PCB board. Due to the lack of advanced image recognition and automatic adjustment functions, the accuracy and speed are low, and frequent manual intervention and manual calibration are required.

[0005] In a high-precision and highly automated production environment, the traditional manual calibration method can no longer meet the requirements of modern production lines for accuracy, efficiency, and reliability. Therefore, developing an efficient, automated, and highly accurate calibration motion control system has become an urgent need to improve the performance and production efficiency of the die bonder. Summary of the Invention

[0006] Aiming at the above technical problems, the present invention provides a precise motion control system for an automatic die bonder, which improves the die bonding accuracy and production efficiency, reduces the intervention of manual operations, and ensures the stability and reliability of long-term operation.

[0007] To achieve the above object, the present invention provides the following technical solution: A precise motion control system for an automatic die bonder, including an FPGA connected to a host computer, a data acquisition device connected to the FPGA, and a motor control device connected to the FPGA. The FPGA is connected to a storage module, and the storage module is used for data storage and extraction. The data acquisition device includes a sensor module and an image acquisition module connected to the FPGA, the sensor module and the image acquisition module; The motor control device includes a motor drive module connected to the FPGA;

[0008] The FPGA presets the preset position and preset motion trajectory of the mounting head, and controls the motor to move through the motor control device. Cooperating with the data acquisition device to obtain the motor motion trajectory and compare it with the preset position and preset motion trajectory and feedback to the FPGA, the FPGA adjusts the data in real time and adjusts and corrects the motion trajectory of the mounting head.

[0009] Preferably, the FPGA and the motor drive module are connected through a DSP. The DSP is connected to the storage module. The DSP is used for digital signal processing, filtering, optimizing, and correcting the data of the sensor module and the image acquisition module; After the DSP obtains the preset position of the FPGA, it calculates the motion trajectory of the mounting head.

[0010] Preferably, the sensor module and the image acquisition module are connected to the FPGA through a data conversion module. The motor drive module is connected to the DSP through a data conversion module. And the output end of the motor drive module is connected to the motor, and the output end of the motor is connected to the data conversion module;

[0011] The data conversion module is used for conversion between different signal formats, and completes signal conversion, encoding, decoding, and data transmission.

[0012] Preferably, the FPGA is responsible for parallel processing of data. The position data of each substrate and the nozzle are calibrated through the host computer, and the real-time position information of the mounting head is obtained through the image processing module. A large amount of real-time data is sent to the storage module for data processing by the DSP module.

[0013] Preferably, the process of the FPGA adjusting and correcting the motion trajectory of the mounting head is as follows:

[0014] Step 1: The host computer sets the specific positions of the mounting substrate and nozzles of different models, and transmits the data to the FPGA;

[0015] Step 2: The FPGA sends the data to the DSP to obtain the preset position of the movement of the mounting head, calculates the motion trajectory of the mounting head, and generates a control signal through the data conversion module and sends it to the motor control module;

[0016] Step 3: The motor control module obtains the control signal and controls the motor to drive the mounting head to move;

[0017] Step 4: The image acquisition module and the sensor module acquire the position information and moving speed information of the bonding head in real time, and send them to the FPGA in real time. The FPGA transmits them to the storage module for storage;

[0018] Step 5: The DSP reads the motion information of the storage module in real time, compares it with the preset position and preset motion trajectory, generates a control signal in real time to send to the motor control module to control the motor, and corrects the deviation between the motion trajectory of the motor-controlled bonding head and the preset motion trajectory in real time.

[0019] Preferably, during the reading and comparison process by the DSP, the control signal of the motor is adjusted through the PID (Proportional-Integral-Differential) control algorithm.

[0020] Preferably, the sensor module is used to monitor the motion speed, displacement, and acceleration information of the bonding head, and feeds back to the FPGA in real time.

[0021] Preferably, the motor drive module is used to control the start-stop, rotation speed, and motion trajectory of the motor.

[0022] Preferably, the host computer is connected to the FPGA through the PCL bus, and is used for data interaction, data transmission, processing, and instruction issuance.

[0023] Advantages of the present invention: By presetting the motion position and preset motion trajectory of the bonding head, and monitoring the real-time motion position and motion trajectory of the bonding head in real time, and comparing with the preset data, the adjustment and correction of the motion position and motion trajectory of the bonding head are fed back and controlled in real time, improving the accuracy, stability, and efficiency of the automatic die bonder, and ensuring that the equipment can operate continuously and efficiently under rapidly changing production conditions. Description of the Drawings

[0024] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0025] Figure 1 It is a schematic structural diagram of the block diagram of the precise motion control system for an automatic die bonder proposed by the present invention.

[0026] Figure 2 It is a schematic structural diagram of the block diagram of the PID algorithm flow of the present invention.

[0027] Figure 3 It is a schematic structural diagram of the flow chart for adjusting and correcting the motion trajectory of the bonding head of the present invention. Detailed Embodiments

[0028] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments and drawings. However, the following embodiments are only the preferred embodiments of the present invention, not all of them. Based on the embodiments in the implementation manner, other embodiments obtained by those skilled in the art without creative efforts all fall within the protection scope of the present invention.

[0029] Please refer to Figures 1-3 , a precise motion control system for an automatic die bonder, including an FPGA connected to a host computer, a data acquisition device connected to the FPGA, and a motor control device connected to the FPGA. The FPGA is connected to a storage module, and the storage module is used for data storage and extraction. The data acquisition device includes a sensor module and an image acquisition module connected to the FPGA, and the sensor module and the image acquisition module; the motor control device includes a motor drive module connected to the FPGA.

[0030] The FPGA presets the preset position and preset motion trajectory of the bonding head, and controls the motor to move through the motor control device. The data acquisition device is used to obtain the motor motion trajectory and compare it with the preset position and preset motion trajectory and feedback to the FPGA. The FPGA adjusts the data in real time and corrects the motion trajectory of the bonding head.

[0031] The FPGA is connected to the input and output ends of the data conversion module for data processing. The data conversion module is connected to the input and output ends of the image acquisition module to decode the transmitted data information. The input and output ends of the sensor module are connected to the data conversion module to monitor the speed of the bonding head movement. The system monitors the position and state of the bonding head in real time through the sensor and image acquisition modules, and transmits the data to the FPGA and DSP for processing. The FPGA is responsible for processing data streams and control signals, and the DSP adjusts the motion trajectory of the bonding head according to real-time data analysis. Through closed-loop control, the system can dynamically correct motion deviations, ensure high-precision die bonding operations, improve die bonding accuracy and production efficiency, reduce manual operation intervention, and ensure the stability and reliability of long-term operation.

[0032] The FPGA and the motor drive module are connected through the DSP. The DSP is connected to the storage module. The DSP is used for digital signal processing, filtering, optimizing, and correcting the data of the sensor module and the image acquisition module; after the DSP obtains the preset position of the FPGA, it calculates the motion trajectory of the bonding head.

[0033] The DSP uses the MS28335 chip which integrates the common rotational speed measurement circuit inside the chip to form the enhanced quadrature encoder module eQEP. When working in the quadrature counting mode, the quadrature decoding unit can perform 4-fold frequency processing on the quadrature signal to provide the clock frequency for the counting of the position counter register. The FPGA uses XCKU040, providing powerful parallel computing capabilities, low-latency real-time processing, high-bandwidth data transmission, flexible customized design, and efficient hardware acceleration functions. The storage module uses MT60B256M32JHA-062. The data conversion module includes an analog-to-digital conversion module, a digital-to-analog conversion module, and a level conversion module. The analog-to-digital conversion module uses the AD7680 chip, the digital-to-analog conversion module uses the AD9747 chip, the level conversion uses the TXB0108 chip, the image processing module uses the IMX689, the sensor module uses the Gocator2340, and the motor drive module uses the tmc2240 chip.

[0034] The sensor module and the image acquisition module are connected to the FPGA through the data conversion module. The motor drive module is connected to the DSP through the data conversion module, and the output end of the motor drive module is connected to the motor, and the output end of the motor is connected to the data conversion module;

[0035] The data conversion module is used for the conversion between different signal formats to complete the conversion, encoding, decoding, and data transmission of the signals.

[0036] The FPGA is responsible for the parallel processing of data. The position data of each substrate and nozzle is calibrated through the host computer. The real-time position information of the placement head is obtained through the image processing module, and a large amount of real-time data is sent to the storage module for data processing by the DSP module.

[0037] The process of the FPGA adjusting and correcting the movement trajectory of the placement head is as follows:

[0038] Step 1: The host computer sets the specific positions of the mounting substrate and different types of nozzles, and transmits the data to the FPGA; the host computer is connected to the FPGA through the PCL bus for data interaction, data transmission, processing, and instruction issuance; the host computer generally is responsible for operating and monitoring the entire system, including substrate placement, nozzle type selection, motion trajectory planning, etc. It usually sets these parameters through a graphical interface or a control panel, and configures the position of the mounting substrate and the type of nozzle according to different production requirements. PCL (Parallel Communication Line) is the bus used for communication between the host computer and the FPGA. Its working principle is to transmit multiple data channels simultaneously to improve the data transmission rate. At this time, the PCL bus can transmit information such as the preset substrate position and nozzle type to the FPGA. The FPGA receives and stores these position information and uses it as data for subsequent motion control and calculation. The FPGA is used to receive the data transmitted by the host computer and is responsible for further data processing or passing it to the DSP. Its advantage is strong parallel processing ability, and it can efficiently process a large number of real-time control signals.

[0039] Step 2: The FPGA sends the data to the DSP to obtain the preset position of the mounting bonding head movement, calculates the motion trajectory of the mounting bonding head, and generates control signals through the data conversion module to send to the motor control module; the FPGA and the DSP communicate through the AXI bus to obtain the preset position of the mounting bonding head movement, the DSP calculates the motion trajectory, generates the control signal of the motor drive chip through the data conversion module to drive the motor to start moving, thereby controlling the movement of the mounting bonding head. The AXI is used to connect the FPGA and the DSP, and is suitable for processing real-time control signals and complex data exchange. The FPGA transmits the data set by the host computer (substrate position, nozzle type, etc.) to the DSP through the AXI bus, and the DSP calculates the target motion trajectory of the mounting bonding head based on these input information. The core task of the DSP is to calculate the real-time motion trajectory according to the received position information. According to different control requirements (such as acceleration, speed limit, etc.), the DSP calculates the path of the mounting bonding head from the current position to the target position and generates control signals. The data conversion module is responsible for converting the control signals calculated by the DSP (such as voltage, current control signals) into a form suitable for the motor drive chip. These signals are sent to the motor driver, and the driver adjusts the speed, acceleration, and direction of the motor according to the control signals. The motor drive chip controls the servo motor to drive the mounting bonding head to move precisely along the calculated trajectory.

[0040] Step 3: The motor control module obtains the control signal and controls the motor to drive the mounting bonding head to move.

[0041] Step 4: The image acquisition module and the sensor module continuously obtain the position information and moving speed information of the placement head in real time, and send them to the FPGA in real time. The FPGA then transmits them to the storage module for storage. After the placement head starts to move, the image acquisition module and the sensor module start to work, continuously acquiring the position information of the placement head and information such as the moving speed of the placement head, and sending them to the FPGA in real time through the data conversion module. After receiving the data, the FPGA immediately transmits it to the storage module. The image acquisition module monitors the movement of the placement head in real time through a camera or a vision sensor, obtaining the current position, posture of the placement head, and the deviation from the target position. This information can be used to correct or modify the movement trajectory of the placement head. The sensor module (used to measure dynamic information such as the moving speed and acceleration of the placement head to ensure the stability and accuracy of the movement). The image acquisition module and the sensor module continuously acquire the real-time data of the placement head. After being processed by the conversion module, the data is transmitted to the FPGA. The data conversion module includes an A / D converter, a signal processing module, etc., in order to convert the analog signals of the sensor and the camera into digital signals;

[0042] After receiving this data, the FPGA immediately transmits it to the storage module. The storage module is usually used to temporarily store this data for subsequent calculation and analysis. It is possible to consider using a cache or external storage to store the data.

[0043] Step 5: The DSP reads the movement information of the storage module in real time, compares it with the preset position and preset movement trajectory, generates a control signal in real time to send to the motor control module to control the motor, and corrects the deviation between the movement trajectory of the motor-controlled placement head and the preset movement trajectory in real time.

[0044] The DSP reads the actual movement data of the placement head (such as the current position information, speed, etc.) from the storage module in real time, and compares it with the initially set target position and expected speed. Through this comparison, the DSP can judge the deviation between the current movement state and the preset target. The magnitude and direction of the deviation will affect subsequent control decisions. The DSP will continue to calculate and generate a new control signal to reduce the deviation and ensure that the placement head moves along the expected path.

[0045] During the reading and comparison process, the DSP adjusts the control signal of the motor through the PID (Proportional-Integral-Derivative) control algorithm.

[0046] At the beginning of the die bonding process, the DSP first reads the target position of the placement bonding head and generates a preliminary control instruction based on the error between the target position and the current position, and starts the movement of the placement bonding head. As the placement bonding head starts to move, the DSP obtains the current position and current speed information of the placement bonding head from the storage module in real time, and continuously adjusts the error during the movement in combination with the PID algorithm (Proportional, Integral, Derivative control). The PID algorithm calculates the precise adjustment amount according to the gap (error) between the current position and the target position, the accumulation of errors (integral term), and the error change rate (derivative term) as Figure 2 shown, so as to optimize the motor drive signal, ensure that the placement bonding head moves smoothly and with high precision according to the predetermined trajectory and speed, and avoid excessive oscillation or deviation from the target position. This closed-loop control system can continuously compensate for the dynamic error during the movement process to achieve precise positioning and stable die bonding operation.

[0047] The sensor module is used to monitor the movement speed, displacement, and acceleration information of the placement bonding head and feedback it to the FPGA in real time.

[0048] The motor drive module is used to control the start / stop, rotation speed, and movement trajectory of the motor.

[0049] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A precise motion control system for an automatic die bonder, comprising an FPGA connected to a host computer, a data acquisition device connected to the FPGA, and a motor control device connected to the FPGA. The FPGA is connected to a storage module, and the storage module is used for data storage and extraction. It is characterized in that, The data acquisition device includes a sensor module and an image acquisition module connected to the FPGA, the sensor module and the image acquisition module; the motor control device includes a motor drive module connected to the FPGA; The FPGA presets the preset position and preset motion trajectory of the mounting bonding head, and controls the motor to move through the motor control device, cooperates with the data acquisition device to obtain the motor motion trajectory and compares it with the preset position and preset motion trajectory and feeds back to the FPGA. The FPGA adjusts the data in real time and corrects the motion trajectory of the mounting bonding head.

2. The precise motion control system for an automatic die bonder according to claim 1, wherein: The FPGA and the motor drive module are connected through a DSP. The DSP is connected to the storage module. The DSP is used for digital signal processing, filtering, optimizing, and correcting the data of the sensor module and the image acquisition module; after obtaining the preset position of the FPGA, the DSP calculates the motion trajectory of the mounting bonding head.

3. The precise motion control system for an automatic die bonder according to claim 2, wherein: The sensor module and the image acquisition module are connected to the FPGA through a data conversion module. The motor drive module is connected to the DSP through a data conversion module, and the output end of the motor drive module is connected to the motor, and the output end of the motor is connected to the data conversion module; The data conversion module is used for conversion between different signal formats, and completes signal conversion, encoding, decoding, and data transmission.

4. The precise motion control system for an automatic die bonder according to claim 3, wherein: The FPGA is responsible for parallel processing of data, calibrates the position data of each substrate and nozzle through the host computer, obtains the real-time position information of the mounting bonding head through the image processing module, and sends a large amount of real-time data to the storage module for data processing by the DSP module.

5. The precise motion control system for an automatic die bonder according to claim 4, characterized in that: The process of the FPGA adjusting and correcting the motion trajectory of the mounting bonding head is as follows: Step 1: The host computer sets the specific positions of the mounting substrate and nozzles of different models, and transmits the data to the FPGA; Step 2: The FPGA sends the data to the DSP, obtains the preset position of the movement of the mounting bonding head, calculates the motion trajectory of the mounting bonding head, and generates a control signal through the data conversion module and sends it to the motor control module; Step 3: The motor control module obtains the control signal and controls the motor to drive the mounting bonding head to move; Step 4: The image acquisition module and the sensor module obtain the position information and moving speed information of the mounting bonding head in real time, and send them to the FPGA in real time. The FPGA transmits them to the storage module for storage; Step 5: The DSP reads the motion information of the storage module in real time and compares it with the preset position and preset motion trajectory, generates a control signal in real time and sends it to the motor control module to control the motor, and corrects the deviation between the motion trajectory of the motor controlling the mounting bonding head and the preset motion trajectory in real time.

6. The precise motion control system for an automatic die bonder according to claim 5, characterized in that: During the reading and comparison process, the DSP adjusts the control signal of the motor through the PID (Proportional-Integral-Derivative) control algorithm.

7. The precise motion control system for an automatic die bonder according to claim 1, characterized in that: The sensor module is used to monitor the motion speed, displacement, and acceleration information of the mounting bonding head and feedback it to the FPGA in real time.

8. The precise motion control system for an automatic die bonder according to claim 1, characterized in that: The motor drive module is used to control the start, stop, rotation speed, and motion trajectory of the motor.

9. The precise motion control system for an automatic die bonder according to claim 1, characterized in that: The host computer is connected to the FPGA through the PCL bus, used for data interaction, data transmission, processing, and instruction issuance.

Images