Modular display structure based on tool-free disassembly and material traceability and disassembly method thereof

Abstract

The invention discloses a modular display structure based on tool-free disassembly and material traceability and a disassembly method thereof, and belongs to the technical field of green manufacturing of electronic equipment. The display structure comprises a four-stage gelling-free system and a material identification system, wherein the four-stage gelling-free system comprises panel glass, a metal frame, a circuit board module, a cooling fin, a main body frame and a plastic shell; according to the displayer structure, through a four-stage gelling-free system composed of magnetic attraction, the shape memory alloy, the push-pull type sliding rail mechanism and the sound wave welding weakening line, rapid separation of all components can be achieved, the disassembling difficulty is lowered, and the disassembling efficiency is improved; and three layers of plastic shells made of different materials are adopted, so that lossless separation in an alkaline solution can be realized, the material recovery rate is improved, and pollution is reduced.

Description

Technical Field

[0001] The present application relates to a modular display structure based on tool - free disassembly and material traceability and a disassembly method thereof, belonging to the technical field of green manufacturing of electronic devices. Background Art

[0002] Traditional display manufacturing widely uses screw fixation, glue bonding, and welding processes, resulting in the following problems:

[0003] 1. Low disassembly efficiency: Special tools (such as hot air guns, suction cups, etc.) are required, and the average disassembly time exceeds 3 hours (data source: "2023 Electronic Waste Recycling White Paper").

[0004] 2. Serious material pollution: The mixed bonding of metals, plastics, and glass results in insufficient recycling purity (plastic recycling rate < 70%, precious metal recycling rate < 50%).

[0005] 3. Lack of recycling information: There is a lack of material composition identification, and the labor sorting cost accounts for more than 45% of the total recycling cost.

[0006] For example, there is an existing modular display. Since it uses screws to connect the frame and the panel, it needs to be separated destructively during disassembly, resulting in serious material loss and reducing the recycling rate of the display. To solve the problem of low disassembly efficiency, there is a cooperation of spring clips, but the problem of rapid separation of the circuit board and the power module has not been solved; there is an existing environmentally friendly display that uses degradable glue for connection, but due to its unoptimized structural design, chemical treatment is still required to separate materials after disassembly, resulting in a complex recycling process and high environmental pollution.

[0007] Therefore, there is currently a lack of a display structure and a corresponding disassembly method with high disassembly efficiency, low pollution, simple process, and high material recycling rate. Summary of the Invention

[0008] To solve the above problems, the present application proposes a modular display structure based on tool - free disassembly and material traceability. In this display structure, a four - level glue - free system composed of magnetic attraction, shape - memory alloy, push - pull slide rail mechanism, and acoustic welding weakening line can achieve the rapid separation of each component, reduce the disassembly difficulty, and improve the disassembly efficiency; and a plastic shell with three different materials can be separated without damage in an alkaline solution, improving the material recycling rate and reducing pollution.

[0009] According to one aspect of the present application, there is provided a modular display structure based on tool - free disassembly and material traceability, including:

[0010] A four - level glue - free system, the four - level glue - free system includes panel glass, metal frame, circuit board module, heat sink, main frame, and plastic shell;

[0011] The panel glass and the metal frame are magnetically levitated and coupled through a Halbach magnetic array;

[0012] The circuit board module and the heat sink are fixed by a shape memory alloy buckle, and the phase change trigger temperature of the shape memory alloy buckle is 45°C ± 3°C;

[0013] The power supply module and the main body frame are connected by a push-pull slide rail mechanism, and a self-powered-off safety lock is built in the push-pull slide rail mechanism;

[0014] The plastic shell is fixed by a sonic welding weakening line. The plastic shell includes a PC layer, a PLA layer, and an ABS layer from the inside out, and the PLA layer can be dissolved in an alkaline solution;

[0015] A material identification system, the material identification system includes an NFC chip, and the NFC chip is embedded in the circuit board module and the power supply module. The NFC chip is used to store material components, disassembly guide video links, and recycling codes.

[0016] In the above four-level glue-free system, screw fixation, glue bonding, and welding processes are not used. Instead, it is composed of magnetic attraction, shape memory alloy, push-pull slide rail mechanism, and sonic welding weakening line, which not only improves the assembly efficiency of the display structure, but also improves the disassembly efficiency during the recycling of the display structure. At the same time, it can also achieve stable connection between components and extend the service life of the display structure.

[0017] Optionally, the magnetic flux density of the Halbach magnetic array is 0.8 - 1.2T, and the magnetic pole gap is 0.5 - 1mm.

[0018] Preferably, the Halbach magnetic array is composed of neodymium iron boron magnets, its magnetic field strength gradient ≥ 15%, and the N / S poles of adjacent magnetic poles are arranged in a 45° staggered pattern.

[0019] Optionally, the composition of the shape memory alloy buckle consists of Ni 50.2wt%, Ti 48.5wt%, and Cu 1.3wt%. The shape memory alloy buckle is obtained after melting, hot rolling, vacuum annealing, and water quenching treatments.

[0020] Preferably, the temperature of the vacuum annealing is 850°C and the time is 1h.

[0021] Optionally, the welding frequency of the sonic welding weakening line is 28kHz, the line width is 0.1 - 0.3mm, and the spacing is 1.5 - 2mm;

[0022] The melting depth of the sonic welding weakening line is 30% - 40% of the thickness of the plastic shell, and the surface roughness Ra of the welding area ≤ 3.2μm.

[0023] Optionally, a mortise and tenon connection interface is provided on the plastic housing, and the tolerance of the mortise and tenon connection interface is ≤0.05 mm;

[0024] A power slot opening is provided on the plastic housing for installing a power slot.

[0025] Specifically, the insertion and extraction life of the power slot is ≥5000 times.

[0026] Optionally, the NFC chip further includes a self-destruction function and an energy harvesting module, and the energy harvesting module obtains electric energy from ambient Wi-Fi signals through electromagnetic induction.

[0027] Optionally, the push-pull slide rail mechanism further includes a two-way damper and an anti-misoperation locking device. The resistance value of the two-way damper is 5-15 N, and the anti-misoperation locking device needs to press both side buttons simultaneously to unlock.

[0028] Optionally, the material identification system further includes color-coded identification, and the color-coded identification at least includes a red identification and a green identification. Among them, the components with red identification are components containing precious metals and with a recycling purity requirement of ≥95%, and the components with green identification are single plastic components that can be directly crushed and recycled.

[0029] Optionally, the material identification system further includes a cloud data linkage module, and the cloud data linkage module is configured to automatically upload material data to the recycling plant database after scanning the NFC chip and generate a dynamic disassembly work order.

[0030] Optionally, the panel glass is chemically strengthened glass, with a surface hardness of ≥7H, a thickness of 0.5-1.1 mm, and an edge chamfer angle of 30°±2°.

[0031] Optionally, the thickness of the ABS layer is 0.5-0.8 mm, and the surface hardness is ≥HB65. This layer of material mainly provides wear protection.

[0032] Optionally, the thickness of the PLA layer is 0.1-0.2 mm and it completely dissolves within 5 minutes in an alkaline solution (60 °C) with pH≥12.

[0033] Optionally, the thickness of the PC layer is 0.3-0.5 mm, it is heat-resistant (≤120 °C), and the impact resistance is ≥60 kJ / m 2 。

[0034] According to another aspect of the present application, a disassembly method for the modular display structure based on tool-free disassembly and material traceability described in any one of the above is provided, including the following steps:

[0035] (1) Pretreatment stage: Immerse the entire display structure in an alkaline solution with pH ≥ 12, maintain the temperature at 60°C ± 2°C for 5 - 8 min to dissolve the PLA layer;

[0036] (2) Physical disassembly stage: Manually separate the plastic shell, peel off the ABS layer and the PC layer, control the temperature at 45°C ± 3°C to release the shape memory alloy buckle, separate the circuit board module from the heat sink, slide the power module along the slide rail direction of the push - pull slide rail mechanism to the disengaged position, and magnetically separate the panel glass;

[0037] (3) Material recycling stage: Classify and put each component, and components including precious metals are regenerated through electrolytic purification.

[0038] In the above treatment steps, by first treating the entire display with an alkaline solution to dissolve the PLA layer, it is convenient for the disassembly of the remaining layers, improving the disassembly efficiency and material recovery rate of the display structure.

[0039] Optionally, the alkaline solution is a mixed solution of sodium hydroxide and sodium silicate, the concentration of sodium hydroxide is 2.8 - 3.2 mol / L, and the concentration of sodium silicate is 0.4 - 0.5 mol / L.

[0040] The addition of sodium silicate in the above alkaline solution can hydrolyze into silicate ions and hydroxide ions. On the one hand, the hydroxide ions can increase the concentration of hydroxide ions in the alkaline solution, enhance the alkalinity, thus accelerating the hydrolysis reaction rate of PLA, accelerating the degradation of PLA, and improving the disassembly rate; on the other hand, the silicate ions can react with metal ions on the metal surface to form a dense and protective silicate film. This film can isolate the metal surface from the corrosive alkaline solution, preventing corrosive substances such as hydroxide ions and dissolved oxygen in the solution from directly contacting the metal, thereby slowing down the corrosion rate of the metal to improve the recovery rate of the metal in the display structure.

[0041] Optionally, the pH of the alkaline solution is 12.5 ± 0.2.

[0042] Optionally, the cathode of the electrolytic purification process uses a titanium mesh, the anode uses the metal component to be recycled, and the electrolyte is a complex solution of silver nitrate and potassium cyanide.

[0043] Preferably, the concentration of silver nitrate in the electrolyte is 0.1 - 0.5 mol / L, and the concentration of potassium cyanide is 0.05 - 0.1 mol / L.

[0044] According to another aspect of the present application, there is provided an application of the modular display structure described in any one of the above, and the application includes NFC chip data supporting blockchain evidence storage.

[0045] Optionally, the application includes a metal frame compatible AR glasses interaction protocol to implement augmented reality disassembly guidance.

[0046] The beneficial effects that this application can produce include but are not limited to:

[0047] 1. For the modular display structure based on tool - free disassembly and material traceability provided by this application, the four - level non - adhesive connection system consists of magnetic attraction, shape memory alloy, push - pull slide rail mechanism and sonic welding weakening line. During disassembly, components can be quickly separated and damage to components can be reduced, improving disassembly efficiency and material recovery rate while reducing disassembly difficulty.

[0048] 2. For the modular display structure based on tool - free disassembly and material traceability provided by this application, the plastic shell is composed of three different materials. It not only ensures the usage requirements such as the strength of the plastic shell, but also can achieve delamination and disassembly of the plastic shell using an alkaline solution during separation, which can also improve disassembly efficiency and material recovery rate and reduce pollution.

[0049] 3. For the modular display structure based on tool - free disassembly and material traceability provided by this application, in the material identification system, through NFC chips and color coding, material composition traceability and automated disassembly guidance are achieved, further improving the disassembly efficiency of this display.

[0050] 4. The disassembly method of the display structure provided by this application has the advantages of simple disassembly process, high disassembly efficiency, high material recovery rate and low environmental pollution. The recycled materials can be reused, reducing the manufacturing cost of the display and being suitable for industrial promotion and use.

[0051] 5. The display structure and its disassembly method provided by this application have good industrial application prospects. In the field of consumer electronics, it is suitable for the environmental protection design of products such as laptops and smart TVs; in the field of medical equipment, it can meet the non - contact disassembly requirements in the sterile environment of the operating room.

[0052] 6. The display structure and its disassembly method provided by this application can be docked with the recycling manufacturer database to realize the full - life - cycle management of electronic waste and have good economic circulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] The drawings described herein are used to provide a further understanding of this application, and constitute a part of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application. In the drawings:

[0054] Figure 1 is the architecture diagram of the four - level non - adhesive system related to Embodiment 1 of this application;

[0055] Figure 2This is the magnetic suspension coupling profile diagram involved in Embodiment 1 of the present application;

[0056] Figure 3 This is the working principle diagram of the shape memory alloy buckle involved in Embodiment 1 of the present application;

[0057] Figure 4 This is the NFC chip data interaction flowchart involved in Embodiment 1 of the present application. Detailed implementation manners

[0058] In order to more clearly illustrate the overall concept of the present application, the following will be described in detail by way of examples in combination with the drawings in the specification.

[0059] In order to be able to more clearly understand the above-mentioned objects, features and advantages of the present application, the present application will be further described in detail below in combination with the drawings and specific implementation manners. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0060] In the following description, many specific details are set forth in order to fully understand the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present application is not limited by the specific embodiments disclosed below.

[0061] In addition, in the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0062] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0063] In this application, unless otherwise clearly specified or limited, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0064] In this application, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0065] Embodiment 1

[0066] Reference Figures 1-4 , the embodiments of this application disclose a modular display structure based on tool - free disassembly and material traceability, which is characterized by including:

[0067] A four - level glue - free system, and the four - level glue - free system includes panel glass, a metal frame, a circuit board module, a heat sink, a main frame, and a plastic shell;

[0068] The panel glass and the metal frame achieve magnetic suspension coupling through a Halbach magnetic array;

[0069] The circuit board module and the heat sink are fixed by a shape - memory alloy buckle, and the phase - change trigger temperature of the shape - memory alloy buckle is 45°C ± 3°C;

[0070] The power module and the main frame are connected through a push - pull slide - rail mechanism, and a self - power - off safety lock is built in the push - pull slide - rail mechanism;

[0071] The plastic shell is fixed through a sonic welding weakening line. The plastic shell includes a PC layer, a PLA layer, and an ABS layer from the inside outwards, and the PLA layer can be dissolved in an alkaline solution;

[0072] Material identification system, the material identification system includes an NFC chip, the NFC chip is embedded in the circuit board module and the power module, and the NFC chip is used to store material composition, disassembly guide video link and recycling code.

[0073] Reference Figure 1 , in the above four-level non-glue system, screw fixation, glue bonding and welding processes are not used, but are composed of magnetic attraction, shape memory alloy, push-pull slide rail mechanism and sonic welding weakening line, which not only improves the assembly efficiency of the display structure, but also improves the disassembly efficiency of the display structure during recycling, and at the same time can achieve stable connection between various components and extend the service life of the display structure.

[0074] Specifically, reference Figure 2 , the materials used for magnetic levitation coupling are neodymium iron boron magnets (N52 grade) to couple the aluminum alloy frame (6061-T6) and the panel glass. Process: The magnet is embedded in injection molding, smelting, hot rolling, with a tolerance control of ±0.1mm, and the accuracy of the magnetic array magnetization direction is ≤1°.

[0075] Specifically, the NFC chip data interaction flowchart reference Figure 4 , which includes a complete link of code scanning, data uploading, cloud matching, and disassembly instruction issuance.

[0076] As an implementation, the magnetic flux density of the Halbach magnetic array is 0.8 - 1.2T, and the magnetic pole gap is 0.5 - 1mm.

[0077] For the above magnetic flux density, it can withstand a 30G acceleration vibration (simulating the transportation environment, ASTM D999), the displacement is ≤0.1mm, and the connection is stable; the magnetic flux density in the central area of 1.05T can provide the main adsorption force, and the magnetic flux density in the edge area is ≤5mT to form a low-resistance separation area; it can be disassembled with 50 - 80N (within the human-operable range).

[0078] As an implementation, the Halbach magnetic array is composed of neodymium iron boron magnets, and its magnetic field strength gradient ≥15%, and the N / S poles of adjacent magnetic poles are arranged in a 45° staggered pattern.

[0079] When the gradient ≥15%, the magnetic lines of force form a rapid attenuation area at the interface between the panel glass and the metal frame, preventing accidental adsorption (such as metal debris) caused by magnetic field diffusion. The high-gradient magnetic field forms a low magnetic flux area (<5mT) at the edge, guiding the disassembly tool to cut in from the edge, and the prying force ≤10N (meeting the ergonomic limit).

[0080] If the magnetic field strength gradient < 15%, the edge magnetic field leakage increases (> 10 mT), making it easy to adsorb surrounding metal foreign objects, resulting in the need for additional cleaning steps during disassembly. If the N / S poles of adjacent magnetic poles are not arranged in a 45° staggered pattern, the magnetic leakage increases, leading to the risk of electromagnetic interference (EMI), which may affect the internal circuits of the display (such as the T-CON module).

[0081] As an implementation, the composition of the shape memory alloy buckle consists of 50.2 wt% Ni, 48.5 wt% Ti, and 1.3 wt% Cu. The shape memory alloy buckle is obtained after melting, hot rolling, vacuum annealing, and water quenching.

[0082] The above composition of the shape memory alloy buckle can control its phase change trigger temperature to be 45°C ± 3°C, and the buckle can be released only by soaking in hot water. This temperature is not only beneficial to the disassembly of the display structure but also will not cause self-disassembly at room temperature and during the use of the display structure, improving the safety of use of the display structure. If the phase change trigger temperature of the shape memory alloy buckle is lower than 45°C ± 3°C, there may be a situation of detachment during the use of the display structure, reducing the safety of use of the display structure. If the phase change trigger temperature of the shape memory alloy buckle is higher than 45°C ± 3°C, a higher temperature needs to be controlled during the disassembly process to achieve disassembly, which may cause damage to other components and reduce the material recovery rate.

[0083] Specifically, Figure 3 is the working principle diagram of the shape memory alloy buckle. The shape memory alloy buckle undergoes 500 thermal cycles and then the deformation recovery rate ≥ 99.2%.

[0084] As an implementation, the temperature of vacuum annealing is 850°C and the time is 1 h.

[0085] Under the above composition and material, vacuum annealing and water quenching treatments are carried out on the shape memory alloy buckle after melting and hot rolling, which can improve the microstructure of the shape memory alloy buckle, accurately control the phase change temperature within the range of 45°C ± 3°C, and improve the mechanical strength and weather resistance of the shape memory alloy buckle, extending its service life.

[0086] As an implementation, the shape memory alloy buckle is subjected to surface passivation treatment after water quenching. This treatment can improve the corrosion resistance of the shape memory alloy buckle, thereby improving the recovery rate of metal materials.

[0087] As an implementation, the welding frequency of the ultrasonic welding weakening line is 26.6 - 29.4 kHz, the amplitude is 50 μm, the line width is 0.1 - 0.3 mm, and the spacing is 1.5 - 2 mm; the melting depth of the ultrasonic welding weakening line is 30% - 40% of the thickness of the plastic shell, and the surface roughness Ra of the welding area ≤ 3.2 μm.

[0088] As an implementation manner, the welding pressure of sonic welding is 200 N, the duration is 0.5 s, and the cooling time is 1.2 s.

[0089] Under the above settings, it is possible to improve the welding strength of the plastic housing while minimizing the usage of weakening lines as much as possible, which not only reduces the manufacturing cost of the display structure but also improves the appearance aesthetics of the display structure. The above frequency, line width, and spacing can ensure the welding quality and efficiency. If the frequency is too high, high frequency will cause local overheating (>150 °C), and the plastic will carbonize. If the frequency is too low, the energy will be insufficient, and the melting depth will be <20%. The weakening line will fail. If the line width is too narrow, the processing accuracy requirements will increase, resulting in a decrease in the yield rate. If the line width is too wide, the breaking force will increase, and tool assistance is required for disassembly. If the spacing is too wide, the crack propagation path will shift, and the amount of fracture debris will increase.

[0090] The melting depth and surface roughness of the above sonic welding weakening line can simultaneously achieve the three goals of low disassembly force, high recovery rate, and low-cost manufacturing. If the melting depth is too deep, the substrate will be thermally damaged, and the impact resistance will decrease. If the melting depth is too wide, the weakening line will be discontinuous, and multiple bends are required during disassembly. If the surface roughness is too large, the fracture burrs will cause metal-plastic mixing.

[0091] As an implementation manner, mortise and tenon connection interfaces are provided on the plastic housing, and the tolerance of the mortise and tenon connection interfaces is ≤0.05 mm;

[0092] A power socket opening is provided on the plastic housing for installing a power socket.

[0093] The plastic housing is assembled from at least two plastic components through sonic welding weakening lines. Mortise and tenon connection interfaces are provided at the joints of the plastic components, which can achieve the preliminary connection and welding positioning of the plastic components, improve the connection stability of the plastic housing, and thus extend the service life of the display structure.

[0094] Specifically, at least four mortise and tenon connection interfaces are provided at the joints of the plastic components and are evenly arranged along the circumference of the plastic components. The mortise and tenon connection interface means that a connection post is provided on the connection surface of one plastic component, and a slot is provided on the connection surface of the other plastic component. The connection post and the slot cooperate to form a mortise and tenon connection interface. Setting the tolerance of the mortise and tenon connection interface to ≤0.05 mm can improve the connection accuracy and structural strength, ensure the welding quality, improve the production efficiency, and adapt to thermal expansion and contraction, thus comprehensively improving the performance and reliability of the plastic housing.

[0095] Specifically, the insertion and extraction life of the power socket is ≥5000 times.

[0096] As an implementation, the NFC chip further includes a self-destruction function and an energy harvesting module. The energy harvesting module obtains electrical energy from ambient Wi-Fi signals through electromagnetic induction.

[0097] The above self-destruction function setting can prevent data leakage, enhance anti-tampering ability, and improve device security, thus effectively protecting user privacy and device integrity. The energy harvesting module can obtain electrical energy, thereby reducing the power supply loss of the display structure, and being more energy-saving and environmentally friendly.

[0098] As an implementation, the push-pull slide rail mechanism further includes a two-way damper and an anti-misoperation locking device. The resistance value of the two-way damper is 5 - 15 N, and the anti-misoperation locking device needs to press both side buttons simultaneously to unlock.

[0099] The above two-way damper is used to control the movement resistance of the push-pull slide rail mechanism, enabling it to move smoothly and slowly during pushing and pulling, avoiding shaking or collision caused by excessive force or inertia resulting in rapid sliding of the slide rail mechanism, thereby improving the stability and comfort of use. The anti-misoperation locking device can prevent misoperation and is used to control the movement resistance of the push-pull slide rail mechanism, enabling it to move smoothly and slowly during pushing and pulling, avoiding shaking or collision caused by excessive force or inertia resulting in rapid sliding of the slide rail mechanism, thereby improving the stability and comfort of use.

[0100] As an implementation, the material identification system further includes color-coded identification. The color-coded identification at least includes a red identification and a green identification. Among them, the components with red identification are components containing precious metals and with a recycling purity requirement of ≥95%, and the components with green identification are single plastic components that can be directly shredded and recycled.

[0101] Normally, the identification in the display structure is to directly label text or symbols on the components. This application innovatively uses red identification and green identification to identify different components, which can quickly distinguish different types of components, facilitate taking corresponding treatment measures during production, maintenance, or recycling, improve the recyclability, environmental friendliness, and production and maintenance efficiency of the display, and at the same time help reduce production costs and improve the user experience of the product, enhancing the brand image and market competitiveness.

[0102] As an implementation, the material identification system further includes a cloud data linkage module. The cloud data linkage module is configured to automatically upload material data to the recycling plant database after scanning the NFC chip and generate a dynamic disassembly work order. When the display needs to be recycled, the recycling plant staff uses a device with a scanning function to scan the NFC chip on the display. After the device reads information such as the unique identifier in the chip, it sends this information to the cloud data linkage module through the network. After receiving the information, this module retrieves the material data corresponding to the NFC chip from the database, such as detailed information about the materials of each component, the situation of containing precious metals, and whether it can be directly recycled. Then, the cloud data linkage module uploads this material data to the recycling plant's database and generates a dynamic disassembly work order containing detailed information such as disassembly steps, precautions, and required tools for the recycling plant staff to refer to and execute.

[0103] The setting of this cloud data linkage module can realize the automation, informatization, and intelligence of the display recycling process, improve the recycling efficiency and accuracy, reduce the recycling cost and environmental risk, promote the resource utilization and harmless treatment of electronic waste, and promote the development of circular economy.

[0104] As an implementation, the panel glass is chemically strengthened glass, with a surface hardness ≥ 7H, a thickness of 0.5 - 1.1 mm, and an edge chamfer angle of 30° ± 2°.

[0105] Since the first step of disassembling the display in this application requires treatment in an alkaline solution, the setting of this panel glass can resist the corrosion of the alkaline solution and maintain the original performance of the panel glass, thereby improving the material recovery rate.

[0106] As an implementation, the thickness of the ABS layer is 0.5 - 0.8 mm, and the surface hardness ≥ HB65. This layer of material mainly provides wear protection.

[0107] As an implementation, the thickness of the PLA layer is 0.1 - 0.2 mm and it completely dissolves within 5 minutes in an alkaline solution (60 °C) with pH ≥ 12.

[0108] As an implementation, the thickness of the PC layer is 0.3 - 0.5 mm, it is heat-resistant (≤ 120 °C), and the impact resistance strength ≥ 60 kJ / m 2 。

[0109] Example 2

[0110] This example relates to a disassembly method for the modular display structure based on tool-free disassembly and material traceability in Example 1, including the following steps:

[0111] (1) Pretreatment stage: Immerse the entire display structure in an alkaline solution with pH ≥ 12, maintain the temperature at 60°C ± 2°C for 5 - 8 min to dissolve the PLA layer;

[0112] (2) Physical disassembly stage: Manually separate the plastic shell, peel off the ABS layer and the PC layer. Pour hot water at 45 ± 3°C over the circuit board module to release the shape memory alloy fasteners, achieving the separation of the circuit board module from the heat sink (time-consuming ≤ 30 seconds). Slide the power module along the sliding rail direction of the push-pull type sliding rail mechanism to the disengaged position, and magnetically separate the panel glass;

[0113] (3) Material recycling stage: Classify and put each component. Components including precious metals are recycled through electrolytic purification.

[0114] As an implementation manner, the alkaline solution is a mixed solution of sodium hydroxide and sodium silicate. The concentration of sodium hydroxide is 3 mol / L, and the concentration of sodium silicate is 0.5 mol / L.

[0115] As an implementation manner, the pH of the alkaline solution is 12.5 ± 0.2.

[0116] As an implementation manner, the cathode of the electrolytic purification process uses a titanium mesh, the anode uses the metal components to be recycled, and the electrolyte is a complex solution of silver nitrate and potassium cyanide.

[0117] As an implementation manner, the concentration of silver nitrate in the electrolyte is 0.1 - 0.5 mol / L, and the concentration of potassium cyanide is 0.05 - 0.1 mol / L.

[0118] As an implementation manner, the current density of the electrolytic purification process is 200 A / m 2 , and the temperature of the electrolyte is 50°C.

[0119] Under the above disassembly method, the dissolution rate of the PLA layer is ≥ 98%, and the ABS layer and the PC layer are directly granulated after sorting, with a recycling purity ≥ 97%.

[0120] Example 3

[0121] This example involves the specific disassembly of a 27-inch office display structure in Example 1, and its structural configuration is as follows:

[0122] Panel: Corning Gorilla Glass (thickness 0.7 mm, hardness 7H);

[0123] Circuit board: Four-layer non-glued system (connected in the manner of Example 1);

[0124] Plastic shell: The thickness of the ABS layer is 0.6 mm, the thickness of the PLA layer is 0.15 mm, and the thickness of the PC layer is 0.4 mm.

[0125] Disassembly was carried out using the disassembly method of Example 2, and the disassembly results are as follows:

[0126] The total time consumed was 7 minutes and 12 seconds;

[0127] Material recovery rates: ABS 98.2%, PC 96.5%, aluminum 99.1%, gold 96.3%.

[0128] Comparative Example

[0129] The difference between this comparative example and Example 3 is that the display structure was incinerated for recycling:

[0130] Condition: Treated in a 400 °C incinerator for 1 hour;

[0131] Results:

[0132] The PLA layer was completely degraded, and the metal components partially fell off (manual assistance for sorting was still required);

[0133] The glass panel had minor cracks and needed to be further repaired before reuse;

[0134] Material recovery rates: ABS 85.4%, PC 80.1%, aluminum 88.3%, gold 82.5%.

[0135] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and reference can be made to the corresponding parts of the method embodiments for relevant details.

[0136] The above description is only for the embodiments of this application and is not intended to limit this application. For those skilled in the art, various changes and modifications can be made to this application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the scope of the claims of this application.

Claims

1. A modular display structure based on tool - free disassembly and material traceability, characterized in that Including: A four - level glue - free system, which includes panel glass, a metal frame, a circuit board module, a heat sink, a main body frame, and a plastic shell; The panel glass and the metal frame achieve magnetic suspension coupling through a Halbach magnetic array; The circuit board module and the heat sink are fixed by a shape - memory alloy buckle, and the phase - change trigger temperature of the shape - memory alloy buckle is 45℃ ± 3℃; The power supply module and the main body frame are connected through a push - pull slide rail mechanism, and a self - power - off safety lock is built in the push - pull slide rail mechanism; The plastic shell is fixed by an ultrasonic welding weakening line. The plastic shell includes a PC layer, a PLA layer, and an ABS layer from the inside outwards, and the PLA layer can be dissolved in an alkaline solution; A material identification system, which includes an NFC chip. The NFC chip is embedded in the circuit board module and the power supply module, and the NFC chip is used to store material components, a disassembly guide video link, and a recycling code.

2. The modular display structure based on tool - free disassembly and material traceability according to claim 1, characterized in that, The magnetic flux density of the Halbach magnetic array is 0.8 - 1.2T, and the magnetic pole gap is 0.5 - 1mm.

3. The modular display structure based on tool - free disassembly and material traceability according to claim 1, wherein, The composition of the shape - memory alloy buckle consists of Ni 50.2wt%, Ti 48.5wt%, and Cu 1.3wt%. The shape - memory alloy buckle is obtained after smelting, hot rolling, vacuum annealing, and water quenching treatments; 4. The modular display structure based on tool-free disassembly and material traceability according to claim 1, wherein The welding frequency of the ultrasonic welding weakening line is 26.6 - 29.4kHz, the line width is 0.1 - 0.3mm, and the spacing is 1.5 - 2mm; The melting depth of the ultrasonic welding weakening line is 30% - 40% of the thickness of the plastic shell, and the surface roughness Ra of the welding area is ≤ 3.2μm; 5. The modular display structure based on tool-free disassembly and material traceability according to claim 1, characterized in that, Tenon - mortise connection interfaces are provided on the plastic shell, and the tolerance of the tenon - mortise connection interfaces is ≤ 0.05mm; A power supply slot opening is provided on the plastic shell for installing a power supply slot.

6. The modular display structure based on tool - free disassembly and material traceability according to claim 1, wherein, The NFC chip also includes a self - destruction function and an energy harvesting module, and the energy harvesting module obtains electric energy from the ambient Wi - Fi signal through electromagnetic induction.

7. The modular display structure based on tool-free disassembly and material traceability according to claim 1, wherein, The push - pull slide rail mechanism also includes a two - way damper and an anti - accidental touch locking device. The resistance value of the two - way damper is 5 - 15N, and the anti - accidental touch locking device needs to press both side buttons simultaneously to unlock.

8. A disassembly method for the modular display structure based on tool-free disassembly and material traceability according to any one of claims 1-7, characterized in that, Including the following steps: (1) Pretreatment stage: Immerse the entire display structure in an alkaline solution with pH ≥ 12, maintain the temperature at 60℃ ± 2℃ for 5 - 8min to dissolve the PLA layer; (2) Physical disassembly stage: Manually separate the plastic shell, peel off the ABS layer and the PC layer, control the temperature at 45℃ ± 3℃ to release the shape - memory alloy buckle, separate the circuit board module from the heat sink, slide the power supply module along the slide rail direction of the push - pull slide rail mechanism to the disengaged position, and magnetically separate the panel glass; (3) Material recycling stage: Classify and put each component. Components including precious metals are regenerated through electrolytic purification.

9. The disassembly method according to claim 8, characterized in that The alkaline solution is a mixed solution of sodium hydroxide and sodium silicate. The concentration of sodium hydroxide is 2.8 - 3.2mol / L, and the concentration of sodium silicate is 0.4 - 0.5mol / L.

10. An application of the modular display structure according to any one of claims 1-7, characterized in that, The application includes NFC chip data supporting blockchain evidence preservation; and / or The application includes a metal frame-compatible AR glasses interaction protocol to achieve augmented reality disassembly guidance.

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