Array automatic ball mounting method

Abstract

The invention discloses an automatic array ball mounting method, and relates to the technical field of ball grid array (BGA) ball mounting. According to the automatic array ball mounting method, the ball socket cluster is arranged in the ball mounting tool, the pre-assembly points are provided for the solder balls, the solder balls can be rapidly and effectively assembled into the ball sockets in cooperation with the scraper piece, then the first solder is pre-coated on the device to be subjected to ball mounting, and the device to be subjected to ball mounting is adsorbed and transferred to the position above the solder balls; the first welding flux can drive the welding balls to be separated from the ball sockets in a surface mounting mode, then rapid assembly of the welding balls is achieved, effective supporting conditions are provided for batch and efficient production of BGA devices, through cooperation of a scraper piece, a blocking plate, a connecting frame, a rotating sliding block and a supporting plate, when the welding balls are filled into the ball sockets, the blocking plate blocks a flow guide groove, and therefore the welding balls can be rapidly assembled. And when redundant solder balls are guided out, the scraper is taken out, the blocking plate falls off and leaks out of the flow guide groove, and the extension plate is matched to provide convenient support for smooth discharge of the solder balls from the discharge port.

Description

Technical Field

[0001] The present invention relates to the technical field of BGA ball planting, and specifically provides an array automatic ball planting method. Background Art

[0002] Ball Grid Array packaging technology, abbreviated as BGA, is a high-performance packaging technology that uses a solder ball array to replace traditional pins. The solder ball diameter is usually 0.3 - 1.0 mm, and the substrate materials include BT resin / glass laminate PBGA, ceramic CBGA, polyimide tape TBGA, etc., which are used for wiring, heat dissipation and mechanics. It has the advantages of high density and miniaturization, with solder balls distributed on the entire bottom surface, and the I / O density is higher than that of QFP packaging. For example, a 208-pin QFP corresponds to a pitch of 1.27 mm, while BGA can support more than a thousand solder joints.

[0003] For the device to be ball-planted, it has numerous solder joints, resulting in a relatively cumbersome ball-planting process and low batch production efficiency. Therefore, an array automatic ball-planting method is specifically proposed to achieve batch and efficient BGA ball planting. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides an array automatic ball-planting method, which solves the problems of relatively cumbersome traditional ball-planting process and low batch production efficiency.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: An array automatic ball-planting method specifically includes the following steps: Step 1: Place the scraping member in the ball-planting tooling, block the discharge port and the diversion groove of the ball-planting tooling, place the solder balls in the ball-planting tooling, and use the scraping member to push the solder balls into the ball sockets distributed in an array in the ball-planting tooling; Step 2: Take out the scraping member, and manually fill the remaining ball sockets with solder balls; Step 3: After applying solder paste 1 to the pads of the device to be ball-planted, place the pads of the device to be ball-planted vertically downward in the tray; Step 4: Use an automatic placement device to pick up the device to be ball-planted on the tray with a suction nozzle and place it above the ball sockets distributed in an array, so that solder paste 1 is in contact with the solder balls until the device to be ball-planted is mounted with the solder balls in all the ball sockets distributed in an array; Step 5: Apply solder paste 2 distributed in an array on the PCB board; Step 6: Take out the device to be ball-planted from the ball-planting tooling. The device to be ball-planted takes the solder balls out of the ball sockets through solder paste 1, aligns the solder balls with solder paste 2 for mounting, and then performs reflow soldering to complete the ball planting.

[0006] The present invention is further configured as follows: the ball implanting tool comprises an assembly pool, a plurality of ball socket clusters are provided at the bottom of the inner cavity of the assembly pool, the ball socket clusters comprise a plurality of ball sockets, and the plurality of ball sockets are distributed in a rectangular array.

[0007] The present invention is further configured as follows: both the front and rear sides of the bottom of the inner cavity of the assembly pool are provided with embedding grooves, both the left and right sides of the bottom of the inner cavity of the assembly pool are provided with guide grooves, and both ends of the two embedding grooves are connected to both ends of the two guide grooves respectively; The front side of the assembly pool is provided with a discharge port which is communicated with an embedding groove.

[0008] The present invention is further configured as follows: the scraper member comprises two embedded plates, the tops of both sides of the two embedded plates are commonly fixedly connected with support plates, the tops of the two support plates are commonly slidably mounted with a scraper, and the bottom of the scraper is provided with a groove for use with a solder ball; The outer surface of the embedded plate is used in conjunction with the embedded groove, and the bottom of the scraper is in sliding contact with the bottom of the inner cavity of the assembly pool.

[0009] The present invention is further configured as follows: a blocking plate is slidably installed inside the guide groove, a rotating slider is slidably installed on both the front and rear sides of the bottom of the blocking plate through a connecting frame, a support plate is rotatably installed inside the rotating slider, and the support plate is rotatably installed inside the guide groove.

[0010] The present invention is further configured as follows: a plurality of guide rods are fixedly mounted on the bottom of the blocking plate, and a plurality of guide holes are opened at the bottom of the inner cavity of the guide groove, and the guide holes are used in conjunction with the guide rods.

[0011] The present invention is further configured as follows: inclined extrusion blocks are fixedly installed on both sides of the bottom of the embedded plate, and the inclined extrusion blocks are used in conjunction with one side of the top of the supporting plate.

[0012] The present invention is further configured as follows: extension plates are fixedly mounted on both sides of the top of the scraper, and the extension plates are used in conjunction with the guide grooves.

[0013] The present invention provides an array automated ball planting method, which has the following beneficial effects: (1) The present invention provides pre-assembly points for solder balls by arranging ball socket clusters in the ball planting tooling. With the cooperation of the scraper, it is ensured that the solder balls can be quickly and effectively assembled into the ball sockets. Then, solder 1 is pre-coated on the device to be planted and adsorbed and transferred to the top of the solder balls. The solder 1 can drive the solder balls out of the ball sockets in a mounting manner, thereby realizing rapid assembly of the solder balls, providing effective support conditions for the efficient mass production of BGA devices.

[0014] (2) Through the cooperative setting of the scraping member, the plugging plate, the connecting frame, the rotating slider and the supporting plate, when filling the solder balls into the ball sockets, the plugging plate plugs the diversion groove, and with the use of the scraping plate, the rapid assembly of the solder balls and the ball sockets can be achieved. When discharging the excess solder balls, the scraping member is taken out, the plugging plate drops, the diversion groove is exposed, and the extension plate provides convenient support for the smooth discharge of the solder balls from the discharge port. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic connection diagram of the ball planting tooling, the ball socket cluster and the scraping member structure of the present invention; Figure 2 It is a schematic internal structure diagram of the assembly pool of the present invention; Figure 3 It is a schematic structure diagram of the scraping member of the present invention; Figure 4 It is a schematic connection diagram of the ball planting tooling and the scraping member structure of the present invention; Figure 5 For the present invention Figure 4 An enlarged schematic diagram of the structure at A in the present invention; Figure 6 It is a schematic connection diagram of the plugging plate, the connecting frame, the rotating slider and the supporting plate structures after the scraping member is taken out in the present invention; Figure 7 It is a schematic connection diagram of the solder ball and the solder paste I structures of the present invention; Figure 8 It is a schematic structure diagram of the device to be ball-planted and the tray of the present invention; Figure 9 It is a schematic connection diagram of the solder ball, the solder paste I and the solder paste II structures of the present invention.

[0016] In the figure: 1. Ball planting tooling; 101. Assembly pool; 102. Diversion groove; 103. Discharge port; 104. Embedding groove; 105. Plugging plate; 106. Connecting frame; 107. Rotating slider; 108. Supporting plate; 109. Guide rod; 1010. Guide hole; 2. Solder ball; 3. Ball socket cluster; 301. Ball socket; 4. Device to be ball-planted; 401. Solder paste I; 5. Tray; 6. PCB board; 601. Solder paste II; 7. Scraping member; 701. Embedding plate; 702. Support plate; 703. Scraping plate; 704. Groove; 705. Inclined extrusion block; 706. Extension plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention.

[0018] Please refer to Figures 1-9 , the embodiments of the present invention provide the following technical solutions: Embodiment 1 An array automatic ball mounting method provides ball mounting efficiency by pre-assembling solder balls 2 using a ball mounting tooling 1. Specifically, the ball mounting tooling 1 includes an assembly pool 101. At the bottom of the inner cavity of the assembly pool 101, several groups of ball socket clusters 3 are provided. The ball socket cluster 3 includes several ball sockets 301, which are used in cooperation with the solder balls 2. The opening diameter of the ball socket 301 is 0.05 - 0.1 mm larger than the diameter of the selected solder ball 2, and the depth of the ball socket 301 is between one-half and two-thirds of the diameter of the solder ball 2. And several ball sockets 301 are distributed in a rectangular array. Embedding grooves 104 are provided on both the front and rear sides of the bottom of the inner cavity of the assembly pool 101, and flow guide grooves 102 are provided on both the left and right sides of the bottom of the inner cavity of the assembly pool 101. The two ends of the two embedding grooves 104 are respectively communicated with the two ends of the two flow guide grooves 102. An outlet 103 communicated with one of the embedding grooves 104 is provided on the front surface of the assembly pool 101, which is convenient for the export of the redundant solder balls 2.

[0019] The array automatic ball mounting method specifically includes the following steps: Step 1: Place the solder balls 2 in the ball mounting tooling 1 and fill the solder balls 2 into the ball sockets 301 distributed in an array; Step 2: After applying solder paste 401 to the pads of the device 4 to be ball-mounted, place the device 4 to be ball-mounted with the pads facing vertically downward in the tray 5. As shown in the appendix Figure 8 , this tray 5 can not only support the device 4 to be ball-mounted, but also avoid the solder paste 401; Step 3: Use an automatic placement device to use a suction nozzle to place the device 4 to be ball-mounted on the tray 5 above the ball sockets 301 distributed in an array, so that the solder paste 401 is in contact with the solder balls 2 until the device 4 to be ball-mounted is mounted with all the solder balls in the ball sockets 301 distributed in an array; Step 5: Apply solder paste 601 distributed in an array on the PCB board 6; Step 6: Take out the device 4 to be ball-mounted from the ball mounting tooling 1. The device 4 to be ball-mounted brings the solder balls 2 out of the ball sockets 301 through the solder paste 401. After aligning the solder balls 2 with the solder paste 601 for mounting, perform reflow soldering to complete the ball mounting.

[0020] Embodiment 2 As an improvement over the previous embodiment, this embodiment utilizes the scraping member 7 to achieve the convenient assembly of the solder balls 2. Specifically, the scraping member 7 includes two embedding plates 701. The outer surface of the embedding plate 701 is used in cooperation with the embedding groove 104. At the top of both sides of the two embedding plates 701, support plates 702 are fixedly connected together. A scraper 703 is slidably mounted on the top of the two support plates 702. A groove 704 that is used in cooperation with the solder ball 2 is formed at the bottom of the scraper 703, and the bottom of the scraper 703 is in sliding contact with the bottom of the inner cavity of the assembly pool 101.

[0021] Further explanation, in order to prevent a large number of solder balls 2 from entering the diversion groove 102 and affecting the filling efficiency of the solder balls 2 in the ball socket 301, a blocking plate 105 is slidably mounted inside the diversion groove 102. At the front and rear sides of the bottom of the blocking plate 105, rotating sliders 107 are slidably mounted through connecting frames 106. A support plate 108 is rotatably mounted inside the rotating slider 107. The support plate 108 is rotatably mounted inside the diversion groove 102. At both sides of the bottom of the embedding plate 701, inclined extrusion blocks 705 are fixedly mounted. The inclined extrusion blocks 705 are used in cooperation with one side of the top of the support plate 108. In order to ensure the stable up and down movement of the blocking plate 105, a plurality of guide rods 109 are fixedly mounted at the bottom of the blocking plate 105, and a plurality of guide holes 1010 are formed at the bottom of the inner cavity of the diversion groove 102. The guide holes 1010 are used in cooperation with the guide rods 109.

[0022] Further explanation, in order to facilitate the rapid export of the solder balls inside the diversion groove 102, extension plates 706 are fixedly mounted on both sides of the top of the scraper 703, and the extension plates 706 are used in cooperation with the diversion groove 102.

[0023] An array automatic ball planting method specifically includes the following steps: Step 1: Synchronously and respectively insert the two embedding plates 701 into the two embedding grooves 104. During the process, the embedding plate 701 drives the inclined extrusion block 705 to squeeze one side of the top of the support plate 108, causing the support plate 108 to rotate. During the process, the support plate 108 drives the rotating slider 107 to slide on the connecting frame 106 and pushes the blocking plate 105 to rise until the blocking plate 105 just completes the blocking of the diversion groove 102. During the process, the embedding plate 701 also blocks the discharge port 103. Place three times the number of solder balls 2 needed in the assembly pool 101. Push the scraper 703 back and forth along the support plate 702 to push the solder balls 2 into the ball socket 301. It should be noted that when the scraper 703 moves to the front or rear side of the inner cavity of the assembly pool 101, lift the scraper 703 upward to make the accumulated unfilled solder balls 2 flow in the reverse direction, and then put the scraper 703 on the support plate 702 to push the solder balls 2. Repeat this process several times; Step 2: Remove the two embedding plates 701 upward. During this process, the plugging plate 105 descends, and by rotating the slider 107 to squeeze the supporting plate 108, the supporting plate 108 is restored to a horizontal state. As shown in the appendix Figure 6 As shown, the horizontal plane on one side of the top of the supporting plate 108 coincides with the horizontal plane on the top of the plugging plate 105, and at this time, the horizontal plane on the top of the plugging plate 105 coincides with the horizontal plane at the bottom of the inner cavity of the embedding groove 104, providing a stable diversion channel for the excess solder balls 2. After the excess solder balls 2 enter the embedding groove 104 and the diversion groove 102, they are discharged from the discharge port 103. In order to facilitate the discharge of the excess solder balls 2, the ball planting tooling 1 can be set at an inclination of 3 - 5°, and then observe whether all the solder balls 2 are filled in the ball sockets 301. If not, manually fill the solder balls 2 in the vacant ball sockets 301; Step 3: After applying solder paste 401 to the pads of the device 4 to be ball-planted, place the device 4 to be ball-planted with its pads facing vertically downward in the tray 5; Step 4: Use an automatic mounting device to use a suction nozzle to mount the device 4 to be ball-planted on the tray 5 above the ball sockets 301 distributed in an array, so that the solder paste 401 is in contact with the solder balls 2 until the mounting of the device 4 to be ball-planted and the solder balls in all the ball sockets 301 distributed in an array is completed; Step 5: Apply solder paste 601 distributed in an array on the PCB board 6; Step 6: Take out the device 4 to be ball-planted from the ball planting tooling 1. The device 4 to be ball-planted brings the solder balls 2 out of the ball sockets 301 through the solder paste 401. After aligning the solder balls 2 with the solder paste 601 for mounting, perform reflow soldering to complete the ball planting.

[0024] In summary, the present invention pre-assembles the solder balls 2 in an array distribution manner, providing support for the array-type solder ball adhesion of the subsequent device 4 to be ball-planted, and providing effective support for batch and efficient BGA ball planting.

[0025] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0026] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An array automatic ball mounting method, characterized in that, Specifically, it includes the following steps: Step 1: Place the scraping member (7) in the ball-planting tooling (1), block the discharge port (103) and the diversion groove (102) of the ball-planting tooling (1), place the solder balls (2) in the ball-planting tooling (1), and use the scraping member (7) to push the solder balls (2) into the ball sockets (301) distributed in an array in the ball-planting tooling (1); Step 2: Take out the scraping member (7), and manually fill the remaining ball sockets (301) with the solder balls (2); Step 3: After coating the solder paste I (401) on the pads of the device to be ball-planted (4), place the device to be ball-planted (4) with the pads facing vertically downward in the tray (5); Step 4: Use an automatic placement device to pick up the device to be ball-planted (4) on the tray (5) with a suction nozzle and place it above the ball sockets (301) distributed in an array, so that the solder paste I (401) is in contact with the solder balls (2) until the device to be ball-planted (4) is placed with all the solder balls in the ball sockets (301) distributed in an array; Step 5: Coat the solder paste II (601) distributed in an array on the PCB board (6); Step 6: Take out the device to be ball-planted (4) from the ball-planting tooling (1), the device to be ball-planted (4) brings the solder balls (2) out of the ball sockets (301) through the solder paste I (401), aligns the solder balls (2) with the solder paste II (601) for placement, and then performs reflow soldering to complete ball planting.

2. The method for automatically ball mounting an array according to claim 1, wherein, The ball-planting tooling (1) includes an assembly pool (101), and a plurality of groups of ball socket clusters (3) are arranged at the bottom of the inner cavity of the assembly pool (101). The ball socket cluster (3) includes a plurality of ball sockets (301), and the plurality of ball sockets (301) are distributed in a rectangular array.

3. The method for automatically ball mounting an array according to claim 2, wherein Insertion grooves (104) are respectively arranged on the front and rear sides of the bottom of the inner cavity of the assembly pool (101), diversion grooves (102) are respectively arranged on the left and right sides of the bottom of the inner cavity of the assembly pool (101), and the two ends of the two insertion grooves (104) are respectively communicated with the two ends of the two diversion grooves (102); A discharge port (103) communicated with one of the insertion grooves (104) is arranged on the front surface of the assembly pool (101).

4. The array automatic ball planting method according to claim 3, wherein, The scraping member (7) includes two insertion plates (701), support plates (702) are fixedly connected to the tops of the two sides of the two insertion plates (701) together, a scraper (703) is slidably installed on the tops of the two support plates (702) together, and a groove (704) matched with the solder balls (2) is arranged at the bottom of the scraper (703); The outer surface of the insertion plate (701) is matched with the insertion groove (104), and the bottom of the scraper (703) is in sliding contact with the bottom of the inner cavity of the assembly pool (101).

5. The array automatic ball planting method according to claim 5, wherein, A blocking plate (105) is slidably installed in the diversion groove (102), rotating sliders (107) are slidably installed on the front and rear sides of the bottom of the blocking plate (105) through connecting frames (106), a support plate (108) is rotatably installed in the rotating slider (107), and the support plate (108) is rotatably installed in the diversion groove (102).

6. The method for automatically ball mounting an array according to claim 5, wherein A plurality of guide rods (109) are fixedly installed at the bottom of the plugging plate (105), and a plurality of guide holes (1010) are formed at the bottom of the inner cavity of the diversion groove (102). The guide holes (1010) are used in cooperation with the guide rods (109).

7. The method for automatically ball mounting an array according to claim 5, wherein Inclined extrusion blocks (705) are fixedly installed on both sides of the bottom of the embedded plate (701), and the inclined extrusion blocks (705) are used in cooperation with one side of the top of the support plate (108).

8. A method for automatically ball mounting an array according to claim 4, characterized in that Extension plates (706) are fixedly installed on both sides of the top of the scraping plate (703), and the extension plates (706) are used in cooperation with the diversion groove (102).

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