Wafer surface particle cleaning structure and process

Abstract

The invention discloses a wafer surface particle cleaning structure and process, and relates to the technical field of wafer cleaning. Comprising a cleaning machine cabinet body, a cleaning mechanism for cleaning particles on the surface of a wafer is arranged on the cleaning machine cabinet body, the cleaning device comprises a mounting assembly, the mounting assembly comprises a mounting base fixed in the cleaning machine cabinet body, and the upper end face of the mounting base is rotationally connected with a supporting roller. The height of the cleaning plate can be adjusted to adapt to wafers with different thicknesses, the surface of the wafer is cleaned through rotation of the cleaning plate, and meanwhile, the wafer rotates opposite to the cleaning plate on the supporting roller, so that a cleaning medium can uniformly cover the surface of the wafer, uneven cleaning or dead angles caused by unidirectional rotation are avoided, and the cleaning efficiency is improved. The relative movement speed of the surface of the wafer and the brush is increased, stubborn particulate pollutants can be removed, particulate pollutants can be rapidly removed, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and specifically to a cleaning structure and process for particles on the surface of a wafer. Background Art

[0002] In the semiconductor manufacturing process, the cleanliness of the wafer surface has a crucial impact on the performance and yield of the device. The cleanliness of the wafer surface is crucial for the performance and reliability of the final product. During the wafer processing, various tiny particle contaminants may adhere to the surface. These particles may originate from the environment, the process, or the equipment itself. If these particles are not effectively removed, it may lead to short circuits or open circuits in the circuit, affecting the yield of the wafer and the performance of semiconductor devices. Therefore, wafer cleaning technology is an indispensable key link in semiconductor manufacturing.

[0003] Traditional wafer cleaning methods mainly include chemical cleaning, ultrasonic cleaning, and mechanical brushing, etc.

[0004] Mechanical cleaning removes particles through physical means, such as using a brush or a roller. However, during cleaning, the wafer is fixed, and cleaning is carried out only by the single rotation of the brush. Since the wafer is fixed during the cleaning process and only cleaned by the single rotation of the brush, the relative movement speed between the cleaning medium and the wafer surface is low, making it difficult to thoroughly remove stubborn particles. Also, during the cleaning process, particles may reattach to the wafer surface, reducing the cleaning effect. For this reason, the present invention provides a cleaning structure and process for particles on the surface of a wafer.

[0005] Summary of the Invention

[0006] Aiming at the deficiencies of the prior art, the present invention provides a cleaning structure and process for particles on the surface of a wafer, which solves the problems that during cleaning, the wafer is fixed and cleaned by the single rotation of the brush. Since the wafer is fixed during the cleaning process and only cleaned by the single rotation of the brush, the relative movement speed between the cleaning medium and the wafer surface is low, making it difficult to thoroughly remove stubborn particles, and during the cleaning process, particles may reattach to the wafer surface, reducing the cleaning effect.

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions: A cleaning structure for particles on the surface of a wafer, including a cleaning machine cabinet body, and a cleaning mechanism for particles on the wafer surface is provided on the cleaning machine cabinet body. The cleaning includes:

[0008] An installation component, including a mounting seat fixed inside the cleaning machine cabinet body. The upper end surface of the mounting seat is rotatably connected with a support roller. An installation plate is fixed inside the inner wall of the support roller. A chute is opened inside the installation plate, and a clamping ring is arranged inside the chute and connected through a top-pushing component;

[0009] The rotating assembly includes a support housing fixed to one side of the upper end face of the mounting base. The top of the support housing is connected to a fixing plate through a fixing component. A cleaning plate connected through a gear component is arranged in the vertical direction of the fixing plate. A spray pipe is connected through the inside of the cleaning plate. Brush components for cleaning are evenly distributed on the lower end face of the cleaning plate.

[0010] Preferably, the pushing component includes a first electric push rod fixed to the center of the lower end face of the mounting plate. The telescopic end of the first electric push rod is fixed with a push plate. A movable rod connected through a rotating assembly is arranged on the outer wall of the push plate, and there are four groups of movable rods. A slider is slidably connected to the inner wall of the chute. The clamping ring is fixedly connected to the inner wall of the slider.

[0011] Preferably, the fixing component includes a mounting bracket fixed to the top of the support housing. The fixing plate is fixedly connected to the end of the mounting bracket. A cabinet door rotatably connected through a rotating shaft is arranged on the front end face of the cleaning machine cabinet body. A glass window is inlaid inside the cabinet door.

[0012] Preferably, the gear component includes a support shaft vertically penetrating through the fixing plate. A transmission gear is fixed to the outer wall of the support shaft below the fixing plate. A connecting shaft penetrates through the inside of the fixing plate, and the connecting shaft is located on the right side of the support shaft. A driving gear is fixed to one end of the connecting shaft extending below the fixing plate. The driving gear is meshed with the transmission gear. A second electric push rod is fixed to the lowermost end of the support shaft. The cleaning plate is fixedly connected to the telescopic end of the second electric push rod. A motor is fixed to the side wall of the support housing. One end of the output shaft of the motor extending into the support housing is fixed with a first bevel gear. A first transmission rod is rotatably connected to the lower end in the vertical direction of the support housing. A driven gear is fixed to one end of the first transmission rod close to the support roller. Tooth blocks are evenly fixed to the outer wall of the support roller. The tooth blocks are meshed with the driven gear. A second bevel gear is fixed to the top of the first transmission rod, and the second bevel gear is meshed with the first bevel gear. A second transmission rod is rotatably connected to the upper end in the vertical direction of the support housing. A third bevel gear is fixed to one end of the second transmission rod close to the first bevel gear. The third bevel gear is meshed with the first bevel gear. The upper end of the second transmission rod is connected to the connecting shaft through a transmission wheel and a transmission belt.

[0013] Preferably, a conduit is fixed to the upper end of the spray pipe extending to the cleaning plate. A micro pump for inflating is fixed inside one side of the conduit.

[0014] Preferably, the brush component includes a first brush fixed to the outermost ring of the lower end face of the cleaning plate. A second brush is fixed to the lower end of the cleaning plate inside the first brush. A third brush is fixed to the lower end face of the cleaning plate inside the second brush.

[0015] Preferably, three sets of the first brush, the second brush, and the third brush are provided, and the hardness of the first brush, the second brush, and the third brush increases gradually.

[0016] The present invention also discloses a cleaning process for particles on the surface of a wafer, using the cleaning structure for particles on the surface of a wafer according to any one of the claims, comprising the following steps:

[0017] Step 1: Place the wafer on the upper end surface of the mounting plate, start the first electric push rod, drive the push plate to move downward, drive the slider to slide along the chute through the movable rod, and make the clamping ring clamp and fix the wafer.

[0018] Step 2: Start the motor, drive the first bevel gear to rotate, and through the internal transmission of the gear assembly and the support housing, make the first transmission rod and the second transmission rod rotate in opposite directions, thereby making the support roller and the fixed wafer rotate.

[0019] Step 3: Finally, adjust the height of the cleaning plate by the second electric push rod to make it descend close to the surface of the wafer, start the micro pump, blow the particles through the nozzle, and at the same time, the brush assembly contacts the wafer in the order of hardness for double cleaning.

[0020] Beneficial effects

[0021] The present invention provides a cleaning structure and process for particles on the surface of a wafer. Compared with the prior art, the following beneficial effects are achieved:

[0022] First, when the first transmission rod rotates in the present invention, the support roller realizes the rotatable operation on the mounting seat through the meshing of the tooth block and the driven gear and the action of the first transmission rod, realizes the rotation of the wafer fixed on the mounting plate, and then when the second transmission rod rotates, the connecting shaft is connected to the second transmission rod through the transmission wheel and the transmission belt for transmission, realizes the rotation of the driving gear, and then the support shaft rotates on the fixing plate under the action of the transmission gear and the driving gear, and the size of the driving gear is smaller than that of the transmission gear, which is used to drive the second electric push rod and the cleaning plate at the lower end of the support shaft to rotate. The cleaning plate descends close to the surface of the wafer through the second electric push rod, and the height of the cleaning plate can be adjusted to adapt to wafers of different thicknesses. The surface of the wafer is cleaned by the rotation of the cleaning plate. At the same time, the wafer rotates in the opposite direction to the support roller and the cleaning plate, so that the cleaning medium can evenly cover the surface of the wafer, avoiding uneven cleaning or dead corners caused by single-direction rotation, increasing the relative movement speed between the surface of the wafer and the brush, helping to remove stubborn particle pollutants, and quickly removing particle pollutants, thereby improving the cleaning efficiency.

[0023] Secondly, when the present invention cleans particles on the wafer surface through the brush under the cleaning plate, the micro pump injects gas into the catheter, and then blows away the particles on the wafer surface through the nozzle. The dual action significantly improves the particle removal efficiency, ensures a better cleaning effect on tiny particles, and the gas purge quickly takes the particles away from the wafer surface to avoid the particles from re-attaching during the cleaning process. The synergistic effect of the gas purge and the brush allows the cleaning medium to evenly cover the wafer surface to avoid cleaning dead corners.

[0024] Thirdly, the present invention contacts the wafer through a softer first brush, then a medium-hard second brush, and finally a harder third brush, contacting the wafer surface in sequence to gradually remove particles of different sizes, thereby avoiding damage to the wafer caused by a one-time high pressure, and the softer first brush contacts the wafer surface first to remove larger particles, the medium-hard second brush further removes medium-sized particles, and the harder third brush contacts last to remove tiny particles to achieve layered cleaning, thereby ensuring that particles of different sizes can be effectively removed and the cleaning effect is improved. At the same time, the brush design of different hardness can effectively remove different particles, thereby improving the versatility and cleaning effect of the equipment.

[0025] Fourthly, the present invention places the wafer on the upper end surface of the mounting plate, and then the first electric push rod drives the push plate to move downward, and then the slider rotates with the push plate through the rotating shafts at both ends of the movable rod. When the push plate moves downward, the movable rod drives the slider to slide along the slide groove on the mounting plate, thereby driving the clamping ring on the inner wall of the slider to drive, and the clamping ring is set to four groups, and the outer wall of the wafer is clamped and fixed at the same time, ensuring that the wafer remains stable during the cleaning process without displacement or shaking, avoiding uneven cleaning or cleaning failure due to wafer movement, and the design of the slider and the clamping ring can slide along the slide groove, adjust the clamping position, adapt to wafers of different diameters, improve the versatility of the equipment, reduce the frequency of replacing the fixture, and reduce the equipment cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the cross-sectional structure of the housing of the separation device of the present invention;

[0028] Figure 3 It is a schematic diagram of the connection structure of the first swirl plate and the second swirl plate of the present invention;

[0029] Figure 4 It is a schematic diagram of the card block connection structure of the present invention;

[0030] Figure 5 It is a schematic diagram of the internal structure of the feed housing of the present invention;

[0031] Figure 6 Schematic diagram of the internal structure of the feeding housing of the present invention;

[0032] Figure 7 Schematic diagram of the internal structure of the feeding housing of the present invention.

[0033] In the figure: 1. Cleaning machine cabinet; 101. Cabinet door; 102. Glass window; 2. Mounting seat; 201. Support roller; 202. Mounting plate; 203. Slide groove; 204. Slide block; 205. Clamping ring; 3. First electric push rod; 301. Push plate; 302. Moving rod; 4. Support housing; 401. Mounting bracket; 402. Fixed plate; 403. Support shaft; 404. Driving gear; 405. Connecting shaft; 406. Driving gear; 407. Second electric push rod; 5. Motor; 501. First bevel gear; 502. First transmission rod; 503. Driven gear; 504. Tooth block; 505. Second bevel gear; 506. Second transmission rod; 507. Third bevel gear; 6. Cleaning plate; 601. Spray pipe; 602. Conduit; 603. Micro pump; 7. First brush; 701. Second brush; 702. Third brush. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Please refer to Figures 1-7 , the present invention provides a technical solution

[0036] Embodiment 1: A cleaning structure for particles on the surface of a wafer, including a cleaning machine cabinet 1, and a cleaning mechanism for particles on the surface of the wafer is provided on the cleaning machine cabinet 1. The cleaning includes:

[0037] An installation component, including a mounting seat 2 fixed inside the cleaning machine cabinet 1. The upper end surface of the mounting seat 2 is rotatably connected with a support roller 201. The inner wall of the support roller 201 is fixed with a mounting plate 202. A slide groove 203 is opened inside the mounting plate 202. A clamping ring 205 is arranged inside the slide groove 203 through a top-pushing component;

[0038] A rotating component, including a support housing 4 fixed on one side of the upper end surface of the mounting seat 2. The top of the support housing 4 is connected with a fixed plate 402 through a fixing component. A cleaning plate 6 is arranged vertically through a gear component. A spray pipe 601 is penetrated and connected inside the cleaning plate 6. A brush component for cleaning is evenly distributed on the lower end surface of the cleaning plate 6.

[0039] In a preferred embodiment, the pushing component includes a first electric push rod 3 fixed at the center of the lower end face of the mounting plate 202. A push plate 301 is fixed to the telescopic end of the first electric push rod 3. An active rod 302 connected through a rotating component is arranged on the outer wall of the push plate 301, and four groups of active rods 302 are provided. A slider 204 is slidably connected to the inner wall of the chute 203. The clamping ring 205 is fixedly connected to the inner wall of the slider 204. The fixing component includes a mounting bracket 401 fixed at the top of the support housing 4. A fixing plate 402 is fixedly connected to the end of the mounting bracket 401. A cabinet door 101 rotatably connected through a rotating shaft is arranged on the front end face of the cleaning machine cabinet 1. A glass window 102 is inlaid inside the cabinet door 101. When cleaning the wafer equipment, the cabinet door 101 is opened, and then the wafer is placed on the upper end face of the mounting plate 202. Then, the first electric push rod 3 drives the push plate 301 to move downward. Then, the slider 204 rotates with the push plate 301 through the rotating shafts at both ends of the active rod 302. When the push plate 301 moves downward, the active rod 302 drives the slider 204 to slide along the chute 203 on the mounting plate 202, thereby driving the clamping ring 205 inside the slider 204. Four groups of clamping rings 205 are provided to clamp and fix the outer wall of the wafer at the same time, ensuring that the wafer remains stable during the cleaning process without displacement or shaking, avoiding uneven cleaning or cleaning failure caused by wafer movement. In addition, the designs of the slider 204 and the clamping ring 205 can slide along the chute 203 to adjust the clamping position, adapt to wafers of different diameters, improve the versatility of the equipment, reduce the frequency of fixture replacement, and reduce the equipment cost. At the same time, the four groups of clamping rings 205 apply force evenly at the same time to avoid damage to the surface or edge of the wafer caused by excessive local pressure. The first electric push rod 3 drives the push plate 301 to drive the clamping ring 205 to automatically complete the clamping action without manual intervention. Finally, the cabinet door 101 is closed, and the cleaning particles are prevented from flying into the external environment through the glass window 102.

[0040] In a preferred embodiment, the gear assembly includes a support shaft 403 vertically penetrating and connected to a fixed plate 402. A transmission gear 404 is fixed to the outer wall of the support shaft 403 below the fixed plate 402. A connecting shaft 405 penetrates through the interior of the fixed plate 402, and the connecting shaft 405 is located on the right side of the support shaft 403. One end of the connecting shaft 405 extending below the fixed plate 402 is fixed with a driving gear 406. The driving gear 406 is meshed with the transmission gear 404. A second electric push rod 407 is fixed to the lowermost end of the support shaft 403. The cleaning plate 6 is fixedly connected to the telescopic end of the second electric push rod 407. A motor 5 is fixed to the side wall of the support housing 4. One end of the output shaft of the motor 5 extending into the interior of the support housing 4 is fixed with a first bevel gear 501. A first transmission rod 502 is rotatably connected to the lower end of the support housing 4 in the vertical direction. A driven gear 503 is fixed to one end of the first transmission rod 502 close to the support roller 201. Tooth blocks 504 are uniformly fixed to the outer wall of the support roller 201. The tooth blocks 504 are meshed with the driven gear 503. A second bevel gear 505 is fixed to the top end of the first transmission rod 502, and the second bevel gear 505 is meshed with the first bevel gear 501. A second transmission rod 506 is rotatably connected to the upper end of the support housing 4 in the vertical direction. A third bevel gear 507 is fixed to one end of the second transmission rod 506 close to the first bevel gear 501. The third bevel gear 507 is meshed with the first bevel gear 501. The upper end of the second transmission rod 506 is connected to the connecting shaft 405 through a transmission wheel and a transmission belt. During specific cleaning work, the motor 5 is set to drive the first bevel gear 501 to rotate. Then, both the second bevel gear 505 and the third bevel gear 507 are meshed with the first bevel gear 501, and the second bevel gear 505 and the third bevel gear 507 are distributed on the upper and lower sides of the first bevel gear 501, realizing the opposite rotation of the first transmission rod 502 and the second transmission rod 506 inside the support housing 4. Then, when the first transmission rod 502 rotates, the support roller 201 realizes the rotatable work of the support roller 201 on the mounting seat 2 through the meshing of the tooth blocks 504 and the driven gear 503 and the action of the first transmission rod 502, realizing the rotation of the wafer fixed on the mounting plate 202. Then, when the second transmission rod 506 rotates, the connecting shaft 405 is driven by the transmission wheel and the transmission belt connected to the second transmission rod 506, realizing the rotation of the driving gear 406. Then, the support shaft 403 rotates on the fixed plate 402 under the action of the transmission gear 404 and the driving gear 406, and the size of the driving gear 406 is smaller than that of the transmission gear 404, ensuring the stability of rotation, for driving the second electric push rod 407 and the cleaning plate 6 at the lower end of the support shaft 403 to rotate. The cleaning plate 6 descends close to the wafer surface through the second electric push rod 407, and the height of the cleaning plate 6 can be adjusted to adapt to wafers of different thicknesses. The surface of the wafer is cleaned by the rotation of the cleaning plate 6. At the same time, the wafer rotates in the opposite direction to the cleaning plate 6 between the support roller 201 and the cleaning plate 6.The cleaning medium can evenly cover the surface of the wafer, avoiding uneven cleaning or dead corners caused by one-way rotation, increasing the relative movement speed between the wafer surface and the brush, helping to remove stubborn particle contaminants, quickly removing particle contaminants, and improving the cleaning efficiency.

[0041] In a preferred embodiment, a conduit 602 is fixed at the upper end of the cleaning plate 6 where the nozzle 601 extends. Inside one side of the conduit 602, a micro pump 603 for inflating is fixed. When cleaning particles on the wafer surface with the brush under the cleaning plate 6, the micro pump 603 injects gas into the conduit 602, and then blows away the particles on the wafer surface through the nozzle 601. Through the dual action, the particle removal efficiency is significantly improved, ensuring a better cleaning effect on micro particles, and the gas purge quickly takes the particles away from the wafer surface, avoiding the particles reattaching during the cleaning process. Also, through the synergistic effect of the gas purge and the brush, the cleaning medium evenly covers the wafer surface, avoiding cleaning dead corners.

[0042] In a preferred embodiment, the brush assembly includes a first brush 7 fixed to the outermost ring of the lower end face of the cleaning plate 6. Inside the first brush 7, a second brush 701 is fixed to the lower end of the cleaning plate 6. Inside the second brush 701, a third brush 702 is fixed to the lower end face of the cleaning plate 6. The first brush 7, the second brush 701, and the third brush 702 are all provided in three groups. The hardness of the first brush 7, the second brush 701, and the third brush 702 increases gradually. When the cleaning plate 6 descends through the second electric push rod 407 to contact the wafer surface, first the softer first brush 7 contacts the wafer, then the medium-hard second brush 701, and finally the harder third brush 702 contacts the wafer. Contacting the wafer surface in sequence, different-sized particles are gradually removed, avoiding damage to the wafer caused by high pressure at one time. Also, the softer first brush 7 contacts the wafer surface first to remove larger particles, the medium-hard second brush 701 further removes medium-sized particles, and the harder third brush 702 contacts last to remove micro particles to achieve layered cleaning, ensuring that different-sized particles can be effectively removed, improving the cleaning effect. At the same time, the design of brushes with different hardnesses can effectively remove different particles, improving the versatility and cleaning effect of the equipment.

[0043] Among them, the above motor model is N30-050, and the micro pump model is ZR5551PM.

[0044] Meanwhile, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0045] The present invention also discloses a cleaning process for particles on the wafer surface, using a cleaning structure for particles on the wafer surface according to any one of claims 1-7, including the following steps:

[0046] Step 1: Place the wafer on the upper end face of the mounting plate 202. Start the first electric push rod 3 to drive the push plate 301 to move downward. Drive the slider 204 to slide along the chute 203 through the movable rod 302, so that the clamping ring 205 clamps and fixes the wafer. Specifically, the first electric push rod 3 drives the push plate 301 to move downward. Then, the slider 204 rotates with the push plate 301 through the rotating shafts at both ends of the movable rod 302. When the push plate 301 moves downward, it drives the slider 204 to slide on the mounting plate 202 along the chute 203 through the movable rod 302, thereby driving the clamping ring 205 on the inner wall of the slider 204. And the clamping ring 205 is set in four groups to clamp and fix the outer wall of the wafer at the same time, ensuring that the wafer remains stable during the cleaning process and will not be displaced or shaken, avoiding uneven cleaning or cleaning failure caused by the movement of the wafer.

[0047] Step 2: Start the motor 5 to drive the first bevel gear 501 to rotate. Through the internal transmission of the gear assembly and the support housing 4, the first transmission rod 502 and the second transmission rod 506 rotate in opposite directions, and then the support roller 201 and the fixed wafer rotate. Specifically, the set motor 5 drives the first bevel gear 501 to rotate. Then, the second bevel gear 505 and the third bevel gear 507 are both meshed with the first bevel gear 501, and the second bevel gear 505 and the third bevel gear 507 are distributed on the upper and lower sides of the first bevel gear 501, realizing the opposite rotation of the first transmission rod 502 and the second transmission rod 506 inside the support housing 4. Then, when the first transmission rod 502 rotates, the support roller 201 realizes the rotatable work on the mounting seat 2 through the meshing of the tooth block 504 and the driven gear 503 and the action of the first transmission rod 502, realizing the rotation of the wafer fixed on the mounting plate 202. Then, when the second transmission rod 506 rotates, the connecting shaft 405 is driven by the transmission wheel and the transmission belt to be connected with the second transmission rod 506 for transmission, realizing the rotation of the driving gear 406. Then, the support shaft 403 rotates on the fixed plate 402 under the action of the transmission gear 404 and the driving gear 406, and the size of the driving gear 406 is smaller than that of the transmission gear 404. It is used to drive the second electric push rod 407 and the cleaning plate 6 at the lower end of the support shaft 403 to rotate. The cleaning plate 6 descends close to the wafer surface through the second electric push rod 407, and the height of the cleaning plate 6 can be adjusted to adapt to wafers of different thicknesses. The surface of the wafer is cleaned by the rotation of the cleaning plate 6. At the same time, the wafer rotates in the opposite direction to the cleaning plate 6 between the support roller 201 and the cleaning plate 6, so that the cleaning medium can evenly cover the wafer surface, avoiding uneven cleaning or dead corners caused by one-way rotation, increasing the relative movement speed between the wafer surface and the brush, helping to remove stubborn particle pollutants, and quickly removing particle pollutants.

[0048] Step 3. Finally, the cleaning wafer adjusts the height of the cleaning plate 6 through the second electric push rod 407 to lower it close to the wafer surface. Then, start the micro pump 603 to blow particles through the nozzle 601. At the same time, the brush assembly contacts the wafer in the order of hardness for double cleaning. Specifically, when cleaning the particles on the wafer surface with the brush under the cleaning plate 6, the micro pump 603 injects gas into the conduit 602, and then blows away the particles on the wafer surface through the nozzle 601. The double action significantly improves the particle removal efficiency, ensures a better cleaning effect on micro particles, and the gas purge quickly removes the particles from the wafer surface to avoid reattachment of the particles during the cleaning process. The synergistic effect of the gas purge and the brush evenly covers the cleaning medium on the wafer surface to avoid cleaning dead corners. When the cleaning plate 6 contacts the wafer surface by descending through the second electric push rod 407, first, the softer first brush 7 contacts the wafer, then the medium-hard second brush 701, and finally the harder third brush 702 contacts the wafer. They contact the wafer surface in sequence to gradually remove particles of different sizes, avoiding damage to the wafer caused by high pressure at one time. The softer first brush 7 first contacts the wafer surface to remove larger particles, the medium-hard second brush 701 further removes medium-sized particles, and the harder third brush 702 finally contacts to remove micro particles to achieve layered cleaning, ensuring that particles of different sizes can be effectively removed and improving the cleaning effect.

[0049] During operation, first, when cleaning the wafer equipment, open the cabinet door 101, then place the wafer on the upper end surface of the mounting plate 202. Then, the first electric push rod 3 drives the push plate 301 to move downward. Then, the slider 204 rotates with the push plate 301 through the rotating shafts at both ends of the movable rod 302. When the push plate 301 moves downward, it drives the slider 204 to slide along the chute 203 on the mounting plate 202 through the movable rod 302, thereby driving the clamping ring 205 inside the slider 204. The clamping ring 205 is set in four groups to clamp and fix the outer wall of the wafer at the same time, ensuring the stability of the wafer during the cleaning process.

[0050] Then, the set motor 5 drives the first bevel gear 501 to rotate. The second bevel gear 505 and the third bevel gear 507 are both meshed with the first bevel gear 501, and the second bevel gear 505 and the third bevel gear 507 are distributed on the upper and lower sides of the first bevel gear 501, so as to realize the opposite rotation of the first transmission rod 502 and the second transmission rod 506 inside the support housing 4. Then, when the first transmission rod 502 rotates, the support roller 201 realizes the rotatable work of the support roller 201 on the mounting seat 2 through the meshing of the tooth block 504 and the driven gear 503 and the action of the first transmission rod 502, so as to rotate the wafer fixed on the mounting plate 202. Then, when the second transmission rod 506 rotates, the connecting shaft 405 is connected with the second transmission rod 506 through the transmission wheel and the transmission belt to realize the rotation of the driving gear 406. Then, the support shaft 403 rotates on the fixed plate 402 under the action of the transmission gear 404 and the driving gear 406, and the size of the driving gear 406 is smaller than that of the transmission gear 404, which is used to drive the second electric push rod 407 and the cleaning plate 6 at the lower end of the support shaft 403 to rotate. The cleaning plate 6 descends close to the wafer surface through the second electric push rod 407, and the height of the cleaning plate 6 can be adjusted to adapt to wafers of different thicknesses. The surface of the wafer is cleaned by the rotation of the cleaning plate 6. At the same time, the wafer rotates in the opposite direction to the cleaning plate 6, so that the cleaning medium can evenly cover the wafer surface, avoiding uneven cleaning or dead corners caused by one-way rotation;

[0051] Finally, when the brush under the cleaning plate 6 cleans the particles on the wafer surface, the micro pump 603 injects gas into the conduit 602, and then blows away the particles on the wafer surface through the nozzle 601. The double action significantly improves the particle removal efficiency, ensures a better cleaning effect on micro particles, and the softer first brush 7 contacts the wafer, then the medium-hard second brush 701, and finally the harder third brush 702 contacts the wafer, contacting the wafer surface in sequence to gradually remove particles of different sizes, avoiding damage to the wafer caused by high pressure at one time.

[0052] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or device.

[0053] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cleaning structure for particles on the surface of a wafer, comprising a cleaning machine cabinet (1), characterized in that: A cleaning mechanism for particles on the surface of wafers is provided on the cleaning machine cabinet body (1), and the cleaning includes: An installation component, including a mounting seat (2) fixed inside the cleaning machine cabinet body (1). A support roller (201) is rotatably connected to the upper end surface of the mounting seat (2). An installation plate (202) is fixed to the inner wall of the support roller (201). A chute (203) is formed inside the installation plate (202). A clamping ring (205) is arranged inside the chute (203) and is connected through a pushing component. A rotating component, including a support housing (4) fixed to one side of the upper end surface of the mounting seat (2). A fixing plate (402) is connected to the top end of the support housing (4) through a fixing component. A cleaning plate (6) is arranged in the vertical direction of the fixing plate (402) and is connected through a gear component. A spray pipe (601) is connected through the cleaning plate (6). A brush component for cleaning is evenly distributed on the lower end surface of the cleaning plate (6).

2. The cleaning structure for particles on the surface of a wafer according to claim 1, wherein: The pushing component includes a first electric push rod (3) fixed to the center of the lower end surface of the installation plate (202). A push plate (301) is fixed to the telescopic end of the first electric push rod (3). A movable rod (302) is arranged on the outer wall of the push plate (301) and is connected through a rotating component. And the movable rod (302) is arranged in four groups. A slider (204) is slidably connected to the inner wall of the chute (203). The clamping ring (205) is fixedly connected to the inner wall of the slider (204).

3. The cleaning structure for particles on the surface of a wafer according to claim 1, wherein: The fixing component includes a mounting bracket (401) fixed to the top end of the support housing (4). The fixing plate (402) is fixedly connected to the end of the mounting bracket (401). A cabinet door (101) is rotatably connected to the front end surface of the cleaning machine cabinet body (1) through a rotating shaft. A glass window (102) is inlaid inside the cabinet door (101).

4. The cleaning structure for particles on the surface of a wafer according to claim 1, characterized in that: The gear assembly includes a support shaft (403) vertically penetrating and connected to a fixing plate (402). A transmission gear (404) is fixed to the outer wall below the fixing plate (402) of the support shaft (403). A connecting shaft (405) penetrates through the interior of the fixing plate (402), and the connecting shaft (405) is located on the right side of the support shaft (403). One end of the connecting shaft (405) extending below the fixing plate (402) is fixed with a driving gear (406). The driving gear (406) is meshed with the transmission gear (404). A second electric push rod (407) is fixed to the lowermost end of the support shaft (403). The cleaning plate (6) is fixedly connected to the telescopic end of the second electric push rod (407). A motor (5) is fixed to the side wall of the support housing (4). One end of the output shaft of the motor (5) extending into the interior of the support housing (4) is fixed with a first bevel gear (501). A first transmission rod (502) is rotatably connected to the lower end of the support housing (4) in the vertical direction. A driven gear (503) is fixed to one end of the first transmission rod (502) close to the support roller (201). Tooth blocks (504) are uniformly fixed to the outer wall of the support roller (201). The tooth blocks (504) are meshed with the driven gear (503). A second bevel gear (505) is fixed to the top end of the first transmission rod (502), and the second bevel gear (505) is meshed with the first bevel gear (501). A second transmission rod (506) is rotatably connected to the upper end of the support housing (4) in the vertical direction. A third bevel gear (507) is fixed to one end of the second transmission rod (506) close to the first bevel gear (501). The third bevel gear (507) is meshed with the first bevel gear (501). The upper end of the second transmission rod (506) is connected to the connecting shaft (405) through a transmission wheel and a transmission belt.

5. The cleaning structure for particles on the surface of a wafer according to claim 1, characterized in that: The nozzle (601) extends to the upper end of the cleaning plate (6) and is fixed with a conduit (602). A micro pump (603) for inflating is fixed inside one side of the conduit (602).

6. The cleaning structure for particles on the surface of a wafer according to claim 1, characterized in that: The brush assembly includes a first brush (7) fixed to the outermost ring of the lower end face of the cleaning plate (6). A second brush (701) is fixed to the lower end of the cleaning plate (6) inside the first brush (7). A third brush (702) is fixed to the lower end face of the cleaning plate (6) inside the second brush (701).

7. The cleaning structure for particles on the surface of a wafer according to claim 6, characterized in that: The first brush (7), the second brush (701), and the third brush (702) are each provided in three groups, and the hardness of the first brush (7), the second brush (701), and the third brush (702) increases gradually.

8. A cleaning process for particles on the surface of a wafer, which uses a cleaning structure for particles on the surface of a wafer described in any one of claims 1-7, characterized in that, It includes the following steps: Step 1: Place the wafer on the upper end face of the mounting plate (202), start the first electric push rod (3), drive the push plate (301) to move downward, drive the slider (204) to slide along the chute (203) through the movable rod (302), and clamp and fix the wafer with the clamping ring (205). Step 2: Start the motor (5), drive the first bevel gear (501) to rotate, and through the internal transmission of the tooth assembly and the support housing (4), make the first transmission rod (502) and the second transmission rod (506) rotate in opposite directions, thereby making the support roller (201) and the fixed wafer rotate. Step 3: Finally, adjust the height of the cleaning plate (6) through the second electric push rod (407) to make it descend close to the wafer surface for cleaning the wafer, start the micro pump (603), blow particles through the nozzle (601), and at the same time, the brush assembly contacts the wafer in the order of hardness for double cleaning.

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