Semiconductor packaging chip direction detection device

Abstract

A semiconductor packaging chip direction detection device belongs to the technical field of integrated circuit packaging and testing, is used for detecting a chip conveyed along a horizontal guide rail, and comprises a limiting rod which moves along the vertical direction above the horizontal guide rail and a jacking mechanism arranged below the horizontal guide rail, the jacking mechanism comprises an ejector pin and a moving rod horizontally connected to the bottom end of the ejector pin, and the moving rod reciprocates along an inclined track; pins on two sides of the chip are asymmetric, a plurality of detection gaps are arranged on one side, the detection gaps are gaps between adjacent pins on the side, and the detection gaps are in one-to-one correspondence with the positions of a plurality of pins on the other side. When the side, with the detection gap, of the limited chip is located at the detection side, the ejector pin penetrates through the detection gap in the moving process, and the chip is detected to be a forward product; and when the other side of the limited chip is in a posture that the other side is positioned on the detection side, the ejector pin moves to act on the pin, corresponding to the detection gap, on the other side of the chip so as to jack up the other side of the chip, the chip is detected as a reverse product, and reverse detection is realized.

Description

Technical Field

[0001] The present application relates to semiconductor technology, belonging to the technical field of integrated circuit packaging and testing, and particularly relates to a semiconductor package chip direction detection device. Background Art

[0002] As the demand for higher integration and miniaturization of semiconductor devices increases, it has become a development trend to use integrated circuit packaging to form various modules with specific functions. In the packaging of these modules, it is necessary to redesign the lead frame to make it suitable for multi-chip bonding and mutual isolation, and some pins will be omitted, combined, widened, etc. according to the requirements of electrical conduction and bonding leads, so that the pins of the finally formed package chip are different from the standard pin layout of the original package form it adopts, thereby obtaining better heat dissipation effects and eliminating subsequent processing of unnecessary pins. For example Figure 1 And Figure 2 As shown in a SOP-type integrated package product, the pins on both sides of chip 1 are in an asymmetric form. It can be seen that the pins on the right side are basically the standard pins of this package form, while there are several defaults on the left side, and the positions of multiple pins on the left side do not correspond to the pins on the right side; and as shown by the dotted line in Figure 2 the corresponding position relationship of the pins on both sides, some pins on the left side exactly correspond to the gaps between the pins on the right side. For a package chip with such pin morphology, when queuing and conveying to the detection station, it needs to be queued in the same orientation. If a chip with the left and right sides reversed is mixed in, it will not be able to match the pins to be contacted when it enters the detection station, resulting in detection failure. Although generally, the attitude detection and mechanical posture adjustment of the chip are carried out before queuing and conveying, which can ensure that the chip is not in an inverted state, but occasionally a chip in the correct posture but with the left and right sides reversed will be "let go". Therefore, it is necessary to detect such a package chip with asymmetric pins and identify it from the queue. Although optical vision detection in the vertical projection direction can achieve the purpose, the construction cost of such equipment is relatively high; therefore, how to implement it in a more easily implementable way based on the pin characteristics of such chips has become a technical problem to be solved. Summary of the Invention

[0003] In order to solve the deficiencies of the above-mentioned related prior arts, the present application provides a semiconductor package chip direction detection device, which can detect and identify the asymmetric pin package chips conveyed in a queue, and remove the chips with the left and right reversed postures from the queue, and the device has a simple structure and is easy to implement.

[0004] To achieve the above object, the present invention adopts the following technologies: A semiconductor package chip direction detection device for detecting the direction of chips conveyed in a single row along a horizontal guide rail, comprising: A limiting rod vertically arranged above the horizontal guide rail and moving in the vertical direction, which is used to limit the conveyed chips; and A jacking mechanism arranged below the horizontal guide rail, which includes a plurality of ejector pins arranged in the vertical direction and a moving rod horizontally connecting the bottoms of the ejector pins at the same time. The moving rod reciprocates in a pair of fixedly arranged inclined guide rails, and the length direction of the inclined guide rail has an acute angle with the height direction of the ejector pin; The pins on both sides of the chip are arranged asymmetrically. There are multiple detection gaps on one side, and the detection gap is the gap between adjacent pins on this side, and they correspond to the positions of multiple pins on the other side one by one; One side of the horizontal guide rail is the detection side. When the moving rod is at the starting position of the low end of the inclined guide rail, in the horizontal direction, the ejector pin is located outside the detection side, and the position of the ejector pin corresponds to the position of the pin on the other side of the chip limited by the limiting rod and corresponding to the detection gap. The ejector pin is used to move towards the detection side and simultaneously move upward in the vertical direction when the moving rod moves from the low end to the high end of the inclined guide rail, so as to perform direction detection on the chip limited by the limiting rod: When the chip limited by the limiting rod is in the posture where the side with the detection gap is located on the detection side, the ejector pin moves through the detection gap during movement, and it is detected as a positive product; When the chip limited by the limiting rod is in the posture where the other side is located on the detection side, the ejector pin acts on the pin on the other side of the chip corresponding to the detection gap during movement to lift the other side of the chip, and it is detected as a reverse product.

[0005] Furthermore, it also includes a material pushing mechanism arranged above the horizontal guide rail, which is used to push the chip lifted by the ejector pin to the other side of the horizontal guide rail and push it out of the horizontal guide rail.

[0006] Even further, the material pushing mechanism includes: A swing rod arranged to swing, and its swing axis is located above the horizontal guide rail and parallel to the conveying direction of the horizontal guide rail; A connecting plate, the upper end of which is connected to the bottom end of the swing rod, and the lower end is formed with a rotating groove; and A push rod, one end of which is located in the rotating groove and rotatably connected to the lower end of the connecting plate, and the other end is connected to the connecting plate through a return spring / return elastic piece; The rotating connection point of the push rod and the connecting plate is higher than the top surface of the chip on the horizontal guide rail, and is located outside the detection side of the horizontal guide rail. When the return spring / return elastic piece is in the natural state, the other end of the push rod is higher than the top surface of the chip on the horizontal guide rail.

[0007] Even still further, the material pushing mechanism also includes: A swing shaft connected to the upper end of the swing rod, and a gear is coaxially arranged on it; An upper shaft seat installed on an upper frame, the swing shaft is rotatably installed on the upper shaft seat, and a limiting guide rail is arranged on the upper frame; a rack meshing with the gear and cooperating with the limiting guide rail; and The horizontal cylinder installed on the upper frame has its output end connected to the rack. The stroke direction of the horizontal cylinder is consistent with the length direction of the limit guide rail and is perpendicular to the conveying direction of the horizontal guide rail.

[0008] Furthermore, when the moving rod is at the starting position of the travel at the lower end of the inclined guide rail, the ejector pin is located outside the detection side in the horizontal direction, and the position of the ejector pin corresponds to the position of the pin corresponding to the detection gap on the other side of the chip limited by the limiting rod.

[0009] Furthermore, there is a pair of ejector pins, and the bottom ends of the ejector pins are connected to ring sleeves, which are slidably matched with the moving rod and fixed by bolts, so that the position of the ejector pin can be adjusted according to the actual position of the pin to be ejected, thereby improving the adaptability of the detection device.

[0010] Furthermore, the inclined guide rail is installed on the base plate, and a first and a second parallel and spaced-apart inclined groove are provided on the inclined guide rail along the length direction. The two ends of the moving rod are respectively slidably matched with the first inclined grooves of a pair of inclined guide rails, and the side of the ejector pin is horizontally connected to a limiting column, and the limiting column is slidably matched with the second inclined groove. One end of the moving rod is rotatably connected to one end of the connecting rod, and the other end of the connecting rod is rotatably connected to one end of the rotating rod, and the other end of the rotating rod is connected to the rotating shaft, which is rotatably installed on the support, and the motor output shaft is coaxially connected to the rotating shaft, and the support and the motor are installed on the base plate.

[0011] Furthermore, the horizontal guide rail is recessed inward from the detection side to form detection notches whose number and positions correspond to those of the ejector pins.

[0012] The beneficial effects of the present invention are: 1. Make full use of the asymmetric distribution of pins on both sides of the chip structure to be tested, and the characteristics that at least two pins on one side correspond to the two gaps on the other side. Whether it is a forward or reverse product is determined by whether the ejector pin touches the chip pins at the detection station. Compared with optical visual inspection, it is simpler, faster, and has a low implementation cost; 2. The position setting of the ejector pin does not affect the conveyance of the chip on the horizontal rail when it is not lifted. The movement of the ejector pin is not only vertical, but also close to the horizontal rail, and even enters the detection gap. In this way, when the ejector pin acts on the pin to lift the chip, it can have a longer stroke to maintain the effect on the chip, providing a guarantee for the acceptance of the lever; 3. The rotation and reset setting of the lever in the material shifting mechanism can not affect the continued conveying of normal products when forward products are detected. When reverse products are detected, the lever can gradually change from contacting the chip with the bottom surface to receiving the chip as the top pin lifts the chip. The structure is simple, and the reverse products can be received by the lever ingeniously with the lifting process of the top pin, laying the foundation for the rejection with the swing rod. Brief Description of the Drawings

[0013] Figure 1 It is a three-dimensional view of an SOP-type packaged chip structure.

[0014] Figure 2 It is a top view of an SOP-type packaged chip structure.

[0015] Figure 3 It is a three-dimensional view of the overall structure of the detection device according to the embodiment of the present application.

[0016] Figure 4 It is a side view of the overall structure of the detection device according to the embodiment of the present application.

[0017] Figure 5 It is Figure 3 an enlarged view of part A in

[0018] Figure 6 It is a partial three-dimensional view when the lifting mechanism of the embodiment of the present application lifts the chip.

[0019] Figure 7 It is a state diagram when the chip of the embodiment of the present application acts on the bottom surface of the lever after being lifted.

[0020] Figure 8 It is a state diagram when the bottom surface of the chip of the embodiment of the present application is supported by the lever after being lifted.

[0021] Figure 9 It is a partial three-dimensional view of the device structure when the bottom surface of the chip of the embodiment of the present application is supported by the lever after being lifted.

[0022] Figure 10 It is an end view of the overall structure of the device when the bottom surface of the chip of the embodiment of the present application is supported by the lever after being lifted.

[0023] Figure 11 It is a three-dimensional view of the overall structure of the device when the chip of the embodiment of the present application is kicked out of the queue by the lever.

[0024] Figure 12 It is a partial three-dimensional view of the preferred scheme of the connection mode between the ejector pin and the moving rod according to the embodiment of the present application.

[0025] Reference Signs: Chip - 1; Detection Notch - 20, Horizontal Guide Rail - 21, Pressure Strip - 22; Limit Rod - 31, Vertical Cylinder - 32; Lifting mechanism - 4, bottom plate - 40, ejector pin - 41, moving rod - 42, inclined guide rail - 43, first inclined groove - 44, second inclined groove - 45, connecting rod - 46, rotating rod - 47, rotating shaft - 48, support - 49, motor - 410, limit post - 411, collar - 412, vertical plate - 430; Stocking mechanism - 5, stocker rod - 51, connecting plate - 52, return spring - 53, swing rod - 54, swing shaft - 55, upper shaft seat - 56, gear - 57, rack - 58, limit guide rail - 59, horizontal cylinder - 510; Upper frame - 6. Detailed implementation mode

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will describe the embodiments of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0027] The embodiments of the present application provide a semiconductor packaging chip direction detection device for detecting the direction of a chip 1 as shown in Figure 1 and Figure 2 The pins on both sides of the chip 1 are asymmetrically arranged. There are multiple detection gaps on one side, and the detection gap is the gap between adjacent pins on this side, and they correspond to the positions of multiple pins on the other side one by one. As shown in Figure 2 The chip 1 has two pins on the left side, corresponding to two detection gaps on the right side, as shown by the dotted line in Figure 2 .

[0028] Specifically, as shown in Figure 3 , the device in this embodiment is used to detect the direction of the chips 1 transported in a single row along the horizontal guide rail 21. The device includes a limit rod 31, a lifting mechanism 4, etc.

[0029] The limit rod 31 is vertically arranged above the horizontal guide rail 21 and moves in the vertical direction. Specifically, the limit rod 31 is connected to the output end of a vertical cylinder 32 fixed to the upper frame 6, and is used to limit the transported chips 1. After the limitation, the position where the chip 1 in contact with the limit rod 31 is located is the detection station.

[0030] Define one side of the horizontal guide rail 21 as the detection side. At the detection station, it is necessary to detect the direction of the chip 1 from the detection side. Assume that when the side of the chip 1 with detection gaps (i.e., the right side as shown in the perspectives of Figure 1 and Figure 2 ) is aligned with the detection side, it is in the forward posture, and the other side of the chip 1 (i.e., as shown in the perspectives of Figure 1 and Figure 2When the left side (shown from the perspective) matches the detection side, it is in the reverse posture. When detecting, it is necessary to detect the chip 1 in the reverse posture from the conveying queue. Specifically, the conveying of the chip 1 on the horizontal guide rail 21 is a step-by-step pushing conveying to match the detection rhythm.

[0031] Preferably, in order to ensure the stability of the conveying queue of the chip 1, a pressing strip 22 is provided above the horizontal guide rail 21. The pressing strip 22 extends from the starting end of the horizontal guide rail 21 along the conveying direction to a distance greater than the length of one chip 1 and less than the length of two chips 1 from the limiting rod 31, that is, the pressing strip 22 covers all the chips 1 on the horizontal guide rail 21 before the detection station.

[0032] The lifting mechanism 4 is arranged below the horizontal guide rail 21, as Figure 4 and Figure 5 shown. It includes a plurality of thimbles 41 arranged in the vertical direction and a moving rod 42 that is horizontal and simultaneously connects the bottom ends of the thimbles 41. The moving rod 42 reciprocates in a pair of inclined guide rails 43 fixedly arranged on the bottom plate 40. The moving direction of the moving rod 42 has an acute angle with the vertical direction. Specifically, it can be set that the length direction of the inclined guide rail 43 has the acute angle with the height direction of the thimble 41.

[0033] When the moving rod 42 is at the starting position of the stroke at the lower end of the inclined guide rail 43, in the horizontal direction, the thimble 41 is located at a predetermined distance outside the detection side, and the position of the thimble 41 corresponds to the position of the detection gap on one side of the chip 1 defined by the limiting rod 31 (i.e., in the detection station), or corresponds to the position of the pin on the other side of the chip 1 corresponding to the detection gap. As the moving rod 42 moves from the lower end to the upper end of the inclined guide rail 43, the thimble 41 moves towards the detection side and simultaneously moves upward in the vertical direction to perform direction detection on the chip 1 defined by the limiting rod 31: When the side of the chip 1 defined by the limiting rod 31 with the detection gap is located on the detection side in the posture, the thimble 41 moves through the detection gap during the movement, and the detection is a positive product. As Figure 5 shown, the chip 1 in the detection station is a positive product. If the thimble 41 moves from the lower end to the upper end with the moving rod 42, the thimble 41 will pass through the detection gap; When the other side of the chip 1 defined by the limiting rod 31 is located on the detection side in the posture, the thimble 41 acts on the pin corresponding to the detection gap on the other side of the chip 1 during the movement to lift the other side of the chip 1, and the detection is a reverse product. As Figure 6 shown, the chip 1 in the detection station is a reverse product. After the thimble 41 moves, it acts on the pin corresponding to the detection gap, and the other side of the chip 1 is lifted.

[0034] The vertical cylinder 32 operates intermittently, and the specific interval is subject to the detection rhythm. Specifically, its downward stroke is used to wait for the chip 1 conveyed step by step, and the chip 1 in contact with it is limited at the detection station. After the detection is completed, it performs an upward stroke to release the chip 1 with a positive detection result.

[0035] Specifically, when there is one ejector pin 41, it can correspond to the position of one pin corresponding to the detection interval; when there are a pair of ejector pins 41, they correspond to the positions of two pins corresponding to the detection interval. Using two ejector pins 41 can improve the stability of the chip 1's posture during lifting. In this example, there are 2 detection intervals, and a pair of ejector pins 41 just corresponds. Of course, according to the actual situation, when there are 3 or more detection intervals and the pins corresponding to the detection intervals, the ejector pins 41 can also be set to multiple with a matching quantity to respectively correspond to one such pin and the detection interval.

[0036] Preferably, in order to improve the adaptability range of the device, for example, when adapting to other chips 1 and the detection intervals and the positions of the corresponding pins on the other side of other chips 1 change as a whole, such as when the two detection intervals and the corresponding pin spacings change, it can be preferably set that the spacing between a pair of ejector pins 41 is adjustable for adaptation. Specifically, as Figure 12 shown, the bottom ends of the ejector pins 41 are all connected with collar sleeves 412. The collar sleeves 412 are slidably fitted on the moving rod 42 and fixed by bolts. The position of the ejector pins 41 on the moving rod 42 is adjusted through the collar sleeves 412 for adaptation, and after adjustment, the collar sleeves 412 are fixed by bolts to fix the position of the ejector pins 41.

[0037] Specifically, as Figures 3 - 6 shown, the inclined guide rails 43 are installed on the bottom plate 40. Along the length direction of the inclined guide rails 43, there are parallel and spaced first inclined slots 44 and second inclined slots 45. Both ends of the moving rod 42 are slidably fitted in the first inclined slots 44 of a pair of inclined guide rails 43. The side of the ejector pin 41 is horizontally connected with a limit post 411, and the limit post 411 is slidably fitted in the second inclined slot 45. One end of the moving rod 42 is rotatably connected to one end of a connecting rod 46, the other end of the connecting rod 46 is rotatably connected to one end of a rotating rod 47, the other end of the rotating rod 47 is connected with a rotating shaft 48, and the rotating shaft 48 is rotatably installed on a support 49. The output shaft of the motor 410 is coaxially connected with the rotating shaft 48, and the support 49 and the motor 410 are installed on the bottom plate 40. The motor 410 can be selected as a micro stepping motor, and its rotation speed and the pause time after rotating one circle are preset in advance. The specific settings of the starting positions and lengths of the first inclined slot 44 and the second inclined slot 45 can be considered: when the moving rod 42 is at the starting position at the bottom end of the first inclined slot 44, the limit post 411 does not contact or just contacts the bottom end of the second inclined slot 45, and when the moving rod 42 is at the end position at the top end of the first inclined slot 44, the limit post 411 does not contact or just contacts the top end of the second inclined slot 45.

[0038] During operation, the starting position is when the moving rod 42 is at the bottom end of the first inclined slot 44. Figure 5 As shown, at this time, the connecting rod 46 and the rotating rod 47 are in a straight line, and the distance between the rotating shaft 48 and the moving rod 42 is the farthest. As the motor 410 drives the rotating shaft 48 to rotate, the rotating rod 47 rotates, driving the connecting rod 46 to move and rotate; Figure 6 As shown, when the rotating rod 47 rotates 180°, the moving rod 42 is at the top of the first inclined slot 44. At this time, the connecting rod 46 and the rotating rod 47 overlap in a straight line, and the ejector pin 41 reaches the maximum lifting height to complete the detection; then, as the rotating rod 47 continues to rotate, the connecting rod 46, the rotating rod 47, the moving rod 42, and the ejector pin 41 return to the starting position and wait for the next detection.

[0039] Preferably, the horizontal guide rail 21 is recessed inward from the detection side to form detection notches 20 whose number and position correspond to the ejector pins 41. Figure 6 , Figure 9 , Figure 11 As shown, the number of ejector pins 41 is consistent with the number of detection notches 20, and the positions correspond one to one, so as to allow the ejector pins 41 to pass through when moving, so as to increase the stroke of the ejector pins 41 and make the stroke of the ejector pins acting on the pins longer, so as to ensure the degree of ejection and the connection with the material diverting mechanism.

[0040] In order to facilitate processing and installation, Figure 12 As shown, the inclined guide rail 43 may be replaced by a vertical plate 430 , and the first inclined groove 44 and the second inclined groove 45 are formed on the vertical plate 430 .

[0041] In order to further screen out or reject the chip 1 with the detected reverse posture, as shown in FIG. Figures 3 - 5 As shown, the detection device also includes a material removal mechanism 5 arranged above the horizontal guide rail 21, which is used to move the chip 1 lifted by the ejector pin 41 to the other side of the horizontal guide rail 21 and remove it from the horizontal guide rail 21. The removal needs to be completed before the next detection, that is, before the subsequent chip 1 continues to be stepped and transported.

[0042] As one of the specific implementation forms of the material-selecting mechanism 5, Figure 4 , Figure 5 , Figure 10 , Figure 11As shown, the material feeding mechanism 5 includes a swing rod 54, a connecting plate 52, a dial rod 51, etc. Specifically, the swing rod 54 is swingably arranged above the horizontal guide rail 21, and its swing axis is located above the horizontal guide rail 21 and parallel to the conveying direction of the horizontal guide rail 21; the upper end of the connecting plate 52 is connected to the bottom end of the swing rod 54, and a rotating groove 50 is formed at the lower end; one end of the dial rod 51 is located in the rotating groove 50 and is rotatably connected to the lower end of the connecting plate 52, and the other end is connected to the connecting plate 52 through a return spring 53 or a return elastic sheet; the rotational connection point of the dial rod 51 and the connecting plate 52 is higher than the top surface of the chip 1 on the horizontal guide rail 21 and is located outside the detection side of the horizontal guide rail 21; as Figure 8 shown, when the return spring 53 is in a natural state, the other end of the dial rod 51 is higher than the top surface of the chip 1 on the horizontal guide rail 21.

[0043] Specifically, in order to avoid movement interference between the parts of the device, along the conveying direction, the dial rod 51 and the ejector pin 41 are arranged at different positions and do not affect each other, as Figure 4 and Figure 9 shown; and the position of the dial rod 51 corresponds to a larger gap on the left side of the chip 1 shown in Figure 2 at the detection station, so as to avoid the dial rod 51 acting on the pins when the chip 1 is lifted.

[0044] During the process of detecting the chip 1 in the reverse posture and when it is lifted, the lifted chip 1 will first contact the bottom surface of the dial rod 51, and as the lifting process progresses, the contact point with the dial rod 51 will move towards the upper end of the dial rod 51, and during this process, the dial rod 51 will rotate and the return spring 53 will be slightly compressed, as Figure 7 shown, and then as the dial rod 51 rotates and the chip 1 is lifted, the contact point disengages from the dial rod 51, and the dial rod 51 rotates downward and resets under the action of the return spring 53 to receive the bottom of the chip 1, as Figure 8 shown. Before it disengages from the reception, the ejector pin 41 has reached the maximum lifting stroke and starts to reset. At this time, by using the swing of the swing rod 54, specifically swinging towards the other side of the horizontal guide rail 21 opposite to the detection side, in the perspective shown in Figure 8 it is swinging to the left; swinging a predetermined angle to make the dial rod 51 dial out the chip 1 from the horizontal guide rail 21, as Figure 11 shown, and the ejected chip 1 has turned out of the horizontal guide rail 21, realizing the rejection of the chip 1 in the reverse posture.

[0045] More specifically, the implementation structure of the swing of the swing rod 54 is as Figure 10 and Figure 11As shown, a swing shaft 55 is connected to the upper end of a swing rod 54, and a gear 57 is coaxially arranged thereon; an upper shaft seat 56 is installed on an upper frame 6, the swing shaft 55 is rotatably installed on the upper shaft seat 56, and a limit guide rail 59 is arranged on the upper frame 6; a rack 58 meshing with the gear 57 is slidably fitted in the limit guide rail 59; a horizontal air cylinder 510 is further installed on the upper frame 6, and its output end is connected to the rack 58. The stroke direction of the horizontal air cylinder 510 is consistent with the length direction of the limit guide rail 59 and is perpendicular to the conveying direction of the horizontal guide rail 21.

[0046] When the swing rod 54 needs to swing, the rack 58 is controlled to move in the limit guide rail 59 through the horizontal air cylinder 510 to drive the gear 57 to rotate, so that the swing rod 54 swings through the rotation of the swing shaft 55; in order to improve efficiency, the stroke of the horizontal air cylinder 510 can be set to match the angle required for the swing of the swing rod 54. Thus, the output stroke of the horizontal air cylinder 510 corresponds to the swing stroke of the swing rod 54, and the retraction stroke of the horizontal air cylinder 510 corresponds to the reset stroke of the swing rod 54; and the swing stroke of the swing rod 54 is based on the swing to the position where the dial rod 51 will push out the to-be-topped chip 1 from the horizontal guide rail 21.

[0047] The above are only the preferred embodiments of the present application and are not used to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. A semiconductor package chip direction detection device for detecting the direction of chips (1) conveyed in a single row along a horizontal guide rail (21), characterized in that: The pins on both sides of the chip (1) are asymmetrically arranged. There are multiple detection gaps on one side, and the detection gap is the gap between adjacent pins on this side, and they respectively correspond to the positions of multiple pins on the other side one by one; The device includes: A limiting rod (31) vertically arranged above the horizontal guide rail (21) and moving in the vertical direction for limiting the conveyed chips (1); and A jacking mechanism (4) arranged below the horizontal guide rail (21), which includes a plurality of thimbles (41) arranged in the vertical direction and a moving rod (42) horizontally connecting the bottoms of the thimbles (41) at the same time. The moving rod (42) reciprocates and moves in a pair of fixedly arranged inclined guide rails (43); Among them, one side of the horizontal guide rail (21) is the detection side. The thimble (41) is used to move towards the detection side and move upward in the vertical direction at the same time when the moving rod (42) moves from the low end to the high end of the inclined guide rail (43), so as to detect the direction of the chip (1) limited by the limiting rod (31): When the chip (1) limited by the limiting rod (31) is in the posture where the side with the detection gap is located on the detection side, the thimble (41) moves through the detection gap during the movement, and it is detected as a positive product; When the chip (1) limited by the limiting rod (31) is in the posture where the other side is located on the detection side, the thimble (41) acts on the pins corresponding to the detection gap on the other side of the chip (1) during the movement to jack up the other side of the chip (1), and it is detected as a reverse product.

2. The semiconductor package chip direction detection device according to claim 1, wherein It further includes a material pushing mechanism (5) arranged above the horizontal guide rail (21) for pushing the chip (1) jacked up by the thimble (41) to the other side of the horizontal guide rail (21) and pushing it out of the horizontal guide rail (21).

3. The semiconductor package chip direction detection device according to claim 2, wherein, The material pushing mechanism (5) includes: A swing rod (54) arranged to swing, and its swing axis is located above the horizontal guide rail (21) and parallel to the conveying direction of the horizontal guide rail (21); A connecting plate (52), the upper end of which is connected to the bottom end of the swing rod (54), and a rotating groove (50) is formed at the lower end; and A push rod (51), one end of which is located in the rotating groove (50) and is rotatably connected to the lower end of the connecting plate (52), and the other end is connected to the connecting plate (52) through a return spring (53) / return elastic sheet; The rotating connection between the push rod (51) and the connecting plate (52) is higher than the top surface of the chip (1) on the horizontal guide rail (21), and is located outside the detection side of the horizontal guide rail (21). When the return spring (53) / return elastic sheet is in the natural state, the other end of the push rod (51) is higher than the top surface of the chip (1) on the horizontal guide rail (21).

4. The semiconductor package chip direction detection device according to claim 3, wherein, The material pushing mechanism (5) further includes: A swing shaft (55) connected to the upper end of the swing rod (54), on which a gear (57) is coaxially arranged; An upper shaft seat (56) installed on an upper frame (6), the swing shaft (55) is rotatably installed on the upper shaft seat (56), and a limiting guide rail (59) is arranged on the upper frame (6); A rack (58) meshing with the gear (57) and cooperating with the limiting guide rail (59); and A horizontal cylinder (510) is installed on the upper rack (6), and its output end is connected to a rack (58). The stroke direction of the horizontal cylinder (510) is the same as the length direction of the limit guide rail (59) and perpendicular to the conveying direction of the horizontal guide rail (21).

5. The semiconductor package chip direction detection device according to claim 1, wherein When the moving rod (42) is at the starting position of the stroke at the lower end of the inclined guide rail (43), in the horizontal direction, the ejector pin (41) is located outside the detection side, and the position of the ejector pin (41) corresponds to the position of the pin on the other side of the chip (1) limited by the limit rod (31) corresponding to the detection gap.

6. The semiconductor package chip direction detection device according to claim 1, wherein, There is a pair of ejector pins (41), and loop sleeves (412) are connected to the bottom ends of the ejector pins (41). The loop sleeves (412) are slidably fitted to the moving rod (42) and fixed by bolts.

7. The semiconductor package chip direction detection device according to claim 1, wherein, The inclined guide rail (43) is installed on the bottom plate (40). Along the length direction of the inclined guide rail (43), parallel and spaced first inclined grooves (44) and second inclined grooves (45) are provided. The two ends of the moving rod (42) are respectively slidably fitted to the first inclined grooves (44) of a pair of inclined guide rails (43). A limit column (411) is horizontally connected to the side of the ejector pin (41), and the limit column (411) is slidably fitted to the second inclined groove (45). One end of the moving rod (42) is rotatably connected to one end of a connecting rod (46), the other end of the connecting rod (46) is rotatably connected to one end of a rotating rod (47), the other end of the rotating rod (47) is connected to a rotating shaft (48), the rotating shaft (48) is rotatably installed on a support (49), and the output shaft of the motor (410) is coaxially connected to the rotating shaft (48). The support (49) and the motor (410) are installed on the bottom plate (40).

8. The semiconductor package chip direction detection device according to claim 1, characterized in that, The horizontal guide rail (21) is recessed inward from the detection side to form detection notches (20) with the same number and positions as the ejector pins (41) for the ejector pins (41) to pass through when moving.

9. The semiconductor package chip direction detection device according to claim 1, wherein The limit rod (31) is connected to the output end of a fixedly arranged vertical cylinder (32).

10. The semiconductor package chip direction detection device according to claim 1, wherein A pressure strip (22) is provided above the horizontal guide rail (21). The pressure strip (22) extends from the starting end of the horizontal guide rail (21) along the conveying direction to a distance from the limit rod (31) greater than the length of one chip (1) and less than the length of two chips (1).

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