Semiconductor manufacturing apparatus

Abstract

Provided is a semiconductor manufacturing apparatus capable of picking up electronic components more appropriately. According to one embodiment, a semiconductor manufacturing apparatus includes a jacking unit, a transfer unit, an electronic component holding unit, and a mounting unit. The jack-up portion can jack up a plurality of adjacent electronic components among a plurality of electronic components singulated from a wafer. The transfer part can transfer the plurality of electronic components jacked up by the jacking part. The electronic component holding unit is capable of holding the plurality of electronic components transferred by the transfer unit. The carrying part enables the electronic component held by the electronic component holding part to be carried on a carried object. At least a part of the jacking part can jack the plurality of adjacent electronic components so as to span the plurality of adjacent electronic components on the same surface. The electronic component holding unit is capable of switching between a holding state of the electronic component and a non-holding state of the electronic component for each of the electronic components.

Description

Technical Field

[0001] This embodiment relates to a semiconductor manufacturing apparatus. Background Art

[0002] When picking up a thin-thickness chip (thin-thickness electronic component), a multi-stage lifting method is effective. However, if the aspect ratio of the chip becomes large and the chip becomes thin, it is difficult to manufacture a jig for the multi-stage lifting method.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2003-109979 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] To provide a semiconductor manufacturing apparatus capable of more appropriately picking up electronic components.

[0008] Means for Solving the Problems

[0009] The semiconductor manufacturing apparatus of this embodiment includes a lifting unit, a transfer unit, an electronic component holding unit, and a mounting unit. The lifting unit can lift adjacent ones of a plurality of electronic components singulated from a wafer. The transfer unit can transfer the plurality of electronic components lifted by the lifting unit. The electronic component holding unit can hold the plurality of electronic components transferred by the transfer unit. The mounting unit mounts the electronic components held by the electronic component holding unit on an object to be mounted. At least a part of the lifting unit can lift adjacent ones of the plurality of electronic components in such a manner as to straddle them on the same plane. The electronic component holding unit can switch the holding state and the non-holding state of the electronic components for each of the electronic components. Brief Description of the Drawings

[0010] Figure 1 is a block diagram showing an example of the configuration of the semiconductor manufacturing apparatus according to the first embodiment.

[0011] Figure 2 is a top view showing an example of the configuration of the lifting mechanism according to the first embodiment.

[0012] Figure 3A is a diagram showing an example of the manufacturing method of the semiconductor device according to the first embodiment.

[0013] Figure 3B is showing then Figure 3A an example of the manufacturing method of the semiconductor device.

[0014] Figure 3C is showing thenFigure 3B A diagram showing an example of a method for manufacturing a semiconductor device.

[0015] Figure 3D It shows the subsequent Figure 3C A diagram showing an example of a method for manufacturing a semiconductor device.

[0016] Figure 3E It shows the subsequent Figure 3D A diagram showing an example of a method for manufacturing a semiconductor device.

[0017] Figure 3F It shows the subsequent Figure 3E A diagram showing an example of a method for manufacturing a semiconductor device.

[0018] Figure 4 A cross-sectional view showing an example of the operation of the lifting mechanism of the first embodiment.

[0019] Figure 5A A diagram showing an example of a method for manufacturing a semiconductor device of the first embodiment.

[0020] Figure 5B It shows the subsequent Figure 5A A diagram showing an example of a method for manufacturing a semiconductor device.

[0021] Figure 5C It shows the subsequent Figure 5B A diagram showing an example of a method for manufacturing a semiconductor device.

[0022] Figure 5D It shows the subsequent Figure 5C A diagram showing an example of a method for manufacturing a semiconductor device.

[0023] Figure 6A A diagram showing an example of a method for manufacturing a semiconductor device of the comparative example.

[0024] Figure 6B It shows the subsequent Figure 6A A diagram showing an example of a method for manufacturing a semiconductor device.

[0025] Figure 7 A cross-sectional view showing an example of the operation of the lifting mechanism of the second embodiment.

[0026] Figure 8 A cross-sectional view showing an example of the operation of the lifting mechanism of the third embodiment.

[0027] Figure 9 A cross-sectional view showing an example of the operation of the lifting mechanism of the fourth embodiment.

[0028] Figure 10This is a top view showing an example of the configuration of the lifting mechanism according to the fifth embodiment.

[0029] Figure 11 This is a top view showing an example of the configuration of the lifting mechanism according to the sixth embodiment.

[0030] Figure 12 This is a top view showing an example of the configuration of the lifting mechanism according to the seventh embodiment.

[0031] Figure 13 This is a top view showing an example of the configuration of the lifting mechanism according to the eighth embodiment.

[0032] Figure 14 This is a block diagram showing an example of the configuration of a semiconductor manufacturing apparatus according to the ninth embodiment.

[0033] Figure 15 This is a cross-sectional view showing an example of the operation of the lifting mechanism according to the third operation example of the ninth embodiment.

[0034] Figure 16 This is a cross-sectional view showing an example of the operation of the lifting mechanism according to the fourth operation example of the ninth embodiment. Detailed Embodiments

[0035] Hereinafter, embodiments of the present invention will be described with reference to the drawings. These embodiments do not limit the present invention. The drawings are schematic or conceptual, and the ratios of the respective parts do not necessarily have to be the same as in reality. In the specification and the drawings, the same reference numerals are assigned to elements that are the same as those described with respect to the previously presented drawings, and detailed descriptions are appropriately omitted.

[0036] (First Embodiment)

[0037] Figure 1 This is a block diagram showing an example of the configuration of a semiconductor manufacturing apparatus according to the first embodiment. The semiconductor manufacturing apparatus includes a pick-up device 10, a preciser 20, and a mount device 30.

[0038] The pick-up device 10 picks up singulated electronic components from a dicing tape DT. Hereinafter, it is assumed that the electronic component is a semiconductor chip C for the purpose of explanation. However, the electronic component is not limited to the semiconductor chip C.

[0039] The pick-up device 10 includes a lifting mechanism 11, a wafer holding unit 12, and a transfer head 13.

[0040] The lifting mechanism 11 (lifting part) can lift adjacent semiconductor chips C among the multiple semiconductor chips C singulated from the semiconductor wafer W. The lifting mechanism 11 moves below the semiconductor chip C to be picked up (lifted), and lifts the semiconductor chip C and the dicing tape upward from below.

[0041] In addition, the lifting mechanism 11 has a plurality of lifting members 111, 112, and 113. Thus, a multi-stage lifting method is adopted. In addition, for the details of the lifting members 111, 112, and 113, refer to Figure 2 for description later.

[0042] The wafer holding part 12 is arranged around the lifting mechanism 11, and holds the semiconductor chips C around the semiconductor chip C lifted by the lifting mechanism 11. The wafer holding part 12 has suction holes for sucking the back surface of the dicing tape DT, and is connected to a vacuum pump (not shown). The wafer holding part 12 holds the semiconductor chips C around the semiconductor chip C to be lifted by suction.

[0043] The transfer head 13 (transfer part) picks up and transfers the multiple semiconductor chips C lifted by the lifting mechanism 11. The transfer head 13 has, for example, suction chucks for sucking the semiconductor chips C.

[0044] The aligner 20 (electronic component holding part) can place the semiconductor chip C and hold the multiple semiconductor chips C transferred by the transfer head 13. The aligner 20 holds the semiconductor chip C by suction, for example. With the provision of the aligner 20, the picking operation and the mounting operation of the semiconductor chip C can be performed independently. Thus, the process time required for picking and mounting can be shortened.

[0045] The aligner 20 can switch the holding state and the non-holding state of the semiconductor chip C for each semiconductor chip C. The aligner 20 has a plurality of suction parts (not shown) that can independently suck each semiconductor chip C. Thus, each semiconductor chip C can be separately sucked (held). The suction parts (such as suction holes) are connected to a vacuum pump (not shown).

[0046] The mounting device 30 places the semiconductor chip C on the object to be mounted. Hereinafter, it is assumed that the object to be mounted is the wiring substrate S for description. However, the object to be mounted is not limited to the wiring substrate S.

[0047] The mounting device 30 has a mounting head 31.

[0048] The mounting head 31 (mounting section) mounts the semiconductor chip C held by the aligner 20 onto the wiring substrate S. More specifically, the mounting head 31 mounts the semiconductor chips C one by one from among the at least one semiconductor chip C held by the aligner 20 onto the wiring substrate S. The mounting head 31 has, for example, a suction chuck that sucks the semiconductor chip C.

[0049] Next, the configuration of the lifting mechanism 11 will be described in detail.

[0050] Figure 2 It is a top view showing an example of the configuration of the lifting mechanism 11 of the first embodiment. Figure 2 The semiconductor chip C is also shown. In addition, Figure 2 The line A - A in shows the section corresponding to the sectional view of the lifting mechanism 11 in Figure 1

[0051] At least a part of the lifting mechanism 11 can lift adjacent multiple semiconductor chips C in a manner that straddles the adjacent multiple semiconductor chips C on the same plane. Thereby, multiple semiconductor chips C (two semiconductor chips C) can be picked up simultaneously.

[0052] The lifting mechanism 11 has a plurality of lifting members 111, 112, 113. The lifting members 111, 112, 113 respectively correspond to the lifting members of "1", "2", and "3" shown in Figure 2 In addition, the number of the lifting members is not limited to three.

[0053] The lifting members 111, 112, 113 can be lifted and lowered separately (independently).

[0054] The lifting member 113 is, for example, rectangular in shape when viewed from a direction substantially perpendicular to the semiconductor wafer W and is disposed at the center. The lifting member 112 is, for example, disposed so as to surround the lifting member 113. The lifting member 111 is, for example, disposed so as to surround the lifting member 112.

[0055] The semiconductor chip C is, for example, rectangular in shape when viewed from a direction substantially perpendicular to the semiconductor wafer W.

[0056] Next, a method for manufacturing a semiconductor device will be described.

[0057] Figures 3A - 3F It is a diagram showing an example of a method for manufacturing a semiconductor device according to the first embodiment.

[0058] First, as shown in Figure 3A the semiconductor wafer W is singulated into a plurality of semiconductor chips C. The semiconductor wafer W is singulated in a state of being adhered to the dicing tape DT via the adhesive layer A.

[0059] Next, as​Figure 3B As shown, the wafer holding unit 12 holds the semiconductor chips C around the semiconductor chip C to be lifted. The holding of the semiconductor chip C is performed by suction of the wafer holding unit 12.

[0060] Next, as Figure 3C shown, the lifting mechanism 11 lifts the semiconductor chip C to be lifted, and the transfer head 13 sucks and picks up the semiconductor chip C. In Figure 3C the example shown, there are two semiconductor chips C to be lifted. In addition, the operation of the lifting mechanism 11 will be described in detail later with reference to Figure 4 .

[0061] Next, as Figure 3D shown, the transfer head 13 transfers the two semiconductor chips C to the aligner 20. The two semiconductor chips C are transferred simultaneously by the transfer head 13.

[0062] Next, as Figure 3E shown, the mounting head 31 sucks one semiconductor chip C. In addition, the aligner 20 stops sucking (holding) the semiconductor chip C sucked by the mounting head 31.

[0063] Next, as Figure 3F shown, one semiconductor chip C is mounted on the wiring board S.

[0064] After that, the same processes as Figure 3E and Figure 3F are performed on the other semiconductor chip C. That is, the mounting head 31 mounts the semiconductor chips C one by one.

[0065] Next, the operation of the lifting mechanism 11 in the Figure 3C process will be described in detail.

[0066] Figure 4 is a cross-sectional view showing an example of the operation of the lifting mechanism 11 of the first embodiment. Each of the lifting members 111, 112, and 113 corresponds to the lifting members of "1", "2", and "3" shown in Figure 4 . In addition, in Figure 4 , the chuck of the transfer head 13 is shown as the transfer head 13.

[0067] The left and right lifting members 111 lift two semiconductor chips C on the same plane (refer to Figure 2 ). The left and right lifting members 112 lift two semiconductor chips C on the same plane (refer to Figure 2 ).

[0068] First, as Figure 4As shown in (a), the transfer head 13 adsorbs two semiconductor chips C. In addition, the lifting members 111, 112, and 113 are in the state before lifting and all have the same height.

[0069] Next, as Figure 4 shown in (b), all the lifting members 111, 112, and 113 rise to lift the semiconductor chip C. In addition, the lifting members 111, 112, and 113 all have the same height.

[0070] Next, as Figure 4 shown in (c), the lifting members 112 and 113 rise to lift the semiconductor chip C. As a result, the dicing tape DT around the lifting member 112 is peeled off from the semiconductor chip C.

[0071] Next, as Figure 4 shown in (d), the lifting member 113 rises to lift the semiconductor chip C. As a result, the dicing tape DT around the lifting member 113 is peeled off from the semiconductor chip C. Thus, the dicing tape DT is gradually peeled off from the semiconductor chip C from the outside of the lifting mechanism 11.

[0072] Next, as Figure 4 shown in (e), the transfer head 13 rises to pick up two semiconductor chips C.

[0073] Next, a method for manufacturing a semiconductor device after mounting the semiconductor chip C on the wiring substrate S will be described.

[0074] Figures 5A - 5D is a diagram showing an example of a method for manufacturing a semiconductor device according to the first embodiment.

[0075] First, as Figure 5A shown, the singulated semiconductor chip C is picked up and mounted on the wiring substrate S. The picking up and mounting of the semiconductor chip C are performed through the process shown in Figures 3A - 3F . In the example shown in Figure 5A , an adhesive layer A is shown under the semiconductor chip C. In addition, a plurality of semiconductor chips C are shown stacked in a direction substantially perpendicular to the wiring substrate S.

[0076] Next, as Figure 5B shown, bonding wires BW for electrically connecting the wiring substrate S and the semiconductor chip C are formed.

[0077] Next, as Figure 5C shown, a molding resin M for covering the semiconductor chip C and the bonding wires BW is formed on the wiring substrate S. In addition, metal bumps B are formed on the lower surface of the wiring substrate S. The metal bumps B are, for example, solder balls.

[0078] Next, asFigure 5D Singulation is performed as shown. Thus, the semiconductor device as one semiconductor package is completed.

[0079] As described above, according to the first embodiment, at least a part of the lifting mechanism 11 can lift a plurality of adjacent semiconductor chips C so as to straddle the adjacent semiconductor chips C on the same surface. In addition, the aligner 20 can switch the holding state and the non-holding state of the semiconductor chip C for each semiconductor chip C. Thereby, it is possible to more appropriately pick up the semiconductor chip C having a high aspect ratio and a small thickness. In addition, the time required for picking up is shortened, so the productivity is improved.

[0080] The thickness of the semiconductor chip C in the direction substantially perpendicular to the semiconductor wafer W is, for example, 60 μm or less. In addition, the short side of the semiconductor chip C is, for example, 3.0 mm or less.

[0081] (Comparative example)

[0082] Figure 6A and Figure 6B is a diagram showing an example of a method for manufacturing a semiconductor device of a comparative example. The comparative example is different from the first embodiment in that a single semiconductor chip is picked up.

[0083] After the semiconductor chip C is held by the wafer holding unit 12 (see Figure 3B ), as Figure 6A shown, the lifting mechanism 11 lifts the semiconductor chips C one by one, and the transfer head 13 picks up the semiconductor chips C one by one.

[0084] Next, as Figure 6B shown, the transfer head 13 transfers the semiconductor chips C one by one onto the aligner 20. The aligner 20 adsorbs only one semiconductor chip C. In addition, the mounting head 31 recognizes only one semiconductor chip C on the aligner 20.

[0085] When picking up a thin chip (for example, 60 μm or less), it is effective to adopt a multi-stage lifting method. However, if the aspect ratio of the semiconductor chip C becomes large (for example, length / width = 4 or more) and the semiconductor chip C becomes thin, it is difficult to manufacture the lifting members 111, 112, 113 (jigs) for the multi-stage lifting method.

[0086] In addition, even when the aspect ratio is large, if the semiconductor chip C is thin, there is a possibility of chip breakage when picking up by the pin lifting method.

[0087] In contrast, in the first embodiment, the lifting mechanism 11 simultaneously lifts a plurality of semiconductor chips C. A plurality of semiconductor chips C arranged in the short side direction are simultaneously picked up as one semiconductor chip C. Thereby, the apparent aspect ratio of the semiconductor chip C can be reduced. Therefore, it is possible to pick up a semiconductor chip C having a relatively high aspect ratio and being thin without manufacturing the lifting members 111, 112, 113 (jigs) that accompany the change in the aspect ratio of the semiconductor chip C. In addition, since a plurality of semiconductor chips C can be picked up simultaneously, the productivity can be improved.

[0088] (Second Embodiment)

[0089] Figure 7 It is a cross-sectional view showing an example of the operation of the lifting mechanism 11 of the second embodiment. In the second embodiment, the operation of the lifting mechanism 11 is different from that of the first embodiment.

[0090] First, as Figure 7 shown in (a) of FIG., the transfer head 13 adsorbs two semiconductor chips C. In addition, the lifting members 111, 112, 113 are in a state before lifting, and all have the same height.

[0091] Next, as Figure 7 shown in (b) of FIG., all the lifting members 111, 112, 113 rise to lift the semiconductor chips C. In addition, all the lifting members 111, 112, 113 have the same height.

[0092] Next, as Figure 7 shown in (c) of FIG., the lifting member 112 rises to lift the semiconductor chip C. Thereby, the dicing tape DT around the lifting member 112 is peeled off from the semiconductor chip C.

[0093] Next, as Figure 7 shown in (d) of FIG., the transfer head 13 rises to pick up two semiconductor chips C.

[0094] As in the second embodiment, the operation of the lifting mechanism 11 can also be changed. In this case, the same effect as that of the first embodiment can also be obtained.

[0095] (Third Embodiment)

[0096] Figure 8 It is a cross-sectional view showing an example of the operation of the lifting mechanism 11 of the third embodiment. In the third embodiment, the operation of the lifting mechanism 11 is different from that of the first embodiment.

[0097] First, as Figure 8As shown in (a) of , the transfer head 13 adsorbs two semiconductor chips C. In addition, the lifting members 111, 112, and 113 are in the state before lifting, and all have the same height.

[0098] Next, as Figure 8 shown in (b) of , all the lifting members 111, 112, and 113 rise to lift the semiconductor chip C. In addition, the lifting members 111, 112, and 113 all have the same height.

[0099] Next, as Figure 8 shown in (c) of , the lifting member 111 descends. As a result, the dicing tape DT around the lifting member 112 is peeled off from the semiconductor chip C.

[0100] Next, as Figure 8 shown in (d) of , the lifting member 112 descends. As a result, the dicing tape DT around the lifting member 113 is peeled off from the semiconductor chip C. Thus, the dicing tape DT is gradually peeled off from the semiconductor chip C from the outside of the lifting mechanism 11.

[0101] Next, as Figure 8 shown in (e) of , the transfer head 13 rises to pick up two semiconductor chips C.

[0102] In the stepwise descending method, it is difficult to apply stress to the semiconductor chip C compared with the stepwise ascending method. Therefore, in the case of using a thinner semiconductor chip C, the stepwise descending method is preferred.

[0103] As in the third embodiment, the operation of the lifting mechanism 11 can also be changed. In this case, the same effect as in the first embodiment can also be obtained.

[0104] (Fourth Embodiment)

[0105] Figure 9 It is a cross-sectional view showing an example of the operation of the lifting mechanism 11 in the fourth embodiment. In the fourth embodiment, the operation of the lifting mechanism 11 is different from that in the first embodiment.

[0106] First, as Figure 9 shown in (a) of , the transfer head 13 adsorbs two semiconductor chips C. In addition, the lifting members 111, 112, and 113 are in the state before lifting, and all have the same height.

[0107] Next, as Figure 9 shown in (b) of , all the lifting members 111, 112, and 113 rise to lift the semiconductor chip C. In addition, the lifting members 111, 112, and 113 all have the same height.

[0108] Next, asFigure 9 As shown in (c) thereof, the lifting members 111 and 113 descend. Thereby, the dicing tape DT around the lifting member 112 is peeled off from the semiconductor chip C.

[0109] Next, as Figure 9 shown in (d) thereof, the lifting member 112 ascends to lift the semiconductor chip C.

[0110] Next, as Figure 9 shown in (e) thereof, the transfer head 13 ascends to pick up two semiconductor chips C.

[0111] As in the fourth embodiment, the operation of the lifting mechanism 11 can also be changed. In this case, the same effect as in the first embodiment can also be obtained.

[0112] (Fifth Embodiment)

[0113] Figure 10 FIG. is a plan view showing an example of the configuration of the lifting mechanism 11 in the fifth embodiment. In the fifth embodiment, the configuration of the lifting mechanism 11 is different from that in the first embodiment.

[0114] The lifting member 113 is, for example, rectangular when viewed from a direction substantially perpendicular to the semiconductor wafer W and is disposed at the center. The two lifting members 112 are disposed so as to sandwich the lifting member 113 in the long side direction of the semiconductor chip C. The two lifting members 111 are disposed so as to sandwich the two lifting members 112 in the long side direction of the semiconductor chip C.

[0115] As in the fifth embodiment, the configuration of the lifting mechanism 11 can also be changed. In this case, the same effect as in the first embodiment can also be obtained.

[0116] (Sixth Embodiment)

[0117] Figure 11 FIG. is a plan view showing an example of the configuration of the lifting mechanism 11 in the sixth embodiment. In the sixth embodiment, the number of semiconductor chips C lifted by the lifting mechanism 11 is different from that in the fifth embodiment.

[0118] In Figure 11 the example shown, the lifting mechanism 11 simultaneously lifts 1×3 semiconductor chips C in the longitudinal × transverse direction.

[0119] As in the sixth embodiment, the number of semiconductor chips C lifted by the lifting mechanism 11 can also be changed. In this case, the same effect as in the fifth embodiment can also be obtained.

[0120] (Seventh Embodiment)

[0121] Figure 12It is a top view showing an example of the configuration of the lifting mechanism 11 of the seventh embodiment. In the seventh embodiment, compared with the fifth embodiment, the number of semiconductor chips C lifted by the lifting mechanism 11 is different.

[0122] In Figure 12 the example shown, the lifting mechanism 11 simultaneously lifts 1×4 semiconductor chips C in the longitudinal and transverse directions.

[0123] As in the seventh embodiment, the number of semiconductor chips C lifted by the lifting mechanism 11 can also be changed. In this case, the same effects as those of the fifth embodiment can also be obtained.

[0124] (Eighth Embodiment)

[0125] Figure 13 It is a top view showing an example of the configuration of the lifting mechanism 11 of the eighth embodiment. In the eighth embodiment, compared with the first embodiment, the number of semiconductor chips C lifted by the lifting mechanism 11 is different.

[0126] In Figure 13 the example shown, the lifting mechanism 11 simultaneously lifts 2×2 semiconductor chips C in the longitudinal and transverse directions.

[0127] As in the eighth embodiment, the number of semiconductor chips C lifted by the lifting mechanism 11 can also be changed. In this case, the same effects as those of the fifth embodiment can also be obtained.

[0128] (Ninth Embodiment)

[0129] Figure 14 It is a block diagram showing an example of the configuration of the semiconductor manufacturing apparatus of the ninth embodiment. The ninth embodiment is different from the first embodiment in that the quality determination of the semiconductor chip C is performed.

[0130] The pickup device 10 further includes a photographing unit 14.

[0131] The photographing unit 14 photographs the singulated semiconductor chip C. The photographing unit 14 is, for example, a camera.

[0132] The semiconductor manufacturing apparatus further includes a control device 40.

[0133] The control device 40 controls the pickup device 10 and the mounting device 30.

[0134] The control device 40 includes a determination unit 41 and a control unit 42. In addition, the determination unit 41 and the control unit 42 may also be provided inside the photographing unit 14.

[0135] The determination unit 41 determines the quality, presence or absence, etc. of the semiconductor chip C based on the imaging result of the imaging unit 14. Therefore, the determination unit 41 identifies whether the semiconductor chip C is a qualified chip or a non - qualified chip. In addition, the determination unit 41 also identifies the presence or absence of the semiconductor chip C.

[0136] The control unit 42 sends control signals to the pickup device and the mounting device 30 according to the determination result of the determination unit 41. Thereby, it is possible to make the pickup device 10 and the mounting device 30 perform different actions according to the quality, presence or absence, etc. of the two semiconductor chips C to be picked up.

[0137] When the determination unit 41 identifies that the two semiconductor chips C are qualified chips, the pickup device 10 adsorbs and conveys the two semiconductor chips C. The operation in this case is the same as the operation described in the first embodiment.

[0138] An example of the operation when the determination unit 41 identifies that one semiconductor chip C is a qualified chip and one semiconductor chip C is a non - qualified chip will be described.

[0139] As a first operation example, the transfer head 13 adsorbs two semiconductor chips C, conveys the qualified chip to the aligner 20, and discards the non - qualified chip immediately after picking it up (before conveying it to the aligner 20). The non - qualified chip is discarded into a waste container, for example. That is, the transfer head 13 discards the semiconductor chip C that is lifted by the lifting mechanism 11 and determined by the determination unit 41 to be a non - qualified product.

[0140] As a second operation example, the transfer head 13 adsorbs two semiconductor chips C and conveys them to the aligner 20. After that, the mounting head 31 discards the non - qualified chip. The non - qualified chip is discarded into a waste container, for example. That is, the mounting head 31 discards the semiconductor chip C that is held by the aligner 20 and determined by the determination unit 41 to be a non - qualified product.

[0141] Figure 15 It is a cross - sectional view showing an example of the operation of the lifting mechanism 11 which is the third operation example of the ninth embodiment.

[0142] The adsorption chuck of the transfer head 13 has a plurality of independent adsorption holes.

[0143] The transfer head 13 transfers the semiconductor chip C determined by the determination unit 41 to be a qualified product among the semiconductor chips C lifted by the lifting mechanism 11, and does not transfer the semiconductor chip C determined by the determination unit 41 to be a non - qualified product.

[0144] As a third operation example, the transfer head 13 closes the suction corresponding to the defective chips, sucks the qualified chips, and conveys the calibrator 20. That is, the transfer head 13 leaves the defective chips on the dicing tape DT. In addition, in a state where the transfer head 13 sucks the qualified chips, the lifting mechanism 11 lifts two semiconductor chips.

[0145] In Figure 15 In the example shown, the transfer head 13 opens the suction on the left side and closes the suction on the right side. The lifting mechanism 11 lifts two semiconductor chips C in a state where the transfer head 13 sucks the qualified chips. Thereby, the semiconductor chip C on the left side can be transferred, and the semiconductor chip C on the right side can be left on the dicing tape DT.

[0146] Figure 16 It is a cross-sectional view showing an example of the operation of the lifting mechanism 11 in the fourth operation example of the ninth embodiment.

[0147] The lifting mechanism 11 lifts the semiconductor chip C determined to be a qualified product by the determination unit 41 among the semiconductor chips C to be lifted, and does not lift the semiconductor chip C determined to be a defective product by the determination unit 41. The right lifting member 111 and the left lifting member 111 can be lifted independently of each other. The right lifting member 112 and the left lifting member 112 can be lifted independently of each other.

[0148] As a fourth operation example, the lifting mechanism 11 lifts the semiconductor chips C asymmetrically left and right. More specifically, the transfer head 13 sucks two semiconductor chips C, and the lifting mechanism 11 lifts the two semiconductor chips. After that, the lifting mechanism 11 only lowers the lifting members directly below the qualified chips in order from the outer peripheral side. That is, the defective chips are left on the dicing tape DT. After that, the transfer head 13 conveys the qualified chips to the calibrator 20. In addition, the transfer head 13 may close the suction on the right side when the lifting member is lowered.

[0149] In Figure 16 In the example shown, the left lifting members 111 and 112 do not rise, and the right lifting members 111 and 112 rise. Thereby, the semiconductor chip C on the left side can be transferred, and the semiconductor chip C on the right side can be left on the dicing tape DT.

[0150] An operation example in the case where the determination unit 41 identifies that one semiconductor chip C is a qualified chip and there is no semiconductor chip C on one side, that is, the semiconductor chip C at the end of the picked-up semiconductor wafer W, will be described.

[0151] As a fifth operation example, the transfer head 13 closes the suction on the side where there is no semiconductor chip C and conveys the qualified chips.

[0152] As a sixth operation example, the lifting mechanism 11 performs lifting asymmetrically left and right. After that, the transfer head 13 adsorbs the qualified chip and conveys it to the aligner 20.

[0153] When the determination unit 41 identifies that the two semiconductor chips C are defective chips, the picking up of the two defective chips is not performed. That is, the lifting mechanism 11, the wafer holding unit 12, and the transfer head 13 move to the next two semiconductor chips C.

[0154] As in the ninth embodiment, the determination of the quality of the semiconductor chip C may also be performed. In this case, the same effect as that of the first embodiment can also be obtained.

[0155] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the scope equivalent to the invention described in the claims.

[0156] Explanation of reference numerals

[0157] 10 Picking device, 11 Lifting mechanism, 111 to 113 Lifting members, C Semiconductor chip, 20 Aligner, 30 Mounting device, 40 Control device, 41 Determination unit, S Wiring board, W Semiconductor wafer

Claims

1. A semiconductor manufacturing apparatus, characterized in that, Comprising: A lifting part capable of lifting adjacent ones of a plurality of electronic components singulated from a wafer; A transfer part capable of transferring the plurality of electronic components lifted by the lifting part; An electronic component holding part capable of holding the plurality of electronic components transferred by the transfer part; And A mounting part for mounting the electronic components held by the electronic component holding part on an object to be mounted, At least a part of the lifting part can lift adjacent ones of the plurality of electronic components in a manner that spans adjacent ones of the plurality of electronic components on the same plane, The electronic component holding part can switch the holding state and the non-holding state of the electronic components for each of the electronic components.

2. The semiconductor manufacturing apparatus according to claim 1, wherein: The mounting part mounts the electronic components one by one on the object to be mounted from at least one of the electronic components held by the electronic component holding part.

3. The semiconductor manufacturing apparatus according to claim 1, wherein: It further comprises a determination part for determining the quality of the electronic components.

4. The semiconductor manufacturing apparatus according to claim 3, wherein: The transfer part transfers the electronic components determined to be qualified by the determination part among the electronic components lifted by the lifting part, and does not transfer the electronic components determined to be unqualified by the determination part.

5. The semiconductor manufacturing apparatus according to claim 3, wherein: The lifting part lifts the electronic components determined to be qualified by the determination part among the electronic components to be lifted, and does not lift the electronic components determined to be unqualified by the determination part.

6. The semiconductor manufacturing apparatus according to claim 5, wherein: The lifting part lifts the electronic components asymmetrically.

7. The semiconductor manufacturing apparatus according to claim 3, wherein: The transfer part discards the electronic components lifted by the lifting part and determined to be unqualified by the determination part.

8. The semiconductor manufacturing apparatus according to claim 3, wherein: The mounting part discards the electronic components held by the electronic component holding part and determined to be unqualified by the determination part.

9. The semiconductor manufacturing apparatus according to claim 1, wherein: The thickness of the electronic components in a first direction substantially perpendicular to the wafer is 60 μm or less, The electronic components are rectangular when viewed from the first direction, The short side of the electronic components is 3.0 mm or less.

10. The semiconductor manufacturing apparatus according to claim 1, wherein: It further comprises a wafer holding part for holding the electronic components around the electronic components lifted by the lifting part.

11. The semiconductor manufacturing apparatus according to any one of claims 1 to 10, wherein: The electronic components are semiconductor chips, The object to be mounted is a wiring substrate.

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