TR module with high-power TPG heat dissipation framework

Abstract

The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a TR module with a high-power TPG heat dissipation framework. Comprising a cavity, a TPG material layer and a plurality of fins, the multiple fins are arranged side by side in the length direction of the cavity. The TPG material layer is positioned between the cavity and the plurality of fins; the cavity, the TPG material layer and the fins are connected into a whole in a friction stir welding mode, and the TR module is formed. According to the invention, heat is quickly diffused to the copper fins through the TPG material layer and is taken away through natural heat dissipation or forced air cooling heat dissipation, so that the radio frequency chip is effectively prevented from being overheated.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation for electronic devices, and more specifically, to a TR module with a high-power TPG heat dissipation architecture. Background Art

[0002] With the development of phased array radar technology, the integration and power density of TR modules have been continuously increasing, resulting in a concentrated heat source and an increasingly prominent heat dissipation problem. Traditional natural heat dissipation and forced air cooling methods often fail to meet the heat dissipation requirements in high-power TR modules. Especially when volume and weight are restricted, low heat dissipation efficiency may cause the RF chips to overheat or even burn out.

[0003] In view of this, the present application is specifically proposed. Summary of the Invention

[0004] The object of the present invention is to provide a TR module with a high-power TPG heat dissipation architecture, which can effectively solve the problem of heat concentration in high-power TR modules, improve the heat dissipation efficiency, and at the same time maintain the light weight and high integration of the module.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] A TR module with a high-power TPG heat dissipation architecture includes: a cavity, a TPG material layer, and a plurality of fins; the plurality of fins are arranged side by side along the length direction of the cavity; the TPG material layer is located between the cavity and the plurality of fins; the cavity, the TPG material layer, and the plurality of fins are connected as a whole by friction stir welding to form the TR module.

[0007] Further, two TR modules are connected by screws; an air duct is formed between the plurality of fins of one TR module and the plurality of fins of the other TR module.

[0008] Further, the length of the TR module, the number of fins, the shape of the fins, and the size of the fins are all variable.

[0009] Further, the cavity includes: an RF chip and an RF PCB board.

[0010] Further, the thickness of the cavity wall of the cavity is 0.5 mm.

[0011] Further, the thickness of the TPG material layer is 0.5 mm.

[0012] Further, the thickness of the fins is 0.5 mm.

[0013] Further, the material of the cavity is aluminum alloy.

[0014] Furthermore, the fin is made of copper.

[0015] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0016] 1. The heat is quickly diffused to the copper fins through the TPG material layer, and the heat is taken away by natural heat dissipation or forced air cooling, effectively preventing the RF chip from overheating.

[0017] 2. The thin-walled aluminum alloy and copper fins are adopted to ensure the light weight of the heat dissipation structure, which is suitable for high-integration TR modules.

[0018] 3. The TR module cavity can be connected by screws to form a phased array, which is convenient for quick assembly and disassembly.

[0019] 4. The module height and fan size can be adjusted according to the heat dissipation requirements to further improve the heat dissipation efficiency.

[0020] 5. The friction stir welding method ensures the tight connection between the inner cavity, the TPG material layer and the copper fins, improving the overall structural stability and heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 FIG. is a schematic structural diagram of a TR module with a high-power TPG heat dissipation structure provided by an embodiment of the present invention;

[0023] Figure 2 FIG. is a schematic structural diagram of two TR modules forming an air duct by phased array.

[0024] Reference numerals in the drawings and corresponding component names:

[0025] 1 - cavity, 2 - TPG material layer, 3 - fin, 4 - TR module, 5 - air duct. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the embodiments and the drawings. The illustrative embodiments and descriptions thereof of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0027] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures, circuits, materials, or methods have not been specifically described to avoid obscuring aspects of the present invention.

[0028] Throughout the specification, references to "one embodiment", "an embodiment", "an example", or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "one embodiment", "an embodiment", "an example", or "an example" throughout the specification are not necessarily all referring to the same embodiment or example. Additionally, the particular features, structures, or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. Moreover, those of ordinary skill in the art should understand that the diagrams provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] In the description of the present invention, the orientation or positional relationships indicated by the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the scope of protection of the present invention.

[0030] Embodiment: As Figure 1 shown, a TR module of a high-power TPG heat dissipation architecture provided by the embodiment includes: a cavity 1, a TPG material layer 2, and a plurality of fins 3. Among them, the cavity is made of thin-walled aluminum alloy with a thickness of 0.5 mm and is used to accommodate a radio frequency chip and a radio frequency PCB board. The thickness of the TPG material layer 2 is 0.5 mm and is used to quickly spread the heat generated by the radio frequency chip to the fins 3, and take away the heat through natural heat dissipation or forced air cooling to achieve rapid heat conduction and prevent the radio frequency chip from being burned due to heat concentration. The fins 3 are made of copper and are used to increase the heat dissipation surface area, and their thickness, shape, and size can be adjusted according to the heat dissipation requirements to increase the heat dissipation surface area and improve the heat dissipation efficiency. The connection method is as follows: a plurality of fins 3 are arranged side by side along the length direction of the cavity 1; the TPG material layer 2 is located between the cavity 1 and the plurality of fins 3; the cavity 1, the TPG material layer 2, and the plurality of fins 3 are connected into a whole by friction stir welding to form a TR module 4. The friction stir welding method ensures the tight connection between the cavity 1, the TPG material layer 2, and the fins 3, and improves the stability and heat dissipation efficiency of the overall structure.

[0031] Furthermore, the TR module 4 can adapt to different sizes of fans by adjusting the length of the cavity, the number of fins 3, the shape of the fins 3, and the size of the fins 3, so as to increase the air volume and heat transfer coefficient, further improve the heat dissipation effect, and meet different heat dissipation requirements.

[0032] In addition, the TR modules 4 are connected by screws to form a phased array. After splicing, a duct 5 as shown in Figure 2 is formed between the multiple fins 3 of one TR module 4 and the multiple fins 3 of another TR module 4, which is convenient for quick assembly and disassembly.

[0033] In summary, a TR module with a high-power TPG heat dissipation architecture provided in this embodiment forms an efficient heat dissipation structure by connecting a thin-walled aluminum alloy inner cavity, a TPG material layer, and thin-walled copper fins into a whole by friction stir welding. This architecture can quickly spread the heat generated by the radio frequency chip to the copper fins and take away the heat through natural heat dissipation or forced air cooling, effectively preventing the chip from burning out. This heat dissipation architecture has the characteristics of high integration, small volume, and light weight, is suitable for high-power phased array radar systems, and has good scalability. It can adjust the module height and fan size according to the heat dissipation requirements, further improve the heat dissipation efficiency, and extend its service life.

[0034] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A TR module with a high-power TPG heat dissipation architecture, characterized in that, Comprising: A cavity (1), a TPG material layer (2), and a plurality of fins (3); the plurality of fins (3) are arranged side by side along the length direction of the cavity (1); the TPG material layer (2) is located between the cavity (1) and the plurality of fins (3); the cavity (1), the TPG material layer (2), and the plurality of fins (3) are connected into a whole by friction stir welding to form the TR module (4).

2. The TR module with a high-power TPG heat dissipation architecture according to claim 1, wherein, Two of the TR modules (4) are connected by screws; an air duct (5) is formed between the plurality of fins (3) of one of the TR modules (4) and the plurality of fins (3) of the other TR module (4).

3. The TR module with a high-power TPG heat dissipation architecture according to claim 1 or 2, characterized in that, The length of the TR module (4), the number of the fins (3), the shape of the fins (3), and the size of the fins (3) are all variable.

4. A TR module with a high-power TPG heat dissipation architecture according to claim 1 or 2, characterized in that, The cavity (1) includes: a radio frequency chip and a radio frequency PCB board.

5. A TR module with a high-power TPG heat dissipation architecture according to claim 1 or 2, characterized in that The thickness of the cavity wall of the cavity (1) is 0.5 mm.

6. The TR module with a high-power TPG heat dissipation architecture according to claim 1 or 2, characterized in that, The thickness of the TPG material layer (2) is 0.5 mm.

7. The TR module with a high-power TPG heat dissipation architecture according to claim 1 or 2, characterized in that The thickness of the fins (3) is 0.5 mm.

8. The TR module with a high-power TPG heat dissipation architecture according to claim 1 or 2, characterized in that, The material of the cavity (1) is aluminum alloy.

9. A TR module with a high-power TPG heat dissipation architecture according to claim 1 or 2, characterized in that, The material of the fins (3) is copper.

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