High-density PCB connector assembly and assembling method thereof

Abstract

The invention discloses a high-density PCB connector assembly and an assembling method thereof, the high-density PCB connector assembly comprises a shell structure, a composite contact element group, a self-locking mechanism and a heat dissipation structure, the independent replacement of sub-modules is realized through precise mortise and tenon connection, the fit clearance of a dovetail bulge and a wedge-shaped groove is less than or equal to 0.03 mm, the splicing precision is ensured, and the assembly efficiency is improved. An elastic contact piece (a three-dimensional wave-shaped curved surface) and a rigid current-carrying column work cooperatively, high-frequency signal transmission (impedance fluctuation is smaller than or equal to 5%) and large-current bearing (rated current is larger than or equal to 30 A) are considered, a metal substrate (an AlSiC composite material) and a micro-channel heat-conducting fin form a three-dimensional heat dissipation network, actually measured temperature rise is reduced by 35%, real-time monitoring of the plugging state is achieved based on the magnetic coding recognition technology, and the real-time monitoring of the plugging state is achieved. And the misplug identification accuracy is greater than or equal to 99.9%.

Description

Technical Field

[0001] The present invention relates to the technical field of connectors, and particularly to a high-density PCB connector assembly and an assembly method thereof. Background Art

[0002] With the rapid development of electronic devices towards miniaturization and high density, as a key interconnection component, the PCB connector faces severe challenges in aspects such as signal transmission integrity, high-current carrying capacity, and long-term reliability. Traditional connectors mostly adopt an integrated housing structure, where cross-interference between signal and power channels leads to a decline in signal integrity. When transmitting high current, the temperature rise of the contact exceeds 85°C, resulting in failure. The low modularity leads to an increase in maintenance and replacement costs, and the manual insertion error rate is as high as over 3%. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art solutions, the present invention provides a high-density PCB connector assembly, which can effectively solve the problems raised in the background art.

[0004] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0005] A high-density PCB connector assembly includes:

[0006] A housing structure, which is composed of at least two independently detachable insulator modules spliced by tenon and mortise connectors. The insulator modules are provided with non-communicating signal channels and power channels. The two insulator modules are respectively a first sub-module and a second sub-module;

[0007] A composite contact group, including elastic contact sheets arranged in the signal channels and rigid current-carrying columns arranged in the power channels. The contact end of the elastic contact sheet is provided with a three-dimensional wavy surface, and the radius of curvature R of the three-dimensional wavy surface satisfies: 0.05 mm ≤ R ≤ 0.3 mm;

[0008] A self-locking mechanism, including a spring-loaded buckle arranged on the side wall of the housing and a matching guiding inclined surface. The stroke L of the spring-loaded buckle and the height H of the housing satisfy: L = 0.15H ± 0.03H;

[0009] A heat dissipation structure, which is composed of a metal substrate embedded at the bottom of the housing and heat conduction fins extending to the middle of the contact parts. The thermal conductivity of the metal substrate is ≥ 200 W / (m·K).

[0010] As a further description of the above technical solution, the elastic contact sheet is made of a copper-nickel-silicon alloy material, and its composition by weight percentage is: Cu 94 - 96%, Ni 2.5 - 3.5%, Si 0.8 - 1.2%, and the Vickers hardness HV is 180 - 220.

[0011] As a further description of the above technical solution, the heat dissipation fin has a hierarchical microchannel structure, and the hierarchical microchannel structure includes a primary channel with a width of 50-100 μm and a secondary channel with a width of 10-20 μm. The secondary channel is spirally distributed along the axis of the contact member.

[0012] As a further description of the above technical solution, it further includes an anti-misinsertion positioning system. The anti-misinsertion positioning system includes a programmable magnetic coding block, a positioning groove provided on the top surface of the housing, a magnetic sensor array provided in the positioning groove, and a feedback module that generates an audible and visual alarm when misinserted. Among them, the magnetic pole distribution of the programmable magnetic coding block and the positioning groove satisfies: the number of N / S pole pairs n≥3 and the adjacent pole spacing d≤2 mm.

[0013] As a further description of the above technical solution, the magnetic sensor array includes at least three Hall elements distributed in a triangle. The detection thresholds of each Hall element satisfy: an effective signal is triggered when B≥10 mT, and the detection error≤±0.5 mT.

[0014] As a further description of the above technical solution, the mortise and tenon connector includes a dovetail protrusion provided on the first sub-module and a wedge-shaped groove provided on the second sub-module. The inclination angle α of the dovetail protrusion is 5°±0.5°. The depth h of the wedge-shaped groove and the height H1 of the dovetail protrusion satisfy: h = 1.05H1±0.02 mm, and the fit clearance after the dovetail protrusions are connected is≤0.03 mm.

[0015] As a further description of the above technical solution, the surface of the rigid current-carrying column is provided with a gradient coating structure, and the gradient coating structure from the inside to the outside is as follows:

[0016] The first coating: a nickel-based diffusion barrier layer with a thickness of 3-5 μm;

[0017] The second coating: a palladium-cobalt alloy layer (Co content 8-12 wt%) with a thickness of 1-2 μm;

[0018] The third coating: a gold layer with a thickness of 0.1-0.3 μm.

[0019] As a further description of the above technical solution, it includes the following steps:

[0020] Step S1: The sub-module housing is formed in three times using an injection mold, and a metal substrate is embedded during the second molding;

[0021] Step S2: The heat dissipation fin is joined to the metal substrate by ultrasonic welding, with a welding frequency of 28 kHz±1 kHz and a pressure of 50-80 N;

[0022] Step S3: Assemble the composite contact member group using a vacuum adsorption device, and maintain the vacuum degree at 0.08-0.1 MPa;

[0023] Step S4: Connect the mortise and tenon structure using laser-activated welding technology. The laser wavelength is 1064 nm, and the power density is 15 - 20 W / mm 2 .

[0024] As a further description of the above technical solution, in step S3, the vacuum adsorption device includes a nozzle adapted to the curved surface, a multi-stage pressure regulation module, and a vision positioning system. The surface roughness Ra of the nozzle adapted to the curved surface is ≤ 0.8 μm;

[0025] The pressure control accuracy of the multi-stage pressure regulation module is ±0.5 N, and the positioning accuracy of the vision positioning system is ±0.01 mm.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] A high-density PCB connector assembly and its assembly method of the present invention have at least one of the following beneficial effects during use:

[0028] Independent replacement of sub-modules is achieved through precise mortise and tenon connection. The fit clearance between the dovetail protrusion and the wedge-shaped groove is ≤ 0.03 mm to ensure the splicing accuracy. The elastic contact piece (three-dimensional wavy surface) and the rigid current-carrying column work together to balance high-frequency signal transmission (impedance fluctuation ≤ 5%) and large-current carrying (rated current ≥ 30 A). The metal substrate (AlSiC composite material) and the micro-channel heat dissipation fins form a three-dimensional heat dissipation network, and the actual measured temperature rise is reduced by 35%. The plugging state is monitored in real time based on magnetic coding recognition technology, and the misplug recognition accuracy rate is ≥ 99.9%. Description of the Drawings

[0029] Figure 1 It is a schematic diagram of the overall structure of a high-density PCB connector assembly of the present invention;

[0030] Figure 2 It is a schematic diagram of the first part of the structure of a high-density PCB connector assembly of the present invention;

[0031] Figure 3 It is a schematic diagram of the second part of the structure of a high-density PCB connector assembly of the present invention;

[0032] Figure 4 It is a schematic diagram of the third part of the structure of a high-density PCB connector assembly of the present invention;

[0033] Figure 5 It is a schematic diagram of the assembly method flow of a high-density PCB connector assembly of the present invention.

[0034] Reference numerals in the drawings:

[0035] 1. Housing structure; 101. First sub-module; 102. Second sub-module; 103. Signal channel; 104. Power supply channel; 105. Rigid current-carrying column; 106. Tenon and mortise connector; 107. Anti-misinsertion positioning system; 108. Self-locking mechanism; 109. Elastic contact piece; 110. Three-dimensional wavy surface; 111. Primary channel; 112. Secondary channel. Detailed implementation mode

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] As Figures 1-5 shown, the present invention provides a high-density PCB connector assembly, including:

[0038] A housing structure 1, which is formed by splicing at least two independently detachable insulator modules through a tenon and mortise connector 106. The insulator modules are provided with non-communicating signal channels 103 and power supply channels 104. The two insulator modules are respectively a first sub-module 101 and a second sub-module 102.

[0039] The two insulator modules (the first sub-module 101 and the second sub-module 102B) in this embodiment are spliced through a tenon and mortise connector 106. Among them:

[0040] An elastic contact piece 109 is installed in the signal channel 103. The curvature radius R of its three-dimensional wavy surface 110 is 0.15 mm, the surface roughness Ra is 0.4 μm, and the plugging and unplugging life reaches 5000 times. A rigid current-carrying column 105 with a diameter of Φ2.5 mm is built in the power supply channel 104. The surface gradient coating passes the salt spray test for 96 hours without corrosion. The spring-loaded buckle stroke L of the self-locking mechanism 108 is 1.2 mm (corresponding to the housing height H = 8 mm), and the plugging and unplugging force is controlled within 25N ± 3N.

[0041] A composite contact member group, including an elastic contact piece 109 arranged in the signal channel 103 and a rigid current-carrying column 105 arranged in the power supply channel 104. The contact end of the elastic contact piece 109 is provided with a three-dimensional wavy surface 110, and the curvature radius R of the three-dimensional wavy surface 110 satisfies: 0.05 mm ≤ R ≤ 0.3 mm.

[0042] The elastic contact piece 109 of this embodiment is smelted with an alloy in the ratio of Cu 95.2%, Ni 3.1%, and Si 1.1%. After cold rolling and forming, it is heat-treated (450 °C × 2 h) to obtain an elastic modulus of HV200. A three-dimensional wavy surface 110 is formed by a micro stamping process, with a curvature tolerance of ±0.02 mm.

[0043] The self-locking mechanism 108 includes a spring-loaded buckle and a matching guiding inclined plane provided on the side wall of the housing. The stroke L of the spring-loaded buckle and the height H of the housing satisfy: L = 0.15H ± 0.03H;

[0044] The heat dissipation structure is composed of a metal substrate embedded at the bottom of the housing and heat-conducting fins extending to the middle of the contact member. The thermal conductivity of the metal substrate is ≥200 W / (m·K).

[0045] Under a current load of 30 A, the temperature of the heat dissipation structure in this embodiment is 62 °C, the thermal resistance value (°C / W) is 0.9, and the temperature equilibrium degree is ±4 °C.

[0046] The modular housing of this embodiment realizes independent disassembly and assembly of sub-modules through mortise and tenon connections. The signal and power channels 104 are physically isolated (spacing ≥ 2 mm) to avoid electromagnetic interference. The three-dimensional wavy elastic contact piece 109 forms multi-point contact through curvature optimization (R = 0.05 - 0.3 mm), and the contact resistance is reduced to less than 0.8 mΩ; the rigid current-carrying column 105 cooperates with the power channel 104 to carry a current of ≥30 A. The ratio of the stroke of the self-locking mechanism 108 to the height of the housing (L = 0.15H ± 3%) ensures stable insertion and extraction force (25 ± 3 N), and the spring stiffness matches the deformation of the housing. The metal substrate (AlSiC composite material) and the heat-conducting fins form a three-dimensional heat dissipation path, with a thermal resistance ≤ 0.9 °C / W.

[0047] Further, the elastic contact piece 109 is made of a copper-nickel-silicon alloy material, and its composition is by weight percentage: Cu 94 - 96%, Ni 2.5 - 3.5%, Si 0.8 - 1.2%, and the Vickers hardness HV is 180 - 220.

[0048] After the copper-nickel-silicon alloy (Cu 94 - 96%, Ni 2.5 - 3.5%, Si 0.8 - 1.2%) is solution-treated at 450 °C, Ni-Si strengthening phases are precipitated, with a Vickers hardness HV of 180 - 220 and an elastic modulus of ≥120 GPa. The three-dimensional surface is formed by micro stamping (precision ±0.02 mm), and the surface roughness Ra ≤ 0.4 μm. After 5000 insertions and extractions, the elastic force attenuation < 10%, and the conductivity of the Cu-Ni-Si alloy ≥ 85% IACS.

[0049] Further, the heat dissipation fins have a hierarchical microchannel structure. The hierarchical microchannel structure includes a primary channel 111 with a width of 50 - 100 μm and a secondary channel 112 with a width of 10 - 20 μm. The secondary channel 112 is spirally distributed along the axial direction of the contact member.

[0050] The primary channel 111 (50 - 100 μm wide) guides the main heat dissipation flow, and the secondary channel 112 (10 - 20 μm wide) induces turbulent flow through spiral distribution (pitch 0.5 - 1 mm), increasing the heat transfer coefficient to 8000 W / (m 2 ·K). The total surface area of the microchannels is increased by 3 times compared with the traditional structure. The temperature gradient is reduced from ±12 °C to ±4 °C, and the flow resistance is reduced by 40% (under the condition of a flow velocity of 1 m / s).

[0051] Further, it also includes an anti - misinsertion positioning system 107. The anti - misinsertion positioning system 107 includes a programmable magnetic coding block provided on the top surface of the housing, a positioning groove, a magnetic sensor array provided in the positioning groove, and a feedback module that generates an audible and visual alarm when misinserted. Among them, the pole distribution of the programmable magnetic coding block and the positioning groove satisfies: the number of N / S pole pairs n ≥ 3 and the adjacent pole pitch d ≤ 2 mm.

[0052] The magnetic coding block (number of N / S pole pairs n ≥ 3) and the Hall array form a binary coding combination (such as N - S - N - S corresponding to the code 1010). The adjacent pole pitch d ≤ 2 mm ensures a magnetic field strength ≥ 15 mT. The feedback module outputs an error code through the RS485 interface. An angular deviation of the anti - misinsertion accuracy > 1° triggers an alarm, and the coding capacity can be expanded to 2n combinations (n ≤ 8).

[0053] Further, the magnetic sensor array includes at least three Hall elements distributed in a triangular shape. The detection thresholds of each Hall element satisfy: an effective signal is triggered when B ≥ 10 mT, and the detection error ≤ ±0.5 mT.

[0054] Three Hall elements (model AH49E) are arranged in an equilateral triangle layout with a side length of 5 mm, and the insertion angle is judged by the synthesis of the magnetic field vectors on the three sides. The detection threshold B ≥ 10 mT, and the resolution is 0.1 mT. Single - sensor failure can still be recognized, and the positioning accuracy is ±0.05 mm (traditional mechanical positioning is ±0.5 mm).

[0055] Further, the tenon - mortise connector 106 includes a dovetail protrusion provided on the first sub - module 101 and a wedge - shaped groove provided on the second sub - module 102. The inclination angle α of the dovetail protrusion is 5° ± 0.5°. The depth h of the wedge - shaped groove and the height H1 of the dovetail protrusion satisfy: h = 1.05H1 ± 0.02 mm, and the fit clearance after the connection of the dovetail protrusions ≤ 0.03 mm.

[0056] The inclination angle α of the dovetail protrusion is 5° ± 0.5°, the fit clearance is ≤ 0.03 mm, and interference fit is achieved through elastic deformation (the deformation amount is ≤ 0.01 mm). The groove depth h = 1.05H1 ± 0.02 mm provides a pre-tightening force (20 - 30 N). The tensile strength is ≥ 80 N (ISO 13061 standard), and the position deviation is < 0.005 mm after 10 disassembly and assembly operations.

[0057] Furthermore, a gradient coating structure is provided on the surface of the rigid current-carrying column 105, and the gradient coating structure from the inside to the outside is as follows:

[0058] The first coating: a nickel-based diffusion barrier layer with a thickness of 3 - 5 μm;

[0059] The second coating: a palladium-cobalt alloy layer (Co content 8 - 12 wt%) with a thickness of 1 - 2 μm;

[0060] The third coating: a gold layer with a thickness of 0.1 - 0.3 μm.

[0061] The nickel layer (3 - 5 μm) serves as a diffusion barrier layer (porosity < 5%), the palladium-cobalt alloy (Co 8 - 12 wt%) has a hardness of HV300 - 350, and the gold layer (0.1 - 0.3 μm) has a contact resistance of ≤ 0.5 mΩ. The bonding force between the coatings is enhanced by ion bombardment (bonding force ≥ 50 MPa). After a 96-hour salt spray test (ASTM B117), the coating wear is < 0.05 μm after 1000 plugging and unplugging operations.

[0062] Furthermore, it includes the following steps:

[0063] Step S1: The sub-module housing is formed in three times using an injection mold, and a metal substrate is embedded during the second molding;

[0064] Step S2: The heat dissipation fins are joined to the metal substrate by ultrasonic welding, with a welding frequency of 28 kHz ± 1 kHz and a pressure of 50 - 80 N;

[0065] Step S3: The composite contact member group is assembled using a vacuum adsorption device, and the vacuum degree is maintained at 0.08 - 0.1 MPa;

[0066] Step S4: The mortise and tenon structure is connected using a laser activation welding technique, with a laser wavelength of 1064 nm and a power density of 15 - 20 W / mm 2 。

[0067] The injection molding is formed in three times: the first time forms the insulating frame (LCP material), the second time embeds the metal substrate (interference amount 0.02 mm), and the third time injects the sealing joint. Laser activation welding (wavelength 1064 nm) generates a micro-melting layer (depth 0.1 - 0.2 mm) at the mortise and tenon interface. The helium leak detection rate is ≤ 1×10 -8 Pa·m3 / s, shear force ≥ 150 N.

[0068] Furthermore, in the step S3, the vacuum adsorption device includes a nozzle adapted to the curved surface, a multi-stage pressure regulation module and a vision positioning system. The surface roughness Ra of the nozzle adapted to the curved surface is ≤ 0.8 μm;

[0069] The pressure control accuracy of the multi-stage pressure regulation module is ±0.5 N, and the positioning accuracy of the vision positioning system is ±0.01 mm.

[0070] The self-adaptive nozzle (silicone material, Shore hardness 50A) adsorbs the curved surface contact piece through negative pressure (0.08 - 0.1 MPa). The vision positioning (5 million pixel CMOS) has an identification accuracy of ±0.01 mm, and the pressure regulation module (piezoelectric ceramic drive) dynamically compensates ±0.5 N. The alignment error of the contact part is < 0.005 mm, and the single-piece assembly time is ≤ 8 s (traditional process ≥ 30 s).

[0071] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A high-density PCB connector assembly, characterized in that, Including: A housing structure, which is composed of at least two independently detachable insulator modules spliced by mortise and tenon connectors. The insulator modules are provided with non-connected signal channels and power channels. The two insulator modules are respectively a first sub-module and a second sub-module; A composite contact group, including elastic contact pieces arranged in the signal channel and rigid current-carrying columns arranged in the power channel. The contact end of the elastic contact piece is provided with a three-dimensional wavy surface, and the curvature radius R of the three-dimensional wavy surface satisfies: 0.05mm ≤ R ≤ 0.3mm; A self-locking mechanism, including a spring-loaded buckle arranged on the side wall of the housing and a matching guiding inclined surface. The stroke L of the spring-loaded buckle and the height H of the housing satisfy: L = 0.15H ± 0.03H; A heat dissipation structure, which is composed of a metal substrate embedded at the bottom of the housing and heat conduction fins extending to the middle of the contact pieces. The thermal conductivity of the metal substrate is ≥ 200W / (m·K).

2. The high-density PCB connector assembly according to claim 1, wherein: The elastic contact piece is made of copper-nickel-silicon alloy material, and its composition is calculated by weight percentage as: Cu 94-96%, Ni 2.5-3.5%, Si 0.8-1.2%, and the Vickers hardness HV is 180-220.

3. A high-density PCB connector assembly according to claim 1, characterized in that: The heat conduction fins have a hierarchical microchannel structure. The hierarchical microchannel structure includes a first-level channel with a width of 50-100μm and a second-level channel with a width of 10-20μm. The second-level channel is spirally distributed along the axial direction of the contact piece.

4. A high-density PCB connector assembly according to claim 1, characterized in that: It also includes an anti-misinsertion positioning system. The anti-misinsertion positioning system includes a programmable magnetic coding block arranged on the top surface of the housing, a positioning groove, a magnetic sensor array arranged in the positioning groove, and a feedback module that generates an audible and visual alarm when misinserted. Among them, the magnetic pole distribution of the programmable magnetic coding block and the positioning groove satisfies: the number of N / S pole pairs n ≥ 3 and the adjacent pole spacing d ≤ 2mm.

5. The high-density PCB connector assembly according to claim 4, characterized in that: The magnetic sensor array includes at least three Hall elements distributed in a triangle. The detection thresholds of the Hall elements satisfy: an effective signal is triggered when B ≥ 10mT, and the detection error ≤ ±0.5mT.

6. A high-density PCB connector assembly according to claim 1, characterized in that: The mortise and tenon connector includes a dovetail protrusion arranged on the first sub-module and a wedge-shaped groove arranged on the second sub-module. The inclination angle α of the dovetail protrusion is 5° ± 0.5°. The depth h of the wedge-shaped groove and the height H1 of the dovetail protrusion satisfy: h = 1.05H1 ± 0.02mm, and the fitting clearance after the dovetail protrusions are connected is ≤ 0.03mm.

7. A high-density PCB connector assembly according to claim 1, characterized in that: The surface of the rigid current-carrying column is provided with a gradient coating structure, and the gradient coating structure is from the inside to the outside in turn: The first coating: a nickel-based diffusion barrier layer with a thickness of 3-5μm; The second coating: a palladium-cobalt alloy layer (Co content 8-12wt%) with a thickness of 1-2μm; The third coating: a gold layer with a thickness of 0.1-0.3μm.

8. The assembling method of the PCB connector assembly according to any one of claims 1-7, characterized in that: Including the following steps: Step S1: The sub-module housing is formed in three times by an injection mold, and the metal substrate is embedded during the second molding; Step S2: The heat conduction fins are joined to the metal substrate by ultrasonic welding, the welding frequency is 28kHz ± 1kHz, and the pressure is 50-80N; Step S3: The composite contact group is assembled using a vacuum adsorption device, and the vacuum degree is maintained at 0.08-0.1MPa; Step S4: Connect the mortise and tenon structure using laser-activated welding technology with a laser wavelength of 1064 nm and a power density of 15 - 20 W / mm 2 .

9. The assembling method of the PCB connector assembly according to claim 8, wherein: In the step S3, the vacuum adsorption device includes a nozzle adaptable to a curved surface, a multi-stage pressure regulation module, and a vision positioning system, and the surface roughness Ra of the nozzle adaptable to the curved surface is ≤ 0.8 μm; The pressure control accuracy of the multi-stage pressure regulation module is ±0.5 N, and the positioning accuracy of the vision positioning system is ±0.01 mm.

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