A welding device for PCB board

Abstract

The present invention relates to the technical field of circuit board welding equipment, and discloses a welding device for a PCB board, comprising a conveying mechanism, a wave soldering mechanism, and a fixing mechanism, wherein the conveying mechanism comprises a conveying assembly and a carrier, and the fixing mechanism comprises a pin fixing assembly and a board fixing assembly; the board fixing assembly comprises a pressing member and a pressing driving member, the pressing member being arranged on the carrier for moving up and down, and the pressing driving member being capable of driving the pressing member to move downward; the pin fixing assembly comprises an extrusion airbag, the extrusion airbag being arranged above the wave soldering mechanism, and when the PCB board is conveyed to the top of the wave soldering mechanism, the extrusion airbag is located above the PCB board, and the extrusion airbag is capable of downwardly squeezing components inserted on the PCB board. When the PCB board welding device of the present invention is in use, the components and the PCB board are fixed by the pin fixing assembly and the board fixing assembly, and can prevent the pins and the PCB board from moving when subjected to the upward impact of the soldering liquid wave crest, thereby preventing poor welding.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board welding equipment, and in particular to a welding device for a PCB board. Background Art

[0002] A PCB, or printed circuit board, is a support for electronic components and serves as a means of electrical connection. During PCB production, the pins of components mounted on the PCB must be soldered to the PCB's pads. Wave soldering is commonly used to solder these pins to the PCB's pads.

[0003] Chinese patent application number CN219852522U discloses a wave soldering machine comprising a clamping mechanism, a flux spraying mechanism, a preheating mechanism, a soldering mechanism, and a cooling mechanism. The clamping mechanism comprises two conveyor belts for moving circuit boards. Fixing clamps are arranged in an equidistant array on the outer sides of the conveyor belts. The bottoms of the fixing clamps are provided with hooks. The two ends of the circuit board are respectively mounted on the hooks on either side. The fixing clamps on both sides work in conjunction with each other, and the hooks hold the ends of the circuit board, driving the circuit board through the movement of the conveyor belts. The flux spraying mechanism comprises a spray box and a movable chamber. The movable chamber is located on one side of the spray box and has an open top. A drive motor and a movable frame are located within the spray box, and a nozzle is located within the movable chamber. The soldering mechanism comprises a solder bath and a turbulence pump. Heaters are located on all sides of the solder bath, and the turbulence pump is located within the solder bath. A turbulence nozzle is located on the top of the solder bath. The preheating mechanism comprises a horizontally arranged preheating plate, and the cooling mechanism comprises a cooling fan.

[0004] When the above-mentioned wave soldering machine is in use, the circuit board with electronic components inserted is placed between the conveyor belts, and the hook-shaped part at the end of the fixed frame supports the two ends of the circuit board. The conveyor belt drives the circuit board to move into the equipment. After the first infrared sensor detects that the circuit board has entered, each mechanism is started in sequence, and the driving motor drives the movable frame to move back and forth. The nozzle mixes the flux with high-pressure air and sprays it out in atomization. While moving with the movable frame, the flux is evenly sprayed on the bottom of the circuit board. After spraying is completed, it is heated by the preheating plate and enters the welding part. The spoiler pump pumps the solder liquid that has been pre-melted and stored in the solder tank to the spoiler nozzle for spraying, forming intermittently arranged peaks and troughs. When the circuit board moves over the spoiler nozzle, it contacts the solder liquid wave peak for welding, and then the circuit board is cooled by the cooling fan.

[0005] A problem with the aforementioned wave soldering machine during use is that, after a circuit board with electronic components installed is placed on the hook-shaped portion of a retaining clamp between two conveyor belts, as the circuit board passes over the soldering mechanism's turbulent nozzle, the solder wave impacts the bottom of the circuit board, contacting the pins of the electronic components and the circuit board to form a joint. This upward impact can cause the circuit board to move upward, potentially causing the pins to move relative to the circuit board, leading to poor soldering. Summary of the Invention

[0006] The present invention provides a soldering device for a PCB board, which aims to solve the problem in the above-mentioned prior art that when the soldering liquid wave peak hits the bottom of the circuit board upward during use, it may cause the circuit board to move upward and may also cause the pins to move upward relative to the circuit board, thereby causing poor soldering.

[0007] The PCB soldering device of the present invention comprises a conveying mechanism and a wave soldering mechanism. The conveying mechanism comprises a conveying assembly and a carrier for carrying the PCB board. The conveying assembly can drive the carrier to move with the PCB board. The wave soldering mechanism is arranged on the moving path of the PCB board and can perform wave soldering on the passing PCB board. The wave soldering mechanism also comprises a fixing mechanism, which comprises a pin fixing assembly and a board fixing assembly. The board fixing assembly comprises a pressing member and a pressing driving member. The pressing member is arranged on the carrier and moves up and down. The pressing driving member can drive the pressing member to move downward to press the PCB board onto the carrier. The pin fixing assembly comprises an extrusion airbag. The extrusion airbag is arranged above the wave soldering mechanism. When the PCB board is conveyed to the top of the wave soldering mechanism, the extrusion airbag is located above the PCB board and can press components inserted on the PCB board downward to press the components onto the PCB board.

[0008] The beneficial effect is that when the PCB board welding device of the present invention is used, the PCB board with the components inserted is first placed on the carrier, and the conveying assembly drives the carrier to move the PCB board from back to front. During the conveying of the PCB board, the downward pressure driving member of the board fixing assembly drives the downward pressure member to move downward to press the PCB board against the carrier. When the PCB board is conveyed above the wave soldering mechanism, the squeezing airbag squeezes the components inserted on the PCB board downward to press the components against the PCB board. When the PCB board welding device of the present invention is used, the components and the PCB board are fixed by the pin fixing assembly and the board fixing assembly, which can prevent the pins and the PCB board from moving when subjected to the upward impact of the solder liquid wave crest, thereby preventing poor soldering.

[0009] Preferably, the conveying assembly includes a mounting frame, a first conveyor belt, a first driving wheel, a first driven wheel, a second conveyor belt, a second driving wheel and a second driven wheel, the first driving wheel, the first driven wheel, the second driving wheel and the second driven wheel are all rotatably arranged on the mounting frame and the rotation axis is vertically arranged, the first conveyor belt is wrapped around the first driving wheel and the first driven wheel, the second conveyor belt is wrapped around the second driving wheel and the second driven wheel, the first conveyor belt and the second conveyor belt are arranged in parallel and spaced apart on the same horizontal plane, and a conveying channel for PCB boards is formed between the first conveyor belt and the second conveyor belt; a plurality of the carriers are provided on the first conveyor belt and the second conveyor belt, the carriers on the first conveyor belt are arranged at intervals along the length direction of the first conveyor belt, the carriers on the second conveyor belt are arranged at intervals along the length direction of the second conveyor belt, and the carriers on the first conveyor belt correspond one to one with the carriers on the second conveyor belt in a direction perpendicular to the conveying direction.

[0010] Preferably, the plate fixing assembly also includes a horizontal pressing member and a pressing driving member. The horizontal pressing member is arranged on the carrier and moves horizontally and perpendicularly to the conveying direction. The pressing driving member can drive the horizontal pressing member to move horizontally and perpendicularly to the conveying direction, and press the PCB board placed on the carrier to clamp the PCB board on the carrier.

[0011] The beneficial effect is that the two side supports of the PCB board are placed on the supporting members of the first conveyor belt and the second conveyor belt, and then the top pressure driving members on the supporting members of the first conveyor belt and the second conveyor belt drive the horizontal top pressure members to approach each other, thereby clamping the PCB board on the supporting members, further improving the fixing effect of the PCB board.

[0012] The two ends of the vertical elastic member are respectively connected to the top pressure plate and the connecting rod, and the lower end of the vertical elastic telescopic rod is fixed on the connecting rod.

[0013] Preferably, the top-pressing driving member is a strip plate-like structure, two top-pressing driving members are provided and are respectively located below the first conveyor belt and the second conveyor belt, the top-pressing driving member is fixed on the mounting frame, the length direction of the top-pressing driving member is consistent with the length direction of the first conveyor belt, the top-pressing driving member has a horizontal extrusion portion protruding toward the middle position of the first conveyor belt and the second conveyor belt, the cross-section of the horizontal extrusion portion is trapezoidal, and the two ends of the horizontal extrusion portion in the length direction have transition inclined surfaces, when the supporting member moves through the transition inclined surfaces, the transition inclined surfaces can squeeze the horizontal elastic telescopic rod to drive the top pressure plate to move toward the middle position of the first conveyor belt and the second conveyor belt, thereby pressing the PCB board placed on the supporting member.

[0014] The beneficial effect is that as the conveyor assembly drives the carrier, carrying the PCB, from back to front, the carrier passes over a transition slope. This slope compresses the horizontal elastic telescopic rod and drives the pressure plate toward the center between the first and second conveyor belts. The pressure plates on both sides clamp the PCB to the carrier. The pressure drive converts the conveyor assembly's conveying power into the power to drive the pressure plates to clamp the PCB, eliminating the need for a separate power source and reducing equipment costs.

[0015] Preferably, the downward pressure driving member is a strip plate structure, two downward pressure driving members are provided and are respectively located below the first conveyor belt and the second conveyor belt, the downward pressure driving member is fixed to the upper surface of the top pressure driving member, the length direction of the downward pressure driving member is consistent with the length direction of the first conveyor belt, the downward pressure driving member has a vertical extrusion portion protruding downward, the cross-section of the vertical extrusion portion is trapezoidal, and the two ends of the vertical extrusion portion in the length direction have downward pressure inclined surfaces, when the supporting member moves past the downward pressure inclined surface, the downward pressure inclined surface can squeeze the vertical elastic telescopic rod to drive the downward pressure block to move downward, thereby pressing the PCB board tightly on the supporting member.

[0016] The beneficial effect is that as the conveyor assembly drives the carrier carrying the PCB from back to front, the carrier passes over the downward-pressing inclined surface, which compresses the vertical elastic telescopic rod and drives the downward-pressing block, thereby pressing the PCB against the carrier. The downward-pressing drive element converts the conveying force of the conveyor assembly into the downward-moving force of the downward-pressing block, eliminating the need for a separate power source and reducing equipment costs.

[0017] Preferably, the pin fixing assembly also includes a rotating drive member for driving the extrusion airbag to rotate. The extrusion airbag is a cylindrical structure with a hollow interior. The rotating shaft of the rotating drive member is coaxially fixedly connected to the extrusion airbag, and the rotating axis of the extrusion airbag is perpendicular to the conveying direction.

[0018] The beneficial effect is that when the PCB board is conveyed to the top of the wave soldering mechanism, the squeezing airbag squeezes the components inserted on the PCB board downward, and the rotating driving part drives the squeezing airbag to rotate, so that the linear speed of the squeezing airbag rotation is the same as the speed of the PCB board conveying, which can prevent the squeezing airbag from generating friction resistance on the components.

[0019] Preferably, the pin fixing assembly also includes an air supply pipe and an air charging and discharging part for inflating or extracting gas from the extrusion airbag. The air supply pipe is fixedly arranged on the mounting frame, one end of the air supply pipe is connected to the air charging and discharging part, and the other end is connected to the inside of the extrusion airbag. The air supply pipe and the extrusion airbag are coaxially arranged, and the extrusion airbag is rotatably connected to the air supply pipe.

[0020] The beneficial effect is that when the PCB is transported above the solder wave crest, the inflator and deflation device can inflate the squeeze airbag, causing the squeeze airbag to squeeze the components inserted on the PCB downward, pressing the components tightly against the PCB. When the PCB leaves the solder wave crest, the inflator and deflation device extracts the gas in the squeeze airbag, causing the squeeze airbag to deflate and move away from the solder wave crest.

[0021] The scraper is located in the horizontal slide and the inclined slot is arranged at the front end of the horizontal slide, and the inclined slot is inclined at the back and lowered at the front. The rear end of the inclined slot is connected to the front end of the horizontal slide, and the scraper is slidably arranged in the horizontal slide and the inclined slot. One end of the reset elastic member is fixed on the mounting plate and the other end is fixed on the scraper. When the reset elastic member is in a natural state, the scraper is located in the horizontal slide and the scraper is located behind the soldering liquid wave peak generated by the wave soldering mechanism. The PCB board can move forward against the scraper during transportation, and the scraper can scrape off the oxide layer formed on the soldering liquid wave peak when passing through the soldering liquid wave peak. When the scraper moves to the front end of the inclined slot, the scraper is located below the PCB board, and the PCB board no longer moves against the scraper.

[0022] The beneficial effect is that the PCB board can move forward against the scraper when being transported, and the scraper can scrape off the oxide layer formed on the solder liquid wave crest when passing through the solder liquid wave crest, thereby preventing the oxide layer from affecting the welding quality.

[0023] Preferably, a proximity switch is further provided on the mounting plate. When the PCB board is transported to above the solder liquid wave crest, the proximity switch sends an inflation signal, and the inflation and deflation component inflates the extrusion airbag; when the PCB board leaves above the solder liquid wave crest, the proximity switch sends an exhaust signal, and the inflation and deflation component extracts the gas in the extrusion airbag.

[0024] The beneficial effects of the present invention are as follows: when the PCB board welding device of the present invention is in use, the components and the PCB board are fixed by the pin fixing assembly and the board fixing assembly, which can prevent the pins and the PCB board from moving when they are subjected to the upward impact of the solder liquid wave crest, thereby preventing poor soldering. In addition, when the PCB board is transported to the top of the wave soldering mechanism, the extrusion airbag squeezes the components inserted on the PCB board downward, and the rotating drive member drives the extrusion airbag to rotate, so that the linear speed of the extrusion airbag rotation is the same as the speed of the PCB board transportation, which can prevent the extrusion airbag from generating friction resistance to the components. When the PCB board is transported, it can move forward against the scraper, and when the scraper passes through the solder liquid wave crest, it can scrape off the oxide layer formed on the solder liquid wave crest, thereby preventing the oxide layer from affecting the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the PCB board welding device of the present invention when in use.

[0026] Figure 2 It is a three-dimensional structural schematic diagram of the supporting component and the fixing mechanism of the PCB board welding device of the present invention.

[0027] Figure 3 yes Figure 2 Main view of the structure.

[0028] Figure 4 yes Figure 2 Right side view of the structure.

[0029] Figure 5 yes Figure 4 Middle AA section view.

[0030] Figure 6 yes Figure 5 A magnified view of the structure at B in the middle.

[0031] Figure 7 It is a schematic diagram of the three-dimensional structure of the supporting component of the PCB welding device of the present invention.

[0032] Figure 8 yes Figure 7 Right side view of the structure.

[0033] Figure 9 yes Figure 7 Main view of the structure.

[0034] Figure 10 It is a schematic diagram of the three-dimensional structure of the fixing mechanism of the PCB welding device of the present invention.

[0035] Figure 11 yes Figure 10 Top view of the structure.

[0036] Figure 12yes Figure 10 Main view of the structure.

[0037] Figure 13 It is a three-dimensional structural schematic diagram of the downward pressing driving component and the upward pressing driving component of the PCB board welding device of the present invention.

[0038] Figure 14 It is a schematic diagram showing the partial three-dimensional structure when the supporting member on the first conveyor belt moves to the transition slope.

[0039] Figure 15 yes Figure 14 Top view of the structure.

[0040] Figure 16 yes Figure 15 Magnified view of the structure at center C.

[0041] Figure 17 yes Figure 14 Main view of the structure.

[0042] Figure 18 yes Figure 17 A magnified view of the structure at position D in the middle.

[0043] Figure 19 The present invention is a schematic diagram of the three-dimensional structure of the wave soldering mechanism and the soldering liquid oxide layer scraping mechanism of the PCB soldering device.

[0044] Figure 20 yes Figure 19 Exploded view of the structure.

[0045] Reference numerals:

[0046] 11. Mounting frame; 12. First conveyor belt; 13. First driving wheel; 14. First driven wheel; 15. Second conveyor belt; 16. Second driving wheel; 17. Second driven wheel; 18. Carrying member; 181. First avoidance hole; 19. U-shaped fixing plate; 191. Horizontal plate; 192. Vertical plate; 193. Second avoidance hole; 194. Sliding groove; 195. Sliding seat; 2. Flux spraying mechanism; 3. Preheating mechanism; 4. Wave soldering mechanism; 41. Solder box; 5. Cooling mechanism; 6. Pin fixing assembly; 61. Extrusion airbag; 62. Rotating drive member; 63. Air supply pipe; 711. Vertical elastic telescopic rod; 7111. First vertical rod; 7112. Second vertical rod; 7113. Vertical spring; 712. Vertical elastic member; 713. : Downward pressure block; 714, connecting rod; 72, downward pressure drive member; 721, vertical extrusion part; 722, downward pressure inclined surface; 731, horizontal elastic telescopic rod; 7311, first horizontal rod; 7312, second horizontal rod; 7313, horizontal spring; 732, horizontal elastic member; 733, top pressure plate; 7331, vertical slide hole; 734, support plate; 74, top pressure drive member; 741, axial hole; 742, horizontal extrusion part; 743, transition inclined surface; 75, fixed column; 81, mounting plate; 811, guide slide groove; 8111, horizontal slide groove; 8112, inclined groove; 82, scraper; 83, reset elastic member; 84, sliding plate; 85, support rod; 86, stop rod; 87, fixed rod; 88, roller; 89, sliding column; 9, PCB board. DETAILED DESCRIPTION

[0047] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0048] like Figures 1-20 As shown, the PCB soldering device of the present invention includes a conveying mechanism, a flux spraying mechanism 2, a preheating mechanism 3, a wave soldering mechanism 4, a cooling mechanism 5, a fixing mechanism, and a mechanism for scraping off the oxide layer of the solder liquid. The conveying mechanism includes a conveying assembly and a carrier 18 for supporting the PCB board 9. The conveying assembly is capable of driving the carrier 18 to move the PCB board 9. The flux spraying mechanism 2, the preheating mechanism 3, the wave soldering mechanism 4, and the cooling mechanism 5 are sequentially arranged, from back to front, along the travel path of the PCB board 9. The flux spraying mechanism 2 sprays flux onto the passing PCB board 9, the preheating mechanism 3 preheats the passing PCB board 9 to facilitate soldering, the wave soldering mechanism 4 generates a solder liquid wave for wave soldering the passing PCB board 9, and the cooling mechanism 5 rapidly cools the PCB board 9 after soldering. The flux spraying mechanism 2, the preheating mechanism 3, the wave soldering mechanism 4, and the cooling mechanism 5 are all prior art, so their structures and operating principles will not be described in detail.

[0049] like Figure 1 As shown, the conveyor assembly includes a mounting frame 11, a first conveyor belt 12, a first driving wheel 13, a first driven wheel 14, a first motor (not shown), a second conveyor belt 15, a second driving wheel 16, a second driven wheel 17, and a second motor (not shown). The output shaft of the first motor is coaxially fixedly connected to the first driving wheel 13, and the output shaft of the second motor is coaxially fixedly connected to the second driving wheel 16. The first driving wheel 13, the first driven wheel 14, the second driving wheel 16, and the second driven wheel 17 are all rotatably mounted on the mounting frame 11 via a rotating shaft. The rotation axes of the first driving wheel 13, the first driven wheel 14, the second driving wheel 16, and the second driven wheel 17 are vertically arranged. The first conveyor belt 12 is wound around the first driving wheel 13 and the first driven wheel 14, and the second conveyor belt 15 is wound around the second driving wheel 16 and the second driven wheel 17. The first conveyor belt 12 and the second conveyor belt 15 are arranged parallel and spaced apart on the same horizontal plane, forming a conveying path for the PCB board 9 between the first conveyor belt 12 and the second conveyor belt 15. A plurality of load-bearing members 18 are provided on each of the first conveyor belt 12 and the second conveyor belt 15. The load-bearing members 18 on the first conveyor belt 12 are evenly spaced along the length of the first conveyor belt 12, and the load-bearing members 18 on the second conveyor belt 15 are evenly spaced along the length of the second conveyor belt 15. The load-bearing members 18 on the first conveyor belt 12 and the load-bearing members 18 on the second conveyor belt 15 are symmetrically arranged perpendicular to the conveying direction.

[0050] like Figure 2 、 Figure 7-Figure 9 As shown, the support member 18 is an L-shaped plate structure, with the upper end of the support member 18 fixedly mounted on the conveyor belt. Specifically, a U-shaped fixing plate 19 is fixedly mounted on the upper end of the support member 18, which is fixed to the conveyor belt. The support member 18 is provided with a first avoidance hole 181. A horizontal plate 191 is also fixed to the support member 18, and a vertical plate 192 is fixed to the bottom of the horizontal plate 191. The vertical plate 192 is provided with a sliding hole extending horizontally and perpendicular to the conveying direction. A second avoidance hole 193 extending horizontally and perpendicular to the conveying direction is provided on the horizontal plate 191. Two sliding grooves 194 extending horizontally and perpendicular to the conveying direction are also provided on the upper surface of the horizontal plate 191. The two sliding grooves 194 are respectively located on either side of the second avoidance hole 193. A sliding seat 195 is slidably provided on the transverse plate 191 horizontally and perpendicularly to the conveying direction. The bottom of the sliding seat 195 is slidably provided in the two sliding grooves 194 . A through hole is provided on the upper surface of the sliding seat 195 .

[0051] like Figures 1-6As shown, the fixing mechanism can fix the PCB board 9 on the carrier 18, and can also fix the components inserted on the PCB board 9 on the PCB board 9, thereby preventing the pins of the PCB board 9 and the components from moving. The fixing mechanism includes a pin fixing assembly 6 and a board fixing assembly. The board fixing assembly includes a pressing member, a pressing drive 72, a horizontal pressing member and a pressing drive 74. The pressing member is arranged on the carrier 18 to move up and down, and the pressing drive 72 can drive the pressing member to move downward to press the PCB board 9 on the carrier 18. The horizontal pressing member is arranged on the carrier 18 to move horizontally and perpendicularly to the conveying direction, and the pressing drive 74 can drive the horizontal pressing member to move horizontally and perpendicularly to the conveying direction, and press the PCB board 9 placed on the carrier 18, thereby clamping the PCB board 9 on the carrier 18.

[0052] like Figure 2-Figure 12 As shown, the horizontal pressure member includes a horizontal elastic telescopic rod 731, a horizontal elastic member 732, and a pressure plate 733. The horizontal elastic telescopic rod 731 includes a first horizontal rod 7311, a second horizontal rod 7312, and a horizontal spring 7313. The elastic coefficient of the horizontal spring 7313 is greater than that of the horizontal elastic member 732. One end of the first horizontal rod 7311 is slidably inserted into the second horizontal rod 7312. The horizontal spring 7313 is mounted on the first horizontal rod 7311. One end of the horizontal spring 7313 is fixed to the first horizontal rod 7311, and the other end is fixed to the second horizontal rod 7312. The second horizontal rod 7312 slides horizontally and perpendicularly to the conveying direction in a sliding hole. The pressure plate 733 is fixed to the end of the second horizontal rod 7312 near the support member 18. The horizontal elastic member 732 is a spring and is mounted on the second horizontal rod 7312. The ends of the horizontal elastic member 732 are respectively fixedly connected to the pressure plate 733 and the vertical plate 192. When the first horizontal rod 7311 is squeezed, it can drive the horizontal spring 7313, the second horizontal rod 7312 and the top pressure plate 733 to move toward the PCB board 9 on the carrier 18. The top pressure plate 733 is used to press the PCB board 9 placed on the carrier 18.

[0053] like Figure 2-Figure 12As shown, the pressing member includes a vertical elastic telescopic rod 711, a vertical elastic member 712, a pressing block 713 and a connecting rod 714. The vertical elastic telescopic rod 711 includes a first vertical rod 7111, a second vertical rod 7112 and a vertical spring 7113. The elastic coefficient of the vertical spring 7113 is greater than the elastic coefficient of the vertical elastic member 712. One end of the first vertical rod 7111 is slidably inserted into the second vertical rod 7112, and the vertical spring 7113 is mounted on the first vertical rod 7111. One end of the vertical spring 7113 is fixed to the first vertical rod 7111, and the other end is fixed to the second vertical rod 7112. The second vertical rod 7112 is slidably inserted into the through hole of the sliding seat 195, and the lower end of the second vertical rod 7112 is fixed to the connecting rod 714. The top pressure plate 733 is provided with a vertical sliding hole 7331 extending vertically. The connecting rod 714 is an L-shaped rod that slides up and down in the vertical sliding hole 7331 of the top pressure plate 733. The lower pressing block 713 is fixed to the lower end of the connecting rod 714 and is located on the side of the top pressure plate 733 away from the horizontal elastic member 732. The top pressure plate 733 is also fixed with a support plate 734. The vertical elastic member 712 is a spring, and its ends are respectively fixedly connected to the support plate 734 and the connecting rod 714. When the first vertical rod 7111 is pressed downward, it can drive the vertical spring 7113, the second vertical rod 7112, the connecting rod 714, and the lower pressing block 713 to move downward, pressing and securing the PCB board 9 to the carrier 18.

[0054] like Figure 1 、 Figures 13-18 As shown, the top pressure drive member 74 is a strip-shaped plate-like structure. Two top pressure drive members 74 are provided, one located below the first conveyor belt 12 and the other below the second conveyor belt 15. The length of each top pressure drive member 74 aligns with the length of the first conveyor belt 12, and the two top pressure drive members 74 are symmetrically arranged perpendicular to the conveying direction. Fixed posts 75 are fixed at each end of the top pressure drive member 74, and the lower ends of the fixed posts 75 are fixed to the mounting frame 11. Axial holes 741 are also defined at each end of the top pressure drive member 74. The first driving wheel 13, the first driven wheel 14, the second driving wheel 16, and the second driven wheel 17 are rotatably mounted in the four axle holes 741 of the two top pressure drive members 74 via rotating shafts. The top pressure drive member 74 has a horizontal extrusion portion 742 that protrudes toward the center of the first conveyor belt 12 and the second conveyor belt 15. The horizontal extrusion portion 742 has a trapezoidal cross-section and has transition slopes 743 at both ends of the horizontal extrusion portion 742 along its length. When the carrier 18 moves past the transition slope 743, the transition slope 743 can compress the first horizontal rod 7311 to drive the pressure plate 733 to move toward the middle position between the first conveyor belt 12 and the second conveyor belt 15, thereby pressing the PCB board 9 placed on the carrier 18. The pressure plates 733 on the first conveyor belt 12 and the second conveyor belt 15 move closer to each other to clamp and secure the PCB board 9 to the carrier 18.

[0055] like Figure 1 、 Figures 13-18 As shown, the downward-pressing driving member 72 is a strip-shaped plate-like structure. Two downward-pressing driving members 72 are provided and are respectively located below the first conveyor belt 12 and the second conveyor belt 15. The downward-pressing driving member 72 is fixed to the upper surface of the top-pressing driving member 74. The length direction of the downward-pressing driving member 72 is consistent with the length direction of the first conveyor belt 12. The two downward-pressing driving members 72 are symmetrically arranged perpendicular to the conveying direction. The downward-pressing driving member 72 has a vertical extrusion portion 721 protruding downward. The cross-section of the vertical extrusion portion 721 is trapezoidal. The two ends of the vertical extrusion portion 721 in the length direction have downward-pressing inclined surfaces 722. When the carrier 18 moves past the downward-pressing inclined surfaces 722, the downward-pressing inclined surfaces 722 can squeeze the first vertical rod 7111 downward to drive the downward-pressing block 713 to move downward, thereby pressing the PCB board 9 onto the carrier 18.

[0056] like Figure 1 As shown, the pin fixing assembly 6 includes an extrusion airbag 61, a rotating drive member 62, an air supply pipe 63, and an inflator (not shown). The extrusion airbag 61 is located above the wave soldering mechanism 4 and is a hollow cylindrical structure. The rotating drive member 62 is used to rotate the extrusion airbag 61. The rotating drive member 62 is fixed to the mounting frame 11 and is a motor. The rotating shaft of the rotating drive member 62 is coaxially fixedly connected to the extrusion airbag 61, and the rotation axis of the extrusion airbag 61 is perpendicular to the conveying direction. The air supply pipe 63 is fixed to the mounting frame 11. One end of the air supply pipe 63 is connected to the inflator (gas discharge) member, and the other end is connected to the interior of the extrusion airbag 61. The air supply pipe 63 is coaxially arranged with the extrusion airbag 61 and is rotatably connected to the air supply pipe 63. The inflator (gas discharge) member is used to inflate or extract gas from the extrusion airbag 61. When the PCB board 9 is conveyed to the top of the wave soldering mechanism 4, the squeezing airbag 61 is located above the PCB board 9, and the squeezing airbag 61 filled with gas can squeeze the components inserted on the PCB board 9 downward to press the components tightly onto the PCB board 9.

[0057] like Figure 19 and Figure 20As shown, the wave soldering mechanism 4 includes a solder box 41, and a solder liquid oxide layer scraping mechanism is arranged on the top of the solder box 41. The solder liquid oxide layer scraping mechanism includes a mounting plate 81, a scraper 82, a reset elastic member 83, a sliding plate 84, a support rod 85, a baffle 86 and a fixing rod 87. Two mounting plates 81 are arranged in parallel and spaced apart, and the two mounting plates 81 are symmetrically fixed on the top of the two side walls of the solder box 41. Two guide chutes 811 are provided on the mounting plate 81 at intervals in the front and back along the conveying direction. The guide chutes 811 include a horizontal chute 8111 and an inclined chute 8112. The horizontal chute 8111 extends along the conveying direction. The inclined chute 8112 is located at the front end of the horizontal chute 8111. The inclined chute 8112 is arranged to be higher at the back and lower at the front. The rear end of the inclined chute 8112 is connected to the front end of the horizontal chute 8111.

[0058] like Figure 19 and Figure 20 As shown, two sliding plates 84 are arranged in parallel and spaced apart. The ends of the scraper 82 are fixedly connected to the two sliding plates 84, and the length direction of the scraper 82 is arranged horizontally and perpendicular to the conveying direction. The ends of the support rod 85 are fixedly connected to the two sliding plates 84, and the support rod 85 is arranged parallel to the scraper 82. Two baffle rods 86 are arranged at intervals along the length direction of the support rod 85, and the two baffle rods 86 extend upward. Two fixed rods 87 are arranged at intervals along the length direction of the scraper 82, and the two fixed rods 87 extend upward. Rollers 88 are rotatably provided at the upper ends of the baffle rods 86 and the fixed rod 87. The rotation axis of the roller 88 is arranged horizontally and perpendicular to the conveying direction. The rollers 88 provided on the baffle rods 86 and the fixed rod 87 are in the same horizontal plane. Sliding posts 89 are fixedly provided at the front and rear ends of the sliding plates 84, respectively. The sliding posts 89 are located on the opposite sides of the two sliding plates 84 and are cylindrical in structure. The two sliding plates 84 are slidably mounted in the guide slots 811 of the two mounting plates 81 via sliding posts 89. The sliding posts 89 at the rear end of the sliding plate 84 are slidably mounted in the guide slots 811 at the rear of the mounting plate 81, while the sliding posts 89 at the front end of the sliding plate 84 are slidably mounted in the guide slots 811 at the front of the mounting plate 81.

[0059] like Figure 19 and Figure 20As shown, the reset elastic member 83 is a spring, one end of which is fixed to the mounting plate 81 and the other end to the front end of the sliding plate 84. When the reset elastic member 83 is in its natural state, the sliding post 89 is located in the horizontal chute 8111, and the scraper 82 is located behind the solder wave crest generated by the wave soldering mechanism 4. When the PCB 9 is transported from the back to the front, it can move forward against the baffle 86, thereby driving the scraper 82 forward. As the scraper 82 passes over the solder wave crest, it can scrape off the oxide layer formed on the solder wave crest. When the sliding post 89 moves to the front end of the chute 8112, the scraper 82, sliding plate 84, support rod 85, baffle 86, and roller 88 move downward along the chute 8112 synchronously, so that the roller 88 is located below the PCB 9 and contacts the bottom wall of the PCB 9, and the PCB 9 no longer moves forward against the scraper 82.

[0060] A proximity switch (not shown) is also provided on the mounting plate 81. When the PCB 9 is positioned above the solder liquid crest, the proximity switch generates an inflation signal, causing the inflation / deflation component to inflate the extrusion airbag 61. When the PCB 9 leaves the solder liquid crest, the proximity switch generates a degassing signal, causing the inflation / deflation component to extract the gas from the extrusion airbag 61, thereby deflation and moving it away from the solder liquid crest.

[0061] The PCB soldering device according to the present invention operates as follows: During use, a PCB board 9, with components already installed, is first supported on both sides and placed on the carrier 18 of the first and second conveyor belts 12 and 15. Then, the first and second motors synchronously drive the first and second conveyor belts 12 and 15 to transport the PCB board 9 from back to front. When the carrier 18 passes over the transition slope 743, the transition slope 743 compresses the first horizontal rod 7311, driving the push plate 733 toward the center of the first and second conveyor belts 12 and 15, thereby pressing the PCB board 9 placed on the carrier 18. The push plates 733 on the first and second conveyor belts 12 and 15 move toward each other, clamping the PCB board 9 against the carrier 18. When the carrier 18 passes over the downward pressing slope 722, the downward pressing slope 722 compresses the first vertical rod 7111 downward, driving the downward pressing block 713 downward, thereby pressing the PCB board 9 against the carrier 18. The PCB board 9 continues to be transported from back to front. The PCB board 9 moves forward against the stop bar 86, thereby driving the scraper 82 forward. When the scraper 82 passes over the soldering liquid wave crest, it scrapes off the oxide layer formed on the soldering liquid wave crest. The conveying continues. When the PCB board 9 is conveyed above the wave soldering mechanism 4, the proximity switch sends an inflation signal. The inflation and deflation components inflate the extrusion airbag 61. The extrusion airbag 61 presses the components inserted on the PCB board 9 downward, pressing the components against the PCB board 9. The soldering liquid wave crest performs wave soldering on the PCB board 9. The conveying continues. When the PCB board 9 leaves the soldering liquid wave crest, the proximity switch sends an exhaust signal. The inflation and deflation components extract the gas in the extrusion airbag 61, thereby shrinking the extrusion airbag 61 and moving it away from the soldering liquid wave crest. When the sliding post 89 moves to the front end of the chute 8112, the scraper 82, sliding plate 84, support rod 85, stopper 86, and roller 88 simultaneously move downward along the chute 8112, positioning roller 88 below the PCB 9 and contacting the bottom wall of the PCB 9. The PCB 9 no longer moves forward against the scraper 82. When the PCB 9 is no longer above the roller 88, the return spring 83 drives the scraper 82 back to its original position.

[0062] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A PCB soldering device, comprising a conveying mechanism and a wave soldering mechanism, wherein the conveying mechanism comprises a conveying assembly and a carrier for carrying the PCB, the conveying assembly can drive the carrier to move the PCB, and the wave soldering mechanism is arranged on the moving path of the PCB and can perform wave soldering on the PCB passing by. The device is characterized in that: The PCB is fixed on the support member, and the PCB is fixed on the support member. The support member is fixed on the support member, and the PCB is fixed on the support member. The support member is fixed on the support member, and the PCB is fixed on the support member. The support member is fixed on the support member, and the PCB is fixed on the support member. The support member is fixed on the support member, and the PCB is fixed on the support member. The support member is fixed on the support member, and the PCB is fixed on the support member. The support member is fixed on the support member, and the PCB is fixed on the support member. The support member is fixed on the support member, and the support member is fixed on the support member. The support member is fixed on the support member, and the support member is fixed on the support member. The support member is fixed on the support member, and the support member is fixed on the support member. The support member is fixed on the support member, and the support member is fixed on the support member. The support member is fixed on the support member, and the support member is fixed on the support member. The support member is fixed on the support member. The flat top pressure piece includes a horizontal elastic telescopic rod, a horizontal elastic piece and a top pressure plate. The horizontal elastic telescopic rod slides horizontally and perpendicular to the conveying direction in the sliding hole. The top pressure plate is fixed to one end of the horizontal elastic telescopic rod close to the carrier. The two ends of the horizontal elastic piece are respectively connected to the top pressure plate and the vertical plate. The top pressure plate is used to press the PCB board placed on the carrier. A first avoidance hole for avoiding the top pressure plate is provided on the carrier. The lower pressure piece includes a vertical elastic telescopic rod, a vertical elastic piece, a lower pressure block and a connecting rod. The connecting rod slides up and down on the top pressure plate. The lower pressure block is fixed at the lower end of the connecting rod, and the lower pressure block is located on the side of the top pressure plate away from the horizontal elastic piece. The two ends of the vertical elastic piece are respectively connected to the top pressure plate and the connecting rod, and the lower end of the vertical elastic telescopic rod is fixed on the connecting rod.

2. The PCB soldering device according to claim 1, wherein: The conveying assembly includes a mounting frame, a first conveyor belt, a first driving wheel, a first driven wheel, a second conveyor belt, a second driving wheel and a second driven wheel. The first driving wheel, the first driven wheel, the second driving wheel and the second driven wheel are all rotatably arranged on the mounting frame and the rotation axis is vertically arranged. The first conveyor belt is wound around the first driving wheel and the first driven wheel, and the second conveyor belt is wound around the second driving wheel and the second driven wheel. The first conveyor belt and the second conveyor belt are arranged in parallel and spaced apart on the same horizontal plane, and a conveying channel for PCB boards is formed between the first conveyor belt and the second conveyor belt; a plurality of the carriers are provided on the first conveyor belt and the second conveyor belt, the carriers on the first conveyor belt are arranged at intervals along the length direction of the first conveyor belt, and the carriers on the second conveyor belt are arranged at intervals along the length direction of the second conveyor belt, and the carriers on the first conveyor belt correspond to the carriers on the second conveyor belt in a one-to-one manner perpendicular to the conveying direction.

3. The PCB soldering device according to claim 2, wherein: The board fixing assembly also includes a horizontal pressing member and a pressing driving member. The horizontal pressing member is arranged on the carrier and moves horizontally and perpendicularly to the conveying direction. The pressing driving member can drive the horizontal pressing member to move horizontally and perpendicularly to the conveying direction, and press the PCB board placed on the carrier to clamp the PCB board on the carrier.

4. The PCB soldering device according to claim 3, wherein: The top-pressing driving member is a strip plate-shaped structure. Two top-pressing driving members are provided and are respectively located below the first conveyor belt and the second conveyor belt. The top-pressing driving member is fixed on the mounting frame. The length direction of the top-pressing driving member is consistent with the length direction of the first conveyor belt. The top-pressing driving member has a horizontal extrusion portion protruding toward the middle position of the first conveyor belt and the second conveyor belt. The cross-section of the horizontal extrusion portion is trapezoidal, and the two ends of the horizontal extrusion portion in the length direction have transition inclined surfaces. When the supporting member moves through the transition inclined surface, the transition inclined surface can squeeze the horizontal elastic telescopic rod to drive the top pressure plate to move toward the middle position of the first conveyor belt and the second conveyor belt, thereby pressing the PCB board placed on the supporting member.

5. The PCB soldering device according to claim 4, wherein: The downward-pressing driving member is a strip-shaped plate structure. Two downward-pressing driving members are provided and are respectively located below the first conveyor belt and the second conveyor belt. The downward-pressing driving member is fixed to the upper surface of the top-pressing driving member. The length direction of the downward-pressing driving member is consistent with the length direction of the first conveyor belt. The downward-pressing driving member has a vertical extrusion portion protruding downward. The cross-section of the vertical extrusion portion is trapezoidal. Both ends of the vertical extrusion portion in the length direction have downward-pressing inclined surfaces. When the supporting member moves past the downward-pressing inclined surface, the downward-pressing inclined surface can squeeze the vertical elastic telescopic rod to drive the downward-pressing block to move downward, thereby pressing the PCB board tightly on the supporting member.

6. The PCB soldering device according to any one of claims 1 to 5, characterized in that: The pin fixing assembly also includes a rotating drive member for driving the extrusion airbag to rotate. The extrusion airbag is a cylindrical structure with a hollow interior. The rotating shaft of the rotating drive member is coaxially fixedly connected to the extrusion airbag, and the rotating axis of the extrusion airbag is perpendicular to the conveying direction.

7. The PCB soldering device according to claim 6, wherein: The pin fixing assembly also includes an air supply pipe and an air charging and discharging part for inflating or extracting gas from the extrusion airbag. The air supply pipe is fixedly arranged on the mounting frame. One end of the air supply pipe is connected to the air charging and discharging part, and the other end is connected to the inside of the extrusion airbag. The air supply pipe and the extrusion airbag are coaxially arranged, and the extrusion airbag is rotatably connected to the air supply pipe.

8. The PCB soldering device according to claim 7, wherein: The wave soldering mechanism includes a soldering box, a solder liquid oxide layer scraping mechanism is provided on the top of the soldering box, the solder liquid oxide layer scraping mechanism includes a mounting plate, a scraper and a reset elastic member, the mounting plate is fixedly arranged on the soldering box, a horizontal slide and an inclined slot are provided on the mounting plate, the horizontal slide extends along the conveying direction, the inclined slot is located at the front end of the horizontal slide, the inclined slot is inclined at the rear higher and the front lower, the rear end of the inclined slot is connected with the front end of the horizontal slide, the scraper is slidably arranged in the horizontal slide and the inclined slot, one end of the reset elastic member is fixed on the mounting plate, and the other end is fixed on the scraper. When the reset elastic member is in a natural state, the scraper is located in the horizontal slide, and the scraper is located behind the solder liquid wave crest generated by the wave soldering mechanism. The PCB board can move forward against the scraper during transportation, and the scraper can scrape off the oxide layer formed on the solder liquid wave crest when passing through the solder liquid wave crest. When the scraper moves to the front end of the inclined slot, the scraper is located below the PCB board, and the PCB board no longer moves against the scraper.

9. The PCB soldering device according to claim 8, wherein: The mounting plate is also provided with a proximity switch. When the PCB is transported to above the solder liquid wave crest, the proximity switch sends an inflation signal, and the inflation and deflation component inflates the extrusion airbag; when the PCB leaves above the solder liquid wave crest, the proximity switch sends an exhaust signal, and the inflation and deflation component extracts the gas in the extrusion airbag.

Images