Electronic device heat dissipation device, electric cabinet and air conditioner

Abstract

The invention relates to the technical field of electronic device heat dissipation, and provides an electronic device heat dissipation device, an electric cabinet and an air conditioner. The invention provides a heat dissipation device for an electronic device. The heat dissipation device comprises the electronic device, a phase change unit and a heat dissipation unit, the phase change unit is connected with the electronic device and can absorb heat released when the electronic device is started and stopped; the heat dissipation unit is connected with the phase change unit and can dissipate heat of the phase change unit. The phase change unit is used as a heat absorption and storage medium, the phase change unit can rapidly absorb heat when the calorific value of the electronic device is increased, and a phase change material of the phase change unit is subjected to phase change when absorbing the heat, so that a large amount of heat energy is stored; the heat dissipation unit is connected with the phase change unit and is responsible for transmitting the stored heat to the external environment through a heat dissipation mechanism, heat dissipation is achieved, and rapid heat dissipation of the electronic device is achieved. The technical problem that a heat dissipation device in the prior art is low in response speed and cannot meet the requirement for sudden increase of heat generated when an electronic device is started or stopped is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and particularly to a heat dissipation device for electronic devices, an electric control box, and an air conditioner. Background Art

[0002] Electrical appliances such as air conditioners generally include an electric control box. There are many electronic devices in the electric control box. These electronic devices are like people. When people run, their bodies will get hot. Similarly, electronic devices will also generate heat during operation. Among them, if the temperature of the electronic devices is too high, problems such as shortened lifespan of the electronic devices will occur. Therefore, it is necessary to dissipate heat from the electronic devices.

[0003] Taking the electric control box as an example, in the prior art, although most of the electronic devices (non-power devices) in the electric control box can rely on liquid cooling for heat dissipation. For example, these electronic devices are directly contacted with the liquid cooling pipeline for liquid cooling heat dissipation. However, the response speed of the liquid driving structure such as the pump of the liquid cooling unit is relatively slow, resulting in the inability to meet the heat dissipation requirements of some electronic devices whose heat generation increases suddenly during startup and shutdown and significantly decreases after stable operation. Summary of the Invention

[0004] The present invention provides a heat dissipation device for electronic devices, an electric control box, and an air conditioner to solve the technical problem that the heat dissipation device in the prior art has a slow response speed and cannot meet the sudden increase in heat generation of electronic devices during startup and shutdown.

[0005] The present invention provides a heat dissipation device for electronic devices, including an electronic device, a phase change unit, and a heat dissipation unit; the phase change unit is connected to the electronic device and can absorb the heat released by the electronic device during startup and shutdown; the heat dissipation unit is connected to the phase change unit and can dissipate heat from the phase change unit.

[0006] According to an embodiment of the present invention, it further includes a housing having an accommodation cavity; the electronic device, the phase change unit, and the heat dissipation unit are arranged in the accommodation cavity; the phase change unit is a structural member made of a phase change material.

[0007] According to an embodiment of the present invention, the heat dissipation unit is a liquid cooling heat dissipation unit, and the liquid cooling heat dissipation unit includes a liquid cooling pipe; the liquid cooling pipe extends into the accommodation cavity; the heat dissipation device for electronic devices further includes at least one heat exchange fin, and the heat exchange fin is arranged on the liquid cooling pipe and connected to the phase change unit.

[0008] According to an embodiment of the present invention, there are multiple heat exchange fins, and the multiple heat exchange fins are arranged along the extension direction of the liquid cooling pipe and sleeved on the liquid cooling pipe, and are in contact with the side wall surface of the liquid cooling pipe.

[0009] According to an embodiment of the present invention, it further includes a temperature sensor, a controller, and a supplementary heat dissipation unit; the temperature sensor is located inside the housing and can detect the temperature of the heat exchange fins; the controller is connected to the temperature sensor and the supplementary heat dissipation unit, and can connect the supplementary heat dissipation unit to the heat exchange fins when the temperature sensor detects that the temperature is greater than a preset value.

[0010] According to an embodiment of the present invention, the supplementary heat dissipation unit includes a driving mechanism and a heat dissipation mechanism; the driving mechanism is connected to the heat dissipation mechanism and can drive the heat dissipation mechanism to move; the controller is connected to the driving mechanism; the surface of the housing has an insertion hole that can communicate with the inside of the accommodation cavity; the heat dissipation mechanism is slidably connected to the hole wall of the insertion hole and is in sealing cooperation with the hole wall of the insertion hole. When the temperature sensor detects that the temperature is greater than a preset value, the heat dissipation mechanism can be connected to the heat exchange fins.

[0011] According to an embodiment of the present invention, the driving mechanism includes a driving motor, a lead screw, and a nut; the output end of the driving motor is connected to the end of the lead screw; the nut is sleeved on the lead screw and is connected to the heat dissipation mechanism.

[0012] According to an embodiment of the present invention, the heat dissipation mechanism can be connected to the heat exchange fins and the phase change unit when the temperature sensor detects that the temperature is greater than a preset value.

[0013] According to an embodiment of the present invention, the heat dissipation mechanism is a heat pipe. When the temperature sensor detects that the temperature is greater than a preset value, the hot end of the heat pipe can be connected to the heat exchange fins and the phase change unit.

[0014] According to an embodiment of the present invention, the heat dissipation mechanism is a heat dissipation plate; the electronic device heat dissipation device further includes a thermoelectric cooler, which is arranged on the heat dissipation plate and is connected to the controller; the controller can make the thermoelectric cooler refrigerate when the temperature sensor detects that the temperature is greater than a preset value.

[0015] The present invention provides an electric control box, including: the electronic device heat dissipation device as described in the above embodiment.

[0016] The present invention provides an air conditioner, including: the electronic device heat dissipation device as described in the above embodiment; or, the air conditioner as described in the above embodiment.

[0017] The characteristics and advantages of the electronic device heat dissipation device, electric control box, and air conditioner of the present invention are: The phase change unit serves as a heat absorption and storage medium. The phase change unit can rapidly absorb heat when the heat generation of the electronic device increases. When the phase change material of the phase change unit absorbs heat, a phase change occurs, thereby storing a large amount of thermal energy. The heat dissipation unit is connected to the phase change unit and is responsible for transferring the stored heat to the external environment through a heat dissipation mechanism (such as liquid cooling or air cooling, etc.) to achieve heat dissipation, realizing rapid heat dissipation of the electronic device. Since the thermal conductivity of the phase change material is relatively low, the phase change material will not allow heat to be rapidly transferred to the heat dissipation unit. That is, it takes a certain amount of time for the heat dissipation unit to dissipate the heat stored in the phase change unit. Therefore, even if the heat of the phase change unit is relatively high and it is connected to the electronic device, due to its low thermal conductivity, it will not rapidly transfer the heat of the phase change unit back to the electronic device, and will not cause a rapid increase in the temperature of the electronic device. Thus, a buffering time is given to the electronic device to avoid damage caused by a sudden increase in the heat of the electronic device. This solves the technical problem that the heat dissipation device in the prior art has a slow response speed and cannot meet the sudden increase in heat generation when the electronic device starts and stops.

[0018] Briefly speaking, the heat dissipation device for an electronic device of the present invention includes a special phase change unit and a heat dissipation unit. The phase change unit is the key part of this device. It is like a sponge for heat. When the electronic device generates a lot of heat during operation, especially when starting or stopping rapidly, the phase change unit can rapidly absorb this heat. The phase change material inside it undergoes a phase change when absorbing heat, just like ice melting into water. A large amount of thermal energy can be stored during this process. Connected to the phase change unit is the heat dissipation unit, whose job is to help dissipate this stored heat. The heat dissipation unit uses a heat dissipation mechanism, such as liquid cooling or air cooling, to transfer the heat to the external environment and keep the electronic device cool. Since the thermal conductivity of the phase change material is relatively low, it will not allow heat to be rapidly transferred to the heat dissipation unit, which means it takes some time for the heat dissipation unit to dissipate the heat stored in the phase change unit. This process is like the sun slowly setting and the heat gradually dissipating, rather than disappearing suddenly. In this way, even if the temperature of the electronic device rises due to operation, the phase change unit will not allow this heat to be rapidly transferred back to the electronic device, avoiding a rapid increase in temperature. This gives the electronic device a buffering time to prevent damage caused by a sudden increase in heat. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a three-dimensional schematic diagram of an embodiment of the heat dissipation device for an electronic device of the present invention.

[0021] Figure 2 It is an exploded view of an embodiment of the heat dissipation device for an electronic device of the present invention.

[0022] Figure 3 It is a top view of an embodiment of the heat dissipation device for an electronic device of the present invention.

[0023] Figure 4 is Figure 3 a cross-sectional view taken along the A-A direction in

[0024] Figure 5 It is a top view of another embodiment of the heat dissipation device for an electronic device of the present invention.

[0025] Reference numerals: 100, electronic device; 200, phase change unit; 300, heat dissipation unit; 310, liquid cooling pipe; 400, housing; 410, accommodating cavity; 500, heat exchange fins; 600, supplementary heat dissipation unit; 610, driving mechanism; 611, driving motor; 612, lead screw; 613, nut; 620, heat dissipation mechanism. Specific embodiments

[0026] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0027] In the description of this embodiment, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this embodiment and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this embodiment.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this embodiment, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0029] In this embodiment, unless otherwise clearly specified and defined, terms such as "arranged", "installed", "connected", "joined", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0030] In the embodiments of the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0031] Figures 1 to 5 The electronic device heat dissipation device, the electric control box and the air conditioner provided by the present invention are shown. It can be seen from the figure that the present invention provides an electronic device heat dissipation device, including an electronic device 100, a phase change unit 200 and a heat dissipation unit 300; the phase change unit 200 is connected to the electronic device 100 and can absorb the heat released by the electronic device 100 when starting and stopping; the heat dissipation unit 300 is connected to the phase change unit 200 and can dissipate heat from the phase change unit 200.

[0032] In specific implementation, the phase change unit 200 serves as a heat absorption and storage medium. The phase change unit 200 can rapidly absorb heat when the heat generation of the electronic device 100 increases. The phase change material of the phase change unit 200 will undergo a phase change when absorbing heat, thereby storing a large amount of thermal energy. The heat dissipation unit 300 is connected to the phase change unit 200 and is responsible for transferring the stored heat to the external environment through a heat dissipation mechanism (such as liquid cooling or air cooling, etc.) to achieve heat dissipation, realizing rapid heat dissipation of the electronic device 100. Since the thermal conductivity of the phase change material is relatively low, the phase change material will not allow heat to be rapidly transferred to the heat dissipation unit 300. That is to say, it takes a certain amount of time for the heat dissipation unit 300 to dissipate the heat stored in the phase change unit 200. Therefore, even if the heat of the phase change unit 200 is relatively high and it is connected to the electronic device 100, the heat of the phase change unit 200 itself will not be rapidly transferred to the electronic device 100, and it will not cause a rapid increase in the temperature of the electronic device 100. Thus, a buffering time is given to the electronic device 100 to avoid damage caused by a sudden increase in the heat of the electronic device 100. This solves the technical problem that the heat dissipation device in the prior art has a slow response speed and cannot meet the sudden increase in heat generation of the electronic device 100 during startup and shutdown.

[0033] Briefly speaking, the heat dissipation device for an electronic device of the present invention includes a special phase change unit 200 and a heat dissipation unit 300. The phase change unit 200 is the key part of this device. It is like a sponge for heat. When the electronic device 100 generates a lot of heat during operation, especially when starting or stopping rapidly, the phase change unit 200 can rapidly absorb this heat. The phase change material inside it will undergo a phase change when absorbing heat, just like ice melting into water. A large amount of thermal energy can be stored during this process. Connected to the phase change unit 200 is the heat dissipation unit 300, and its job is to help dissipate this stored heat. The heat dissipation unit 300 uses a heat dissipation mechanism, such as liquid cooling or air cooling, to transfer the heat to the external environment to keep the electronic device 100 cool. Since the thermal conductivity of the phase change material is relatively low, it will not allow heat to be rapidly transferred to the heat dissipation unit 300, which means that it takes some time for the heat dissipation unit 300 to dissipate the heat stored in the phase change unit 200. This process is like the sun slowly setting and the heat gradually dissipating, rather than disappearing suddenly. In this way, even if the temperature of the electronic device 100 rises due to operation, the phase change unit 200 will not allow this heat to be rapidly transferred back to the electronic device 100, avoiding a rapid rise in temperature. This gives the electronic device 100 a buffering time to prevent damage caused by a sudden increase in heat.

[0034] In this embodiment, the phase change material can be the prior art, such as paraffin wax, etc.

[0035] According to an embodiment of the present invention, it further includes a housing 400 having an accommodation cavity 410; an electronic device 100, a phase change unit 200, and a heat dissipation unit 300 are disposed in the accommodation cavity 410; the phase change unit 200 is a structural member made of a phase change material.

[0036] In specific implementation, through a cleverly designed housing 400, the interior of the housing 400 includes an accommodation cavity 410, which is specifically used to install the electronic device 100, the phase change unit 200, and the heat dissipation unit 300. Such a design makes the heat dissipation device more compact and integrated. The phase change unit 200 is made of a phase change material, and this phase change material can absorb and store heat through a phase change process when the electronic device 100 generates heat during operation. This characteristic of phase change heat absorption provides an effective heat buffer for the electronic device 100, helping to prevent the device from overheating due to rapid heat accumulation. Overall, such a heat dissipation device can improve the thermal management efficiency of the electronic device 100 and ensure that it can maintain a stable and safe temperature state under various working conditions.

[0037] According to an embodiment of the present invention, the heat dissipation unit 300 is a liquid cooling heat dissipation unit 300, and the liquid cooling heat dissipation unit 300 includes a liquid cooling pipe 310; the liquid cooling pipe 310 extends into the accommodation cavity 410; the electronic device heat dissipation device further includes at least one heat exchange fin 500, and the heat exchange fin 500 is disposed on the liquid cooling pipe 310 and is connected to the phase change unit 200.

[0038] In specific implementation, the liquid cooling pipe 310 is designed to extend into the accommodation cavity 410 of the housing 400, that is, at least a part of the liquid cooling pipe 310 can be disposed in the accommodation cavity 410 to directly contact and absorb the heat generated by the phase change unit 200. To further improve the heat dissipation performance, the heat dissipation device further includes at least one heat exchange fin 500, and the heat exchange fin 500 is installed on the liquid cooling pipe 310 and is connected to the phase change unit 200. The contact area between the heat exchange fin 500 and the phase change unit 200 is relatively large, which can conduct the heat of the phase change unit 200 to the liquid cooling pipe 310, thereby improving the heat transfer efficiency and making the heat dissipation more rapid. Such a design can timely export the heat through the liquid cooling system, keep the electronic device 100 within a safe working temperature range, extend the service life of the electronic device 100 and ensure its reliability.

[0039] According to an embodiment of the present invention, there are a plurality of heat exchange fins 500, and the plurality of heat exchange fins 500 are arranged along the extending direction of the liquid cooling pipe 310 and sleeved on the liquid cooling pipe 310 and are in contact with the side wall surface of the liquid cooling pipe 310.

[0040] In specific implementation, the heat dissipation efficiency is significantly improved by adding a plurality of heat exchange fins 500. These heat exchange fins 500 are arranged along the extending direction of the liquid cooling pipe 310 and sleeved outside the liquid cooling pipe 310, achieving surface contact with the side wall surface of the liquid cooling pipe 310. The contact area between the heat exchange fins 500 and the phase change unit 200 is relatively large, capable of conducting the heat of the phase change unit 200 to the liquid cooling pipe 310, thereby further improving the heat transfer efficiency and making the heat dissipation more rapid. This design can not only effectively dissipate the heat generated by the electronic device 100 during high-load operation, but also timely export the heat through the liquid cooling system, keep the electronic device 100 within a safe operating temperature range, extend the service life of the electronic device 100 and ensure its reliability.

[0041] According to an embodiment of the present invention, it further includes a temperature sensor, a controller and a supplementary heat dissipation unit 600; the temperature sensor is located inside the housing 400 and can detect the temperature of the heat exchange fins 500; the controller is connected to the temperature sensor and the supplementary heat dissipation unit 600, and can connect the supplementary heat dissipation unit 600 to the heat exchange fins 500 when the temperature sensor detects that the temperature is greater than a preset value.

[0042] In specific implementation, the temperature sensor is installed inside the housing 400 and can monitor the temperature change of the heat exchange fins 500 in real time. Once it detects that the temperature exceeds the preset safety value, it indicates that the current heat dissipation capacity cannot meet the demand, and the controller will automatically activate the supplementary heat dissipation unit 600 to provide additional heat dissipation support. This design not only improves the heat dissipation efficiency, but also ensures the stability and safety of the electronic device 100 under various operating conditions through intelligent control. Through this intelligent heat dissipation management, the heat dissipation device can dynamically adapt to the temperature change of the electronic device 100, achieve more accurate and effective thermal management, thereby significantly improving the performance and durability of the electronic device 100 in the face of extreme or unstable operating conditions.

[0043] According to an embodiment of the present invention, the supplementary heat dissipation unit 600 includes a driving mechanism 610 and a heat dissipation mechanism 620; the driving mechanism 610 is connected to the heat dissipation mechanism 620 and can drive the heat dissipation mechanism 620 to move; the controller is connected to the driving mechanism 610; the surface of the housing 400 has an insertion hole that can communicate with the inside of the accommodation cavity 410; the heat dissipation mechanism 620 is slidably connected to the hole wall of the insertion hole and is hermetically matched with the hole wall of the insertion hole. When the temperature sensor detects that the temperature is greater than a preset value, the heat dissipation mechanism 620 can be connected to the heat exchange fins 500.

[0044] In specific implementation, by introducing a supplementary heat dissipation unit 600, the supplementary heat dissipation unit 600 is composed of a driving mechanism 610 and a heat dissipation mechanism 620. The driving mechanism 610 is connected to the heat dissipation mechanism 620 and is responsible for driving the movement of the heat dissipation mechanism 620, while the controller is connected to the driving mechanism 610 to accurately control the startup and operation of the heat dissipation mechanism 620. The heat dissipation mechanism 620 is designed to be slidably connected through an insertion hole on the surface of the housing 400 and form a sealed fit with the hole wall. When the temperature detected by the temperature sensor exceeds a preset safety threshold, the heat dissipation mechanism 620 will automatically contact the heat exchange fins 500 to provide additional heat dissipation capacity. This design not only improves the heat dissipation efficiency but also allows the heat dissipation device to flexibly adjust the heat dissipation intensity according to the actual temperature change, ensuring that the electronic device 100 can be maintained within a safe and stable temperature range under various working conditions, thereby improving the reliability of the entire heat dissipation system and the performance stability of the electronic device 100.

[0045] It can be understood that the electric control box may include multiple electronic device heat dissipation devices. Under normal conditions, the above heat dissipation mechanism 620 does not perform supplementary heat dissipation, and only when the temperature detected by the temperature sensor exceeds the preset safety threshold does it perform supplementary heat dissipation. The driving mechanism 610 can drive the heat dissipation mechanism 620 to extend into the electronic devices 100 of different housings 400. That is, a heat dissipation unit 300 can selectively perform supplementary heat dissipation for the heat exchange fins 500 in multiple housings 400, so as to reuse the supplementary heat dissipation unit 600, reduce costs, and there is no need to install a supplementary heat dissipation unit 600 for each electronic device heat dissipation device.

[0046] In this embodiment, the insertion hole may be located on the upper surface of the housing 400.

[0047] According to an embodiment of the present invention, the driving mechanism 610 includes a driving motor 611, a lead screw 612, and a nut 613; the output end of the driving motor 611 is connected to the end of the lead screw 612; the nut 613 is sleeved on the lead screw 612 and is connected to the heat dissipation mechanism 620.

[0048] During specific implementation, the driving motor 611 serves as the power source, and its output end is connected to the end of the lead screw 612. The rotation of the motor drives the rotation of the lead screw 612, and the rotation of the lead screw 612 causes the nut 613 to move linearly. The nut 613 is connected to the heat dissipation mechanism 620 to ensure that the heat dissipation mechanism 620 can move accordingly based on the nut 613. This design enables the heat dissipation mechanism 620 to accurately respond to the instructions of the controller, achieving rapid contact with or separation from the heat exchange fins 500 to meet the heat dissipation requirements of the electronic device 100 under different working conditions. Through this mechanical transmission method, the heat dissipation device can adjust the heat dissipation effect more flexibly and accurately, improve the heat dissipation efficiency, ensure the stable operation of the electronic device 100 in a high-temperature environment, and thus enhance the reliability and adaptability of the entire heat dissipation system.

[0049] In this embodiment, the driving motor 611 is arranged on the outer side wall of the housing 400.

[0050] According to an embodiment of the present invention, the heat dissipation mechanism 620 can connect the heat exchange fins 500 and the phase change unit 200 when the temperature sensor detects that the temperature is greater than the preset value.

[0051] During specific implementation, through the above structural arrangement, the heat dissipation structure 620 of the supplementary heat dissipation unit 600 can play the role of conducting the heat of the phase change unit 200 and dissipating heat from the heat dissipation fins 500. It ensures that when the electronic device 100 generates excessive heat, the heat dissipation mechanism 620 can immediately intervene, accelerate the heat transfer by contacting the heat exchange fins 500, and at the same time, the connection with the phase change unit 200 conducts the heat to the heat exchange fins. Such a mechanism not only improves the heat dissipation efficiency but also provides additional protection for the electronic device 100 through the buffering effect of the phase change material, preventing damage caused by a sharp increase in temperature. This intelligent response of the heat dissipation mechanism 620 significantly enhances the adaptability and reliability of the heat dissipation device, ensuring that the electronic device 100 can maintain a safe operating temperature range under various working conditions.

[0052] In a feasible embodiment, the heat dissipation mechanism 620 is a heat pipe. When the temperature sensor detects that the temperature is greater than the preset value, the hot end of the heat pipe can connect the heat exchange fins 500 and the phase change unit 200.

[0053] In specific implementation, when the temperature detected by the temperature sensor exceeds the preset safety value, the hot end of the heat pipe will automatically come into contact with the heat exchange fins 500 and the phase change unit 200, forming an efficient heat conduction path. The hot end of the heat pipe absorbs the heat generated by the electronic device 100 and quickly transfers the heat to the other end, i.e., the cold end, through the phase change process inside the heat pipe, thereby achieving rapid heat dissipation. This design not only improves the heat dissipation efficiency, but also due to the high thermal conductivity of the heat pipe, it can export a large amount of heat from the heat source in a short time, effectively preventing the electronic device 100 from being damaged due to overheating. Through the intervention of the heat pipe, the heat dissipation device can respond to temperature changes more quickly and effectively, ensuring that the electronic device 100 can be maintained within a suitable temperature range under various working conditions, improving the stability and reliability of the entire system.

[0054] In another feasible implementation manner, the heat dissipation mechanism 620 is a heat dissipation plate; the electronic device heat dissipation device further includes a thermoelectric cooler, which is arranged on the heat dissipation plate and connected to the controller; the controller can make the thermoelectric cooler refrigerate when the temperature sensor detects that the temperature is greater than the preset value.

[0055] In specific implementation, by adopting the heat dissipation plate as the heat dissipation mechanism 620, the heat dissipation capacity is further enhanced. The heat dissipation plate is characterized by having a large surface area, which can effectively dissipate heat. In addition, the heat dissipation device further includes a thermoelectric cooler, which is an advanced heat dissipation technology. When the temperature of the electronic device 100 rises, the refrigeration process can be started through the instruction of the controller. The thermoelectric cooler is installed on the heat dissipation plate and connected to the controller. When the temperature detected by the temperature sensor exceeds the preset safety threshold, the controller will activate the thermoelectric cooler and use its refrigeration effect to further reduce the temperature. This heat dissipation mechanism combining passive heat dissipation and active refrigeration not only improves the heat dissipation efficiency, but also provides an effective means to protect the electronic device 100 in a high-temperature environment. Through this intelligent temperature control, the heat dissipation device can ensure that the electronic device 100 can be maintained within a safe and stable temperature range under various working conditions, thereby improving the performance and service life of the electronic device 100.

[0056] In summary, the present invention aims to provide an innovative heat dissipation device for electronic devices (or can be called a temperature control device for electronic device 100). This device combines the design of phase change materials and highly efficient liquid cooling tubes 310 to achieve rapid heat absorption and stable heat release, thereby significantly improving the heat exchange efficiency and maintaining the temperature stability of electronic device 100. The device mainly consists of three core components: Firstly, there is the liquid cooling tube 310 with heat exchange fins 500. These heat exchange fins 500 are tightly combined with the liquid cooling tube 310 through welding or tube expanding processes. This not only increases the contact area with the phase change material but also customizes the lengths of the heat exchange fins 500 according to the shape of the heat-generating electronic device 100 to achieve personalized and efficient heat dissipation. Secondly, there is the potting tooling, which not only houses the heat-generating electronic device 100 and the phase change material but also uses metal or non-metal materials according to requirements to ensure thermal conductivity and meet electromagnetic safety requirements. Finally, there is the phase change material, which serves as a heat capacity storage unit and is filled in the housing 400. It can quickly absorb additional heat during the start-stop stage of the device and gradually release it after the working state stabilizes to maintain a stable temperature.

[0057] The heat dissipation device of the present invention enhances the response to heat load changes during the start-stop stage of the device by improving the dynamic heat load buffering capacity. At the same time, through the integrated design of the liquid cooling tube 310 path and the heat exchange fins 500, the heat conduction efficiency is optimized. In addition, the intelligent adaptive design allows for dynamic adjustment according to the actual heat generation characteristics and working state of the device, overcoming the limitations of traditional liquid cooling solutions. The present invention also considers various alternative solutions, including heat exchange fins 500 of different shapes, liquid cooling tubes 310 without heat exchange fins 500, the layout of liquid cooling tubes 310 at different positions, diverse pipe material selections, as well as different phase change materials and connection methods, to adapt to different heat dissipation requirements and improve the heat dissipation efficiency. This integrated temperature control solution not only improves the overall performance and reliability of electronic devices but also extends the service life of the device, bringing innovation and breakthroughs to the heat dissipation of electronic components.

[0058] The present invention provides an electric control box, comprising: the heat dissipation device for electronic devices as described in the above embodiment.

[0059] During specific implementation, the specific structure, working principle, and beneficial effects of the heat dissipation device for electronic devices are the same as those in the above embodiment and will not be elaborated here.

[0060] The present invention provides an air conditioner, comprising: the heat dissipation device for electronic devices as described in the above embodiment; or, the air conditioner as described in the above embodiment.

[0061] During specific implementation, the specific structure, working principle, and beneficial effects of the heat dissipation device for electronic devices or the air conditioner are the same as those in the above embodiment and will not be elaborated here.

[0062] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "way", "specific way", or "some ways", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or way are included in at least one embodiment or way of the embodiments of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or way. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or ways. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or ways described in this specification and the features of different embodiments or ways.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device for an electronic device, characterized in that, It includes an electronic device (100), a phase change unit (200) and a heat dissipation unit (300); The phase change unit (200) is connected to the electronic device (100) and can absorb the heat released by the electronic device (100) when starting and stopping; The heat dissipation unit (300) is connected to the phase change unit (200) and can dissipate heat from the phase change unit (200).

2. The heat dissipation device for an electronic device according to claim 1, characterized in that, It further includes a housing (400), and the housing (400) has a receiving cavity (410); The electronic device (100), the phase change unit (200) and the heat dissipation unit (300) are arranged in the receiving cavity (410); The phase change unit (200) is a structural member made of a phase change material.

3. The electronic device heat dissipation device according to claim 2, characterized in that, The heat dissipation unit (300) is a liquid cooling heat dissipation unit (300), and the liquid cooling heat dissipation unit (300) includes a liquid cooling pipe (310); the liquid cooling pipe (310) extends into the receiving cavity (410); The electronic device heat dissipation device further includes at least one heat exchange fin (500), and the heat exchange fin (500) is arranged on the liquid cooling pipe (310) and is connected to the phase change unit (200).

4. The electronic device heat dissipation device according to claim 3, characterized in that, There are multiple heat exchange fins (500), and the multiple heat exchange fins (500) are arranged along the extending direction of the liquid cooling pipe (310) and sleeved on the liquid cooling pipe (310), and are in contact with the side wall surface of the liquid cooling pipe (310).

5. The heat dissipation device for an electronic device according to claim 3 or 4, characterized in that, It further includes a temperature sensor, a controller and a supplementary heat dissipation unit (600); The temperature sensor is located inside the housing (400) and can detect the temperature of the heat exchange fin (500); The controller is connected to the temperature sensor and the supplementary heat dissipation unit (600), and can connect the supplementary heat dissipation unit (600) to the heat exchange fin (500) when the temperature sensor detects that the temperature is greater than a preset value.

6. The electronic device heat dissipation device according to claim 5, characterized in that, The supplementary heat dissipation unit (600) includes a driving mechanism (610) and a heat dissipation mechanism (620); The driving mechanism (610) is connected to the heat dissipation mechanism (620) and can drive the heat dissipation mechanism (620) to move; The controller is connected to the driving mechanism (610); The surface of the housing (400) has an insertion hole that can communicate with the inside of the receiving cavity (410); The heat dissipation mechanism (620) is slidably connected to the hole wall of the insertion hole and is in sealed cooperation with the hole wall of the insertion hole. When the temperature sensor detects that the temperature is greater than the preset value, the heat dissipation mechanism (620) can be connected to the heat exchange fin (500).

7. The heat dissipation device for an electronic device according to claim 6, characterized in that The driving mechanism (610) includes a driving motor (611), a lead screw (612) and a nut (613); The output end of the driving motor (611) is connected to the end of the lead screw (612); The nut (613) is sleeved on the lead screw (612) and is connected to the heat dissipation mechanism (620).

8. The electronic device heat dissipation device according to claim 7, characterized in that, The heat dissipation mechanism (620) can be connected to the heat exchange fin (500) and the phase change unit (200) when the temperature sensor detects that the temperature is greater than the preset value.

9. The electronic device heat dissipation device according to claim 8, characterized in that, The heat dissipation mechanism (620) is a heat pipe. In a state where the temperature sensor detects that the temperature is greater than the preset value, the hot end of the heat pipe can be connected to the heat exchange fins (500) and the phase change unit (200).

10. The heat dissipation device for an electronic device according to claim 8, characterized in that, The heat dissipation mechanism (620) is a heat dissipation plate; The electronic device heat dissipation device further includes a thermoelectric cooler, which is disposed on the heat dissipation plate and connected to the controller; The controller can cause the thermoelectric cooler to refrigerate in a state where the temperature sensor detects that the temperature is greater than the preset value.

11. An electric control box, characterized in that, Comprising: The electronic device heat dissipation device according to any one of claims 1 to 10.

12. An air conditioner, characterized in that, Comprising: The electronic device heat dissipation device according to any one of claims 1 to 10; Or, The air conditioner according to claim 11.

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