Heat sinks and electronic devices

Abstract

The present application discloses a heat dissipation device and an electronic device. The heat dissipation device includes: a mounting cover, which is connected to a board on which components are mounted, and has a liquid inlet, a liquid outlet, and an air outlet; a jet plate, which has a jet channel facing the components; a first partition, which is arranged between the jet plate and the board, and forms a first flow channel between the first partition and the jet plate; a second partition, which is arranged between the first partition and the board, and forms a cooling cavity between the second partition and the board, and has a second flow channel between the second partition and the first partition, the jet channel passes through the first partition and the second partition and is connected to the cooling cavity, and has a gas-liquid separation zone between the second partition and the first partition, and both the first flow channel and the second flow channel are connected to the cooling cavity through the gas-liquid separation zone. The present application solves the problem of low heat dissipation effect of liquid cooling technology in related technologies.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and electronic equipment. Background Art

[0002] Currently, there are two main types of liquid cold plate technology: single-phase liquid cold plate technology and dual-phase liquid cold plate technology. In single-phase liquid cold plate technology, the coolant, driven by a pump, flows through a microchannel heat sink that is in direct contact with the heat-generating electronic device. Forced convection heat exchange occurs between the coolant and the heat sink, absorbing the heat generated by the electronic device. Although single-phase liquid cold plate technology can solve the heat dissipation problems of some high-power electronic devices, because it utilizes the sensible heat of the coolant, the sensible heat of the coolant is still very small compared to the latent heat of the coolant. Therefore, dual-phase liquid cold plate technology has emerged, which uses the latent heat of the coolant to cool electronic devices, greatly improving the heat dissipation performance of liquid cold plate technology. Although dual-phase liquid cold plate technology increases the heat dissipation limit of liquid cold plate technology and can solve the heat dissipation problem of high heat flux density, it still has heat dissipation limitations.

[0003] From the above, it can be seen that the existing liquid cooling technology still has the problem of low heat dissipation effect and cannot meet the high heat dissipation requirements. Summary of the Invention

[0004] The present application provides a heat dissipation device and an electronic device to at least solve the problem of low heat dissipation effect of liquid cooling technology in related technologies.

[0005] The present application provides a heat dissipation device, comprising: a mounting cover, the mounting cover is connected to a board card on which components are mounted, the mounting cover having a liquid inlet, a liquid outlet and an air outlet; a jet plate, the jet plate is arranged in the mounting cover, the jet plate has a jet channel facing the components, the jet channel is connected to the liquid inlet; a first partition, the first partition is arranged between the jet plate and the board card, a first flow channel is formed between the first partition and the jet plate; a second partition, the second partition is arranged between the first partition and the board card, a cooling cavity for accommodating components is formed between the second partition and the board card, a second flow channel is provided between the second partition and the first partition, the jet channel passes through the first partition and the second partition and is connected to the cooling cavity, one of the first flow channel and the second flow channel is connected to the liquid outlet, the other of the first flow channel and the second flow channel is connected to the air outlet, a gas-liquid separation zone is provided between the second partition and the first partition, both the first flow channel and the second flow channel are connected to the cooling cavity through the gas-liquid separation zone.

[0006] The present application also provides an electronic device, including a board, components and the above-mentioned heat dissipation device, the heat dissipation device is connected to the board, and the components are arranged in the heat dissipation device.

[0007] Through the present application, a jet plate, a first partition plate and a second partition plate are provided, and the three cooperate with the mounting cover to form a cooling cavity, a first flow channel and a second flow channel. The cooling cavity is used to place components that need to be cooled, while the first flow channel and the second flow channel can be used for liquid and gas to flow. At the same time, the setting of the jet channel on the jet plate enables the coolant and other media to impact the components through the jet channel, thereby achieving heat dissipation of the components. Generally speaking, the heat dissipation process is as follows: the coolant enters the mounting cover from the liquid inlet and impacts the components through the jet channel, thereby achieving heat dissipation of the components. Depending on the different calorific values ​​of the components, the phase change of the coolant is also different. When the calorific value of the components is low, the coolant remains in liquid state after absorbing heat, that is, single-phase cooling. At this time, the coolant after absorbing heat enters the first flow channel or the second flow channel and is discharged from the liquid outlet through the first flow channel or the second flow channel. When the calorific value of the components is high, the coolant produces gas after absorbing heat, that is, phase change cooling. At this time, the cooling chamber is in a state of gas-liquid mixture, and both liquid and gaseous media enter the gas-liquid separation zone. The gas and liquid are separated in the gas-liquid separation zone, one of which enters the first flow channel and the other enters the second flow channel. At this time, the gas and liquid are respectively transported in the isolated flow channels and then discharged from the gas outlet and the liquid outlet. The above-mentioned setting combines single-phase and two-phase together, utilizing the latent heat of phase change of the medium. The jet impact combines the advantages of high heat transfer efficiency of single-phase in the stagnation zone with the advantages of boiling heat exchange of the external phase change in this area, so that the cooling effect is further improved. In addition, the setting of the two flow channels enables the gaseous and liquid media generated after boiling heat exchange to be separated and discharged in time through their respective flow channels, thereby avoiding blockage of the flow path and the risk of chip overheating and downtime, ensuring good cooling and heat exchange effect, and solving the problems of pressure drop oscillation and parallel channel instability caused by untimely gas-liquid separation leading to poor liquid circuit circulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 A schematic structural diagram of a heat dissipation device provided in an embodiment of the present application;

[0010] Figure 2 for Figure 1 Exploded diagram;

[0011] Figure 3 for Figure 1 The main cross-sectional view of

[0012] Figure 4 for Figure 4 Axonometric view of

[0013] Figure 5 for Figure 4 Enlarged view of point P in the middle;

[0014] Figure 6 for Figure 1 A top cross-sectional view of the first partition.

[0015] The above drawings include the following reference numerals:

[0016] 10. Mounting cover; 11. Liquid inlet; 12. Liquid outlet; 13. Gas outlet; 20. Jet plate; 21. Jet channel; 30. First partition; 31. First flow channel; 32. Sealing section; 40. Second partition; 41. Cooling chamber; 42. Second flow channel; 43. Gas-liquid flow channel; 44. Gas-liquid separation zone; 50. Inner cover; 51. Liquid inlet chamber; 52. Gas flow channel; 53. Liquid flow channel; 54. Partition plate; 55. Side plate; 551. Extension section; 56. Liquid inlet section; 60. Heat exchange enhancement structure; 70. Board; 80. Components. DETAILED DESCRIPTION

[0017] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0018] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0019] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] In order to solve the problem of low heat dissipation effect of liquid cooling technology in related technologies, the present application provides a heat dissipation device and an electronic device.

[0021] like Figures 1 to 6The heat dissipation device shown in the figure includes a mounting cover 10, a jet plate 20, a first baffle 30 and a second baffle 40. The mounting cover 10 is connected to a board 70 on which a component 80 is mounted. The mounting cover 10 has a liquid inlet 11, a liquid outlet 12 and an air outlet 13. The jet plate 20 is arranged in the mounting cover 10. The jet plate 20 has a jet channel 21 facing the component 80, and the jet channel 21 is connected to the liquid inlet 11. The first baffle 30 is arranged between the jet plate 20 and the board 70, and a first flow channel 31 is formed between the first baffle 30 and the jet plate 20. The second baffle 40 is arranged between the first baffle 30 and the board 70, a cooling cavity 41 containing components 80 is formed between the second partition 40 and the board 70, a second flow channel 42 is provided between the second partition 40 and the first partition 30, the jet channel 21 passes through the first partition 30 and the second partition 40 and is connected to the cooling cavity 41, one of the first flow channel 31 and the second flow channel 42 is connected to the liquid outlet 12, and the other of the first flow channel 31 and the second flow channel 42 is connected to the gas outlet 13, a gas-liquid separation area 44 is provided between the second partition 40 and the first partition 30, and the first flow channel 31 and the second flow channel 42 are both connected to the cooling cavity 41 through the gas-liquid separation area 44.

[0022] In this embodiment, a jet plate 20, a first baffle 30 and a second baffle 40 are provided, and the three cooperate with the mounting cover 10 to form a cooling cavity 41, a first flow channel 31 and a second flow channel 42. The cooling cavity 41 is used to place components 80 that need to be dissipated, while the first flow channel 31 and the second flow channel 42 can be used for liquid and gas to flow. At the same time, the setting of the jet channel 21 on the jet plate 20 enables the coolant and other media to impact the components 80 through the jet channel 21, thereby achieving heat dissipation of the components 80. Generally speaking, the heat dissipation process is as follows: the coolant enters the mounting cover 10 from the liquid inlet 11 and impacts the component 80 through the jet channel 21, thereby achieving heat dissipation of the component 80. According to the different calorific values ​​of the component 80, the phase change of the coolant is also different. When the calorific value of the component 80 is low, the coolant remains in liquid state after absorbing heat, that is, single-phase cooling. At this time, the coolant after absorbing heat enters the first flow channel 31 or the second flow channel 42 and passes through the first flow channel 31 or the second flow channel 42. 42 is discharged from the liquid outlet 12, and when the heat generation of the component 80 is high, the coolant absorbs heat to produce gas, that is, phase change cooling. At this time, the cooling chamber 41 is in a state of a mixture of gas and liquid, and both the liquid and gaseous media enter the gas-liquid separation area 44. The gas and liquid are separated in the gas-liquid separation area 44, one of which enters the first flow channel 31 and the other enters the second flow channel 42. At this time, the gas and liquid are respectively transported in the isolated flow channels, and then discharged from the gas outlet 13 and the liquid outlet 12. The above-mentioned setting combines single-phase and two-phase together, utilizing the latent heat of phase change of the medium. The jet impact combines the advantages of high heat transfer efficiency of single-phase in the stagnation zone with the advantages of boiling heat exchange of the external phase change in this area, so that the cooling effect is further improved. In addition, the setting of the two flow channels enables the gaseous and liquid media generated after boiling heat exchange to be separated and discharged in time through their respective flow channels, thereby avoiding blockage of the flow path and the risk of chip overheating and downtime, ensuring good cooling and heat exchange effect, and solving the problems of pressure drop oscillation and parallel channel instability caused by untimely gas-liquid separation leading to poor liquid circuit circulation.

[0023] like Figure 2 and Figure 3As shown, in this embodiment, the heat dissipation device further includes an inner cover 50, which is arranged in the mounting cover 10 and is located on the side of the jet plate 20 away from the first partition 30. Taking the board 70 placed horizontally and the component 80 as a chip and placed above the board 70 as an example, the mounting cover 10 can be arranged above the board 70, and the inner cover 50, the jet plate 20, the first partition 30, and the second partition 40 in the mounting cover 10 are arranged in the order of the inner cover 50, the jet plate 20, the first partition 30, and the second partition 40 from top to bottom. In this way, a liquid inlet cavity 51 is formed between the inner cover 50 and the jet plate 20, a first flow channel 31 is formed between the jet plate 20 and the first partition 30, and the first partition 31 is formed between the first partition 30. 0. A second flow channel 42 is formed between the second partitions 40, and a cooling chamber 41 is formed between the second partitions 40 and the board 70. The liquid inlet chamber 51 is connected to the liquid inlet 11 and the jet channel 21. The first flow channel 31 and the second flow channel 42 are not directly connected and are separated. The cooling chamber 41 is connected to the jet channel 21 and the first flow channel 31 and the second flow channel 42. As a result, the medium first enters the liquid inlet chamber 51 from the liquid inlet 11, and then is injected from the liquid inlet chamber 51 through the jet channel 21 into the cooling chamber 41 to cool the component 80. The cooled heat-absorbing medium is discharged from the air outlet 13 and the liquid outlet 12 through the first flow channel 31 and the second flow channel 42, thus completing the heat dissipation cycle. The provision of the liquid inlet chamber 51 provides a storage and buffer space for the medium when it enters the mounting cover 10 from the liquid inlet 11, and also facilitates the subsequent distribution of the medium.

[0024] like Figure 3 and Figure 4 As shown, in this embodiment, the inner cover 50 and the mounting cover 10 are spaced apart, and the two form at least a portion of the gas flow channel 52 and at least a portion of the liquid flow channel 53. The gas flow channel 52 and the liquid flow channel 53 are separated, and one of the first flow channel 31 and the second flow channel 42 is connected to the gas outlet 13 through the gas flow channel 52, and the other of the first flow channel 31 and the second flow channel 42 is connected to the liquid outlet 12 through the liquid flow channel 53. In this way, the space between the inner cover 50 and the mounting cover 10 allows both the first flow channel 31 and the second flow channel 42 to further flow through the space between the mounting cover 10 and the inner cover 50, thereby flowing to the side or top of the inner cover 50 and being discharged from the gas outlet 13 and the liquid outlet 12 on the mounting cover 10.

[0025] In this embodiment, the first flow channel 31 is used to allow liquid medium to flow through, and the second flow channel 42 is used to allow gaseous medium to flow through. In this case, the first flow channel 31 is connected to the liquid flow channel 53, and the second flow channel 42 is connected to the gas flow channel 52. Of course, the functions of the first flow channel 31 and the second flow channel 42 can also be reversed, that is, the first flow channel 31 is connected to the gas flow channel 52 to allow gaseous medium to flow through, while the second flow channel 42 is connected to the liquid flow channel 53 to allow liquid medium to flow through.

[0026] In this embodiment, the inner housing 50 includes a partition plate 54 and a side plate 55. The partition plate 54 is spaced parallel to and spaced from the fluidic plate 20, resulting in a generally parallel arrangement of the partition plate 54, the fluidic plate 20, the first partition plate 30, the second partition plate 40, and the card 70. Due to the spacing between adjacent partition plates, various chambers can be formed. The side plate 55 is connected to the partition plate 54 and is located on the side of the partition plate 54 facing the fluidic plate 20. Unlike the conventional arrangement of the partition plate 54, the side plate 55 is in a square-shaped configuration, with its surface generally perpendicular to the partition plate 54. This creates a bottom-open frame-like structure for the inner housing 50, naturally forming a cavity within it that serves as the liquid inlet chamber 51. The bottom end of the side plate 55 is connected to the jet plate 20, so that the partition plate 54, the side plate 55 and the jet plate 20 together enclose the liquid inlet chamber 51. Since the jet channel 21 is provided on the jet plate 20, the liquid inlet chamber 51 and the jet channel 21 are naturally connected, so that the medium introduced into the liquid inlet 11 is diverted into the jet channel 21 through the liquid inlet chamber 51. At the same time, both the partition plate 54 and the side plate 55 are spaced apart from the inner wall of the mounting cover 10, so that a certain space is formed between them and the mounting cover 10, and this part of the space is used as a channel for the passage of gaseous or liquid media, thereby forming a liquid flow channel 53 and a gas flow channel 52. In this embodiment, the liquid inlet 11, the liquid outlet 12 and the gas outlet 13 are all provided on the top surface of the mounting cover 10, so that the longitudinal cross-sections of the liquid flow channel 53 and the gas flow channel 52 form an inverted L-shape. Of course, the specific positions of the liquid inlet 11, the liquid outlet 12 and the air outlet 13 on the mounting cover 10 can be adjusted as needed. For example, the liquid outlet 12 and the air outlet 13 can be set on the side of the mounting cover 10, so that the liquid outlet 12 and the air outlet 13 are opposite to the side panel 55, so that at this time there is no need to set a gap between the partition plate 54 and the mounting cover 10, and only the side panel 55 and the mounting cover 10 need to be set a gap.

[0027] In this embodiment, in order to ensure that the first flow channel 31 and the liquid flow channel 53 can be effectively separated from the second flow channel 42 and the gas flow channel 52, so that the gaseous medium and the liquid medium after heat exchange can flow independently in their respective flow channels, this embodiment further designs the structural forms of components such as the side plate 55, the first partition plate 30, the mounting cover 10, and the inner cover 50, and the separation effect can be ensured through the coordination between their structures.

[0028] like Figure 3 As shown, in this embodiment, along the circumference of the partition plate 54, a portion of the circumferential section of the side plate 55 has an extension section 551. The extension section 551 is located at the end of the side plate 55 connected to the jet plate 20 and extends toward the first partition plate 30. Since the side plate 55 in this embodiment is located above the jet plate 20, the extension section 551 is located at the bottom end of the side plate 55 and extends a distance along the circumference of the side plate 55. It should be noted that the extension section 551 does not cover the 360-degree circumference of the bottom end of the side plate 55, but only a portion of the circumference of the side plate 55. At the same time, the extension section 551 extends downward a short distance so that it passes over the jet plate 20 and extends to the first partition plate 30. The top end of the extension section 551 is connected to the side of the jet plate 20, and the bottom end is connected to the side of the first partition plate 30. Thus, the bottom end of the side plate 55 is circumferentially divided into two parts: a protruding portion with an extension section 551 and a recessed portion without the extension section 551. As for the protruding portion, since it extends beyond the side of the jet plate 20 and connects to the first baffle 30, the extension section 551 can block one side of the first flow channel 31 between the jet plate 20 and the first baffle 30, thereby separating the first flow channel 31 on the inside of the side plate 55 from the gas flow channel 52 on the outside of the side plate 55. As for the recessed portion, since its bottom end is located only at the jet plate 20 and connected only to the jet plate 20, it does not block the gap between the jet plate 20 and the first baffle 30, allowing the first flow channel 31 to connect with the liquid flow channel 53 through the recessed portion. Thus, the provision of the extension section 551 ensures stable communication between the first flow channel 31 and the liquid flow channel 53 and separates the first flow channel 31 from the gas flow channel 52.

[0029] like Figure 3As shown, in this embodiment, the edge of the first partition 30 is spaced apart from the inner wall of the mounting cover 10 and has a blocking section 32 extending toward the inner wall of the mounting cover 10. The blocking section 32 extends generally along the plane of the first partition 30, thereby forming a small outwardly extending portion at the circumferential edge of the first partition 30. This portion is the blocking section 32. Similar to the design of the aforementioned extension section 551, the blocking section 32 has a certain length along the circumference of the first partition 30 and does not cover the 360-degree circumference of the first partition 30, thereby forming a structure in which the edge of the first partition 30 is partially protruding and another portion is recessed. For the protruding part, since the blocking section 32 extends to the inner wall surface of the mounting cover 10 and is connected to the inner wall of the mounting cover 10, the blocking section 32 can separate the space between the upper and lower parts of the first partition 30, thereby playing the role of separating the first flow channel 31 above the first partition 30 and the second flow channel 42 below, avoiding communication between the first flow channel 31 and the second flow channel 42; and for the recessed part, since there is no blocking section 32, the edge of the first partition 30 and the mounting cover 10 are spaced apart, and this gap enables communication between the second flow channel 42 and the gas flow channel 52, that is, the second flow channel 42 is connected to the gas flow channel 52 through the gap, so that the gaseous medium in the second flow channel 42 can enter the gas flow channel 52. Since the gas flow channel 52 and the liquid flow channel 53 are respectively arranged on opposite sides of the inner cover 50 in this embodiment, the blocking section 32 and the extension section 551 are also respectively arranged on both sides of the inner cover 50 in this embodiment, so that the blocking section 32 and the extension section 551 can respectively play their respective blocking roles.

[0030] In this embodiment, since there is a gap around the inner wall of the mounting cover 10 and the outer wall of the inner cover 50, and the gap around the edges forms the gas flow channel 52 and the liquid flow channel 53, in order to separate the gas flow channel 52 and the liquid flow channel 53, this embodiment provides a partition section between the mounting cover 10 and the inner cover 50. The two sides of the partition section are connected to the mounting cover 10 and the inner cover 50, respectively, thereby dividing the gap outside the inner cover 50 into two independent parts, namely the liquid flow channel 53 and the gas flow channel 52. Multiple partition sections can be provided, with partition sections provided on opposite sides of the inner cover 50, to ensure that the partition section can separate the gap outside the inner cover 50 into two independent, non-directly connected parts.

[0031] By configuring the extension section 551, the blocking section 32, and the separating section, the first flow channel 31 and the liquid flow channel 53 are connected to each other, and the second flow channel 42 and the gas flow channel 52 are connected to each other, and the two groups of flow channels are separated from each other, so that each flow channel of the device is designed to be targeted, thereby ensuring that the gaseous medium and the liquid medium are transported and discharged in a timely manner, avoiding the situation where the gas and liquid mix together and cause the flow path to be blocked. It should be noted that when the functions of the first flow channel 31 and the second flow channel 42 and the specific coordination relationship between the gas flow channel 52 and the liquid flow channel 53 change, the extension section 551, the blocking section 32, the separating section, and other components that play the role of flow channel blocking and separation can be adjusted as needed, as long as it can ensure that the liquid medium and the gaseous medium are discharged through their respective flow channels respectively and do not affect each other.

[0032] like Figure 3 As shown, in this embodiment, the top of the partition plate 54 of the inner cover 50 also has a liquid inlet section 56. The liquid inlet section 56 adopts a sleeve-like structure, and its middle channel is connected to the liquid inlet cavity 51, which plays the role of liquid inlet. The liquid inlet section 56 as a whole extends a short distance upward along the arrangement direction of the two partitions, that is, longitudinally, so that the liquid inlet section 56 can extend into the liquid inlet 11, so that the liquid inlet section 56 can be used to connect with the external condensation component. In this way, the medium can directly enter the liquid inlet cavity 51 through the liquid inlet section 56 without passing through the installation cover 10, thereby avoiding the gap between the inner cover 50 and the installation cover 10 at the liquid inlet 11 that causes leakage, ensuring stable and reliable circulation of the medium. Of course, an opening can also be provided at the top of the inner cover 50 to connect and cooperate with the liquid inlet 11. At this time, since the medium will first pass through the liquid inlet 11 of the mounting cover 10, it is necessary to add a structure on the side of the liquid inlet 11 to seal the gap between the liquid inlet 11 and the inner cover 50 to ensure that the medium can only enter the liquid inlet cavity 51 through the liquid inlet 11, and avoid overflowing into the gas flow channel 52 and the liquid flow channel 53.

[0033] In this embodiment, the first partition 30 and / or the second partition 40 has a gas-liquid flow channel 43, and the gas-liquid flow channel 43 can be connected to at least one of the first partition 30 and the second partition 40 as needed. The setting method of the gas-liquid flow channel 43 has certain similarities with the jet channel 21, and is also arranged longitudinally through the first partition 30 and the second partition 40, and the upper and lower ends of the gas-liquid flow channel 43 are respectively connected to the cooling chamber 41 and the first flow channel 31, and the middle section of the gas-liquid flow channel 43 will pass through the second flow channel 42, so that a radially penetrating through hole can be opened on the side of the gas-liquid flow channel 43, and the through hole is connected to the second flow channel 42. In this way, the gas-liquid flow channel 43 can be connected to the first flow channel 31, the second flow channel 42 and the cooling chamber 41 at the same time, so that the medium in the cooling chamber 41 can enter the first flow channel 31 or the second flow channel 42 via the gas-liquid flow channel 43. Since the gas-liquid flow channel 43 connects the first flow channel 31 and the second flow channel 42, the through hole can be used as the gas-liquid separation zone 44. A gas-liquid separation membrane can be set at the through hole to achieve gas-liquid separation, so that the liquid cannot enter the second flow channel 42 and can only enter the first flow channel 31. Similarly, the gas cannot enter the first flow channel 31 and can only enter the second flow channel 42. Of course, the specific location of the gas-liquid separation zone 44 and the method for achieving gas-liquid separation can be adjusted as needed and are not limited to the above-mentioned arrangement of this embodiment.

[0034] like Figure 6 As shown, the number of both the jet channels 21 and the gas-liquid flow channels 43 of this embodiment can be set as needed, and one or more can be set. This embodiment preferably has multiple jet channels 21 and multiple gas-liquid flow channels 43, and each gas-liquid flow channel 43 is arranged at intervals along the surface of the first partition 30, and each jet channel 21 is arranged at intervals along the surface of the jet plate 20. Since the jet plate 20 and the first partition 30 of this embodiment are arranged parallel to each other, the planes on which they are located are also parallel to each other. Therefore, the arrangement of the gas-liquid flow channels 43 and the jet channels 21 is basically the same. Although the components they pass through are not exactly the same, both will pass through the first partition 30 and the second partition 40. Therefore, it can be said that both are arranged at intervals along the plane on which the first partition 30 is located. In this way, by setting up multiple jet channels 21, the medium in the liquid inlet chamber 51 can impact different positions of the cooling chamber 41 through different jet channels 21, thereby ensuring comprehensive heat dissipation of the components 80. The multiple gas-liquid flow channels 43 are configured to cooperate with the jet channels 21. The medium at various locations within the cooling chamber 41 can enter the first flow channel 31 or the second flow channel 42 through different gas-liquid flow channels 43, thereby facilitating timely return of the coolant. Both the jet channels 21 and the gas-liquid flow channels 43 can be arranged in an array as needed, such as a 6×6 or 6×7 arrangement.

[0035] Preferably, in this embodiment, a jet channel 21 is provided between two adjacent gas-liquid flow channels 43, and a gas-liquid flow channel 43 is provided between two adjacent jet channels 21. In other words, two adjacent gas-liquid flow channels 43 are not directly adjacent to each other, but are separated by a jet channel 21. Similarly, two adjacent jet channels 21 are not directly adjacent to each other, but are separated by a gas-liquid flow channel 43. The above method forms a cross-array layout between the jet channels 21 and the gas-liquid flow channels 43, and directional jet impingement cooling is carried out at the heat source location, facilitating timely return of the coolant, and solving the problem of the coolant flowing laterally and disturbing each other after the jet impingement, affecting the heat dissipation efficiency.

[0036] Further preferably, in this embodiment, the gas-liquid flow channels 43 and the jet channels 21 are arranged alternately along the surface of the first partition 30. That is, along the first direction of the surface of the first partition 30, there are the gas-liquid flow channels 43, the jet channels 21, another gas-liquid flow channel 43, another jet channels 21..., and along the second direction perpendicular to the first direction, there are the gas-liquid flow channels 43, the jet channels 21, another gas-liquid flow channel 43, another jet channels 21..., so that the gas-liquid flow channels 43 and the jet channels 21 form an alternating array arrangement, thereby further improving the cooling reflux effect and further reducing the impact of the lateral flow of the coolant. Of course, it is also possible to adopt an alternating arrangement in only one direction, and in the other direction, the gas-liquid flow channels 43 and the jet channels 21 are not adjacent to each other.

[0037] Preferably, in addition to optimizing the arrangement of the gas-liquid flow channel 43 and the jet channel 21, this embodiment also designs the size of the two. The flow area of ​​the jet channel 21 is smaller than the flow area of ​​the gas-liquid flow channel 43. This allows the coolant to flow through the jet channel 21 at a higher speed, thereby impacting the component 80 at high speed. The larger gas-liquid flow channel 43 can increase the speed of the coolant return flow, ensuring timely return flow. In this embodiment, the aperture of the jet channel 21 is set to 1 mm, and the aperture of the gas-liquid flow channel 43 is set to be greater than 1 mm. Of course, the specific diameter can be adjusted as needed.

[0038] like Figure 2 and Figure 3As shown, in this embodiment, the heat dissipation device also includes a heat exchange enhancement structure 60, which is connected to the component 80. The heat exchange enhancement structure 60 can be directly set on the surface of the component 80, and the heat exchange enhancement structure 60 has a protruding structure toward the second partition 40. The jet channel 21 can be oriented toward the heat exchange enhancement structure 60, so that the coolant flowing out of the jet channel 21 can act on the heat exchange enhancement structure 60. By setting the heat exchange enhancement structure 60, the coolant can act directly on the surface of the component 80, thereby eliminating the two layers of thermal resistance between the chip package and the heat conductive material and the bottom of the cold plate, thereby improving the cooling capacity. The heat exchange enhancement structure 60 can be directly processed on the surface of the component 80 through milling and other processes as needed, thereby realizing direct hybrid cooling for multi-chip high heat flux density heat dissipation scenarios.

[0039] The protruding structure of this embodiment adopts a pin-fin structure. The pin-fin structure of this embodiment has the following advantages in two-phase jet impingement cooling scenarios: significantly increasing the heat transfer surface area, thereby improving cooling performance; the high-density, small-scale pin-fin structure forms numerous microchannels, promoting enhanced convective heat transfer and enabling more efficient heat dissipation from the surface; the simultaneous presence of multiple jet channels 21 ensures uniform distribution of the coolant, and the impingement of the pin-fin structure generates turbulence, which enhances heat transfer and makes the surface temperature distribution more uniform; the two-phase cold plate experiences dynamic changes in the gas-liquid two-phase flow state and dryness. Because the density of the vapor phase is two orders of magnitude lower than that of the liquid phase, i.e., its specific volume is two orders of magnitude higher, flow instability in the two-phase microchannel heat sink can occur. This problem is mainly divided into two types: pressure drop oscillation and parallel channel instability. Pressure drop oscillation is the result of the interaction between the two-phase flow in the microchannel heat sink and the upstream compressible volume in the flow circuit. This instability causes violent fluctuations between the inflowing liquid and the downstream two-phase mixture in all channels, while parallel channel instability is the result of flow interaction between microchannels. Therefore, this embodiment adopts a pin-fin structure, and utilizes the intermittent staggered structural form of the pin-fin structure to facilitate gas-liquid diffusion during the phase change process, avoid the gas-liquid mixed fluid from flowing in a single direction, and effectively avoid the above-mentioned problems.

[0040] This embodiment uses a jet channel 21 facing the heat exchange enhancement structure 60, that is, the axis of the jet channel 21 is roughly parallel to the protruding direction of the pin-fin structure and is aligned up and down, so that the medium in the jet channel 21 can directly impact downward on the heat exchange enhancement structure 60, thereby achieving direct heat dissipation of the components 80 and ensuring the heat dissipation and cooling effect.

[0041] In this embodiment, the heat dissipation device further includes a blocking member, which can be configured as a plug or other structure as needed. The blocking member can be selectively positioned at the gas outlet 13 and can block the gas outlet 13. Since the generation of the gaseous medium depends on the heat generated by the component 80, when the heat generated by the component 80 is insufficient to generate the gaseous medium, only the first flow channel 31 and the liquid flow channel 53 function, while the second flow channel 42 and the gas flow channel 52 do not. Therefore, the blocking member can be installed at the gas outlet 13, thereby blocking both the second flow channel 42 and the gas flow channel 52. When the gaseous medium is generated and the second flow channel 42 and the gas flow channel 52 are needed, the blocking member can be removed.

[0042] This embodiment also provides an electronic device, including a board 70, components 80 and the above-mentioned heat dissipation device, the heat dissipation device is connected to the board 70, the mounting cover 10 is provided on the board 70, and the components 80 are arranged in the heat dissipation device, so that the heat dissipation device can cool and dissipate heat from the components 80.

[0043] The electronic device in this embodiment is a server, and the component 80 is a chip. Of course, the electronic device can also be other devices, such as a router, a switch, etc., and the component 80 can also be other devices such as a memory.

[0044] In this embodiment, the electronic device further includes a condensing assembly, which is in communication with the liquid inlet 11, liquid outlet 12, and air outlet 13 of the heat sink. The condensing assembly is configured to receive and cool the medium after heat exchange. The condensing assembly delivers the liquid, lower-temperature medium into the heat sink via the liquid inlet 11. The heat exchanged medium within the heat sink then flows back into the condensing assembly via the liquid outlet 12 and air outlet 13. Within the condensing assembly, the medium undergoes heat exchange with an external cooling source on the primary side, releasing heat absorbed during vaporization and recondensing the medium into a lower-temperature liquid.

[0045] The overall cooling cycle of the electronic equipment of this embodiment is as follows:

[0046] During the endothermic evaporation phase, the low-boiling-point coolant within the condensation assembly flows through the liquid inlet 11, the liquid inlet cavity 51, and the jet channel 21, impacting the enhanced heat exchange structure on the surface of the component 80. This absorbs the heat generated by the operation of the component 80, and the coolant evaporates from liquid to gas or a gas-liquid mixture. During this process, the medium absorbs a large amount of heat using the latent heat of vaporization, quickly removing the high heat load even when the temperature remains essentially unchanged.

[0047] Heat transfer stage: The gaseous or gas-liquid mixed medium flows back into the condensation component through the first flow channel 31, the second flow channel 42, the gas flow channel 52, and the liquid flow channel 53, where it exchanges heat with the primary-side external cold source, releases the heat absorbed during vaporization, and re-condenses into a liquid medium.

[0048] Circulation reflux stage: driven by the pump, the condensed liquid medium flows back into the mounting cover 10 to continue cooling the components 80, completing a closed cycle.

[0049] The above process utilizes the latent heat of phase change of the medium, realizes efficient heat exchange of "small flow, high heat dissipation", and greatly improves the cooling effect.

[0050] It should be noted that, in the above embodiments, a plurality refers to at least two.

[0051] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0052] By providing a jet plate 20, a first baffle 30 and a second baffle 40, the three cooperate with the mounting cover 10 to form a cooling cavity 41, a first flow channel 31 and a second flow channel 42, wherein the cooling cavity 41 is used to place components 80 that need to be dissipated, and the first flow channel 31 and the second flow channel 42 can be used for liquid and gas to flow. At the same time, the setting of the jet channel 21 on the jet plate 20 enables the coolant and other media to impact the component 80 through the jet channel 21, thereby achieving heat dissipation of the component 80. Generally speaking, the heat dissipation process is as follows: the coolant enters the mounting cover 10 from the liquid inlet 11 and impacts the component 80 through the jet channel 21, thereby achieving heat dissipation of the component 80. According to the different calorific values ​​of the component 80, the phase change of the coolant is also different. When the calorific value of the component 80 is low, the coolant remains in liquid state after absorbing heat, that is, single-phase cooling. At this time, the coolant after absorbing heat enters the first flow channel 31 or the second flow channel 42 and passes through the first flow channel 31 or the second flow channel 42. 42 is discharged from the liquid outlet 12, and when the heat generation of the component 80 is high, the coolant absorbs heat to produce gas, that is, phase change cooling. At this time, the cooling chamber 41 is in a state of a mixture of gas and liquid, and both the liquid and gaseous media enter the gas-liquid separation area 44. The gas and liquid are separated in the gas-liquid separation area 44, one of which enters the first flow channel 31 and the other enters the second flow channel 42. At this time, the gas and liquid are respectively transported in the isolated flow channels, and then discharged from the gas outlet 13 and the liquid outlet 12. The above-mentioned setting combines single-phase and two-phase together, utilizing the latent heat of phase change of the medium. The jet impact combines the advantages of high heat transfer efficiency of single-phase in the stagnation zone with the advantages of boiling heat exchange of the external phase change in this area, so that the cooling effect is further improved. In addition, the setting of the two flow channels enables the gaseous and liquid media generated after boiling heat exchange to be separated and discharged in time through their respective flow channels, thereby avoiding blockage of the flow path and the risk of chip overheating and downtime, ensuring good cooling and heat exchange effect, and solving the problems of pressure drop oscillation and parallel channel instability caused by untimely gas-liquid separation leading to poor liquid circuit circulation.

[0053] The above is a detailed introduction to a heat dissipation device and an electronic device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A heat dissipation device, characterized in that: include: A mounting cover (10), the mounting cover (10) being connected to a board (70) on which components (80) are mounted, the mounting cover (10) having a liquid inlet (11), a liquid outlet (12), and an air outlet (13); a jet plate (20), the jet plate (20) being arranged in the mounting cover (10), the jet plate (20) having a jet channel (21) facing the component (80), the jet channel (21) being in communication with the liquid inlet (11); a first baffle (30), the first baffle (30) being arranged between the jet plate (20) and the board card (70), and forming a first flow channel (31) between the first baffle (30) and the jet plate (20); a second partition (40), the second partition (40) being arranged between the first partition (30) and the board (70), a cooling cavity (41) containing the component (80) being formed between the second partition (40) and the board (70), a second flow channel (42) being provided between the second partition (40) and the first partition (30), the jet channel (21) passing through the first partition (30) and the second partition (40) and communicating with the cooling cavity (41), one of the first flow channel (31) and the second flow channel (42) being communicated with the liquid outlet (12), the other of the first flow channel (31) and the second flow channel (42) being communicated with the gas outlet (13), a gas-liquid separation zone (44) being provided between the second partition (40) and the first partition (30), the first flow channel (31) and the second flow channel (42) both being communicated with the cooling cavity (41) through the gas-liquid separation zone (44); The heat dissipation device further comprises an inner cover (50), the inner cover (50) being arranged in the mounting cover (10) and being located on a side of the jet plate (20) away from the first partition (30), a liquid inlet cavity (51) being formed between the inner cover (50) and the jet plate (20), the liquid inlet cavity (51) being in communication with the liquid inlet port (11); The inner cover (50) and the mounting cover (10) are spaced apart from each other, and the two form at least a portion of a gas flow channel (52) and at least a portion of a liquid flow channel (53); the gas flow channel (52) and the liquid flow channel (53) are separated and arranged; one of the first flow channel (31) and the second flow channel (42) is communicated with the gas outlet (13) through the gas flow channel (52); and the other of the first flow channel (31) and the second flow channel (42) is communicated with the liquid outlet (12) through the liquid flow channel (53); The first partition plate (30) and / or the second partition plate (40) has a gas-liquid flow channel (43), and the gas-liquid flow channel (43) passes through the first partition plate (30) and the second partition plate (40). The two ends of the gas-liquid flow channel (43) are connected to the cooling cavity (41) and the first flow channel (31) respectively. The side of the gas-liquid flow channel (43) has a through hole, and the through hole is connected to the second flow channel (42). The through hole serves as the gas-liquid separation zone (44).

2. The heat dissipation device according to claim 1, characterized in that: The inner cover (50) comprises: a partition plate (54), the partition plate (54) being arranged parallel to and spaced apart from the jet plate (20); A side plate (55), the side plate (55) is connected to the partition plate (54) and is located on a side of the partition plate (54) facing the jet plate (20), the side plate (55) is connected to the jet plate (20), the partition plate (54), the side plate (55) and the jet plate (20) together enclose the liquid inlet cavity (51), the partition plate (54) and the side plate (55) are both spaced apart from the mounting cover (10) and form the liquid flow channel (53) and the gas flow channel (52).

3. The heat dissipation device according to claim 2, characterized in that: Along the circumference of the partition plate (54), a partial segment of the circumference of the side plate (55) has an extension section (551), and the extension section (551) is located at one end of the side plate (55) connected to the jet plate (20) and extends in a direction close to the first partition plate (30). The extension section (551) extends to the first partition plate (30) and is connected to the first partition plate (30). The extension section (551) blocks one side of the first flow channel (31) and separates the first flow channel (31) and the gas flow channel (52).

4. The heat dissipation device according to claim 3, characterized in that: The edge of the first partition (30) is spaced apart from the inner wall of the mounting cover (10), and the edge of the first partition (30) has a blocking section (32) extending toward the inner wall of the mounting cover (10), the blocking section (32) and the extending section (551) are respectively located on both sides of the inner cover (50), and the blocking section (32) is connected to the inner wall of the mounting cover (10) and separates the first flow channel (31) and the second flow channel (42).

5. The heat dissipation device according to claim 1, characterized in that: A partition section is provided between the mounting cover (10) and the inner cover (50), and two sides of the partition section are respectively connected to the mounting cover (10) and the inner cover (50), and separate the liquid flow channel (53) and the gas flow channel (52) on both sides.

6. The heat dissipation device according to claim 1, characterized in that: The inner cover (50) has a liquid inlet section (56), the liquid inlet section (56) is in communication with the liquid inlet cavity (51), the liquid inlet section (56) is located at the liquid inlet port (11), and is used for docking and communicating with an external condensation component.

7. The heat dissipation device according to any one of claims 1 to 6, characterized in that: There are a plurality of gas-liquid flow channels (43), and each of the gas-liquid flow channels (43) is arranged at intervals along the surface of the first partition plate (30).

8. The heat dissipation device according to any one of claims 1 to 6, characterized in that: There are a plurality of jet channels (21), and each of the jet channels (21) is arranged at intervals along the surface of the jet plate (20).

9. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The gas-liquid flow channels (43) and the jet channels (21) are both plural and are arranged at intervals along the surface of the first partition plate (30). The jet channel (21) is provided between two adjacent gas-liquid flow channels (43), and the gas-liquid flow channel (43) is provided between two adjacent jet channels (21).

10. The heat dissipation device according to claim 9, characterized in that: Along the surface of the first partition plate (30), the gas-liquid flow channel (43) and the jet channel (21) are alternately arranged in sequence.

11. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The flow area of ​​the jet channel (21) is smaller than the flow area of ​​the gas-liquid flow channel (43).

12. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat dissipation device further comprises a heat exchange enhancement structure (60), the heat exchange enhancement structure (60) being connected to the component (80), and the heat exchange enhancement structure (60) having a protruding structure toward the second partition plate (40).

13. The heat dissipation device according to claim 12, characterized in that: The protruding structure is a pin-fin structure.

14. The heat dissipation device according to claim 12, wherein: The jet channel (21) faces the heat exchange enhancement structure (60), and the medium in the jet channel (21) impacts the heat exchange enhancement structure (60).

15. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat dissipation device further comprises a blocking piece, which can be selectively arranged at the air outlet (13) and is capable of blocking the air outlet (13).

16. An electronic device, characterized in that: The heat dissipation device comprises a board (70), a component (80), and the heat dissipation device according to any one of claims 1 to 15, wherein the heat dissipation device is connected to the board (70), and the component (80) is arranged in the heat dissipation device.

17. The electronic device according to claim 16, wherein: The electronic device further comprises a condensation component, the condensation component being in communication with the liquid inlet (11), the liquid outlet (12) and the air outlet (13) of the heat dissipation device, and the condensation component being used to receive the medium after heat exchange and to cool the medium.

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