Display device and visual inspection system

By introducing reference patterns and visual inspection systems into the display device, the problem of alignment recognition of optical functional layer and polarization layer is solved, and the display quality of the display device is improved.

CN120379476APending Publication Date: 2025-07-25SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202411977821.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-01-17
Filing Date
2024-12-31
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

It is difficult for existing display devices to accurately identify and correct during the alignment of the optical functional layer and the polarization layer, which affects the display quality.

Method used

The reference pattern is introduced into the display device, and the alignment state of the optical functional layer and the polarization layer is identified through the visual inspection system, and corresponding correction processing is performed.

Benefits of technology

The alignment accuracy of the optical functional layer and the polarization layer is improved, and the display quality of the display device is improved.

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Abstract

A display apparatus and a visual inspection system are provided. The display device includes a pixel circuit layer, a polarization layer disposed on the pixel circuit layer, an optical functional layer disposed on the polarization layer, and a reference pattern aligned with an edge of the optical functional layer.
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Description

[0001] Cross - reference to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10 - 2024 - 0007631, filed with the Korean Intellectual Property Office on January 17, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0003] The present inventive concept relates to a display device and a visual inspection system, and more particularly, to a display device including a reference pattern indicating the positions of an optical functional layer and a polarization layer, and an inspection system for identifying the reference pattern. Background art

[0004] A display device may receive image data and display an image corresponding to the image data. Such a display device may be used as a display for products such as mobile phones or televisions.

[0005] A display device may include a plurality of pixels that receive an electrical signal and emit light to display an image. Each of the plurality of pixels includes a light - emitting device. For example, in the case of an organic light - emitting display device, each pixel may include an organic light - emitting device (OLED) as the light - emitting device. Generally, an organic light - emitting display device may include a thin - film transistor and an organic light - emitting device formed on a substrate, and the organic light - emitting device may emit light.

[0006] Meanwhile, inspection technologies are being developed to improve the quality of these display devices. Summary of the invention

[0007] In one or more embodiments, a display device may include a reference pattern for identifying the alignment of an optical functional layer and a polarization layer using an inspection system, and the inspection system may be configured to identify the reference pattern. However, aspects of the present disclosure are not limited thereto.

[0008] Additional aspects will be apparent from the following description or may be learned by practicing the technical ideas presented in the present inventive concept.

[0009] According to one or more embodiments, a display device includes a pixel circuit layer, a polarization layer disposed on the pixel circuit layer, an optical functional layer disposed on the polarization layer, and a reference pattern aligned with an edge of the optical functional layer.

[0010] The display device may further include a substrate, wherein the pixel circuit layer may be disposed on the substrate, and the reference pattern may be printed on an upper surface of the optical functional layer.

[0011] The display device may further include a protective film layer disposed on the optical functional layer and the reference pattern.

[0012] The display device may further include a protective film layer disposed on the optical functional layer, wherein a reference pattern may be printed on the lower surface of the protective film layer.

[0013] The display device may further include a protective film layer disposed on the optical functional layer, wherein a reference pattern may be printed on the upper surface of the protective film layer.

[0014] The optical functional layer may include an adhesive layer disposed on the polarization layer, a light control layer disposed on the adhesive layer, and a cover layer disposed on the light control layer.

[0015] The reference pattern may be printed on the upper surface of the cover layer.

[0016] In a plan view, the reference pattern may have a width of about 10 micrometers to about 150 micrometers.

[0017] The display device may further include a window layer disposed on the optical functional layer and a light-blocking material layer disposed on the window layer that overlaps the reference pattern in a plan view.

[0018] The light-blocking material layer may be disposed on the lower surface of the window layer.

[0019] According to one or more embodiments, a visual inspection system includes: a sensing device configured to generate image data regarding an upper surface of a display panel, the display panel including a polarization layer, an optical functional layer disposed on the polarization layer, and a reference pattern aligned with an edge of the optical functional layer; and a computing device configured to receive the image data, identify the reference pattern from the image data, and obtain alignment state information of the optical functional layer based on the reference pattern.

[0020] The information regarding the alignment state may be information corresponding to one of the following cases: a case where an edge of the optical functional layer protrudes outside an edge of the polarization layer in the image data, a case where an edge of the optical functional layer is disposed inside an edge of the polarization layer in the image data, and a case where an edge of the optical functional layer coincides with an edge of the polarization layer in the image data.

[0021] The computing device may be configured to cause the display panel to proceed to a further process in a case where the computing device obtains information regarding the alignment state of the optical functional layer indicating that an edge of the optical functional layer coincides with an edge of the polarization layer in the image data.

[0022] The computing device may be configured to cause the display panel to proceed to one of a correction process and recycling in a case where the computing device obtains information regarding the alignment state of the optical functional layer indicating that an edge of the optical functional layer protrudes outside an edge of the polarization layer or an edge of the optical functional layer is disposed inside an edge of the polarization layer in the image data.

[0023] According to one or more embodiments, a display device includes a substrate, a pixel circuit layer disposed on the substrate, a polarization layer disposed on the pixel circuit layer, an optical function layer disposed on the polarization layer, and a reference pattern printed on an upper surface of the optical function layer at an edge of the optical function layer.

[0024] The display device may further include a protective film disposed on the optical function layer and the reference pattern.

[0025] The optical function layer may include an adhesive layer disposed on the polarization layer, a light control layer disposed on the adhesive layer, and a cover layer disposed on the light control layer.

[0026] In a plan view, the reference pattern may have a width of from about 10 micrometers to about 150 micrometers.

[0027] The display device may further include a first adhesive layer disposed on the optical function layer, a window layer disposed on the first adhesive layer, and a light-blocking material layer disposed on a surface of the window layer that overlaps the reference pattern in a plan view.

[0028] The light-blocking material layer may be disposed on a lower surface of the window layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Aspects, features, and advantages of embodiments of the present disclosure will become more apparent from the following description in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is a schematic plan view of a display device according to an embodiment;

[0031] Figure 2 is Figure 1 an equivalent circuit diagram of a pixel of the display device;

[0032] Figure 3 is a plan view mainly showing Figure 1 the optical function layer of the display panel;

[0033] Figure 4 is a cross-sectional view schematically showing a cross-section taken along line I-I' of Figure 3 ;

[0034] Figure 5 is Figure 1 a schematic cross-sectional view of a part of the display device;

[0035] Figures 6 to 8 is a cross-sectional view schematically showing an example in which a protective film layer is disposed on Figure 3 and Figure 4 the optical function layer;

[0036] Figure 9is a cross-sectional view schematically showing an example in which a window layer is disposed on Figure 4 a display panel; and

[0037] Figure 10 is a conceptual diagram schematically illustrating an inspection system according to an embodiment. DETAILED DESCRIPTION

[0038] Now, embodiments, examples of which are illustrated in the accompanying drawings, will be described in detail, where like reference numerals always refer to like elements. In this regard, the embodiments may have different forms and should not be construed as limited to the description set forth herein. Thus, the embodiments are described below only by reference to the figures to illustrate aspects of the present description.

[0039] Since the present disclosure allows for various changes and many embodiments, specific embodiments will be illustrated in the drawings and described in detail in the written description. Hereinafter, the effects and features of the present disclosure and the methods for achieving them will be described more fully with reference to the drawings in which embodiments of the present disclosure are shown. However, the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0040] One or more embodiments will be described in more detail below with reference to the drawings. In the drawings, components may be identified by the same reference numerals, and redundant descriptions thereof may be omitted.

[0041] It will be understood that, unless otherwise specified, when an element (such as a layer, film, region, or substrate) is referred to as being “on” another element, it can be “directly” on the other element, or intervening elements may also be present. It will be understood that, unless otherwise specified, when an element (such as a layer, film, region, or substrate) is referred to as being “under” another element, it can be “directly” under the other element, or intervening elements may also be present.

[0042] In the drawings, for ease of illustration, the thicknesses of layers and regions may be exaggerated or reduced. For example, for ease of illustration, the dimensions and thicknesses of components in the drawings may be arbitrarily illustrated, and the embodiments are not limited thereto. That is, for ease of illustration, the dimensions, thicknesses, and ratios of components in the drawings may be exaggerated and / or simplified for clarity. Therefore, spatially relative terms such as “below,” “beneath,” “under,” “underneath,” “above,” and “on” may be used to describe the relationship of one element or feature to another element or feature.

[0043] In the specification, it will be understood that terms used to describe space, direction, etc. are intended to cover different directions or viewpoints other than those shown in the figures. For example, when a device or component in the figures is flipped, a device or component described as "below" can be oriented in other ways (e.g., rotated 90 degrees or in the opposite direction). For example, when a device or component in the figures is flipped, a device or component described as "above" can be oriented in other ways (e.g., rotated 90 degrees or in the opposite direction). Thus, the terms "below" and "above" can include both upward and downward orientations. Additionally, a device or component can be oriented in other ways, and the descriptions of space or direction used herein can be interpreted in various ways.

[0044] In the specification, the process sequence or method sequence in the description of a process or manufacturing method can be different from the described sequence. For example, two consecutively described processes or methods can be performed substantially simultaneously or in a sequence opposite to the described sequence.

[0045] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of a rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0046] In the specification, the terms "first", "second", and "third" can be used to describe specific components, and the terms "first", "second", and "third" can be used to distinguish one component from another.

[0047] When a component is referred to as "connected to" or "coupled to" another component, it can be directly connected to or directly coupled to the other component, or there can be one or more intermediate components therebetween.

[0048] Similarly, when a component is "electrically connected" to another component, the one component and the other component can be directly and electrically connected, or can be indirectly and electrically connected through a conductive component.

[0049] Additionally, it will be understood that when a component is referred to as "between" other components, the one component can be the only component located between the other components, or intermediate components other than the one component can be located between the other components.

[0050] The terms used in this specification are only for describing specific embodiments and are not intended to limit the disclosure. The singular terms "a" and "an" used herein are also intended to include the plural forms unless the context clearly indicates otherwise.

[0051] The terms "positive mixture", "mixture", "mixing", "include", "include with", "contain", "contain with", "have", and "possess" designate the existence of the described features, wholes, steps, operations, elements, and / or components, but do not preclude the existence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof.

[0052] The term "and / or" includes any and all combinations of one or more of the related listed items. For example, the expression "A and / or B" indicates A, B, or A and B. The expression "at least one of..." can be used to indicate one or more components among a plurality of components. For example, the expression "at least one of a, b, and c" or "at least one selected from the group consisting of a, b, and c" can indicate "a", "b", "c", "a, b", "b, c", "a, c", or "a, b, c".

[0053] Terms such as "substantially" and "about" and similar terms are used as approximate terms rather than terms of degree, and can be intended to account for the inherent deviations of measured or calculated values that would be recognized by a person of ordinary skill in the art. For example, when describing an embodiment, the use of the term "may" or "can" can refer to one or more embodiments disclosed in the specification.

[0054] In the specification, when one layer has the "same layer structure" as another layer, it can mean that multiple layers included in that layer can be included in the other layer in the same order. For example, multiple layers included in one layer and multiple layers included in another layer can include the same materials and can be formed in the same order.

[0055] An electronic or electrical device and / or other related devices or components (e.g., some of the respective modules) according to the embodiments described herein can be implemented by using any suitable hardware, firmware (e.g., application specific integrated circuit), or software, or a combination of software, firmware, and hardware. For example, the respective components of these devices can be formed on an integrated circuit (IC) chip or on separate IC chips. In addition, the respective components of these devices can be formed on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or on a substrate. In addition, the respective components of these devices can be processes or threads running on one or more processors in one or more computing devices, executing computing program instructions and interacting with other system components to perform the various functions described herein.

[0056] Computer program instructions can be stored in a memory. The memory can be implemented in a computing device using a standard memory device such as random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media such as a CD-ROM or a flash drive. Additionally, those of ordinary skill in the art should recognize that, without departing from the spirit and scope of the embodiments, the various functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed over one or more other computing devices.

[0057] A display device according to an embodiment will be described in detail in the context of the above matters.

[0058] Figure 1 is a schematic plan view of a display device according to an embodiment.

[0059] As Figure 1 illustrated, a display device according to an embodiment may include a display panel 10. The display device can be of any type as long as it includes the display panel 10. For example, the display device can be a device such as a smart phone, a tablet computer, a laptop computer, a television, or a digital billboard. A display device according to an embodiment may include thin film transistors and capacitors, and the thin film transistors and capacitors can be implemented by a conductive layer and an insulating layer.

[0060] The display panel 10 may include a display area DA. The display panel 10 may include a peripheral area PA disposed around the display area DA. Although Figure 1 the display area DA is illustrated as having a rectangular shape, the present disclosure is not limited thereto. The display area DA can have any one of various shapes such as a circular shape, an oval shape, a polygonal shape, and a specific graphic shape. The peripheral area PA can have the same shape as or a different shape from the shape of the display area DA.

[0061] The display area DA can be an area for displaying an image. A plurality of pixels PX can be provided in the display area DA. Each of the plurality of pixels PX can include a display element such as an organic light emitting device. Each of the plurality of pixels PX can emit, for example, red light, green light, or blue light. The pixel PX can be connected to a pixel circuit including a thin film transistor (TFT), a storage capacitor, etc. Such a pixel circuit can be connected to, for example, a scan line SL that transmits a scan signal, a data line DL that intersects the scan line SL and transmits a data signal, and a drive voltage line PL that supplies a drive voltage. The data line DL and the drive voltage line PL can extend in the y-axis direction (hereinafter referred to as the first direction), and the scan line SL can extend in the x-axis direction (hereinafter referred to as the second direction).

[0062] Pixels PX can emit light having a luminance corresponding to an electrical signal from an electrically connected pixel circuit. A display area DA can display a specific image by using the light emitted by the pixels PX. For reference, the pixels PX used herein can be defined as light-emitting regions that emit red light, green light, or blue light as described above.

[0063] The peripheral area PA can be an area where the pixels PX are not provided and can correspond to an area where no image is displayed. Power supply wirings for driving the pixels PX can be arranged in the peripheral area PA. Additionally, pads can be provided in the peripheral area PA. An integrated circuit device (such as a driver IC or a printed circuit board including a driving circuit unit) and the pads can be electrically connected to each other in the peripheral area PA.

[0064] The display panel 10 can include a substrate 100. It can be considered that the substrate 100 has a display area DA and a peripheral area PA. A detailed description of the substrate 100 is provided herein.

[0065] A plurality of transistors can be provided in the display area DA. Depending on the type of transistor (N-type or P-type) and / or operating conditions, the first terminal of the transistor can be a source electrode or a drain electrode, and the second terminal of the transistor can be an electrode different from the first terminal. For example, when the first terminal is a source electrode, the second terminal can be a drain electrode.

[0066] The plurality of transistors can include a driving transistor, a data writing transistor, a compensating transistor, an initializing transistor, and an emission control transistor. The driving transistor can be connected between a driving voltage line PL and an organic light-emitting device (e.g., an organic light-emitting device OLED, see Figure 2 )). The data writing transistor can be connected to a data line DL. The driving transistor can perform a switching operation of transmitting a data signal transmitted through the data line DL.

[0067] The compensating transistor can be turned on according to a scan signal received through a scan line SL to connect the driving transistor to the organic light-emitting device and compensate for the threshold voltage of the driving transistor.

[0068] The initializing transistor can be turned on according to a scan signal received through the scan line SL to send an initialization voltage to the gate electrode of the driving transistor and initialize the gate electrode of the driving transistor. The scan line SL connected to the initializing transistor can be a separate scan line SL different from the scan line SL connected to the compensating transistor.

[0069] The emission control transistor can be turned on according to an emission control signal received through an emission control line such that a driving current flows through the organic light-emitting device.

[0070] An organic light emitting device may include a pixel electrode (e.g., an anode) and a counter electrode (e.g., a cathode), and may receive voltages from the pixel electrode (e.g., the anode) and the counter electrode (e.g., the cathode). The organic light emitting device may receive a driving current from a driving transistor to emit light and display an image.

[0071] Now, an organic light emitting display device will be illustrated and described as a display device according to an embodiment, but the display device according to the present disclosure is not limited thereto. According to an embodiment, the display device of the present disclosure may be an inorganic light emitting display, a quantum dot light emitting display, etc. For example, an emission layer of a display device included in the display device may include an organic material, or may include an inorganic material. The display device may include an emission layer and quantum dots located on a path of light emitted from the emission layer.

[0072] Figure 2 is Figure 1 the equivalent circuit diagram of a pixel of the display device.

[0073] Reference Figure 2 , each pixel PX may include a pixel circuit PC connected to a scan line SL and a data line DL, and an organic light emitting device OLED connected to the pixel circuit PC.

[0074] The pixel circuit PC may include a driving thin film transistor Td, a switching thin film transistor Ts, and a storage capacitor Cst. The switching thin film transistor Ts may be connected to the scan line SL and the data line DL, and may transmit a data signal Dm received via the data line DL to the driving thin film transistor Td according to a scan signal Sn received via the scan line SL.

[0075] The storage capacitor Cst may be connected to the switching thin film transistor Ts and a driving voltage line PL, and may store a voltage corresponding to a difference between a voltage received from the switching thin film transistor Ts and a first power supply voltage ELVDD (or a driving voltage) supplied to the driving voltage line PL.

[0076] The driving thin film transistor Td may be connected to the driving voltage line PL and the storage capacitor Cst, and may control a driving current flowing from the driving voltage line PL to the organic light emitting device OLED according to a voltage value stored in the storage capacitor Cst. The organic light emitting device OLED may emit light with a specific luminance according to the driving current.

[0077] The organic light-emitting device OLED can receive a second power supply voltage ELVSS (or common voltage). For example, the organic light-emitting device OLED can receive the second power supply voltage ELVSS (or common voltage) through the counter electrode (cathode), and the organic light-emitting device OLED can emit light with a specific brightness according to the driving current, and the driving current can be controlled according to the voltage difference between the first power supply voltage ELVDD (or driving voltage) and the second power supply voltage ELVSS (or common voltage).

[0078] Although in Figure 2 it is illustrated that the pixel circuit PC includes two thin film transistors and a storage capacitor, the embodiment is not limited thereto. For example, the pixel circuit PC can include two or more storage capacitors, and can include three or more thin film transistors.

[0079] Figure 3 is mainly showing Figure 1 a plan view of the optical functional layer of the display panel. Figure 4 is schematically showing a cross-sectional view of the cross-section taken along the line I-I’ of Figure 3 .

[0080] In Figure 3 and Figure 4 to the extent that it is the same as or overlaps with the descriptions given elsewhere in this article, redundant descriptions can be omitted.

[0081] As Figure 3 and Figure 4 shown, the display panel 10 of the display device according to an embodiment can include a substrate 100, a pixel circuit layer PCL, a packaging layer ENC, a polarization layer POL, and an optical functional layer LCF. The pixel circuit layer PCL, the packaging layer ENC, the polarization layer POL, and the optical functional layer LCF can be stacked in sequence. For example, the pixel circuit layer PCL can be arranged on the substrate 100, the packaging layer ENC can be arranged on the pixel circuit layer PCL, the polarization layer POL can be arranged on the packaging layer ENC, and the optical functional layer LCF can be arranged on the polarization layer POL.

[0082] The packaging layer ENC can be a layer for packaging the substrate 100 (or the pixel circuit layer PCL). The packaging layer ENC can be an inorganic layer of a type containing an inorganic material or an organic layer containing an organic material. Alternatively, the packaging layer ENC can include multiple layers formed by stacking an inorganic layer and an organic layer. The packaging layer ENC can be fixed by a sealing member CS arranged on the pixel circuit layer PCL. The packaging layer ENC can package at least a part of the substrate 100 or the pixel circuit layer PCL together with the sealing member CS.

[0083] The encapsulation layer ENC can cover the light-emitting elements of the pixel circuit layer PCL. The encapsulation layer ENC can inhibit or prevent the penetration of oxygen and moisture into the light-emitting elements. The encapsulation layer ENC can include a plurality of insulating layers and can include a plurality of inorganic layers (not shown) and a plurality of organic layers (not shown). In this case, the plurality of inorganic layers (not shown) can include at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, zirconium oxide, and tin oxide. The plurality of organic layers (not shown) can include one of acrylaldehyde group, polyimide (PI), polyamide (PA), and benzocyclobutene (BCB).

[0084] The polarization layer POL can be disposed on at least a part of the upper surface of the encapsulation layer ENC. The polarization layer POL can prevent or inhibit the reflection of external light incident on the display device. The polarization layer POL can improve the display quality of the display device. To this end, the polarization layer POL can at least cover the display area DA of the display device.

[0085] For example, the polarization layer POL can convert natural light (e.g., unpolarized light) or any polarized light into linearly polarized light with a specific direction, and can also include a linear polarization layer (not shown) for reducing the reflection of external light and a retardation layer for shifting the phase of the incident light by approximately 1 / 4λ. Therefore, the retardation layer (not shown) can change linearly polarized light into circularly polarized light, or change circularly polarized light into linearly polarized light.

[0086] The optical function layer LCF can be disposed on the polarization layer POL. The optical function layer LCF can have light directivity to control the path of external light or reflected light, and can improve the light efficiency by diffusing the reflected light. A detailed description of the optical function layer LCF is described herein.

[0087] The reference pattern BP can be disposed on the upper surface of the optical function layer LCF. The reference pattern BP can be disposed at the edge of the optical function layer LCF. For example, the reference pattern BP can be printed on the upper surface of the optical function layer LCF. The reference pattern BP can be printed at the edge of the optical function layer LCF.

[0088] The reference pattern BP can be a reference mark for accurately indicating the edge (or boundary) of the optical function layer LCF. The reference pattern BP can be configured to be recognized by an inspection system. The reference pattern BP can have characteristics that can be recognized by the inspection system. For example, the reference pattern BP can have a color, brightness, or reflectivity that can be recognized by the inspection system. The reference pattern BP can be formed by an inkjet printing process, but can be formed by various methods without being limited by its material, color, or processing method.

[0089] In a plan view, the reference pattern BP may have a width d. For example, the width d of the reference pattern BP may be from about 10 micrometers to about 150 micrometers, or may be about 100 micrometers. The width d of the reference pattern BP may be uniform around the edge of the optical functional layer LCF. The width d of the reference pattern BP may vary around the edge of the optical functional layer LCF. For example, the width d of the reference pattern BP may be different between at least two different edges of the optical functional layer LCF.

[0090] Generally, the boundary of the optical functional layer LCF may not be straight, and the boundary of the optical functional layer LCF may have a convex shape or a wavy shape. Generally, the range of the boundary of the optical functional layer LCF may have a variation of about 10 micrometers in the length of the boundary (e.g., edge). Therefore, in a plan view, the width d of the reference pattern BP may have a dimension equal to or greater than the variation range of the boundary of the optical functional layer LCF. Additionally, considering the recognition sensitivity of the inspection system, the width d of the reference pattern BP may be about 10 micrometers or greater.

[0091] When the width d of the reference pattern BP is greater than about 150 micrometers, the reference pattern BP may have a thickness that is not completely shielded by the window layer CG (see Figure 9 ). When the reference pattern BP is recognized by the user in the final product, this may have a negative impact on the display quality, such as making the border look thicker.

[0092] Figure 5 is Figure 1 a schematic cross-sectional view of a part of the display device.

[0093] As described above, the substrate 100 may include a display area DA and an area corresponding to the peripheral area PA around the display area DA. The substrate 100 may include various materials having flexible or bendable properties. For example, the substrate 100 may include glass, metal, or polymer resin. The substrate 100 may include polymer resin, such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 may have a multilayer structure. Each layer may include polymer resin. A barrier layer including inorganic materials (silicon oxide, silicon nitride, silicon oxynitride, etc.) may be located between multiple layers of the multilayer structure. The substrate 100 is not limited and may be subject to various modifications.

[0094] The buffer layer 101 may be disposed on the substrate 100. The buffer layer 101 may serve as a barrier layer and / or a blocking layer. For example, the buffer layer 101 may inhibit or prevent the diffusion of impurity ions. The buffer layer 101 may inhibit or prevent the penetration of moisture or external air. The buffer layer 101 may serve as a barrier layer and / or a blocking layer for planarizing the upper surface of the substrate 100. The buffer layer 101 may include silicon oxide, silicon nitride, or silicon oxynitride. The buffer layer 101 may control the heat transfer rate during a crystallization process for forming the semiconductor layer 110 such that the semiconductor layer 110 may be crystallized uniformly.

[0095] The semiconductor layer 110 may be disposed on the buffer layer 101. The semiconductor layer 110 may be formed of polysilicon. The semiconductor layer 110 may include a channel region doped with no impurities and a source region and a drain region both doped with impurities and formed on side surfaces of the channel region, respectively. The impurities may vary according to the type of thin film transistor and may be N-type impurities or P-type impurities. Although not shown in Figure 5 the display device according to the inventive concept may further include one or more additional semiconductor layers disposed on another layer.

[0096] The gate insulating layer 102 may be disposed on the semiconductor layer 110. The gate insulating layer 102 may be configured to ensure insulation between the semiconductor layer 110 and the gate layer 120. The gate insulating layer 102 may include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride and may be interposed between the semiconductor layer 110 and the gate layer 120. The gate insulating layer 102 may be a conformal layer. For example, the gate insulating layer 102 may have a shape corresponding to the surface of the substrate 100. The gate insulating layer 102 may have a structure in which contact holes are formed at preset portions. Accordingly, an insulating layer including an inorganic material may be formed via chemical vapor deposition (CVD) or atomic layer deposition (ALD). This may also apply to the embodiments and modifications described herein.

[0097] The gate layer 120 may be disposed on the gate insulating layer 102. The gate layer 120 may be disposed at a position vertically overlapping the semiconductor layer 110 and may include at least one metal among molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), titanium (Ti), tungsten (W), and copper (Cu). A detailed description of the gate layer 120 is described herein. Although not shown in Figure 5 the display device according to the inventive concept may further include another gate layer disposed on another layer.

[0098] The interlayer insulating layer 103 may be disposed on the gate layer 120. The interlayer insulating layer 103 may cover the gate layer 120. The interlayer insulating layer 103 may be formed of an inorganic material. For example, the interlayer insulating layer 103 may be a metal oxide or a metal nitride. For example, the inorganic material may include silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO2), etc. According to some embodiments, the interlayer insulating layer 103 may have a SiO x / SiN y or SiN x / SiO y dual structure.

[0099] The conductive layer 130 may be disposed on the interlayer insulating layer 103. The conductive layer 130 may be used as an electrode connected to the source region / drain region of the semiconductor layer 110 through vias included in the gate insulating layer 102 and the interlayer insulating layer 103.

[0100] The conductive layer 130 may include at least one metal selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu). For example, the conductive layer 130 may include a titanium layer, an aluminum layer, and / or a copper layer. For example, the conductive layer 130 may include a Ti / Al / Ti structure.

[0101] Although not shown in Figure 5 , the display device according to the inventive concept may further include an additional conductive layer disposed on another layer. The additional conductive layer may be, for example, a wiring layer used as a wiring. The additional conductive layer may include the same material as the material of the conductive layer 130 and have the same layer structure as the layer structure of the conductive layer 130.

[0102] The organic insulating layer 104 may be disposed on the interlayer insulating layer 103 and the conductive layer 130. The organic insulating layer 104 may be an organic insulating layer that covers the upper portion of the conductive layer 130 and has a substantially flat upper surface, which may be used as a planarization layer. The organic insulating layer 104 may include an organic material such as an acryl group, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO). Various modifications may be made to the organic insulating layer 104. For example, the organic insulating layer 104 may include a single layer or multiple layers.

[0103] Although not shown in Figure 5Although not shown in the figure, the display device according to the inventive concept may further include an additional organic insulating layer disposed on another layer. The additional organic insulating layer may be disposed on the above-described additional conductive layer and may cover the top of the additional conductive layer to serve as a planarization layer. The additional organic insulating layer may include the same material as that of the organic insulating layer 104 and may have the same layer structure as that of the organic insulating layer 104.

[0104] The pixel electrode 140 may be disposed on the organic insulating layer 104. Alternatively, the pixel electrode 140 may be disposed on the additional organic insulating layer. However, for ease of explanation, it may be assumed that the pixel electrode 140 is disposed on the organic insulating layer 104.

[0105] The pixel electrode 140 may be connected to the conductive layer 130 through a contact hole formed in the organic insulating layer 104. A display element may be disposed on the pixel electrode 140. The organic light-emitting device OLED may be used as the display element. In other words, the organic light-emitting device OLED may be disposed on, for example, the pixel electrode 140. The pixel electrode 140 may include a transparent conductive layer formed of a transparent conductive oxide such as ITO, In2O3, or IZO and a reflective layer formed of a metal such as Al or Ag. For example, the pixel electrode 140 may have a layered structure of ITO / Ag / ITO.

[0106] The pixel defining layer 105 may be disposed on the organic insulating layer 104. The pixel defining layer 105 may be disposed to cover the edge of the pixel electrode 140. For example, the pixel defining layer 105 may cover the sidewalls of the pixel electrode 140 extending in the vertical direction (e.g., the z-axis direction). The pixel defining layer 105 may have an opening corresponding to the pixel PX, and the opening may be formed to expose at least a part of the pixel electrode 140. For example, the pixel defining layer 105 may expose at least the central part of the pixel electrode 140. The opening may be defined by the pixel defining layer 105.

[0107] The pixel defining layer 105 may include, for example, an organic material such as polyimide or hexamethyldisiloxane (HMDSO). A spacer (not shown) may be disposed on the pixel defining layer 105. The spacer may be positioned on the peripheral area PA, but may also be positioned on the display area DA. The spacer may prevent the organic light-emitting device OLED from being damaged due to the sagging of the mask in the manufacturing process using a mask. The spacer may include an organic insulating material and may be a single layer or multiple layers.

[0108] The intermediate layer 150 and the counter electrode 160 may be disposed in the openings in the pixel defining layer 105. The intermediate layer 150 may include a low molecular weight material or a high molecular weight material. When the intermediate layer 150 includes a low molecular weight material, the intermediate layer 150 may include a hole injection layer, a hole transport layer, an emission layer, an electron transport layer, and / or an electron injection layer. When the intermediate layer 150 includes a high molecular weight material, the intermediate layer 150 generally may have a structure including a hole transport layer and an electron transport layer.

[0109] The intermediate layer 150 is not limited to the structures described herein and may have any of a variety of other structures. For example, at least one of the plurality of layers constituting the intermediate layer 150 may be integrally formed with the counter electrode 160. According to another embodiment, the intermediate layer 150 may include a layer patterned to correspond to each of the plurality of pixel electrodes 140.

[0110] The counter electrode 160 may include a transparent conductive layer formed of a transparent conductive oxide such as ITO, In2O3, or IZO. The pixel electrode 140 may serve as an anode electrode, and the counter electrode 160 may serve as a cathode electrode. Alternatively, the pixel electrode 140 may serve as a cathode electrode, and the counter electrode 160 may serve as an anode electrode.

[0111] The counter electrode 160 may be disposed in the display area DA. The counter electrode 160 may cover the entire display area DA. In other words, the counter electrode 160 may be integrally formed to cover the plurality of pixels PX.

[0112] The pixel circuit layer PCL may include layers disposed on the substrate 100. The pixel circuit layer PCL may include, for example, a semiconductor layer 110, a gate insulating layer 102, a gate layer 120, an interlayer insulating layer 103, a conductive layer 130, an organic insulating layer 104, a pixel electrode 140, a pixel defining layer 105, an intermediate layer 150, and a counter electrode 160. In some cases, the pixel circuit layer PCL may include a buffer layer 101. The pixel circuit layer PCL is a concept introduced for ease of explanation. The pixel circuit layer PCL may be understood as a layer disposed on the substrate 100 and including at least one light-emitting pixel.

[0113] The encapsulation layer ENC may be disposed on the pixel circuit layer PCL, and an empty space ES or a transparent filler TF may be disposed between the pixel circuit layer PCL and the encapsulation layer ENC.

[0114] Figures 6 to 8 is schematically shown in which the protective film layer is disposed on Figure 3 and Figure 4 the optical functional layer of.

[0115] As Figures 6 to 8As shown, the optical functional layer LCF may include a first adhesive layer 401, a light control layer 402, and a cover layer 403. The first adhesive layer 401 may be disposed on the polarization layer POL. The light control layer 402 may be disposed on the first adhesive layer 401. The cover layer 403 may be disposed on the light control layer 402.

[0116] The first adhesive layer 401 may be disposed between the polarization layer POL and the light control layer 402, and may bond the upper surface of the polarization layer POL to the lower surface of the light control layer 402. For example, the first adhesive layer 401 may be an adhesive layer manufactured by applying a liquid adhesive material and curing the liquid adhesive material, or may be a separately manufactured adhesive sheet. For example, the first adhesive layer 401 may include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0117] The light control layer 402 may have light directivity characteristics. For example, the light control layer 402 may control the path of light emitted from the light control layer 402. The light emitted from the light control layer 402 may be referred to as external light or reflected light. The light emitted from the light control layer 402 may have a predetermined angle, or may be polarized with respect to a direction perpendicular to the polarization layer POL. The light control layer 402 may have a window layer including a light-blocking region. In an example, the path of the light emitted from the light control layer 402 may be guided by the light control layer 402 in the direction of the user's viewing angle, and the light use efficiency may be increased.

[0118] The cover layer 403 may be disposed on the light control layer 402. The cover layer 403 may protect the light control layer 402 from external influences. The cover layer 403 may be a layer on which the reference pattern BP may be printed. The cover layer 403 may include a material having a high light transmittance. For example, the cover layer 403 may include polyimide (PI), cyclic olefin polymer (COP), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polynorbornene (PNB), or polyethersulfone (PES), or may include a combination of some of the above materials. Alternatively, the cover layer 403 may include a resin.

[0119] The protective film layer PTF can be disposed on the optical functional layer LCF. For example, the protective film layer PTF can be disposed on the cover layer 403 included in the optical functional layer LCF. The protective film layer PTF can be a separable layer. For example, the optical functional layer LCF can be provided as a unit including the protective film layer PTF disposed thereon. The protective film layer PTF can be configured to protect the upper surface of the optical functional layer LCF from external substances or external impacts. For example, the protective film layer PTF can protect the upper surface of the optical functional layer LCF during transportation. The protective film layer PTF can be removed during the display device manufacturing process. The protective film layer PTF can be removed after the alignment inspection process using the vision inspection device described herein.

[0120] As Figure 6 shown, the protective film layer PTF can be disposed on the optical functional layer LCF. The protective film layer PTF can cover the reference pattern BP. The reference pattern BP can be disposed on the cover layer 403. In a cross-sectional view, the reference pattern BP can be disposed between the light control layer 402 and the protective film layer PTF. The reference pattern BP can be disposed between the cover layer 403 and the protective film layer PTF.

[0121] As Figure 7 shown, the protective film layer PTF can be removed. The protective film layer PTF can be removed during the display device manufacturing process. In an example where the reference pattern BP is printed on the upper surface of the optical functional layer LCF or the upper surface of the cover layer 403, when the protective film layer PTF is removed, the reference pattern BP can remain on the upper surface of the optical functional layer LCF. For example, when the protective film layer PTF is removed, the protective film layer PTF and the reference pattern BP can be separated from each other, and the reference pattern BP can not be removed from the cover layer 403 or the optical functional layer LCF. In the example, the reference pattern BP can remain disposed on the optical functional layer LCF after the protective film layer PTF is removed, and the reference pattern BP can be covered by the window layer CG.

[0122] As Figure 8As shown, the protective film layer PTF can be removed during the display device manufacturing process. In an example, the reference pattern BP can be removed together with the protective film layer PTF. To this end, the reference pattern BP can be printed not on the upper surface of the optical functional layer LCF or the upper surface of the cover layer 403, but on the lower surface of the protective film layer PTF. In an example where the reference pattern BP is printed on the surface of the protective film layer PTF, the reference pattern BP can be aligned with the edge of the optical functional layer LCF. Accordingly, even when the reference pattern BP is printed on the surface of the protective film layer PTF, the alignment of the optical functional layer LCF and the polarizing layer POL can be determined. In an example where the reference pattern BP is removed together with the protective film layer PTF or removed after the protective film layer PTF, another component for separately covering the reference pattern BP in a later operation can be omitted.

[0123] Although not shown in Figure 8 , the reference pattern BP can be printed on the upper surface of the protective film layer PTF opposite to the lower surface of the protective film layer PTF. When the reference pattern BP is printed on the lower surface or the upper surface of the protective film layer PTF, the reference pattern BP can be disposed in a region corresponding to the edge of the optical functional layer LCF. Even when the reference pattern BP is printed on the lower surface or the upper surface of the protective film layer PTF, the reference pattern BP can serve as a reference mark for identifying the edge of the optical functional layer LCF.

[0124] Figure 9 is a cross-sectional view schematically showing an example of a display panel in which a window layer is disposed on Figure 4 . In the drawings (e.g., refer to Figure 6 ), redundant descriptions of components identified by the same reference numerals can be omitted.

[0125] As Figure 9 shown, the window layer CG can be disposed on the optical functional layer LCF. The window layer CG can be made of a transparent material such as glass.

[0126] In a plan view, the window layer CG can be divided into a transmissive region (not shown) and a light-blocking region (not shown). In a plan view, the light-blocking region (not shown) can be disposed to surround the transmissive region (not shown). The light-blocking region can be defined by a light-blocking material layer CGBM disposed on the lower surface of the window layer CG. In a plan view, the light-blocking region can refer to a region where the light-blocking material layer CGBM is disposed. The transmissive region can refer to a region where the light-blocking material layer CGBM is not disposed in a plan view.

[0127] The light-blocking material layer CGBM can be disposed on the lower surface of the window layer CG. The light-blocking material layer CGBM can be disposed at the edge of the window layer CG. The light-blocking material layer CGBM can be disposed at the edge of the window layer CG, and the light-blocking material layer CGBM can extend toward the central portion of the window layer CG with a specific width.

[0128] In a plan view, the light-blocking material layer CGBM and the reference pattern BP can overlap each other. For example, when viewed from the outside of the display device, the reference pattern BP may be blocked by the light-blocking material layer CGBM. For example, the light-blocking material layer CGBM can have a width greater than or equal to the width of the reference pattern BP.

[0129] The light-blocking material layer CGBM can be a black matrix and can include various materials capable of absorbing at least a portion of light. For example, the light-blocking material layer CGBM can include at least one of carbon black, graphite, chromium-based materials, dyes, metal reflective films, and light absorption films.

[0130] The second adhesive layer can be disposed between the window layer CG and the optical functional layer LCF. For example, the second adhesive layer can include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin OCR. In Figure 9 the second adhesive layer is illustrated as the optically clear resin OCR, however, the description is not limited thereto. For example, the optically clear resin OCR can be replaced by a pressure-sensitive adhesive (PSA) or an optically clear adhesive (OCA). The second adhesive layer can be located between the lower surface of the window layer CG and the upper surface of the optical functional layer LCF. The second adhesive layer can bond the lower surface of the window layer CG to the upper surface of the optical functional layer LCF.

[0131] At least one of the reference pattern BP and the light-blocking material layer CGBM can be used to inhibit the optically clear resin OCR from flowing to the edge of the optical functional layer LCF. Although the reference pattern BP is shown to have a rectangular shape in cross-section, the reference pattern BP can have other shapes. For example, the reference pattern BP can have a shape configured to inhibit the optically clear resin OCR from flowing to the edge of the optical functional layer LCF. For example, the reference pattern BP can have a dome shape in cross-section. In an example, the reference pattern BP can have a substantially linear edge disposed along the edge of the optical functional layer LCF and a wavy edge disposed opposite the linear edge in a plan view. In another example, the reference pattern BP can be provided as a first reference pattern disposed at the edge of the optical functional layer LCF and a second reference pattern disposed adjacent to the first reference pattern. In yet another example, the first reference pattern can be linear along the edge of the optical functional layer LCF, and the second reference pattern can have a wavy shape in a plan view.

[0132] Figure 10It is a conceptual diagram schematically illustrating an inspection system according to an embodiment.

[0133] For reference, in Figure 10 the description, redundant descriptions of matters that are the same as or overlap with the matters described above may be omitted.

[0134] As Figure 10 shown in

[0135] an inspection system for inspecting a display panel 10 according to an embodiment may include a sensing device 20 and a computing device 30. For example, the inspection system may be an optical functional layer alignment inspection system. The sensing device 20 may generate image data regarding the upper surface of the display panel 10. The computing device 30 may receive the image data and perform a visual recognition operation based on the image data. Figures 1 to 8 The display panel 10 has been described with reference to

[0136] and its redundant description may be omitted. The optical functional layer LCF and the polarization layer POL may be aligned such that they overlap each other in a plan view. Based on the result of inspecting the edge of the optical functional layer LCF and the edge of the polarization layer POL by optical recognition, the alignment state may be obtained by the computing device 30. However, it may be difficult to clearly distinguish between the edge of the optical functional layer LCF and the edge of the polarization layer POL using optical recognition. Figure 10 The display panel 10 may be disposed on the visual inspection table of the inspection system shown in Figure 4 . The display panel 10 may be in a state before the window layer CG is formed. The display panel 10 disposed on the visual inspection table may be in a state in which a substrate 100, a pixel circuit layer PCL, an encapsulation layer ENC, a polarization layer POL, and an optical functional layer LCF are stacked in sequence (see, for example, Figure 8 ). In an example, a reference pattern BP disposed at the edge of the optical functional layer LCF may be used to distinguish the edge of the optical functional layer LCF. In a case where the edge of the optical functional layer LCF and the edge of the polarization layer POL are aligned in the vertical direction (e.g., the z-axis direction), the reference pattern BP disposed at the edge of the optical functional layer LCF may be used to distinguish the edge of the polarization layer POL. In some cases, as

[0137] shown in Figure 8 , the display panel 10 disposed on the visual inspection table may include a protective film layer PTF. The protective film layer PTF may protect the upper surface of the optical functional layer LCF. When the protective film layer PTF is also included, the reference pattern BP of the display panel 10 may be printed on the upper surface of the optical functional layer LCF, or may be printed on the surface of the protective film layer PTF. For example, the reference pattern BP may be printed on the lower surface of the protective film layer PTF.The sensing device 20 may be a device for generating image data. The image data may be at least one image, or may be frame images. For example, the sensing device 20 may refer to an optical camera, an infrared camera, or an ultraviolet camera, or any device that detects an object by using electromagnetic radiation (such as radar or lidar). The sensing device 20 may be an optical camera.

[0138] The computing device 30 may receive image data from the sensing device 20. The computing device 30 may perform an operation for identifying a reference pattern BP in the image data. For example, the computing device 30 may execute a pre-stored algorithm. The computing device 30 may obtain information about the alignment state of the optical functional layer LCF based on the reference pattern BP.

[0139] The information about the alignment state of the optical functional layer LCF may be classified. For example, the information about the alignment state may indicate that an edge of the optical functional layer LCF protrudes outside an edge of the polarization layer POL in the image data. In another case, the information about the alignment state may indicate that an edge of the optical functional layer LCF is disposed inside an edge of the polarization layer POL in the image data. In still another case, the information about the alignment state may indicate that an edge of the optical functional layer LCF coincides with an edge of the polarization layer POL in the image data. In this case, the edges of the optical functional layer LCF and the polarization layer POL may correspond to each other in the vertical direction (e.g., the z-axis direction). For example, the alignment state of the left edge of the optical functional layer LCF in the plan view may be defined based on the relative position with respect to the left edge of the polarization layer POL in the plan view.

[0140] When one edge of the optical functional layer LCF is disposed outside an edge of the polarization layer POL (e.g., when one edge of the optical functional layer LCF is disposed outside one edge of the polarization layer POL), the other edge of the optical functional layer LCF opposite to the one edge may be disposed inside an edge of the polarization layer POL. Therefore, the computing device 30 may identify the reference pattern BP disposed on one side of an edge of the optical functional layer LCF from the image data, and may obtain alignment state information based on this side of the edge of the optical functional layer LCF.

[0141] The computing device 30 may define the display panel 10 as defective or normal based on the alignment state information. For example, when the alignment state indicates that an edge of the optical functional layer LCF coincides with an edge of the polarization layer POL in the image data, the computing device 30 may define the display panel 10 as normal. For example, coincidence may be determined when the reference pattern BP overlaps an edge of the polarization layer POL (e.g., when an edge of the polarization layer POL is hidden by the reference pattern BP). In this way, the alignment accuracy (e.g., alignment tolerance) may be controlled according to the distance from the reference pattern BP.

[0142] The computing device 30 can send the display panel 10 to a predetermined process according to a defined state, or can perform marking on the display panel 10. For example, the computing device 30 can classify the display panel 10 as having aligned layers and can advance the display panel 10 to a further process. For example, the computing device 30 can classify the display panel 10 as having aligned layers and can advance the display panel 10 for encapsulation, for implementation in an electronic device, etc. In a case where the computing device 30 classifies the display panel 10 as misaligned (e.g., the alignment state is abnormal), the computing device 30 can advance the display panel 10 for correction processing or recycling, or remove it from a further process.

[0143] To perform these operations, the computing device 30 can include a processor 31, a memory 32, and a communication module 33.

[0144] The memory 32 can store data supporting various functions of the computing device 30. The memory 32 can store application programs or applications executable by the computing device 30, data for the operation of the computing device 30, or other instructions. The application programs can be downloaded to the computing device 30 from an external server, for example, via wireless communication. The application programs can be stored in the memory 32 installed in the computing device 30 and executed by the processor 31 to perform the operations (or functions) of the computing device 30.

[0145] The memory 32 can include at least one type of storage medium selected from a flash memory type, a hard disk type, a solid state drive (SSD) type, a silicon disk drive (SDD) type, a multimedia card micro type, a card type memory (e.g., a secure digital (SD) or extreme digital (XD) memory), a random access memory (RAM), a static random access memory (SRAM), a read only memory (ROM), an electrically erasable programmable ROM (EEPROM), a programmable ROM (PROM), a magnetic memory, a magnetic disk, and an optical disk. The memory 32 can include cloud storage that can perform a storage function on a network.

[0146] The processor 31 can execute instructions and process information by processing signals, data, information, etc. input or output by the computing device 30. The processor 31 can control one or more other components by executing instructions stored in the memory 32. The processor 31 can execute instructions stored in the memory 32. For example, the processor 31 can run application programs stored in the memory 32.

[0147] The processor 31 can be a component capable of performing calculations and controlling one or more other devices. The processor 31 may mainly refer to a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), etc. The CPU, AP, or GPU may include one or more cores therein, and the CPU, AP, or GPU may operate using an operating voltage and a clock signal.

[0148] The communication module 33 can send / receive information. Information can be sent to / from a base station or another component having a communication function through an antenna. In this case, the communication module 33 may include a modulator, a demodulator, a signal processor, etc. Alternatively, the communication module 33 can perform wired or wireless communication functions.

[0149] Wireless communication may refer to communication using a wireless communication network and a communication protocol such as 3GPP, LTE, 5G, or 6G. However, this specification can utilize a pre-installed communication network without being restricted by such a wireless communication method.

[0150] Wireless communication may refer to short-distance communication. In this case, wireless communication may include Bluetooth, Bluetooth Low Energy (BLE), beacons, radio frequency identification (RFID), Infrared Data Association (IrDA), ultra-wideband (UWB), ZigBee, etc.

[0151] As Figure 10 shown, the inspection system may further include a lighting device 40. The lighting device 40 can help obtain clear image data. The reference pattern BP may have a color according to the color of the lighting device 40. For example, the color of the reference pattern BP may have a color complementary to the color of the light emitted from the lighting device 40. This is only an example for helping understanding, and the scope of the rights of this specification is not limited by this example.

[0152] According to the embodiments described herein, an inspection system (i.e., a visual inspection system) capable of inspecting the alignment state of an optical functional layer and a polarization layer through visual recognition can be implemented. Of course, the scope of the present disclosure is not limited thereto.

[0153] It should be understood that the embodiments described herein should be considered only in a descriptive sense and not for the purpose of limitation. The description of features or aspects within an embodiment should generally be considered available for other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the figures, those of ordinary skill in the art will understand that various changes in form and detail can be made therein without departing from the spirit and scope as defined by the appended claims.

Claims

1. A display device, comprising: A pixel circuit layer; A polarization layer disposed on the pixel circuit layer; An optical functional layer disposed on the polarization layer; And A reference pattern aligned with an edge of the optical functional layer.

2. The display device according to claim 1, further comprising: A substrate, Wherein, the pixel circuit layer is disposed on the substrate, and the reference pattern is printed on an upper surface of the optical functional layer.

3. The display device according to claim 2, further comprising: A protective film layer disposed on the optical functional layer and the reference pattern.

4. The display device according to claim 1, further comprising: A protective film layer disposed on the optical functional layer, Wherein, the reference pattern is printed on a lower surface of the protective film layer.

5. The display device according to claim 1, further comprising: A protective film layer disposed on the optical functional layer, Wherein, the reference pattern is printed on an upper surface of the protective film layer.

6. The display device according to claim 1, wherein, The optical functional layer includes: A first adhesive layer disposed on the polarization layer; A light control layer disposed on the first adhesive layer; and A cover layer disposed on the light control layer.

7. The display device according to claim 6, wherein, The reference pattern is printed on an upper surface of the cover layer.

8. The display device according to claim 1, wherein, In a plan view, the reference pattern has a width of 10 micrometers to 150 micrometers.

9. The display device according to claim 1, further comprising: A window layer disposed on the optical functional layer; And A light-blocking material layer disposed on the window layer that overlaps the reference pattern in a plan view.

10. The display device according to claim 9, wherein, The light-blocking material layer is disposed on a lower surface of the window layer.

11. A visual inspection system, comprising: A sensing device configured to generate image data regarding an upper surface of a display panel, the display panel including a polarization layer, an optical functional layer disposed on the polarization layer, and a reference pattern aligned with an edge of the optical functional layer; And A computing device configured to receive the image data, identify the reference pattern from the image data, and obtain information regarding an alignment state of the optical functional layer based on the reference pattern.

12. The visual inspection system according to claim 11, wherein, The information regarding the alignment state is information corresponding to one of the following cases: a case where an edge of the optical functional layer protrudes outside an edge of the polarization layer in the image data, a case where the edge of the optical functional layer is disposed inside the edge of the polarization layer in the image data, and a case where the edge of the optical functional layer coincides with the edge of the polarization layer in the image data.

13. The visual inspection system according to claim 12, wherein, The computing device is configured to cause the display panel to proceed to a further process in a case of obtaining the information regarding the alignment state of the optical functional layer indicating that the edge of the optical functional layer coincides with the edge of the polarization layer in the image data.

14. The visual inspection system according to claim 12, wherein, The computing device is configured to cause the display panel to proceed with one of calibration processing and recycling in the case of obtaining the information regarding the alignment state of the optical functional layer indicating that an edge of the optical functional layer protrudes outside an edge of the polarizing layer or the edge of the optical functional layer is disposed inside the edge of the polarizing layer in the image data.

15. A display device, comprising: a substrate; a pixel circuit layer disposed on the substrate; a polarizing layer disposed on the pixel circuit layer; an optical functional layer disposed on the polarizing layer; and a reference pattern printed on an upper surface of the optical functional layer at an edge of the optical functional layer.

16. The display device according to claim 15, further comprising: a protective film disposed on the optical functional layer and the reference pattern.

17. The display device according to claim 15, wherein, The optical functional layer includes: an adhesive layer disposed on the polarizing layer; a light control layer disposed on the adhesive layer; and a cover layer disposed on the light control layer.

18. The display device according to claim 15, wherein, In a plan view, the reference pattern has a width of 10 micrometers to 150 micrometers.

19. The display device according to claim 15, further comprising: a first adhesive layer disposed on the optical functional layer; a window layer disposed on the first adhesive layer; and a light-blocking material layer disposed on a surface of the window layer overlapping the reference pattern in a plan view.

20. The display device according to claim 19, wherein, The light-blocking material layer is disposed on a lower surface of the window layer.

Citation Information

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