Portable modular data center system and method of use

Abstract

Modular portable data center systems and methods of use are discussed herein. A modular portable data center system has: a portable housing formed from panels that cooperate to form an enclosure; an air inlet defined within an inlet panel in the panel; an air outlet defined within an outlet panel of the panels; an inner frame within the portable housing, the inner frame defining a cooling air passage comprising: a labyrinth inlet duct leading to the air inlet; a processor mounting region connected to the labyrinth inlet conduit; and a labyrinth outlet duct leading to the processor mounting area and the air outlet. The method includes operating a processor located in a portable housing of the system to process blockchain transactions while a cooling fan moves cooling air sequentially: through a labyrinth inlet duct defined within the portable housing; a crossing processor; the labyrinth type outlet pipeline is defined in the portable shell; therefore, the plurality of processors are kept in respective working temperature ranges.

Description

TECHNICAL FIELD

[0001] This document relates to a portable modular data center system and a method of use thereof. BACKGROUND OF THE INVENTION

[0002] Known portable enclosures (such as modified intermodal container units) are used to house multiple currency transaction processors that are connected via the Internet to authenticate currency transactions. It is required to allow the processors to operate outdoors with limited sound and noise, and also to suppress fires. SUMMARY OF THE INVENTION

[0003] The present invention discloses a system that includes a portable modular data center system and a power source that is connected to supply power to the portable modular data center system.

[0004] The present invention discloses a modular data center system, comprising: a portable housing formed by panels that mate to form an enclosure; an air inlet defined within an inlet panel of the panels; an air outlet defined within an outlet panel of the panels; an internal frame located within the portable housing, the internal frame defining a cooling air passage that includes: a labyrinthine inlet duct leading to the air inlet; a processor mounting area connected to the labyrinthine inlet duct; and a labyrinthine outlet duct connected to the processor mounting area and the air outlet.

[0005] The present invention discloses a method that includes: operating processors located within the portable housing of the modular data center system to authenticate currency transactions while a cooling fan moves cooling air sequentially: through the labyrinthine inlet duct defined within the portable housing; across the processors; and through the labyrinthine outlet duct defined within the portable housing; so as to maintain the multiple processors within their respective operating temperature ranges.

[0006] In various embodiments, one or more of the following features may be included: An air mover is connected to direct air through a cooling air passage from an air inlet to an air outlet. A processor mounting area is raised above the base to a position adjacent to a top plate in the panel. The panel defines or forms a processor access door that is configured to provide access to the processor mounting area. The top plate in the panel forms the processor access door and is pivotally connected to a side wall in the panel. The side wall in the panel forms the processor access door. The processor access door includes a peripheral weatherstrip. The air inlet is defined within an inlet side wall in the panel. The air outlet is defined within an outlet side wall in the panel. The air inlet and the air outlet are provided adjacent to a base end of the inlet side wall and a base end of the outlet side wall, respectively. The inlet side wall and the outlet side wall are opposite each other. An internal frame includes a partition wall that separates a labyrinthine inlet duct and a labyrinthine outlet duct. The partition wall at least partially divides the enclosure into two. The processor mounting area includes a shelf supported by the partition wall above the partition wall. An adjustable air recirculation valve is connected to allow a controlled range of air to bypass from the labyrinthine outlet duct back to the labyrinthine inlet duct. The adjustable air recirculation valve includes a sliding door mounted on a recirculation port. The labyrinthine inlet duct includes one or more inlet duct portions connected in series between the air inlet and the processor mounting area, wherein each downstream inlet duct portion in the one or more inlet duct portions is oriented to define a downstream inlet duct portion axis that is ninety degrees or more from an upstream inlet duct portion axis of an adjacent upstream inlet duct portion in the one or more inlet duct portions. The one or more inlet duct portions include: a first inlet duct portion connected to the air inlet; a second inlet duct portion connected to the first inlet duct portion and defining a second inlet duct portion axis that is ninety degrees or more from the first inlet duct portion axis of the first inlet duct portion; a third inlet duct portion connected to the second inlet duct portion and defining a third inlet duct portion axis that is ninety degrees or more from the second inlet duct portion axis; and a fourth inlet duct portion connected to the third inlet duct portion and the processor mounting area and defining a fourth inlet duct portion axis that is ninety degrees or more from the third inlet duct portion axis. The downstream inlet duct portion axis and the upstream inlet duct portion axis are defined in a common plane. Each downstream inlet duct portion has a respective diverter wall configured to change the air flow direction from an adjacent upstream inlet duct portion by at least ninety degrees and block all lines of sight from the adjacent upstream inlet duct portion into the downstream inlet duct portion.The labyrinthine outlet duct includes one or more outlet duct portions connected in series between the processor mounting area and the air outlet, wherein each downstream outlet duct portion among the one or more outlet duct portions is oriented to define a downstream outlet duct portion axis that is at an angle of ninety degrees or greater with respect to the upstream outlet duct portion axis of an adjacent upstream outlet duct portion among the one or more outlet duct portions. The one or more outlet duct portions include: a first outlet duct portion connected to the processor mounting area; a second outlet duct portion connected to the first outlet duct portion and defining a second outlet duct portion axis that is at an angle of ninety degrees or greater with respect to the first outlet duct portion axis of the first outlet duct portion; a third outlet duct portion connected to the second outlet duct portion and defining a third outlet duct portion axis that is at an angle of ninety degrees or greater with respect to the second outlet duct portion axis; and a fourth outlet duct portion connected to the third outlet duct portion and the air outlet and defining a fourth outlet duct portion axis that is at an angle of ninety degrees or greater with respect to the third outlet duct portion axis. The downstream outlet duct portion axis and the upstream outlet duct portion axis are defined in a common plane. Each downstream outlet duct portion has a respective flow dividing wall configured to change the air flow direction from an adjacent upstream outlet duct portion by at least ninety degrees and to block all lines of sight from the adjacent upstream outlet duct portion into the downstream outlet duct portion. A pressure barrier is oriented across the cooling air channel within the processor mounting area, and the pressure barrier defines a discharge port configured to be mounted to the discharge end of the body of the processor. An internal frame defines a central symmetry plane between the air inlet and the air outlet. One or more of the panels include sound insulation. An inlet filter is located above the air inlet; and an outlet filter is located above the air outlet. The width of the portable enclosure is ninety-six inches or greater. In some cases, the width of the portable enclosure is less than ninety-six inches, such as sixteen inches or greater, but other dimensions greater than or less than ninety-six inches may be used. The enclosure is a weatherproof housing. One processor is mounted within the processor mounting area. Multiple processors are mounted within the processor mounting area. The multiple processors are mounted parallel along a lateral mounting axis that is transverse to the air flow axis, which is defined to span the processors within the processor area. Each processor includes one or more of the following: a body; a processor board mounted on the body and containing one or more application specific integrated circuit chips; a controller; a power connector; a network connector; and one or more fans connected to direct air through a cooling air channel across the processor to maintain the processor within its respective operating temperature range. The one or more fans include one or more of the following: an inlet fan located at the inlet end of the body; and a discharge fan located at the discharge end of the body.Operate the processor of the modular processor system to verify a transaction. A cooling fan moves cooling air into a labyrinthine inlet duct through an inlet defined within an inlet in a portable housing. The cooling air is recirculated from the labyrinthine outlet duct back to the labyrinthine inlet duct through an adjustable air recirculation valve. The cooling fan moves the cooling air through the labyrinthine outlet duct to an air outlet defined within an outlet in the portable housing. The processor has a network interface; the network interface is connected to receive data from and transmit data to a network via the Internet; the processor is connected to the network interface and is adapted to communicate with a database. The network is a peer-to-peer network; the database is a distributed database stored on multiple nodes in the peer-to-peer network; and the database stores transaction information of currency. Operate the modular processor system to: verify a transaction using the modular processor system, such as by verifying the latest data on the database using the modular processor system; and communicate wirelessly via the Internet to communicate with the database. The network interface includes one or more satellite, cellular, or radio antennas connected to a modem. The system operates on a polyphase (three-phase) power supply or a single-phase power supply. The height dimension of the portable housing is less than four feet. The portable housing forms ground-engaging skids. Two or more portable modular processor modules are secured together to form a wall of portable modular processor modules. These modules can be located anywhere, such as inside or outside a building. Two or more portable modular processor modules are stacked vertically one above the other to form a vertical stack, thereby supporting each other by gravity and / or secured together using their respective module mounting mechanisms. Two or more portable modular processor modules are arranged in a horizontal row and are not secured or are secured together using their respective module mounting mechanisms. The portable modular processor modules are aligned such that an air inlet is located on a first side of the wall and an air outlet is located on a second side of the wall. The portable modular processor modules are connected to receive power from a central power supply. Prior to operation, a plurality of portable modular processor modules are stacked vertically by securing the base of a first portable modular processor module to the top of a second portable modular processor module. The wall has a horizontal row formed by two or more portable modular processor modules, where the side wall of one portable modular processor module is secured to the side wall of another portable modular processor module.

[0007] These and other aspects of the apparatus and method are set forth in the claims, which are incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Embodiments will now be described with reference to the drawings, where, by way of example, like reference numerals indicate like elements, and where: Figure 1 is a perspective view of a portable modular data center system with the top cover open.Figure 1A is Figure 1 A side sectional view of a portable modular data center system, where soundproof panels are arranged around the inner surface of the inner frame. Figure 2 is Figure 1 A perspective view of an ASIC processor unit in the system of , which is configured for a modular processor and connected to a pressure barrier. Figure 3 is Figure 1 A perspective sectional view of a portable modular processor system of , where the side wall is removed, the lid is opened, and one of the two ASIC units is removed. Figure 4 is Figure 1 A perspective sectional view of a portable modular processor system of , where the side wall is removed to view the internal flow dividing wall (baffle) and the air circulation path. Figure 5 is a perspective view of a series of portable modular processor systems, including the portable modular processor system of on the right Figure 1 The widths of these systems and the number of ASIC processor units contained therein are different from each other to indicate Figure 1 how the system of scales up or down in terms of processing power. Figure 6 is Figure 4 A side sectional view of a portable modular processor system of . Figure 7 is a side sectional view of a portable modular processor system, where the side wall is removed and the air recirculation valve is fully closed. Figure 8 is Figure 7 A side sectional view of a portable modular processor system of , where the air recirculation valve is fully open, and the partially open position is shown by a dashed line. Figure 9 is Figure 7 A perspective view of a portable modular processor system of (the air recirculation valve is fully closed). Figure 10 is Figure 8 A perspective view of a portable modular processor system of (the air recirculation valve is fully open). Figure 11 is a perspective view of a plurality of Figure 1 portable modular processor systems arranged in a horizontal row. Figure 12 is a perspective view of a plurality of Figure 1 portable modular processor systems in arranged and stacked in a vertical row. Figure 13 is a perspective view of a plurality of Figure 1 portable modular processor systems in arranged in a horizontal row formed by two vertically stacked rows. Detailed Description

[0009] Without departing from what is covered by the claims, non-substantial modifications can be made to the embodiments described herein.

[0010] Blockchain is a form of database that can be saved as a distributed ledger in a network of nodes that maintain a continuously growing list of records called blocks. Each block contains a timestamp and a link to the previous block. Data in a block cannot be retroactively changed without a significant amount of computational work and majority consensus of the network. By using a peer-to-peer network and distributed timestamp servers, the blockchain database is managed autonomously. Blockchain technology has use cases for maintaining accurate, tamper-proof databases. Examples include maintaining land deeds and records of historical events.

[0011] By design, blockchain is inherently resistant to data modification (and is assumed to be effectively impermeable) - once recorded, data in a block cannot be retroactively changed without network consensus. Blockchain is an open distributed ledger that can effectively record transactions between two parties in a verifiable and permanent way. The ledger itself can also be programmed to automatically trigger transactions. Blockchain is secure by design and is an example of a distributed computing system with high Byzantine fault tolerance. Thus, blockchain can be used to achieve decentralized consensus. This makes the blockchain model suitable for recording events, medical records, and other record management activities, identity management, transaction processing, and proving provenance. This offers the potential for large-scale disintermediation and has a huge impact on how global trade is conducted.

[0012] Blockchain helps with secure online transactions. Blockchain is a decentralized digital ledger that records transactions in such a way on thousands of computers globally that registered transactions cannot be retroactively changed. This allows participants to verify and audit transactions in an inexpensive way. Transactions are authenticated through large-scale collaboration driven by the collective self-interest. The result is a robust workflow where the uncertainty of participants about data security is negligible. Blockchain is described as a value exchange protocol. This value exchange can be done faster, more securely, and more cheaply using blockchain. Blockchain can assign ownership as it provides a record of offer and acceptance. From a technical perspective, blockchain is a hash chain within another hash chain.

[0013] A blockchain database can include two types of records: transactions and blocks. Blocks can hold batches of valid transactions that are hashed and encoded into a Merkle tree. Each block can include the hash value of the previous block in the blockchain, thus linking the two. Variants of this format have been used before in, for example, Git, and they may not be sufficient on their own to be a blockchain. Linked blocks form a chain. This iterative process confirms the integrity of the previous block, all the way back to the original genesis block. Some blockchains create a new block every five seconds or less. As blockchains age, they are said to increase in height. Blocks are built by dividing them into layers.

[0014] Sometimes, individual blocks may be verified simultaneously, creating temporary forks. In addition to the history based on secure hashes, each blockchain has a specific algorithm to score different versions of the history, enabling the selection of one with a higher value than others. Blocks not selected to be included in the chain are called orphan blocks. Peer devices supporting the database do not always have exactly the same version of the history, but they retain the version of the database with the highest score they currently know. Whenever a peer device receives a version with a higher score (usually an older version with a single new block added), they extend or rewrite their own database and resend the improvement to their peers. There is never an absolute guarantee to ensure that any specific entry will always remain in the best version of the history, but since blockchains are typically created to add the score of new blocks to old blocks and there is an incentive to only be busy extending with new blocks rather than rewriting old blocks, as more blocks are built on top, the likelihood of an entry being replaced decreases exponentially and eventually becomes very low. For example, in a blockchain using a proof-of-work system, the chain with the most cumulative proof-of-work is always considered valid by the network. In practice, there are many ways to demonstrate a sufficient level of computation. Within a blockchain, the computation is performed redundantly rather than in a traditional separate and parallel manner.

[0015] Maintaining a blockchain database refers to a distributed computing audit process performed on each data block in the blockchain. This allows for consensus to be reached in an environment where no party knows or trusts each other.

[0016] Refer to Figure 1 、 Figure 3 、 Figure 4 and Figure 6, shows a modular processor system 10. The system 10 includes a portable housing 12, an air inlet 16, an air outlet 18, and an internal frame 19. The portable housing 12 can be formed by panels, such as walls 12A to 12C, a base 12E, and a top plate 12D. The panels can be connected together by suitable mechanisms, such as welding or fasteners, or formed integrally, in part or in whole, to form the housing 12. The panels can cooperate to form an enclosure 12I, such as a weatherproof enclosure as shown, which defines an interior 12F that houses internal components, such as a processor 80 (discussed later). The air inlet 16 can be defined within an inlet panel of the panels, such as within the front side wall 12A. The air outlet 18 can be defined within an outlet panel of the panels, such as within the rear side wall 12B. The side walls 12A and 12B can be opposite each other, such as defined as opposite side walls as shown. The internal frame 19 can be provided, for example, connected or formed integrally, in part or in whole, within the portable housing 12. The internal frame 19 can define a cooling air channel 21. The channel 21 can include a labyrinth inlet duct 20, such as which extends to the air inlet 16. The channel 21 can extend to and include a processor mounting area 43, such as the processor mounting area 43 is connected to the labyrinth inlet duct 20. The channel 21 can include a labyrinth outlet duct 33, such as which is connected to the ASIC processor mounting area 43 and the air outlet 18. One or more processors 80 can be mounted within the processor mounting area 43. In use, the processor 80 can be operated to process transactions, such as in a distributed ledger system. The housing 12 can provide a protective enclosure for one or more processors, such as ASICs. A system 10 that is ergonomic and practical can be provided for deploying ASICs in various locations, such as on-site, near a building, or at home. One or more air movers, such as fans, can be provided, for example, as part of the processor 80 and / or the housing 12, and can be connected to direct air through the cooling air channel 21 from the air inlet 16 to the air outlet 18.

[0017] Referring to Figure 2, the processor 80 may include an application specific integrated circuit (ASIC) chip. An ASIC can be an integrated circuit (IC) chip customized for a specific purpose rather than for general purpose. For example, a chip designed to operate in a digital recorder or a high-efficiency processor is an ASIC. An application specific standard product (ASSP) chip can be an intermediate product between an ASIC and an industry standard integrated circuit (such as the 7400 series or 4000 series). ASIC chips are typically manufactured using metal oxide semiconductor (MOS) technology, i.e., MOS integrated circuit chips. As feature sizes have shrunk and design tools have improved year by year, the maximum possible complexity (and functionality) in an ASIC has increased from 5,000 logic gates to over 100 million. Modern ASICs typically include an entire microprocessor, memory blocks (including ROM, RAM, EEPROM, flash memory, and other large building blocks). Such an ASIC is often referred to as a system-on-chip (SoC). Designers of digital ASICs typically use a hardware description language (HDL) (such as Verilog or VHDL) to describe the functionality of the ASIC. A field programmable gate array (FPGA) is a modern technology for building breadboards or prototypes using standard components; programmable logic blocks and programmable interconnects allow the same FPGA to be used for many different applications. For smaller designs or lower production volumes, FPGAs may be more cost-effective than ASIC designs, even in production. The non-recurring engineering (NRE) costs of an ASIC can be as high as millions of dollars. Therefore, device manufacturers generally prefer to use FPGAs for prototyping and devices with lower production volumes, while using ASICs for very large production volumes where the NRE costs can be amortized over many devices. One or more ASIC chips may be included on each processor 80, such as in a single or multiple arrays or groups located in one or more hash boards 92.

[0018] Referring to Figure 2 , each processor 80 may have suitable characteristics. The example shown depicts an S9i TM jointly manufactured and sold by BITMAIN TM in conjunction with the ANTMINER TM brand. The processor 80 may include one or more controllers 83. The control board (controller 83) of the Antminer TM S9i TM uses a fast Dual TM microprocessor with CoreSight . The control board of the S9i may use a microprocessor with Dual Series FPGAs. The processor 80 may include a network connector 90 (for an Ethernet cable), such as a network connector supporting Gigabit Ethernet, to ensure immediate data submission. Each processor board 92 may be mounted on the body 82 of the processor 80 and house one or more application-specific integrated circuit chips. Each Antminer TM S9i TM employs multiple ASICs, such as 189 such chips. The processor 80 may include a suitable body 82 on which the components are mounted. In the example shown, the body 82 is a high-grade aluminum housing.

[0019] Referring Figure 2 , the processor 80 may include one or more cooling mechanisms. The body 82 may include one or more heat sinks. One or more fans may be connected to direct air through the cooling air channels 21 and across the ASIC processor 80 to keep the ASIC processor 80 within its respective operating temperature range during use. One or more temperature sensors (not shown) may be used to monitor the temperature and adjust the fans and / or the computing operations. The fans may include an intake fan 84 located at the intake end of the body 82. The fans may include an exhaust fan 86 located at the exhaust end of the body 82. By using two computer-controlled high-speed fans 84 and 86 at both ends of the tubular body 82, the hot air is quickly replaced by cold air at the desired speed. By using two computer-controlled fans to keep the processor 80 cooled, the processor 80 remains efficient and powerful. The processor 80 may use a combination of conduction and convection cooling to optimize the performance of the processor 80 without getting hotter. In some cases, each chip of the processor 80 may be equipped with a customized heat sink, such as a heat sink made of high-grade aluminum alloy.

[0020] Referring Figure 2 , the processor 80 may include other components to operate the processor 80 in a proper manner. The processor 80 may include a power connector, such as a circuit housing for connection to a suitable power source (such as an A / C wall socket line). Power may be supplied to the PCIe (Peripheral Component Interconnect Express) port on the hash board at the top of the unit or another suitable location. One or more power distribution units, such as power boards, may be used. One or more power converters may be used to convert the input power into a usable form, such as having one or more inverters, transformers, or other suitable mechanisms. The processor 80 may interact with an online control application software. There may be a mechanism for periodically updating the firmware of the controller.

[0021] Referring Figure 1, the portable housing 12 may have a suitable access door. A panel (such as the top panel 12D) may define or form a processor access door that is configured to provide access to the ASIC processor mounting area 43. In the example, the top panel 12D forms a lid that is pivotally connected, for example by a suitable hinge (not shown), to the side walls 12A, 12B, or 12C in the panel. The processor access door (such as the top panel 12D) may include a peripheral weatherstrip 13, such as a peripheral lip seal or rubber, silicone, or other suitable flexible material. One or more locks (such as a latch 98 that is connected to a catch 96 in use) may be provided to secure the top panel 12D in the closed position, for example for safety during use. The locking system may provide a compression seal by applying a closing pressure that squeezes and seals any weatherstrip 13 or other door seals present, for example to keep weather such as moisture out and prevent undesirable convective movement through the door seals. The side wall in the panel (such as wall 12C) may form a processor access door in some cases, such as door 15 as shown. Suitable doors may be one or more of pivotally connected, slidable, or removable. The door (such as the top panel 12D) and / or the edge around which the door seals (such as provided by the top edges of walls 12A to 12C (front wall 12A, rear wall 12B, and side wall 12C)) may each include a peripheral skirt or edge to facilitate weatherproofing of the housing 12 when the door is closed. Due to the top cover or side swing door channels, the ASIC can be easily installed / dismantled. The lid and door may include suitable hardware, such as hinges for the lid, spring compression catches for keeping the lid tightly closed, locks and handles for the lid.

[0022] Referring Figure 6 , the ASIC processor 80 and the inlet 16 / outlet 18 may be located at suitable positions on or within the housing 12, respectively. The ASIC processor mounting area 43 may be elevated, for example elevated above the base 12E, for example further elevated to a position adjacent to the top panel 12D in the panel. In the example shown, the processor 80 is mounted in the area 43 at the top forty percent of the height of the housing 12. One or more of the air inlet 16 and the air outlet 18 may be arranged to be adjacent to the base end of the inlet side wall 12A and the base end of the outlet side wall 12B, respectively. In the example shown, the processor 80 is mounted above the inlet 16 and the outlet 18. Positioning the ASIC processor 80 above the air inlet / discharge port and above any local low points where any liquid ingress or flooding may occur and allowing drainage can serve to protect the ASIC from contact with such liquids, thereby allowing drainage before such liquids reach the ASIC. The inner base surface of the inner frame 19 may be inclined or otherwise configured to facilitate drainage from the housing 12.

[0023] ReferringFigure 3 , Figure 4 and Figure 6 , the inner frame 19 and the outer shell 12 may have suitable geometric shapes and structures. The inner frame 19 may include a partition wall 24B that separates the labyrinth inlet duct 20 and the labyrinth outlet duct 33. The partition wall 24B may directly or indirectly lift and support the ASIC processor 80. For example, the ASIC processor mounting area 43 may include a shelf 44 supported above the partition wall 24B by the partition wall 24B, and the partition wall 24B may act as a column. The inner frame of the outer shell 12 may be constructed and oriented to achieve flexibility in use and configuration. For example, the inner frame 19 may be oriented to allow the air flow through the channel 21 to reverse, such as in the case where the inlet 16 and the outlet 18 become the outlet and the inlet respectively, and the processor 80 is mounted in reverse relative to that shown in the figure. The partition wall 24B may at least partially divide the shroud 12I into two, such as shown by dividing the base portion of the outer shell 12 into two. The main support wall (partition wall 24B) may be disposed in the middle of the cross-sectional shape as shown and serve as a separator between the low-pressure cold inlet and the high-pressure hot outlet. The inner frame 19 may define a central symmetry plane between the air inlet 16 and the air outlet 18. The axial lengths of the two ducts 20 and 33 may be similar or the same. The symmetric air flow path means that the inlets / outlets may be located on either side of the system 10. The construction may be relatively simple, modular, low-cost and repeatable.

[0024] Referring Figures 7 to 10 , the system 10 may be configured to allow the controlled recirculation of heated exhaust gas into the channel 21 upstream of the ASIC processor area 43. An adjustable air recirculation valve 47 may be provided. The valve 47 may be connected to allow a controlled range of cooling air to bypass from the labyrinth outlet duct 33 back to the labyrinth inlet duct 20, such as along the direction arrow 94. The adjustable air recirculation valve 47 may include a sliding door, such as having a panel 48 or other blocking member, mounted on the recirculation port 46. The valve 47 may be adjusted manually or automatically. In the example shown, the valve 47 has a handle 48A, which operates in a manner similar to a heat register in a building, where the user or controller adjusts the allowed recirculation amount (ranging from zero percent to one hundred percent) by moving the panel 48 between the closed position ( Figure 7 and Figure 9 ) and the open position ( Figure 8 and Figure 10 ). In Figure 8In the figure, the middle position is shown by a dashed line to demonstrate how a series of positions can be used. The automated system can include a controller (not shown) and an actuator (not shown) for adjusting the position of valve 47 to achieve the desired temperature range of processor 80 during operation. Valve 47 can be adjusted in response to the ambient temperature outside housing 12, for example, by one or more thermostats (not shown) or other temperature sensors. Refer to Figure 10 , a filter, such as grille 50, can be provided above port 46. The heat recirculation air conditioner / slider can allow the user to return heat to the inlet in cold weather to melt any accumulated incoming snow and preheat the air entering the ASIC to prevent the temperature of the ASIC from falling out of the appropriate operating temperature range.

[0025] Refer to Figure 4 and Figure 6 , the labyrinthine inlet duct 20 and the labyrinthine outlet duct 33 can be defined by the internal frame of housing 12. The labyrinthine ducts can provide tortuous passages with varying directions, thus forming a spiral, winding, and / or serpentine route or path for air to travel through in its route to and from the ASIC processor mounting area 43. The labyrinthine flow path can serve to attenuate the noise from processor 80 and allow any moisture (such as rain or snow) to drop out before reaching the ASIC processor 80.

[0026] Refer to Figure 4 and Figure 6, the labyrinthine inlet duct 20 may include one or more inlet duct portions serially connected between the air inlet 16 and the ASIC processor mounting area 43. In the example shown, the inlet duct portions include a first inlet duct portion 22, a second inlet duct portion 24, a third inlet duct portion 26, and a fourth inlet duct portion 28 in series, each inlet duct portion defining its own axis 22A, 24A, 26A, and 28A of the air flow through the passage 21, respectively. Each downstream inlet duct portion in the one or more inlet duct portions may be oriented to define a downstream inlet duct portion axis that is ninety degrees or more with respect to the upstream inlet duct portion axis of the adjacent upstream inlet duct portion in the one or more inlet duct portions. Thus, for example, the inlet duct portion 24 is downstream of the inlet duct portion 22 and is angled with respect to the inlet duct portion 22, while the inlet duct portion 22 is upstream of the inlet duct portion 24, and the axis 24A of the inlet duct portion 24 is at a 90-degree angle with respect to the axis 22A of the inlet duct portion 22. Similarly, the axis 26A is at a 90-degree angle with respect to the axis 24A, and the axis 28A is at a 90-degree angle with respect to the axis 26A. The ASIC processor mounting area 43 may define an inlet duct portion 30, the axis 30A of which is ninety degrees or more with respect to the axis 28A of the duct portion 28. The structure shown provides an S-shaped tortuous duct from the air inlet 16 to the ASIC processor 80, thereby providing multiple levels of sound attenuation without significantly losing air pressure or increasing the power requirements of the air mover. In some cases, an angle less than 90 degrees may be used between adjacent duct portions. The downstream inlet duct portion axis and the upstream inlet duct portion axis, such as each of the axes 22A, 24A, 26A, and 28A (and in some cases the axis 30A), may be defined in a common plane as shown, but other configurations located out of the plane may also be used.

[0027] Referring to Figure 4 and Figure 6, each downstream inlet duct section may have its own diverter wall configured to change the air flow direction from an adjacent upstream inlet duct section by at least 90 degrees. The diverter walls, such as walls 24B, 26B, 28B (and in some cases wall 30B of inlet duct section 30), can be used to block all lines of sight from an adjacent upstream inlet duct section into the downstream inlet duct section. Each diverter wall may form the terminus of the corresponding upstream inlet duct section, thereby diverting the flow, suppressing noise in the process, and helping to separate the condensing fluid from the cooling air. There may be one or more baffle walls, such as baffle wall 22B of duct section 22. The air flow may travel through inlet 16 in the direction of arrow 56 to the ASIC processor mounting area 43 and enter duct section 22 along arrow 58. Diverter wall 24B may redirect the air flow into duct section 24 along arrow 60. Diverter wall 26B may redirect the air flow into duct section 26 along arrow 62. Diverter wall 28B may redirect the air flow into duct section 28 along arrow 64. Diverter wall 30B may redirect the air flow into duct section 30 along arrow 66. Thus, the air flow enters the body 82 through the fan 84, exchanges and absorbs heat with the processor 80 in the process, and exits the body 82 through the discharge fan 86.

[0028] Reference Figure 4 and Figure 6, the labyrinth exit duct 20 may include one or more exit duct portions connected in series between the ASIC processor mounting area 43 and the air outlet 18. In the example shown, the exit duct portions include a first exit duct portion 36, a second exit duct portion 38, a third exit duct portion 40, and a fourth exit duct portion 42 connected in series, each exit duct portion defining its own axis 36A, 38A, 40A, and 42A of the air flow through the passage 21, respectively. Each downstream exit duct portion in the one or more exit duct portions may be oriented to define a downstream exit duct portion axis that is ninety degrees or greater with respect to the upstream exit duct portion axis of the adjacent upstream exit duct portion in the one or more exit duct portions. Thus, for example, the exit duct portion 38 is located downstream of the exit duct portion 36 and is angled with respect to the exit duct portion 36, the exit duct portion 36 is located upstream of the exit duct portion 38, and the axis 38A of the exit duct portion 38 is at a 90-degree angle with respect to the axis 36A of the exit duct portion 36. Similarly, the axis 40A is at a 90-degree angle with respect to the axis 38A, and the axis 42A is at a 90-degree angle with respect to the axis 40A. The ASIC processor mounting area 43 may define a discharge duct portion 34 whose axis 34A is ninety degrees or greater with respect to the axis 36A of the duct portion 36. The structure shown provides an S-shaped tortuous duct from the ASIC processor 80 to the air outlet 18, thereby providing multiple stages of sound attenuation without significant loss of air pressure or increased power requirements of the air mover. In some cases, an angle less than 90 degrees may be used between adjacent duct portions. The downstream exit duct portion axis and the upstream exit duct portion axis, such as each of the axes 36A, 38A, 40A, 42A (and in some cases the axis 34A), may be defined in a common plane as shown, but other configurations located out of the plane may also be used.

[0029] Referring to Figure 4 and Figure 6, each downstream outlet duct section may have a respective diverter wall configured to change the air flow direction from an adjacent upstream outlet duct section by at least 90 degrees. The diverter walls, such as walls 36B, 38B, 40B, and 42B, can be used to block all lines of sight from an adjacent upstream outlet duct section into the downstream outlet duct section. Each diverter wall may form the terminus of a respective upstream duct section, thereby diverting the flow and suppressing sound in the process. There may be one or more baffle walls, such as baffle wall 42C of duct section 42. The air flow may travel from the ASIC processor mounting area 43 in the direction of arrow 68 through duct section 34 to the diverter wall 36B and enter duct section 36 along arrow 70. The diverter wall 38B may redirect the air flow into duct section 38 along arrow 72. The diverter wall 240B may redirect the air flow into duct section 40 along arrow 74. The diverter wall 42B may redirect the air flow into duct section 42 along arrow 76. Thus, the air flow exits the body 82 through the outlet 18 in the direction of arrow 78 into the surrounding environment and / or recirculates back into duct section 24 through the open port 46.

[0030] Referring Figure 2 and Figure 6 , the ASIC processor mounting area 43 may include a pressure barrier 52. The barrier 52 may be oriented in a suitable manner, such as across the cooling air channel 21 within the ASIC processor mounting area 43. The pressure barrier 52 may define a discharge port 54 configured to be mounted to the discharge end (such as the discharge fan 86) of the body 82 of the ASIC processor 80. The pressure barrier 52 may provide a mounting surface for the processor 80. The pressure barrier 52 may form an interface between the high-pressure duct 33 and the low-pressure duct 21, respectively, so as to prevent unnecessary recirculation between the ducts. The pressure barrier 52 may have a suitable structure, such as a plate as shown.

[0031] Referring Figure 1A, the system 10 may include sound insulation components. In the illustrated example, one or more of the panels may include sound insulation components, such as the sound insulation panel 100. Acoustic panels may be provided on the inner surface or part or all of the inner frame 19. Acoustic panels (also known as sound absorption panels, sound insulation panels or sound panels) may be boards wrapped with sound absorption fabrics, which are designed to control echo and reverberation in a room. Acoustic panels may be constructed in a suitable manner, such as using a wooden frame, filled with sound absorption materials (mineral wool, fiberglass, cellulose, open-cell foam or a combination thereof) and wrapped with fabric. In some cases, acoustic foam may be used. Acoustic foam may include open-cell foam for acoustic treatment. Acoustic foam can attenuate sound waves in the air and reduce the amplitude to achieve the purpose of reducing or controlling noise. Energy is dissipated in the form of heat. Acoustic foam can be made in a variety of different colors, sizes and thicknesses. Acoustic foam can be attached to the walls, ceilings, doors, floors and other components of the portable housing 12 to control the noise level, vibration and echo. In some cases, the housing 12 structure is made of, for example, steel with an inner polyurethane foam panel coating to inhibit the outward penetration of sound waves to the outside 12G of the housing 12.

[0032] In some cases, part or all of the housing 12 and / or the inner frame 19 may be treated to provide fireproof or flame-retardant properties. Flame-retardant acoustic foam products can be used. The term "flame retardant" includes different groups of chemical substances added to manufacturing materials (such as plastics and textiles) as well as surface finishes and coatings. Flame retardants can be activated by the presence of an ignition source and are designed to prevent or slow down the further development of ignition through various different physical and chemical methods. These can be added as copolymers during the polymerization process, or subsequently added to polymers during the molding or extrusion process, or (especially for textiles) applied as a topical finish. Mineral flame retardants are usually additive, while organic halogen and organic phosphorus compounds can be reactive or additive. Expanding materials or other materials can be used. Fireproofing can be used to enable high-power energized ASICs to operate safely inside or outside the home, as it is well known that these ASICs sometimes catch fire in poorly ventilated environments. This will also make it safer to operate near combustible materials (such as wood or plastic, which are commonly present in homes and buildings).

[0033] Referring to Figure 6, system 10 may include one or more air filters. The air inlet 16 may include an inlet filter 16A, for example, above the air inlet 16. The air outlet 18 may include an outlet filter 18A. A screen may be used as the filter. In some cases, a high-efficiency particulate air (HEPA) filter or other suitable filter may be used. HEPA is a pleated mechanical air filter. This type of air filter can theoretically remove at least 99.97% of dust, pollen, mold, bacteria, and any airborne particles with a size of 0.3 micrometers (μm). The screen or other filter can prevent the entry of external wind and rain, as well as animals, insects, plants, and fungi.

[0034] Referring to Figure 1 , Figure 3 , Figure 4 and Figure 6 , the housing 12 and the system 10 may form a weatherproof enclosure 12I. Weatherproof may refer to the ability of the system 10 to withstand exposure to wind and rain in an unprotected outdoor environment without damage or loss of function. Each aspect may contribute to the weatherproof system. The use of a hinged cover or other access door (top plate 12D) may be helpful, and this access door is sealed against wind and rain using weatherstripping and compression clips. The use of the labyrinthine ducts 20 and 33 may provide a serpentine air flow path with direction changes, which helps to discharge liquids and airborne particles that might otherwise enter the inlet of the processor 80 harmfully. Providing the ASICs elevated above the inlet / discharge ports allows for drainage before the liquid reaches the ASICs in the event of any liquid ingress or flooding. The heat recirculation air regulator / slider may allow the user to return heat to the inlet in cold weather to melt any accumulated snow that has entered and preheat the air entering the ASICs.

[0035] Referring to Figure 5 , the system 10 may provide a compact enclosure that can be scaled in a convenient manner during the manufacturing process. In the example shown, the system 10 can be scaled to multiple power levels (multiple ASICs) and heat dissipation by simply extending the width of the housing (measured, for example, along the Z-axis 102 between the side walls 12C of the housing in this example). The width of the portable housing 12 can be selected as needed, such as 20 inches (the rightmost housing 12), 28 inches (the middle housing 12), or 96 inches (the leftmost housing), or smaller or larger widths. In the example shown, the housing 12 can be scaled completely linearly along the Z-axis 102 to scale for more power. As shown, multiple ASIC processors 80 can be installed within the ASIC processor mounting area 43 of each housing 12, and the wider housing 12 provides more space for additional processors 80. Referring to Figure 6, as shown in the figure, multiple ASIC processors 80 can be mounted in parallel along a lateral mounting axis (such as axis 102), which is transverse to the air flow axis (such as axes 30A and 34A), and the air flow axis is defined as spanning the ASIC processors 80 within the ASIC processor mounting area 43. The scalability on the Z-axis 102 gives the housing 12 an extruded shape, that is, the appearance of a unit formed by an extrusion process.

[0036] Referring to Figures 11 to 13 , various configurations of a vertical and / or horizontal stacked arrangement of the housing 12 are shown. See Figure 12 and 13 , two or more portable ASIC housings 12 can be stacked one on top of the other to form a vertical stack. The stacked housings 12 can be fixed together using their respective module mounting mechanisms, or can be placed one on top of the other without any fixing mechanism. Referring to Figure 11 and Figure 13 , two or more portable ASIC housings 12 can be arranged in a horizontal row. Horizontally adjacent housings 12 can be in contact with each other and can be unfixed, or can be fixed together using their respective module mounting mechanisms. Referring to Figures 11 to 13 , the portable ASIC housings 12 can be aligned such that the air inlets 16 are in the same plane, allowing the axis 22A of the first duct 22 to be aligned for all housings 12. Similarly, the housings can be aligned such that the air outlets (not shown) are in the same plane. Thus, the modules can cooperate with each other to draw air into each housing 12 and discharge air from each housing 12 from the same side of each other, thereby drawing air in from one side of the stack / row and discharging air from the other side of the stack / row, avoiding accidental recirculation and allowing an increase in power density within a minimized footprint. Referring to Figure 12 and Figure 13 , the module mounting mechanism can include components (not shown) that fix the modules to each other when the modules are stacked vertically one on top of the other. The module mounting mechanism can include mating mounting components on the top 12D and base 12E of each portable ASIC housing 12 to allow the housings to be mounted together. Referring to Figure 11 and Figure 13 , the housing 12 can include components (not shown) that fix the modules to each other when the modules are arranged adjacent to each other in a horizontal row in an adjacent relationship. Each housing 12 can be configured to allow adjacent corresponding portable ASIC housings 12 (which are the same as the housing 12 in a relevant set of applicable dimensions) to be fixed to form a horizontal row of portable ASIC modules.

[0037] Relative terms such as front and rear, side, left and right, upper and lower are arbitrary and do not refer to absolute orientation unless the context otherwise indicates. For example, although a description refers to a rear end and a front end, it should be understood that the orientation may be reversed. Similarly, for example, in the case of a cubic container, the side walls need not be the walls with the longest lateral dimension (although they will be in many cases). Features in various embodiments may be interchanged, for example so as to provide an air inlet in the bottom plate and an air outlet in the top plate. System 10 may form a slide rail, or may form a wheeled or tracked unit, such as a trailer. In some cases, system 10 may include a motor for driving system 10 to different positions. A reference to a bottom plate may refer to the base of a component, or it may refer to a bottom plate located above the base. In some cases, system 10 or a module may come with a processor bracket but without the processor itself. The data center disclosed herein need not operate in a blockchain environment and may be used as other forms of data center or computing processor.

[0038] In the claims, the word "comprising" is used in its inclusive sense and does not exclude the presence of other elements. The indefinite articles "a" and "an" before a claim feature do not exclude the presence of more than one feature. Each individual feature described herein can be used in one or more embodiments and should not be construed as necessary for all embodiments defined by the claims merely because it is described herein.

Claims

1. A modular portable data center system, comprising: A portable enclosure formed by panels that cooperate to form an enclosure; An air inlet defined within an inlet panel of the panels; An air outlet defined within an outlet panel of the panels; An internal frame located within the portable enclosure, the internal frame defining a cooling air passage, the cooling air passage including: A labyrinth inlet duct leading to the air inlet; A processor mounting area connected to the labyrinth inlet duct; and A labyrinth outlet duct leading to the processor mounting area and the air outlet.

2. The modular portable data center system according to claim 1, wherein, The processor mounting area is elevated above the base to a position adjacent to a top panel in the panels.

3. The modular portable data center system according to any one of claims 1 to 2, wherein, The panels define or form a processor access door configured to lead to the processor mounting area.

4. The modular portable data center system according to claim 3, wherein, The top panel in the panels forms the processor access door and is pivotally connected to a side wall in the panels.

5. The modular portable data center system according to any one of claims 1 to 4, wherein: The air inlet is defined within an inlet side wall of the panels; and The air outlet is defined within an outlet side wall of the panels.

6. The modular portable data center system according to claim 5, wherein: The air inlet and the air outlet are arranged to be adjacent to a base end of the inlet side wall and a base end of the outlet side wall, respectively; and The inlet side wall and the outlet side wall are opposite each other.

7. The modular portable data center system according to any one of claims 1 to 6, wherein: The internal frame includes a partition wall separating the labyrinth inlet duct and the labyrinth outlet duct; and The partition wall at least partially divides the enclosure into two parts.

8. The modular portable data center system according to claim 7, wherein, The processor mounting area includes a shelf supported by the partition wall above the partition wall.

9. The modular portable data center system according to any one of claims 1 to 8, wherein, The modular portable data center system further includes an adjustable air recirculation valve connected to allow a controlled range of air to bypass from the labyrinth outlet duct back to the labyrinth inlet duct.

10. The modular portable data center system according to claim 9, wherein, The adjustable air recirculation valve includes a sliding door mounted to a recirculation port.

11. The modular portable data center system according to any one of claims 1 to 10, wherein, The labyrinth inlet duct includes one or more inlet duct portions connected in series between the air inlet and the processor mounting area, wherein each downstream inlet duct portion in the one or more inlet duct portions is oriented to define a downstream inlet duct portion axis that is ninety degrees or more with respect to an upstream inlet duct portion axis of an adjacent upstream inlet duct portion in the one or more inlet duct portions.

12. The modular portable data center system according to claim 11, wherein, The one or more inlet duct portions include: A first inlet duct portion connected to the air inlet; A second inlet duct portion connected to the first inlet duct portion and defining a second inlet duct portion axis that is ninety degrees or more with respect to a first inlet duct portion axis of the first inlet duct portion. A third inlet duct portion connected to the second inlet duct portion and defining a third inlet duct portion axis, the third inlet duct portion axis being at an angle of ninety degrees or more relative to the second inlet duct portion axis; and A fourth inlet duct portion connected to the third inlet duct portion and the processor mounting area and defining a fourth inlet duct portion axis, the fourth inlet duct portion axis being at an angle of ninety degrees or more relative to the third inlet duct portion axis.

13. The modular portable data center system according to any one of claims 11 to 12, wherein, The downstream inlet duct portion axis and the upstream inlet duct portion axis are defined in a common plane.

14. The modular portable data center system according to any one of claims 1 to 13, wherein, The labyrinthine outlet duct includes one or more outlet duct portions connected in series between the processor mounting area and the air outlet, wherein each downstream outlet duct portion of the one or more outlet duct portions is oriented to define a downstream outlet duct portion axis, the downstream outlet duct portion axis being at an angle of ninety degrees or more relative to the upstream outlet duct portion axis of an adjacent upstream outlet duct portion of the one or more outlet duct portions.

15. The modular portable data center system according to claim 14, wherein, The one or more outlet duct portions include: A first outlet duct portion connected to the processor mounting area; A second outlet duct portion connected to the first outlet duct portion and defining a second outlet duct portion axis, the second outlet duct portion axis being at an angle of ninety degrees or more relative to the first outlet duct portion axis of the first outlet duct portion; A third outlet duct portion connected to the second outlet duct portion and defining a third outlet duct portion axis, the third outlet duct portion axis being at an angle of ninety degrees or more relative to the second outlet duct portion axis; and A fourth outlet duct portion connected to the third outlet duct portion and the air outlet and defining a fourth outlet duct portion axis, the fourth outlet duct portion axis being at an angle of ninety degrees or more relative to the third outlet duct portion axis.

16. The modular portable data center system according to any one of claims 14 to 15, wherein, The downstream outlet duct portion axis and the upstream outlet duct portion axis are defined in a common plane.

17. The modular portable data center system according to any one of claims 1 to 16, wherein, The modular portable data center system further includes a pressure barrier oriented across the cooling air channel within the processor mounting area, the pressure barrier defining a discharge port configured to be mounted to the discharge end of the body of the processor.

18. The modular portable data center system according to any one of claims 1 to 17, wherein, The internal frame defines a central symmetry plane between the air inlet and the air outlet.

19. The modular portable data center system according to any one of claims 1 to 18, wherein, One or more of the panels include sound insulation.

20. The modular portable data center system according to any one of claims 1 to 19, wherein, The modular portable data center system further includes one or more of the following: An inlet filter located above the air inlet; and An outlet filter located above the air outlet.

21. The modular portable data center system according to any one of claims 1 to 20, wherein, The enclosure is a weatherproof enclosure.

22. The modular portable data center system according to any one of claims 1 to 21, wherein, The modular portable data center system further includes one or more processors mounted within the processor mounting area.

23. The modular portable data center system according to claim 22, wherein, The plurality of processors are mounted in parallel along a lateral mounting axis transverse to the air flow axis defined to span the processors within the processor mounting area.

24. The modular portable data center system according to any one of claims 22 to 23, wherein, Each processor includes: A body; A processor board mounted on the body and including one or more application specific integrated circuit chips; A controller; A power connector; A network connector; and One or more fans connected to direct air through the cooling air channels across the processor to keep the processor within respective operating temperature ranges.

25. The modular portable data center system according to claim 24, wherein, The one or more fans for each processor include: An inlet fan located at the inlet end of the body; and An exhaust fan located at the exhaust end of the body.

26. A method, comprising: Operating a processor of the modular portable data center system according to any one of claims 21 to 25 to process currency transactions.

27. A method, comprising: Operating a processor located in a portable enclosure of a modular portable data center system to verify currency transactions while cooling fans move cooling air sequentially: Through a labyrinthine inlet duct defined within the portable enclosure; Across the processor; And Through a labyrinthine outlet duct defined within the portable enclosure; To keep the plurality of processors within respective operating temperature ranges.

28. The method according to claim 27, wherein, The cooling fans move cooling air through an air inlet defined in an inlet within the portable enclosure into the labyrinthine inlet duct.

29. The method according to any one of claims 27 to 28, wherein, Cooling air is recirculated from the labyrinthine outlet duct back to the labyrinthine inlet duct through an adjustable air recirculation valve.

30. The method according to any one of claims 27 to 29, wherein The cooling fans move cooling air through the labyrinthine outlet duct and out to an air outlet defined in an outlet within the portable enclosure.

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