Sensor, detection device, wearable equipment, ionic gel and preparation method

Abstract

The embodiment of the invention provides a sensor, a detection device, wearable equipment, ionic gel and a preparation method, and belongs to the technical field of sensors. The sensor comprises a supporting layer, a substrate layer, an electrode layer, an ionic gel layer and a packaging layer. The electrode layer is arranged between the ionic gel layer and the substrate layer, the ionic gel layer is arranged between the electrode layer and the packaging layer, and the packaging layer is connected with the substrate layer through the supporting layer. The sensor is used for receiving the pressing force, so that the contact area of the ionic gel layer and the electrode layer is changed. The sensor provided by the embodiment of the invention can detect static force and dynamic force.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of sensors, and particularly to a sensor, a detection device, a wearable device, an ionic gel and a preparation method. Background Art

[0002] At present, wearable devices such as smart bracelets and smart watches are integrated with functions such as blood pressure measurement and heart rate measurement. The wearable device includes a pressurizing mechanism and a piezoelectric pressure sensor. During the process of the pressurizing mechanism pressurizing the wrist of the subject, the piezoelectric pressure sensor can detect the change of the pulse signal at the wrist. However, the existing piezoelectric pressure sensor cannot detect static force. The performance of the sensors of wearable devices needs to be improved. Summary of the Invention

[0003] The embodiments of the present application provide a sensor, a detection device, a wearable device, an ionic gel and a preparation method. The sensor can detect static force and dynamic force, which helps to improve the performance of wearable devices.

[0004] In the first aspect of the present application, a sensor is provided, which includes a support layer, a substrate layer, an electrode layer, an ionic gel layer and a packaging layer. The electrode layer is disposed between the ionic gel layer and the substrate layer, the ionic gel layer is disposed between the electrode layer and the packaging layer, and the packaging layer is connected to the substrate layer through the support layer. The sensor is used to receive a pressing force, so that the contact area between the ionic gel layer and the electrode layer changes.

[0005] When the pressing force is a static force, the ionic gel layer can contact the electrode layer, and an ion-electron pair is formed at the contact interface between the ionic gel layer and the electrode layer, so that the sensor can output a capacitance value to realize the detection of force. When the pressing force is a dynamic force, the contact area between the ionic gel layer and the electrode layer changes with the change of the pressing, so that the number of ion-electron pairs formed at the contact interface between the ionic gel layer and the electrode layer changes, resulting in a change in the capacitance value output by the sensor to realize the detection of force. Therefore, the wearable device can detect static force and dynamic force through the sensor provided by the embodiments of the present application, and the pressure sensor for detecting static force can be removed. In addition, it helps to improve the performance of wearable devices.

[0006] In addition, compared with the traditional flat capacitive mechanical sensor, the change of the capacitance value output by the sensor provided by the present application depends on the change of the number of ion-electron pairs at the ionic gel-electrode contact interface. Moreover, since the distance between ion-electron pairs is much smaller than the thickness of the dielectric layer in the traditional flat capacitor, the capacitance value output by the sensor provided by the present application is several orders of magnitude higher than that of the flat capacitor, which is increased from pF to nF. This also makes the sensitivity and mechanical resolution indexes of the sensor increase by 10-100 times.

[0007] In a possible implementation, the ionic gel layer and the electrode layer are spaced apart in a first direction, and the first direction is the thickness direction of the substrate layer.

[0008] In this way, when the sensor is pressed, the contact area between the ionic gel layer and the electrode layer can be increased, the number of ion-electron pairs can be increased, the capacitance value output by the sensor can be made larger, which helps to improve the sensitivity and mechanical resolution of the sensor.

[0009] In a possible implementation, the surface of the ionic gel layer facing the electrode layer is provided with microstructures.

[0010] In this way, when the sensor is pressed, the contact area between the ionic gel layer and the electrode layer can be increased, the number of ion-electron pairs can be increased, the capacitance value output by the sensor can be made larger, which helps to improve the sensitivity and mechanical resolution of the sensor. Additionally, when the sensor is not pressed, the ionic gel layer and the electrode layer can be in contact, which helps to further reduce the size of the sensor in the thickness direction of the substrate.

[0011] In a possible implementation, the ionic gel layer includes 1,4-butanediol divinyl ether, 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt.

[0012] In this way, the ionic gel layer is made of these several materials, which can increase the number of ion-electron pairs formed when the ionic gel layer contacts the electrode layer, and can further improve the sensitivity and mechanical resolution of the sensor.

[0013] In a possible implementation, the ionic gel layer is connected to the encapsulation layer by chemical bonding.

[0014] In this way, the ionic gel layer and the encapsulation layer can be connected by chemical bonding, which can improve the firmness of the connection between the ionic gel layer and the encapsulation layer. Additionally, the thickness of the connection structure between the ionic gel layer and the encapsulation layer can be reduced to reduce the thickness size of the sensor and achieve a thinning design.

[0015] In a possible implementation, the sensor further includes a coupling agent layer, the coupling agent layer is disposed between the ionic gel layer and the encapsulation layer, the ionic gel layer is connected to the coupling agent layer by chemical bonding, and the encapsulation layer is connected to the coupling agent layer by chemical bonding.

[0016] In this way, the ionic gel layer and the encapsulation layer can be firmly connected, and the thickness size of the sensor can be reduced, which helps to achieve a thinning design.

[0017] In a possible implementation, the support layer is provided with through holes, and the ionic gel layer and the electrode layer are disposed inside the through holes.

[0018] In this way, the support layer can protect the electrode layer and the ion gel layer, and when the ion gel layer is pressed, it can contact the electrode layer to form ion-electron pairs.

[0019] In a possible implementation, the support layer includes a plurality of through holes arranged at intervals, and each through hole is provided with an ion gel layer and an electrode layer.

[0020] In this way, the support layer with a grid structure separates multiple ion gel layers from each other and separates multiple electrode layers from each other. Thus, the electrode layer and the ion gel layer in each through hole form a dot, and further, the support layer can separate adjacent dots. The ion gel layer-electrode layer combination in each dot can independently output a set of capacitance values without affecting the capacitance values of the ion gel layer-electrode layer combinations in adjacent dots. Therefore, there is no crosstalk between dots, ensuring the accuracy of measurement.

[0021] In a possible implementation, the encapsulation layer includes a first elastic layer and a second elastic layer. The second elastic layer is disposed between the first elastic layer and the ion gel layer and is fixedly connected to the ion gel layer. The elastic modulus of the first elastic layer is greater than or equal to 1 GPa and the elastic modulus of the second elastic layer is less than or equal to 100 MPa, or the ratio of the elastic modulus of the first elastic layer to the elastic modulus of the second elastic layer is greater than or equal to 10.

[0022] Since the elastic modulus of the first elastic layer is greater than that of the second elastic layer, the first elastic layer is made of a high-modulus material and the second elastic layer is made of a low-modulus material. Among them, the low-modulus material provides good stretchability, ensuring that the sensor has good bending and stretching characteristics. In addition, the low-modulus material can also provide good water and oxygen barrier properties, so that the ion gel layer is not affected by water and oxygen. The high-modulus material itself provides good resilience. Therefore, using the first elastic layer and the second elastic layer to form a composite structure can improve the stability of the sensor performance.

[0023] In a possible implementation, at least one of the first elastic layer and the second elastic layer is provided with a groove structure.

[0024] By providing a groove structure in at least one of the first elastic layer and the second elastic layer, the stretchability in the non-continuous direction can be ensured to a certain extent, and the degree of irregular surface deformation of the encapsulation layer during bending will be reduced, which can further ensure the stability of the sensor performance.

[0025] The second aspect of the present application provides a detection device, including a pressing member and the sensor according to any one of the first aspect. The pressing member is used to apply pressure to the measurement site. The sensor is used to measure the pulse wave signal of the measurement site, and the sensor is disposed between the pressing member and the measurement site.

[0026] In the third aspect of the present application, a wearable device is provided, including a watch body, a first watch band, a second watch band, and a sensor according to any one of the first aspect. The opposite ends of the watch body are respectively connected to one end of the first watch band and one end of the second watch band, and the sensor is connected to the first watch band.

[0027] In the fourth aspect of the present application, an ionic gel is provided, including an elastomeric polymer backbone and an ionic liquid disposed in the elastomeric polymer backbone. The elastomeric polymer backbone includes 1,4-butanediol divinyl ether, 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), and benzoin dimethyl ether. The ionic liquid includes 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide.

[0028] In the fifth aspect of the present application, a method for preparing an ionic gel is provided, including the following steps:

[0029] Mix 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol divinyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide evenly to obtain a precursor pre-curing solution;

[0030] Place the precursor pre-curing solution under ultraviolet light for a polymerization reaction to obtain an ionic gel.

[0031] In a possible implementation manner, mixing 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol divinyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide evenly to obtain a precursor pre-curing solution includes the following steps:

[0032] Mix 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide until the benzoin dimethyl ether is completely dissolved to obtain a mixed liquid;

[0033] Add 1,4-butanediol divinyl ether to the mixed liquid to obtain a precursor pre-curing solution.

[0034] In a possible implementation manner, the ratio of 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide is 93:22:20:1.

[0035] In a possible implementation manner, the ratio of 1,4-butanediol divinyl ether to benzoin dimethyl ether is 102:1. Description of the Drawings

[0036] Figure 1 Schematic structural diagram of a wearable device provided by an embodiment of the present application;

[0037] Figure 2 Schematic structural diagram of the first sensor provided by an embodiment of the present application;

[0038] Figure 3 is Figure 2 Cross-sectional schematic diagram of the sensor in

[0039] Figure 4 is Figure 3 Cross-sectional schematic diagram of the first support layer in

[0040] Figure 5 Schematic structural diagram of the second support layer provided by an embodiment of the present application;

[0041] Figure 6 is Figure 3 Cross-sectional schematic diagram of the sensor when bent in

[0042] Figure 7 Cross-sectional schematic diagram of the second sensor provided by an embodiment of the present application;

[0043] Figure 8 Cross-sectional schematic diagram of a packaging layer from a top-down perspective provided by an embodiment of the present application;

[0044] Figure 9 Another cross-sectional schematic diagram of a packaging layer from a top-down perspective provided by an embodiment of the present application;

[0045] Figure 10 Cross-sectional schematic diagram of the third sensor provided by an embodiment of the present application;

[0046] Figure 11 is Figure 10 Cross-sectional schematic diagram of the ionic gel layer connected to the packaging layer through a coupling agent layer in

[0047] Figure 12 Cross-sectional schematic diagram of the fourth sensor provided by an embodiment of the present application;

[0048] Figure 13 Cross-sectional schematic diagram of the fifth sensor provided by an embodiment of the present application;

[0049] Figure 14 Cross-sectional schematic diagram of the sixth sensor provided by an embodiment of the present application;

[0050] Figure 15 Cross-sectional schematic diagram of the seventh sensor provided by an embodiment of the present application;

[0051] Figure 16 This is a schematic cross-sectional view of the eighth type of sensor provided by the embodiments of the present application.

[0052] Description of the reference numerals in the drawings:

[0053] 100, sensor;

[0054] 10, substrate layer;

[0055] 20, electrode layer;

[0056] 30, ionic gel layer; 31, microstructure;

[0057] 40, encapsulation layer; 41, first elastic layer; 411, strip portion; 412, columnar portion; 42, second elastic layer; 43, groove structure; 431, strip groove;

[0058] 50, support layer; 51, through hole;

[0059] 60, coupling agent layer;

[0060] 70, adhesive layer;

[0061] 200, pressing member; 210, first watch band; 220, second watch band; 230, airbag;

[0062] 300, detection device;

[0063] 400, watch body;

[0064] 500, wearable device. Detailed implementation manners

[0065] In the related art, a wearable device includes a pressing mechanism and a piezoelectric pressure sensor. During the process of the pressing mechanism pressing the wrist of the subject, the piezoelectric pressure sensor can detect the change of the pulse signal at the wrist. However, since the piezoelectric pressure sensor cannot detect static force, in order to implement the blood pressure detection function, a pressure sensor for detecting static force needs to be added. Therefore, in order to implement the blood pressure detection function, two pressure sensors need to be used.

[0066] In view of this, the embodiments of the present application provide a sensor 100, a detection device 300, a wearable device 500, an ionic gel and a preparation method. The sensor 100 realizes the output of the capacitance value through ion-electron pairs, and can not only detect dynamic force and static force, but also because the distance between ion-electron pairs is much smaller than the thickness of the dielectric layer in the traditional planar capacitive mechanical sensor, the capacitance value output by the sensor 100 is several orders of magnitude higher than that of the planar capacitor, from pF to nF, which also makes the sensitivity and mechanical resolution indexes of the sensor 100 increase by 10-100 times.

[0067] The sensor 100 provided by the embodiment of the present application can be used in the wearable device 500 or the detection device 300, and no specific limitation is made here.

[0068] Among them, the wearable device 500 may include, but is not limited to, a smart bracelet, a smart watch, a watch, or a wrist-type sphygmomanometer, etc. In the embodiment of the present application, taking the smart watch as the wearable device 500 above as an example for illustration, as Figure 1 shown.

[0069] Figure 1 is a schematic structural diagram of a wearable device provided by the embodiment of the present application.

[0070] See Figure 1 shown, the wearable device 500 of the embodiment of the present application includes a watch body 400, a pressurizing member 200, and a sensor 100. The pressurizing member 200 includes a first watch band 210, a second watch band 220, and an airbag 230. Among them, the opposite ends of the watch body 400 are respectively connected to one end of the first watch band 210 and one end of the second watch band 220, and the other end of the first watch band 210 is detachably connected to the other end of the second watch band 220. The sensor 100 is connected to the first watch band 210, and the airbag 230 is disposed between the first watch band 210 and the sensor 100.

[0071] The airbag 230 is used to apply pressure to the measurement site of the subject. The sensor 100 is located between the measurement site and the airbag 230 and measures the pulse wave signal of the measurement site. The wearable device 500 obtains the blood pressure and heart rate of the subject according to the pulse wave signal. Among them, by applying multiple different pressure values to the measurement site through the airbag 230, the envelope of the pulse wave signal changes, and the blood pressure value can be calculated according to the change of the envelope. By applying a fixed pressure to the measurement site through the airbag 230, the frequency of the pulse wave signal is counted, and the heart rate value can be calculated according to the frequency of the pulse wave signal.

[0072] The embodiment of the present application also provides a detection device 300. The detection device 300 includes a pressurizing member 200 and a sensor 100. Among them, the pressurizing member 200 is used to apply pressure to the measurement site. The sensor 100 is used to measure the pulse wave signal of the measurement site, and the sensor 100 is disposed between the pressurizing member 200 and the measurement site.

[0073] Among them, the detection device 300 may be a sphygmomanometer, a pressure detection device, etc., and no specific limitation is made here.

[0074] There is no limitation on the specific structure of the pressing member 200 here. In some implementation manners, the pressing member 200 is a telescopic watch band. At this time, the pressing member 200 can form an annular structure around the measurement part of the subject. When pressing on the measurement part of the subject, the inner diameter of the pressing member 200 becomes larger or smaller, so that the force received by the measurement part becomes larger or smaller.

[0075] In some other implementation manners, the pressing member 200 may also include an airbag 230, and the airbag 230 is used to form an annular structure around the measurement part of the subject. By inflating and deflating the airbag 230, pressure is applied to the measurement part.

[0076] In still some other implementation manners, the pressing member 200 may also include a first watch band 210, a second watch band 220, and an airbag 230. One end of the first watch band 210 is connected to one end of the second watch band 220, and the other end of the first watch band 210 and the other end of the second watch band 220 are detachably connected, and the airbag 230 is connected to the first watch band 210.

[0077] Next, in conjunction with the accompanying drawings, the implementation manners of the sensor 100 provided by the embodiments of the present application will be described.

[0078] Figure 2 FIG. is a schematic structural diagram of the first sensor provided by the embodiments of the present application. Figure 3 is Figure 2 a cross-sectional schematic diagram of the sensor in

[0079] Referring to Figure 3 as shown, the sensor 100 of the embodiments of the present application includes a support layer 50, a substrate layer 10, an electrode layer 20, an ionic gel layer 30, and a packaging layer 40. Among them, the electrode layer 20 is disposed between the ionic gel layer 30 and the substrate layer 10, the ionic gel layer 30 is disposed between the electrode layer 20 and the packaging layer 40, and the packaging layer 40 is connected to the substrate layer 10 through the support layer 50. The sensor 100 is used to receive a pressing force, so that the contact area between the ionic gel layer 30 and the electrode layer 20 changes, and the ion-electron pairs formed at the contact interface between the ionic gel layer 30 and the electrode layer 20 change.

[0080] During the process of the sensor 100 detecting the pulse wave signal, the packaging layer 40 contacts the measurement part of the subject, the substrate layer 10 is connected to the pressing member 200, and during the process of the pressing member 200 pressing on the measurement part of the subject, the contact area between the ionic gel layer 30 and the electrode layer 20 changes, so that the number of ion-electron pairs formed at the contact interface between the ionic gel layer 30 and the electrode layer 20 changes, and the capacitance value output by the sensor 100 changes, and static / dynamic load values can be detected simultaneously.

[0081] When the pressing force is a static force, the ionic gel layer 30 can contact the electrode layer 20. An ion-electron pair is formed at the contact interface between the ionic gel layer 30 and the electrode layer 20, enabling the sensor 100 to output a capacitance value and achieve force detection. When the pressing force is a dynamic force, the contact area between the ionic gel layer 30 and the electrode layer 20 changes with the pressing, causing a change in the number of ion-electron pairs formed at the contact interface between the ionic gel layer 30 and the electrode layer 20, resulting in a change in the capacitance value output by the sensor 100 and achieving force detection. Therefore, the sensor 100 provided in the embodiments of the present application can detect static forces and dynamic forces, and the pressure sensor for detecting static forces can be removed. This can help reduce the cost of the wearable device 500, or help achieve miniaturization of the wearable device 500.

[0082] In addition, compared with traditional planar capacitive mechanical sensors, the change in the capacitance value output by the sensor 100 provided in the embodiments of the present application depends on the change in the number of ion-electron pairs at the ionic gel-electrode contact interface. Since the spacing between ion-electron pairs is much smaller than the thickness of the dielectric layer in traditional planar capacitors, the capacitance value output by the sensor 100 provided in the embodiments of the present application is several orders of magnitude higher than that of planar capacitors, increasing from pF to nF. This also improves the sensitivity and mechanical resolution of the sensor 100 by 10 - 100 times.

[0083] In the embodiments of the present application, the substrate layer 10 serves as the base of the sensor 100, providing support for all sensing structures. At the same time, the substrate layer 10 also provides an encapsulation function for the sensor 100. In addition, the material of the substrate may include, but is not limited to, polymer materials such as polyethylene naphthalate (PEN), polyethylene glycol terephthalate (PET), polyimide (PI), polystyrene (PS), polyvinyl chloride (PVC), and polydimethylsiloxane (PDMS).

[0084] In the embodiments of the present application, the material of the electrode layer 20 may include, but is not limited to, conductor materials such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), graphite (C), and silver nanowires.

[0085] In some implementation manners, the electrode layer 20 can be integrated on the surface of the substrate layer 10 by means of surface fitting or deposition.

[0086] There is no limitation on the specific shape of the electrode layer 20 here. In some implementation manners, the morphology of the electrode layer 20 may be a whole-piece sheet electrode. In other implementation manners, the electrode layer 20 may also be a finger-shaped or comb-shaped interdigital electrode.

[0087] In the embodiments of the present application, the material of the support layer 50 may include, but is not limited to, polymer materials such as polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), polystyrene (PS), polyvinyl chloride (PVC), polydimethylsiloxane (PDMS), etc.

[0088] In some possible implementation manners, as Figure 3 shown, the surface of the ion gel layer 30 facing the electrode layer 20 is provided with microstructures 31, and the microstructures 31 make the surface of the ion gel layer 30 facing the electrode layer 20 rough (concave and convex), in other words, the surface of the ion gel layer 30 facing the electrode layer 20 is a non-smooth surface. Therefore, when pressing the sensor 100, the contact area between the ion gel layer 30 and the electrode layer 20 can be increased, the number of ion-electron pairs can be increased, the capacitance value output by the sensor 100 can be made larger, which helps to improve the sensitivity and mechanical resolution of the sensor 100.

[0089] There is no limitation on the specific structure of the microstructures 31 here. In some implementation manners, as Figure 3 shown, the microstructures 31 may be a sandpaper structure. In other implementation manners, the microstructures 31 may also include a plurality of bump structures arranged on the surface of the ion gel layer 30 facing the electrode layer 20, and the bump structure may be conical.

[0090] There is no limitation on how to form the microstructures 31 on the ion gel layer 30 here. In some implementation manners, the preparation method of the microstructures 31 on the surface of the ion gel layer 30 may be: pouring the precursor pre-curing solution of the ion gel layer 30 (see the description of the preparation process of the ion gel below) into a mold with a sandpaper structure, and the mold has been pre-installed with a support layer 50 with a grid structure. Therefore, the precursor pre-curing solution of the ion gel layer 30 is distributed in independent "micro-wells (which can be understood as the through-holes 51 of the support layer 50)". Then, the encapsulation layer 40 with an adhesive modification material is pressed on the precursor pre-curing solution of the ion gel layer 30, and the precursor pre-curing solution of the ion gel layer 30 is irradiated with ultraviolet light to cure it. Then, the encapsulation layer 40 is torn off from the mold to obtain the ion gel layer 30 adhered to the encapsulation layer 40 and having a sandpaper microstructure 31 on the surface.

[0091] It should be noted that, in addition to providing the microstructure 31 on the ionic gel layer 30, in some implementation manners, the surface of the electrode layer 20 facing the ionic gel layer 30 may also be provided with the microstructure 31 (not shown in the figure). In this way, the contact area between the electrode layer 20 and the ionic gel layer 30 can also be increased. Additionally, the microstructure 31 may be provided in at least one of the ionic gel layer 30 and the electrode layer 20. For example, both the ionic gel layer 30 and the electrode layer 20 are provided with the microstructure 31, or, only one of the ionic gel layer 30 and the electrode layer 20 is provided with the microstructure 31.

[0092] In some possible implementation manners, as Figure 3 shown, the ionic gel layer 30 and the electrode layer 20 are spaced apart in the first direction Z, and the first direction Z is the thickness direction of the substrate layer 10. In this way, when the pressure sensor 100 is pressed, the contact area between the ionic gel layer 30 and the electrode layer 20 can be increased, the number of ion-electron pairs can be increased, the capacitance value output by the sensor 100 becomes larger, which helps to improve the sensitivity and mechanical resolution of the sensor 100.

[0093] Since the ionic gel layer 30 is connected to the encapsulation layer 40, the electrode layer 20 is connected to the substrate layer 10, and the encapsulation layer 40 is connected to the substrate layer 10 through the support layer 50. Therefore, in addition to connecting the substrate layer 10 and the encapsulation layer 40, the support layer 50 is also used to separate the ionic gel layer 30 and the electrode layer 20. Only when pressed, the electrode layer 20 contacts the ionic gel layer 30, and the greater the pressing force, the larger the contact area between the electrode layer 20 and the ionic gel layer 30, and the larger the capacitance value output by the sensor 100. Thus, the presence of the support layer 50 can ensure the normal sensing performance of the sensor 100.

[0094] In some possible implementation manners, as Figure 3 shown, the support layer 50 is provided with a through hole 51. The through hole 51 penetrates the support layer 50 along the first direction Z, and the axial direction of the through hole 51 is parallel to the first direction Z. The ionic gel layer 30 and the electrode layer 20 are disposed inside the through hole 51. In this way, the support layer 50 can protect the electrode layer 20 and the ionic gel layer 30, and when the pressure sensor 100 is pressed, the ionic gel layer 30 can contact the electrode layer 20 to form ion-electron pairs.

[0095] Regarding the specific shape of the through hole 51, no limitation is made here. In some implementation manners, the through hole 51 may be a circular through hole 51 (not shown in the figure). In some other implementation manners, the through hole 51 may also be a square through hole (as Figure 4 shown).

[0096] Figure 4 For Figure 3 the schematic structural view of the first type of support layer.

[0097] AsFigure 4 As shown, the support layer 50 includes a plurality of through holes 51 arranged at intervals, such that the support layer 50 has a grid structure. As Figure 3 shown, an ion gel layer 30 and an electrode layer 20 are disposed in each through hole 51. Therefore, the number of ion gel layers 30 is multiple and the number of electrode layers 20 is multiple. Adjacent ion gel layers 30 are separated by the support layer 50, and adjacent electrode layers 20 are separated by the support layer 50.

[0098] Among them, the ion gel layer 30 and the electrode layer 20 in each through hole 51 can form a lattice point. Thus, the sensor 100 is equivalent to an array of multiple lattice points. The grid structure of the support layer 50 can ensure that each lattice point forms a "micro-well" structure (as shown by A in Figure 2 ), separating the ion gel materials therein, ensuring the normal sensing performance of the sensor 100, and effectively eliminating the mutual crosstalk between lattice points.

[0099] One function of the support layer 50 is that the support layer 50 separates the ion gel layer 30 from the electrode layer 20. Only when an external force is applied to press, the ion gel layer 30 contacts the electrode layer 20 and generates a capacitance change that varies with pressure, ensuring the normal performance of the sensor 100. Another function is that the grid-shaped support layer 50 separates the lattice points in the array from each other. The ion gel layer 30 - electrode layer 20 combination in each lattice point can independently output a set of capacitance values, without affecting the capacitance values of the ion gel layer 30 - electrode layer 20 combinations in adjacent lattice points. Therefore, there is no mutual crosstalk between lattice points, ensuring the measurement accuracy.

[0100] Since adjacent electrode layers 20 are separated by the support layer 50, there is a certain gap between adjacent electrode layers 20. The traces of the electrode layer 20 (not shown in the figure) can be arranged in this gap. In addition, the support layer 50 can also be connected to the substrate layer 10 through this gap.

[0101] Regarding the specific structure of the support layer 50, no limitation is imposed here. In some implementation manners, as Figure 4 shown, each of the plurality of through holes 51 is formed by four side walls. In other implementation manners, as Figure 5 shown, some of the plurality of through holes 51 are formed by four side walls, and some of the through holes 51 are formed by two side walls or three side walls. Among them, Figure 5 is a schematic structural diagram of the second support layer provided by the embodiment of the present application.

[0102] In some implementation manners, as Figure 3 shown, the sensor 100 may further include an adhesive layer 70. The adhesive layer 70 is disposed between the support layer 50 and the substrate layer 10, such that the support layer 50 is connected to the substrate layer 10 in an adhesive manner.

[0103] As Figure 4 shown, since the support layer 50 is a grid structure, the structure of the adhesive layer 70 is also a grid structure, and the grid size of the adhesive layer 70 matches the grid size of the support layer 50 to ensure the connection between the support layer 50 and the adhesive layer 70.

[0104] Among them, there is no limitation on the specific material of the adhesive layer 70 here. Exemplarily, the adhesive layer 70 can be double-sided tape. When the adhesive layer 70 is double-sided tape, the double-sided tape can be pre-bonded to the support layer 50, and then the double-sided tape and the support layer 50 with a grid structure are processed.

[0105] Exemplarily, the sheet-shaped support layer 50 and the double-sided tape can be ion-cleaned first, then the support layer 50 and the double-sided tape are pressed together, and then the connected support layer 50 and double-sided tape are placed in an oven and heated at a certain temperature for a certain time until cooled, and then the support layer 50 and the double-sided tape with a grid structure are cut out by laser.

[0106] Among them, the grid size of the support layer 50 and the grid size of the double-sided tape are consistent with the gap size of the electrode layer 20 to ensure that the support layer 50 with a grid structure is distributed in the gap between the electrode layers 20, and to ensure that the double-sided tape with a grid structure is bonded to the substrate layer 10 through the gap between the electrode layers 20 to connect the support layer 50 to the substrate layer 10.

[0107] In the embodiments of the present application, there is no specific limitation on the specific material of the ion gel layer 30 here. Among them, the ion gel layer 30 can be prepared by mixing a variety of organic materials.

[0108] In some possible implementation manners, the ion gel layer 30 can include 1,4-butanediol divinyl ether, 2,2'-(1,2-ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide.

[0109] Specifically, the ionic gel layer 30 is composed of 1,4-butanediol divinylether (BVB), 2,2'-(ethylenedioxy)diethanethiol (BMOE), and trimethylolpropane tris(3-mercaptopropionate) (TMPT) as monomers, and 2,2-dimethoxy-2-phenylacetophenone (DMPA) as a photoinitiator to undergo a Click polymerization reaction to form an elastomeric polymer backbone, and ionic liquids such as 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide (EMIM[TFSI]) uniformly dispersed in the polymer backbone. The sensor 100 uses the ionic gel layer 30 made of these several materials to contact the electrode layer 20, which can increase the number of ion-electron pairs formed when the ionic gel layer 30 contacts the electrode layer 20, and can further improve the sensitivity and mechanical resolution of the sensor 100.

[0110] It should be noted that in addition to the ionic gel layer 30 made of these several materials, the sensor 100 can also use an ionic gel layer 30 made of other materials.

[0111] In the embodiment of the present application, the encapsulation layer 40 is used to provide the functions of anti-wear, waterproof, and oxygen isolation for the sensor 100. Among them, there is no limitation on the specific structure of the encapsulation layer 40 here.

[0112] In some possible implementation manners, as Figure 3 shown, the encapsulation layer 40 includes a first elastic layer 41 and a second elastic layer 42. The second elastic layer 42 is disposed between the first elastic layer 41 and the ionic gel layer 30 and is fixedly connected to the ionic gel layer 30. Among them, the elastic modulus of the first elastic layer 41 is greater than or equal to 1 GPa and the elastic modulus of the second elastic layer 42 is less than or equal to 100 MPa, or the ratio of the elastic modulus of the first elastic layer 41 to the elastic modulus of the second elastic layer 42 is greater than or equal to 10.

[0113] It should be noted that the relationship between the elastic modulus of the first elastic layer 41 and the elastic modulus of the second elastic layer 42 only needs to satisfy at least one of the following two conditions: 1. The elastic modulus of the first elastic layer 41 is greater than or equal to 1 GPa and the elastic modulus of the second elastic layer 42 is less than or equal to 100 MPa. 2. The ratio of the elastic modulus of the first elastic layer 41 to the elastic modulus of the second elastic layer 42 is greater than or equal to 10.

[0114] The first elastic layer 41 is made of a high-modulus material. The high-modulus material refers to a polymer material with an elastic modulus greater than or equal to 1 GPa, including but not limited to polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. Materials with a high elastic modulus can achieve rapid rebound when the bending or pressing pressure is removed, that is, such materials have good creep resistance. This helps to realize the basic functions of the sensor 100: the encapsulation layer 40 and the ion gel layer 30 connected thereto will produce corresponding bending deformations under a certain pressure, so as to ensure that the ion gel layer 30 and the electrode layer 20 have corresponding contact areas and output corresponding capacitance values. When the pressure changes rapidly, taking the rapid decrease in pressure as an example, the high-elasticity-modulus material in the encapsulation layer 40 will rebound rapidly, the corresponding bending deformation will decrease, the contact area between the ion gel layer 30 and the electrode layer 20 will decrease, and the capacitance value output by the sensor 100 will decrease, thus realizing the signal sensing of the force decrease.

[0115] The second elastic layer 42 is made of a low-modulus material. The low-elasticity-modulus material refers to a polymer material with an elastic modulus less than or equal to 100 MPa, including but not limited to polydimethylsiloxane (PDMS), Ecoflex, silica gel, etc. Materials with a low elastic modulus have good stretchability, which can ensure that the sensor 100 has good bending and stretching properties. In addition, the low-elasticity-modulus material can also provide good water and oxygen isolation, ensuring the stability of the ion gel layer 30. In addition, during the preparation process of the sensor 100, when the low-elasticity-modulus material is cleaned with Plasma plasma, the oxygen side chains (-O-) on the material on the side close to the ion gel layer 30 will become hydroxyl side chains (-OH), so that it can be combined with the coupling agent layer 60 (see below), thereby ensuring that the low-elasticity-modulus material can be firmly bonded to the ion gel layer 30.

[0116] In summary, the encapsulation layer 40 is made of a low-elastic modulus material and a high-elastic modulus material. The low-modulus material provides excellent stretchability, ensuring that the sensor 100 has good bending and stretching properties. Furthermore, the low-modulus material provides excellent water and oxygen insulation, protecting the ion gel layer 30 from the effects of water and oxygen. The high-modulus material itself provides excellent resilience, which can improve the performance stability of the sensor 100. Therefore, the encapsulation layer 40, consisting of the first elastic layer 41 and the second elastic layer 42, ensures that the sensor 100 can respond quickly while also ensuring repeatable and stable sensing performance.

[0117] In some possible implementations, at least one of the first elastic layer 41 and the second elastic layer 42 may be provided with a groove structure 43, for example Figure 3 As shown, the first elastic layer 41 is provided with a groove structure 43 , while the second elastic layer 42 is not provided with a groove structure 43 .

[0118] Because the first elastic layer 41 is made of a high-elastic modulus material and the second elastic layer 42 is made of a low-elastic modulus material, the two materials with different elastic moduli tend to produce different bending states (different curvatures, different curvature distributions, etc.) when bent under force, which can easily cause irregular surface deformation and affect the performance of the sensor 100. Therefore, by providing a groove structure 43 on the first elastic layer 41 to pattern the first elastic layer 41, the irregular surface deformation can be reduced or eliminated, thereby ensuring the resilience and stretchability of the encapsulation layer 40.

[0119] Figure 6 for Figure 3 The cross-sectional diagram of the sensor in FIG. Figure 7 This is a cross-sectional diagram of the second sensor provided in the embodiment of the present application. Figure 7 and Figure 6 The difference is that Figure 7 Neither the first elastic layer 41 nor the second elastic layer 42 is provided with the groove structure 43 .

[0120] In some implementations, a portion of the first elastic layer 41 can be cut or etched to form a strip-shaped grating structure or a stretchable grid structure to form a patterned structure. The effect of this structure is that because the material of the first elastic layer 41 is a high elastic modulus material, it has good rebound properties in the continuous direction of the material. In the discontinuous direction of the material (the direction in which it is cut or etched), the material is stretchable, and because a portion is removed, when the material is bent and deformed, its internal stress is less than that of the whole piece of material that has not been patterned. Therefore, its bending deformation is not as large as the deformation of the whole piece of material. When compounded with a low elastic modulus material, the degree of irregular surface deformation will be reduced (such as Figure 6as shown, can be clearly distinguished from Figure 7 the case of the large surface shape change shown. Therefore, the patterned structure can not only ensure the recoverable elasticity of the encapsulation layer 40, but also ensure its stretchability, while reducing the irregular surface shape change between the two layers during bending deformation.

[0121] In the example of the present application, there is no specific limitation on the specific structure of the first elastic layer 41 having the groove structure 43.

[0122] Figure 8 It is a schematic cross-sectional view of an encapsulation layer from a top view provided by an embodiment of the present application. Figure 9 It is another schematic cross-sectional view of an encapsulation layer from a top view provided by an embodiment of the present application.

[0123] In some implementation manners, as Figure 8 shown, the first elastic layer 41 may include a plurality of strip portions 411 arranged side by side and spaced apart in the second direction X, and the extending direction of each strip portion 411 is parallel to the third direction Y, and a groove structure 43 is formed between two adjacent strip portions 411.

[0124] In other implementation manners, as Figure 9 shown, the first elastic layer 41 may include a plurality of columnar portions 412 arranged at intervals, and the plurality of columnar portions 412 are arranged in an array in the second direction X and the third direction Y, and the gap between adjacent columnar portions 412 is used to form the groove structure 43.

[0125] In still other implementation manners, the first elastic layer 41 may also include a main body portion and a plurality of strip portions 411. The main body portion is connected to the second elastic layer 42, and the plurality of strip portions 411 are arranged on the same side of the main body portion. The plurality of strip portions 411 are arranged side by side and spaced apart in the second direction X, and each strip portion 411 extends in the third direction Y, and a groove structure 43 is formed by two adjacent strip portions 411 and the main body portion.

[0126] In the example of the present application, the first direction Z, the second direction X, and the third direction Y are perpendicular to each other. Among them, the first direction Z is the thickness direction of the substrate layer 10.

[0127] It should be noted that in addition to the first elastic layer 41 being provided with the groove structure 43, in some implementation manners, the groove structure 43 may also be provided on the second elastic layer 42, and the first elastic layer 41 is not provided with the groove structure 43. In still other implementation manners, the groove structure 43 may also be provided on both the first elastic layer 41 and the second elastic layer 42.

[0128] When the second elastic layer 42 is provided with a groove structure 43, along the first direction Z, the groove structure 43 does not penetrate the second elastic layer 42. In other words, the groove structure 43 is not a through-groove structure. Or it can also be understood that when the second elastic layer 42 is provided with a groove structure 43, the second elastic layer 42 is still an integral plate structure, rather than being composed of multiple discrete parts. In this way, this can ensure that the second elastic layer 42 can be connected to the ion gel layer 30.

[0129] When the second elastic layer 42 is provided with a groove structure 43, the groove structure 43 is disposed on the side of the second elastic layer 42 facing the first elastic layer 41 along the first direction Z. At this time, a part of the first elastic layer 41 can be disposed inside the groove structure 43 to increase the contact area between the first elastic layer 41 and the second elastic layer 42, which helps to improve the firmness of the connection between the first elastic layer 41 and the second elastic layer 42.

[0130] In the embodiment of the present application, the ion gel layer 30 can be connected to the encapsulation layer 40 by bonding. In some implementation manners, the ion gel layer 30 can be bonded to the encapsulation layer 40 by bonding members such as double-sided tape, glue, tape (not shown in the figure). In other implementation manners, the ion gel layer 30 can also be connected to the encapsulation layer 40 by chemical bonding, so that the ion gel layer 30 and the encapsulation layer 40 are chemically bonded, thereby forming an integrated structure between the ion gel layer 30 and the encapsulation layer 40.

[0131] Correspondingly, whether the ion gel layer 30 is connected to the encapsulation layer 40 by a bonding member or by chemical bonding, it can ensure that there is sufficient adhesive force between the ion gel layer 30 and the encapsulation layer 40, so that the ion gel layer 30 and the encapsulation layer 40 are fastened together and will not fall off during the processes of stretching and bending, thereby ensuring the stability of the sensor 100 during long-term use.

[0132] Since the thickness of the bonding member in the first direction Z (usually in the order of hundreds of micrometers) is relatively thick, it will affect the thickness and bendability of the sensor 100 in the first direction Z. However, when the ion gel layer 30 is connected to the encapsulation layer 40 by chemical bonding, the thickness of the chemical layer between the ion gel layer 30 and the encapsulation layer 40 can be controlled to be sub-micron (less than μm) thickness, which will not affect the thickness, stretching, and bending performance of the sensor 100, and the thickness of the sensor 100 in the first direction Z can be made thinner. Therefore, in the example of the present application, the ion gel layer 30 forms an integral structure with the encapsulation layer 40 by chemical bonding.

[0133] Figure 10 The cross-sectional schematic diagram of the third sensor provided for the embodiment of the present application Figure 11 is Figure 10 the cross-sectional schematic diagram of the ion gel layer in [] being connected to the encapsulation layer through a coupling agent layer.

[0134] In some possible implementations, such as Figure 10 shown, the sensor 100 may further include a coupling agent layer 60 disposed between the ion gel layer 30 and the encapsulation layer 40. The ion gel layer 30 is connected to the coupling agent layer 60 by chemical bonding, and the encapsulation layer 40 is connected to the coupling agent layer 60 by chemical bonding. In this way, the ion gel layer 30 can be chemically bonded to the encapsulation layer 40 through the coupling agent layer 60, which can ensure sufficient adhesion between the encapsulation layer 40 and the ion gel layer 30, and reduce the thickness of the sensor 100 in the first direction Z without affecting the bendability of the sensor 100.

[0135] There is no limitation on the specific type of the coupling agent layer 60 here. Exemplarily, the ion gel layer 30 can form an integral structure with the encapsulation layer 40 through a coupling agent with a mercapto group, such as (3-mercaptopropyl)trimethoxysilane, and perform chemical bonding with the encapsulation layer 40 and the ion gel layer 30 respectively by dehydration / de-alcoholization reaction and click reaction, respectively realizing the strong connection of the encapsulation layer 40-coupling agent adhesive layer 70 (as Figure 11 shown) and the gel layer-coupling agent adhesive layer 70 (as Figure 11 shown), so that the ion gel layer 30 and the encapsulation layer 40 are fastened together and will not fall off during the processes of stretching and bending, thus ensuring the stability of the sensor 100 during long-term use.

[0136] Taking the coupling agent layer 60 as (3-mercaptopropyl)trimethoxysilane as an example, the following will illustrate how the coupling agent layer 60 bonds the ion gel layer 30 and the encapsulation layer 40 into an integral structure.

[0137] As Figure 10 shown, the encapsulation layer 40 is composed of a first elastic layer 41 and a second elastic layer 42. The second elastic layer 42 is connected to the ion gel layer 30, and the material of the second elastic layer 42 may include but is not limited to polymers with an oxygen chain (-O-), such as PDMS, Ecoflex, and silica gel.

[0138] During the preparation process of the sensor 100, first, the encapsulation layer 40 is cleaned with Plasma plasma, so that the oxygen chain side chain (-O-) on the second elastic layer 42 becomes a hydroxyl side chain (-OH), and then the encapsulation layer 40 is placed in a treatment solution of the coupling agent (main components: (3-mercaptopropyl)trimethoxysilane + acetic acid) for 30 minutes. The de-alcoholization reaction that occurs during this period is:

[0139]

[0140] After the above processing steps, the encapsulation layer 40 and the coupling agent layer 60 complete chemical bonding, and a strong chemical bond is formed between the two layers to connect them. Then, using the principle of click chemistry reaction, the coupling agent is chemically bonded to the monomers in the precursor pre-curing solution of the ionic gel layer 30, so that the ionic gel layer 30 can be tightly connected to the encapsulation layer 40 during curing.

[0141] During the preparation of the sensor 100, one side of the encapsulation layer 40 with the coupling agent layer 60 is pressed onto the precursor pre-curing solution of the ionic gel layer 30, and then irradiated with an ultraviolet lamp to cure the precursor pre-curing solution of the ionic gel layer 30. The click chemical reaction that occurs during this period is:

[0142]

[0143] It can be seen from the reaction formula that the thiol group (-SH) in the coupling agent layer 60 undergoes a click reaction with the carbon-carbon double bond (C═C) in the monomers of the pre-curing solution of the ionic gel layer 30 to form a stable carbon-sulfur bond (C-S), which tightly connects the coupling agent layer 60 and the ionic gel layer 30 together.

[0144] In summary, due to the presence of the coupling agent layer 60, a stable bonding structure of the encapsulation layer 40 - coupling agent layer 60 - ionic gel layer 30 is formed at the connection interface between the encapsulation layer 40 and the ionic gel layer 30 (as Figure 11 shown), so that the ionic gel layer 30 can be firmly and stably fixed to the encapsulation layer 40.

[0145] Figure 12 This is a schematic cross-sectional view of the fourth sensor provided by the embodiment of the present application.

[0146] Figure 12 Compared with Figure 3 , the difference is that the encapsulation layer 40 is also composed of a first elastic layer 41 and a second elastic layer 42, and neither the first elastic layer 41 nor the second elastic layer 42 is provided with a groove structure 43. With this setting, the encapsulation layer 40 composed of a high elastic modulus material and a low elastic modulus material can also make the sensor 100 have good stretchability, bendability, and resilience, and can ensure the stability of the performance of the sensor 100.

[0147] In the above content, the encapsulation layer 40 is a two-layer structure and is composed of two materials with different elastic moduli. However, the encapsulation layer 40 can also be a single-layer structure, and the encapsulation layer 40 is composed of a material with one elastic modulus, as Figure 13 shown. Among them, Figure 13 This is a schematic cross-sectional view of the fifth sensor provided by the embodiment of the present application.

[0148] In Figure 13In [the above], the encapsulation layer 40 can be bonded to the ionic gel layer 30 through an adhesive or bonded to the ionic gel layer 30 by chemical bonding.

[0149] Figure 14 This is a schematic cross-sectional view of the sixth sensor provided by the embodiments of the present application.

[0150] Figure 14 And Figure 3 The difference is that along the first direction Z, the ionic gel layer 30 is in contact with the electrode layer 20. Specifically, before pressing the sensor 100, the ionic gel layer 30 remains in contact with the electrode layer 20. Since the surface of the ionic gel layer 30 facing the electrode layer 20 is provided with microstructures 31, when the sensor 100 is pressed, the contact area between the ionic gel layer 30 and the electrode layer 20 can change, so that the number of ion-electron pairs formed by the contact cross-section of the ionic gel layer 30 and the electrode layer 20 changes, realizing the detection of force.

[0151] As Figure 14 shown, by making the ionic gel layer 30 in contact with the electrode layer 20, the thickness of the sensor 100 in the first direction Z can be further reduced, which helps the thinning design of the sensor 100.

[0152] In the above content, the surface of the ionic gel layer 30 facing the electrode layer 20 is provided with microstructures 31 (as Figure 3 or Figure 14 shown). However, the surface of the ionic gel layer 30 facing the electrode layer 20 may not be provided with microstructures 31. In other words, the surface of the ionic gel layer 30 facing the electrode layer 20 is a non-rough surface (or a flat surface), as Figure 15 shown. Among them, Figure 15 This is a schematic cross-sectional view of the seventh sensor provided by the embodiments of the present application.

[0153] It should be noted that when the surface of the ionic gel layer 30 facing the electrode layer 20 is not provided with microstructures 31, the ionic gel layer 30 and the electrode layer 20 should be spaced apart in the first direction Z to ensure that the contact area between the ionic gel layer 30 and the electrode layer 20 can change when the sensor 100 is pressed.

[0154] In the above content, the support layer 50 has a plurality of through holes 51, so that the support layer 50 has a grid structure. However, the support layer 50 may also be provided with one through hole 51, as Figure 16 shown. Among them, Figure 16 This is a schematic cross-sectional view of the eighth sensor provided by the embodiments of the present application.

[0155] As Figure 16As shown, the support layer 50 is provided with a through hole 51, and the number of the electrode layer 20 and the ion gel layer 30 is also one. Additionally, when the number of the through holes 51 is one, the support layer 50 is equivalent to a pipe structure that penetrates through both ends.

[0156] An embodiment of the present application further provides an ion gel, which includes an elastomeric polymer backbone and an ionic liquid disposed in the elastomeric polymer backbone. Among them, the elastomeric polymer backbone includes 1,4-butanediol divinyl ether, 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), and benzoin dimethyl ether. The ionic liquid includes 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide.

[0157] Specifically, the elastomeric polymer backbone is generated by a Click polymerization reaction using 1,4-butanediol divinyl ether (BVB), 2,2'-(ethylenedioxy)bis(ethanethiol) (BMOE), and trimethylolpropane tris(3-mercaptopropionate) (TMPT) as monomers and benzoin dimethyl ether (DMPA) as a photoinitiator.

[0158] An embodiment of the present application further provides a preparation method for an ion gel, which specifically includes the following steps:

[0159] S1. Mix 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol divinyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide uniformly to obtain a precursor pre-curing solution. Specifically, the precursor pre-curing solution can be obtained through the following steps.

[0160] S11. Mix 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide until the benzoin dimethyl ether is completely dissolved to obtain a mixed liquid.

[0161] To ensure the complete dissolution of benzoin dimethyl ether, a shaking device can be used to shake the mixed liquid of 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide.

[0162] During the preparation of the mixed liquid, the proportions of 2,2'-(1,2-ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide are not restricted here. Among them, the proportions of 2,2'-(1,2-ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide refer to mass ratios.

[0163] Exemplarily, the proportions of 2,2'-(1,2-ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide can be 93:22:20:1, which can further improve the performance of the ion gel. Of course, the proportions of 2,2'-(1,2-ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide can also be other proportions. For example, they can also be 92:22:20:1.

[0164] S12. Add 1,4-butanediol divinyl ether to the mixed liquid to obtain a precursor pre-curing solution.

[0165] Specifically, in order to fully mix 1,4-butanediol divinyl ether and the mixed liquid, a shaking device can be used to shake for a certain period of time and ultrasonic treatment can be carried out to remove bubbles. Exemplarily, after 1,4-butanediol divinyl ether and the mixed liquid are mixed, shake for 60 s and perform ultrasonic treatment for 60 s.

[0166] The proportion of 1,4-butanediol divinyl ether is not restricted here. Among them, the proportion of 1,4-butanediol divinyl ether refers to the mass ratio. Exemplarily, the ratio of 1,4-butanediol divinyl ether to benzoin dimethyl ether can be 102:1. Of course, the ratio of 1,4-butanediol divinyl ether to benzoin dimethyl ether can also be other ratios. For example, it can also be 101:1.

[0167] S2. Place the precursor pre-curing solution under ultraviolet light for a polymerization reaction to obtain an ion gel.

[0168] Specifically, the precursor pre-curing solution can be irradiated with an ultraviolet lamp to cure the precursor pre-curing solution to obtain an ion gel.

[0169] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, or an indirect connection through an intermediate medium, or the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0170] In the embodiments of the present application, it is not to be understood that the devices or components indicated by the embodiments or implications thereof must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically and precisely defined.

[0171] The terms "first", "second", "third", "fourth", etc. (if any) in the description of the embodiments of the present application, the claims, and the above-mentioned drawings are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0172] The term "a plurality" herein refers to two or more. The term "and / or" herein merely describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after; in a formula, the character " / " represents a "division" relationship between the associated objects before and after.

[0173] It can be understood that in the embodiments of the present application, the various numerical numbers involved are only for the convenience of description and do not limit the scope of the embodiments of the present application.

[0174] It can be understood that in the embodiments of the present application, the magnitude of the sequence numbers of the above processes does not mean the order of execution, and the order of execution of each process should be determined according to its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A sensor, characterized in that, It includes a support layer, a substrate layer, an electrode layer, an ionic gel layer, and a packaging layer; The electrode layer is disposed between the ionic gel layer and the substrate layer, the ionic gel layer is disposed between the electrode layer and the packaging layer, and the packaging layer is connected to the substrate layer through the support layer; The sensor is used to receive a pressing force, such that the contact area between the ionic gel layer and the electrode layer changes.

2. The sensor according to claim 1, characterized in that, The ionic gel layer and the electrode layer are spaced apart in a first direction, and the first direction is the thickness direction of the substrate layer.

3. The sensor according to claim 1 or 2, characterized in that, The surface of the ionic gel layer facing the electrode layer is provided with microstructures.

4. The sensor according to any one of claims 1 to 3, characterized in that The ionic gel layer includes 1,4-butanediol divinyl ether, 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide.

5. The sensor according to any one of claims 1 to 4, characterized in that The ionic gel layer is connected to the packaging layer through chemical bonding.

6. The sensor according to claim 5, wherein The sensor further includes a coupling agent layer, the coupling agent layer is disposed between the ionic gel layer and the packaging layer, the ionic gel layer is connected to the coupling agent layer through chemical bonding, and the packaging layer is connected to the coupling agent layer through chemical bonding.

7. The sensor according to any one of claims 1 to 6, characterized in that The support layer is provided with through holes, and the ionic gel layer and the electrode layer are disposed inside the through holes.

8. The sensor according to claim 7, characterized in that, The support layer includes a plurality of spaced-apart through holes, and one ionic gel layer and one electrode layer are disposed in each through hole.

9. The sensor according to any one of claims 1 to 8, characterized in that, The packaging layer includes a first elastic layer and a second elastic layer, and the second elastic layer is disposed between the first elastic layer and the ionic gel layer and is fixedly connected to the ionic gel layer; The elastic modulus of the first elastic layer is greater than or equal to 1 GPa and the elastic modulus of the second elastic layer is less than or equal to 100 MPa, or the ratio of the elastic modulus of the first elastic layer to the elastic modulus of the second elastic layer is greater than or equal to 10.

10. The sensor according to claim 9, wherein At least one of the first elastic layer and the second elastic layer is provided with a groove structure.

11. A detection device, characterized in that, It includes a pressing member and the sensor according to any one of claims 1 to 10; The pressing member is used to apply pressure to the measurement site; The sensor is used to measure the pulse wave signal of the measurement site, and the sensor is disposed between the pressing member and the measurement site.

12. A wearable device, characterized in that, It includes a watch body, a first watch band, a second watch band, and the sensor according to any one of claims 1 to 10; Opposite ends of the watch body are respectively connected to one end of the first watch band and one end of the second watch band, and the sensor is connected to the first watch band.

13. An ion gel, characterized in that, It includes an elastomeric polymer backbone and an ionic liquid disposed in the elastomeric polymer backbone; The elastomeric polymer backbone includes 1,4-butanediol divinyl ether, 2,2'-(ethylenedioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), and benzoin dimethyl ether; The ionic liquid includes 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide.

14. A method for preparing an ionic gel, characterized in that, It includes the following steps: Mix 2,2'-(1,2-ethanediyl dioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol vinyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt evenly to obtain a precursor pre-curing solution; Place the precursor pre-curing solution under ultraviolet light for a polymerization reaction to obtain an ion gel.

15. The preparation method according to claim 14, characterized in that, The step of mixing 2,2'-(1,2-ethanediyl dioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol vinyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt evenly to obtain a precursor pre-curing solution includes the following steps: Mix the 2,2'-(1,2-ethanediyl dioxy)bis(ethanethiol), the trimethylolpropane tris(3-mercaptopropionate), the benzoin dimethyl ether, and the 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt until the benzoin dimethyl ether is completely dissolved and a mixed liquid is obtained; Add the 1,4-butanediol vinyl ether to the mixed liquid to obtain the precursor pre-curing solution.

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