A flexible sensor and a method of manufacturing the same

Abstract

A flexible sensor and its fabrication method are disclosed. The fabrication method mainly includes embedding a first magnetic element into a dielectric layer, placing the dielectric layer after embedding the magnetic material into a second mold, placing a second magnetic element below the second mold, filling the gaps in the second mold with conductive adhesive ink to obtain a first sensing layer of the sensor, and fabricating a second sensing layer in the same manner. The first sensing layer, the spacer layer, and the second sensing layer are then sequentially combined. The first magnetic elements adjacent to each other in the assembled flexible sensor exhibit repulsive forces. The fabrication method of the first and second sensing layers reduces interface defects and gaps between materials, thereby reducing the risk of performance degradation and structural failure of the sensor due to material aging, oxidation, or corrosion during long-term use, and enhancing the long-term stability of the sensor.

Description

Technical Field

[0001] This invention relates to the field of flexible sensor technology, and in particular to a flexible sensor and its fabrication method. Background Technology

[0002] With the widespread application of flexible wearable electronic devices in fields such as human-computer interaction, the demand for sensors capable of accurately detecting strain on mechanical surfaces is increasing. These sensors need to be able to adapt to the fitting requirements of various complex curved surfaces; therefore, flexible sensors have become a key component of sensor research.

[0003] Although some progress has been made in the research of flexible ionized sensors, they still face many technical bottlenecks: flexible ionized sensors are not stable enough, and their performance may become unstable or degraded after long-term use, resulting in a decrease in the measurement accuracy of the sensor. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a flexible sensor and its fabrication method.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A method for fabricating a flexible sensor includes the following steps:

[0007] S1. Fabrication of the dielectric layer:

[0008] Ionic liquid, gaseous SiO2 particles, curing agent liquid and ionic liquid are added to PDMS liquid and stirred for time T1 and vacuum filtered for time T2 to obtain conductive adhesive ink. The conductive adhesive ink is filled into a first mold, and then the first mold filled with the conductive adhesive ink is heated and cured. After demolding, a dielectric layer is obtained.

[0009] S2. Preparation of the first sensing layer:

[0010] The sensor single layer includes a first sensing layer and a second sensing layer. A first magnetic component is embedded in the dielectric layer, and the dielectric layer after embedding the first magnetic component is placed in a second mold. The second magnetic component is then placed below the outer surface of the second mold. The conductive adhesive ink is poured onto the dielectric layer, and the first sensing layer is obtained by heating, curing, and demolding.

[0011] S3. Fabrication of the second sensing layer:

[0012] Repeat the steps in S2 to obtain the second sensing layer;

[0013] S4. Preparation of spacer layer:

[0014] Design a spacer screen and fix the spacer screen on the printing table. Apply spacer ink evenly to the spacer screen and obtain the spacer layer after several overprints.

[0015] S5. Assemble the flexible sensor:

[0016] After matching one side of the spacer layer with the electrode position of the first sensing layer, the spacer layer is adhered. Then, after matching the other side of the spacer layer with the electrode position of the second sensing layer, the flexible sensor is adhered, and the fabrication is complete.

[0017] Furthermore, during steps S2 and S3, when preparing the single layer of the sensor, the magnetic force between the first magnetic element and the second magnetic element is an attractive force; during step S5, when assembling the flexible sensor, the magnetic force between adjacent first magnetic elements inside the flexible sensor is a repulsive force.

[0018] Furthermore, the conductive adhesive ink is obtained by mixing the PDMS liquid, curing agent liquid, ionic liquid, and gaseous SiO2 particles in a mass ratio of 10:1:10:2; and the T1 time is 2h and the T2 time is 2min.

[0019] Furthermore, TPU and DFM are mixed at a mass ratio of 1:2 to obtain the spacer layer ink, and the spacer layer ink is placed in a stirrer and stirred at 1100 r / min and 80 degrees for 3 hours.

[0020] Furthermore, the surface of the spacer layer obtained in step S4 is modified.

[0021] Furthermore, the modification treatment method is plasma treatment. When the surface of the spacer layer is modified by plasma treatment, the plasma treatment power is 100W and the treatment time is 3min.

[0022] Furthermore, the modification treatment method is ultraviolet light irradiation. When the surface of the spacer layer is treated with ultraviolet light irradiation, the ultraviolet light irradiation intensity is 10 mW / cm². 2 The processing time is 10 minutes.

[0023] Furthermore, during the assembly of the flexible sensor, the spacer layer is bonded to the first sensing layer and the second sensing layer by hot pressing or vacuum heating curing.

[0024] Furthermore, when using hot pressing, the hot pressing temperature is 55 degrees Celsius, the pressure is 1.0 MPa, and the hot pressing time is 90 seconds.

[0025] Furthermore, when using vacuum heating curing, the curing temperature is 55 degrees Celsius and the curing time is 1 hour.

[0026] A flexible sensor, prepared using the above-described method, comprises, from top to bottom, a first sensing layer, a spacer layer, and a second sensing layer.

[0027] The beneficial effects of this invention are:

[0028] 1. The present invention proposes a method for fabricating a flexible sensor, which involves embedding a first magnetic component into a dielectric layer, placing a second magnetic component below the outer surface of a second mold, and filling the dielectric layer with conductive adhesive ink to obtain a first sensing layer and a second sensing layer. This method reduces interface defects and voids between materials, thereby reducing the risk of performance degradation and structural failure of the sensor due to material aging, oxidation, or corrosion during long-term use, and enhancing the long-term stability of the sensor.

[0029] 2. The present invention proposes a method for fabricating a flexible sensor. The magnetic force between adjacent first magnetic components is a repulsive force. This repulsive force provides an inherent restoring force for the sensor. When the sensor is deformed by an external force, the relative positions between the magnetic components change, causing the distribution of the repulsive force to change accordingly. Once the external force is removed, the repulsive force between the magnetic components causes them to return to their initial positions, thereby restoring the sensor as a whole to its original shape. This shape memory effect can extend the sensor's lifespan and improve its reliability and stability.

[0030] 3. The present invention proposes a method for preparing a flexible sensor, wherein TPU and DFM are mixed at a mass ratio of 1:2 to prepare a spacer layer ink, and the obtained spacer layer ink is placed in a stirrer and stirred thoroughly at 1100 r / min and 80 degrees for 3 hours. The addition of DFM can significantly improve the conductivity of TPU. By mixing with TPU, a conductive network can be formed, thereby improving the conductivity of the composite material and enabling the sensor to have good electrical performance.

[0031] 4. The present invention proposes a method for fabricating a flexible sensor, which modifies the surface of the spacer layer by plasma treatment or ultraviolet irradiation. Plasma treatment can physically and chemically modify the surface of the spacer layer, significantly improving the surface energy and adhesion of the treated spacer layer, thereby enhancing the overall structural stability and dielectric properties of the sensor. At the same time, by modifying the surface of the spacer layer through plasma treatment or ultraviolet irradiation, the contact between it and the sensing layer or other functional layers can be made tighter and more stable, thereby improving the signal transmission efficiency and sensitivity of the sensor.

[0032] 5. The method for preparing a flexible sensor proposed in this invention can significantly enhance the bonding force between the spacer layer and the first sensor layer and the second sensor layer by hot pressing or vacuum heating curing during the assembly of the flexible sensor, thereby improving the stability and reliability of the sensor. At the same time, these treatment methods can also improve the flexibility and electrical properties of the material, thereby improving the overall performance and service life of the sensor. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a flowchart of a flexible sensor fabrication method according to the present invention;

[0035] Figure 2 This is an exploded view of a flexible sensor unit according to the present invention;

[0036] Figure 3 This is a schematic diagram of the second magnetic component of a flexible sensor according to the present invention;

[0037] Figure 4 This is a schematic diagram of the first mold of a flexible sensor according to the present invention;

[0038] Figure 5 This is one of the schematic diagrams of the second mold for a flexible sensor according to the present invention;

[0039] Figure 6 This is a second schematic diagram of the second mold for a flexible sensor according to the present invention;

[0040] Figure 7 This is an exploded view of a flexible sensor array according to the present invention;

[0041] Figure 8 This is a graph showing the relationship between the repulsive force between the first magnetic components of a flexible sensor according to the present invention and the magnet spacing.

[0042] Figure 9 This is a graph showing the relationship between the sensor's electrical signal output and pressure as a function of strain during the loading and unloading process of a flexible sensor according to the present invention.

[0043] Figure 10 This is a graph showing the change in electrical signal output of a flexible sensor of the present invention within different strain ranges.

[0044] Figure 11This is a graph showing the change in electrical signal output of a flexible sensor according to the present invention within different pressure ranges.

[0045] Figure 12 This is a graph showing the relationship between the capacitance of a flexible sensor of the present invention and the number of cycles under a strain of 15%.

[0046] Figure 13 This is a graph showing the capacitance of a flexible sensor according to the present invention changing over time under high-frequency oscillation of 3.85Hz.

[0047] In the figure, 10 is the dielectric layer; 201 is the first mold; 202 is the second mold; 301 is the first magnetic component; 302 is the second magnetic component; 401 is the first sensing layer; 402 is the second sensing layer; 50 is the spacer layer; 601 is the first placement groove; 6011 is the first protrusion; 6012 is the second protrusion; 602 is the second placement groove; 603 is the third placement groove; 604 is the fourth placement groove; 701 is the first cover layer; and 702 is the second cover layer. Detailed Implementation

[0048] The following is combined with Figures 1 to 13 The present invention will be described in detail below.

[0049] Example 1

[0050] A method for fabricating a flexible sensor includes the following steps:

[0051] S1. Fabrication of dielectric layer 10:

[0052] Ionic liquid, gaseous SiO2 particles, and curing agent liquid are added to PDMS liquid and stirred for time T1 and vacuum filtered for time T2 to obtain conductive adhesive ink. The conductive adhesive ink is filled into the first mold 201, and then the first mold 201 filled with conductive adhesive ink is heated and cured. After demolding, dielectric layer 10 is obtained.

[0053] S2. Fabrication of the first sensing layer 401:

[0054] The sensor single layer includes a first sensing layer 401 and a second sensing layer 402. A first magnetic element 301 is embedded in a dielectric layer 10, and the dielectric layer 10 after embedding the first magnetic element 301 is placed in a second mold 202. The second magnetic element 302 is then placed below the outer surface of the second mold 202. The dielectric layer 10 is reinforced by the attraction between the first magnetic element 301 and the second magnetic element 302. Conductive adhesive ink is introduced above the dielectric layer 10. After heating, curing, and demolding, the first sensing layer 401 is obtained. This preparation method reduces interface defects and voids between materials, thereby reducing the risk of performance degradation and structural failure of the sensor due to material aging, oxidation, or corrosion during long-term use, and enhancing the long-term stability of the sensor.

[0055] S3. Prepare the second sensing layer 402:

[0056] Repeat the steps in S2 to obtain the second sensing layer 402;

[0057] S4, Prepare spacer layer 50:

[0058] Design the spacer screen and fix it on the printing table. Apply the spacer ink evenly to the spacer screen and obtain the spacer 50 after several overprints.

[0059] S5. Assemble the flexible sensor:

[0060] After matching one side of the spacer layer 50 with the electrode position of the first sensing layer 401, the spacer layer 50 is adhered. Then, after matching the other side of the spacer layer 50 with the electrode position of the second sensing layer 402, the flexible sensor is adhered, and the fabrication is complete.

[0061] In this embodiment, during steps S2 and S3 when the first sensing layer 401 and the second sensing layer 402 are prepared, the magnetic force between the first magnetic element 301 and the second magnetic element 302 is an attractive force, which helps to reinforce the dielectric layer 10. During step S5 when the flexible sensor is assembled, the magnetic force between adjacent first magnetic elements 301 inside the flexible sensor is a repulsive force, which can provide an inherent restoring force for the sensor. When the sensor is deformed by external force, the relative positions between the magnetic elements will change, causing the distribution of the repulsive force to change as well. Once the external force is removed, the repulsive force between the magnetic elements will cause them to return to their initial positions, thereby causing the sensor as a whole to return to its original shape. This shape memory effect can extend the service life of the sensor and improve its reliability and stability.

[0062] In this embodiment, a square first placement groove 601 is provided at the center of the first mold 201, and a cylindrical first protrusion 6011 is provided at the center of the first placement groove 601. A second protrusion 6012 that communicates with the edge of the first placement groove 601 is provided at the bottom of the upper surface of the first protrusion 6011.

[0063] Preferably, the first placement groove 601 has a side length of 20mm and a groove depth of 1.8mm; the first protrusion 6011 has a diameter of 10mm and a height of 1mm; and the second protrusion 6012 has a height of 1mm.

[0064] In this embodiment, a square second placement groove 602 is provided at the center of the second mold 202, and a third placement groove 603 connected to the edge of the second mold 202 is provided at the bottom of the second placement groove 602. A fourth placement groove 604 is provided at the bottom of the outer surface of the second mold 202.

[0065] Preferably, the second placement groove 602 has a side length of 20mm and a groove depth of 3.5mm.

[0066] In this embodiment, when preparing the dielectric layer 10, the first mold 201 needs to be cured and heated at a temperature of 100 degrees Celsius for 2 hours. Then, when preparing the conductive adhesive ink, PDMS liquid, curing agent liquid, ionic liquid, and gaseous SiO2 particles are mixed in a mass ratio of 10:1:10:2. The resulting solution is stirred in a stirrer for time T1, and then vacuum filtered for time T2. Thorough stirring and vacuum filtration can improve the dispersibility of gaseous SiO2 particles, allowing them to be evenly distributed in the conductive adhesive ink. This helps to reduce the agglomeration of conductive fillers and improve the uniformity and conductivity of the conductive network.

[0067] Specifically, take a 20ml beaker, add 5g of PDMS liquid, then add 0.5g of curing agent liquid, then add 5g of ionic liquid, then add 1g of fumed SiO2 particles, stir with a magnetic stirrer for time T1, and vacuum filter for time T2 to obtain conductive adhesive ink; then clean a glass plate with alcohol and deionized water, and print using the glass plate at a 45-degree angle, filling the first placement groove 601 with the obtained conductive adhesive ink, and then place the first mold 201 filled with conductive adhesive ink on a 100℃ heating table and heat for 2 hours, and demold to obtain the cured dielectric layer 10.

[0068] Preferably, the time T1 is 2 hours and the time T2 is 2 minutes.

[0069] In this embodiment, during the preparation of the first sensing layer 401 in step S2, a wire is first led out from the first magnetic component 301 using conductive cloth. By using conductive cloth to lead out the wire and filling the dielectric layer 10 with conductive adhesive ink, a stable conductive path can be formed, reducing loss and interference during signal transmission. This helps to improve the stability and reliability of sensor signal transmission, ensuring that the sensor can accurately sense and transmit the magnetic repulsion signal. The first magnetic component 301 is embedded in the dielectric layer 10, and the dielectric layer 10 with the embedded first magnetic component 301 is placed in the second placement groove 602 of the second mold 202. The second magnetic component 302 is placed in the fourth placement groove 604 of the second mold 202, and the dielectric layer 10 is reinforced by the magnetic attraction. The remaining space above the dielectric layer 10 is filled with conductive adhesive ink. After heating and curing, the first sensing layer 401 is obtained after demolding, and step S2 is repeated to prepare the second sensing layer 402.

[0070] Specifically, a conductive nickel cloth of the same size as the first magnetic component 301 is fabricated using laser cutting. The conductive nickel cloth is aligned with the first magnetic component 301, and a wire is led out from the middle. The magnet and the wire are embedded in the center of the dielectric layer 10. The dielectric layer 10 with the first magnetic component 301 embedded is placed in the second placement slot 602 of the second mold 202. The second magnetic component 302 is placed in the fourth placement slot 604 of the second mold 202. The magnetic attraction is used to reinforce the dielectric layer 10. The remaining space above the dielectric layer is filled with conductive adhesive ink using a 45-degree tilted glass plate printing. Then, the second mold 202 filled with conductive adhesive ink and containing the dielectric layer 10 is placed on a 55°C heating table and heated for 5 hours. After demolding, the first sensing layer 401 is obtained after curing. The second magnetic component 302 is then removed. The above steps are repeated to prepare the second sensing layer 402.

[0071] In this embodiment, the spacer layer ink in step S4 is prepared by mixing TPU and DFM at a mass ratio of 1:2 and stirring in a stirrer at 1100 r / min and 80 degrees for 3 hours. The addition of DFM can significantly improve the conductivity of TPU. By mixing with TPU, a conductive network can be formed, thereby improving the conductivity of the composite material and enabling the sensor to have good electrical performance.

[0072] Preferably, the spacer layer ink is coated on the spacer layer screen and the spacer layer 50 is obtained by four overprinting processes.

[0073] In this embodiment, the surface of the spacer layer 50 obtained in step S3 is modified to improve its surface energy and adhesion. The modified spacer layer 50 should have better dielectric stability and bonding strength with the sensor monolayer.

[0074] Specifically, in this embodiment, the modification treatment method is plasma treatment. When modifying the surface of spacer layer 50 using plasma treatment, the plasma treatment power is 100W and the treatment time is 3 minutes. Plasma treatment can perform physical and chemical modification on the surface of spacer layer 50. In terms of physical modification, high-energy particles such as ions, electrons, and free radicals in the plasma can etch the surface, making it rougher and increasing the specific surface area, thereby improving the surface energy. In terms of chemical modification, plasma can introduce polar groups, such as hydroxyl and carboxyl groups. These polar groups can form hydrogen bonds or other chemical bonds with adhesives and other materials, further enhancing the adhesion.

[0075] In this embodiment, the adhesive used in step S5 when assembling the flexible sensor is flexible epoxy resin.

[0076] In this embodiment, when assembling the flexible sensor, the spacer layer 50 is bonded to the first sensing layer 401 and the second sensing layer 402 by hot pressing or vacuum heating curing. When hot pressing is used, the hot pressing temperature is 55°C, the pressure is 1.0 MPa, and the hot pressing time is 90 s to ensure that the layers are bonded to each other. When vacuum heating curing is used, the assembled flexible sensor is placed in a vacuum drying oven, the drying temperature is 55 degrees, and the time is 1 hour.

[0077] This embodiment also provides a flexible sensor. The flexible sensor is prepared using the above-described method and includes, from top to bottom, a first sensing layer 401, a spacer layer 50, and a second sensing layer 402.

[0078] Furthermore, the first sensing layer 401 includes a first cover layer 701, a first electrode layer, and a dielectric layer 10; the second sensing layer 402 includes a second cover layer 702, a second electrode layer, and a dielectric layer 10.

[0079] Specifically, both the first electrode layer and the second electrode layer are first magnetic components 301.

[0080] In this embodiment, the flexible sensor can be expanded into a two-dimensional array to cover a larger detection area, making it suitable for more complex application scenarios. The expansion principle is as follows:

[0081] First, determine the locations where the sensors need to be placed on a two-dimensional plane. Then, place several flexible sensor units at the designated locations to complete the expansion.

[0082] In this embodiment, the working principle of the flexible sensor is as follows:

[0083] When the first sensing layer 401 or the second sensing layer 402 is compressed, the distance between the first electrode layer and the second electrode layer in the sensor decreases, thereby increasing the capacitance or decreasing the resistance, thus realizing the sensing of pressure.

[0084] like Figure 8 As shown, the horizontal axis represents the spacing between magnetic components, and the vertical axis represents the magnitude of the repulsive force of the flexible sensor. It shows that as the spacing between magnetic components increases, the repulsive force decreases significantly, indicating that the repulsive force of the sensor is inversely proportional to its spacing.

[0085] like Figure 9As shown, the horizontal axis represents the strain condition of the sensor. The main vertical axis on the left side of the figure represents the ratio of the change in the capacitance of the flexible sensor to the initial capacitance, which reflects the change in the electrical signal output of the flexible sensor. The secondary vertical axis on the right side of the figure represents the pressure applied to the flexible sensor. The "Loading" label on the figure indicates that the flexible sensor is in the loading process, and the "Unloading" label indicates that the flexible sensor is in the unloading process. This shows that during the loading process, both the electrical signal output and pressure of the flexible sensor increase with the increase of the strain condition, while during the unloading process, the sensor's electrical signal output and pressure decrease with the decrease of the strain condition. Overall, the flexible sensor exhibits stable performance during the loading and unloading processes, indicating that the sensor has the ability to perform long-term stable monitoring.

[0086] like Figure 10-11 As shown, Figure 10 The horizontal axis in the graph represents the strain condition of the flexible sensor, and the vertical axis represents the ratio of the change in capacitance of the flexible sensor to its initial capacitance. Figure 11 The horizontal axis represents the pressure applied to the flexible sensor, and the vertical axis represents the ratio of the change in capacitance to the initial capacitance. This reflects the sensor's good response characteristics under different strain and pressure conditions, which helps to achieve long-term high-frequency signal detection of normal strain and pressure changes.

[0087] like Figure 12 As shown, the horizontal axis represents the number of test cycles, and the vertical axis represents the output capacitance of the flexible sensor. The magnified part in the figure is an arbitrary segment of the experimental values, which shows that the capacitance of the flexible sensor remains stable for more than 12,000 cycles under a strain of 15%, proving the long-term stability of the sensor in strain detection.

[0088] like Figure 13 As shown, the horizontal axis represents the number of test cycles, and the vertical axis represents the output capacitance of the flexible sensor. The magnified portion in the figure is an arbitrary segment of the experimental values, demonstrating that the capacitance of the flexible sensor remained stable during 60,000 cycles of testing under high-frequency oscillation conditions exceeding 3.85Hz, proving the long-term stability of the sensor in detecting high-frequency signals.

[0089] Example 2

[0090] Unlike Example 1, in this example, the modification treatment of the spacer layer ink is performed by ultraviolet light irradiation, with an ultraviolet light intensity of 10 mW / cm². 2The irradiation time was 10 minutes. Ultraviolet light irradiation can induce photochemical reactions on the surface of the spacer layer 50, causing oxidation or cross-linking reactions on the surface, thereby changing the chemical composition and structure of the surface. This modification can increase the polarity and roughness of the surface, improve the surface energy, and thus enhance the surface adhesion.

[0091] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand and implement the present invention. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A method for fabricating a flexible sensor, characterized in that, Includes the following steps: S1. Fabrication of the dielectric layer: Ionic liquid, gaseous SiO2 particles, and curing agent liquid are added to PDMS liquid and stirred for time T1 and vacuum filtered for time T2 to obtain conductive adhesive ink. The conductive adhesive ink is filled into a first mold, and then the first mold filled with the conductive adhesive ink is heated and cured. After demolding, a dielectric layer is obtained. S2. Preparation of the first sensing layer: The sensor single layer includes a first sensing layer and a second sensing layer. A first magnetic component is embedded in the dielectric layer, and the dielectric layer after embedding the first magnetic component is placed in a second mold. The second magnetic component is then placed below the second mold. The conductive adhesive ink is introduced above the dielectric layer. After heating and curing, the first sensing layer is obtained after demolding. S3. Fabrication of the second sensing layer: Repeat the steps in S2 to obtain the second sensing layer; S4. Preparation of spacer layer: Design a spacer screen and fix the spacer screen on the printing table. Apply spacer ink evenly to the spacer screen and obtain the spacer layer after several overprints. S5. Assemble the flexible sensor: After matching one side of the spacer layer with the electrode position of the first sensing layer, the spacer layer is adhered. Then, after matching the other side of the spacer layer with the electrode position of the second sensing layer, the flexible sensor is adhered, and the fabrication is complete.

2. The method for fabricating a flexible sensor as described in claim 1, characterized in that, When the sensor monolayer is prepared in steps S2 and S3, the magnetic force between the first magnetic element and the second magnetic element is an attractive force; when the flexible sensor is assembled in step S5, the magnetic force between adjacent first magnetic elements inside the flexible sensor is a repulsive force.

3. The method for fabricating a flexible sensor as described in claim 1, characterized in that, The conductive adhesive ink is obtained by mixing the PDMS liquid, curing agent liquid, ionic liquid, and gaseous SiO2 particles in a mass ratio of 10:1:10:2; and the T1 time is 2h and the T2 time is 2min.

4. The method for fabricating a flexible sensor as described in claim 1, characterized in that, The surface of the spacer layer obtained in step S4 is modified.

5. The method for fabricating a flexible sensor as described in claim 4, characterized in that, The modification treatment method is plasma treatment. When the plasma treatment method is used to modify the surface of the spacer layer, the plasma treatment power is 100W and the treatment time is 3min.

6. The method for fabricating a flexible sensor as described in claim 4, characterized in that, The modification treatment is performed by ultraviolet light irradiation. When the surface of the spacer layer is modified by ultraviolet light irradiation, the ultraviolet light irradiation intensity is 10 mW / cm². 2 The processing time is 10 minutes.

7. The method for fabricating a flexible sensor as described in claim 1, characterized in that, When assembling the flexible sensor, the spacer layer is attached to the first sensing layer and the second sensing layer by hot pressing or vacuum heating curing.

8. The method for fabricating a flexible sensor as described in claim 7, characterized in that, When using hot pressing, the hot pressing temperature is 55 degrees Celsius, the pressure is 1.0 MPa, and the hot pressing time is 90 seconds.

9. The method for fabricating a flexible sensor as described in claim 7, characterized in that, When using vacuum heating curing, the curing temperature is 55 degrees Celsius and the curing time is 1 hour.

10. A flexible sensor, characterized in that, Using the fabrication method of any one of claims 1-9, the flexible sensor comprises, from top to bottom, the first sensing layer, the spacer layer, and the second sensing layer.

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