Hinge mechanism and electronic device
By setting up an adjustment bracket on the hinge bracket and using fasteners and colloid connections, the problem of poor flatness of the folding screen mobile phone hinge bracket in the unfolded state is solved, and the stability and appearance performance of the hinge are improved.
Patent Information
- Application Number
- CN202510892068.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-30
- Publication Date
- 2025-07-29
AI Technical Summary
The hinge bracket of existing folding screen mobile phones is poor in the unfolded state due to insufficient strength, resulting in a top printing problem, and the high demand for hinge torque causes the spring to rise and deformation.
By setting up an adjustment bracket on the hinge bracket and connecting the fastener and colloid, the adjustment bracket is bonded to the hinge cover, and the bonding force of the colloid and the pulling action of the fastener can alleviate the lifting and deformation of the hinge bracket and enhance the connection stability.
It effectively alleviates the problem of lifting and deformation of the hinge bracket, improves the flatness and appearance performance of the hinge mechanism, and enhances the integrity of the hinge.
Smart Images
Figure CN120384919A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of electronic products, and specifically relates to a hinge mechanism and an electronic device. Background Art
[0002] With the advancement of communication technology and rising user demands, mobile phone displays are becoming larger and larger, making foldable phones a future trend. However, a key pain point for foldable phones is the top print on the unfolded main screen. Existing hinges are becoming weaker due to the increasing thinness of foldable phones. However, the increasing torque requirements for hinges inevitably lead to spring warping and deformation when unfolded. Furthermore, the existing hinge bracket strength is insufficient to overcome the spring deformation, resulting in poor hinge flatness and a top print on the unfolded main screen. Summary of the Invention
[0003] The purpose of the embodiments of the present application is to provide a hinge mechanism and an electronic device that can solve problems such as poor flatness of the hinge bracket.
[0004] In order to solve the above technical problems, this application is implemented as follows: The embodiment of the present application provides a hinge mechanism, comprising: a hinge bracket, a hinge cover, and an adjustment bracket; A first mounting hole is provided on a side of the hinge bracket facing the hinge cover, and two sides of the first mounting hole have a first overlapping surface and a second overlapping surface, and the height of the first overlapping surface is greater than the height of the second overlapping surface; The adjustment bracket is provided with a second mounting hole, the first mounting hole is opposite to the second mounting hole, the adjustment bracket includes a first bonding surface and a second bonding surface, the area of the first bonding surface is smaller than the area of the second bonding surface, the first bonding surface is opposite to the first overlapping surface, and the second bonding surface is opposite to the second overlapping surface, the first mounting hole and the second mounting hole are provided with fasteners, and the adjustment bracket is fixed to the hinge bracket by the fasteners; The fastener and the adjustment bracket are bonded to the hinge cover via a colloid at a side away from the hinge bracket, and the colloid at least covers the second bonding surface.
[0005] An embodiment of the present application also provides an electronic device, comprising the above-mentioned hinge mechanism.
[0006] In the embodiments of the present application, the second bonding surface is bonded to the hinge cover by at least a colloid to ensure the firmness and stability of the connection between the adjustment bracket and the hinge cover. Moreover, since the area of the first bonding surface is smaller than that of the second bonding surface, the bonding force of the colloid on the second bonding surface is greater than that on the first bonding surface. Meanwhile, the colloid can also bond the fastener to the hinge cover. In addition, the adjustment bracket is fixed to the hinge bracket by the fastener. Thus, under the fastening action of the fastener, the first overlapping surface and the second overlapping surface can respectively abut against the adjustment bracket. And since the height of the first overlapping surface is greater than that of the second overlapping surface, under the fastening action of the fastener, the side of the hinge bracket close to the second overlapping surface can be pulled, playing a pre-tightening role, thereby effectively alleviating the problem of warping deformation of the hinge bracket after being stressed, and further ensuring the flatness of the hinge bracket, which is beneficial to improving the integrity and appearance performance of the hinge mechanism. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 is a schematic structural diagram of the hinge mechanism disclosed in the embodiments of the present application; Figure 2 is Figure 1 a schematic cross-sectional view taken along A-A in; Figure 3 is Figure 2 a partial enlarged view at B in; Figure 4 is Figure 2 a partial enlarged view at C in; Figure 5 is Figure 2 a partial enlarged view at D in; Figure 6 is a schematic structural diagram of the hinge mechanism with the hinge cover removed disclosed in the embodiments of the present application; Figure 7 is a schematic structural diagram of the adjustment bracket in the first form disclosed in the embodiments of the present application; Figure 8 is a schematic structural diagram of the adjustment bracket in the second form disclosed in the embodiments of the present application; Figure 9 is a schematic structural diagram of the adjustment bracket in the third form disclosed in the embodiments of the present application; Figure 10 is a schematic structural diagram of the adjustment bracket in the fourth form disclosed in the embodiments of the present application; Figure 11 is a schematic structural diagram of the adjustment bracket in the fifth form disclosed in the embodiments of the present application; Figure 12 is a schematic structural diagram of the adjustment bracket in the sixth form disclosed in the embodiments of the present application; Figure 13Schematic diagram of the electronic device disclosed in the embodiments of the present application.
[0008] Description of reference numerals: 01 - Hinge mechanism; 10 - Hinge bracket; 11 - Protrusion; 111 - First mounting hole; 112 - First lapping surface; 113 - Second lapping surface; 12 - Glue application boss; 121 - Inclined guiding surface; 20 - Hinge cover; 30 - Adjustment bracket; 31 - Second mounting hole; 32 - First bonding surface; 33 - Second bonding surface; 34 - Depression; 35 - Baffle; 351 - Fixing hole; 36 - Connecting column; 40 - Fastener; 50 - Damping component; 60 - Swing arm assembly; 021 - First housing; 022 - Second housing. Detailed implementation manners
[0009] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0010] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally represents an "or" relationship between the associated objects before and after.
[0011] Next, the embodiments of the present application will be described in detail in conjunction with the accompanying drawings through specific embodiments and their application scenarios.
[0012] Referring to Figures 1 to 13 , the embodiments of the present application disclose a hinge mechanism 01, and the disclosed hinge mechanism 01 includes a hinge bracket 10, a hinge cover 20, and an adjustment bracket 30.
[0013] The hinge bracket 10 is a basic component, which can provide an installation foundation for the hinge cover 20, the adjustment bracket 30, etc. In some embodiments, a first mounting hole 111 may be provided on one side of the hinge bracket 10 facing the hinge cover 20, the adjustment bracket 30 may be provided with a second mounting hole 31, and the first mounting hole 111 and the second mounting hole 31 are disposed opposite to each other; in addition, a fastener 40 is provided in the first mounting hole 111 and the second mounting hole 31. In this way, the adjustment bracket 30 can be fixed to the hinge bracket 10 through the fastener 40, thereby ensuring the installation stability and firmness between the adjustment bracket 30 and the hinge bracket 10. Optionally, the hinge bracket 10 may be formed by carbon fiber molding, and the adjustment bracket 30 may be formed by high-strength steel powder metallurgy.
[0014] Furthermore, as Figure 3 and Figure 4 shown, both sides of the first mounting hole 111 have a first overlapping surface 112 and a second overlapping surface 113, and the height of the first overlapping surface 112 is greater than the height of the second overlapping surface 113. It should be noted here that taking the surface of the hinge bracket 10 facing away from the hinge cover 20 as the base surface, the average distance between the first overlapping surface 112 and the base surface is greater than the average distance between the second overlapping surface 113 and the base surface.
[0015] Optionally, the hinge bracket 10 may be provided with a protrusion 11 on the side facing the hinge cover 20, the first mounting hole 111 may be opened in the protrusion 11, and the first overlapping surface 112 and the second overlapping surface 113 may be located on the protruding end surface of the protrusion 11.
[0016] When the adjustment bracket 30 is fixed to the hinge bracket 10 by the fastener 40, under the fastening action of the fastener 40, the surface of the adjustment bracket 30 facing away from the hinge is respectively abutted against the first overlapping surface 112 and the second overlapping surface 113, thereby ensuring the reliability and stability of the connection between the adjustment bracket 30 and the hinge.
[0017] Moreover, the side of the fastener 40 away from the hinge bracket 10 is bonded to the hinge cover 20 by a colloid. In this way, under the bonding action of the colloid, a certain pulling effect can be exerted on the hinge bracket 10 through the fastener 40 to relieve the problem of warping deformation caused by the force on the hinge bracket 10.
[0018] The side of the adjustment bracket 30 away from the hinge bracket 10 is bonded to the hinge cover 20 by a colloid. In this way, under the bonding action of the colloid, the reliability and firmness of the connection between the adjustment bracket 30 and the hinge cover 20 can be ensured, and a certain bearing effect can be exerted on the fastener 40 through the adjustment bracket 30 to enhance the pulling effect on the hinge bracket 10 through the fastener 40.
[0019] Continue to refer to Figure 3 and Figure 4, the adjustment bracket 30 may include a first bonding surface 32 and a second bonding surface 33. Among them, the first bonding surface 32 faces the first overlapping surface 112, the second bonding surface 33 faces the second overlapping surface 113, the area of the first bonding surface 32 is smaller than that of the second bonding surface 33, and the colloid covers at least the second bonding surface 33. Based on this, the bonding force of the colloid on the second bonding surface 33 can be made greater than the bonding force on the first bonding surface 32.
[0020] In the embodiment of the present application, the second bonding surface 33 and the hinge cover 20 are bonded by the colloid at least to ensure the firmness and stability of the connection between the adjustment bracket 30 and the hinge cover 20. And because the area of the first bonding surface 32 is smaller than that of the second bonding surface 33, the bonding force of the colloid on the second bonding surface 33 is greater than the bonding force on the first bonding surface 32. At the same time, the colloid can also bond the fastener 40 to the hinge cover 20. And the adjustment bracket 30 is fixed to the hinge bracket 10 through the fastener 40. In this way, under the fastening action of the fastener 40, the first overlapping surface 112 and the second overlapping surface 113 can respectively abut against the adjustment bracket 30. And because the height of the first overlapping surface 112 is greater than that of the second overlapping surface 113, under the fastening action of the fastener 40, the side of the hinge bracket 10 close to the second overlapping surface 113 can be pulled, playing a pre-tightening role, so as to effectively relieve the problem of warping deformation of the hinge bracket 10 after being stressed, ensure the flatness of the hinge bracket 10, and is beneficial to improving the integrity and appearance performance of the hinge mechanism 01.
[0021] Reference Figure 6 , in some embodiments, the hinge mechanism 01 may further include a damping component 50 provided on the hinge bracket 10. Through the damping component 50, a certain damping effect can be exerted on the folding or unfolding of the hinge mechanism 01 to prevent the hinge mechanism 01 from being bent randomly, and the texture of the hinge mechanism 01 can also be improved.
[0022] It should be noted here that the damping mechanism may include a spring, and the elastic force of the spring can act directly or indirectly on the hinge bracket 10, making the hinge bracket 10 prone to warping deformation, affecting the normal use and appearance performance of the hinge mechanism 01.
[0023] In the embodiment of the present application, by providing the adjustment bracket 30, fixing the adjustment bracket 30 to the hinge bracket 10 through the fastener 40, the matching relationship between the adjustment bracket 30 and the first overlapping surface 112 and the second overlapping surface 113, and bonding the adjustment bracket 30 and the fastener 40 to the hinge cover 20 through the colloid respectively, a certain pulling effect can be exerted on the hinge bracket 10 to offset the acting force of the spring of the damping component 50 that causes the hinge bracket 10 to warp and deform, so as to relieve the problem of warping deformation of the hinge bracket 10.
[0024] Optionally, the first mounting hole 111 and the damping assembly 50 may be arranged along the axial direction of the hinge mechanism 01, and the second overlapping surface 113 is located on the side of the first overlapping surface 112 away from the damping assembly 50. Based on this setting, a stronger pulling effect can be exerted on the hinge bracket 10 on the side of the first mounting hole 111 away from the damping assembly 50, thereby effectively alleviating the problem of warping deformation on the side of the hinge bracket 10 away from the damping assembly 50.
[0025] It should be noted here that the damping assembly 50 is located on the side of the first mounting hole 111 close to the first overlapping surface 112. In this way, the spring of the damping assembly 50 exerts a squeezing effect on the side close to the first overlapping surface 112, causing the hinge bracket 10 to warp and deform, and the warping deformation in the area away from the damping assembly 50 is more obvious. Therefore, a stronger pulling effect needs to be applied to the area away from the damping assembly 50 to prevent obvious warping deformation on the side away from the damping assembly 50.
[0026] Reference Figure 7 and Figure 8 Referring to and, in some embodiments, the adjustment bracket 30 may be a sheet-like structure, and the second mounting hole 31 penetrates through the sheet-like structure. Based on this, when the fastener 40 is inserted into the second mounting hole 31, the sheet-like adjustment bracket 30 can be fastened to the hinge bracket 10 to ensure the installation stability of the adjustment bracket 30.
[0027] Exemplarily, the adjustment bracket 30 may be a rectangular sheet-like structure, etc. Of course, it may also be other shapes, which are not specifically limited herein.
[0028] Reference Figures 9 to 12 Referring to, in other embodiments, the adjustment bracket 30 may also be a strip-like structure, and second mounting holes 31 may be respectively formed in the two end regions of the strip-like structure. Based on this, the strip-like structure can be respectively fastened at both ends by installing fasteners 40 in the second mounting holes 31 in the two end regions, thereby further improving the installation stability of the adjustment bracket 30.
[0029] It should be noted here that the shape of the adjustment bracket 30 can be determined according to the installation positions of the damping assembly 50, the swing arm assembly 60, etc. on the hinge bracket 10, and can be specifically set according to the actual situation.
[0030] In some embodiments, the fastener 40 may be a screw. Correspondingly, the first mounting hole 111 may be a threaded hole, and the stud of the screw can be threadedly connected to the first mounting hole 111 to ensure the reliability of the connection and facilitate disassembly.
[0031] Reference Figures 7 to 9 and Figure 11, the adjustment bracket 30 may be provided with a recess 34, the second mounting hole 31 may be opened in the recess 34, the stud of the screw may pass through the second mounting hole 31, and the nut of the screw may abut against the recess 34. In this way, the nut can exert a squeezing effect on the recess 34, so that the adjustment bracket 30 abuts against the first overlapping surface 112 and the second overlapping surface 113 respectively, thereby ensuring the reliability and stability of the connection between the adjustment bracket 30 and the hinge bracket 10.
[0032] Reference Figures 4 to 6 , in some embodiments, the hinge mechanism 01 may further include a plurality of swing arm assemblies 60 distributed along the axial direction of the hinge mechanism 01; in addition, a plurality of dispensing bosses 12 may be provided on the side of the hinge bracket 10 facing the hinge cover 20, and the plurality of dispensing bosses 12 are respectively bonded to the hinge cover 20 through a colloid, and each dispensing boss 12 is correspondingly arranged with each swing arm assembly 60.
[0033] Based on the above settings, through the bonding and fixing of the plurality of dispensing bosses 12 and the hinge cover 20, the reliability and stability of the connection between the hinge bracket 10 and the hinge cover 20 can be further improved, preventing the hinge cover 20 from detaching from the hinge bracket 10, and further, a certain pulling effect can be exerted on the hinge bracket 10 to relieve the problem of warping and deformation of the hinge bracket 10 due to stress.
[0034] It should be noted here that since the swing arm assembly 60 needs to rotate relative to the hinge bracket 10 and the swing arm assembly 60 is connected to other components, the hinge bracket 10 is prone to warping and deformation due to stress in the area where the swing arm assembly 60 is installed. Based on this, in the embodiment of the present application, the dispensing boss 12 is provided at a position corresponding to each swing arm assembly 60 and is bonded and fixed to the hinge, so as to exert a pulling effect on each area of the hinge bracket 10 corresponding to the swing arm assembly 60, thereby relieving the problem of warping and deformation of the hinge bracket 10 due to stress.
[0035] In some embodiments, an inclined guiding surface 121 may be provided at the connection between the end surface and the side wall of the dispensing boss 12. In this way, the difficulty of disassembling the hinge cover 20 can be reduced, and the hinge bracket 10 can be prevented from being damaged when disassembling the hinge cover 20.
[0036] In some embodiments, the first overlapping surface 112 and the second overlapping surface 113 may be located in the same inclined plane, and the inclined plane extends obliquely in a direction away from the hinge cover 20 from the first overlapping surface 112 to the second overlapping surface 113. Based on this, when both the first overlapping surface 112 and the second overlapping surface 113 abut against the adjustment bracket 30, the pulling effect on the side of the hinge bracket 10 close to the second overlapping surface 113 can be made more obvious, thereby preventing the hinge bracket 10 from warping and deforming on the side close to the second overlapping surface 113.
[0037] In other embodiments, the first lap surface 112 and the second lap surface 113 form a step surface. In this case, when the first lap surface 112 and the second lap surface 113 are both in contact with the adjustment bracket 30, the pulling effect on the hinge bracket 10 on the side close to the second lap surface 113 can also be made more obvious, thereby preventing the hinge bracket 10 from warping and deforming on the side close to the second lap surface 113.
[0038] Optionally, the first lap surface 112 and the second lap surface 113 can be arranged in parallel with a height difference between them; of course, the first lap surface 112 and the second lap surface 113 can also be arranged non-parallel with a height difference between them; in addition, the first lap surface 112 and the second lap surface 113 can both be parallel to the side surface of the hinge bracket 10 facing away from the hinge cover 20, or non-parallel.
[0039] refer to Figure 7 、 Figure 9 and Figure 10 In some embodiments, the adjustment bracket 30 may not be directly connected to the spring of the damping assembly 50. In this case, the adjustment bracket 30 may be provided with a fixing hole 351, through which the adjustment bracket 30 can be sleeved on the rotating shaft, which can improve the installation stability of the adjustment bracket 30 to a certain extent; at the same time, the spring of the damping assembly 50 is also sleeved on the rotating shaft, and is supported and limited by the block provided on the rotating shaft to prevent the spring bracket from acting on the adjustment bracket 30.
[0040] refer to Figure 8 、 Figure 11 and Figure 12 In other embodiments, the adjustment bracket 30 can also be directly connected to the spring of the damping assembly 50. In this case, the adjustment bracket 30 can be provided with a connecting post 36, which is arranged parallel to the rotating shaft. This allows a portion of the spring of the damping assembly 50 to be mounted on the rotating shaft and supported and limited by a stopper provided on the rotating shaft. The other portion of the spring can be mounted on the connecting post 36 and abut against the adjustment bracket 30, so that the spring is supported and limited by the adjustment bracket 30. Of course, the adjustment bracket 30 can also be provided with a fixing hole 351, through which the adjustment bracket 30 is mounted on the rotating shaft to improve the installation stability of the adjustment bracket 30.
[0041] In some specific embodiments, the adjustment bracket 30 may be provided with baffles 35 on either side of the hinge mechanism 01 in the width direction. Each baffle 35 may have a fixing hole 351, which is used to pass through the rotating shaft of the hinge mechanism 01. Therefore, the fixing holes 351 cooperate with the rotating shaft to improve the installation stability of the adjustment bracket 30.
[0042] Further, a connecting post 36 may be provided on the end face of the adjusting bracket 30 along the rotating shaft. The connecting post 36 is used to sleeved with the spring of the damping assembly 50, and the baffle 35 is used to block the spring. In this way, the spring sleeved on the rotating shaft can be limited by the baffle 35.
[0043] It should be noted here that the technical solutions in the embodiments of the present application can be combined arbitrarily without contradiction to obtain different implementation manners.
[0044] Based on the above hinge mechanism 01, an electronic device is further disclosed in an embodiment of the present application. The disclosed electronic device includes the above hinge mechanism 01. In addition, the electronic device may further include a first housing 021 and a second housing 022, and the first housing 021 and the second housing 022 are connected by the hinge mechanism 01, as Figure 13 shown.
[0045] In summary, in the embodiment of the present application, by adding the adjusting bracket 30 and relying on the rigidity of the hinge cover 20, the hinge bracket 10 can be pulled to overcome the influence of the spring of the damping assembly 50 on the warping deformation of the hinge bracket 10. And by making the height of the first overlapping surface 112 greater than the height of the second overlapping surface 113, a pre-compensation space can be formed at the second overlapping surface 113, so as to offset the warping deformation of the hinge bracket 10.
[0046] The embodiments of the present application have been described above with reference to the drawings. However, the present application is not limited to the above specific implementation manners. The above specific implementation manners are only illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all belong to the protection scope of the present application.
Claims
1. A hinge mechanism, characterized in that, Comprising: A hinge bracket, a hinge cover, and an adjustment bracket; On one side of the hinge bracket facing the hinge cover, there is a first mounting hole. On both sides of the first mounting hole, there are a first overlapping surface and a second overlapping surface, and the height of the first overlapping surface is greater than the height of the second overlapping surface; The adjustment bracket is provided with a second mounting hole. The first mounting hole is opposite to the second mounting hole. The adjustment bracket includes a first bonding surface and a second bonding surface. The area of the first bonding surface is smaller than the area of the second bonding surface. The first bonding surface faces the first overlapping surface, and the second bonding surface faces the second overlapping surface. A fastener is provided in the first mounting hole and the second mounting hole, and the adjustment bracket is fixed to the hinge bracket through the fastener; The fastener and the side of the adjustment bracket away from the hinge bracket are bonded to the hinge cover through a colloid, and the colloid at least covers the second bonding surface.
2. The hinge mechanism according to claim 1, characterized in that, The hinge mechanism further includes a damping component provided on the hinge bracket; The first mounting hole and the damping component are arranged along the axial direction of the hinge mechanism, and the second overlapping surface is located on the side of the first overlapping surface away from the damping component.
3. The hinge mechanism according to claim 1, wherein, The adjustment bracket is a sheet-like structure, and the second mounting hole penetrates through the sheet-like structure; Alternatively, the adjustment bracket is a strip-like structure, and the second mounting holes are respectively opened in the two end regions of the strip-like structure.
4. The hinge mechanism according to claim 1, characterized in that, The fastener is a screw; The adjustment bracket is provided with a recessed portion, and the second mounting hole is opened in the recessed portion; The stud of the screw passes through the second mounting hole and is threadedly connected to the first mounting hole, and the nut of the screw abuts against the recessed portion.
5. The hinge mechanism according to claim 1, characterized in that, The hinge mechanism further includes a plurality of swing arm components distributed along the axial direction of the hinge mechanism; On one side of the hinge bracket facing the hinge cover, there are a plurality of dispensing bosses. The plurality of dispensing bosses are respectively bonded to the hinge cover through a colloid, and each dispensing boss is correspondingly arranged with each swing arm component.
6. The hinge mechanism according to claim 5, wherein An inclined guiding surface is provided at the connection between the end face and the side wall of the dispensing boss.
7. The hinge mechanism according to claim 1, wherein, The first overlapping surface and the second overlapping surface are located in the same inclined plane, and the inclined plane extends obliquely in the direction away from the hinge cover from the first overlapping surface to the second overlapping surface.
8. The hinge mechanism according to claim 1, wherein, The first overlapping surface and the second overlapping surface form a stepped surface.
9. The hinge mechanism according to claim 2, characterized in that, On both sides of the adjustment bracket along the width direction of the hinge mechanism, there are respectively provided baffles. Each baffle is provided with a fixing hole for passing through the rotating shaft of the hinge mechanism; On the end face of the adjustment bracket along the rotating shaft, there is a connecting column for sleeving the spring of the damping component, and the baffle is used to block the spring.
10. An electronic device, characterized in that, Comprising the hinge mechanism according to any one of claims 1 to 9.