Circuit board offset detection method, circuit board offset detection system, equipment and medium

Abstract

The invention discloses a circuit board offset detection method, a circuit board offset detection system, equipment and a medium, and the circuit board offset detection method comprises the steps: scanning a circuit board in a first scanning direction to obtain the position and contour of a detection mark on each layer of substrate of the circuit board, and generating a first detection pattern; splicing the first detection pattern of each layer of substrate to generate a first spliced pattern; acquiring a first preset detection pattern; and judging whether the first spliced pattern is consistent with the first preset detection pattern or not, and determining whether the substrates deviate or not during stacking. Therefore, by comparing the first splicing pattern with the first preset detection pattern, whether the multiple layers of substrates deviate or not during stacking is judged, a worker can select a processing mode of the circuit board according to a detection result, and whether the substrates of the circuit board deviate or not can be determined by using the circuit board deviation detection method before processing such as drilling of the circuit board. Therefore, the cutter can be prevented from machining the circuit board with the substrate deviating as much as possible, and defective products of the circuit board can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board offset detection method, a circuit board offset detection system, a computer device, and a computer-readable storage medium. Background Art

[0002] In the related art, in order to reduce the circuit volume and improve the integration of the circuit board, the existing circuit board is formed by stacking and bonding multiple layers of substrates. During the extrusion and bonding process of the substrates, relative sliding offsets are likely to occur between adjacent two layers of substrates along the radial direction of the circuit board, resulting in offsets of some substrates in the formed circuit board. Since this kind of offset is usually only a few micrometers, it is difficult for workers to detect such an offset. When the circuit board performs subsequent operations such as drilling, when the tool of equipment such as a drilling machine processes the offset substrate, due to the offset between the actual processing position of the tool and the preset processing position, the tool will damage the circuit on the offset substrate, thereby reducing the yield rate of the circuit board. Summary of the Invention

[0003] Before the circuit board is drilled or processed, in order to determine whether the substrate of the circuit board is offset, so as to try to prevent the tool from processing the offset circuit board of the substrate and reduce the generation of defective circuit boards, the present application proposes a circuit board offset detection method.

[0004] The present application further proposes a circuit board offset detection system.

[0005] The present application further proposes a computer device.

[0006] The present application further proposes a computer-readable storage medium.

[0007] A circuit board offset detection method provided by the present application adopts the following technical solution: A circuit board offset detection method includes: scanning the circuit board along a first scanning direction to obtain the positions and contours of detection marks on each layer of the substrate of the circuit board, and generating a first detection pattern of the detection marks, wherein the included angle between the first scanning direction and the upper end face of the circuit board is a first preset angle; splicing the first detection patterns of each layer of the substrate to generate a first combined pattern of multiple layers of the substrate; obtaining a first preset detection pattern of the circuit board; judging whether the first combined pattern is consistent with the first preset detection pattern, and judging whether there is an offset when multiple layers of the substrate are stacked according to the comparison result.

[0008] By adopting the above technical solution, by comparing the first combined pattern with the first preset detection pattern to determine whether there is an offset when multiple substrates are stacked, the staff can select the processing method for the circuit board according to the detection result. Before processing such as drilling the circuit board, the circuit board offset detection method can be used to determine whether the substrates of the circuit board are offset, so as to prevent the circuit board with offset substrates from being processed by the tool as much as possible, and further reduce the generation of defective circuit boards.

[0009] Preferably, determining whether there is an offset when multiple substrates are stacked according to the comparison result includes: if the first combined pattern is consistent with the first preset detection pattern, it is determined that there is no offset when multiple substrates are stacked; if the first combined pattern is inconsistent with the first preset detection pattern, it is determined that there is an offset when multiple substrates are stacked.

[0010] By adopting the above technical solution, the technical effect of determining whether there is an offset when multiple substrates are stacked can be achieved.

[0011] Preferably, after determining that there is an offset when multiple substrates are stacked, it further includes: comparing the first combined pattern with the first preset detection pattern to determine the first detection pattern that is offset in the first combined pattern; according to the offset first detection pattern, determining the layer number of the corresponding substrate, and generating substrate offset layer number information, where the substrate offset layer number information is used to indicate the layer number of the substrate in the circuit board where the stacking offset occurs.

[0012] By adopting the above technical solution, after generating the substrate offset layer number information, the substrate offset layer number information can be sent to the user or the processing device. After receiving the substrate offset layer number information, the user or the processing device can perform a rectification process on the circuit board to reduce the number of substrates with stacking offset in the circuit board.

[0013] Preferably, after determining the first detection pattern that is offset in the first combined pattern, it further includes: detecting the pattern offset amount of the offset first detection pattern, where the pattern offset amount includes a displacement offset amount and an angular offset amount; according to the pattern offset amount, determining the substrate offset amount of the substrate corresponding to the offset first detection pattern, and generating the substrate offset amount information of the substrate, where the substrate offset amount information is used to indicate the offset amount of the substrate.

[0014] By adopting the above technical solution, when the processing device receives the substrate offset amount information and processes the circuit board, the circuit board offset detection method can make the tool avoid the circuits on the offset substrate, and further improve the yield rate of the circuit board.

[0015] Preferably, the method for detecting the offset of the circuit board further includes: generating a processing offset instruction according to the substrate offset layer information and the substrate offset amount information, where the processing offset instruction is used to control the offset of the tool during the processing of the circuit board.

[0016] By adopting the above technical solution, the processing equipment can process the circuit board according to the processing offset instruction. When the processing equipment processes the substrate with the offset layer in the circuit board, the processing equipment can adjust the processing position between the tool and the substrate according to the substrate offset amount of the substrate, so that the tool can avoid the circuits etched on the substrate, thereby preventing the circuits on the substrate from being damaged and improving the yield of the circuit board.

[0017] Preferably, before scanning the circuit board along the first scanning direction to obtain the positions and contours of the detection marks on each layer of the substrate of the circuit board, it further includes: processing and forming the detection marks on each layer of the substrate, where the detection marks of any two layers of the substrate are spaced apart.

[0018] By adopting the above technical solution, by pre-processing and forming the detection marks on each layer of the substrate, when multiple layers of substrates are stacked and bonded in sequence to form a circuit board, the detection marks can be retained on the circuit board. By scanning the circuit board along the first scanning direction, the detection marks can be detected, so that the method for detecting the offset of the circuit board can be used to determine whether the substrates of each layer of the circuit board are stacked offset.

[0019] Moreover, by spacing apart the detection marks of any two layers of substrates, when using the method for detecting the offset of the circuit board to scan the circuit board along the first scanning direction, the first detection patterns formed by multiple detection marks can be avoided from overlapping with each other. In this way, it is convenient to identify the detection marks on each layer of the substrate when using the method for detecting the offset of the circuit board, and further the accuracy of detecting whether the substrates are stacked offset by using the method for detecting the offset of the circuit board can be improved.

[0020] Preferably, the processing and forming the detection marks on each layer of the substrate includes: drilling and milling to form the detection marks on the substrate, or printing and dyeing to form the detection marks on the substrate, or pasting the detection marks on the substrate, or coating the detection marks configured as fluorescent indicators on the substrate.

[0021] By adopting the above technical solution, through the drilling and milling process of the substrate, marking holes or marking grooves can be formed on the surface of the substrate, and the marking holes or marking grooves can be used as detection marks. By printing a pattern on the substrate, the pattern can be used as a detection mark. By pre-making a detection mark and then pasting the detection mark on the substrate, and by means of perspective scanning the circuit board, etc., the circuit board offset detection method can be used to detect the detection mark. By coating a fluorescent indicator on the substrate, when the circuit board is irradiated with light of an appropriate wavelength, the fluorescent indicator can emit fluorescence after absorbing the light, and the circuit board offset detection method can identify the fluorescent indicator by detecting the fluorescence, so that the position and contour of the detection mark can be obtained.

[0022] Preferably, each layer of the substrate is provided with one of the detection marks, or each layer of the substrate is provided with a plurality of the detection marks, and the plurality of detection marks are sequentially spaced apart along the circumferential direction of the substrate.

[0023] By adopting the above technical solution, by providing one detection mark on each layer of the substrate, the processing cost of the substrate can be minimized, and the detection cost of detecting the circuit board using the circuit board offset detection method can also be reduced. By providing a plurality of spaced-apart detection marks on each layer of the substrate, when the plurality of detection marks on each layer of the substrate all match the corresponding pattern features in the first preset detection pattern, it can be determined that there is no offset when the substrates are stacked, so that the accuracy of using the circuit board offset detection method to detect whether the substrates are stacked offset can be further improved.

[0024] Preferably, after it is determined that there is no offset when the multiple layers of substrates are stacked, it further includes: scanning the circuit board along a second scanning direction to obtain the positions and contours of the detection marks on each layer of the substrate of the circuit board, generating a second detection pattern of the detection marks, wherein the angle between the second scanning direction and the upper end surface of the circuit board is a second preset angle, and there is an angle between the first scanning direction and the second scanning direction; splicing the second detection patterns of each layer of the substrate to generate a second combined pattern of the multiple layers of the substrate; obtaining the second preset detection pattern of the circuit board; determining whether the second combined pattern is consistent with the second preset detection pattern, and judging whether the stacking order of the multiple layers of the substrate is correct according to the comparison result.

[0025] By adopting the above technical solution, the method for detecting the offset of the circuit board is used to determine whether the stacking order of the substrates is incorrect when stacking the substrates. When it is determined that the stacking order of the substrates is correct, the circuit board can be processed normally. For example, operations such as drilling the circuit board can be performed. When it is determined that the stacking order of the substrates is incorrect, the staff or the production equipment can choose to adjust the circuit board with the offset substrate. For example, the staff or the production equipment can scrap the circuit board with the offset substrate, or the staff or the production equipment can correct the deviation of the circuit board with the offset substrate. The staff or the processing equipment can select the processing method for the circuit board according to the detection result, which can reduce the generation of defective circuit boards.

[0026] Preferably, determining whether the stacking order of the multiple substrates is correct according to the comparison result includes: when the second combined pattern is consistent with the second preset detection pattern, determining that the stacking order of the multiple substrates is correct; when the second combined pattern is inconsistent with the second preset detection pattern, determining that the stacking order of the multiple substrates is incorrect.

[0027] By adopting the above technical solution, the technical effect of judging whether the stacking order of the multiple substrates is incorrect can be achieved.

[0028] Preferably, after determining that the stacking order of the multiple substrates is incorrect, it further includes: comparing the second combined pattern with the second preset detection pattern to determine the offset second detection pattern in the second combined pattern; according to the offset second detection pattern, determining the layer where the corresponding substrate is located, and generating substrate stacking error layer information, where the substrate stacking error layer information is used to indicate the layer of the substrate with incorrect stacking order in the circuit board.

[0029] By adopting the above technical solution, after generating the substrate stacking error layer information, the substrate stacking error layer information can be sent to the user or the processing device, and the user or the processing device can correct the deviation of the circuit board after receiving the substrate stacking error layer information.

[0030] A circuit board offset detection system provided by the present application adopts the following technical solution: A circuit board offset detection system includes: a scanning module for scanning the circuit board at a first preset angle to obtain the positions and contours of the detection marks on each layer of the substrate of the circuit board; an image generation module for generating a first detection pattern of the detection marks, and also for splicing the first detection patterns of each layer of the substrate to generate a first combined pattern of the multiple substrates; a judgment module for obtaining the first preset detection pattern of the circuit board, and also for comparing the first combined pattern with the first preset detection pattern, and judging whether the multiple substrates are offset when stacked according to the comparison result.

[0031] By adopting the above technical solution, for the circuit board offset detection system according to the embodiments of the present application, the judgment module compares the first combined pattern with the first preset detection pattern to determine whether there is an offset when the multi-layer substrates are stacked. Workers or processing equipment can select the processing method for the circuit board according to the detection result. Before the circuit board is processed such as drilled, the circuit board offset detection system can determine whether the substrate of the circuit board is offset, so as to prevent as much as possible the circuit board with an offset substrate from being processed by the tool, and thus reduce the generation of defective circuit boards.

[0032] A computer device provided by the present application adopts the following technical solution: A computer device includes a memory, a processor, and a circuit board offset detection program stored in the memory and executable on the processor. When the processor executes the circuit board offset detection program, the above-mentioned circuit board offset detection method is implemented.

[0033] By adopting the above technical solution, before the circuit board is processed by processing methods such as drilling, when the stored circuit board offset detection program is executed by the processor, it can be determined whether the substrate of the circuit board is offset, so as to prevent as much as possible the circuit board with an offset substrate from being processed by the tool, and thus reduce the generation of defective circuit boards.

[0034] A computer-readable storage medium provided by the present application adopts the following technical solution: A computer-readable storage medium stores a circuit board offset detection program, and when the circuit board offset detection program is executed by a processor, the above-mentioned circuit board offset detection method is implemented.

[0035] By adopting the above technical solution, before the circuit board is processed by processing methods such as drilling, when the stored circuit board offset detection program is executed by the processor, it can be determined whether the substrate of the circuit board is offset, so as to prevent as much as possible the circuit board with an offset substrate from being processed by the tool, and thus reduce the generation of defective circuit boards.

[0036] In summary, the present application includes at least one of the following beneficial technical effects: 1. By comparing the first combined pattern with the first preset detection pattern to determine whether there is an offset when the multi-layer substrates are stacked, workers can select the processing method for the circuit board according to the detection result. Before the circuit board is processed such as drilled, the circuit board offset detection method can be used to determine whether the substrate of the circuit board is offset, so as to prevent as much as possible the circuit board with an offset substrate from being processed by the tool, and thus reduce the generation of defective circuit boards; 2. The processing equipment can process the circuit board according to the processing offset instruction. When the processing equipment processes to the substrate of the offset layer in the circuit board, the processing equipment can adjust the processing position between the tool and the substrate according to the substrate offset amount of the substrate, so that the tool can avoid the circuits etched on the substrate, thereby preventing the circuits on the substrate from being damaged and improving the yield rate of the circuit board. 3. By using the circuit board offset detection method to determine whether the stacking order is incorrect when stacking substrates. When it is determined that the stacking order of the substrates is correct, the circuit board can be processed normally. For example, operations such as drilling the circuit board can be performed. When it is determined that the stacking order of the substrates is incorrect, the staff or the production equipment can choose to perform adjustment processing on the circuit board with the offset substrate. For example, the staff or the production equipment can scrap the circuit board with the offset substrate, or the staff or the production equipment can perform rectification processing on the circuit board with the offset substrate. The staff or the processing equipment can select the processing method for the circuit board according to the detection result, which can reduce the generation of defective circuit boards. Description of the Drawings

[0037] Figure 1 is a flowchart of the circuit board offset detection method according to an embodiment of the present application; Figure 2 is a schematic diagram of detecting a circuit board using the circuit board offset detection method according to an embodiment of the present application; Figure 3 is a top view of a circuit board applicable to the circuit board offset detection method according to an embodiment of the present application; Figure 4 is a block diagram of the circuit board offset detection system according to an embodiment of the present application; Figure 5 is a block diagram of a processor, a memory, a communication interface, and a communication bus according to an embodiment of the present application.

[0038] Description of the Reference Numerals: 100, circuit board; 10, substrate; 20, detection mark; 200, circuit board offset detection system; 30, scanning module; 40, image generation module; 50, judgment module; 1201, processor; 1202, communication interface; 1203, memory; 1204, communication bus. Detailed Embodiment

[0039] The following Figures 1-5 further describes the present application in detail.

[0040] Refer to Figures 1-3 , an embodiment of the present application discloses a circuit board offset detection method. SeeFigures 2-3 , the circuit board 100 has a multi-layer substrate 10, and the circuit board offset detection method is used to detect whether the multi-layer substrate 10 is offset in the radial direction of the circuit board 100 during adhesive stacking.

[0041] See Figure 1 , the circuit board offset detection method according to the embodiment of the present application includes the following steps: S1. Scan the circuit board 100 along a first scanning direction to obtain the positions and contours of the detection marks 20 on each layer of the substrate 10 of the circuit board 100, and generate a first detection pattern of the detection marks 20, wherein the angle between the first scanning direction and the upper end surface of the circuit board 100 is a first preset angle. As Figure 2 shown, the magnitude of the angle between the first scanning direction and the upper end surface of the circuit board 100 can be α. The first preset angle can be a fixed value. In some preferred embodiments, the first preset angle can be 90°, that is, the first scanning direction is perpendicular to the upper end surface of the circuit board 100. Of course, the first preset angle can also be set by the staff themselves. For example, the first preset angle can be 30°, 45°, 50°, or 60°, etc.

[0042] Scanning the circuit board 100 can be achieved by detection components such as a CCD (Charge Coupled Device) camera or an infrared sensor. The detection marks 20 on each layer of the substrate 10 can be set on the substrate 10 during the processing of the substrate 10, and the detection marks 20 are set at preset detection positions on the substrate 10. The detection component can detect the detection marks 20 by scanning the preset detection positions of the substrate 10. It can also be understood that the first detection pattern is the projection of the detection marks 20 along the first scanning direction. In some specific embodiments, the detection marks 20 are arranged close to the edge of the substrate 10. In other embodiments, the detection marks 20 are arranged close to the center of the substrate 10. The specific setting position of the detection marks 20 can be set according to the circuit structure etched on the substrate 10.

[0043] S2. Stitch the first detection patterns of each layer of the substrate 10 to generate a first stitched pattern of the multi-layer substrate 10. Among them, the spacing distance and angle between any two first detection patterns in the first stitched pattern are the same as the spacing distance and angle between the detection marks 20 on the corresponding two substrates 10, so that the position of each first detection pattern in the first stitched pattern corresponds to the position of the corresponding detection mark 20 on the substrate 10.

[0044] S3. Obtain the first preset detection pattern of the circuit board 100. It should be noted that the first preset detection pattern is the standard stitching pattern generated by projecting the detection mark 20 along the first scanning direction during the design of the circuit board 100. It can also be understood that when multiple substrates 10 in the circuit board 100 are stacked in sequence, the first detection pattern formed by scanning the circuit board 100 along the first scanning direction when each substrate 10 has not shifted is the first preset detection pattern.

[0045] S4. Determine whether the first stitching pattern is consistent with the first preset detection pattern, and judge whether there is a shift when the multi-layer substrates 10 are stacked according to the comparison result. Among them, by overlapping and comparing the first stitching pattern with the first preset detection pattern, the circuit board offset detection method can be used to determine whether the first stitching pattern is consistent with the first preset detection pattern, so that it can be determined whether there is a shift when the substrates 10 are stacked according to the consistency between the first stitching pattern and the first preset detection pattern.

[0046] By using the circuit board offset detection method to determine whether there is a shift when the substrates 10 are stacked, when it is determined that there is no shift in the stacking of the substrates 10, the circuit board 100 can be normally processed. For example, operations such as drilling can be performed on the circuit board 100. When it is determined that there is a shift in the stacking of the substrates 10, the staff or the production equipment can choose to adjust the circuit board 100 with the offset substrate 10. For example, the staff or the production equipment can scrap the circuit board 100 with the offset substrate 10, or the staff or the production equipment can correct the circuit board 100 with the offset substrate 10. In this way, it can be ensured that the cutting tool of equipment such as a drilling machine does not contact the circuit on the offset substrate 10. Thus, the staff or the processing equipment can select the processing method for the circuit board 100 according to the detection result, which can reduce the generation of defective products of the circuit board 100.

[0047] Further, judging whether there is a shift when the multi-layer substrates 10 are stacked according to the comparison result includes the following steps: S101. If the first stitching pattern is consistent with the first preset detection pattern, it is determined that there is no shift when the multi-layer substrates 10 are stacked. That is to say, if the first stitching pattern is consistent with the first preset detection pattern, at this time, the projections of the detection marks 20 on each substrate 10 along the first scanning direction coincide with the corresponding pattern features of the standard stitching pattern, and the spacing distance and included angle between the detection marks 20 on any two substrates 10 meet the design requirements. Correspondingly, the actual relative positions between any two substrates 10 meet the design requirements, and further it can be determined that there is no shift when the multi-layer substrates 10 are stacked.

[0048] S102. If the first stitched pattern is inconsistent with the first preset detection pattern, it is determined that the multi-layer substrate 10 is offset during stacking. That is to say, if the first stitched pattern is inconsistent with the first preset detection pattern, at this time, the projection of the detection mark 20 on at least one substrate 10 along the first scanning direction does not coincide with the corresponding pattern feature of the standard stitched pattern, and the spacing distance and included angle between the detection marks 20 on at least two substrates 10 do not meet the design requirements. Correspondingly, the actual relative position between at least two substrates 10 does not meet the design requirements, and thus it can be determined that at least one layer of the substrate 10 is offset during stacking.

[0049] In some embodiments of the present application, after determining that the multi-layer substrate 10 is offset during stacking, the following steps may further be included: S201. Compare the first stitched pattern with the first preset detection pattern to determine the first detection pattern that is offset in the first stitched pattern. Among them, by overlapping and comparing the first stitched pattern with the first preset detection pattern, the first detection pattern in the first stitched pattern is compared with the corresponding pattern features in the first preset detection pattern one by one. When there is a dislocation between the first detection pattern and the corresponding pattern feature, the first detection pattern that is offset in the first stitched pattern can be determined.

[0050] S202. According to the offset first detection pattern, determine the layer number where the corresponding substrate 10 is located, and generate substrate offset layer number information, which is used to indicate the layer number of the substrate 10 that is stacked and offset in the circuit board 100. Specifically, by determining the first detection pattern that is offset in the first stitched pattern, the computer device can find the detection mark 20 corresponding to the first detection pattern, and then the circuit board offset detection method can be used to find and determine the layer number where the corresponding substrate 10 is located according to the detection mark 20.

[0051] After generating the substrate offset layer number information, the substrate offset layer number information can be sent to the user or the processing device. After receiving the substrate offset layer number information, the user or the processing device can perform a rectification process on the circuit board 100. For example, the user can control the processing device to remove the offset substrate 10, and the user can control the processing device to reattach the same substrate 10 as the offset substrate 10 on the circuit board 100 being processed, so as to achieve the rectification of the substrate 10, and thus improve the yield rate of the circuit board 100. Of course, after receiving the substrate offset layer number information, the processing device can also automatically process the circuit board 100 according to the substrate offset layer number information to reduce the number of substrates 10 with stacking offset in the circuit board 100.

[0052] In some embodiments of the present application, after determining the first detection pattern that is offset in the first stitched pattern, the following steps may further be included: S301. Detect the pattern offset of the first detected pattern with offset, where the pattern offset includes a displacement offset and an angular offset. It should be noted that the displacement offset of the first detected pattern with offset is the displacement difference between the first detected pattern with offset and the corresponding pattern feature in the first preset detected pattern, and the angular offset of the first detected pattern with offset is the angular difference between the first detected pattern with offset and the corresponding pattern feature in the first preset detected pattern.

[0053] S302. Determine the substrate offset of the substrate 10 corresponding to the first detected pattern with offset according to the pattern offset, and generate substrate offset information of the substrate 10, where the substrate offset information is used to indicate the offset of the substrate 10. Among them, the staff or computer device can receive the substrate offset information, and the staff or computer device can adjust the processing equipment according to the substrate offset information, so that the processing equipment can avoid the circuits on the offset substrate 10 when processing the circuit board 100, thereby improving the yield rate of the circuit board 100. Of course, the present application is not limited to this. For example, the staff or computer device can also adjust the processing equipment according to the substrate offset information, and the processing equipment can accurately calibrate the position of the offset substrate 10, which can reduce the number of offset substrates 10 in the circuit board 100, thereby improving the yield rate of the circuit board 100.

[0054] Further, the circuit board offset detection method may further include the following steps: S401. Generate a processing offset instruction according to the substrate offset layer information and the substrate offset information, where the processing offset instruction is used for the offset of the tool when processing the circuit board 100.

[0055] In some specific embodiments, after the computer device obtains the substrate offset layer information and the substrate offset information, the computer device can generate and send a processing offset instruction to the processing equipment. The processing equipment (such as a drilling machine, etc.) processes the circuit board 100 according to the processing offset instruction. For example, when the processing equipment processes to the substrate 10 of the offset layer in the circuit board 100, the processing equipment can adjust the processing position between the tool and the substrate 10 according to the substrate offset of the substrate 10, so that the tool can avoid the circuits etched on the substrate 10, thereby preventing the circuits on the substrate 10 from being damaged and improving the yield rate of the circuit board 100.

[0056] In some other embodiments, the circuit board offset detection method may further include the following steps: S402. Determine whether the substrate offset of the substrate 10 is within the corresponding preset offset range. Among them, the preset offset range can be set according to the circuit layout diagram of each layer of the substrate 10 in the circuit board 100.

[0057] S403. If the substrate offset of the substrate 10 is within the preset offset range, a circuit board processing instruction is generated for processing the circuit board 100. The circuit board processing instruction can be sent to a processing device (such as a drilling machine, etc.). After receiving the circuit board processing instruction, the processing device can process the circuit board 100. When the substrate offset of the substrate 10 is within the preset offset range, the processing device will not touch the circuit on the substrate 10 when processing the circuit board 100, that is, the stacking offset of the substrate 10 will not affect the processing of the circuit board 100. At this time, the processing device can normally process the circuit board 100.

[0058] S404. If the substrate offset of the substrate 10 exceeds the preset offset range, a processing offset instruction is generated according to the substrate offset layer information and the substrate offset amount information. The processing offset instruction is used to control the offset of the tool during the processing of the circuit board 100. When the substrate offset of the substrate 10 exceeds the preset offset range, the processing device will touch the circuit on the substrate 10 when processing the circuit board 100, that is, the stacking offset of the substrate 10 will affect the processing of the circuit board 100. At this time, the processing device can adjust the processing position between the tool and the substrate 10 according to the substrate offset of the substrate 10, so as to avoid the etched circuit on the substrate 10, and further prevent the circuit on the substrate 10 from being damaged, improving the yield rate of the circuit board 100.

[0059] In some embodiments of the present application, before scanning the circuit board 100 along the first scanning direction to obtain the positions and contours of the detection marks 20 on each layer of the substrate 10 of the circuit board 100, the following steps are further included: S501. Detection marks 20 are processed and formed on each layer of the substrate 10, and the detection marks 20 of any two adjacent layers of the substrate 10 are spaced apart.

[0060] By pre-processing and forming the detection marks 20 on each layer of the substrate 10, when the multiple layers of the substrate 10 are stacked and bonded in sequence to form the circuit board 100, the detection marks 20 can be retained on the circuit board 100. By scanning the circuit board 100 along the first scanning direction, the detection marks 20 can be detected, so that the circuit board offset detection method can be used to determine whether the substrates 10 of each layer of the circuit board 100 are stacked offset.

[0061] Moreover, by spacing apart the detection marks 20 of any two adjacent layers of the substrate 10, when scanning the circuit board 100 along the first scanning direction using the circuit board offset detection method, the first detection patterns formed by multiple detection marks 20 can be avoided from overlapping with each other. In this way, it is convenient to identify the detection marks 20 on each layer of the substrate 10 when using the circuit board offset detection method, and further improve the accuracy of detecting whether the substrates 10 are stacked offset when using the circuit board offset detection method.

[0062] Further, a detection mark 20 is formed on each layer of the substrate 10, including: milling and drilling on the substrate 10 to form the detection mark 20, or printing and dyeing on the substrate 10 to form the detection mark 20, or pasting the detection mark 20 on the substrate 10, or coating the detection mark 20 configured as a fluorescent indicator on the substrate 10.

[0063] Among them, by milling and drilling the substrate 10, a marking hole or a marking groove can be formed on the surface of the substrate 10. The marking hole or the marking groove can be used as the detection mark 20. A CCD (Charge Coupled Device) camera can identify the marking hole or the marking groove to obtain the position and contour of the detection mark 20.

[0064] By printing and dyeing a pattern on the substrate 10, the pattern can be used as the detection mark 20. By irradiating the circuit board 100 with light, the CCD camera can identify the pattern to obtain the position and contour of the detection mark 20.

[0065] By prefabricating the detection mark 20 and then pasting the detection mark 20 on the substrate 10, by means of perspective scanning the circuit board 100 and the like, the detection mark 20 can be detected by using the circuit board offset detection method, and the position and contour of the detection mark 20 on the substrate 10 can be determined by using the circuit board offset detection method.

[0066] By coating a fluorescent indicator on the substrate 10, when the circuit board 100 is irradiated with light of an appropriate wavelength, the fluorescent indicator can emit fluorescence after absorbing the light. The circuit board offset detection method can detect the fluorescence to identify the fluorescent indicator, so as to obtain the position and contour of the detection mark 20. Thus, by adopting the above method, the detection mark 20 can be formed on the substrate 10, so that the circuit board offset detection method can be used to detect the detection mark 20 to determine whether the substrate 10 is offset during stacking.

[0067] Further, in some embodiments, along the first scanning direction, the shape of the detection mark 20 on the substrate 10 can be one or a combination of a circle, an arc or a polygon, and the shape of the first splicing pattern formed on the circuit board 100 can be one or a combination of a circle, a concentric circle, an arc or a polygon. By setting the detection mark 20 with an appropriate shape on the substrate 10, it is helpful to more easily judge whether the substrate 10 is stacked and offset by using the circuit board offset detection method.

[0068] In some embodiments of the present application, each layer of the substrate 10 is provided with one detection mark 20, or each layer of the substrate 10 is provided with multiple detection marks 20, and the multiple detection marks 20 are sequentially spaced apart along the circumferential direction of the substrate 10. By providing one detection mark 20 on each layer of the substrate 10, the processing cost of the substrate 10 can be minimized, and the detection cost of detecting the circuit board 100 by using the circuit board offset detection method can also be reduced. By providing multiple mutually spaced detection marks 20 on each layer of the substrate 10, when the multiple detection marks 20 on each layer of the substrate 10 all match the corresponding pattern features in the first preset detection pattern, it can be determined that there is no offset when the substrates 10 are stacked, thereby further improving the accuracy of detecting whether the substrates 10 are stacked offset by using the circuit board offset detection method.

[0069] In some embodiments of the present application, after it is determined that there is no offset when the multiple layers of substrates 10 are stacked, the circuit board offset detection method may further include the following steps: S5. Scan the circuit board 100 along the second scanning direction to obtain the positions and contours of the detection marks 20 on each layer of the substrate 10 of the circuit board 100, and generate a second detection pattern of the detection marks 20, wherein the included angle between the second scanning direction and the upper end surface of the circuit board 100 is a second preset angle, and there is an included angle between the first scanning direction and the second scanning direction. As Figure 2 shown, the magnitude of the included angle between the second scanning direction and the upper end surface of the circuit board 100 may be β. The second preset angle may be a fixed value. The second preset angle may also be set by the staff themselves. For example, the second preset angle may be 30°, 45°, 50° or 60°, etc., and satisfies the relationship: α≠β.

[0070] S6. Stitch the second detection patterns of each layer of the substrate 10 to generate a second stitched pattern of the multiple layers of substrates 10. Specifically, since each layer of the substrate 10 has a thickness, the detection marks 20 on each layer of the substrate 10 are sequentially spaced apart along the thickness direction of the circuit board 100. When the circuit board 100 is scanned along different scanning directions, the stitched patterns formed by the circuit board 100 are different. By scanning the circuit board 100 along the second scanning direction, a second stitched pattern different from the first stitched pattern can be obtained.

[0071] S7. Obtain the second preset detection pattern of the circuit board 100. It should be noted that the second preset detection pattern is a standard stitched pattern generated by projecting the detection marks 20 along the second scanning direction during the design of the circuit board 100. It can also be understood that when multiple substrates 10 in the circuit board 100 are sequentially stacked, and each layer of the substrate 10 does not shift and the stacking order of each layer of the substrate 10 is correct, the second detection pattern formed by scanning the circuit board 100 along the second scanning direction is the second preset detection pattern.

[0072] S8. Determine whether the second combined pattern is consistent with the second preset detection pattern, and judge whether the stacking order of the multi-layer substrate 10 is correct according to the comparison result. Among them, by overlapping and comparing the second combined pattern with the second preset detection pattern, the circuit board offset detection method can be used to determine whether the second combined pattern is consistent with the second preset detection pattern, so that it can be determined whether the stacking order is incorrect when the substrate 10 is stacked according to the consistency between the second combined pattern and the second preset detection pattern.

[0073] By using the circuit board offset detection method to determine whether the stacking order of the substrate 10 is incorrect, when it is determined that the stacking order of the substrate 10 is correct, the circuit board 100 can be normally processed. For example, operations such as drilling can be performed on the circuit board 100. When it is determined that the stacking order of the substrate 10 is incorrect, the staff or the production equipment can choose to adjust the circuit board 100 with the offset substrate 10. For example, the staff or the production equipment can scrap the circuit board 100 with the offset substrate 10, or the staff or the production equipment can correct the deviation of the circuit board 100 with the offset substrate 10. Thus, the staff or the processing equipment can select the processing method for the circuit board 100 according to the detection result, which can reduce the generation of defective products of the circuit board 100.

[0074] Furthermore, judging whether the stacking order of the multi-layer substrate 10 is correct according to the comparison result includes: S601. When the second combined pattern is consistent with the second preset detection pattern, it is determined that the stacking order of the multi-layer substrate 10 is correct. Specifically, when the multi-layer substrate 10 is stacked without offset and the stacking order of the multi-layer substrate 10 is correct, the combined pattern obtained by scanning the circuit board 100 in any direction is consistent with the preset detection pattern in the corresponding direction. If the second combined pattern is consistent with the second preset detection pattern, at this time, the detection marks 20 on each substrate 10 are all at the correct height position along the thickness direction of the circuit board 100. Correspondingly, the actual relative positions between any two substrates 10 meet the design requirements, and thus it can be determined that the stacking order of the multi-layer substrate 10 is correct.

[0075] S602. When the second combined pattern is inconsistent with the second preset detection pattern, it is determined that the stacking order of the multi-layer substrate 10 is incorrect. That is to say, if the second combined pattern is inconsistent with the second preset detection pattern, at this time, the projection of the detection mark 20 on at least one substrate 10 along the second scanning direction does not coincide with the corresponding pattern feature of the standard combined pattern. At this time, the detection mark 20 on at least one substrate 10 is at the wrong height position along the thickness direction of the circuit board 100. Correspondingly, the actual relative positions between at least two substrates 10 do not meet the design requirements, and thus it can be determined that the stacking order of at least one substrate 10 is incorrect.

[0076] In some embodiments of the present application, after determining that the stacking order of the multi-layer substrate 10 is incorrect, the circuit board offset detection method may further include the following steps: S701. Compare the second stitched pattern with the second preset detection pattern to determine the second detection pattern that is offset in the second stitched pattern. By overlapping and comparing the second stitched pattern with the second preset detection pattern, the second detection pattern in the second stitched pattern is compared with the corresponding pattern features in the second preset detection pattern one by one. When there is a misalignment between the second detection pattern and the corresponding pattern feature, the second detection pattern that is offset in the second stitched pattern can be determined.

[0077] S702. According to the offset second detection pattern, determine the layer where the corresponding substrate 10 is located, and generate substrate stacking error layer information, which is used to indicate the layer of the substrate 10 with an incorrect stacking order in the circuit board 100.

[0078] Specifically, by determining the second detection pattern that is offset in the second stitched pattern, the computer device can find the detection mark 20 corresponding to the second detection pattern, and then the circuit board offset detection method can be used to find and determine the layer where the corresponding substrate 10 is located according to the detection mark 20.

[0079] After generating the substrate stacking error layer information, the substrate stacking error layer information can be sent to the user or the processing device. After receiving the substrate stacking error layer information, the user or the processing device can perform a rectification process on the circuit board 100. For example, the user can control the processing device to remove the offset substrate 10, and the user can control the processing device to re-stack the substrate 10 in the correct stacking order, so as to realize the rectification of the substrate 10, and further improve the yield rate of the circuit board 100. Of course, after receiving the substrate stacking error layer information, the processing device can also automatically process the circuit board 100 according to the substrate stacking error layer information to reduce the number of substrates 10 with an incorrect stacking order in the circuit board 100.

[0080] The present application further discloses a circuit board offset detection system 200. Refer to Figure 4 , according to the circuit board offset detection system 200 described in the embodiments of the present application, the circuit board offset detection system 200 corresponds to the circuit board offset detection method described in the above embodiments. The circuit board offset detection system 200 includes: a scanning module 30, an image generation module 40, and a judgment module 50. The scanning module 30 is used to scan the circuit board 100 along the first scanning direction to obtain the positions and contours of the detection marks 20 on each layer of the substrate 10 of the circuit board 100.

[0081] The image generation module 40 is used to generate a first detection pattern for detecting the detection mark 20, and is also used to splice the first detection patterns of each layer of the substrate 10 to generate a first combined pattern of the multi-layer substrate 10. The judgment module 50 is used to obtain a first preset detection pattern of the circuit board 100, and is also used to compare the first combined pattern with the first preset detection pattern, and judge whether there is an offset when the multi-layer substrate 10 is stacked according to the comparison result. Among them, the scanning module 30, the image generation module 40, and the judgment module 50 are respectively used to implement some steps of the circuit board offset detection method in the above embodiments. The scanning module 30, the image generation module 40, and the judgment module 50 cooperate with each other to implement the circuit board offset detection method in the above embodiments.

[0082] Thus, according to the circuit board offset detection system 200 described in the embodiments of the present application, the judgment module 50 compares the first combined pattern with the first preset detection pattern to judge whether there is an offset when the multi-layer substrate 10 is stacked. Workers or processing equipment can select a processing method for the circuit board 100 according to the detection result. Before the circuit board 100 is processed such as drilling, the circuit board offset detection system 200 can determine whether the substrate 10 of the circuit board 100 is offset, so as to prevent as much as possible the circuit board 100 with the substrate 10 offset by the tool, and further reduce the generation of defective products of the circuit board 100.

[0083] Based on this, the present application further discloses a computer device. According to the computer device described in the embodiments of the present application, it includes a memory 1203, a processor 1201, and a circuit board offset detection program stored on the memory 1203 and executable on the processor 1201. When the processor 1201 executes the circuit board offset detection program, the circuit board offset detection method described in the above embodiments is implemented.

[0084] According to the computer device described in the embodiments of the present application, by the processor 1201 executing the circuit board offset detection program stored on the memory 1203, before the circuit board 100 is processed by processing methods such as drilling, when the stored circuit board offset detection program is executed by the processor 1201, it can be determined whether the substrate 10 of the circuit board 100 is offset, so as to prevent as much as possible the circuit board 100 with the substrate 10 offset by the tool, and further reduce the generation of defective products of the circuit board 100.

[0085] Based on this, the present application further discloses a computer-readable storage medium. According to the computer-readable storage medium described in the embodiments of the present application, a circuit board offset detection program is stored thereon, and when the circuit board offset detection program is executed by the processor 1201, the circuit board offset detection method described in the above embodiments is implemented.

[0086] According to the computer-readable storage medium described in the embodiments of the present application, before the circuit board 100 is processed by means such as drilling, when the stored circuit board offset detection program is executed by the processor 1201, it is possible to determine whether the substrate 10 of the circuit board 100 is offset, so as to prevent as much as possible the circuit board 100 with the substrate 10 offset during tool processing, and further reduce the generation of defective products of the circuit board 100.

[0087] As Figure 5 shown, the computer device includes at least one processor 1201, at least one communication interface 1202, at least one memory 1203, and at least one communication bus 1204; in the embodiments of the present invention, the number of the processor 1201, the communication interface 1202, the memory 1203, and the communication bus 1204 is at least one, and the processor 1201, the communication interface 1202, and the memory 1203 complete mutual communication through the communication bus 1204.

[0088] Among them, the memory 1203 can be, but is not limited to, a random access memory (Random Access Memory, RAM), a read-only memory (Read Only Memory, ROM), a programmable read-only memory (Programmable Read-Only Memory, PROM), an erasable programmable read-only memory (Erasable Programmable Read-Only Memory, EPROM), an electrically erasable programmable read-only memory (Electric Erasable Programmable Read-Only Memory, EEPROM), etc. Among them, the memory 1203 is used to store a program, and after receiving an execution instruction, the processor 1201 executes the program to implement the steps of the air conditioner control method described in the above embodiments.

[0089] The processor 1201 may be an integrated circuit chip with signal processing capabilities. The above-mentioned processor may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU), a network processor (Network Processor, NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. It can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0090] It should be noted that the logic and / or steps represented in the flowchart or described in other ways herein, for example, can be considered as a definite sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or in combination with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in combination with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connection parts with one or more wirings (electronic devices), portable computer disk cartridges (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber devices, and portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other suitable processing as necessary, and then storing it in a computer memory.

[0091] It should be understood that various parts of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above-described embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application-specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0092] The above are all the preferred embodiments of this application, and do not limit the protection scope of this application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A method for detecting circuit board offset, characterized in that, Including: Scanning the circuit board along a first scanning direction to obtain the positions and contours of detection marks on each layer of substrate of the circuit board, and generating a first detection pattern of the detection marks, wherein the included angle between the first scanning direction and the upper end surface of the circuit board is a first preset angle; Stitching the first detection patterns of each layer of the substrate to generate a first stitched pattern of multiple layers of the substrate; Obtaining a first preset detection pattern of the circuit board; Judging whether the first stitched pattern is consistent with the first preset detection pattern, and judging whether there is an offset when multiple layers of the substrate are stacked according to the comparison result.

2. The method for detecting the offset of a circuit board according to claim 1, wherein The judging whether there is an offset when multiple layers of the substrate are stacked according to the comparison result includes: If the first stitched pattern is consistent with the first preset detection pattern, determining that there is no offset when multiple layers of the substrate are stacked; If the first stitched pattern is inconsistent with the first preset detection pattern, determining that there is an offset when multiple layers of the substrate are stacked.

3. The method for detecting the offset of a circuit board according to claim 2, wherein, After determining that there is an offset when multiple layers of the substrate are stacked, it further includes: Comparing the first stitched pattern with the first preset detection pattern to determine the first detection pattern with an offset in the first stitched pattern; According to the first detection pattern with an offset, determining the layer number of the corresponding substrate, and generating substrate offset layer number information, where the substrate offset layer number information is used to indicate the layer number of the substrate with a stacking offset in the circuit board.

4. A circuit board offset detection method according to claim 3, characterized in that, After determining the first detection pattern with an offset in the first stitched pattern, it further includes: Detecting the pattern offset amount of the first detection pattern with an offset, where the pattern offset amount includes a displacement offset amount and an angle offset amount; According to the pattern offset amount, determining the substrate offset amount of the substrate corresponding to the first detection pattern with an offset, and generating substrate offset amount information of the substrate, where the substrate offset amount information is used to indicate the offset amount of the substrate.

5. A circuit board deviation detection method according to claim 4, characterized in that: It further includes: Generating a processing offset instruction according to the substrate offset layer number information and the substrate offset amount information, where the processing offset instruction is used to control the offset of the tool during the processing of the circuit board.

6. The method for detecting circuit board offset according to claim 1, wherein Before scanning the circuit board along the first scanning direction to obtain the positions and contours of detection marks on each layer of substrate of the circuit board, it further includes: Processing and forming the detection marks on each layer of the substrate, where the detection marks of any two layers of the substrate are arranged at intervals.

7. A circuit board deviation detection method according to claim 6, characterized in that: The processing and forming the detection marks on each layer of the substrate includes: Drilling and milling on the substrate to form the detection marks, or Printing and dyeing on the substrate to form the detection marks, or Pasting the detection marks on the substrate, or Coating the detection marks configured as fluorescent indicators on the substrate.

8. A method for detecting circuit board offset according to claim 1, characterized in that One detection mark is provided on each layer of the substrate, or Multiple detection marks are provided on each layer of the substrate, and the multiple detection marks are sequentially arranged at intervals along the circumferential direction of the substrate.

9. A method for detecting circuit board offset according to claim 1, characterized in that, After determining that there is no offset when multiple layers of the substrate are stacked, it further includes: Scanning the circuit board along a second scanning direction to obtain the position and contour of the detection mark on each substrate layer of the circuit board, and generating a second detection pattern of the detection mark, wherein the angle between the second scanning direction and the upper end surface of the circuit board is a second preset angle, and the first scanning direction and the second scanning direction have an angle; splicing the second detection pattern of each layer of the substrate to generate a second spliced pattern of multiple layers of the substrate; Acquire a second preset detection pattern of the circuit board; It is determined whether the second splicing pattern is consistent with the second preset detection pattern, and whether the stacking order of the multiple layers of the substrate is correct based on the comparison result.

10. A method for detecting circuit board offset according to claim 9, characterized in that, The determining whether the stacking order of the multiple layers of substrates is correct according to the comparison results includes: When the second stitching pattern is consistent with the second preset detection pattern, determining that the stacking order of the multiple layers of the substrate is correct; When the second combined pattern is inconsistent with the second preset detection pattern, it is determined that the stacking order of the multiple layers of the substrate is wrong.

11. A circuit board offset detection method according to claim 10, characterized in that, After determining that the stacking order of the multiple layers of substrates is wrong, the method further includes: comparing the second stitched pattern with the second preset detection pattern to determine a second detection pattern shifted in the second stitched pattern; According to the offset second detection pattern, the layer number of the corresponding substrate is determined, and substrate stacking error layer number information is generated, wherein the substrate stacking error layer number information is used to indicate the number of substrate layers with incorrect stacking order in the circuit board.

12. A circuit board offset detection system, characterized in that, include: a scanning module, configured to scan the circuit board along a first scanning direction to obtain a position and an outline of a detection mark on each substrate layer of the circuit board; an image generation module, configured to generate a first detection pattern of the detection mark, and further configured to splice the first detection pattern of each layer of the substrate to generate a first spliced pattern of multiple layers of the substrate; The judgment module is used to obtain a first preset detection pattern of the circuit board, and is also used to compare the first splicing pattern with the first preset detection pattern, and judge whether the stacking of multiple layers of the substrate is offset according to the comparison result.

13. A computer device, characterized in that, The invention comprises a memory, a processor and a circuit board deviation detection program stored in the memory and executable on the processor. When the processor executes the circuit board deviation detection program, the circuit board deviation detection method according to any one of claims 1 to 11 is implemented.

14. A computer-readable storage medium, characterized in that, A circuit board deviation detection program is stored thereon, and when the circuit board deviation detection program is executed by a processor, the circuit board deviation detection method according to any one of claims 1 to 11 is implemented.

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