一种测试装置及其制备方法
By designing the base and top cover components of the test device, and combining the heat dissipation structure of PIN pins, fixed copper blocks, base heat sinks, and graphene sheets, the problem of high temperature rise in power chips was solved. Stable connection and rapid heat dissipation between the PIN pins and the chip body were achieved, avoiding high temperature alarms and burnout.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU TAOSHENG ELECTRONICS TECH CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-07-17
AI Technical Summary
In the existing technology, due to the high power and high current of power supply chips, reliability test sockets are prone to rapid temperature rise, which can lead to high temperature alarms for the PIN pins or even burn out the internal circuitry.
A testing device was designed, including a base assembly and a top cover assembly. The base assembly consists of a PCB board, a probe holder, a base heat sink, a fixing copper block, and a chip holder. Heat dissipation is achieved through the combination structure of the PIN pins, the fixing copper block, and the base heat sink. The top cover assembly is equipped to press the chip body into place, and graphene sheets and fans are used for auxiliary heat dissipation.
It effectively reduces the temperature of the PIN pins and the chip body, avoids high temperature alarms, ensures the stability of the PIN pins and internal circuits, and improves the reliability and safety of testing.
Smart Images
Figure CN120385910B_ABST