Fixing temperature control method, image forming apparatus, electronic device, and storage medium

Abstract

The invention provides a fixing temperature control method, an image forming device, electronic equipment and a storage medium. The method comprises the following steps: controlling preset heating duration of all heating points in a fixing device; obtaining a temperature rise rate corresponding to each acquisition area according to the temperature variation of each acquisition area within a preset time length; and according to the first actual temperature, the target temperature and the temperature rise rate of each acquisition area, target duration corresponding to heating of the heating point in each acquisition area is controlled. According to the embodiment of the invention, all the heating points in the fuser are divided into the plurality of acquisition areas, and the temperature of each acquisition area is monitored and controlled, so that the temperature of the fuser can be more flexibly controlled, the portrait printing effect and the user experience are improved, and the user experience is improved. The temperature control method provided by the embodiment of the invention can adapt to various complex scenes.

Description

Technical Field

[0001] The present application relates to the technical field of image formation, and particularly to a fixing temperature control method, an image forming apparatus, an electronic device, and a storage medium. Background Art

[0002] An image forming apparatus is a device that forms an image on a recording medium through an imaging principle, such as a printer, a copier, a fax machine, a multifunctional image production and copying device, an electrophotographic device, and any other similar devices. A fixing unit is a key component in a laser image forming apparatus, and its main function is to melt toner through high temperature and fix the toner on the image forming medium. Since the surface of the fixing unit needs to maintain a very high temperature, the fixing unit needs to be heated.

[0003] In the related art, the temperature of the fixing unit is detected at fixed points or multiple points by a thermosensitive element, and the fixing unit is controlled to be heated to a target temperature according to the detected temperature.

[0004] However, since the thermosensitive element detects the local temperature of the fixing unit at fixed points, and the fixing unit is affected by the material and service life, there are differences in the temperature conduction conditions in different regions of the entire fixing unit, resulting in uneven temperature distribution on the entire fixing unit. In this way, the temperature detected by the thermosensitive element cannot reflect the temperature of the entire fixing unit. The heating control strategy of controlling the heating of the fixing unit by the temperature detected by the thermosensitive element at fixed points cannot adapt to complex scenarios.

[0005] It should be noted that the information disclosed in the background art part of the present application is only intended to deepen the understanding of the general background art of the present application, and should not be regarded as an admission or any form of implication that this information constitutes the prior art known to those skilled in the art. Summary of the Invention

[0006] In view of this, the present application provides a fixing temperature control method, an image forming apparatus, an electronic device, and a storage medium, which are beneficial to solving the problem that the heating control strategy of controlling the heating of the fixing unit by the temperature detected by the thermosensitive element at fixed points in the prior art cannot adapt to complex scenarios.

[0007] In a first aspect, an embodiment of the present application provides a fixing temperature control method, which is applied to an image forming apparatus, and the image forming apparatus includes a fixing unit. The method includes: Controlling all heating points in the fixing unit to heat for a preset duration; Obtaining the temperature rise rate corresponding to each acquisition area according to the temperature change amount of each acquisition area within the preset duration, where each acquisition area includes at least one heating point, and all heating points in the fixing unit are divided into multiple acquisition areas; Based on the first actual temperature, the target temperature, and the temperature rise rate of each of the acquisition regions, control the heating points in each of the acquisition regions to heat for a corresponding target duration, where each of the acquisition regions corresponds to a target duration, and the first actual temperature is the actual temperature corresponding to any one of the acquisition regions after the heating point in any one of the acquisition regions has heated for the preset duration.

[0008] In an embodiment of the present application, first control all the heating points in the fuser to heat for a preset duration. According to the temperature change amount of each acquisition region within the preset duration, calculate the temperature rise rate corresponding to each acquisition region, and control each acquisition region to heat for a corresponding target duration based on the temperature rise rate and the target temperature. Since all the heating points in the fuser are divided into multiple acquisition regions in the embodiment of the present application, by monitoring and controlling the temperature of each acquisition region, the temperature of the fuser can be controlled more flexibly and accurately, thereby improving the image printing effect and user experience, and the temperature control method provided in the embodiment of the present application can adapt to various complex scenarios.

[0009] In a possible implementation manner, before obtaining the temperature rise rate corresponding to each acquisition region according to the temperature change amount of each acquisition region within the preset duration, it further includes: Receive the first actual temperature corresponding to each acquisition region detected by the temperature distribution measurement unit; According to the first actual temperature corresponding to each acquisition region and the initial temperature, calculate the temperature change amount of each acquisition region within the preset duration, where the initial temperature is the actual temperature of the heating point in each acquisition region before heating.

[0010] In an embodiment of the present application, the temperature distribution measurement unit is used to detect the first actual temperature corresponding to each acquisition region. Only one device is needed to obtain the actual temperature corresponding to each acquisition region in the entire fuser, and there is no need to set too many temperature detection devices, thereby saving costs.

[0011] In a possible implementation manner, after receiving the first actual temperature corresponding to each acquisition region detected by the temperature distribution measurement unit, it further includes: According to the difference between the first actual temperature of the current acquisition region and the first actual temperature of the adjacent acquisition region, calculate the heat conduction influence factor corresponding to each acquisition region, and the heat conduction influence factor is used to characterize the influence of the temperature of the adjacent acquisition region on the temperature of the current acquisition region; The controlling the heating points in each acquisition region to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each acquisition region includes: Control the heating points in each of the acquisition regions to heat for a corresponding target duration according to the first actual temperature, the target temperature, the temperature rise rate of each of the acquisition regions, and the heat conduction influence factor.

[0012] In an embodiment of the present application, after obtaining the first actual temperature corresponding to each acquisition region, calculate the heat conduction influence factor corresponding to each acquisition region according to the difference between the first actual temperature of the current acquisition region and the first actual temperature of the adjacent acquisition region, and correct the target duration corresponding to each acquisition region according to the calculated heat conduction influence factor. It can be understood that the temperature rise rates of different acquisition regions in the fixing device are different, so there may be a temperature difference between one acquisition region and other adjacent acquisition regions, and this temperature difference will also affect the target duration for this acquisition region to be heated to the target temperature. In the embodiment of the present application, using the heat conduction influence factor to correct the target duration can obtain a more accurate target duration, make the heating control more accurate, and thus make the fixing effect better.

[0013] In a possible implementation manner, after the first actual temperature corresponding to each acquisition region detected by the receiving temperature distribution measurement unit, it further includes: Generate a fixing temperature distribution map according to the first actual temperature corresponding to each acquisition region of the fixing device.

[0014] In an embodiment of the present application, output a fixing temperature distribution map according to the first actual temperature corresponding to each acquisition region of the fixing device. It can be understood that users and after-sales maintenance personnel can view the fixing temperature distribution map through the panel or the driver interface, so as to intuitively confirm the working state of the fixing device. When there is a fixing abnormality in the image forming apparatus, it is more convenient to troubleshoot and repair.

[0015] In a possible implementation manner, after controlling the heating points in each of the acquisition regions to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each of the acquisition regions, it further includes: Obtain the second actual temperature corresponding to each of the acquisition regions, where the second actual temperature is the actual temperature corresponding to any one of the acquisition regions after the heating point in any one of the acquisition regions is heated for the target duration; Adjust the heating quantity and heating time of the heating points in each of the acquisition regions according to the relationship between the second actual temperature and the target temperature.

[0016] In an embodiment of the present application, after controlling the heating points in each acquisition area to heat for a corresponding target duration, the second actual temperature corresponding to each acquisition area is obtained, and according to the relationship between the second actual temperature and the target temperature, the heating quantity and heating time of the heating points in each acquisition area are adjusted. It can be understood that through the adjustment after heating, the temperature of each acquisition area after adjustment can be closer to the target temperature, thereby ensuring the temperature accuracy of the entire fixing device.

[0017] In a possible implementation manner, the adjusting the heating quantity and heating time of the heating points in each of the acquisition areas according to the relationship between the second actual temperature and the target temperature includes: If the second actual temperature corresponding to any one of the acquisition areas is less than the target temperature, then according to the difference between the second actual temperature and the target temperature and the temperature rise rate corresponding to any one of the acquisition areas, all the heating points in any one of the acquisition areas are controlled to continue heating for a compensation duration; If the second actual temperature corresponding to any one of the acquisition areas is equal to the target temperature, then any one of the acquisition areas is controlled to enter a heat preservation state, and the heat preservation state is used to represent that the temperature of the acquisition area is maintained within a preset interval; If the second actual temperature corresponding to any one of the acquisition areas is greater than the target temperature, then the number of heating points heated in any one of the acquisition areas is reduced.

[0018] In an embodiment of the present application, if the second actual temperature corresponding to a certain acquisition area is less than the target temperature, then the heating points in the acquisition area are controlled to continue heating for a certain duration, so as to compensate for the temperature difference between the second actual temperature and the target temperature; if the second actual temperature corresponding to a certain acquisition area is equal to the target temperature, then the acquisition area is controlled to keep warm; if the second actual temperature corresponding to a certain acquisition area is greater than the target temperature, then the number of heating points heated in the acquisition area is reduced, so that the temperature of the acquisition area is closer to the target temperature, and further the fixing effect is better. In a possible implementation manner, after controlling the heating points in each of the acquisition areas to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each of the acquisition areas, it further includes: Controlling each of the acquisition areas to enter a heat preservation state, and the heat preservation state is used to represent that the temperature of the acquisition area is maintained within a preset interval.

[0019] In an embodiment of the present application, after each acquisition area heats for a corresponding target duration, each acquisition area is controlled to enter a heat preservation state, so as to ensure the temperature stability of the entire fixing device, and further improve the portrait printing effect and user experience.

[0020] Second aspect, an embodiment of the present application provides an image forming apparatus, including: A heating control module, configured to control all heating points in the fuser to heat for a preset duration; A temperature rise rate acquisition module, configured to obtain the temperature rise rate corresponding to each acquisition area according to the temperature change amount of each acquisition area within the preset duration, where each acquisition area includes at least one heating point, and all heating points in the fuser are divided into multiple acquisition areas; The heating control module is further configured to control the heating points in each acquisition area to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each acquisition area, where each acquisition area corresponds to a target duration, and the first actual temperature is the actual temperature corresponding to any one of the acquisition areas after the heating points in any one of the acquisition areas heat for the preset duration.

[0021] Third aspect, an embodiment of the present application provides an electronic device, characterized by including: A processor; A memory; And a computer program, where the computer program is stored in the memory, and the computer program includes instructions that, when executed by the processor, cause the electronic device to execute the method according to any one of the first aspect.

[0022] Fourth aspect, an embodiment of the present application provides a computer-readable storage medium, characterized in that the computer-readable storage medium includes a stored program, where, when the program runs, it controls the device where the computer-readable storage medium is located to execute the method according to any one of the first aspect.

[0023] It can be understood that the image forming apparatus provided in the second aspect, the electronic device provided in the third aspect, and the computer-readable storage medium provided in the fourth aspect are used to execute the method provided by the present application. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding method, which will not be elaborated here. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a schematic structural diagram of an image forming apparatus provided by an embodiment of the present application; Figure 2Schematic structural diagram of a fixing component in a related art provided by an embodiment of the present application; Figure 3 Schematic flowchart of a fixing temperature control method provided by an embodiment of the present application; Figure 4 Schematic diagram of a heating point division method provided by an embodiment of the present application; Figure 5 Schematic structural diagram of a collection area provided by an embodiment of the present application; Figure 6 Schematic side view of a fixing device provided by an embodiment of the present application; Figure 7 Schematic flowchart of a primary heating provided by an embodiment of the present application; Figure 8 Schematic diagram of a target duration comparison provided by an embodiment of the present application; Figure 9 Schematic flowchart of a secondary heating provided by an embodiment of the present application; Figure 10 Schematic temperature curve diagram of a hierarchical heating provided by an embodiment of the present application; Figure 11 Schematic diagram of adjusting the number of heating points provided by an embodiment of the present application; Figure 12 Schematic diagram of the corresponding relationship between the temperature difference and the number of heating points to be adjusted provided by an embodiment of the present application; Figure 13 Schematic structural diagram of another image forming apparatus provided by an embodiment of the present application; Figure 14 Schematic structural diagram of an electronic device provided by an embodiment of the present application. Detailed implementation manners

[0026] To better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0027] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0028] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "the" and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0029] It should be understood that the term "and / or" used herein is merely a description of the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this text generally indicates that the associated objects before and after are in an "or" relationship.

[0030] For ease of understanding, the specific structure and working principle of the image forming apparatus will be described by way of example below.

[0031] Participate Figure 1 , which is a schematic structural diagram of an image forming apparatus provided by an embodiment of the present application. As Figure 1 shown, the image forming apparatus includes a laser scanning unit 100; an imaging unit 200. There are 4 imaging units in the color imaging device, namely black (K), magenta (M), cyan (C), and yellow (Y); a transfer unit 300, which includes a transfer belt 310, a first transfer roller 320, and a second transfer roller 330, and a fixing assembly 400. Its working principle is that the laser scanning unit emits a plurality of laser beams, and each laser beam scans a photosensitive component 210 in an imaging unit of one color to form an electrostatic latent image on the surface of the photosensitive component 210. A charging roller 230 is arranged at a position tangent to the photosensitive component 210 and is responsible for charging the surface of the photosensitive component to maintain the potential difference of the photosensitive component. The developing assembly 220 is responsible for attaching toner to the surface of the photosensitive component 210 to convert the electrostatic latent image into an image. The first transfer roller 320 is responsible for transferring the image on the surface of the photosensitive component 210 to the transfer belt 310, and the second transfer roller 330 is responsible for transferring the image on the transfer belt 310 to the paper P. The image on the paper is fixed to the paper by the fixing assembly 400 through heating. The paper P is conveyed by a paper feed roller 610 to a paper conveyance roller 620, conveyed by the paper conveyance roller 620 to the second transfer roller 330, then conveyed to the fixing assembly 400, and finally discharged by a paper discharge roller 630.

[0032] According to Figure 1 the working principle of the image forming apparatus, it can be known that the fixing device is a key component in the laser image forming apparatus, and its main function is to melt the toner through high temperature and fix the toner on the image forming medium. Since melting the toner requires a relatively high temperature, it is necessary to heat the fixing device, so that a very high temperature needs to be maintained on the surface of the fixing device.

[0033] In the related art, the temperature of the fixing device is detected at fixed points or multiple points by a thermosensitive element, and the fixing device is controlled to be heated to a target temperature according to the detected temperature.

[0034] For ease of understanding, an embodiment of the present application also provides a schematic structural diagram of a fixing assembly in the related art.

[0035] Refer to Figure 2, which is a schematic structural diagram of a fixing component in a related art provided by an embodiment of the present application. As Figure 2 shown, the fixing device 202 and the pressure roller 208 are shown in the figure. Among them, the fixing device 202 specifically includes: a support sheet metal 205, a support bracket 207, a ceramic heating sheet 204, a thermistor 206, a fixing film 203, and a fixing film bushing 201. Specifically, the fixing device is the source of fixing heat, and the pressure roller contacts the elastic member of the fixing device and provides pressure. The support sheet metal and the support bracket are mainly used to support the fixing device. The ceramic heating sheet is the source of heat generated by the fixing device. The fixing film is used to conduct the heat of the ceramic heating sheet to the medium, and the fixing film bushing is used to support the fixing film.

[0036] As Figure 2 shown, the temperature of the fixing device is detected by a thermal element (i.e., a thermistor). Because the thermal element detects the local temperature of the fixing device at a fixed point, and due to the influence of the material and service life of the fixing device, there are differences in the temperature conduction of different regions on the entire fixing device, resulting in uneven temperature distribution on the entire fixing device. In this way, the temperature detected by the thermal element cannot reflect the temperature of the entire fixing device. The heating control strategy that controls the heating of the fixing device based on the temperature detected by the thermal element at a fixed point cannot adapt to complex scenarios.

[0037] In view of the above problems, an embodiment of the present application provides a fixing temperature control method. First, all heating points in the fixing device are controlled to heat for a preset duration. According to the temperature change amount of each acquisition area within the preset duration, the temperature rise rate corresponding to each acquisition area is calculated, and each acquisition area is controlled to heat for a corresponding target duration based on the temperature rise rate and the target temperature. Because all heating points in the fixing device are divided into multiple acquisition areas in the embodiment of the present application, and the temperature of each acquisition area is monitored and controlled, the temperature of the fixing device can be controlled more flexibly, thereby improving the image printing effect and user experience. Moreover, the temperature control method provided by the embodiment of the present application can adapt to various complex scenarios. It will be described in detail below in conjunction with the drawings and specific embodiments.

[0038] See Figure 3 , which is a schematic flow diagram of a fixing temperature control method provided by an embodiment of the present application. As Figure 3 shown, it mainly includes the following steps.

[0039] Step S301: Control all heating points in the fixing device to heat for a preset duration.

[0040] Specifically, the image forming apparatus controls all heating points in the fixing device to heat for a preset duration.

[0041] The fuser in the embodiments of the present application is an array heater fuser. The array heater fuser uses multiple independent small heating elements arranged in a matrix form. The array heating realizes the heating of the fuser by generating heat at multiple small heating points, thereby improving energy efficiency and image formation quality.

[0042] Of course, the preset duration in the embodiments of the present application is preset by developers and can be set to any duration. The embodiments of the present application do not make specific limitations on this.

[0043] In addition, in the embodiments of the present application, step S301 is named primary heating, that is, the primary heating in the following text corresponds to step S301.

[0044] Step S302: Obtain the temperature rise rate corresponding to each acquisition area according to the temperature change amount of each acquisition area within the preset duration.

[0045] Specifically, since the preset duration is a fixed duration, it is only necessary to obtain the temperature change amount of each acquisition area within the preset duration to obtain the temperature rise rate corresponding to each acquisition area. Among them, each acquisition area includes at least one heating point, and all the heating points in the fuser are divided into multiple acquisition areas.

[0046] In a possible implementation manner, all the heating points in the fuser are evenly divided into multiple acquisition areas, and the number of heating points in each acquisition area is the same. When the heating points in the fuser cannot be evenly divided, the extra heating points near the edge are divided into several acquisition areas.

[0047] Exemplarily, see Figure 4 , which is a schematic diagram of a heating point division method provided by the embodiments of the present application. As Figure 4 shown, it is a side two-dimensional view of the fuser. In this view, 8×19 heating points can be seen. When dividing the heating points in this fuser, the acquisition areas can be in the 4×4 specification. However, because the 19 heating points in the horizontal direction cannot be evenly divided, there are still 3×8 extra heating points near the edge. At this time, if all the extra heating points are directly taken as one acquisition area, it may cause the number of heating points in this acquisition area to be too large. Therefore, in the embodiments of the present application, the extra heating points are divided into multiple acquisition areas again. To be relatively consistent with other acquisition areas, the division method of these extra heating points in the vertical direction is the same as that of other acquisition areas, that is, the extra heating points are divided according to the 3×4 specification.

[0048] In practical applications, the number of heating points in fusers of the same model is the same. Therefore, the division method of heating points in different models of fusers can be preset, and the corresponding division method can be determined according to the model of the fuser.

[0049] Specifically, according to the model of the fuser, all the heating points in the entire fuser are divided into multiple acquisition areas, and different acquisition areas are distinguished by coordinates (Xn, Yn). Each acquisition area has N heating points. When the acquisition area is heated, some or all of the heating points are turned on.

[0050] Exemplarily, refer to Figure 5 , which is a schematic structural diagram of an acquisition area provided by an embodiment of the present application. As Figure 5 shown, 12 acquisition areas are shown in the XY coordinate system, namely A1 - A4, B1 - B4, and C1 - C4. Among them, the coordinates of acquisition area C1 are (X1, Y1), and the coordinates of acquisition area C2 are (X2, Y1). Similarly, the coordinates of acquisition area B3 are (X3, Y2). Of course, these are only part of the acquisition areas in the fuser. In fact, there are far more than 12 acquisition areas in the fuser. Figure 5 The right side shows the distribution of heating points in an acquisition area. Among them, the black dots are heating points. In this example, an acquisition area includes 9 heating points. It can be understood that the number of heating points in each acquisition area is determined according to the acquisition area division rule.

[0051] In a possible implementation manner, before obtaining the temperature rise rate corresponding to each acquisition area, the first actual temperature corresponding to each acquisition area detected by the temperature distribution measurement unit is received. The first actual temperature is the actual temperature corresponding to an acquisition area after the heating points in the acquisition area are heated for a preset duration; according to the first actual temperature and the initial temperature corresponding to each acquisition area, the temperature change amount of each acquisition area within the preset duration is calculated, where the initial temperature is the actual temperature of the heating points in each acquisition area before heating.

[0052] In a possible implementation manner, after receiving the first actual temperature corresponding to each acquisition area detected by the temperature distribution measurement unit, a fusing temperature distribution map is generated according to the first actual temperature corresponding to each acquisition area.

[0053] It can be understood that by using the temperature distribution measurement unit to detect the temperature distribution of the entire fuser, the actual temperature corresponding to each acquisition area can be obtained. Only one device is needed to obtain the temperature corresponding to each acquisition area in the entire fuser, and there is no need to set too many temperature detection devices, thus saving costs. In addition, generating a fusing temperature distribution map according to the first actual temperature enables users or after-sales personnel to view the fusing temperature distribution map through the panel or the driver interface, thereby intuitively confirming the working state of the fuser, more specifically understanding the heating situation of the fuser, and when the fuser has an abnormality, it is more convenient to troubleshoot and repair.

[0054] In the embodiment of the present application, before the primary heating, the initial temperature of each acquisition area in the fuser is detected by the temperature distribution measurement unit, and the initial temperature corresponding to each acquisition area is recorded as T0 XnYn , Exemplarily, Figure 5 the initial temperature corresponding to C1 in X1Y1 is T0 X2Y1 . After the primary heating, the first actual temperature corresponding to each acquisition area is recorded as T1 XnYn , Exemplarily, Figure the initial temperature corresponding to C1 in X1Y1 is T1 X2Y1 .

[0055] In practical applications, the first actual temperature corresponding to each acquisition area can be subtracted from the initial temperature corresponding to the acquisition area to obtain the temperature change amount, and the temperature change amount is divided by the preset duration to obtain the temperature rise rate. However, since there may be errors in the temperature detected by the temperature detection device, in the embodiment of the present application, in order to ensure the accuracy of the temperature rise rate, a temperature rise rate correction coefficient is introduced.

[0056] Specifically, through the formula P XnYn =f p ×(T1 XnYn -T0 XnYn ) / t to calculate the temperature rise rate, where P XnYn is the temperature rise rate corresponding to the acquisition area, f p is the temperature rise rate correction coefficient, and t is the preset duration. In this formula, by introducing the temperature rise rate correction coefficient, a more accurate temperature rise rate can be obtained, so as to ensure that the final temperature of the fuser approaches the target temperature as much as possible.

[0057] It should be noted that the temperature rise rate correction coefficient in the embodiment of the present application is obtained through a large number of experiments. The magnitude of the temperature rise rate correction coefficient is greatly related to the accuracy of devices such as the temperature distribution measurement unit. The higher the accuracy of these devices, the closer the temperature rise rate correction coefficient is to 1.

[0058] Exemplarily, the temperature rise rate correction coefficient of a certain fuser is 1. The initial temperature of a certain acquisition area in the fuser before the primary heating is 30 °C, the first actual temperature after the primary heating is 130 °C, and the preset duration of the primary heating is 1 s. Then the temperature rise rate of this acquisition area is P XnYn =1×(130 - 30) / 1 = 100 °C / s.

[0059] In one possible implementation, the temperature distribution measurement unit may be an infrared thermal imaging sensor, a thermopile array sensor, a liquid crystal thermal imaging sensor, a fiber optic distributed temperature sensor, an infrared temperature measurement sensor, etc., and this application does not impose any specific restrictions on this.

[0060] In one possible implementation, after obtaining the first actual temperature corresponding to each collection area, a heat conduction influence factor corresponding to each collection area is calculated based on the difference between the first actual temperature of the current collection area and the first actual temperature of an adjacent collection area. The heat conduction influence factor is used to characterize the influence of the temperature of the adjacent collection area on the temperature of the current collection area.

[0061] Since the fuser is mostly cylindrical, the side view can be considered as a rectangle. ​ , is a side view of a fuser provided in an embodiment of the present application. ​ As shown, due to the bottom diameter of the fuser (corresponding to ​ The width of the middle rectangle) is smaller, so in the vertical direction (i.e. ​ The heat in the direction corresponding to the width of the rectangle is relatively balanced. Therefore, in order to simplify the analysis model, the heat conduction influence factor can be analyzed only in the horizontal direction (i.e. ​ The influence of the direction corresponding to the length of the rectangle).

[0062] Specifically, through formula M XnYn =f m ×((T1 XnYn -T1 Xn-1Yn ) / T1 XnYn +(T1 XnYn -T1 Xn+1Yn ) / T1 XnYn ) Calculate the heat conduction influence factor, where M XnYn is the heat conduction influence factor, f m is the correction coefficient of heat conduction influence factor, (T1 XnYn -T1 Xn-1Yn ) / T1 XnYn is the temperature impact of the previous acquisition area on the current acquisition area, (T1 XnYn -T1 Xn+1Yn ) / T1 XnYn It should be noted that the front and back in the embodiment of the present application refer to the front and back in spatial position. ​ In the example shown, the previous collection area can be understood as the left collection area, and the next collection area can be understood as the right collection area, that is, the collection area before the second collection area from left to right is the first collection area, and the collection area after the second collection area is the third collection area.

[0063] Exemplarily, assume that the heat conduction influence factor correction coefficient f m is 1, the first actual temperature T1 of the current acquisition area XnYn is 100 °C, the first actual temperature T1 of the previous acquisition area Xn-1Yn is 200 °C, and the first actual temperature T1 of the subsequent acquisition area Xn+1Yn is 90 °C, then the heat conduction influence factor M XnYn = 1×((100 – 200) / 100 + (100 – 90) / 100) = -0.9.

[0064] Corresponding to the above embodiments, the present application also provides a schematic flow diagram of primary heating.

[0065] Refer to ​ , which is a schematic flow diagram of primary heating provided by an embodiment of the present application. As ​ shown, taking one acquisition area as an example, the process of primary heating is exemplarily described, which mainly includes the following steps.

[0066] Step S701: Start.

[0067] Step S702: Obtain the initial temperature T0 of the acquisition area XnYn .

[0068] Step S703: Start heating for a duration of t1.

[0069] It can be understood that the duration of t1 is the above-mentioned preset duration.

[0070] Step S704: Obtain the first actual temperature T1 of the acquisition area XnYn .

[0071] Step S705: Calculate the temperature rise coefficient P XnYn and the heat conduction influence factor M XnYn .

[0072] Step S706: End.

[0073] For the specific content involved in the embodiments of the present application, reference can be made to the description in the embodiments shown in the above step S302. For the sake of brevity of expression, it will not be elaborated here.

[0074] Step S303: Control the heating points in each acquisition area to heat for the corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each acquisition area.

[0075] Specifically, according to the first actual temperature, the target temperature, and the temperature rise rate of each acquisition area, control the heating points in each acquisition area to heat for the corresponding target duration. It can be understood that each acquisition area corresponds to a target duration, and the target temperature is the temperature that the fuser finally needs to reach.

[0076] In the embodiments of the present application, controlling the heating points in each acquisition area to heat for the corresponding target duration is simply referred to as secondary heating.

[0077] In a possible implementation manner, according to the temperature difference between the first actual temperature and the target temperature corresponding to each acquisition area and the temperature rise rate corresponding to this acquisition area, calculate the target duration corresponding to each acquisition area.

[0078] Specifically, through the formula C0 XnYn =(T - T1 XnYn ) / P XnYn calculate the target duration corresponding to each acquisition area, where T is the target temperature, T1 XnYn is the first actual temperature corresponding to any acquisition area, and P XnYn is the temperature rise rate corresponding to this acquisition area. It can be understood that in the embodiments of the present application, the relationship between the target duration and the temperature is simplified to a linear relationship, so the temperature difference divided by the temperature rise rate can obtain the target duration.

[0079] In a possible implementation manner, after primary heating, calculate the heat conduction influence factor corresponding to each acquisition area. During secondary heating, the target duration corresponding to each acquisition area can be corrected by the heat conduction influence factor.

[0080] Specifically, through the formula C1 XnYn =C0 XnYn +C0 XnYn× M XnYn calculate the target duration corresponding to each acquisition area, where C1 XnYn is the corrected target duration, C0 XnYn is the target duration before correction, and M XnYn is the heat conduction influence factor. It can be understood that the target duration is corrected or compensated by the heat conduction influence factor to obtain a more accurate target duration.

[0081] Exemplarily, assuming the target temperature T is 250 °C and the first actual temperature is 100 °C, then C0 XnYn =(250 – 100) / 100 = 1.5 s, C1 XnYn =1.5 + 1.5 × (-0.9) = 0.15.

[0082] It should be noted that when C1 XnYnWhen it is negative, set the target duration to 0 because C1 XnYn being negative indicates that the temperature of the surrounding acquisition area is much higher than that of the current acquisition area. At this time, the heat radiation from the surrounding acquisition area alone can also increase the temperature of the current acquisition area, so heating may not be necessary. However, the image forming apparatus will collect the temperature of each acquisition area in real time and recalculate the target duration according to the difference between the current temperature and the target temperature and the temperature rise rate. When the target duration is greater than 0, it controls the heating points in this acquisition area to start heating. Additionally, if the current acquisition area is the edge area of the fuser, only the heat influence of the previous / next acquisition area adjacent to it on the current acquisition area needs to be considered.

[0083] In a possible implementation, the temperature of the surrounding acquisition area has a greater impact on the temperature of the current acquisition area. Therefore, there may also be a certain difference between the target duration before correction and the target duration after correction for the same acquisition area.

[0084] Exemplarily, refer to ​ , which is a schematic diagram of target duration comparison provided by an embodiment of the present application. Since it is determined in the embodiment of the present application that the temperature in the vertical direction is the same, it is considered that when X is the same, regardless of the value in the Y direction, the temperature is consistent. Therefore, when X is the same, the target duration is the same. As shown in ​ a, it is the target duration before correction corresponding to different acquisition areas, ​ and b in ​ is the target duration after correction corresponding to different acquisition areas. It should be noted that the target durations shown in

[0085] are all the theoretically calculated target durations. In the embodiment of the present application, the heat influence of the front and rear acquisition areas on the current area is fully considered, which can ensure that the finally calculated theoretical target duration is more accurate. In the specific implementation, a better heating effect can be achieved by adjusting the correction coefficient of the heat conduction influence factor. Specifically, the correction coefficient of the heat conduction influence factor is adjusted according to the actual test situation, and then the heat conduction influence factor is adjusted to obtain a better heating effect.

[0086] Corresponding to the above embodiment, the embodiment of the present application also provides a schematic diagram of the process of secondary heating. ​ Refer to ​ , which is a schematic diagram of the process of secondary heating provided by an embodiment of the present application. As shown in

[0087] Step S901: Start.

[0088] Step S902: Coarsely calculate the heating curve C0 XnYn .

[0089] As described above, C0 XnYn That is, the target duration before correction.

[0090] Step S903: Precisely calculate the heating curve C1 XnYn .

[0091] As described above, C1 XnYn That is, the corrected target duration.

[0092] Step S904: Start the heating function of the heating point according to the heating curve C1 XnYn

[0093] Step S905: End.

[0094] The specific content involved in the embodiments of the present application can be referred to the description in the embodiment shown in the above step S303. For the sake of brevity of expression, it will not be elaborated here.

[0095] In addition, in order to facilitate the understanding of the processes of primary heating and secondary heating, the embodiments of the present application also provide a schematic diagram of the temperature curve of hierarchical heating.

[0096] See ​ , which is a schematic diagram of the temperature curve of hierarchical heating provided by the embodiments of the present application. As ​ shown, this schematic diagram of the temperature curve is the temperature change curve of any acquisition area. Before primary heating, the temperature of the acquisition area remains unchanged. During primary heating, the heating point is controlled to heat for a preset duration, so that the temperature of the acquisition area rises to the first actual temperature T1. At this time, the temperature rise rate is calculated, and according to the first actual temperature, the target temperature, and the temperature rise rate, the target duration C1 is calculated, and the heating point is controlled to heat for C1 duration. Finally, the temperature of the acquisition area reaches the target temperature T.

[0097] A possible implementation manner is that after controlling the heating point in the acquisition area to heat for the target duration, the second actual temperature corresponding to each acquisition area is obtained. The second actual temperature is the actual temperature corresponding to any acquisition area after the heating point in any acquisition area heats for the target duration; according to the relationship between the second actual temperature and the target temperature, the heating quantity and heating time of the heating point in each acquisition area are adjusted.

[0098] It can be understood that through the adjustment after heating, the second actual temperature corresponding to each acquisition area can be made closer to the target temperature, thereby ensuring the temperature accuracy of the entire fixing device.

[0099] ​In a possible implementation, if the second actual temperature corresponding to any acquisition area is less than the target temperature, all heating points in the acquisition area are controlled to continue heating for a compensation duration according to the difference between the second actual temperature and the target temperature and the temperature rise rate corresponding to the acquisition area; if the second actual temperature corresponding to any acquisition area is equal to the target temperature, the acquisition area is controlled to enter a heat preservation state, and the heat preservation state is used to represent that the temperature of the acquisition area is maintained within a preset range; if the second actual temperature corresponding to any acquisition area is greater than the target temperature, the number of heating points for heating in the acquisition area is reduced.

[0100] Wherein, the compensation duration is the duration that the acquisition area still needs to be heated calculated according to the difference between the second actual temperature and the target temperature and the temperature rise rate corresponding to the acquisition area. The heat preservation state is to ensure that the temperature is maintained within a preset range, and even to ensure that the temperature remains as unchanged as possible. Of course, the preset range is preset according to the actual situation, and the embodiments of the present application do not make specific limitations thereto.

[0101] When the second actual temperature is greater than the target temperature, calculate the temperature difference δ between the second actual temperature and the target temperature T , and according to the temperature difference δ T and the corresponding relationship with the number of heating points to be adjusted δ Dot , obtain the number of heating points to be adjusted δ Dot , and according to the target number of heating points = the original number of heating points + δ Dot , calculate the target number of heating points, and adjust the number of heating points according to the target number of heating points. Among them, the target number of heating points is the adjustment target value, the original number of heating points is the number of all heating points in an acquisition area, and the number of heating points to be adjusted δ Dot is the number of heating points that do not need to be heated, and δ Dot < 0.

[0102] Exemplarily, see ​ , which is a schematic diagram of adjusting the number of heating points provided by the embodiments of the present application. As ​ shown, the original number of heating points in an acquisition area is 9 heating points. When the second actual temperature is greater than the target temperature, according to the corresponding relationship between the temperature difference δ T and the number of heating points to be adjusted δ Dot , obtain the number of heating points to be adjusted δ Dot = -2, so control 2 of the 9 heating points not to be heated, so as to achieve the purpose of cooling down.

[0103] In a possible implementation, the corresponding relationship between the temperature difference δ T and the number of heating points to be adjusted δ Dot is in the form of a table, and the number of heating points to be adjusted corresponding to the temperature difference can be obtained by looking up the table.

[0104] See​ , which is a schematic diagram of the correspondence between temperature difference and the number of heating points to be adjusted provided by the embodiment of the present application. As ​ shown, through the acquisition area and the temperature difference (δ T ), a unique number of heating points to be adjusted δ Dot can be determined. Exemplarily, when the temperature difference in acquisition area 1 is 3, since 3 is in the range of 2 to 4, the temperature difference (δ T ) threshold corresponding to acquisition area 1 is taken as 4, and the corresponding number of heating points to be adjusted δ Dot is -2; when the temperature difference in acquisition area 1 is 5, since 5 is in the range of 4 to 6, the temperature difference (δ T ) threshold corresponding to acquisition area 1 is taken as 6, and the corresponding number of heating points to be adjusted δ Dot is -2; when the temperature difference in acquisition area 2 is 13, since 13 is in the range of 12 to 14, the temperature difference (δ T ) threshold corresponding to acquisition area 2 is taken as 14, and the corresponding number of heating points to be adjusted δ Dot is -3; and so on. When the temperature difference (δ T ) threshold corresponding to acquisition area 1 is ≥20, the number of heating points to be adjusted δ Dot is -5. It can be understood that a negative number of heating points to be adjusted means the number of heating points that need to be reduced.

[0105] In a possible implementation, after secondary heating, each acquisition area is controlled to enter the heat preservation state. It can be understood that through the heat preservation state, the temperature stability of the entire fixing unit can be ensured, thereby improving the image printing effect and user experience.

[0106] Corresponding to the above embodiment, the present application also provides another image forming apparatus.

[0107] Referring to ​ , which is a schematic structural diagram of another image forming apparatus provided by the embodiment of the present application. As ​ shown, the image forming apparatus may include a heating control module 1301 and a temperature rise rate acquisition module 1302. These components communicate through one or more buses. Those skilled in the art can understand that the structure of the electronic device shown in the figure does not constitute a limitation to the embodiment of the present application. It can be a bus structure, a star structure, and may also include more or fewer components than shown in the figure, or combine some components, or have different component arrangements.

[0108] Among them, the heating control module 1301 is used to control all heating points in the fixing unit to heat for a preset duration; The temperature rise rate acquisition module 1302 is configured to obtain the temperature rise rate corresponding to each acquisition area according to the temperature change amount of each acquisition area within the preset duration, where each acquisition area includes at least one heating point, and all the heating points in the fixing device are divided into multiple acquisition areas; The heating control module 1301 is further configured to control the heating points in each acquisition area to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each acquisition area. Each acquisition area corresponds to a target duration. The first actual temperature is the actual temperature corresponding to any acquisition area after the heating point in any acquisition area is heated for the preset duration.

[0109] Corresponding to the above embodiments, the present application further provides an electronic device.

[0110] See ​ , which is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As ​ shown, the electronic device 1400 may include: a processor 1401, a memory 1402, and a communication unit 1403. These components communicate through one or more buses. Those skilled in the art can understand that the structure of the electronic device shown in the figure does not constitute a limitation on the embodiments of the present application. It can be a bus structure, a star structure, and may also include more or fewer components than shown in the figure, or combine certain components, or different component arrangements.

[0111] Among them, the communication unit 1403 is configured to establish a communication channel, so that the electronic device can communicate with other devices. Receive user data sent by other devices or send user data to other devices.

[0112] The processor 1401 is the control center of the electronic device. It uses various interfaces and lines to connect all parts of the electronic device, and executes various functions and / or processes data of the electronic device by running or executing software programs, instructions, and / or modules stored in the memory 1402, and calling the data stored in the memory. The processor may be composed of an integrated circuit (IC). For example, it may be composed of a single packaged IC, or may be composed of multiple packaged ICs with the same or different functions connected together. For example, the processor 1401 may only include a central processing unit (CPU). In the embodiment of the present application, the CPU may be a single operation core or may include multiple operation cores.

[0113] The memory 1402 is used to store the execution instructions of the processor 1401. The memory 1402 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disc.

[0114] When the execution instructions in the memory 1402 are executed by the processor 1401, the electronic device 1400 is enabled to execute ​ Some or all of the steps in the illustrated embodiments.

[0115] In a specific implementation, an embodiment of the present application further provides a computer storage medium. The computer storage medium may store a program, and when the program is executed, it may include some or all of the steps in the embodiments of the simulation scenario generation method provided in the embodiments of the present application. The storage medium may be a magnetic disk, an optical disc, a read-only memory (ROM), or a random access memory (RAM), etc.

[0116] In a specific implementation, an embodiment of the present application further provides a computer program product. The computer program product includes executable instructions. When the executable instructions are executed on a computer, the computer is enabled to execute some or all of the steps in the embodiments of the simulation scenario generation method provided in the embodiments of the present application.

[0117] In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "And / or" describes the association relationship between associated objects and indicates that three relationships may exist. For example, A and / or B may represent the cases of A existing alone, A and B existing simultaneously, and B existing alone. Where A and B may be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after. "At least one of the following" and its similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, and c may represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, and c may be single or multiple.

[0118] Those of ordinary skill in the art can realize that the units and algorithm steps described in the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. Whether these functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0119] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0120] In several embodiments provided in this application, if any function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The foregoing storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs.

[0121] The same or similar parts among the various embodiments in this specification can be referred to each other. In particular, for the device embodiments and terminal embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can refer to the descriptions in the method embodiments.

Claims

1. A fixing temperature control method, characterized in that, Applied to an image forming apparatus, the image forming apparatus including a fuser, the method comprising: Controlling all heating points in the fuser to heat for a preset duration; Obtaining a temperature rise rate corresponding to each of the acquisition regions according to a temperature change amount of each acquisition region within the preset duration, wherein at least one heating point is included in each of the acquisition regions, and all heating points in the fuser are divided into a plurality of acquisition regions; Controlling heating points in each of the acquisition regions to heat for a corresponding target duration according to a first actual temperature, a target temperature, and the temperature rise rate of each of the acquisition regions, each of the acquisition regions corresponding to a target duration, and the first actual temperature being the actual temperature corresponding to any one of the acquisition regions after the heating points in any one of the acquisition regions heat for the preset duration.

2. The method according to claim 1, wherein Before obtaining the temperature rise rate corresponding to each of the acquisition regions according to the temperature change amount of each acquisition region within the preset duration, further comprising: Receiving the first actual temperature corresponding to each acquisition region detected by a temperature distribution measurement unit; Calculating the temperature change amount of each acquisition region within the preset duration according to the first actual temperature and an initial temperature corresponding to each of the acquisition regions, the initial temperature being the actual temperature of the heating points in each of the acquisition regions before heating.

3. The method according to claim 2, wherein After receiving the first actual temperature corresponding to each acquisition region detected by the temperature distribution measurement unit, further comprising: Calculating a heat conduction influence factor corresponding to each acquisition region according to a difference between the first actual temperature of the current acquisition region and the first actual temperature of an adjacent acquisition region, the heat conduction influence factor being used to characterize the influence of the temperature of the adjacent acquisition region on the temperature of the current acquisition region; The controlling heating points in each of the acquisition regions to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each of the acquisition regions comprises: Controlling heating points in each of the acquisition regions to heat for a corresponding target duration according to the first actual temperature, the target temperature, the temperature rise rate of each of the acquisition regions, and the heat conduction influence factor.

4. The method according to claim 2, wherein After receiving the first actual temperature corresponding to each acquisition region detected by the temperature distribution measurement unit, further comprising: Generating a fusing temperature distribution map according to the first actual temperature corresponding to each acquisition region of the fuser.

5. The method according to claim 1, characterized in that After controlling heating points in each of the acquisition regions to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each of the acquisition regions, further comprising: Obtaining a second actual temperature corresponding to each of the acquisition regions, the second actual temperature being the actual temperature corresponding to any one of the acquisition regions after the heating points in any one of the acquisition regions heat for the target duration; Adjusting the heating quantity and heating time of the heating points in each of the acquisition regions according to the relationship between the second actual temperature and the target temperature.

6. The method according to claim 5, characterized in that, The adjusting the heating quantity and heating time of the heating points in each of the acquisition regions according to the relationship between the second actual temperature and the target temperature comprises: If the second actual temperature corresponding to any one of the collection areas is less than the target temperature, then according to the difference between the second actual temperature and the target temperature and the temperature rise rate corresponding to any one of the collection areas, control all the heating points in any one of the collection areas to continue heating for a compensation duration; If the second actual temperature corresponding to any one of the collection areas is equal to the target temperature, then control any one of the collection areas to enter a heat preservation state, and the heat preservation state is used to represent that the temperature of the collection area is maintained within a preset range; If the second actual temperature corresponding to any one of the collection areas is greater than the target temperature, then reduce the number of heating points that are heated in any one of the collection areas.

7. The method according to claim 1, wherein After controlling the heating points in each of the collection areas to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each of the collection areas, it further includes: Control each of the collection areas to enter a heat preservation state, and the heat preservation state is used to represent that the temperature of the collection area is maintained within a preset range.

8. An image forming apparatus, characterized in that, It includes: A heating control module, configured to control all the heating points in the fuser to heat for a preset duration; A temperature rise rate acquisition module, configured to obtain the temperature rise rate corresponding to each of the collection areas according to the temperature change amount of each collection area within the preset duration, where each of the collection areas includes at least one heating point, and all the heating points in the fuser are divided into multiple collection areas; The heating control module is further configured to control the heating points in each of the collection areas to heat for a corresponding target duration according to the first actual temperature, the target temperature, and the temperature rise rate of each of the collection areas, each of the collection areas corresponds to a target duration, and the first actual temperature is the actual temperature corresponding to any one of the collection areas after the heating points in any one of the collection areas heat for a preset duration.

9. An electronic device, characterized in that, It includes: A processor; A memory; And a computer program, where the computer program is stored in the memory, and the computer program includes instructions, and when the instructions are executed by the processor, the electronic device is caused to execute the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a stored program, where, when the program runs, the device where the computer-readable storage medium is located is controlled to execute the method according to any one of claims 1 to 7.

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