Semiconductor full package molding die and molding method thereof

Abstract

The present invention relates to the field of semiconductor integrated circuits and discloses a semiconductor full-encapsulation molding die and a molding method thereof. In order to solve the problem of low carrier utilization due to the presence of empty areas in the carrier package, adhesive films are placed on the upper and lower mold cores for protection, and molten resin is injected into the lower mold core. The carrier fixed by the upper mold core can be completely immersed in the resin, and the resin is used to completely encapsulate the four sides of the carrier, thereby increasing the effective area of ​​the carrier and making full use of the originally wasted area.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor integrated circuits, and in particular to a semiconductor full-package molding die and a molding method thereof. Background Art

[0002] Semiconductor packaging is a critical step in the semiconductor manufacturing process. Its core purpose is to encapsulate the chip (die) in a protective housing using specific materials and processes to achieve electrical connections, physical protection, heat management, and environmental isolation. The quality of the packaging directly affects the performance, reliability, and lifespan of the chip. With the rapid development of semiconductor technology, the integration density of chips continues to increase, placing higher demands on packaging technology.

[0003] In the current semiconductor packaging field, granular resin and liquid resin are commonly used as packaging materials. Multiple chips with different functions are placed on carriers of different materials (such as PCB, steel plate, glass, etc.) and then resin molded. However, there is a significant technical defect in the existing packaging technology, that is, the package body cannot completely encapsulate the carrier. Specifically, there are gaps around the carrier (such as Figure 12 As shown in the figure, these gaps not only reduce the effective area of ​​the carrier board, thus reducing the integration and performance of the chip, but also may become channels for external environmental factors (such as moisture, dust, chemicals, etc.) to invade, thereby affecting the reliability and service life of the chip. Summary of the Invention

[0004] The present invention provides a semiconductor full-encapsulation molding die and a molding method thereof, which have the advantage of completely encapsulating a carrier board and can solve the problem of low carrier board utilization rate caused by the presence of empty areas in carrier board packaging in the existing background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a semiconductor full-encapsulation molding mold, comprising: an upper mold base and a lower mold base, the upper mold base is provided with an upper mold core, and the lower mold base is provided with a lower mold core; the upper mold core is provided with film adsorption holes for fixing the film and panel adsorption holes for fixing the carrier board; the lower mold core is provided with lower mold inner side adsorption holes and lower mold outer side adsorption holes for adsorbing and fixing the film.

[0006] Furthermore, a recessed cavity for placing resin is provided in the middle of the surface of the lower mold core.

[0007] Furthermore, a puncture mechanism for puncturing the adhesive film is provided in the adsorption hole of the panel.

[0008] Furthermore, the hole-breaking mechanism includes: a reset push spring and a film-breaking push spring arranged in the panel adsorption hole; a detection electric contact for detecting whether the carrier plate is correctly placed, a guide sleeve for limiting the movement of the adjustment sleeve, and a fastening base to prevent the adjustment sleeve from detaching are installed in sequence in the panel adsorption hole; the adjustment sleeve is installed inside the guide sleeve, and the side of the adjustment sleeve has a limit rod pushed outward by a spring, and a needle seat is installed inside; the needle seat is directed toward the adjustment sleeve according to the guide rod and spring installed below the adjustment sleeve; a film-breaking ejector pin for puncturing the film is installed at the bottom of the needle seat.

[0009] Furthermore, the guide sleeve is a cylindrical tube with a through middle portion and bevels are provided on the inner sides of the upper and lower ends.

[0010] Furthermore, a connecting hole is opened inside the upper mold core to connect the panel adsorption holes to each other.

[0011] Furthermore, an annular groove is provided in the middle of the needle seat, and the limiting rod abuts against the annular groove to prevent the adjustment sleeve and the needle seat from being axially separated.

[0012] A method for forming a semiconductor full-encapsulation molding die comprises the following steps:

[0013] S1. The upper die base and the lower die base are installed in a press, and the press is used to realize the upper die base and the lower die base to move relative to each other up and down.

[0014] S2. The mechanical multi-axis clamping arm spreads the film flat on the lower mold core and the upper mold core respectively.

[0015] S3. For film coating on the upper mold core, use a vacuum pump to suck the film adsorption holes so that the film is spread flat to the bottom of the upper mold core, and use a piercing mechanism to puncture the film at the adsorption holes of the panel.

[0016] S4. For the film coating of the lower mold core, use a vacuum pump to make the adsorption holes on the inner side of the lower mold adsorb the film, so that a rectangular groove with the same shape as the middle of the lower mold core is generated in the middle of the film, and then use the adsorption holes on the outer side of the lower mold to adsorb the film so that the outer side of the film is flattened to the surface of the lower mold core.

[0017] S5. The robot moves the carrier to be packaged to the bottom of the upper mold core, and uses a vacuum pump to suck the panel adsorption holes so that the panel adsorption holes are adsorbed to the surface of the carrier.

[0018] S6. The delivery pipe pours the molten resin into the rectangular groove in the middle of the film.

[0019] S7. The press machine pushes the upper mold base downward, and the carrier board on the upper mold core is immersed in the resin. As the upper mold base continues to move downward, the films on the lower mold core and the upper mold core are pressed together to complete the full encapsulation of the carrier board.

[0020] The present invention has the following beneficial effects:

[0021] The present invention provides a semiconductor fully encapsulated molding mold and molding method. By pre-placing adhesive films on both upper and lower mold cores, molten resin is injected into the cavity of the lower mold core during the molding process. A carrier plate secured to the upper mold core is smoothly and completely immersed in the resin. Leveraging the resin's excellent fluidity and filling properties, the carrier plate is fully encapsulated on all sides, without blind spots. This approach increases the effective usable area of ​​the carrier plate, fully utilizing the marginal areas that would otherwise be wasted in traditional packaging processes, significantly improving carrier plate utilization and overall packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] The present invention can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0024] Figure 1 This is a schematic diagram of the overall external three-dimensional structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the three-dimensional structure of the lower die base of the present invention;

[0026] Figure 3 This is a schematic diagram of the three-dimensional structure of the upper die base of the present invention;

[0027] Figure 4 Schematic diagram of the internal planar cross-sectional structure of the upper mold core of the present invention;

[0028] Figure 5 For the present invention Figure 4 The enlarged structural diagram of the hole-piercing component at E in the middle;

[0029] Figure 6 For the present invention Figure 4 The middle F is a schematic diagram of the location of the connecting hole;

[0030] Figure 7 This is a schematic diagram of the internal planar cross-sectional structure of the lower mold core of the present invention;

[0031] Figure 8 This is a schematic diagram of the internal three-dimensional structure of the hole-piercing assembly of the present invention;

[0032] Figure 9 This is a schematic diagram of the three-dimensional structure of the membrane-breaking ejector pin of the present invention;

[0033] Figure 10 This is a schematic diagram of film application on the upper mold core of the present invention;

[0034] Figure 11 This is a schematic diagram of film application on the lower mold core of the present invention;

[0035] Figure 12 Schematic diagram of chip distribution and plastic packaging on the current traditional carrier board;

[0036] Figure 13 Schematic diagram of chip distribution and plastic packaging on the carrier board of the present invention;

[0037] Figure 14 Schematic diagram of the upper mold core adsorbing the film according to the present invention;

[0038] Figure 15 Schematic diagram of the upper mold core adsorbing the carrier plate of the present invention;

[0039] Figure 16 Schematic diagram of the lower mold core adsorbing the film according to the present invention;

[0040] Figure 17 This is a schematic diagram of the state where plastic resin is injected into the film of the lower mold core of the present invention;

[0041] Figure 18 This is a schematic diagram of the state after the upper and lower mold cores of the present invention are closed;

[0042] Figure 19 This is a schematic diagram of the upward state of the hole-breaking component when it is subjected to suction;

[0043] Figure 20 This is a schematic diagram of the movement state of the hole-piercing component when it is not subjected to suction;

[0044] Figure 21 This is a schematic diagram of the membrane-breaking state where the membrane-breaking ejector pin in the puncture assembly is extended.

[0045] In the figure: 1. Upper mold base; 2. Lower mold base; 3. Lower mold core; 300. Lower mold inner side adsorption hole; 301. Lower mold outer side adsorption hole; 4. Upper mold core; 400. Panel adsorption hole; 401. Film adsorption hole; 402. Connecting hole; 5. Hole-breaking mechanism; 500. Guide sleeve; 501. Fastening base; 502. Reset push spring; 503. Film-breaking push spring; 504. Adjustment sleeve; 505. Limit rod; 506. Needle seat; 507. Film-breaking ejector pin; 508. Guide rod; 6. Detection electrical contact; 7. Adhesive film; 8. Film clamping frame; 9. Carrier board; 10. Chip; 11. Resin. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0047] For example 1, please refer to Figure 1 It can be seen that the mold mentioned in this application mainly includes an upper mold base 1 and a lower mold base 2. When used, the upper mold base 1 and the lower mold base 2 need to be fixed to the corresponding press with fasteners, and the press is used to achieve the approach / distance between the upper mold base 1 and the lower mold base 2.

[0048] The upper die base 1 has an upper die core 4 fastened with bolts, see Figure 3 It can be seen that the upper mold core 4 is provided with film adsorption holes 401 and panel adsorption holes 400 arranged alternately. There are multiple adsorption holes, and the panel adsorption holes 400 and the film adsorption holes 401 are connected to corresponding vacuum pumps respectively. The vacuum pump is used to suck the panel adsorption holes 400 / film adsorption holes 401 to complete the subsequent fixation of the adhesive film 7 and the carrier plate 9. In more detail, the film adsorption holes 401 are mainly used to fix the adhesive film 7, and the panel adsorption holes 400 are used to fix the carrier plate 9. During this process, the external mechanical clamping arm uses the film clamping frame 8 to unfold the adhesive film 7 and spread it flat on the upper mold core 4, as shown in the attached figure. Figure 10 The film 7 is attached to the upper mold core 4 by the film adsorption holes 401. Since the panel adsorption holes 400 are now blocked by the film 7, in order to ensure that the panel adsorption holes 400 can effectively adsorb and fix the carrier 9, the puncture mechanism 5 is required to puncture the blocked area of ​​the film 7. After the carrier 9 is placed on the film 7, the panel adsorption holes 400 can be used to firmly adsorb and fix the carrier 9.

[0049] Regarding the structure of the lower die base 2, Figure 2 It can be seen that the lower mold base 2 is provided with a lower mold core 3 fastened with bolts, and the lower mold core 3 is also provided with a lower mold inner side adsorption hole 300 and a lower mold outer side adsorption hole 301 connected to the vacuum pump. Figure 2 and Figure 7 It can be seen that a downwardly concave cavity is provided in the middle of the lower mold core 3, which is mainly used to place the subsequent molten resin. In addition, the gaps between the four sides of the cavity and the inner side of the lower mold core 3 are set as the lower mold inner adsorption holes 300, and the lower mold outer adsorption holes 301 are shaped as an annular cavity located outside the lower mold inner adsorption holes 300. When the robot uses the film clamping frame 8 to lay the film 7 flat on the lower mold core 3, as shown in FIG. Figure 11 Afterwards, the film 7 is completely spread into the concave cavity by the adsorption holes 300 on the inner side of the lower mold. Figure 16 Finally, the film 7 is spread out according to the surface shape of the lower mold core 3 and forms a rectangular depression in the middle thereof. The rectangular depression is the placement area of ​​the molten resin.

[0050] The actual working process mainly involves the following steps:

[0051] 1. Installation and fixation of the upper die base 1 and the lower die base 2: The upper die base 1 and the lower die base 2 are correspondingly installed in the press, and the press can realize the upper die base 1 and the lower die base 2 relative movement up and down.

[0052] 2. Film coating process of lower mold core 3 and upper mold core 4: Figure 10 and Figure 11 As shown, the mechanical multi-axis clamping arm uses the film clamping frame 8 to lay the two adhesive films 7 on the lower mold core 3 and the upper mold core 4 accordingly.

[0053] For the coating on the upper mold core 4, as Figure 4 and Figure 14 It can be seen that the film adsorption holes 401 are sucked by the vacuum pump, so that the adhesive film 7 is spread to the bottom of the upper mold core 4, and the adhesive film 7 at the panel adsorption holes 400 is punctured by the piercing mechanism.

[0054] For the coating on the lower mold core 3, as Figure 7 and Figure 16 It can be seen that the vacuum pump is used to make the inner adsorption holes 300 of the lower mold adsorb the film 7, and a rectangular depression with the same shape as the middle of the lower mold core 3 is generated in the middle of the film 7. The outer adsorption holes 301 of the lower mold are used to adsorb the film 7 so that the outer side of the film 7 is flattened to the surface of the lower mold core 3.

[0055] 3. Fixing the carrier 9: Use the robot to move the carrier 9 to be packaged to the bottom of the upper mold core 4, and use the vacuum pump to suck the panel adsorption holes 400 so that the panel adsorption holes 400 adsorb on the surface of the carrier 9. At this time, the carrier 9 is located below the upper mold core 4, and the panel adsorption holes 400 adsorb on the adhesive film 7 below the upper mold core 4. Figure 15 It should be noted that the chip 10 on the carrier board 9 is placed downward.

[0056] 4. Resin 11 injection process: The molten resin 11 is injected into the rectangular cavity of the lower mold core 3 using a delivery pipe. At this time, since the lower mold core 3 is provided with a film 7, the resin 11 is poured into the rectangular groove in the middle of the film 7, as shown in FIG. Figure 17 shown.

[0057] 5. Mold Closing Process: The upper mold base 1 is pressed downward by a press, and the carrier plate 9 on the upper mold core 4 is immersed in the resin 11. As the upper mold base 1 continues to move downward, the film 7 on the lower mold core 3 and the upper mold core 4 are pressed together. Figure 18 As shown. It should be noted that because the adhesive film 7 is tightly pressed between the carrier plate 9 and the upper mold core 4, the resin does not overflow onto the back of the carrier plate 9 and cause quality problems. Finally, after the resin cools, the press machine drives the upper mold base 1 relatively away from the lower mold base 2, completing the full encapsulation of the carrier plate 9.

[0058] The final packaged product is Figure 13 As shown, Figure 12 Compared with traditional packaging, the resin 11 can completely surround the carrier 9, which allows the chip 10 to be placed closer to the outer side of the carrier 9, thereby increasing the effective use area of ​​the carrier and making full use of the edge area that was originally wasted due to traditional packaging technology.

[0059] The second embodiment is a further disclosure of the hole-piercing mechanism described in the first embodiment. Figure 4-Figure 6 、 Figure 8 and Figure 9 It can be seen that during assembly, the hole-breaking mechanism 5 uses a spring pressure plate to fasten the reset push spring 502 and the film-breaking push spring 503 in the panel adsorption hole 400, wherein the film-breaking push spring 503 is located on the outer side of the reset push spring 502, and the two are coaxially arranged. The detection electric contact 6, the guide sleeve 500 and the fastening base 501 are sequentially installed in the panel adsorption hole 400. Among them, the detection electric contact 6 is connected to the external control system through a wire. Since there are two detection electric contacts 6, when the two detection electric contacts 6 are connected, an electric signal can be sent to the control system, thereby sounding an alarm; the guide sleeve 500 is composed of a hollow cylindrical tube, and the inner side of the upper and lower ends of the guide sleeve 500 is provided with an oblique angle; the fastening base 501 is fastened to the end of the panel adsorption hole 400 by the outer thread. From Figure 6 It can be seen that connecting holes 402 are opened in the upper mold core 4 in both the horizontal and vertical directions, so that the panel adsorption holes 400 in the upper mold core 4 are in a mutually connected state.

[0060] Before the fastening base 501 is installed, the adjusting sleeve 504 is installed in the guide sleeve 500. Figure 8 and Figure 9 As can be clearly seen, the adjustment sleeve 504 is annular in shape, and its outer portion is in sealed, sliding connection with the inner side of the guide sleeve 500, primarily utilizing a rubber ring. A spring-loaded stopper 505 is located on the side of the adjustment sleeve 504, protruding outward. The axial cross-section of the stopper 505 is a "cross" shape. Therefore, when the stopper 505 is installed in the adjustment sleeve 504, an annular block threaded onto the outer side of the adjustment sleeve 504 prevents the stopper 505 from disengaging.

[0061] The adjustment sleeve 504 is internally sealed and movable, housing a needle holder 506 with a T-shaped axial cross-section. Threaded onto the bottom of the adjustment sleeve 504 are multiple guide rods 508, which guide the needle holder 506 in its vertical motion. Springs are positioned outside the guide rods 508, leveraging their elastic force to ensure that the needle holder 506 consistently moves toward the adjustment sleeve 504. A circular groove is defined in the center of the needle holder 506. When the stop rod 505 abuts the groove, it prevents axial separation between the adjustment sleeve 504 and the needle holder 506. More importantly, a film-breaking pin 507 is threaded onto the bottom of the needle holder 506. This pin has a tapered base. When extended from the fastening base 501, it punctures the film 7 beneath the upper mold core 4.

[0062] In actual application, under normal circumstances, such as Figure 5 and Figure 8 As shown, the membrane-breaking push spring 503 pushes the adjustment sleeve 504 downward, and causes the stop rod 505 to reach the inclined surface at the bottom of the guide sleeve 500, and is blocked by the top of the fastening base 501, forcing the adjustment sleeve 504 to be unable to continue to move downward.

[0063] The needle seat 506 moves upward along the guide rod 508 under the action of the spring, causing the membrane-breaking ejector needle 507 to be retracted into the fastening base 501. Therefore, it can be seen that under normal conditions, the membrane-breaking ejector needle 507 does not extend outward.

[0064] During the operation of Example 1, before film coating is applied to the bottom of the upper mold core 4, a vacuum pump is used to apply suction to the panel suction holes 400. This action of the vacuum pump reduces the pressure in the chamber above the panel suction holes 400, causing the needle seat 506 and the adjustment sleeve 504 to move upward synchronously due to the reduced pressure. At this time, as the adjustment sleeve 504 moves upward, the stop rod 505 moves along the inclined surface at the bottom of the guide sleeve 500, compressing the spring. The stop rod 505 eventually rests in the annular groove on the outer side of the middle portion of the needle seat 506, ensuring that the adjustment sleeve 504 and needle seat 506 do not separate axially during the upward movement. As the adjustment sleeve 504 and needle holder 506 continue to move upward, the film-breaking push spring 503 and the return push spring 502 are compressed in sequence until the stop rod 505 moves to the top inclined surface of the guide sleeve 500. There, the stop rod 505 is affected by the stepped surface located inside the upper mold core 4 and above the top of the guide sleeve 500, preventing the adjustment sleeve 504 and needle holder 506 from moving further upward. The stop rod 505 then abuts against the top inclined surface of the guide sleeve 500. Generally, an annular arc groove is provided on the top inclined surface of the guide sleeve 500 to increase the resistance of the stop rod 505 as it moves downward.

[0065] Afterwards, as described in Example 1, the film 7 is adsorbed under the upper mold core 4 through the film adsorption hole 401, and then the hole-breaking work is performed. During this process, since the limit rod 505 hits the annular arc groove on the top slope of the guide sleeve 500, the resistance to the limit rod 505 being disengaged is relatively greater than the elastic force of the film-breaking push spring 503. Not only that, the limit rod 505 is pushed outward by the spring, so that the limit rod 505 is disengaged from the annular groove on the outside of the middle of the needle seat 506. When the vacuum pump on the panel adsorption hole 400 stops working, the reset push spring 502 will first push the needle seat 506 to move downward. The limit rod 505 moves downward and along the guide rod 508, while compressing the spring on the outside of the guide rod 508. When the top of the needle seat 506 is lower than the end of the limit rod 505, the needle seat 506 will also move downward to the limit position below the guide rod 508, and the spring on the guide rod 508 will also be unable to be compressed. Figure 20 shown.

[0066] The needle seat 506, as it descends further, presses down on the guide rod 508, further increasing the downward momentum of the adjustment sleeve 504 and forcing the stop rod 505 to disengage from the top of the guide sleeve 500. Subsequently, as the stop rod 505 moves along the top slope of the guide sleeve 500 toward the inner wall of the guide sleeve 500, the end of the stop rod 505 approaches the middle of the adjustment sleeve 504. However, at this point, the top of the needle seat 506 is located below the end of the stop rod 505. The membrane rupture spring 503 and the return spring 502 push the adjustment sleeve 504 and needle seat 506 downward. When the needle seat 506 disengages from the return spring 502, the spring pushes upward on the needle seat 506, causing its top end to abut against the end of the stop rod 505, thereby limiting its upward movement. At this time, as the adjustment sleeve 504 continues to move downward, the airflow in the adsorption hole 400 on the panel below the adjustment sleeve 504 will flow upward along the gap between the adjustment sleeve 504 and the needle seat 506, avoiding the problem that the airflow in the adsorption hole 400 on the panel below the adjustment sleeve 504 is squeezed, and the air squeezes downward on the adhesive film 7 below, causing bubbling of the adhesive film 7.

[0067] Subsequently, as the film-breaking spring 503 pushes the adjustment sleeve 504 downward, the end of the stop rod 505 will abut against the needle seat 506 and continue to push downward until the stop rod 505 moves again to the inclined surface below the guide sleeve 500. However, when the stop rod 505 approaches the inclined surface below the guide sleeve 500, the needle seat 506 has already extended downward to a certain extent, which will cause the film-breaking ejector pin 507 to extend from the bottom of the fastening base 501 before the stop rod 505 approaches the bottom of the guide sleeve 500. The extended film-breaking ejector pin 507 can then puncture the film 7 at the bottom below the upper mold core 4. Figure 21When the stop rod 505 is completely moved to the inclined surface below the guide sleeve 500, it is pushed by the spring to move the stop rod 505 away from the middle of the adjustment sleeve 504, thereby no longer blocking the end of the needle seat 506. The needle seat 506 is pushed upward by the spring to reset, allowing the membrane-breaking ejector 507 to automatically retract into the fastening base 501 after piercing the film 7.

[0068] Subsequently, the carrier plate 9 needs to be transported to the bottom of the upper mold core 4, and the vacuum adsorption work of the carrier plate 9 needs to be completed. During this process, the top of the panel adsorption hole 400 is sucked again by the vacuum pump, causing the needle seat 506 and the adjustment sleeve 504 to move upward again. However, the difference in this process is that since the opening below the panel adsorption hole 400 is blocked by the carrier plate 9, as the adjustment sleeve 504 and the needle seat 506 move upward, the air pressure in the panel adsorption hole 400 below the adjustment sleeve 504 will decrease. On the one hand, the low pressure is used to tighten and adsorb the carrier plate 9 below the upper mold core 4. On the other hand, the low-pressure air below also restricts the upward movement of the adjustment sleeve 504 and the needle seat 506.

[0069] Finally, under normal conditions, the adjustment sleeve 504 and the needle seat 506 will not continue to move upward, and the stop rod 505 will not move to the top inclined surface of the guide sleeve 500.

[0070] When a gap forms between the carrier plate 9 and the upper mold core 4, this gap can cause resin to infuse through the gap between the two. To avoid this problem, the present application connects all panel adsorption holes 400 located below the adjustment sleeve 504 through the connecting hole 402. This results in the panel adsorption holes 400 below the adjustment sleeve 504 being in the same chamber. Since the number of panel adsorption holes 400 is relatively dispersed, if each panel adsorption hole 400 is tightly fitted with the carrier plate 9, the seal between the carrier plate 9 and the upper mold core 4 is relatively good. Conversely, if a gap forms between the two, external airflow will flow into the panel adsorption holes 400 below the adjustment sleeve 504 through the gap. The inflow of air causes the pressure in the panel adsorption holes 400 below to rise relatively. Under the influence of the continuous suction of the vacuum pump, the adjustment sleeve 504 and the needle seat 506 will move upward again until the stop rod 505 moves again to the inclined surface above the guide sleeve 500. At the same time, the adjustment sleeve 504 that moves upward to this position will simultaneously abut against the detection electrical contacts 6, forcing the detection electrical contacts 6 to be connected. The detection electrical contacts 6 will feed back to the control unit in the form of electrical signals through the wires, thereby alerting the operator that there is an abnormality in the fixation of the carrier plate 9 under the upper mold core 4, and an inspection is required to avoid accidental outflow of resin during subsequent packaging.

Claims

1. A semiconductor full packaging molding die, characterized in that: include: The upper mold base and the lower mold base are provided with an upper mold core on the upper mold base and a lower mold core on the lower mold base; the upper mold core is provided with film adsorption holes for fixing the adhesive film and panel adsorption holes for fixing the carrier plate; the lower mold core is provided with lower mold inner side adsorption holes and lower mold outer side adsorption holes for adsorbing and fixing the adhesive film; The panel adsorption hole is provided with a puncture mechanism for puncturing the film; The hole-breaking mechanism includes: a reset push spring and a film-breaking push spring disposed in the panel adsorption hole; a detection electrical contact for detecting whether the carrier plate is correctly placed, a guide sleeve for limiting the movement of the adjustment sleeve, and a fastening base to prevent the adjustment sleeve from detaching are sequentially installed in the panel adsorption hole; the adjustment sleeve is sleeved inside the guide sleeve, and the side of the adjustment sleeve has a limit rod ejected outward by a spring, and a needle seat is sleeved inside; the needle seat is directed toward the adjustment sleeve by the guide rod and spring installed below the adjustment sleeve; a film-breaking ejector pin is installed at the bottom of the needle seat to puncture the film; After the carrier plate is immersed in the resin in the lower mold core, the resin can fully encapsulate the carrier plate; when a gap appears between the carrier plate and the upper mold core, the adjustment sleeve moves upward and hits the detection electrical contact. After the detection electrical contact is connected, an abnormal alarm is generated.

2. The semiconductor full packaging molding die according to claim 1, characterized in that: A recessed cavity for placing resin is provided in the middle of the surface of the lower mold core.

3. The semiconductor full packaging molding die according to claim 1, characterized in that: The guide sleeve is a cylindrical tube with a through middle portion and bevels are provided on the inner sides of the upper and lower ends.

4. The semiconductor full packaging molding die according to claim 1, characterized in that: A connecting hole is provided inside the upper mold core to connect the panel adsorption holes to each other.

5. The semiconductor full packaging molding die according to claim 1, characterized in that: An annular groove is provided in the middle of the needle seat, and the limiting rod abuts against the annular groove to prevent the adjusting sleeve and the needle seat from being axially separated.

6. A method for forming a semiconductor full package molding die according to claim 1, characterized in that: The following steps are involved: S1. The upper die base and the lower die base are installed in a press, and the press is used to realize the upper die base and the lower die base to move up and down relative to each other; S2, the mechanical multi-axis clamping arm lays the film flat on the lower mold core and the upper mold core respectively; S3. For film coating on the upper mold core, use a vacuum pump to suck the film adsorption holes so that the film is spread flat to the bottom of the upper mold core, and use a piercing mechanism to puncture the film at the adsorption holes of the panel; S4. For film coating on the lower mold core, use a vacuum pump to allow the inner suction holes of the lower mold to absorb the film, creating a rectangular groove in the middle of the film that is the same shape as the middle of the lower mold core. Then, use the outer suction holes of the lower mold to absorb the film, so that the outer side of the film is flattened onto the surface of the lower mold core. S5. The robot moves the carrier to be packaged to the bottom of the upper mold core, and uses a vacuum pump to suck the panel adsorption holes so that the panel adsorption holes are adsorbed to the surface of the carrier; S6, the delivery pipe pours the molten resin into the rectangular groove in the middle of the film; S7. The press machine pushes the upper mold base downward, and the carrier board on the upper mold core is immersed in the resin. As the upper mold base continues to move downward, the films on the lower mold core and the upper mold core are pressed together to complete the full encapsulation of the carrier board.

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