Semiconductor iron ring overturning and lifting device and method

Abstract

The invention discloses a semiconductor iron ring overturning and lifting device and method. The turnover lifting device comprises a driving box and a turnover mechanism arranged on one side of the driving box, and the turnover mechanism comprises two clamping ring arms capable of moving oppositely; the opposite sides of the ring clamping arms are uniformly provided with iron ring driving and flattening pieces and a plurality of groups of arch measuring mechanisms; the iron ring driving and flattening pieces comprise a plurality of ring adapting liquid bags; the arch measuring mechanism and the turnover mechanism are both connected with the control system. When the overturning mechanism is used for clamping the iron ring and injecting liquid into all the ring adapting liquid bags, the multiple ring adapting liquid bags can form a flexible wave topological structure, the iron ring is flexibly extruded to automatically slide to the same-phase wave peak valley position of the topological structure, and external force horizontal calibration of the iron ring is achieved. The arch measuring mechanism is used for generating an electric signal when the iron ring is stressed unevenly, and the control system can dynamically adjust the clamping force parameter of the turnover mechanism according to the electric signal. According to the invention, the flexible lossless clamping and automatic horizontal calibration of the semiconductor iron ring are realized through the synergistic effect of the ring adapting liquid bag embedded in the ring clamping arm and the inelastic bag binding wire.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and more specifically, to a semiconductor iron ring flipping, lifting device and method. Background Art

[0002] In the field of semiconductor manufacturing, as a core component for wafer loading and transmission, the performance of the iron ring is directly related to the yield and production efficiency of chip manufacturing. Through precise design, the iron ring can firmly hold the edge of the wafer, ensuring its precise positioning on the vacuum chuck, and effectively preventing the wafer from shifting or deforming during high-speed rotation coating, lithography and other processes. During the automated transmission process, the iron ring needs to cooperate seamlessly with equipment such as robotic arms and transmission tracks to achieve smooth grasping, flipping and lifting of the wafer.

[0003] In semiconductor manufacturing processes, operations such as clamping, flipping and positioning of iron rings (such as wafer carrier rings, reaction chamber sealing rings, etc.) as precision components are crucial for process yield. Traditional iron ring processing devices mostly use rigid mechanical jaws or pneumatic fixtures to achieve clamping. The contact surface of the rigid jaws cannot adapt to the slight inclination or surface unevenness of the iron ring, and local pressure concentration is likely to cause plastic deformation of the iron ring, affecting the subsequent process accuracy. Therefore, the present invention proposes a semiconductor iron ring flipping, lifting device and method. Summary of the Invention

[0004] The present invention provides a semiconductor iron ring flipping, lifting device and method, which solve the technical problem in related technologies that the contact surface of the rigid jaws cannot adapt to the slight inclination or surface unevenness of the iron ring, and local pressure concentration is likely to cause plastic deformation of the iron ring, affecting the subsequent process accuracy.

[0005] The first aspect of the present invention provides a semiconductor iron ring flipping, lifting device, including a driving force box and a flipping mechanism arranged on one side of the driving force box; the flipping mechanism includes two clamping ring arms that can move towards each other in the horizontal direction for clamping the iron ring; evenly distributed iron ring flattening members and multiple groups of arch measuring mechanisms are arranged on the opposite sides of the clamping ring arms; both the arch measuring mechanism and the flipping mechanism are connected to a control system; The iron ring flattening member includes a plurality of ring - adapting liquid sacs arranged at equal intervals, and non - elastic bundle filaments are fixed on the inner wall of each ring - adapting liquid sac. When the flipping mechanism clamps the iron ring and injects liquid into the plurality of ring - adapting liquid sacs, the plurality of ring - adapting liquid sacs can form a flexible wave topology structure, and through flexible extrusion, the iron ring can be automatically slipped to the in - phase wave peak - valley positions within the flexible wave topology structure, realizing external force horizontal calibration of the iron ring; The arch measurement mechanism includes a first conductive arch piece and a second conductive piece disposed above and below the adaptable ring liquid sac. When the iron ring clamped by the flipping mechanism bulges due to uneven force, the bulging part of the iron ring can drive the first conductive arch piece to deform and contact the second conductive piece, thereby generating an electrical signal. The control system can dynamically adjust the clamping force parameters of the flipping mechanism according to the electrical signal to achieve force-deformation closed-loop control.

[0006] Further, a lifting main frame is provided on the side of the driving force box away from the flipping mechanism. The driving force box is fixedly connected to the elevator in the lifting main frame, and the driving force box is controlled by the elevator in the lifting main frame to move up and down.

[0007] Further, the flipping mechanism further includes a protective box. A flipping motor component is fixedly provided at the central position on the side of the protective box close to the driving force box, and the flipping motor component is fixed in the driving force box. The protective box can be flipped under the drive of the flipping motor component.

[0008] Further, a rotating shaft is fixedly provided at the central position inside the protective box. Two pull plates are rotatably provided at both ends of the rotating shaft. A limiting plate is provided outside one of the two pull plates. A driving arm cylinder is fixedly provided on one side of the limiting plate, and the driving arm cylinder is fixedly connected to the back plate of the protective box. One end of each of the two pull plates is fixedly connected to a clamping ring arm respectively.

[0009] Further, the clamping ring area of the clamping ring arm is a clamping ring groove. When in the initial state, the side wall of the adaptable ring liquid sac is flush with the inner wall of the clamping ring groove.

[0010] Further, the liquid inlet ends of several adaptable ring liquid sacs are all fixedly connected to a liquid conveying pipe. The liquid conveying pipe is fixedly connected to the clamping ring arm. The end of the liquid conveying pipe away from the adaptable ring liquid sac is connected to an outlet liquid sac, and two outlet liquid sacs are provided, corresponding to the liquid conveying pipes on the two clamping ring arms respectively.

[0011] Further, a fixing plate is fixedly provided above the two outlet liquid sacs. An extrusion plate is fixedly provided on the lower wall of the fixing plate, and the lower wall of the extrusion plate is fixedly connected to the telescopic arm of a pressure control cylinder. The fixing plate is fixedly connected to the shell of the pressure control cylinder through a connecting plate. The two outlet liquid sacs are clamped between the extrusion plate and the fixing plate.

[0012] Further, limiting ring strips are fixedly provided on both the upper and lower parts of the clamping ring groove. The thickness dimensions of the two limiting ring strips gradually increase from the far side to the side of the adaptable ring liquid sac. Several groups of the first conductive arch pieces and the second conductive pieces are closely attached to the limiting ring strips.

[0013] Furthermore, a measuring arch piece is fixedly provided on the upper wall of the limiting ring bar, and one side edge of the measuring arch piece is fixed to both the conductive arch piece 1 and the conductive arch piece 2. An insulating layer is provided on the inner side of the measuring arch piece close to the fixed edge, and two tilting points are fixedly provided on the insulating layer. The two tilting points correspond to the conductive arch piece 1 and the conductive piece 2 respectively, and the conductive arch piece 1 and the conductive piece 2 are respectively connected to the intelligent control module through wires.

[0014] A second aspect of the present invention provides a method for using a semiconductor iron ring flip lifting device, comprising the following steps: S1, initial positioning stage: The elevator in the lifting main frame drives the driving box to move vertically, driving the protective box and the clamping ring arm to reach the preset working height, so that the semiconductor iron ring to be processed enters the operating area between the two clamping ring arms; S2, synchronous clamping stage: the control system starts the arm drive cylinder, which rotates synchronously with the pull plate around the rotary axis through the limit plate, driving the two clamping ring arms to move horizontally towards each other; During the clamping process, the wedge-shaped structure of the ring limiter guides the semiconductor iron ring into the clamping ring groove to complete the initial mechanical clamping; S3, fluid calibration stage: After the clamping arm clamps the semiconductor iron ring according to the preset system, the pressure-controlled cylinder drives the extrusion plate to perform progressive extrusion on the liquid outlet bag, and the pressurized fluid is injected into the ring-fitting liquid bag through the liquid pipe; The ring-fitting sac forms a periodic wave topology under the constraint of the inelastic bundle sac wire. The fluid pressure difference is used to make the iron ring automatically slide to the same phase peak-trough position of multiple ring-fitting sacs, thus realizing the hydrodynamic calibration of the iron ring's horizontal posture. S4, deformation monitoring stage: During the continuous clamping process, the measuring arch pieces distributed on the limit ring bar monitor the deformation of the iron ring in real time: (a) When the iron ring remains flat, the measuring arch piece maintains non-conductive contact with the conductive arch piece 1 and the conductive arch piece 2 only through the insulating layer; (b) When the iron ring bulges due to stress concentration, the bulge compresses the measuring arch piece, causing it to elastically deform. This causes the conductive end of the measuring arch piece to contact both the first and second conductive arch pieces simultaneously, forming a closed-loop electrical signal path. S5, dynamic adjustment stage: The intelligent control module adjusts the output pressure of the pressure control cylinder in real time through the control algorithm according to the number and distribution characteristics of the received electrical signals, and dynamically optimizes the wave topology of the ring-adapting sac; When the electrical signal disappears, it indicates that the iron ring has returned to a flat state, and the current pressure parameters are maintained; Finally, the flip motor drives the protective box to complete the flipping operation, realizing the spatial posture transformation of the iron ring.

[0015] Compared with the prior art, the present invention has the following beneficial effects: Through the cooperative action of the adaptable liquid sac embedded in the clamping ring arm and the inelastic bundle sac filaments, the present invention realizes the flexible and non-destructive clamping and automatic horizontal calibration of the semiconductor iron ring. By means of the flexible wave topology structure that dynamically fits the contour of the iron ring, after injecting liquid, wave peaks and valleys with consistent phases are formed on the surface of the liquid sac. The fluid inertia is utilized to guide the iron ring to autonomously slide to the theoretical horizontal position, eliminating the manual alignment error. The inelastic bundle sac filaments serve as the inner lining skeleton, which not only restricts the excessive expansion of the liquid sac but also maintains the phase stability of the wave structure through its inelastic characteristics. The equidistant array design of the adaptable liquid sac can be compatible with iron rings of different curvature radii. A single set of devices can be adapted to multiple specifications of products, significantly reducing the equipment changeover cost. This design breaks through the limitations of rigid clamping. While ensuring the structural integrity of the iron ring, it improves the calibration efficiency, especially suitable for high-precision semiconductor manufacturing scenarios. Description of the Drawings

[0016] Figure 1 is the overall structural schematic diagram of a semiconductor iron ring flipping and lifting device in Embodiment 1; Figure 2 is the internal structural schematic diagram of a driving force box of the present invention in Embodiment 1; Figure 3 is Figure 2 the enlarged schematic diagram at A in Figure 4 is the initial state structural schematic diagram of an adaptable liquid sac in Embodiment 1; Figure 5 is the structural schematic diagram of a liquid outlet sac in Embodiment 1; Figure 6 is the internal structural schematic diagram of an adaptable liquid sac in Embodiment 1; Figure 7 is the expansion structural schematic diagram of an adaptable liquid sac in Embodiment 1; Figure 8 is the structural schematic diagram of a arch measurement mechanism in Embodiment 1; Figure 9 is the back structural schematic diagram of an arch measurement piece in Embodiment 1.

[0017] Description of the reference numerals: 11, driving force box; 12, lifting main frame; 13, flipping motor part; 2, flipping mechanism; 21, clamping ring arm; 22, clamping ring groove; 221, pressure control cylinder; 222, ring limiting strip; 223, adaptable liquid sac; 224, liquid conduction pipe; 226, bundle sac filament; 227, fixing plate; 228, extrusion plate; 229, liquid outlet sac; 23, protective box; 24, rotating shaft; 25, driving arm cylinder; 26, limiting plate; 27, pulling plate; 3, arch measurement mechanism; 31, conductive arch piece 1; 32, conductive piece 2; 33, arch measurement piece; 34, elastic strip; 35, insulating layer; 36, warping point; 38, intelligent control module. Detailed Description of the Embodiment

[0018] Reference will now be made to exemplary embodiments to discuss the subject matter described herein. It should be understood that discussing these embodiments is only to enable those skilled in the art to better understand and thus implement the subject matter described herein. Without departing from the scope of protection of the content of this specification, changes can be made to the functions and arrangements of the elements discussed. Each example can omit, substitute, or add various processes or components as needed. Additionally, the features described for some examples can also be combined in other examples.

[0019] Example 1 As Figures 1-9 shown, a semiconductor iron ring flipping and lifting device provided in this embodiment includes a driving force box 11 and a flipping mechanism 2 disposed on one side of the driving force box 11. The flipping mechanism 2 includes two clamping ring arms 21 that can move towards each other in the horizontal direction for clamping the iron ring. On the opposite sides of the clamping ring arms 21, iron ring flattening members and multiple groups of arch measurement mechanisms 3 are evenly distributed. Both the arch measurement mechanism 3 and the flipping mechanism 2 are connected to the control system.

[0020] The iron ring flattening member includes a plurality of ring - fitting liquid sacs 223 arranged at equal intervals. On the inner wall of each ring - fitting liquid sac 223, inelastic bundle filaments 226 are fixed. The inelastic bundle filaments can limit the lateral expansion of the ring - fitting liquid sac 223 during liquid injection, only allowing its longitudinal deformation. When the flipping mechanism 2 clamps the iron ring and injects liquid into the multiple ring - fitting liquid sacs 223, the multiple ring - fitting liquid sacs 223 can form a flexible wave topology structure, and through flexible extrusion, the iron ring can be automatically slipped to the same - phase wave peak - valley positions within the flexible wave topology structure, realizing the external force horizontal calibration of the iron ring.

[0021] The arch measurement mechanism 3 includes a first conductive arch piece 31 and a second conductive piece 32 disposed above and below the ring - fitting liquid sac 223. When the iron ring clamped by the flipping mechanism 2 bulges due to uneven force, the bulging part of the iron ring can drive the first conductive arch piece 31 to deform and contact the second conductive piece 32, thereby generating an electrical signal, which can be a current signal, etc. The control system can dynamically adjust the clamping force parameters of the flipping mechanism 2 based on this electrical signal to achieve force - deformation closed - loop control.

[0022] On the side of the driving force box 11 away from the flipping mechanism 2, a lifting main frame 12 is provided. The driving force box 11 is fixedly connected to the elevator in the lifting main frame 12, and the driving force box 11 is controlled by the elevator in the lifting main frame 12 to perform lifting.

[0023] The flipping mechanism 2 further includes a protective box 23. At the central position on the side of the protective box 23 close to the driving force box 11, a flipping motor part 13 is fixedly provided, and the flipping motor part 13 is fixed in the driving force box 11. The protective box 23 can be flipped under the drive of the flipping motor part 13.

[0024] At the central position inside the protective box 23, a rotating shaft 24 is fixedly arranged. At both ends of the rotating shaft 24, a follower plate 27 is rotatably arranged. And a limiting plate 26 is arranged outside one of the two follower plates 27. On one side of the limiting plate 26, a driving arm cylinder 25 is fixedly arranged, and the driving arm cylinder 25 is fixedly connected to the back plate of the protective box 23. One end of each of the two follower plates 27 away from the follower plate 27 is fixedly connected to a clamping ring arm 21.

[0025] The clamping ring area of the clamping ring arm 21 is a clamping ring groove 22. When in the initial state, the side wall of the adaptable ring liquid sac 223 is flush with the inner wall of the clamping ring groove 22.

[0026] The liquid inlet ends of a plurality of adaptable ring liquid sacs 223 are all fixedly connected to a liquid passing pipe 224. The liquid passing pipe 224 is fixedly connected to the clamping ring arm 21. One end of the liquid passing pipe 224 away from the adaptable ring liquid sac 223 is connected to a liquid outlet sac 229. And two liquid outlet sacs 229 are provided, corresponding to the liquid passing pipes 224 on the two clamping ring arms 21 respectively.

[0027] Above the two liquid outlet sacs 229, a fixing plate 227 is fixedly arranged. On the lower wall of the fixing plate 227, a pressing plate 228 is fixedly arranged. And the lower wall of the pressing plate 228 is fixedly connected to the telescopic arm of the pressure control cylinder 221. The fixing plate 227 is fixedly connected to the shell of the pressure control cylinder 221 through a connecting plate. The two liquid outlet sacs 229 are clamped between the pressing plate 228 and the fixing plate 227.

[0028] Limit ring strips 222 are fixedly arranged on both the upper and lower parts of the clamping ring groove 22. The thickness dimensions of the two limit ring strips 222 gradually increase from the far side to the side of the adaptable ring liquid sac 223. A plurality of groups of conductive arch pieces one 31 and conductive pieces two 32 are closely attached to the limit ring strips 222.

[0029] On the upper wall of the limit ring strip 222, a measuring arch piece 33 is fixedly arranged. And one side edge of the measuring arch piece 33 is fixed to both the conductive arch piece one 31 and the conductive piece two 32. Inside the measuring arch piece 33 near the fixed edge, an insulating layer 35 is arranged. On the insulating layer 35, two warping points 36 are fixedly arranged. The two warping points 36 respectively correspond to the conductive arch piece one 31 and the conductive piece two 32. The conductive arch piece one 31 and the conductive piece two 32 are respectively connected to the intelligent control module 38 through wires.

[0030] Embodiment 2 This embodiment provides a method for using a semiconductor iron ring flipping and lifting device, including the following steps: S1. Initial positioning stage: Drive the driving force box 11 to move vertically through the elevator in the lifting main frame 12, drive the protective box 23 and the clamping ring arm 21 to reach the preset operation height, and make the semiconductor iron ring to be processed enter the operation area between the two clamping ring arms 21. S2, synchronous clamping stage: the control system starts the arm drive cylinder 25, which pulls the pull plate 27 to rotate synchronously around the rotary axis 24 through the limit plate 26, driving the two clamping ring arms 21 to move horizontally toward each other; During the clamping process, the wedge-shaped structure of the ring-limiting bar 222 guides the semiconductor iron ring into the clamping ring groove 22 to complete the initial mechanical clamping; S3, fluid calibration stage: After the clamping arm 21 clamps the semiconductor iron ring according to the preset system, the pressure-controlled cylinder 221 drives the extrusion plate 228 to perform progressive extrusion on the liquid outlet capsule 229, and the pressurized fluid is injected into the ring-fitting liquid capsule 223 through the liquid passage 224; The ring-adapting liquid capsule 223 forms a periodic wave topology under the constraint of the inelastic bundle filament 226. The iron ring is automatically slid to the same phase peak-trough position of multiple ring-adapting liquid capsules 223 by using the fluid pressure difference, thus realizing the hydrodynamic calibration of the horizontal posture of the iron ring. S4, deformation monitoring stage: During the continuous clamping process, the measuring arch pieces 33 distributed on the ring limit bar 222 monitor the deformation of the iron ring in real time: When the iron ring is kept flat, the measuring arch piece 33 maintains non-conductive contact with the conductive arch piece 1 31 and the conductive arch piece 2 32 only through the insulating layer 35; b. When the iron ring bulges due to stress concentration, the bulged area presses the measuring arch piece 33 to cause it to elastically deform, causing the conductive end of the measuring arch piece 33 to contact the conductive arch piece 1 31 and the conductive piece 2 32 at the same time, forming a closed-loop electrical signal path; S5, dynamic adjustment stage: the intelligent control module 38 adjusts the output pressure of the pressure control cylinder 221 in real time through the control algorithm according to the number and distribution characteristics of the received electrical signals, and dynamically optimizes the wave topology of the ring-adapting liquid capsule 223; When the electrical signal disappears, it indicates that the iron ring has returned to a flat state, and the current pressure parameters are maintained; Finally, the flip motor 13 drives the protective box 23 to complete the flipping operation, thereby realizing the spatial posture conversion of the iron ring.

[0031] During operation, the elevator in the lifting main frame 12 drives the protective box 23 to the specified position, so that the semiconductor iron ring is just between the two clamping ring arms 21, and then the system controls the arm driving cylinder 25 to work and pull the limit plate 26 toward the rotating shaft 24, thereby driving the follow-up plate 27 in the same direction as the arm driving cylinder 25 to move toward the rotating shaft 24 through the rotating shaft 24, and the clamping ring arm 21 on the other side is just driven by the rotating shaft 24 to move toward the rotating shaft 24. At this time, the two clamping ring arms 21 move toward the center position at the same time until the semiconductor iron ring is clamped in the clamping ring groove 22.

[0032] When the two clamping ring arms 21 move toward the semiconductor iron ring at the same time, the semiconductor iron ring can be scooped up by the ring limiting strip 222 and just fall into the clamping ring groove 22; When the semiconductor iron ring runs to the position set by the system, it just fits the semiconductor iron ring to be clamped at this time. If the iron ring tilts when clamping the semiconductor iron ring, the clamping force of the two clamping ring arms 21 on the semiconductor iron ring will change, and the phenomenon of arching may occur, which will affect the semiconductor iron ring. When the two clamping ring arms 21 clamp the semiconductor iron ring, the system controls the pressure control cylinder 221 to work, causing the extrusion plate 228 to rise and simultaneously extruding the two liquid outlet sacs 229. The liquid in the two liquid outlet sacs 229 enters the liquid conduction pipe 224 through their respective corresponding pipes, and is shunted to each ring-fitting liquid sac 223 through the liquid conduction pipe 224. And through the gradual increase of the hydraulic pressure, the ring-fitting liquid sac 223 expands. Due to the binding tension of the multiple beam filaments 226 on the inner wall of the ring-fitting liquid sac 223, the ring-fitting liquid sac 223 forms a wavy shape. If the semiconductor iron ring tilts, at this time, the positions of the wave peaks and valleys where the semiconductor iron ring is located may be different. With the extrusion force exerted by the peak ridges of the ring-fitting liquid sac 223 on the semiconductor iron ring, the semiconductor iron ring can be automatically moved to the height of the position of the peaks and valleys of most ring-fitting liquid sacs 223, thus achieving external force leveling. If, under the clamping of the two clamping ring arms 21, the semiconductor iron ring deforms under pressure to form an arch, and the arched position of the semiconductor iron ring will squeeze the arch measurement piece 33, causing the arch measurement piece 33 to be in contact with the first conductive arch piece 31 and the second conductive piece 32 at the same time, making the first conductive arch piece 31 and the second conductive piece 32 energized, and then transmitting an electrical signal to the intelligent control module 38. The larger the arched radian of the semiconductor iron ring, the more arch measurement pieces 33 are squeezed, and the more electrical signals the intelligent control module 38 receives. And the intelligent control module 38 can control the adjustment of the pressure control cylinder 221 through an intelligent algorithm to adjust the clamping force of the two clamping ring arms 21 on the semiconductor iron ring until the semiconductor iron ring no longer touches all the arch measurement pieces 33. At this time, under the action of the elastic strip 34 and the two tipping points 36, the conductive ends of the arch measurement pieces 33 are not in contact with the first conductive arch piece 31 and the second conductive piece 32.

[0033] Finally, the flipping motor part 13 drives the protective box 23 and the clamping ring arms 21 to flip 180°.

[0034] The above describes the embodiments of the present invention, but the present invention is not limited to the above specific embodiments. The above specific embodiments are only illustrative and not restrictive. Under the inspiration of this embodiment, those of ordinary skill in the art can also make many forms, all of which fall within the protection scope of this embodiment.

Claims

1. A semiconductor iron ring flipping and lifting device, characterized in that, It includes a driving force box (11) and a flipping mechanism (2) arranged on one side of the driving force box (11); the flipping mechanism (2) includes two clamping ring arms (21) that can move towards each other in the horizontal direction for clamping an iron ring; on the opposite sides of the clamping ring arms (21), iron ring flattening members and multiple groups of arch measuring mechanisms (3) are evenly distributed; both the arch measuring mechanism (3) and the flipping mechanism (2) are connected to a control system; The iron ring flattening member includes a plurality of ring - fitting liquid sacs (223) arranged at equal intervals. An inelastic bundle sac wire (226) is fixed to the inner wall of each ring - fitting liquid sac (223). When the flipping mechanism (2) clamps the iron ring and injects liquid into the multiple ring - fitting liquid sacs (223), the multiple ring - fitting liquid sacs (223) can form a flexible wave topology structure, and through flexible extrusion, the iron ring can automatically slide to the same - phase wave peak - valley positions within the flexible wave topology structure, realizing the horizontal calibration of the external force of the iron ring; The arch measuring mechanism (3) includes a first conductive arch piece (31) and a second conductive piece (32) arranged above and below the ring - fitting liquid sac (223). When the iron ring clamped by the flipping mechanism (2) bulges due to uneven force, the bulging part of the iron ring can drive the first conductive arch piece (31) to deform and contact the second conductive piece (32), thereby generating an electrical signal. The control system can dynamically adjust the clamping force parameters of the flipping mechanism (2) according to the electrical signal, realizing force - deformation closed - loop control.

2. The semiconductor iron ring flipping and lifting device according to claim 1, wherein On the side of the driving force box (11) away from the flipping mechanism (2), a lifting main frame (12) is arranged. The driving force box (11) is fixedly connected to the elevator in the lifting main frame (12), and the driving force box (11) is controlled by the elevator in the lifting main frame (12) to move up and down.

3. The semiconductor iron ring turnover and lifting device according to claim 1, characterized in that, The flipping mechanism (2) further includes a protective box (23). At the central position on the side of the protective box (23) close to the driving force box (11), a flipping motor part (13) is fixedly arranged, and the flipping motor part (13) is fixed in the driving force box (11). The protective box (23) can be flipped under the drive of the flipping motor part (13).

4. A semiconductor iron ring flipping and lifting device according to claim 3, characterized in that At the central position inside the protective box (23), a rotating shaft (24) is fixedly arranged. Rotating plates (27) are rotatably arranged at both ends of the rotating shaft (24). A limiting plate (26) is arranged outside one of the two rotating plates (27). A driving arm cylinder (25) is fixedly arranged on one side of the limiting plate (26), and the driving arm cylinder (25) is fixedly connected to the back plate of the protective box (23). One end of each of the two rotating plates (27) is fixedly connected to a clamping ring arm (21).

5. A semiconductor iron ring flipping and lifting device according to claim 1, characterized in that, The clamping area of the clamping ring arm (21) is a clamping ring groove (22). When in the initial state, the side wall of the ring - fitting liquid sac (223) is flush with the inner wall of the clamping ring groove (22).

6. A semiconductor iron ring flipping and lifting device according to claim 1, characterized in that, The liquid inlet ends of several ring - fitting liquid sacs (223) are all fixedly connected to a liquid - passing pipe (224). The liquid - passing pipe (224) is fixedly connected to the clamping ring arm (21). The end of the liquid - passing pipe (224) away from the ring - fitting liquid sac (223) is connected to an outlet liquid sac (229), and there are two outlet liquid sacs (229) in total, corresponding to the liquid - passing pipes (224) on the two clamping ring arms (21) respectively.

7. A semiconductor iron ring flipping and lifting device according to claim 6, characterized in that, Above the two liquid outlet sacs (229), a fixing plate (227) is fixedly arranged. On the lower wall of the fixing plate (227), a pressing plate (228) is fixedly arranged, and the lower wall of the pressing plate (228) is fixedly connected to the telescopic arm of the pressure control cylinder (221). The fixing plate (227) is fixedly connected to the outer shell of the pressure control cylinder (221) through a connecting plate. The two liquid outlet sacs (229) are clamped between the pressing plate (228) and the fixing plate (227).

8. A semiconductor iron ring flipping and lifting device according to claim 5, characterized in that, Limit ring strips (222) are fixedly arranged at both the upper and lower parts of the clamping ring groove (22). The thickness dimensions of the two limit ring strips (222) gradually increase from the far side to the side of the adaptable liquid sac (223). A plurality of groups of the first conductive arch pieces (31) and the second conductive pieces (32) are closely attached to the limit ring strips (222).

9. A semiconductor iron ring flipping and lifting device according to claim 8, characterized in that, On the upper wall of the limit ring strip (222), a measuring arch piece (33) is fixedly arranged. One side edge of the measuring arch piece (33) is fixed to both the first conductive arch piece (31) and the second conductive piece (32). An insulating layer (35) is arranged inside the measuring arch piece (33) near the fixed edge. Two warping points (36) are fixedly arranged on the insulating layer (35). The two warping points (36) respectively correspond to the first conductive arch piece (31) and the second conductive piece (32). The first conductive arch piece (31) and the second conductive piece (32) are respectively connected to the intelligent control module (38) through wires.

10. A method of using the semiconductor iron ring flipping and lifting device according to any one of claims 1-9, characterized in that, It includes the following steps: S1. Initial positioning stage: The elevator in the lifting main frame (12) drives the driving force box (11) to move vertically, driving the protective box (23) and the clamping ring arms (21) to reach the preset operation height, so that the semiconductor iron ring to be processed enters the operation area between the two clamping ring arms (21). S2. Synchronous clamping stage: The control system starts the driving arm cylinder (25). Through the limiting plate (26), the following pulling plate (27) is pulled to rotate synchronously around the return shaft (24), driving the two clamping ring arms (21) to move horizontally towards each other. During the clamping process, the wedge-shaped structure of the limit ring strip (222) guides the semiconductor iron ring into the clamping ring groove (22) to complete the initial mechanical clamping. S3. Fluid calibration stage: When the clamping ring arms (21) clamp the semiconductor iron ring according to the preset system, the pressure control cylinder (221) drives the pressing plate (228) to gradually squeeze the liquid outlet sacs (229), and the pressure fluid is injected into the adaptable liquid sacs (223) through the liquid delivery pipe (224). The adaptable liquid sacs (223) form a periodic wave topology structure without the constraint of the elastic bundle filaments (226). Using the fluid pressure difference, the iron ring automatically slides to the same-phase wave crest-wave trough positions of the multiple adaptable liquid sacs (223) to achieve the hydrodynamic calibration of the horizontal attitude of the iron ring. S4. Deformation monitoring stage: During the continuous clamping process, the measuring arch pieces (33) distributed on the limit ring strip (222) monitor the deformation of the iron ring in real time: (a) When the iron ring remains flat, the measuring arch piece (33) only maintains non-conductive contact with the first conductive arch piece (31) and the second conductive piece (32) through the insulating layer (35). (b)When the iron ring arches due to stress concentration, the arched area presses the arch measuring piece (33) to cause elastic deformation, resulting in the conductive ends of the arch measuring piece (33) contacting the first conductive arch piece (31) and the second conductive piece (32) simultaneously, forming a closed-loop electrical signal path; S5. Dynamic adjustment stage: The intelligent control module (38) adjusts the output pressure of the pressure control cylinder (221) in real time through a control algorithm according to the received number and distribution characteristics of electrical signals, and dynamically optimizes the wave topology structure of the adaptive ring liquid sac (223); When the electrical signal disappears, it indicates that the iron ring has returned to a flat state, and the current pressure parameters are maintained at this time; Finally, the flip motor part (13) drives the protective box (23) to complete the flipping operation, realizing the spatial attitude conversion of the iron ring.

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