Dust removal and anti-static device for circuit board patching

Abstract

The application discloses dust-removing and anti-static equipment for circuit board pasting, and relates to the field of printed circuits, which comprises a box body, a negative pressure bin is installed in the box body, conveying mechanisms for conveying circuit boards are arranged at both ends of the negative pressure bin, a static electricity removing roller for contacting the surface of the circuit board is rotatably connected to one side of the negative pressure bin, elastic return mechanisms are arranged between the bottom of the negative pressure bin and the inner wall of the negative pressure bin, a fixed bin is further arranged, telescopic bins are slidably connected to both ends of the fixed bin, the top surfaces of the telescopic bins and the fixed bin are in contact with the bottom surface of the circuit board, and dust filter plates are arranged at the bottom of the telescopic bins. The dust and other sundries in the through holes of the circuit board are cleaned by the negative pressure in the negative pressure bin, so that the circuit board is effectively cleaned, and the surface of the cleaned circuit board is contacted with the static electricity removing roller, so that the static electricity removing effect is better.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of printed circuits, in particular to a dust removal and anti-static equipment for circuit board patching. BACKGROUND

[0002] Electronic circuit surface mounting technology, also known as surface mounting or surface mounting technology, is a circuit connection technology that installs pinless or short lead surface mounted components on the surface of a printed circuit board or other substrate, and is welded and assembled through reflow soldering or immersion soldering.

[0003] The existing circuit board patching process includes tin paste printing, part mounting, reflow soldering, optical detection, maintenance and board separation in sequence. The surface of the circuit board needs to be kept clean before the tin paste printing process, and foreign matter such as small board scraps, dust, fibers, hair, skin debris and metal particles on the surface of the circuit board is cleaned to eliminate virtual soldering, empty soldering, warping and skewing in advance, thereby improving product quality.

[0004] A PCB roller dust removal and static elimination equipment used in an SMT line is disclosed in Chinese Patent No. CN221017502U, which includes a touch screen, a rubber roller cleaning bin, a brush support bin, a terminal block, a PLC, a relay, and an ion wind rod. The touch screen is arranged on the surface of the equipment. The brush support bin is arranged on the inner side of the middle part of the equipment, and an anti-static brush roller is arranged in the brush support bin. The rubber roller cleaning bin is arranged on the inner side of the upper part of the elimination equipment, and a dust sticking rubber roller and a transmission guide rail are arranged in the rubber roller cleaning bin. The transmission guide rail is arranged on the top of the anti-static brush roller. The inlet end and the outlet end of the transmission guide rail are respectively provided with a front dust removal rubber roller and a rear dust removal rubber roller. The dust sticking rubber roller is arranged above the front and rear dust removal rubber rollers and is tangent to them. The relay, PLC and terminal block are arranged on the inner side of the bottom of the equipment. The ion wind rod is installed above the outlet of the transmission guide rail.

[0005] In view of the above related technology, the circuit board in the prior art has generally completed the punching process before tin paste printing. The diameters of the holes on the circuit board for inserting elements or serving as conductive holes are different, and a small amount of dust or other impurities may exist in some of the holes. The adhesion of impurities in the prior art cannot effectively clean the holes in the circuit board. A small amount of impurities in the holes of the circuit board may cause problems such as poor soldering in the subsequent part mounting process, ultimately affecting the patching quality of the circuit board. In summary, the existing dust removal and anti-static equipment for circuit board patching cannot effectively clean the holes in the circuit board. SUMMARY

[0006] Based on this, the purpose of the present application is to provide a dust removal and anti-static device for circuit board mounting, so as to solve the technical problem that the existing dust removal and anti-static device for circuit board mounting is difficult to achieve effective cleaning of the holes in the circuit board.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solution: a dust removal and anti-static device for circuit board mounting, comprising a box body, a negative pressure bin is installed in the box body, and conveying mechanisms for conveying circuit boards are arranged at both ends of the negative pressure bin, an anti-static roller for contacting the surface of the circuit board is rotatably connected to one side of the negative pressure bin, and the negative pressure bin further comprises a negative pressure bin, both sides of the bottom of the negative pressure bin are slidably connected with sealing plates, the sealing plates are fixedly connected with inclined push plates, the sealing plates can slide to both sides of the negative pressure bin after the circuit board contacts the push plates, the distance between the two sealing plates after sliding is the same as the width of the circuit board, an elastic return mechanism is arranged between the sealing plates and the inner wall of the negative pressure bin, and the device further comprises a fixed bin, both ends of the fixed bin are slidably connected with telescopic bins, the end portions of the telescopic bins are slidably connected to the sealing plates in the vertical direction, the top surfaces of the telescopic bins and the fixed bin are in contact with the bottom surface of the circuit board, and dust filter plates are arranged at the bottom portions in a spaced manner.

[0008] By adopting the above technical solution, the dust and other impurities in the holes of the circuit board and on the surface of the circuit board are cleaned by the negative pressure in the negative pressure bin, effective cleaning of the circuit board is achieved, and the surface of the cleaned circuit board is contacted with the anti-static roller to achieve better static removal effect.

[0009] The present application further provides that the bottom end of the negative pressure bin is fixedly connected with a guide column in the width direction, one end of each of the two sealing plates that are close to each other is slidably connected to the guide column, a spring is arranged between the end portion of the sealing plate and the inner wall of the negative pressure bin, a guide rod is fixedly connected to the top surface of each of the sealing plates, the guide rods pass through both sides of the negative pressure bin and are slidably connected to the side walls of the negative pressure bin in a relative manner, and the top surface of the sealing plate is in close contact with the bottom surface of the negative pressure bin.

[0010] As a preferred, the guide rod and the guide column jointly play a guiding role for the sealing plate, so that the sealing plate that blocks the air inlet position of the negative pressure bin has supporting structures at both ends, so as to guarantee the air tightness of the sealing plate.

[0011] The present application further provides that drive rollers parallel to the sliding direction of the sealing plates are rotatably arranged at both ends of the negative pressure bin in the box body, a driving assembly is connected to the rotating shaft of the drive roller, a lifting platform is arranged below the drive roller in the box body, a compression spring is arranged in the lifting platform, a driven roller is slidably connected to the lifting platform in the vertical direction, the driven roller is parallel to and in contact with the drive roller, the bottom surface of the drive roller is lower than the bottom surface of the negative pressure bin, and the bottom end of the negative pressure bin is not in contact with the surface of the circuit board.

[0012] As preferably, the friction between the driving roller and the driven roller realizes the conveying of the circuit board.

[0013] The application is further provided with rotating rods rotatably connected to both sides of the negative pressure bin, and a static electricity removing roller rotatably connected between the ends of the rotating rods.

[0014] The static electricity removing roller connected to the rotating rod preferably contacts the surface of the circuit board to remove static electricity possibly carried by the surface of the circuit board.

[0015] The application is further provided with a jacking rod upwardly arranged near the telescopic bin, and a push switch rotatably connected to the position near the negative pressure bin.

[0016] The jacking rod preferably lifts the telescopic bin and the fixed bin so that the top surfaces of the telescopic bin and the fixed bin contact the bottom surface of the circuit board, avoiding the airflow through the through holes of the circuit board from bringing dust and impurities from the outside into the through holes of the circuit board.

[0017] The application is further provided with fixed brushes arranged at both ends of the fixed bin and facing the bottom surface of the telescopic bin.

[0018] The fixed brushes and the moving brushes preferably clean the dust filter plate when the telescopic bin is telescoped.

[0019] The application is further provided with a sliding groove fixedly connected to the bottom surface of the fixed bin, and both ends of the moving brush slidingly connected in the sliding groove.

[0020] The sliding groove preferably guides the moving brush to avoid the moving brush from being out of contact with the bottom surface of the fixed bin due to the flexural deformation of the connecting frame.

[0021] The application is further provided with the negative pressure bin arranged obliquely, and a bin cover connected to the bottom surface of the oblique part.

[0022] The collecting strips in the bin cover preferably effectively collect some relatively heavy dust and impurities to avoid them from falling back onto the circuit board.

[0023] In summary, the application has the following advantages:

[0024] The application adjusts the air inlet of the negative pressure bin and the circuit board to be equal in width by sliding the sealing plate, and sets an air inlet filtering structure capable of being attached to the circuit board on the bottom surface of the circuit board, so as to clean the surface of the circuit board and the dust and other impurities in the through hole of the circuit board by the negative pressure in the negative pressure bin, and achieve effective cleaning of the circuit board, and the static electricity removing roller contacts the cleaned surface of the circuit board to achieve better static electricity removing effect.

[0025] The application contacts the edge of the circuit board by the obliquely arranged push plate, pushes the push plate and the sealing plate by the circuit board in motion, and then adjusts the air inlet of the negative pressure bin to different widths according to the width of the circuit board, so as to avoid the decrease of the air flow speed at the through hole of the circuit board due to the large air inlets at both ends of the negative pressure bin, and to improve the air flow speed through the through hole of the circuit board as much as possible while adjusting the width of the circuit board, so as to better take out the dust and impurities in the through hole of the circuit board, and achieve more sufficient cleaning of the circuit board.

[0026] The application connects the telescopic bin with the sealing plate, and connects the telescopic bin in the fixed bin in a sliding manner, drives the telescopic bin to extend or retract while the sealing plate slides, so that the sum of the length of the telescopic bin and the fixed bin is equal to the width of the air inlet of the negative pressure bin, the top surfaces of the telescopic bin and the fixed bin contact the bottom surface of the circuit board, and the air inlet of the negative pressure bin is filtered to a certain extent, so as to effectively avoid that the dust or other impurities in the outside environment are stuck in the through hole of the circuit board when passing through the through hole of the circuit board due to the influence of the air inlet, and further improve the cleaning effect of the circuit board.

[0027] The application sets the fixed brush at the bottom of both ends of the fixed bin, and connects the movable brush at the bottom end of the telescopic bin, so that the fixed brush can clean the dust filter plate at the bottom surface of the telescopic bin during each extension and retraction of the telescopic bin, and the movable brush synchronously cleans the dust filter plate at the bottom surface of the fixed bin, so as to effectively avoid the problem that the dust filter plate is blocked by dust, and ensure the flow speed of the air inlet of the negative pressure bin passing through the through hole of the circuit board.

[0028] The application sets the inclined negative pressure bin structure, and detachably connects the bin cover at the bottom surface of the inclined part of the negative pressure bin, and sets the dust or impurity collecting strip for containing part of dust or impurities with relatively large mass along the height direction of the bin cover, so as to avoid that the dust or impurities collide with the inner wall of the negative pressure air flow channel and then fall back to the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a perspective view of the application;

[0030] Figure 2 It is a perspective view of the internal structure of the circuit board cleaning state box of the application;

[0031] Figure 3 A of the present application Figure 2 A of the present application

[0032] Figure 4 A of the present application

[0033] Figure 5 B of the present application Figure 4 B of the present application

[0034] Figure 6 A of the present application

[0035] Figure 7 A of the present application

[0036] Figure 8 C of the present application Figure 7 C of the present application

[0037] Figure 9 A of the present application

[0038] Figure 10 D of the present application Figure 9 D of the present application

[0039] Figure 11 A of the present application

[0040] Figure 12 A of the present application

[0041] Figure 13 E of the present application Figure 12 E of the present application

[0042] BRIEF DESCRIPTION OF THE DRAWINGS

[0043] 1, box; 101, through hole; 2, negative pressure bin; 201, limiting block; 202, negative pressure interface; 3, bin cover; 301, collection strip; 4, sealing plate; 5, push plate; 501, vertical sliding groove; 6, fixed bin; 7, telescopic bin; 701, vertical sliding block; 8, guide column; 9, spring; 10, guide rod; 11, rotating rod; 12, static electricity removing roller; 13, fixed brush; 14, connecting frame; 15, moving brush; 16, sliding groove; 17, dust filter plate; 18, pressure switch; 19, jacking rod; 20, driving roller; 21, lifting platform; 22, driven roller; 23, circuit board body. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The embodiments described below with reference to the drawings are exemplary and are used only for explaining the present application, and cannot be understood as a limitation of the present application.

[0045] The embodiments of the present application will be described below according to the overall structure of the present application. Embodiment One

[0046] A dust removal and anti-static device for circuit board patching, please refer to Figures 1-13 , including a box body 1, specifically, the box body 1 can be installed between the screen printer and the board feeding machine of the circuit board patching production line, the circuit board sent out by the board feeding machine is sent into the screen printer for subsequent processing after dust removal and static removal by the box body 1, a negative pressure bin 2 is installed in the box body 1, and conveying mechanisms for conveying the circuit board are arranged at both ends of the negative pressure bin 2, a negative pressure interface 202 extending out of the box body 1 is arranged at the top end of the negative pressure bin 2, the negative pressure interface 202 is used for connecting a negative pressure dust collection pipeline, and an anti-static roller 12 for contacting the surface of the circuit board is rotatably connected to one side of the negative pressure bin 2.

[0047] Further including a negative pressure bin 2, both sides of the bottom of the negative pressure bin 2 are slidably connected with sealing plates 4, the top surface of the sealing plate 4 is in contact with the bottom surface of the negative pressure bin 2, the sealing plate 4 is further tightly attached to the bottom surface of the negative pressure bin 2 under the negative pressure state in the negative pressure bin 2, and the sealing plate 4 is fixedly connected with an inclined push plate 5, the sealing plate 4 can slide to both sides of the negative pressure bin 2 after contacting the push plate 5, so as to adapt to circuit boards of different widths, the distance between the two sealing plates 4 after sliding is the same as the width of the circuit board, and an elastic return mechanism is arranged between the sealing plate 4 and the inner wall of the negative pressure bin 2, so that the sealing plate 4 is tightly attached to the side surface of the circuit board under the elastic force of the elastic return mechanism.

[0048] Further including a fixed bin 6, both ends of the fixed bin 6 are slidably connected with telescopic bins 7, the telescopic bin 7 is slidably connected to the fixed bin 6 along the length direction of the telescopic bin 7, the telescopic bin 7 is lifted and lowered at the same time, the fixed bin 6 is also lifted and lowered synchronously, the end of the telescopic bin 7 is slidably connected to the sealing plate 4 in the vertical direction, the top surface of the telescopic bin 7 and the top surface of the fixed bin 6 are in contact with the bottom surface of the circuit board, and the bottom is spaced apart from the dust filter plate 17, so as to avoid that the dust and sundries in the external environment enter the through hole of the circuit board due to the influence of airflow.

[0049] In the above embodiment, specifically, please refer to Figures 7-8 , the bottom end inside the negative pressure bin 2 is fixedly connected with a guide column 8 in the width direction, one end of the two sealing plates 4 close to each other is slidably connected to the guide column 8, and a spring 9 is arranged between the end of the sealing plate 4 and the inner wall of the negative pressure bin 2, the spring 9 is in a further compressed state in the process that the push plate 5 is pushed by the circuit board and the sealing plate 4 is away from each other, and the spring 9 accumulates elastic potential energy in this state.

[0050] Further, the top surface of the sealing plate 4 is fixedly connected with a guide rod 10, the guide rod 10 penetrates through the two sides of the negative pressure bin 2 and is slidably connected to the side wall of the negative pressure bin 2, the top surface of the sealing plate 4 is in close contact with the bottom surface of the negative pressure bin 2, and the guide rod 10 and the guide column 8 jointly guide the sealing plate 4, so that the two ends of the sealing plate 4 covering the air inlet of the negative pressure bin 2 are supported, thereby ensuring the air tightness of the sealing plate 4.

[0051] In the above embodiment, please refer to Figures 1-3 and Figure 6 , the box body 1 is rotatably provided with a driving roller 20 parallel to the sliding direction of the sealing plate 4 at the two ends of the negative pressure bin 2, the rotating shaft of the driving roller 20 is connected with a driving assembly, specifically, the driving assembly is a driving motor, the driving motor is specifically installed on the outer wall of the box body 1, and the output shaft of the driving motor is coaxial with the driving roller 20.

[0052] Further, the box body 1 is provided with a lifting platform 21 below the driving roller 20, the lifting platform 21 is provided with a compression spring and a driven roller 22 slidably connected in the vertical direction, specifically, the lifting platform 21 includes a fixed part fixedly connected to the box body 1 and a sliding part slidably connected to the fixed part in the vertical direction, the compression spring is arranged between the sliding part and the inner wall of the fixed part and is always in a compressed state, the driven roller 22 is rotatably connected between the sliding parts of the two lifting platforms 21, the driven roller 22 is parallel to and in contact with the driving roller 20, and the circuit board will press down the driven roller 22 when it contacts the driving roller 20 and the driven roller 22, thereby making the driven roller 22 and the driving roller 20 respectively tightly contact the bottom surface and the top surface of the circuit board.

[0053] Specifically, the bottom surface of the driving roller 20 is lower than the bottom surface of the negative pressure bin 2, the bottom end of the negative pressure bin 2 does not contact the surface of the circuit board, so as to avoid scratching the surface of the circuit board by the negative pressure bin 2, and the friction force between the driving roller 20 and the driven roller 22 is used to realize the conveying of the circuit board, in this embodiment, the length of the driving roller 20 and the driven roller 22 is equal to the width of the negative pressure bin 2, and two groups are arranged at the two ends of the negative pressure bin 2, in other embodiments not disclosed, in order to further improve the conveying effect of the circuit board and avoid bending deformation of the circuit board, the conveying structure composed of the driving roller 20 and the driven roller 22 can be provided with multiple groups, and the length can also be different from the width of the negative pressure bin 2. Embodiment two

[0054] A dust removal and anti-static device for circuit board mounting, please refer to Figures 1-13On the basis of the first embodiment, different from the first embodiment is that the negative pressure bin 2 is rotatably connected with a rotating rod 11 on both sides, and the rotating rod 11 is rotatably connected with an electrostatic elimination roller 12 between the ends. Specifically, the surface of the electrostatic elimination roller 12 can conduct electricity, and a conductive slip ring is arranged at the connection with the rotating rod 11. The electrostatic elimination roller 12 is in a grounded state through the grounding wire, and the static electricity on the surface of the circuit board body 23 can be guided to the ground by the electrostatic elimination roller 12, thereby eliminating the static electricity that the circuit board body 23 may carry.

[0055] Further, the negative pressure bin 2 is fixedly connected with a limiting block 201 on both sides to limit the rotation of the rotating rod 11. When the rotating rod 11 is in contact with the limiting block 201, the bottom end of the electrostatic elimination roller 12 is lower than the top surface of the circuit board. After the circuit board contacts the electrostatic elimination roller 12, the electrostatic elimination roller 12 is lifted up, the rotating rod 11 rotates to be out of contact with the limiting block 201, and the electrostatic elimination roller 12 is in full contact with the surface of the cleaned circuit board body 23 under its own gravity, effectively avoiding the phenomenon that the electrostatic elimination roller 12 is not in good contact with the circuit board body. The electrostatic elimination roller 12 connected with the rotating rod 11 contacts the surface of the circuit board, which can conduct the static electricity that the circuit board surface may carry. Embodiment three

[0056] A dust removal and anti-static device for circuit board mounting, please refer to Figures 1-13 On the basis of the second embodiment, different from the second embodiment is that the sealing plate 4 is provided with a jacking rod 19 upward near the telescopic bin 7. The jacking rod 19 is a pneumatic telescopic rod, and in other unpublished embodiments, an electric telescopic rod or a hydraulic rod can also be used. The push plate 5 is rotatably connected with a pressure switch 18 near the negative pressure bin 2. The sealing plate 4 is provided with a vertical sliding groove 501 in the direction towards the telescopic bin 7. The telescopic bin 7 is fixedly connected with a vertical sliding block 701 in the direction towards the sealing plate 4. The vertical sliding block 701 is slidably connected in the vertical sliding groove 501.

[0057] Specifically, please refer to Figures 1-3 and Figures 9-10 When the distance between the sealing plates 4 is the same as the width of the circuit board, the pressure switch 18 is pressed down. The pressure switch 18 is used to control the jacking rod 19 to rise, and a reset torsional spring is arranged in the rotating shaft. When the circuit board leaves the area between the sealing plates 4, the sealing plates 4 are moved back to the original position under the elastic potential energy accumulated by the spring 9, and at the same time, the pressure switch 18 restores to the open state under the action of the reset torsional spring, so that the jacking rod 19 is retracted. The height of the fixed bin 6 and the telescopic bin 7 is lowered. When the next circuit board body 23 comes, the pressure switch 18 is pressed down, and the jacking rod 19 is elongated again, so as to adapt to circuit boards of different thicknesses.

[0058] Further, the jacking rod 19 can make the telescopic bin 7 and the fixed bin 6 rise when it is elongated, so that the top surfaces of the telescopic bin 7 and the fixed bin 6 are in contact with the bottom surface of the circuit board, and the airflow passing through the through holes of the circuit board can not bring the dust and impurities from the outside into the through holes of the circuit board. Embodiment four

[0059] A dust removal and anti-static device for circuit board mounting, please refer to Figures 1-13 In the third embodiment, the two ends of the fixed bin 6 are provided with fixed brushes 13 facing the bottom surface of the telescopic bin 7, the fixed brushes 13 are used to clean the dust filter plate 17 on the bottom surface of the telescopic bin 7, the bottom surface of the telescopic bin 7 is fixedly connected with a connecting frame 14 near the sealing plate 4, the connecting frame 14 extends to the other end of the telescopic bin 7 and is connected with a moving brush 15 facing the bottom surface of the fixed bin 6, the moving brush 15 is used to clean the dust filter plate 17 on the bottom surface of the fixed bin 6, the fixed brush 13 and the moving brush 15 can clean the dust filter plate 17 when the telescopic bin 7 is telescoped, so as to ensure the ventilation efficiency of the dust filter plate 17, and increase the airflow speed passing through the through holes of the circuit board as much as possible under the premise that the negative pressure in the negative pressure bin 2 is not convenient, so as to achieve better cleaning effect for the through holes of the circuit board.

[0060] In the above embodiments, specifically, please refer to Figures 4-5 and Figures 9-11 The bottom surface of the fixed bin 6 is fixedly connected with a sliding groove 16, and the two ends of the moving brush 15 are slidingly connected in the sliding groove 16, the connecting frame 14 and the sliding groove 16 do not interfere with each other, the sliding groove 16 plays a guiding role for the moving brush 15, so as to avoid the moving brush 15 from being separated from the bottom surface of the fixed bin 6 due to the flexural deformation of the connecting frame 14. Embodiment five

[0061] A dust removal and anti-static device for circuit board mounting, please refer to Figures 1-13 In the fourth embodiment, the negative pressure bin 2 is inclinedly arranged, and the bottom surface of the inclined part is connected with a bin cover 3, and the inner wall of the bin cover 3 is connected with collecting strips 301 for collecting dust and impurities along the height direction.

[0062] Specifically, when the pressure in the negative pressure bin 2 changes, part of the relatively heavy dust and impurities may fall due to collision with the inner wall of the negative pressure bin 2 or the decrease of airflow speed, and the collecting strips 301 in the bin cover 3 can effectively collect part of the relatively heavy dust and impurities, so as to avoid them from falling back to the circuit board, and further improve the cleaning effect of the circuit board. After a period of dust removal and anti-static work for the circuit board, the bin cover 3 can be disassembled and cleaned, and meanwhile, the internal structure of the negative pressure bin 2 is exposed after the bin cover 3 is disassembled, which is convenient for the maintenance or cleaning of the inside of the negative pressure bin 2.

[0063] In the specific work, the circuit board is inserted into the box 1 from the through hole 101 of the box 1, under the conveying of the conveying mechanism, the push plate 5 is pushed to slide to the both sides of the sealing plate 4, finally the width of the air inlet at the bottom end of the negative pressure bin 2 is the same as the width of the circuit board, in the process, the both sides of the circuit board press the on-off switch 18 to make the lifting rod 19 rise, the fixed bin 6 and the telescopic bin 7 are close to the bottom surface of the circuit board under the action of the lifting rod 19, the airflow generated by the negative pressure in the negative pressure bin 2 makes the dust and sundries in the through hole of the circuit board and on the surface of the circuit board move upward, the dust and sundries carried by the airflow through the through hole of the circuit board are effectively filtered by the dust filter plate 17 on the bottom surface of the telescopic bin 7 and the fixed bin 6, dust and sundries in the external air are prevented from entering the through hole, and the surface of the circuit board and the through hole are effectively cleaned, the surface of the cleaned circuit board contacts the static electricity removing roller 12, the static electricity possibly carried by the surface of the circuit board is guided and removed by the static electricity removing roller 12, and the dust removing and static electricity removing work before the tin paste printing of the circuit board is completed.

[0064] Although the embodiments of the present application have been shown and described, the specific embodiments are merely illustrative of the present application, and are not intended to limit the present application, and the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner, and those skilled in the art can make modifications, replacements and variations of the embodiments without creative contribution after reading the specification, as long as the principles and purposes of the present application are not deviated, and the patent law is protected within the scope of the claims of the present application.

Claims

1. A dust removal and anti-static device for surface mount circuit boards, characterized in that, include: The box contains a negative pressure chamber, and both ends of the negative pressure chamber are equipped with conveying mechanisms for conveying circuit boards. One side of the negative pressure chamber is rotatably connected to an antistatic roller for contacting the surface of the circuit board. The negative pressure chamber has sealing plates slidably connected to both sides of its bottom. Each sealing plate is fixedly connected to an inclined push plate. After the circuit board contacts the push plate, the sealing plates can slide to both sides of the negative pressure chamber. The distance between the two sealing plates after sliding is the same as the width of the circuit board. An elastic reset mechanism is provided between the sealing plates and the inner wall of the negative pressure chamber. The fixed chamber has telescopic chambers slidably connected to both ends. The ends of the telescopic chambers are slidably connected to a sealing plate in the vertical direction. The top surfaces of both the telescopic and fixed chambers contact the bottom surface of the circuit board, and dust filter plates are spaced apart at their bottoms. A guide post is fixedly connected to the bottom end of the negative pressure chamber along its width. The ends of the two sealing plates that are close to each other are slidably connected to the guide post. A spring is installed between the end of the sealing plate and the inner wall of the negative pressure chamber. Guide rods are fixedly connected to the top surface of each sealing plate, and these guide rods pass through both sides of the negative pressure chamber. The sealing plate is slidably connected to the side wall of the negative pressure chamber. The top surface of the sealing plate is in close contact with the bottom surface of the negative pressure chamber. Both ends of the chamber are rotatably equipped with drive rollers parallel to the sliding direction of the sealing plate. The shaft of the drive roller is connected to a drive assembly. A lifting platform is provided below the drive rollers in the chamber. A compression spring is provided in the lifting platform, and a driven roller is slidably connected in the vertical direction. The driven roller is parallel to and in contact with the drive roller. The bottom surface of the drive roller is lower than the bottom surface of the negative pressure chamber. The bottom end of the negative pressure chamber does not contact the surface of the circuit board.

2. The dust removal and anti-static equipment for circuit board mounting according to claim 1, characterized in that: Rotating rods are rotatably connected to both sides of the negative pressure chamber, and antistatic rollers are rotatably connected between the ends of the rotating rods. Limiting blocks that restrict the rotation of the rotating rods are fixedly connected to both sides of the negative pressure chamber. When the rotating rods are in contact with the limiting blocks, the bottom end of the antistatic rollers is lower than the top surface of the circuit board.

3. The dust removal and anti-static equipment for circuit board mounting according to claim 1, characterized in that: The sealing plate is provided with an upward lifting rod near the telescopic chamber. The push plate is rotatably connected to a pressure switch near the negative pressure chamber. When the spacing between the sealing plates is the same as the width of the circuit board, the pressure switch is pressed down. The pressure switch is used to control the lifting rod to rise, and a reset torsion spring is provided in the rotating shaft.

4. The dust removal and anti-static equipment for circuit board mounting according to claim 1, characterized in that: Fixed brushes are provided at both ends of the fixed compartment facing the bottom of the telescopic compartment. A connecting frame is fixedly connected to the bottom of the telescopic compartment near the sealing plate. The connecting frame extends to the other end of the telescopic compartment and is connected to a movable brush facing the bottom of the fixed compartment.

5. The dust removal and anti-static equipment for circuit board mounting according to claim 4, characterized in that: The bottom surface of the fixed chamber is fixedly connected to a sliding groove, and the two ends of the movable brush are slidably connected within the sliding groove.

6. The dust removal and anti-static equipment for circuit board surface mounting according to claim 1, characterized in that: The negative pressure chamber is inclined, and a chamber cover is connected to the bottom surface of the inclined part. The inner wall of the chamber cover is connected with collection strips for collecting dust and debris at intervals along the height direction.

Images