Shell, preparation method thereof and electronic equipment

Abstract

The invention provides a shell, a preparation method thereof and electronic equipment. The shell provided by the embodiment of the invention comprises a shell body; the shell comprises a shell body and a heat conduction composite plate, the heat conduction composite plate is borne on the shell body, the heat conduction composite plate comprises a first fiber resin layer, a heat conduction layer and a second fiber resin layer which are sequentially arranged in a stacked mode, and the heat conduction layer is provided with a plurality of through holes formed at intervals. When the shell is applied to the electronic equipment, the surface of the electronic equipment can have the low highest temperature.

Description

Technical Field

[0001] This application relates to the field of electronics, and particularly to a housing, a method for manufacturing the same, and an electronic device. Background Art

[0002] Components such as chips (e.g., system-on-chip, abbreviated as SOC) and batteries are provided on electronic devices such as mobile phones. Since these components generate heat during operation, it is easy for the outer surface of the electronic device corresponding to these components to quickly heat up, and the high temperature will affect user safety and user experience. Summary of the Invention

[0003] An embodiment of this application provides a housing which can make the surface of the electronic device have a lower maximum temperature when applied to the electronic device.

[0004] In a first aspect, an embodiment of this application provides a housing, which includes:

[0005] A housing body; and

[0006] A heat-conducting composite plate carried on the housing body. The heat-conducting composite plate includes a first fiber resin layer, a heat-conducting layer, and a second fiber resin layer that are sequentially stacked. The heat-conducting layer has a plurality of through holes arranged at intervals.

[0007] In a second aspect, an embodiment of this application provides a method for manufacturing a housing, which includes:

[0008] Providing a heat-conducting composite plate, which includes a first fiber resin layer, a heat-conducting layer, and a second fiber resin layer that are sequentially stacked. The heat-conducting layer has a plurality of through holes arranged at intervals;

[0009] Providing at least three prepregs, and at least one of the at least three prepregs has a through slot;

[0010] Stacking the at least three prepregs, and disposing the heat-conducting composite plate in the through slot; and

[0011] Performing a first hot pressing to form a housing body from the at least three prepregs, thereby obtaining the housing.

[0012] In a third aspect, an embodiment of this application provides an electronic device, which includes:

[0013] A display screen;

[0014] The housing according to the embodiment of the first aspect of this application or the housing obtained by the method for manufacturing a housing according to the embodiment of the second aspect of this application. The housing is disposed opposite to the display screen; and

[0015] A processor, which is disposed between the display screen and the housing, and is electrically connected to the display screen for controlling the display screen to display.

[0016] The housing of the embodiment of the present application includes a housing body and a heat-conducting composite plate. The heat-conducting composite plate is carried on the housing body. By providing the heat-conducting composite plate in the housing, the heat-conducting coefficient of the housing can be improved. When the housing is applied to an electronic device, the heat in the heat-generating area of the electronic device can be transferred or conducted to a lower-temperature area faster, so as to better dissipate the heat of the electronic device, and the heat generated during the operation of the electronic device can be transferred to the entire housing faster, thereby avoiding local overheating of the housing of the electronic device and affecting the user experience. In addition, the heat-conducting composite plate includes a first fiber resin layer, a heat-conducting layer, and a second fiber resin layer that are sequentially laminated. The heat-conducting layer has a plurality of through holes provided at intervals; since the bonding force between the heat-conducting layer and the first fiber resin layer and the second fiber resin layer is usually weak, providing a plurality of through holes in the heat-conducting layer can enable the first fiber resin layer and the second fiber resin layer to be connected through the through holes, thereby improving the bonding force between the first fiber resin layer, the heat-conducting layer, and the second fiber resin layer, and better avoiding delamination of the heat-conducting composite plate when forming a 3D-structured housing by hot pressing, and improving the processing performance and service life of the heat-conducting composite plate. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a partial perspective structural schematic diagram of the housing of an embodiment of the present application.

[0019] Figure 2 It is a structural schematic diagram of the heat-conducting composite plate of an embodiment of the present application.

[0020] Figure 3 It is along the Figure 2 in the A-A direction of the heat-conducting composite plate of an embodiment of the present application, and it is a cross-sectional structural schematic diagram.

[0021] Figure 4 It is a planar structural schematic diagram of the heat-conducting layer of an embodiment of the present application.

[0022] Figure 5 It is along the Figure 2 in the A-A direction of the heat-conducting composite plate of another embodiment of the present application, and it is a cross-sectional structural schematic diagram.

[0023] Figure 6 is a schematic cross-sectional structure view of the housing along the Figure 1 B-B direction in [Example].

[0024] Figure 7 is a schematic cross-sectional structure view of the housing along the Figure 1 B-B direction in [Another Example].

[0025] Figure 8 is a cross-sectional view of the third fiber resin layer in one embodiment of the present application.

[0026] Figure 9 is a schematic cross-sectional structure view of the housing along the Figure 1 B-B direction in [Another Example].

[0027] Figure 10 is a schematic cross-sectional structure view of the housing along the Figure 1 B-B direction in [Another Example].

[0028] Figure 11 is a schematic cross-sectional structure view of the housing along the Figure 1 B-B direction in [Another Example].

[0029] Figure 12 is a schematic cross-sectional structure view of the housing along the Figure 1 B-B direction in [Another Example].

[0030] Figure 13 is a schematic flow chart of the preparation method of the housing in one embodiment of the present application.

[0031] Figure 14 is a schematic flow chart of the preparation method of the heat-conducting composite plate in one embodiment of the present application.

[0032] Figure 15 is a schematic flow chart of the preparation method of the heat-conducting layer in one embodiment of the present application.

[0033] Figure 16 is a schematic flow chart of the preparation method of the housing in another embodiment of the present application.

[0034] Figure 17 is a schematic structure view of the sample during the drawing force test of the present application.

[0035] Figure 18 is a schematic structure view of the electronic device in one embodiment of the present application.

[0036] Figure 19 is a partial exploded structure view of the electronic device in one embodiment of the present application.

[0037] Figure 20It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 100 - housing, 10 - housing body, 11 - third fiber resin layer, 111 - third fiber cloth, 112 - fourth resin, 113 - through groove, 20 - heat-conducting composite plate, 21 - first fiber resin layer, 211 - first fiber cloth, 212 - first resin, 22 - heat-conducting layer, 221 - through hole, 23 - second fiber resin layer, 231 - second fiber cloth, 232 - second resin, 24 - third resin, 30 - fireproof layer, 40 - adhesion layer, 50 - primer layer, 60 - intermediate paint layer, 70 - topcoat layer, 80 - texture layer, 90 - anti-fingerprint layer, 10’ - hot melt adhesive stick, 300 - electronic device, 310 - display screen, 320 - middle frame, 330 - processor, 350 - memory, 370 - camera module, 101 - light-transmitting part. Detailed implementation manners

[0040] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0041] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0042] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0043] It should be noted that for the convenience of description, in the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, the detailed description of the same components is omitted in different embodiments.

[0044] Electronic devices such as mobile phones are equipped with components such as chips (e.g., system-on-chip, abbreviated as SOC) and batteries. Since these components generate heat during operation, it is easy to cause the outer surface of the electronic device corresponding to the positions of these components to quickly heat up. High temperatures can affect user safety and avoid high temperatures from affecting the user experience.

[0045] The heat sources of electronic devices such as mobile phones are mainly concentrated on the chips. In related technologies, the thermal conductivity of the housing of the electronic device is low, and the heat dissipation effect is not good. It is easy to cause the local temperature of the outer surface of the electronic device corresponding to the chip to be too high, thereby reducing the user experience and affecting user safety.

[0046] In view of this, an embodiment of the present application provides a housing.

[0047] Please refer to Figures 1 to 4 , an embodiment of the present application provides a housing 100. The housing 100 includes a housing body 10 and a thermally conductive composite plate 20. The thermally conductive composite plate 20 is carried on the housing body 10. The thermally conductive composite plate 20 includes a first fiber resin layer 21, a thermally conductive layer 22, and a second fiber resin layer 23 that are sequentially stacked. The thermally conductive layer 22 has a plurality of through holes 221 that are spaced apart.

[0048] The housing 100 of the present application can be applied to portable electronic devices such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, and game consoles. Optionally, the housing 100 of the present application can be the back cover (battery cover), middle frame, decorative part, protective case, protective lens or decorative part of the camera module of the electronic device, etc. In the schematic illustration and description of the drawings of the present application, the housing 100 is taken as an example of the back cover of an electronic device (such as a mobile phone) for illustration and introduction, and should not be construed as a limitation on the housing 100 and the electronic device of the embodiment of the present application. It should be noted that the protective case refers to a protective member, protective cover, etc. that is sleeved on at least a part of the outer periphery of the electronic device to protect the electronic device and can be independent of the electronic device. The housing 100 of the embodiment of the present application can be a 2D structure, a 2.5D structure, a 3D structure, etc.

[0049] It should be noted that the thermally conductive composite plate 20 covers a part of the housing body 10.

[0050] It should be noted that when the thermally conductive composite plate 20 is applied to an electronic device, the thermally conductive layer 22 of the thermally conductive composite plate 20 can be arranged corresponding to the main heat-generating components of the electronic device, such as areas of a circuit board (such as a CPU), a battery, etc.

[0051] In some embodiments, the heat-conducting composite plate 20 is disposed on the surface of the housing body 10. In other embodiments, the heat-conducting composite plate 20 is partially embedded in the housing body 10. For example, the heat-conducting composite plate 20 is embedded in the housing body 10, and one surface of the heat-conducting composite plate 20 is exposed outside the housing body 10 and flush with one surface of the housing body 10. In still other embodiments, the heat-conducting composite plate 20 is completely embedded inside the housing body 10, that is, the heat-conducting composite plate 20 is located inside the housing body 10. It can be understood that when the heat-conducting composite plate 20 is at least partially embedded in the housing body 10, the housing body 10 is disposed around the outer periphery of the heat-conducting composite plate 20. When the heat-conducting composite plate 20 is embedded in the housing body 10, the heat-conducting composite plate 20 does not additionally increase the thickness of the housing 100, thereby making the housing 100 thinner and lighter. When applied to an electronic device, the electronic device can be made thinner and lighter.

[0052] Optionally, the housing body 10 is a sheet-like structure, and the heat-conducting composite plate 20 is a sheet-like structure. The first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23 are all sheet-like structures.

[0053] Optionally, the plurality of through holes 221 may be regularly arranged, such as in an array arrangement, or may be irregularly arranged.

[0054] It can be understood that the through holes 221 penetrate through the heat-conducting layer 22 along the stacking direction of the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23. In other words, the through holes 221 respectively penetrate through the surface of the heat-conducting layer 22 facing the first fiber resin layer 21 and the surface of the heat-conducting layer 22 facing the second fiber resin layer 23.

[0055] The housing 100 of the embodiment of the present application includes a housing body 10 and a heat-conducting composite plate 20. The heat-conducting composite plate 20 is carried on the housing body 10. By providing the heat-conducting composite plate 20 in the housing 100, the heat-conducting coefficient of the housing 100 can be improved. When the housing 100 is applied to an electronic device, the heat in the heat-generating area of the electronic device can be transferred or conducted to a lower-temperature area faster, so as to better dissipate the heat of the electronic device, and the heat generated when the electronic device works can be transferred to the entire housing 100 faster, thereby avoiding the local temperature of the housing 100 of the electronic device from being too high and affecting the user experience. In addition, the heat-conducting composite plate 20 includes a first fiber resin layer 21, a heat-conducting layer 22, and a second fiber resin layer 23 that are sequentially stacked. The heat-conducting layer 22 has a plurality of through holes 221 arranged at intervals; since the bonding force between the heat-conducting layer 22 and the first fiber resin layer 21 and the second fiber resin layer 23 is usually weak, providing a plurality of through holes 221 in the heat-conducting layer 22 can enable the first fiber resin layer 21 and the second fiber resin layer 23 to be connected through the through holes 221, thereby improving the bonding force between the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23, and better avoiding delamination of the heat-conducting composite plate 20 when it is hot-pressed into a 3D-structured housing 100, and improving the processing performance and service life of the heat-conducting composite plate 20.

[0056] Please refer to Figure 5 , in some embodiments, the first fiber resin layer 21 includes a first fiber cloth 211 and a first resin 212. The first resin 212 wraps the surface of the first fiber cloth 211. The second fiber resin layer 23 includes a second fiber cloth 231 and a second resin 232. The second resin 232 wraps the surface of the second fiber cloth 231. The heat-conducting composite plate 20 further includes a third resin 24. The third resin 24 is embedded in the plurality of through holes 221, and the third resin 24 is respectively connected to the first resin 212 and the second resin 232.

[0057] It can be understood that the plurality of through holes 221 are filled with the third resin 24. The third resin 24 can be composed of the first resin 212 and the second resin 232; in other words, part of the first resin 212 and part of the second resin 232 fill the plurality of through holes 221 to form the third resin 24.

[0058] Optionally, the first fiber cloth 211 can be, but is not limited to, at least one of ultra-high molecular weight polyethylene fiber cloth (abbreviated as UPE fiber), carbon fiber cloth, glass fiber cloth, aramid fiber cloth, poly-p-phenylene benzobisoxazole fiber cloth (abbreviated as PBO fiber), liquid crystal polymer cloth (abbreviated as LCP fiber), ceramic fiber cloth, basalt fiber cloth, etc.

[0059] Optionally, the second fiber cloth 231 may be, but is not limited to, at least one of ultra-high molecular weight polyethylene fiber cloth (abbreviated as UPE fiber), carbon fiber cloth, glass fiber cloth, aramid fiber cloth, poly(p-phenylene benzobisoxazole) fiber cloth (abbreviated as PBO fiber), liquid crystal polymer cloth (abbreviated as LCP fiber), ceramic fiber cloth, basalt fiber cloth, etc.

[0060] Optionally, the first fiber cloth 211 may be formed by knitting or weaving. The second fiber cloth 231 may be formed by knitting or weaving.

[0061] Optionally, the first resin 212 may be, but is not limited to, at least one of epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0062] Optionally, the second resin 232 may be, but is not limited to, at least one of epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0063] Optionally, the third resin 24 may be, but is not limited to, at least one of epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0064] It should be noted that the first fiber cloth 211 and the second fiber cloth 231 may be the same or different, and the present application does not make specific limitations. The first resin 212 and the second resin 232 may be the same or different, and the present application does not make specific limitations. When the first fiber cloth 211 and the second fiber cloth 231 are the same, the preparation process of the heat-conducting composite plate 20 can be better simplified. When the first resin 212 and the second resin 232 are the same, the first fiber resin layer 21 and the second fiber resin layer 23 can have better bonding strength and are less likely to delaminate.

[0065] In a specific example, both the first fiber resin layer 21 and the second fiber resin layer 23 are glass fiber resin layers, both the first fiber cloth 211 and the second fiber cloth 231 are glass fiber cloths, the first resin 212, the second resin 232, and the third resin 24 are all epoxy resins, and the heat-conducting layer 22 is a graphene layer.

[0066] In this embodiment, the third resin 24 of the heat-conducting composite plate 20 is embedded in the plurality of through holes 221, and the third resin 24 is respectively connected to the first resin 212 and the second resin 232. In this way, the first fiber resin layer 21 and the second fiber resin layer 23 are connected through the third resin 24 in the plurality of through holes 221, that is, the third resin 24 in the plurality of through holes 221 forms a plurality of connecting columns or pin structures, thereby tightly connecting the first fiber resin layer 21 and the second fiber resin layer 23, and locking the heat-conducting layer 22 between the first fiber resin layer 21 and the second fiber resin layer 23. Thus, a better bonding force can be achieved among the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23 of the heat-conducting composite plate 20, and delamination will not occur due to poor bonding force between the first fiber resin layer 21 and the heat-conducting layer 22 and between the second fiber resin layer 23 and the heat-conducting layer 22. In other words, even if the bonding force between the first fiber resin layer 21 and the heat-conducting layer 22 and between the second fiber resin layer 23 and the heat-conducting layer 22 is poor, adopting the structure of the heat-conducting composite plate 20 of this embodiment can enable the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23 to have good bonding force and be not easily delaminated.

[0067] Please refer to again Figure 4 , in some embodiments, the range of the radial dimension d of the through hole 221 is: 0.7 mm ≤ d ≤ 2 mm.

[0068] Optionally, the shape of the through hole 221 can be, but is not limited to, at least one of regular figures such as a circle, a rectangle, a regular polygon (such as an equilateral triangle, a square, a regular pentagon, a regular hexagon, etc.), a circle, etc. In other embodiments, the shape of the through hole 221 can also be at least one of irregular shapes such as a star shape, a heart shape, etc. The application does not make specific limitations on the shape of the through hole 221. When the through hole 221 is circular, this is beneficial to simplifying the processing procedure of the heat-conducting layer 22, and can make the heat-conducting layer 22 less likely to have stress weak points, thereby having better mechanical strength.

[0069] It should be noted that when the through hole 221 is circular, the radial dimension of the through hole 221 is the diameter of the through hole 221. When the through hole 221 is of other shapes, the radial dimension of the through hole 221 refers to the maximum width of the through hole 221.

[0070] It should be noted that the radial dimensions of the plurality of through holes 221 can be the same or different, and the shapes of the plurality of through holes 221 can be the same or different. When the radial dimensions and shapes of the plurality of through holes 221 are the same, it is beneficial to make the processing of the heat-conducting layer 22 easier, and the heat-conducting performance and mechanical performance of the heat-conducting layer 22 have better uniformity.

[0071] Specifically, the range of the radial dimension d of the through-hole 221 can be, but is not limited to, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.8 mm, 1.9 mm, 1.95 mm, 2.0 mm, etc.

[0072] In this embodiment, if the radial dimension of the through-hole 221 is too small, the third resin 24 cannot pass through, making it difficult to effectively connect the first fiber resin layer 21 and the second fiber resin layer 23, which is not conducive to improving the bonding force between the layers of the heat-conducting composite plate 20. In addition, if the radial dimension of the through-hole 221 is too small and the third resin 24 cannot pass through, air bubbles are likely to exist in the through-hole 221, reducing the mechanical strength of the heat-conducting composite plate 20. Moreover, the presence of air bubbles will affect the appearance of the heat-conducting composite plate 20. If the radial dimension of the through-hole 221 is too large, during the preparation of the heat-conducting composite plate 20, hot pressing is required. After hot pressing, the first resin 212, the second resin 232, and the third resin 24 cool from a high temperature to room temperature, and the first resin 212, the second resin 232, and the third resin 24 will shrink. If the radial dimension of the through-hole 221 is too large, depressions and air bubbles will form at the corresponding positions of the through-hole 221, reducing the appearance and mechanical strength of the heat-conducting composite plate 20, and also reducing the bonding force between the first fiber resin layer 21 and the second fiber resin layer 23. In addition, if the radial dimension of the through-hole 221 is too large, the proportion of the heat-conducting layer 22 will be too small, reducing the heat conductivity of the heat-conducting composite plate 20 and the heat conductivity of the housing 100, which is not conducive to improving the heat dissipation effect of the housing 100.

[0073] Please refer to again Figure 4 , in some embodiments, the range of the spacing s between two adjacent through-holes 221 is: 1 mm ≤ s ≤ 3 mm.

[0074] It can be understood that the spacing s between two adjacent through-holes 221 refers to the minimum gap or the minimum distance between two adjacent through-holes 221.

[0075] It should be noted that the spacing between two adjacent through-holes 221 among multiple through-holes 221 can be the same or different. When the spacing between any two adjacent through-holes 221 among multiple through-holes 221 is the same, it can make the heat-conducting layer 22 easier to process, and the heat-conducting performance and mechanical performance of the heat-conducting layer 22 have better uniformity.

[0076] Specifically, the spacing s between two adjacent through-holes 221 can be, but is not limited to, 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, 2 mm, 2.2 mm, 2.4 mm, 2.6 mm, 2.8 mm, 3 mm, etc.

[0077] In this embodiment, the mechanical strength of the heat-conducting layer 22 is relatively low. If the distance s between two adjacent through-holes 221 is too small, when the through-holes 221 are formed in the heat-conducting layer 22, the heat-conducting layer 22 is likely to have broken holes. When the heat-conducting layer 22, the first fiber resin layer 21, and the second fiber resin layer 23 are hot-pressed and formed, when the third resin 24 is poured into the through-holes 221, the heat-conducting layer 22 is likely to be deformed, thereby reducing the mechanical strength of the heat-conducting composite plate 20 and increasing the defective appearance rate. If the distance s between two adjacent through-holes 221 is too large, the number of through-holes 221 distributed on the heat-conducting layer 22 is too small, and the part where the first fiber resin layer 21 and the second fiber resin layer 23 are connected by the connecting columns or pins of the third resin 24 is too small, reducing the bonding force between the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23. When the heat-conducting composite plate 20 is stressed, for example, when a 3D-structured housing 100 is formed by hot-pressing, delamination is likely to occur.

[0078] In a specific example, the through-hole 221 is a circular through-hole 221, the diameter of the through-hole 221 is 1 mm, and the distance between two adjacent through-holes 221 is 1.5 mm.

[0079] Optionally, the thickness of the first fiber resin layer 21 ranges from 0.03 mm to 0.15 mm. Specifically, the thickness of the first fiber resin layer 21 can be, but is not limited to, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, etc.

[0080] Optionally, the thickness of the second fiber resin layer 23 ranges from 0.03 mm to 0.15 mm. Specifically, the thickness of the second fiber resin layer 23 can be, but is not limited to, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, etc.

[0081] In some embodiments, the thickness of the heat-conducting layer 22 ranges from 30 μm to 100 μm.

[0082] It can be understood that along the stacking direction of the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23, the thickness of the heat-conducting layer 22 ranges from 30 μm to 100 μm.

[0083] Specifically, the thickness of the heat-conducting layer 22 can be, but is not limited to, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 95μm, 100μm, etc.

[0084] In this embodiment, if the thickness of the heat-conducting layer 22 is too thin, the improvement of the heat-conducting performance of the heat-conducting composite plate 20 and the housing 100 is limited, which is not conducive to improving the heat dissipation effect of the housing 100. In addition, if the thickness of the heat-conducting layer 22 is too thin, when forming the through holes 221, the heat-conducting layer 22 is prone to breakage. During the hot pressing process of the heat-conducting layer 22 with the first fiber resin layer 21 and the second fiber resin layer 23, when the third resin 24 is poured into the through holes 221, the heat-conducting layer 22 is prone to deformation, thereby reducing the mechanical strength of the heat-conducting composite plate 20 and increasing the defective appearance rate. If the thickness of the heat-conducting layer 22 is too thick, the overall thickness of the housing 100 will be too thick, which is not conducive to the thinning of the housing 100. In addition, the proportion of the heat-conducting layer 22 in the housing 100 is too high, reducing the mechanical strength of the housing 100.

[0085] Optionally, the heat-conducting layer 22 can be conductive; it can also be insulating. When the heat-conducting layer 22 is conductive, when the heat-conducting layer 22 is applied to an electronic device, the heat-conducting layer 22 is arranged to avoid the antenna and NFC module of the electronic device, so as to prevent the heat-conducting layer 22 from affecting the transmission of antenna signals and NFC signals.

[0086] In some embodiments, the heat-conducting layer 22 includes at least one of graphene sheets, graphite sheets, boron nitride sheets, silicon nitride sheets, and alumina sheets.

[0087] It can be understood that the material of the heat-conducting layer 22 can be at least one of high heat-conducting layer materials such as graphene, graphite, boron nitride, silicon nitride, and alumina.

[0088] In this embodiment, these materials all have high heat-conducting performance, so as to better improve the heat-conducting performance of the heat-conducting composite plate 20 and the heat dissipation effect of the housing 100. Compared with other materials, graphene and graphite have higher heat-conducting performance and can better improve the heat dissipation effect of the housing 100. In addition, compared with boron nitride, graphene has better flexibility and toughness. When it is necessary to prepare the housing 100 with a 3D structure, during the hot pressing process, boron nitride is more brittle and prone to breakage, while graphene is not easily broken and can be used to prepare the housing 100 with a 3D structure, and can better improve the heat dissipation effect of the housing 100.

[0089] Optionally, the thermal conductivity of the thermal conductive layer 22 ranges from 10 W / M·K to 1800 W / M·K. Specifically, the thermal conductivity of the thermal conductive layer 22 can be, but is not limited to, 10 W / M·K, 30 W / M·K, 50 W / M·K, 80 W / M·K, 100 W / M·K, 200 W / M·K, 300 W / M·K, 500 W / M·K, 800 W / M·K, 1000 W / M·K, 1200 W / M·K, 1300 W / M·K, 1500 W / M·K, 1600 W / M·K, 1800 W / M·K, etc. If the thermal conductivity of the thermal conductive layer 22 is too low, it is not conducive to improving the heat dissipation effect of the thermal conductive composite plate 20 and the housing 100; the higher the thermal conductivity of the thermal conductive layer 22, the better. Graphene and graphite have higher thermal conductivity, so that the heat dissipation effect of the thermal conductive composite plate 20 and the housing 100 can be better improved.

[0090] Furthermore, the thermal conductivity of the thermal conductive layer 22 ranges from 100 W / M·K to 1800 W / M·K. In this way, the heat dissipation effect of the thermal conductive composite plate 20 and the housing 100 can be better improved.

[0091] Still further, the thermal conductivity of the thermal conductive layer 22 ranges from 300 W / M·K to 1800 W / M·K. In this way, the heat dissipation effect of the thermal conductive composite plate 20 and the housing 100 can be better improved.

[0092] Still further, the thermal conductivity of the thermal conductive layer 22 ranges from 500 W / M·K to 1800 W / M·K. In this way, the heat dissipation effect of the thermal conductive composite plate 20 and the housing 100 can be better improved.

[0093] Still further, the thermal conductivity of the thermal conductive layer 22 ranges from 800 W / M·K to 1800 W / M·K. In this way, the heat dissipation effect of the thermal conductive composite plate 20 and the housing 100 can be better improved.

[0094] Optionally, the thermal conductivity of the thermal conductive layer 22 is greater than the thermal conductivity of the first fiber resin layer 21. The thermal conductivity of the thermal conductive layer 22 is greater than the thermal conductivity of the second fiber resin layer 23.

[0095] Please refer to Figure 1 、 Figures 6 to 8 , in some embodiments, the housing body 10 includes at least three third fiber resin layers 11, at least one of the at least three third fiber resin layers 11 that is not the outermost layer has a through groove 113, and the thermal conductive composite plate 20 is embedded in the through groove 113; the third fiber resin layer 11 includes a third fiber cloth 111 and a fourth resin 112, and the fourth resin 112 wraps the surface of the third fiber cloth 111.

[0096] It should be noted that the stacking direction of at least three third fiber resin layers 11 is parallel to the stacking direction of the first fiber resin layer 21, the heat conduction layer 22, and the second fiber resin layer 23.

[0097] Optionally, the number of the third fiber resin layers 11 in the shell body 10 may be, but is not limited to, three layers, four layers, five layers, six layers, seven layers, etc.

[0098] Optionally, the third fiber cloth 111 may be formed by knitting or weaving.

[0099] Optionally, the third fiber cloth 111 may be at least one of, but is not limited to, ultra-high molecular weight polyethylene fiber cloth (abbreviation: UPE fiber), carbon fiber cloth, glass fiber cloth, aramid fiber cloth, poly(p-phenylene benzobisoxazole) fiber cloth (abbreviation: PBO fiber), liquid crystal polymer cloth (abbreviation: LCP fiber), ceramic fiber cloth, basalt fiber cloth, etc.

[0100] Optionally, the fourth resin 112 may be at least one of, but is not limited to, epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0101] It should be noted that the first fiber cloth 211, the second fiber cloth 231, and the third fiber cloth 111 may be the same or different, and the present application does not make specific limitations. The first resin 212, the second resin 232, the third resin 24, and the fourth resin 112 may be the same or different, and the present application does not make specific limitations. When the first fiber cloth 211, the second fiber cloth 231, and the third fiber cloth 111 are all the same, the manufacturing process of the shell 100 can be better simplified. When the first resin 212, the second resin 232, the third resin 24, and the fourth resin 112 are all the same, better bonding force can be achieved between the film layers of the shell 100 such as the first fiber resin layer 21, the second fiber resin layer 23, and the third fiber resin layer 11, and delamination is less likely to occur.

[0102] Optionally, the heat conduction coefficient of the heat conduction layer 22 is greater than that of the third fiber resin layer 11.

[0103] Exemplarily, the shell body 10 includes three layers of third fiber resin layers 11 or five layers of third fiber resin layers 11 that are sequentially stacked. Then, the middle layer third fiber resin layer 11 has a through groove 113, and the heat conduction composite plate 20 is disposed in the through groove 113. In other words, the heat conduction composite plate 20 is disposed on the same layer as the middle layer third fiber resin layer 11, and the middle layer third fiber resin layer 11 is disposed around the outer periphery of the heat conduction composite plate 20.

[0104] In this embodiment, by providing a through groove 113 in the third fiber resin layer 11 which is not the outermost layer, and disposing the heat-conducting composite plate 20 in the through groove 113, the thickness of the housing 100 will not be increased additionally, thereby making the housing 100 thinner and lighter. When applied to an electronic device, the electronic device can be made thinner and lighter. In addition, the position of the heat-dissipating composite plate in the housing 100 can be made more accurate, avoiding the offset of the heat-dissipating composite plate during the compression molding process and reducing the heat dissipation effect of the housing 100. In addition, by providing a through groove 113 in the third fiber resin layer 11 and disposing the heat-conducting composite plate 20 in the through groove 113, and the heat-dissipating composite plate is disposed in the non-outermost layer, this can make the overall housing 100 have higher mechanical strength.

[0105] Optionally, the thickness of the third fiber resin layer 11 ranges from 0.03 mm to 0.15 mm. Specifically, the thickness of the third fiber resin layer 11 can be, but is not limited to, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, etc. If the thickness of the third fiber resin layer 11 is too thin, more layers are required to form the housing 100 with a preset thickness, increasing the complexity and cost of the manufacturing process of the housing 100; if the thickness of the third fiber resin layer 11 is too thick, it is not conducive to the design of the film layer structure of the housing 100.

[0106] In some embodiments, the thermal conductivity of the housing 100 ranges from 5 W / M·K to 15 W / M·K.

[0107] Specifically, the thermal conductivity of the housing 100 can be, but is not limited to, 5 W / M·K, 5.5 W / M·K, 6 W / M·K, 7 W / M·K, 8 W / M·K, 9 W / M·K, 10 W / M·K, 11 W / M·K, 12 W / M·K, 13 W / M·K, 14 W / M·K, 15 W / M·K, etc.

[0108] In this embodiment, if the thermal conductivity of the housing 100 is too low, the heat dissipation effect of the housing 100 is reduced, and when the housing 100 is applied to an electronic device, it is not conducive to reducing the temperature of the housing 100 of the electronic device; if the thermal conductivity of the housing 100 is too high, the proportion of the heat-conducting layer 22 in the housing 100 needs to be larger, which will reduce the mechanical strength of the housing 100.

[0109] Optionally, the thickness of the housing 100 ranges from 0.3 mm to 1.0 mm. Specifically, the thickness of the housing 100 can be, but is not limited to, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc. When the housing 100 is too thin, it cannot provide good support and protection, and its mechanical strength cannot well meet the requirements of the housing 100 of the electronic device. When the housing 100 is too thick, it increases the weight of the electronic device, is not conducive to the thin and light design of the electronic device, affects the feel of the electronic device, and the user experience is poor.

[0110] Please refer to Figures 9 to 12 , optionally, the housing 100 further includes at least one of a fireproof layer 30, an adhesion layer 40, a primer layer 50, a middle paint layer 60, a topcoat layer 70, a texture layer 80, and an anti-fingerprint layer 90.

[0111] Please refer to Figure 9 , in some embodiments, the housing 100 further includes a fireproof layer 30, and the fireproof layer 30 is disposed on one side of the housing body 10 to enable the housing 100 to have good fireproof and flame-retardant effects.

[0112] Optionally, the fireproof layer 30 can be, but is not limited to, fireproof paint or fireproof ink. Optionally, the fireproof layer 30 can adopt paint or ink with a shielding function, so as to shield the surface texture of the housing body 10 (such as the texture of the third fiber cloth 111 in the housing body 10), and improve the appearance effect of the housing 100.

[0113] Optionally, the fireproof layer 30 can be one layer or multiple layers (such as 2 layers, 3 layers, 4 layers, or 5 layers, etc.). When the fireproof layer 30 is multiple layers, the multiple fireproof layers 30 are alternately stacked in sequence. The multiple fireproof layers 30 can enable the housing 100 to have better fireproof and flame-retardant effects.

[0114] Optionally, the thickness of each fireproof layer 30 is 5 μm to 12 μm. Specifically, it can be, but is not limited to, 5 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, etc. Optionally, the total thickness of the multiple fireproof layers 30 is 5 μm to 50 μm. Specifically, the total thickness of the multiple fireproof layers 30 can be, but is not limited to, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, etc.

[0115] Please refer to Figure 10In some embodiments, the shell 100 further includes an adhesion layer 40, a primer layer 50, a mid-coat layer 60, and a topcoat layer 70, which are sequentially stacked. When the shell 100 includes a fireproof layer 30, the primer layer 50 is disposed on the surface of the shell body 10 facing away from the fireproof layer 30. The adhesion layer 40 is disposed on the surface of the shell body 10 to improve the adhesion of the primer layer 50 to the surface of the shell body 10. The primer layer 50 is disposed on the surface of the adhesion layer 40 facing away from the primer layer 50 to improve the adhesion of the mid-coat layer 60 to the surface of the shell body 10. The mid-coat layer 60 is used to mask textures (e.g., textures of the third fiber cloth 111 in the shell body 10) and defects on the surface of the shell body 10 and to improve the adhesion of the topcoat layer 70 on the primer layer 50. The topcoat layer 70 is used to mask textures and defects on the surface of the shell body 10 and the surface of the mid-coat layer 60.

[0116] See Figure 11 In some embodiments, the shell 100 further includes a texture layer 80, which is disposed on one side of the shell body 10. When the shell 100 includes a primer layer 50, a mid-coat layer 60, and a top-coat layer 70, the texture layer 80 is disposed on the surface of the top-coat layer 70 facing away from the mid-coat layer 60.

[0117] Optionally, the surface of the texture layer 80 facing away from the shell body 10 has a textured structure (not shown), thereby giving the shell 100 a textured effect. Optionally, the texture layer 80 has a color, thereby giving the shell 100 a variety of colors. By providing the texture layer 80, the shell 100 can have a better appearance.

[0118] Optionally, the texture layer 80 is formed by transferring a texture with a light-curing glue (e.g., UV glue) and then curing it with light. For example, a texture mold is provided, the texture mold having a texture pattern complementary to the texture structure of the texture layer 80; UV glue is applied to the texture mold, and the solvent is removed to form a UV glue layer; the UV glue layer is transferred to the surface of the shell body 10 facing away from the fireproof layer 30, and then cured under ultraviolet light (e.g., a mercury lamp) to cure the UV glue layer to form the texture layer 80.

[0119] See Figure 12 In some embodiments, the shell 100 further includes an anti-fingerprint layer 90 (AF film for short), which is disposed on a side of the texture layer 80 facing away from the shell body 10 for anti-fingerprint and anti-fouling.

[0120] Optionally, the anti-fingerprint layer 90 may include, but is not limited to, one or more of perfluoropolyether, perfluoropolyether derivatives, and the like.

[0121] After the housing 100 is prepared, the method further includes using computer numerically controlled precision machining (referred to as CNC machining) to machine the housing 100 into a preset shape.

[0122] The housing 100 of the embodiment of the present application can be prepared by the method described in the following embodiments of the present application. In addition, it can also be prepared by other methods. The preparation method of the embodiment of the present application is only one or more preparation methods of the housing 100 of the present application, and should not be construed as a limitation on the housing 100 provided by the embodiment of the present application.

[0123] Please refer to Figure 13 , the embodiment of the present application provides a method for preparing a housing 100, which includes:

[0124] S201, providing a thermally conductive composite plate 20, the thermally conductive composite plate 20 includes a first fiber resin layer 21, a thermally conductive layer 22 and a second fiber resin layer 23 which are sequentially laminated, and the thermally conductive layer 22 has a plurality of through holes 221 arranged at intervals;

[0125] For other detailed descriptions of the thermally conductive composite plate 20, the first fiber resin layer 21, the thermally conductive layer 22, the second fiber resin layer 23, the through holes 221, etc., please refer to the corresponding parts of the above embodiments, and will not be repeated here.

[0126] S202, providing at least three layers of prepregs, at least one of the at least three layers of prepregs has a through slot 113;

[0127] It should be noted that there is no sequence requirement between S201 and S202. S201 can be before S202, S201 can also be after S202; it can also be that S201 and S202 are carried out simultaneously. In the embodiments and drawings of the present application, taking S201 being in the front as an example for illustration and description, it should not be construed as a limitation on the preparation method of the housing 100 of the embodiment of the present application.

[0128] S203, laminating the at least three layers of prepregs, and disposing the thermally conductive composite plate 20 in the through slot 113; and

[0129] Optionally, when laminating the at least three layers of prepregs, the prepreg having the through slot 113 can be disposed in the middle, that is, not the outermost layer. In other words, the thermally conductive composite plate 20 and the prepreg having the through slot 113 are disposed on the same layer, and the thermally conductive composite plate 20 can be disposed on a non-outermost layer.

[0130] S204, performing a first hot pressing to form a shell body 10 from the at least three layers of prepregs, thereby obtaining the housing 100.

[0131] For a detailed description of other aspects of the housing 100, please refer to the corresponding parts of the above embodiments, which will not be elaborated here.

[0132] The housing 100 prepared by the method for preparing the housing 100 according to the embodiment of the present application includes a housing body 10 and a heat-conducting composite plate 20. The heat-conducting composite plate 20 is carried on the housing body 10. By arranging the heat-conducting composite plate 20 in the housing 100, the heat-conducting coefficient of the housing 100 can be improved. When the housing 100 is applied to an electronic device, the electronic device can be better cooled, and the heat generated during the operation of the electronic device can be transferred to the entire housing 100 faster, thereby avoiding excessive temperature that may affect the user experience. In addition, the heat-conducting composite plate 20 includes a first fiber resin layer 21, a heat-conducting layer 22, and a second fiber resin layer 23 that are sequentially stacked. The heat-conducting layer 22 has a plurality of through holes 221 arranged at intervals; since the bonding force between the heat-conducting layer 22 and the first fiber resin layer 21 and the second fiber resin layer 23 is usually weak, arranging a plurality of through holes 221 in the heat-conducting layer 22 can enable the first fiber resin layer 21 and the second fiber resin layer 23 to be connected through the through holes 221, thereby improving the bonding force between the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23, and better avoiding delamination of the heat-conducting composite plate 20 when forming a 3D structure of the housing 100 by hot pressing, and improving the processing performance and service life of the heat-conducting composite plate 20. Furthermore, by arranging a through groove 113 in the third fiber resin layer 11 and arranging the heat-conducting composite plate 20 in the through groove 113, the thickness of the housing 100 will not be increased additionally, thereby making the housing 100 thinner and lighter. When applied to an electronic device, the electronic device can be made thinner and lighter. Furthermore, by arranging a through groove 113 in the third fiber resin layer 11 and arranging the heat-conducting composite plate 20 in the through groove 113, the position of the heat-dissipating composite plate in the housing 100 can be more accurate, avoiding the heat-dissipating composite plate from shifting during the molding process and reducing the heat-dissipating effect of the housing 100.

[0133] Please refer to Figure 14 , in some embodiments, in S201, providing the heat-conducting composite plate 20 includes:

[0134] S2011, providing a heat-conducting sheet and forming the plurality of through holes 221 on the heat-conducting sheet to obtain the heat-conducting layer 22;

[0135] Optionally, the material of the heat-conducting sheet can be at least one of high heat-conducting layer materials such as but not limited to graphene, graphite, boron nitride, silicon nitride, and alumina.

[0136] Optionally, the thickness of the heat-conducting sheet ranges from 30 μm to 100 μm. Specifically, the thickness of the heat-conducting sheet can be, but is not limited to, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, etc. In this embodiment, if the thickness of the heat-conducting sheet is too thin, the improvement of the heat-conducting performance of the heat-conducting composite plate 20 and the housing 100 is limited, which is not conducive to improving the heat dissipation effect of the housing 100; in addition, if the thickness of the heat-conducting sheet is too thin, the heat-conducting sheet is likely to have a hole breakage when forming the through holes 221.

[0137] For the detailed description of other aspects of the heat-conducting layer 22 and the through holes 221, please refer to the description of the corresponding part of the above embodiment, and details will not be described herein again.

[0138] Please refer to Figure 15 , in some embodiments, in S2011, forming the plurality of through holes 221 on the heat-conducting sheet to obtain the heat-conducting layer 22 includes:

[0139] S2011a, providing a plurality of layers of heat-conducting sheets and a plurality of layers of release films, and sequentially laminating the heat-conducting sheets and the release films to form a laminate;

[0140] Optionally, the number of layers of the heat-conducting sheet can be, but is not limited to, two layers, three layers, four layers, five layers, six layers, etc.

[0141] It can be understood that a layer of release film is provided between adjacent two layers of heat-conducting sheets.

[0142] Exemplarily, six layers of heat-conducting sheets and five layers of release films are alternately laminated, and a layer of release film is provided between adjacent two layers of heat-conducting sheets to form a laminate.

[0143] S2011b, providing a buffer plate, and respectively providing a layer of buffer plate on opposite two surfaces of the laminate to obtain a stacked body; and

[0144] Optionally, the buffer plate can be, but is not limited to, an epoxy resin plate.

[0145] S2011c, using a drilling machine to drill holes in the stacked body to obtain the heat-conducting layer 22 having a plurality of through holes 221.

[0146] In the related art, when opening holes in graphene sheets, a laser is used for hole opening. Each time the laser opens a hole, it can only pass through one layer, resulting in low hole-opening efficiency. In addition, a die cutter can also be used for cutting the graphene holes. However, it is also difficult to cut multiple layers together with a die cutter. Each time, only a single layer can be cut, resulting in low hole-opening efficiency. In addition, there is an easy problem of curling at the edges during die cutting. After the multi-layer heat-conducting sheet and the multi-layer release film are alternately laminated to form a laminate in the embodiment of the present application, buffer plates are provided on the two opposite surfaces to form a stacked body, and then the stacked body is drilled with a drilling machine, and multiple heat-conducting sheets can be opened at one time, improving the hole-opening efficiency of the heat-conducting sheets. In addition, since a release film is provided between adjacent heat-conducting sheets and buffer plates are provided on the opposite sides of the laminate, curling of the heat-conducting sheets during the hole-opening process can be better avoided, and the hole-opening yield of the heat-conducting sheets is improved.

[0147] S2012, roughen the surface of the heat-conducting layer 22;

[0148] Optionally, the surface of the heat-conducting layer 22 is roughened by plasma or corona, so that the heat-conducting layer 22 has a rough surface. This can provide the contact area between the heat-conducting layer 22, the first resin 212 and the second resin 232, thereby improving the bonding force between the first fiber resin layer 21, the heat-conducting layer 22 and the second fiber resin layer 23 in the obtained heat-conducting composite board 20, and better avoiding delamination of the heat-conducting composite board 20.

[0149] S2013, provide the first fiber semi-cured resin layer and the second fiber semi-cured resin layer, the first fiber semi-cured resin layer includes the first fiber cloth 211 and the first semi-cured resin, and the second fiber semi-cured resin layer includes the second fiber cloth 231 and the second semi-cured resin; and

[0150] For the detailed description of other aspects of the first fiber cloth 211 and the second fiber cloth 231, please refer to the description of the corresponding part of the above embodiment, and details are not described herein again.

[0151] Optionally, the first semi-cured resin may be, but is not limited to, at least one of semi-cured epoxy resin, semi-cured phenolic resin, semi-cured bismaleimide resin, semi-cured benzoxazine resin, etc.

[0152] Optionally, the second semi-cured resin may be, but is not limited to, at least one of semi-cured epoxy resin, semi-cured phenolic resin, semi-cured bismaleimide resin, semi-cured benzoxazine resin, etc.

[0153] It should be noted that there is no order of precedence between S2011 / S2012 and S2013. S2013 can be after S2011 / S2012, before S2011 / S2012, or S2012 and S2013 can be carried out synchronously. In the embodiments and the accompanying drawings of the present application, taking S2011 and S2012 being in the front and S2013 being in the back as an example for illustration and description, it should not be construed as a limitation on the preparation method of the housing 100 of the embodiments of the present application.

[0154] S2014, stack the first fiber semi-cured resin layer, the heat-conducting layer 22, and the second fiber semi-cured resin layer in sequence, and perform a second hot pressing to cure the first semi-cured resin to form the first resin 212, obtaining the first fiber resin layer 21; cure the second semi-cured resin to form the second resin 232, obtaining the second fiber resin layer 23; both the first semi-cured resin and the second semi-cured resin also partially fill the plurality of through holes 221 and cure to form the third resin 24, obtaining the heat-conducting composite plate 20.

[0155] Optionally, the temperature of the second hot pressing can be but is not limited to 90°C to 120°C. Specifically, the temperature of the hot pressing can be but is not limited to 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, etc.

[0156] It should be noted that the first fiber semi-cured resin layer cures to form the first fiber resin layer 21. The second fiber semi-cured resin layer cures to form the second fiber resin layer 23.

[0157] In this embodiment, after the first fiber semi-cured resin layer, the heat-conducting layer 22, and the second fiber semi-cured resin layer are stacked and during hot pressing, at high temperature, the first semi-cured resin and the second semi-cured resin soften and flow. Part of the softened first semi-cured resin and second semi-cured resin will flow into the plurality of through holes 221, fill the through holes 221, and crosslink and cure in the through holes 221 to form the third epoxy resin. And the first semi-cured epoxy resin still wrapping the surface of the first fiber cloth 211 cures to form the first resin 212, and the second semi-cured epoxy resin still wrapping the surface of the second fiber cloth 231 cures to form the second resin 232. The first resin 212 and the second resin 232 are connected by a plurality of connecting columns or pins formed by the third resin 24, thereby forming the heat-conducting composite plate 20 in which the first fiber resin layer 21, the heat-conducting layer 22, and the second fiber resin layer 23 are connected as a whole.

[0158] Optionally, after the heat-conducting composite plate 20 is prepared, it is cut into a preset shape. For example, the shape of the heat-conducting composite plate 20 is cut into a shape matching the through groove 113.

[0159] Optionally, in S203, the prepreg includes a third fiber cloth 111 and a third prepreg resin, and the third prepreg resin wraps the surface of the third fiber cloth 111. For a detailed description of other aspects of the third fiber cloth 111, please refer to the corresponding part of the above embodiments and will not be elaborated here.

[0160] Optionally, the third prepreg resin may be, but is not limited to, at least one of a prepreg epoxy resin, a prepreg phenolic resin, a prepreg bismaleimide resin, a prepreg benzoxazine resin, etc.

[0161] It should be noted that after the first hot pressing and molding, the third prepreg resin is cured to form a fourth resin 112. After the prepreg is cured, a third fiber resin layer 11 is obtained, and at least three layers of the third fiber resin layer 11 form the shell body 10.

[0162] Optionally, in S204, the temperature of the first hot pressing and molding may be, but is not limited to, 90°C to 120°C. Specifically, the temperature of the hot pressing and molding may be, but is not limited to, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, etc.

[0163] It should be noted that when the housing 100 further includes at least one of a fireproof layer 30, an adhesion layer 40, a primer layer 50, a middle paint layer 60, a topcoat layer 70, a texture layer 80, and an anti-fingerprint layer 90, the method for preparing the housing 100 further includes: forming at least one of a fireproof layer 30, an adhesion layer 40, a primer layer 50, a middle paint layer 60, a topcoat layer 70, a texture layer 80, and an anti-fingerprint layer 90 on the shell body 10.

[0164] Please refer to Figure 16 , this embodiment of the present application provides a method for preparing a housing 100, which includes:

[0165] S301, providing a heat-conducting composite plate 20, the heat-conducting composite plate 20 includes a first fiber resin layer 21, a heat-conducting layer 22, and a second fiber resin layer 23 that are sequentially stacked, and the heat-conducting layer 22 has a plurality of through holes 221 arranged at intervals;

[0166] S302, providing at least three prepregs, and at least one of the at least three prepregs has a through groove 113;

[0167] S303, stacking the at least three prepregs, and disposing the heat-conducting composite plate 20 in the through groove 113;

[0168] S304, performing a first hot pressing and molding to form a shell body 10 from at least three prepregs;

[0169] For the detailed description of S301 to S304, please refer to the corresponding parts of the above embodiments, which will not be elaborated here.

[0170] S305, form a fireproof layer 30 on one side of the shell body 10;

[0171] Optionally, coat fireproof ink or fireproof paint on one side of the shell body 10, and after heating and curing, form the fireproof layer 30.

[0172] S306, form an adhesion layer 40 on the side of the shell body 10 facing away from the fireproof layer 30;

[0173] Optionally, coat a slurry composed of the raw materials of the adhesion layer 40, such as Primer, on the side of the shell body 10 facing away from the fireproof layer 30, and after heating and curing, form the adhesion layer 40.

[0174] S307, form a primer layer 50 on the side of the adhesion layer 40 facing away from the shell body 10;

[0175] Optionally, coat a primer on the surface of the adhesion layer 40 facing away from the shell body 10, and after heating and curing, form the primer layer 50.

[0176] S308, form an intermediate paint layer 60 on the side of the primer layer 50 facing away from the shell body 10;

[0177] Optionally, coat an intermediate paint on the surface of the primer layer 50 facing away from the shell body 10, and after heating and curing, form the intermediate paint layer 60.

[0178] S309, form a topcoat layer 70 on the side of the intermediate paint layer 60 facing away from the shell body 10;

[0179] Optionally, coat a topcoat on the surface of the intermediate paint layer 60 facing away from the shell body 10, and after heating and curing, form the topcoat layer 70.

[0180] S310, form a texture layer 80 on the side of the topcoat layer 70 facing away from the shell body 10; and

[0181] Optionally, on the side of the topcoat layer 70 facing away from the shell body 10, use a texture mold to transfer a layer of texture glue layer with UV glue and perform photocuring on the texture glue layer to form the texture layer 80.

[0182] S311, form an anti-fingerprint layer 90 on the side of the texture layer 80 facing away from the shell body 10.

[0183] Optionally, deposit a perfluoropolyether layer on the side of the texture layer 80 facing away from the shell body 10 as the anti-fingerprint layer 90.

[0184] It should be noted that in the description and the accompanying drawings of this embodiment, S305 is before S306. In other embodiments, S305 may also be after any one of the steps from S306 to S311.

[0185] For the detailed descriptions of the fireproof layer 30, the adhesion layer 40, the primer layer 50, the intermediate paint layer 60, the topcoat layer 70, the texture layer 80, and the fingerprint-proof layer 90, please refer to the corresponding parts of the above embodiments, which will not be elaborated here.

[0186] The following further describes the housing 100 of the embodiment of the present application through specific embodiments.

[0187] Embodiment 1

[0188] The housing 100 of this embodiment includes a housing body 10 and a heat-conducting composite board 20, and the heat-conducting composite board 20 is embedded inside the housing body 10;

[0189] The housing body 10 includes five layers of glass fiber epoxy resin layers (i.e., glass fiber cloth impregnated with epoxy resin layer, the third fiber resin layer 11) arranged in a stacked manner in sequence. Among them, the thicknesses of the first, second, and fifth layers of glass fiber epoxy resin layers are all 0.05 mm, and the thicknesses of the third and fourth layers of glass fiber epoxy resin layers are all 0.12 mm; there is a through groove 113 in the third layer of glass fiber epoxy resin layer, and the heat-conducting composite board 20 is arranged in the through groove 113;

[0190] The heat-conducting composite board 20 includes a 0.04-mm-thick glass fiber epoxy resin layer (i.e., the first fiber resin layer 21), a 0.04-mm-thick graphene layer (i.e., the heat-conducting layer 22), and a 0.04-mm-thick glass fiber epoxy resin layer (i.e., the second fiber resin layer 23) arranged in a stacked manner in sequence. The graphene layer has a plurality of through holes 221. The shape of the through holes 221 is circular, the diameter of the through holes 221 is 1 mm, and the distance between adjacent through holes 221 is 1.5 mm.

[0191] Comparative Example 1

[0192] The housing 100 of this comparative example includes a housing body 10 and a heat-conducting composite board 20, and the heat-conducting composite board 20 is embedded inside the housing body 10;

[0193] The housing body 10 includes five layers of glass fiber epoxy resin layers (i.e., glass fiber cloth impregnated with epoxy resin layer, the third fiber resin layer 11) arranged in a stacked manner in sequence. Among them, the thicknesses of the first, second, and fifth layers of glass fiber epoxy resin layers are all 0.05 mm, and the thicknesses of the third and fourth layers of glass fiber epoxy resin layers are all 0.12 mm; there is a through groove 113 in the third layer of glass fiber epoxy resin layer, and the heat-conducting composite board 20 is arranged in the through groove 113;

[0194] The heat-conducting composite board 20 of this comparative example includes a glass fiber epoxy resin layer with a thickness of 0.04 mm (i.e., the first fiber resin layer 21), a graphene layer with a thickness of 0.04 mm (i.e., the heat-conducting layer 22), and a glass fiber epoxy resin layer with a thickness of 0.04 mm (i.e., the second fiber resin layer 23) stacked in sequence, and the graphene layer does not have through holes 221.

[0195] The heat-conducting composite boards 20 and the housing 100 of Example 1 and Comparative Example 1 were subjected to the following performance tests:

[0196] Pull-out force test: The housing 100 to be tested (cut at the part corresponding to the heat-conducting composite board 20) and the heat-conducting composite board 20 were cut into samples with dimensions of 1 cm × 2 cm. Two hot-melt adhesive rods 10' with a diameter of 1 cm were respectively bonded to the opposite two surfaces of the sample along the thickness direction, and the two hot-melt adhesive rods 10' were both perpendicular to the surface of the sample and on a straight line. The two hot-melt adhesive rods 10' on the sample were respectively clamped in the tensile machine fixture and stretched, and the maximum tensile force at which the housing 100 and the heat-conducting composite board 20 were delaminated was measured. Each sample was measured five times and the average value was taken. The measurement results are shown in Table 1 below. The picture of the sample after bonding the hot-melt adhesive is as Figure 17 shown.

[0197] Table 1 Pull-out force test data

[0198]

[0199] It can be seen from the test results in Table 1 that in Comparative Example 1, the graphene layer was not perforated, and the interfacial bonding force between the obtained heat-conducting composite boards 20 was very weak. During the pull-out force test, with a tensile force of only 0.8 N, the heat-conducting composite board 20 was delaminated. While the heat-conducting composite board 20 of Example 1 of the present application can withstand a pull-out force of 74.7 N, and the housing 100 can withstand a pull-out force of 127 N, which shows that the heat-conducting composite board 20 and the housing 100 of the embodiments of the present application have good bonding force between layers and are not easily delaminated.

[0200] Please refer to Figures 18 to 20 , the embodiments of the present application further provide an electronic device 300, the electronic device 300 includes a display screen 310, the housing 100 of the embodiments of the present application, and a processor 330. The housing 100 is disposed opposite to the display screen 310, the processor 330 is disposed between the display screen 310 and the housing 100, and the processor 330 is electrically connected to the display screen 310 for controlling the display screen 310 to display.

[0201] The electronic device 300 according to the embodiments of the present application may be, but is not limited to, portable electronic devices 300 such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc. It can be understood that the electronic device 300 described in this embodiment is only one form of the electronic device 300 to which the housing 100 is applied, and should not be construed as a limitation on the electronic device 300 provided by the present application, nor should it be construed as a limitation on the housing 100 provided by each embodiment of the present application.

[0202] For a detailed description of the housing 100, please refer to the corresponding part of the above embodiment, and details are not described herein again.

[0203] Optionally, the display screen 310 may be, but is not limited to, one or more of a liquid crystal display screen, a light-emitting diode display screen (LED display screen), a micro light-emitting diode display screen (Micro LED display screen), a sub-millimeter light-emitting diode display screen (Mini LED display screen), an organic light-emitting diode display screen (OLED display screen), etc.

[0204] Optionally, the processor 330 includes one or more general-purpose processors 330. Among them, the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 330 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory, which can enable the computing device to provide a wide variety of services.

[0205] Optionally, the electronic device 300 of the present application further includes a memory 350. The memory 350 is electrically connected to the processor 330 and is used to store the program code required for the operation of the processor 330, the program code required for controlling the display screen 310, the display content of the display screen 310, etc.

[0206] Optionally, the memory 350 may include a volatile memory, such as a random access memory (RAM); the memory 350 may also include a non-volatile memory (Non-Volatile Memory, NVM), such as a read-only memory (ROM), a flash memory (Flash Memory, FM), a hard disk drive (HDD), or a solid-state drive (SSD). The memory 350 may also include a combination of the above types of memories.

[0207] In some embodiments, the electronic device 300 according to the embodiments of the present application further includes a middle frame 320 and a camera module 370. The middle frame 320 is disposed between the display screen 310 and the housing 100, and the side surface of the middle frame 320 is exposed between the housing 100 and the display screen 310. The middle frame 320 and the housing 100 enclose an accommodation space (not shown in the figure), and the accommodation space is used to accommodate a system-on-chip, a memory 350, and the camera module 370. The camera module 370 is electrically connected to the system-on-chip and is configured to perform shooting under the control of the system-on-chip.

[0208] Optionally, the housing 100 has a light-transmitting portion 101, and the camera module 370 can shoot through the light-transmitting portion 101 on the housing 100. That is, the camera module 370 in this embodiment is a rear camera module 370. It can be understood that in other embodiments, the light-transmitting portion 101 can be disposed on the display screen 310, that is, the camera module 370 is a front camera module 370. In the schematic diagram of this embodiment, the light-transmitting portion 101 is shown as an opening for illustration. In other embodiments, the light-transmitting portion 101 may not be an opening but a light-transmitting material, such as plastic, glass, etc.

[0209] The mention of "embodiment" and "embodiment manner" in the present application means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. The phrase appears at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments. In addition, it should also be understood that the features, structures, or characteristics described in each embodiment of the present application can be combined arbitrarily without conflict to form another embodiment that does not depart from the spirit and scope of the technical solution of the present application.

[0210] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A housing, characterized in that, The housing comprises: a shell body; and A heat-conducting composite plate is carried by the shell body, and comprises a first fiber resin layer, a heat-conducting layer, and a second fiber resin layer stacked in sequence, wherein the heat-conducting layer has a plurality of through holes arranged at intervals.

2. The housing according to claim 1, wherein The first fiber resin layer includes a first fiber cloth and a first resin, the first resin wraps the surface of the first fiber cloth, the second fiber resin layer includes a second fiber cloth and a second resin, the second resin wraps the surface of the second fiber cloth, and the thermally conductive composite plate also includes a third resin, the third resin is embedded in the multiple through holes, and the third resin is respectively connected to the first resin and the second resin.

3. The housing according to claim 1, wherein The radial dimension d of the through hole is in the range of 0.7 mm ≤ d ≤ 2 mm.

4. The housing according to claim 1, characterized in that, The range of the distance s between two adjacent through holes is: 1mm≤s≤3mm.

5. The housing according to claim 1, characterized in that, The thickness of the heat conducting layer ranges from 30 μm to 100 μm.

6. The housing according to claim 1, characterized in that, The heat-conducting layer includes at least one of a graphene sheet, a graphite sheet, a boron nitride sheet, a silicon nitride sheet, and an aluminum oxide sheet.

7. The housing according to claim 1, characterized in that, The shell body includes at least three third fiber resin layers, at least one non-outermost layer of the at least three third fiber resin layers has a through groove, and the heat-conducting composite plate is embedded in the through groove; the third fiber resin layer includes a third fiber cloth and a fourth resin, and the fourth resin wraps the surface of the third fiber cloth.

8. The housing according to claim 1, characterized in that, The thermal conductivity of the shell is in the range of 5 W / M·K to 15 W / M·K.

9. The housing according to any one of claims 1-8, characterized in that, The housing further comprises at least one of a fireproof layer, an adhesion layer, a primer layer, a mid-coat layer, a topcoat layer, a texture layer, and an anti-fingerprint layer; The fireproof layer is provided on one side of the shell body; The adhesion layer is arranged on a side of the shell body away from the fireproof layer; The adhesion layer, the primer layer, the intermediate paint layer and the top paint layer are sequentially stacked on a side of the adhesion layer away from the shell body, and the adhesion layer is located between the shell body and the primer layer; The texture layer is arranged on a side of the topcoat layer facing away from the shell body; The anti-fingerprint layer is arranged on a side of the topcoat layer facing away from the shell body.

10. A method for preparing a housing, characterized in that, include: A heat-conducting composite plate is provided, the heat-conducting composite plate comprising a first fiber resin layer, a heat-conducting layer, and a second fiber resin layer stacked in sequence, the heat-conducting layer having a plurality of through holes arranged at intervals; Providing at least three layers of prepregs, at least one of the at least three layers of prepregs having a through groove; Laminating the at least three layers of prepregs, and placing the heat-conducting composite plate in the through groove; as well as A first hot pressing molding is performed to form a shell body with at least three layers of prepregs to obtain the shell.

11. The manufacturing method of the housing according to claim 10, characterized in that, Provide thermal conductive composite panels, including: Providing a heat-conducting sheet, and forming the plurality of through holes on the heat-conducting sheet to obtain the heat-conducting layer; performing a roughening treatment on the surface of the heat-conducting layer; Providing a first fiber semi-cured resin layer and a second fiber semi-cured resin layer, wherein the first fiber semi-cured resin layer includes a first fiber cloth and a first semi-cured resin, and the second fiber semi-cured resin layer includes a second fiber cloth and a second semi-cured resin; and The first fiber semi-cured resin layer, the heat-conducting layer, and the second fiber semi-cured resin layer are sequentially laminated and subjected to a second hot pressing to cure the first semi-cured resin to form a first resin, thereby obtaining a first fiber resin layer; the second semi-cured resin is cured to form a second resin, thereby obtaining a second fiber resin layer; both the first semi-cured resin and the second semi-cured resin also partially fill the plurality of through holes and are cured to form a third resin, thereby obtaining the heat-conducting composite board.

12. The manufacturing method of the housing according to claim 11, characterized in that, Forming the plurality of through holes on the heat-conducting sheet to obtain the heat-conducting layer includes: Providing a plurality of layers of heat-conducting sheets and a plurality of layers of release films, and sequentially laminating the heat-conducting sheets and the release films to form a laminate; Providing a buffer plate, and respectively disposing a layer of buffer plate on two opposite surfaces of the laminate to obtain a stacked body; and Using a drilling machine to drill holes in the stacked body to obtain the heat-conducting layer having a plurality of through holes.

13. The manufacturing method of the housing according to claim 11, characterized in that, The preparation method further includes: Forming a fireproof layer on one side of the shell body; Forming an adhesion layer on the side of the shell body facing away from the fireproof layer; Forming a primer layer on the side of the adhesion layer facing away from the shell body; Forming an intermediate paint layer on the side of the primer layer facing away from the shell body; Forming a topcoat layer on the side of the intermediate paint layer facing away from the shell body; Forming a texture layer on the side of the topcoat layer facing away from the shell body; and Forming an anti-fingerprint layer on the side of the texture layer facing away from the shell body.

14. An electronic device, characterized in that, The electronic device includes: A display screen; A housing prepared by the method for preparing a housing according to any one of claims 1-9 or any one of claims 10-13, the housing being disposed opposite to the display screen; and A processor, the processor being disposed between the display screen and the housing, and the processor being electrically connected to the display screen for controlling the display screen to display.

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