An SMT patch device for PCBA board production

Abstract

The present invention relates to the technical field of chip placement machines, and discloses an SMT chip placement device for PCBA board production, including a chip placement machine, wherein the chip placement machine includes a feeding mechanism, a PCB conveying mechanism, and a placement mechanism, wherein the PCB conveying mechanism is used to convey PCB boards, the placement mechanism is used to place patches on PCB boards to be placed, the feeding mechanism is used to provide patch materials to the placement mechanism, and further includes a placement loading table, wherein the placement loading table includes at least two tooling tables, wherein the tooling tables are not connected to each other, when one of the tooling tables is in a patch state, the other tooling table is in a feeding state, the patch state and the feeding state are switched alternately, and the tooling table in the patch state is not connected to the chip placement machine, the patch state refers to a state in which the tooling table is out of contact with the PCB conveying mechanism and the placement mechanism places patches on the tooling table, and the feeding state refers to a state in which the tooling table is docked with the PCB conveying mechanism and is used to receive and transport PCB boards.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounters, and in particular to an SMT chip mount device for PCBA board production. Background Art

[0002] The SMT placement equipment used to make PCBA boards usually uses a frame with high mechanical strength and rigidity. The core components of the placement machine are supported by rigid materials (such as steel) to ensure equipment stability and reduce the impact of vibrations such as the movement of the robotic arm and the conveyor belt on placement accuracy.

[0003] In the actual patch process, even when working on a stable rack, it is still necessary to shut down other motion mechanisms, such as stopping the conveyor belt, while the patch mechanism on the robot arm is performing patch placement, to minimize the impact of corresponding vibration on patch accuracy. This prevents the conveyor belt from feeding and patch placement at the same time, reducing the patch machine's patch efficiency. In addition, the movement of the patch device itself is accompanied by vibration, which also affects the patch accuracy.

[0004] Chinese patent application with application number 2021116214481: A placement machine for preventing pad vibration and displacement, which aims to solve the problem that the pad is easily subjected to vibration, resulting in the pad being offset a small distance, thereby causing deviations in the fixation of components and causing the PCB board to be easily damaged. The technical solution provided is as follows: the upper surface of the base plate is fixedly installed with a power component, and the upper surfaces of both ends of the base plate are symmetrically fixed with brackets. The PCB board is fixed by a concave clamping plate. When the cylinder drives the pressure beam to move downward along the outside of the guide beam through the T-shaped rod, the upper clamping plate is pressed and fixed by the concave pressure block, and the second pulley is linked to make the angular push rod push the second rotating shaft upward along the second strip groove, so that the movable pulley always presses against the second conveyor belt to squeeze the lower clamping plate, so that the position of the PCB board is fixed; when installing components, the connecting plate drives the rectangular slider to slide along the rectangular box through multiple top columns, and buffering is achieved by the third spring to prevent the PCB board from small-distance displacement caused by vibration. This solution is similar to the existing technology, both of which use fastening means such as clamping to rigidly fix the PCB board to be patched. However, the clamping mechanism that provides rigid fixation itself will also transmit vibration, and it does not solve the problem that the feeding of the conveyor belt and the patch work of the robotic arm cannot be carried out simultaneously.

[0005] In some existing technologies, dual cantilevers are installed to increase patch efficiency by performing patch operations on two circuit boards at the same time. However, the dual cantilevers increase the number of motion mechanisms, and the motion mechanisms are not isolated from the structure that supports the PCBs. Instead, they increase the intensity of vibration and relatively increase the risk of affecting the patch accuracy.

[0006] In the prior art, a transfer mechanism such as a robotic arm is provided to transfer the PCB board on the conveyor belt to a clamping station for performing the patch operation. First, the clamping station in the prior art is also an integral structure with the patch machine, and cannot isolate the clamping station from the vibration caused by the various motion mechanisms on the patch machine. In addition, the clamping mechanism is usually required to return the patched PCB board to the conveyor belt after the patch is completed so that it can enter the next process. Therefore, the conveyor belt is also in a stopped state during the patch operation, and the problem of conveying efficiency is not solved. Otherwise, a large-span robotic arm is required to transfer the PCB board, which will greatly increase the size of the equipment and require planning the movement path of the corresponding mechanical structure in a limited area, which greatly increases the complexity of the mechanical movement.

[0007] In summary, there is an urgent need for an SMT patch device for PCBA board production that can isolate the vibration generated by the motion mechanism of the patch machine from being transmitted to the position to be patched and can improve the patch efficiency. Summary of the Invention

[0008] In view of the vibration and efficiency problems in the existing technology during patch processing, an SMT patch device for PCBA board production is proposed, which can isolate the vibration generated by the motion mechanism of the patch machine from being transmitted to the position to be patched and improve the patch efficiency.

[0009] In order to solve the above problems, the technical solution of the present invention is:

[0010] An SMT patch device for PCBA board production includes a patch machine, which includes a feeding mechanism, a PCB conveying mechanism, a placement mechanism, and two tooling tables, wherein the tooling tables are not connected to each other; the tooling tables in the patch state are used to load PCB boards to be patched for the placement mechanism, and the tooling tables in the feeding state are used to receive and transport PCB boards with patches transmitted by the PCB conveying mechanism. The patch state and the feeding state of each tooling table are switched alternately, and when one of the tooling tables is in the patch state, the other is in the feeding state, wherein the tooling tables in the patch state are not connected to the patch machine.

[0011] As a preferred technical solution, the workbench includes a support seat, a translation drive mechanism, and a receiving and conveying mechanism; the support seat is used to support the translation drive mechanism and the receiving and conveying mechanism, the translation drive mechanism is used to drive the receiving and conveying mechanism into the patch state or the feeding state, and the receiving and conveying mechanism is used to receive or transfer PCB boards.

[0012] As a preferred technical solution, the translation drive mechanism is a hydraulic rod structure, and the receiving and conveying mechanism is a conveyor belt structure.

[0013] As a preferred technical solution, the feeding mechanism is provided with two groups, and is symmetrically arranged on both sides of the PCB conveying mechanism.

[0014] As a preferred technical solution, the displacement area of ​​the placement head of the placement mechanism covers each of the receiving and conveying mechanisms.

[0015] As a preferred technical solution, it includes a baffle and a lifting mechanism, wherein the lifting mechanism is used to control the lifting of the baffle. When the lifting mechanism rises, the baffle is used to prevent the PCB board on the PCB conveying mechanism from entering the receiving conveying mechanism.

[0016] As a preferred technical solution, the baffle includes a blocking plate and a guide rod; the lifting mechanism includes a first guide platform and a second guide platform, the first guide platform and the second guide platform are symmetrically arranged on each of the receiving and conveying mechanisms, and there is a gap between the first guide platform and the second guide platform; the guide rod can move along the first guide platform and the second guide platform.

[0017] As a preferred technical solution, the first guide platform includes a settling platform, a rising platform, and a high-position platform; when the guide rod is located on the rising platform and the high-position platform, the blocking piece prevents the PCB board on the PCB conveying mechanism from entering the receiving conveying mechanism.

[0018] As a preferred technical solution, a roller is provided at the end of the guide rod.

[0019] Beneficial effects of the present invention:

[0020] The SMT patch device for PCBA production described in the present invention has a workbench serving as a patch platform, which is located within a frame equipped with a feeding mechanism, a PCB conveying mechanism, a placement mechanism, and other moving mechanisms, but is not connected to the frame. This allows the PCB board to be patched to remain isolated from the vibrating workpiece. Therefore, during the patching process, the PCB board can be continuously conveyed, effectively isolating the impact of the vibration generated by the placement machine's moving mechanism on the PCB board to be patched. The two workbench can alternately switch between the patching state and the feeding state, allowing the placement mechanism to operate continuously without waiting for the PCB board to be loaded and unloaded, greatly improving the patching efficiency. The design of the two workbench being unconnected not only ensures that the workbench in the patching state is completely isolated from the vibration transmission of other moving parts of the placement machine, but also isolates the vibration of the other workbench, thereby further ensuring the accuracy of the patching. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a three-dimensional schematic diagram of the working mechanism on the frame of the SMT patch device for PCBA board production according to the present invention;

[0022] Figure 2This is a schematic diagram of the installation and coordination of the SMT patch device for PCBA board production of the present invention;

[0023] Figure 3 This is a three-dimensional schematic diagram of the SMT patch device used for PCBA board production according to the present invention;

[0024] Figure 4 This is a schematic diagram of the tooling table of the SMT patch device for PCBA board production according to the present invention;

[0025] Figure 5 This is a partial schematic diagram of the SMT patch device used for manufacturing the PCBA board with a baffle according to the present invention;

[0026] Figure 6 This is a schematic diagram of the baffle and lifting mechanism structure of the SMT patch device for PCBA board production according to the present invention;

[0027] Figure 7 Schematic diagram of the baffle in the raised state;

[0028] Figure 8 Schematic diagram of the coordination between the baffle in the raised state and the lifting structure.

[0029] The reference numerals and components in the drawings are as follows:

[0030] 1. Feeding mechanism; 2. PCB conveying mechanism; 21. Connecting rod; 3. Mounting mechanism;

[0031] 4. Workbench; 41. Undertaking and conveying mechanism; 42. Support seat; 43. Translation drive mechanism;

[0032] 5. Frame; 51. Chassis cover;

[0033] 6. PCB board;

[0034] 7. baffle; 71. blocking plate; 72. guide rod; 73. roller;

[0035] 8. Lifting mechanism; 81. First guide platform; 82. Second guide platform; 811. Lowering platform; 812. Rising platform; 813. High-position platform. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of the specific embodiments of the present invention is given in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] To better understand the SMT placement device for PCBA board production provided in this embodiment, the following first briefly introduces the existing SMT placement machine. The existing SMT placement machine refers to a high-precision electronic device used to accurately place various electronic components on a PCB (printed circuit board), including a frame, a conveyor system, an XY positioning system, a placement head, a feeding system, a vision system, and a control system. The frame is the basic structure of the SMT placement machine, bearing the weight of the entire machine and maintaining its stability. The frame usually has sufficient mechanical strength and rigidity to ensure that it will not deform or vibrate during the placement process. The conveyor system is responsible for accurately transporting the PCB to the specified position and sending it out after the placement is completed. It is usually composed of one or more belt conveyor mechanisms and is driven by a stepper motor or servo motor to achieve precise transportation of the PCB. The XY positioning system is responsible for controlling the precise movement of the placement head on the PCB. It is composed of X-axis and Y-axis servo motors, a transmission mechanism, a linear slide, and a positioning sensor. Through a computer control system, the position of the placement head on the PCB can be precisely controlled to achieve precise placement of components. The placement head is the core component of the SMT placement machine, responsible for picking up, moving and placing components. It usually contains one or more suction nozzles, which pick up components by negative pressure adsorption. The placement head can also be equipped with a visual system, which is used to accurately locate and identify PCBs and components. It usually includes cameras, light sources, and image processing software. The control system usually includes computers, motion control cards, sensors, and actuators, which are used to receive data from the visual system, positioning system, and user interface, and issue instructions after processing to control the actions of the placement head, conveying system, and feeding system to achieve automated placement.

[0038] However, the existing SMT placement machine's transmission system, XY positioning system, placement head, and feeding system are all installed on the same frame. As a result, the vibrations generated by the motors and transmission mechanisms during operation can be transmitted to the PCB board to be placed, causing the PCB board to vibrate. Especially when high-precision placement is required, it is easy to lead to a decrease in the placement yield, increase the recognition and positioning difficulty of the visual system, and reduce the placement efficiency.

[0039] Example 1

[0040] Please see the attached Figure 1 This application proposes an SMT placement device for PCBA board production. The device includes a placement machine, which includes a feeding mechanism 1 for providing patch material to a placement mechanism 3, a PCB conveying mechanism 2 for transporting PCB boards 6, and a placement mechanism 3 for picking up patch material from the feeding mechanism 1 to place patches on the PCB board 6.

[0041] In order to solve the problem of vibration generated by the movement mechanism of the placement machine affecting the placement accuracy and improve the placement efficiency, this application proposes to solve this problem by switching the working modes of the two tooling tables 4 alternately, and the tooling table 4 in the placement working mode is not connected to the machine that generates vibration.

[0042] Please see the attached Figure 2 The SMT patch device for PCBA production also includes two tooling tables 4. When one of the tooling tables 4 is in the patch state, the other tooling table 4 is in the feeding state. The patch state and the feeding state can be switched alternately. The patch state refers to the state in which the tooling table 4 is out of contact with the PCB conveying mechanism 2 and the placement mechanism 3 is performing patching on it. The feeding state refers to the state in which the tooling table 4 is docked with the PCB conveying mechanism 2 and is used to receive and transport the PCB board 6. When the tooling table 4 in the patch state completes the patch, the PCB board 6 on the PCB conveying mechanism 2 is completely fed into the tooling table 4 in the feeding state. At this time, the states of the two tooling tables 4 begin to switch. The tooling table 4 that has completed the patch moves to dock with the PCB conveying mechanism 2 and transfers the completed patch to the PCB conveying mechanism 2. Synchronously, the PCB board 6 on the PCB conveying mechanism 2 that has not been patched is gradually fed onto the above-mentioned tooling table 4. At the same time, the other tooling table 4 that was previously in the feeding state carries the PCB board 6 to be patched above it into the waiting patch work. Position, the placement mechanism 3 absorbs the patch material and moves it to the top of the tooling table 4 to place the patch on the PCB board 6. Therefore, by switching the patch stations of the two tooling tables 4, the PCB board 6 transportation and patch can be carried out synchronously, which effectively improves the patch efficiency. At the same time, the two tooling tables 4 are not connected to each other, so that the vibration generated by the tooling table 4 in the feeding state cannot be transmitted to the tooling table 4 in the patch state, and the tooling table 4 in the patch state is also not connected to the patch machine, so that the tooling table 4 in the patch state is completely isolated from the vibration generated by the patch machine, avoiding the vibration affecting the patch accuracy.

[0043] Please see the attached Figure 3 In a specific embodiment, the feed mechanism 1, PCB conveying mechanism 2, and placement mechanism 3 of the placement machine are all mounted on a frame 5. Preferably, a chassis cover 51 is also provided on the frame 5. The PCB conveying mechanism 2 is a motor-driven conveyor belt structure located in the middle of the frame 5. The conveyor belt is divided into two sections, front and rear. Both the front and rear sections are conveyor belts. A space is left between the front and rear sections to accommodate the receiving conveying mechanism 41 of the workbench 4.

[0044] Please see the attached Figure 4Taking the workbench 4 on one side as an example, the workbench 4 includes a support base 42, a translation drive mechanism 43, and a receiving and conveying mechanism 41. The support base 42 is used to support the translation drive mechanism 43 and the receiving and conveying mechanism 41, and the support base 42 passes through the frame 5 and is directly fixed on the ground, and is not connected to the frame 5. A translation drive mechanism 43 is provided above the support base 42. In this embodiment, the translation drive mechanism 43 is a hydraulic rod, and the other end of the hydraulic rod is connected to the receiving and conveying mechanism 41. The receiving and conveying mechanism 41 is a conveyor belt structure, and the upper surface of the conveyor belt is flush with the upper surface of the PCB conveying mechanism 2 for conveying the PCB board 6. The receiving and conveying mechanism 41 is moved in and out between the front section and the rear section of the PCB conveying mechanism 2 by the extension and retraction of the high-precision hydraulic rod. In some embodiments, each receiving and conveying mechanism 41 is connected to two sets of hydraulic rods to improve the support strength. In some embodiments, the extension and retraction drive can also be performed by the drive of a threaded screw.

[0045] In this embodiment, two sets of feeding mechanisms 1 are provided, which are respectively arranged on the rack 5 near the tooling table 4 on both sides to facilitate feeding of the patch.

[0046] In the usage of the present invention, the PCB board 6 is located on the PCB conveying mechanism 2 and moves toward the receiving conveying mechanism 41. When the PCB board 6 is transferred to the receiving conveying mechanism 41, the conveyor belt stops operating but the conveyor belt on the PCB conveying mechanism 2 continues to work. The translation drive structures on the two workbench 4 are started at the same time, one extending and the other retracting. The receiving conveying mechanism 41 carrying the PCB board 6 is retracted to an area away from the PCB conveying mechanism 2, and enters the patch state. The other receiving conveying mechanism 41 that does not carry the PCB board 6 is sent to the area between the front section and the rear section of the PCB conveying mechanism 2 and enters the feeding state for receiving the next PCB board 6. While receiving the next PCB board 6, the placement mechanism 3 has moved to the area where it entered previously. Above the receiving and conveying mechanism 41 in the patch state, the patch head picks up parts from the adjacent feeding mechanism 1 for placement on the PCB board 6 above. It should be understood that when the placement is completed, the PCB board 6 on the other workbench 4 is also loaded, and the switching between the patch state and the feeding state begins. After the PCB board 6 with the mounted PCB board 6 is docked with the PCB conveying mechanism 2, the conveyor belt on it is started to transfer the mounted PCB board 6 to the PCB conveying mechanism 2, and at the same time, a new unmounted PCB board 6 is received from the PCB conveying mechanism 2. At the same time, the placement mechanism 3 has been transferred to the workbench 4 on the other side to start placement. This cyclic operation can achieve stable placement under the continuous operation of the PCB conveying mechanism 2.

[0047] It should be noted that in order to ensure the continuous and stable operation of the SMT placement device for PCBA production described herein, it is necessary to control the spacing between adjacent PCB boards 6 on the PCB conveyor mechanism 2, as well as the conveying speed. Specifically, the placement time and the state switching time must be considered. Specifically, it is necessary to ensure that the time it takes for the receiving conveyor mechanism 41 to complete docking with the PCB conveyor mechanism 2 to receive the PCB board 6 to be placed is the same as the time it takes for the placement mechanism 3 to complete placement, or to ensure that when the placement mechanism in the placement state completes placement, the PCB board 6 to be placed is on the receiving conveyor mechanism 41 in the feeding state. Secondly, it is necessary to ensure that the next PCB board 6 to be placed on the PCB conveyor mechanism 2 remains on the PCB conveyor mechanism 2 before the state switching is completed. Specifically, the time required to move the spacing between adjacent PCB boards 6 is greater than or equal to the time required for the translation drive mechanism 43 to complete the state switching. It should be understood that stable operation can be achieved by simply controlling the conveying speed of the corresponding conveyor belts and the spacing between PCB boards 6 entering the PCB conveyor mechanism 2. Therefore, this can be achieved using existing control systems.

[0048] The SMT placement device for PCBA production described in the present invention maintains an isolated state between the PCB board 6 to be placed and the vibrating workpiece, allowing the PCB board 6 to be transported continuously during the placement process, effectively isolating the impact of vibration generated by the placement machine's motion mechanism on the PCB board 6 to be placed. The two workstations 4 can alternately switch between placement and feeding modes, allowing the placement mechanism 3 to operate continuously without waiting for the PCB board 6 to be loaded or unloaded, greatly improving placement efficiency. The two workstations 4 are designed to be disconnected from each other, ensuring that the workstation 4 in the placement state is completely isolated from vibration transmission from other moving parts of the placement machine and also isolates the vibration of the other workstation 4, further ensuring placement accuracy. In other words, the SMT placement device for PCBA production described in the present invention achieves parallel operation of placement and feeding operations through the alternately switched isolated operating modes, significantly improving placement efficiency and placement yield. While maintaining the same production efficiency, it does not require the addition of a placement mechanism 3 or an increase in floor space.

[0049] Example 2

[0050] The switching between the feeding state and the patch state is achieved by the movement of the translation drive mechanism 43. Therefore, the time required for the state switching depends on the speed of the movement of the translation drive mechanism 43. During the switching process, the PCB conveying mechanism 2 always maintains the conveying state, and the PCB board 6 on it continues to move toward the receiving conveying mechanism 41. In order to further prevent the PCB board 6 from contacting the receiving conveying mechanism 41 during the state switching process due to errors in the conveying speed and the spacing distance between the PCB boards 6, please refer to the attached Figure 5 , Attachment Figure 6In this embodiment, the SMT placement device for PCBA board production is provided with a baffle 7 mechanism to prevent the movement of the PCB board 6. During the state switching process, the baffle 7 rises to isolate the PCB board 6 on the PCB conveying mechanism 2 and the receiving conveying mechanism 41. After the state switching is completed, the baffle 7 falls below the conveying track of the PCB board 6, and the PCB board 6 can be transferred normally.

[0051] Specifically, its isolation structure includes the baffle 7 and the lifting mechanism 8. In some embodiments, the lifting mechanism 8 can be an active driving device for controlling the lifting of the hydraulic cylinder, etc., but in order to reduce the complexity of the control system, the lifting mechanism 8 in this embodiment includes a first guide platform 81 and a second guide platform 82 respectively arranged on each receiving and conveying mechanism 41. Taking the first guide platform 81 as an example, the first guide platform 81 includes a sinking platform 811, a rising platform 812, and a high-level platform 813. The second guide platform 82 has the same structure as the first guide platform 81 and is symmetrically arranged. The first guide platform 81 and the second guide platform 82 are not connected to each other to avoid vibration. Conduction, the baffle 7 includes a blocking piece 71, and a guide rod 72 is provided below the center of the blocking piece 71. Preferably, a roller 73 is provided at the bottom of the guide rod 72. In order to fix the baffle 7 and limit the moving direction of the baffle 7, a connecting rod 21 is provided on the fixing frame on the platform for installing the PCB conveying mechanism 2. The connecting rod 21 is provided with a guide hole adapted to the guide rod 72. The guide rod 72 can be raised and lowered along the guide hole. The connecting rod 21 and the guide hole thereon are used to provide a trajectory for the baffle 7 to move up and down. In some embodiments, guide rails with limiting positions can also be provided on both sides of the blocking piece 71, which can also provide a limit for the baffle 7 to move up and down.

[0052] The roller 73 below the guide rod 72 can move along the surface of the first guide platform 81 and the second guide platform 82. Specifically, taking the first guide platform 81 as an example, when the receiving and conveying mechanism 41 correspondingly connected to the first guide platform 81 is in the feeding state, the roller 73 is located on the sedimentation platform 811. Figure 7 , Attachment Figure 8 When it needs to switch from the feeding state to the patch state, the translation drive mechanism 43 begins to extend and retract and drives the first guide platform 81 to move, and the roller 73 on the guide rod 72 begins to enter the rising platform 812. At this time, the blocking plate 71 begins to move upward and isolates it between the transfer tracks of the PCB board 6, which is used to prevent the PCB board 6 from entering the receiving and conveying mechanism 41 whose state has not been switched. When the roller 73 on the guide rod 72 enters the high-position platform 813, the baffle 7 rises to the highest point. It should be understood that the distance between the first guide platform 81 and the second guide platform 82 is smaller than the diameter of the roller 73, so that the roller 73 can be smoothly transferred between the first guide platform 81 and the second guide platform 82.

[0053] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and supplements without departing from the principles of the present invention. These improvements and supplements should also be regarded as the scope of protection of the present invention.

Claims

1. An SMT placement device for PCBA board production, including a placement machine, the placement machine including a feeding mechanism, a PCB conveying mechanism, and a placement mechanism, characterized in that: The feeding mechanism is provided with two groups, and is symmetrically arranged on both sides of the PCB conveying mechanism, and also includes two tooling tables, wherein the tooling tables are not connected to each other; the tooling tables in the patch state are used to load the PCB boards to be patched for the placement mechanism, and the tooling tables in the feeding state are used to receive and transport the PCB boards with patches transmitted on the PCB conveying mechanism. The patch state and the feeding state of each tooling table are switched alternately, and when one of the tooling tables is in the patch state, the other tooling table is in the feeding state, wherein the tooling tables in the patch state are not connected to the placement machine.

2. The SMT patch device for PCBA production according to claim 1, characterized in that: The workbench includes a support seat, a translation drive mechanism, and a receiving and conveying mechanism; the support seat is used to support the translation drive mechanism and the receiving and conveying mechanism, the translation drive mechanism is used to drive the receiving and conveying mechanism to enter the patch state or the feeding state, and the receiving and conveying mechanism is used to receive or transfer PCB boards.

3. The SMT patch device for PCBA production according to claim 2, characterized in that: The translation drive mechanism is a hydraulic rod structure, and the receiving and conveying mechanism is a conveyor belt structure.

4. The SMT patch device for PCBA production according to claim 2, characterized in that: The displacement area of ​​the placement head of the placement mechanism covers each of the receiving and conveying mechanisms.

5. The SMT patch device for PCBA production according to claim 2, characterized in that: The baffle comprises a baffle and a lifting mechanism. The lifting mechanism is used to control the lifting of the baffle. When the lifting mechanism rises, the baffle is used to prevent the PCB board on the PCB conveying mechanism from entering the receiving conveying mechanism.

6. The SMT patch device for PCBA production according to claim 5, characterized in that: The baffle includes a blocking piece and a guide rod; the lifting mechanism includes a first guide platform and a second guide platform, the first guide platform and the second guide platform are symmetrically arranged on each of the receiving and conveying mechanisms, and there is a gap between the first guide platform and the second guide platform; the guide rod can move along the first guide platform and the second guide platform.

7. The SMT patch device for PCBA production according to claim 6, characterized in that: The first guide platform includes a settling platform, an ascending platform, and a high-position platform; when the guide rod is located on the ascending platform and the high-position platform, the blocking piece prevents the PCB board on the PCB conveying mechanism from entering the receiving conveying mechanism.

8. The SMT patch device for PCBA production according to claim 6, characterized in that: The end of the guide rod is provided with a roller.

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