LED support and LED lamp bead

Abstract

The invention discloses an LED support and an LED lamp bead, and relates to the technical field of LED lamps. The LED support comprises a support mechanism, the support mechanism comprises a supporting plate, a spliced bonding pad assembly is arranged in the middle in the support mechanism, the bonding pad assembly comprises a main frame mechanism, the main frame mechanism comprises a main frame fixedly connected with the supporting plate, pin grooves are formed in the two ends of the bottom face of the main frame respectively, and pin mechanisms are inserted in the pin grooves in a matched mode. A tilting clamping frame mechanism is movably hinged in the bonding pad assembly, extrusion assemblies are oppositely arranged on the side faces of the main frame respectively, each extrusion assembly comprises a spring washer fixedly connected with the main frame, the inward side of each spring washer is fixedly connected with a joint strip, the upper side face of each joint strip is inclined, and a tangent plane is formed in one end of each joint strip; and a second connecting plate is fixedly embedded in the surface of the clamping frame, one side of the clamping frame is fixedly connected with a shaft block, an LED support and an LED lamp bead, the chip mechanism can be placed at an inclined angle, and the convenience of insertion is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamps, specifically an LED bracket and an LED lamp bead. Background Art

[0002] An LED bracket is the bottom base before the encapsulation of an LED lamp bead, and its main functions are to conduct electricity and provide support. On the basis of the LED bracket, a chip is fixed in it, positive and negative electrodes are welded, and then it is encapsulated in one piece with encapsulating glue.

[0003] An LED lamp bead works based on the light-emitting principle of a PN junction. When a forward bias voltage is applied to the PN junction, the potential barrier drops, and the majority carriers in the P region and the N region diffuse towards each other. Since the electron mobility is much larger than the hole mobility, a large number of electrons diffuse into the P region and recombine with the holes in the valence band. The energy released during recombination is manifested in the form of light energy.

[0004] The LED lamp bead needs to fix the LED chip in the LED bracket, and the space in the LED bracket for placing the LED chip is adapted to the LED chip itself. Moreover, the LED chip is placed in the LED bracket in an embedded form. Therefore, when placing the LED chip, it needs to be accurately aligned and then placed. During the actual assembly process, it may be necessary to take and place it multiple times to correctly place the LED chip on the LED bracket. Therefore, the operation of placing the LED chip is relatively slow, reducing the assembly rate of the LED lamp bead. Therefore, there is an urgent need for an LED bracket and an LED lamp bead to solve the above existing problems. Summary of the Invention

[0005] The purpose of the present invention is to provide an LED bracket and an LED lamp bead to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: an LED bracket, including a bracket mechanism, and the bracket mechanism includes a tray;

[0007] A solder pad assembly formed by splicing is arranged in the middle of the bracket mechanism;

[0008] The solder pad assembly includes a main frame mechanism, and the main frame mechanism includes a main frame fixedly connected to the tray. Pin slots are respectively opened at both ends of the bottom surface of the main frame;

[0009] Pin mechanisms are adaptively inserted into the pin slots;

[0010] A clamping frame mechanism that tilts up is movably hinged in the solder pad assembly;

[0011] Extrusion components are respectively arranged on the opposite sides of the main frame. The extrusion component includes a spring pad fixedly connected to the main frame. On the inner side of the spring pad, a sticking strip is fixedly connected. The upper side of the sticking strip is inclined, and a cut surface is opened at one end of the sticking strip.

[0012] The clamping frame mechanism includes a clamping frame. A second connecting plate is fixedly embedded on the surface of the clamping frame. One side of the clamping frame is fixedly connected with a shaft block. Connecting shafts are respectively fixedly connected to both ends of the shaft block. The connecting shafts are movably connected to the main frame through bearings. In the middle of the upper side of the shaft block, a baffle is fixedly connected. At both ends of the upper side of the shaft block, pressing strips with upturned ends are respectively fixedly connected. At both ends of the other side of the clamping frame, bottom strips corresponding to the pressing strips are respectively fixedly connected. The outer edge of the bottom strip is smooth.

[0013] As a preferred technical solution of the present invention, a through hole is opened in the middle of the surface of the support plate.

[0014] Arc-shaped side frames are respectively fixedly connected to the opposite sides of the upper surface of the support plate. First card holes adapted to the plug-in pin mechanism are penetrated and opened on the side frames.

[0015] A cover shell is covered above the support plate. Second card holes adapted to the plug-in pin mechanism are respectively penetrated and opened on the opposite sides of the cover shell. Inclined reflecting mirrors are respectively fixedly embedded on the opposite sides of the inner wall of the cover shell. Below the reflecting mirrors, an adjustable angle adjusting mirror assembly is correspondingly arranged.

[0016] The adjusting mirror assembly includes a reflecting plate. Rotating shafts are respectively fixedly connected to the middle parts of both ends of the reflecting plate. The rotating shafts penetrate and are movably connected to the cover shell.

[0017] As a preferred technical solution of the present invention, a first heat conducting plate corresponding to the through hole is fixedly embedded in the middle of the bottom surface of the main frame.

[0018] First buckling grooves with bulging inner ends are respectively opened at the corners of both ends of the side surface of the main frame.

[0019] As a preferred technical solution of the present invention, the pin mechanism includes an outer plate. The outer end of the outer plate is buckled on the edge of the support plate. The outer plate is adapted to be plugged into the first card hole and the second card hole.

[0020] A clamping plate with sunken sides is fixedly connected to the inner end of the outer plate.

[0021] A connecting plate adapted to be plugged into the pin slot is fixedly connected to the inner end of the clamping plate.

[0022] As a preferred technical solution of the present invention, a main board mechanism that can be fitted with the clamping frame mechanism is arranged on the bottom surface of the main frame. The main board mechanism includes a main board fixedly connected to the main frame. A second heat conducting plate that fits the first heat conducting plate is fixedly embedded in the middle of the surface of the main board.

[0023] A first connecting plate fitted with a connecting plate is fixedly embedded on the surface end side of the main board.

[0024] As a preferred technical solution of the present invention, one end side of the main frame mechanism is assembled with a first side panel mechanism, and the other end side of the main frame mechanism is assembled with a second side panel mechanism;

[0025] The first side panel mechanism includes a first side panel that fits against the end face of the main frame, a second buckle slot adapted for inserting the buckle card is provided on the lower side of the first side panel, first connecting blocks adapted for inserting into the first buckle slot are fixedly connected to the corners at both ends of the inner surface of the first side panel, and a limit strip is fixedly connected to the middle portion of the inner surface of the first side panel;

[0026] The second side panel mechanism includes a second side panel that fits the end face of the main frame, a third buckle groove adapted for inserting a buckle card is provided on the lower side of the second side panel, and second connecting blocks adapted for inserting into the first buckle groove are fixedly connected to the corners at both ends of the inner surface of the second side panel, and a pressure plate adapted for inserting into the main frame is movably hinged to the upper end of the inner end of the second side panel through a rotating shaft.

[0027] LED lamp beads, including: LED bracket and chip mechanism;

[0028] The chip structure includes an LED chip, and third connecting plates are fixedly embedded at both ends of the surface of the LED chip;

[0029] The chip mechanism is plugged into the clamping mechanism, one of the third connecting plates is electrically connected to the second connecting plate, and the other of the third connecting plates is electrically connected to the first connecting plate.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] (1) The LED bracket and the LED lamp beads can be placed at an inclined angle by tilting the clamping mechanism, thereby improving the convenience of inserting the chip mechanism.

[0032] (2) After the LED bracket and LED lamp beads are leveled, the stickers are pressed by the spring pads to fit the sides of the LED chips to form automatic abutment, thereby improving the assembly automation performance of the chip mechanism.

[0033] (3) The LED bracket and LED lamp beads are pressed to allow the chip mechanism to follow and move into place. At the same time, the sticker further fixes the chip mechanism from the side under the elastic action of the spring pad, thereby improving the stability of the chip mechanism placement and further improving the stability of the assembled chip mechanism.

[0034] (4) The LED bracket and the LED lamp bead. The second buckle groove of the first side plate mechanism and the third buckle groove of the second side plate mechanism respectively clamp the clamping plate of the pin mechanism. In addition, the outer plate penetrates through the first and second card holes, and its outer end is buckled on the edge of the support plate, so that the connection of the pin mechanism is more stable, and the connection reliability of the LED lamp bead is improved.

[0035] (5) The LED bracket and the LED lamp bead. The flipped pressure plate simultaneously fits and buckles on the upper side of the chip mechanism, further completing the fixation of the chip mechanism, ensuring that the chip mechanism remains in the correct position during the encapsulation process and during use, preventing the chip mechanism from shifting due to external force factors, and improving the support stability of the LED bracket for the chip mechanism.

[0036] (6) The LED bracket and the LED lamp bead. The chip mechanism conducts heat through the second heat conducting plate and the first heat conducting plate, and is directly connected to the outside through the through holes provided on the support plate, enabling good heat exchange and improving the heat dissipation performance of the LED lamp bead.

[0037] (7) The LED bracket and the LED lamp bead. Through the reflecting mirror provided on the inner wall surface of the cover shell and the adjusting mirror assembly provided thereunder, the angle of the reflecting plate can be adjusted through the rotating shaft extending outside the cover shell, thereby changing the irradiation range of the light and improving the adjustability of the LED lamp bead. Description of the Drawings

[0038] Figure 1 is a schematic structural diagram of the present invention;

[0039] Figure 2 is a schematic diagram of the flat placement of the chip mechanism of the present invention;

[0040] Figure 3 is a schematic diagram of the chip mechanism tilting up of the present invention;

[0041] Figure 4 is a schematic diagram of the solder pad assembly of the present invention;

[0042] Figure 5 is a schematic diagram of the chip mechanism of the present invention;

[0043] Figure 6 is a schematic diagram of the main frame mechanism of the present invention;

[0044] Figure 7 is a schematic diagram of the pin mechanism of the present invention;

[0045] Figure 8 is a schematic diagram of the main board mechanism of the present invention;

[0046] Figure 9 is a schematic diagram of the clamping frame mechanism of the present invention;

[0047] Figure 10Schematic diagram of the first side plate mechanism of the present invention;

[0048] Figure 11 Schematic diagram of the tilting of the clamping mechanism of the present invention;

[0049] Figure 12 Schematic diagram of the second side plate mechanism of the present invention;

[0050] Figure 13 Schematic diagram of the bracket mechanism of the present invention;

[0051] Figure 14 Schematic diagram of the housing of the present invention.

[0052] In the figure: 1. Bracket mechanism; 101. Support plate; 102. Through hole; 103. Side frame; 104. First card hole; 105. Housing; 106. Second card hole; 107. Reflector; 108. Reflecting plate; 109. Rotating shaft; 2. Main frame mechanism; 201. Main frame; 202. Pin slot; 203. First heat conducting plate; 204. First buckle slot; 205. Spring washer; 206. Sticker; 208. Cutting surface; 3. Pin mechanism; 301. Outer plate; 302. Card plate; 303. Connecting plate; 4. Main board mechanism; 401. Main board; 402. Second heat conducting plate; 403. First connecting plate; 5. First side plate mechanism; 501. First side plate; 502. Second buckle slot; 503. First connecting block; 504. Limiting strip; 6. Second side plate mechanism; 601. Second side plate; 602. Third buckle slot; 603. Second connecting block; 604. Pressing plate; 7. Clamping mechanism; 701. Clamping frame; 702. Second connecting plate; 703. Shaft block; 704. Connecting shaft; 705. Baffle; 706. Pressing strip; 707. Bottom strip; 8. Chip mechanism; 801. LED chip; 802. Third connecting plate. Detailed implementation manners

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0054] Embodiment: Please refer to Figure 4 , Figure 6 , Figure 7 , Figure 9 , Figure 11 , Figure 13 , an LED bracket, including a bracket mechanism 1, and the bracket mechanism 1 includes a support plate 101;

[0055] A pad assembly formed by splicing is arranged in the middle of the bracket mechanism 1;

[0056] The pad assembly includes a main frame mechanism 2, and the main frame mechanism 2 includes a main frame 201 fixedly connected to a support plate 101. At both ends of the bottom surface of the main frame 201, pin slots 202 are respectively formed;

[0057] A pin mechanism 3 is adaptively inserted into the pin slots 202;

[0058] A tilting clamp mechanism 7 is movably hinged inside the pad assembly;

[0059] On the opposite sides of the main frame 201, pressing assemblies are respectively arranged. The pressing assembly includes a spring pad 205 fixedly connected to the main frame 201. The spring pad 205 is made of an elastic material. On the inner side of the spring pad 205, a sticker 206 is fixedly connected. The upper surface of the sticker 206 is inclined, and a cut surface 208 is formed at one end of the sticker 206;

[0060] The clamp mechanism 7 includes a clamp 701. A second connecting plate 702 is fixedly embedded on the surface of the clamp 701. When the clamp mechanism 7 is horizontally placed, the second connecting plate 702 is in contact with the connecting plate 303. On one side of the clamp 701, a shaft block 703 is fixedly connected. At both ends of the shaft block 703, connecting shafts 704 are respectively fixedly connected. The connecting shafts 704 are movably connected to the main frame 201 through bearings. In the middle of the upper side of the shaft block 703, a baffle 705 for blocking the chip mechanism 8 is fixedly connected. At both ends of the upper side of the shaft block 703, pressing strips 706 with upturned ends are respectively fixedly connected. At both ends of the other side of the clamp 701, bottom strips 707 corresponding to the pressing strips 706 are respectively fixedly connected. The outer edge of the bottom strip 707 is smooth.

[0061] Please refer to Figure 13 、 Figure 14 , a through hole 102 is formed in the middle of the surface of the support plate 101;

[0062] On the opposite sides of the upper surface of the support plate 101, arc-shaped side frames 103 are respectively fixedly connected. A first card hole 104 for adaptively inserting the pin mechanism 3 is formed through the side frame 103;

[0063] A cover shell 105 is covered above the support plate 101. Second card holes 106 for adaptively inserting the pin mechanism 3 are respectively formed through the opposite sides of the cover shell 105. On the opposite sides of the inner wall of the cover shell 105, inclined reflectors 107 are respectively fixedly embedded. Below the reflectors 107, an adjustable-angle adjustment mirror assembly is correspondingly arranged;

[0064] The adjustment mirror assembly includes a reflector 108. In the middle of both ends of the reflector 108, rotating shafts 109 are respectively fixedly connected. The rotating shafts 109 penetrate and are movably connected to the cover shell 105.

[0065] Please refer to Figure 6 , a first heat conducting plate 203 corresponding to the through hole 102 is fixedly embedded in the middle of the bottom surface of the main frame 201. The first heat conducting plate 203 is made of a heat conducting material;

[0066] At both ends of the side of the main frame 201, first buckle grooves 204 with the inner ends bulging are respectively formed.

[0067] Please refer to Figure 1 、 Figure 7 , the pin mechanism 3 includes an outer plate 301, the outer end of the outer plate 301 is buckled on the edge of the support plate 101, and the outer plate 301 is adaptively inserted into the first card hole 104 and the second card hole 106;

[0068] A clamping plate 302 with the inner side recessed is fixedly connected to the inner end of the outer plate 301;

[0069] A connecting plate 303 adapted to be inserted into the pin groove 202 is fixedly connected to the inner end of the clamping plate 302.

[0070] Please refer to Figure 8 , on the bottom surface of the main frame 201, a main board mechanism 4 that can be engaged with the clamping mechanism 7 is provided. The main board mechanism 4 includes a main board 401 fixedly connected to the main frame 201. A second heat conducting plate 402 that fits the first heat conducting plate 203 is fixedly embedded in the middle of the surface of the main board 401, and the second heat conducting plate 402 is made of a heat conducting material;

[0071] A first connecting plate 403 that fits the connecting plate 303 is fixedly embedded in the side end of the surface of the main board 401.

[0072] Please refer to Figure 10 、 Figure 12 , a first side plate mechanism 5 is assembled on one end side of the main frame mechanism 2, and a second side plate mechanism 6 is assembled on the other end side of the main frame mechanism 2;

[0073] The first side plate mechanism 5 includes a first side plate 501 that fits the end face of the main frame 201. A second buckle groove 502 adapted to insert and buckle the clamping plate 302 is formed on the lower side of the first side plate 501. At both ends of the inner surface of the first side plate 501, first connecting blocks 503 adapted to be inserted into the first buckle grooves 204 are respectively fixedly connected. A limiting strip 504 is fixedly connected to the middle of the inner surface of the first side plate 501. When the clamping mechanism 7 tilts up, the limiting strip 504 and the baffle 705 are in contact;

[0074] The second side plate mechanism 6 includes a second side plate 601 that fits the end face of the main frame 201. A third buckle groove 602 adapted to insert and buckle the clamping plate 302 is formed on the lower side of the second side plate 601. At both ends of the inner surface of the second side plate 601, second connecting blocks 603 adapted to be inserted into the first buckle grooves 204 are respectively fixedly connected. The upper end of the inner end of the second side plate 601 is movably hinged through a rotating shaft with a pressing plate 604 adapted to be inserted into the main frame 201. When the pressing plate 604 is inserted into the main frame 201, it presses on the chip mechanism 8.

[0075] Please refer to Figure 1 、 Figure 2 、Figure 3 , Figure 5 , an LED lamp bead, comprising: an LED bracket and a chip mechanism 8;

[0076] The chip mechanism 8 includes an LED chip 801, and third connecting plates 802 are fixedly embedded at both ends of the surface of the LED chip 801;

[0077] The chip mechanism 8 is inserted into the clamping mechanism 7, one third connecting plate 802 is electrically connected to the second connecting plate 702, and the other third connecting plate 802 is electrically connected to the first connecting plate 403.

[0078] The working principle of the present invention is as follows:

[0079] The spring pad 205 makes the sticker 206 in a relatively inner state in the natural state. At this time, the bottom strip 707 is lapped on the cut surface 208 opened at the end of the sticker 206. Therefore, the clamping mechanism 7 tilts with the connecting shaft 704 as the axis. When installing the chip mechanism 8, the chip mechanism 8 is inserted between the pressing strip 706 and the bottom strip 707. The tilting of the clamping mechanism 7 enables the chip mechanism 8 to be placed at an inclined angle, thereby improving the convenience of inserting the chip mechanism 8.

[0080] When one side of the LED chip 801 is attached to the baffle 705, the chip mechanism 8 is inserted in place. Subsequently, the tilted end of the clamping mechanism 7 is pressed down with the connecting shaft 704 as the axis. Since the upper side of the sticker 206 is inclined, when pressing the clamping mechanism 7, the sticker 206 is squeezed outward. After the clamping mechanism 7 is leveled, the sticker 206 fits against the side of the LED chip 801 under the extrusion of the spring pad 205 to form an automatic abutment, improving the automatic assembly performance of the chip mechanism 8.

[0081] By pressing the clamping mechanism 7, the chip mechanism 8 follows into place. At the same time, the sticker 206 further fixes the chip mechanism 8 from the side under the elastic action of the spring pad 205, improving the stability of placing the chip mechanism 8 and further improving the stability of assembling the chip mechanism 8.

[0082] The connection board 303 of the pin mechanism 3 is inserted into the pin slot 202. When the first side plate mechanism 5 and the second side plate mechanism 6 are respectively inserted into the main frame mechanism 2, the second buckle slot 502 of the first side plate mechanism 5 and the third buckle slot 602 of the second side plate mechanism 6 correspondingly clamp the card plate 302 of the pin mechanism 3. In addition, the outer plate 301 penetrates through the first card hole 104 and the second card hole 106, and its outer end is buckled on the edge of the support plate 101, so that the connection of the pin mechanism 3 is more stable, improving the connection reliability of the LED lamp bead.

[0083] The main frame mechanism 2, the first side plate mechanism 5 and the second side plate mechanism 6 form a frame-shaped enclosure for the pad assembly, so that when the chip mechanism 8 is encapsulated in the traditional way, the seepage of the injected glue can be reduced, and the overall aesthetics of the LED lamp bead assembly can be improved.

[0084] After the second side plate mechanism 6 and the main frame mechanism 2 are inserted and installed, the pressing plate 604 is flipped from the outside and clamped into the main frame 201. The flipped pressing plate 604 is simultaneously attached and buckled on the upper side of the chip mechanism 8, further completing the fixation of the chip mechanism 8, ensuring that the chip mechanism 8 remains in the correct position during the encapsulation process and the use process, preventing the chip mechanism 8 from shifting due to external force factors, and improving the support stability of the LED bracket for the chip mechanism 8.

[0085] The chip mechanism 8 is fixed in all directions through a variety of structures, or only the edge linear sealing operation of the chip mechanism 8 can be carried out at the positions that need to be strengthened, which can make the maintenance, replacement or disassembly operation of the LED lamp beads more convenient and improve the recyclability of the LED lamp beads.

[0086] The chip mechanism 8 conducts heat through the second heat conducting plate 402 and the first heat conducting plate 203, and is directly connected to the outside through the through hole 102 opened on the supporting plate 101, enabling good heat exchange and improving the heat dissipation performance of the LED lamp beads.

[0087] Through the reflecting mirror 107 arranged on the inner wall surface of the cover 105 and the adjusting mirror assembly arranged below it, the angle of the reflecting plate 108 can be adjusted through the rotating shaft 109 extending outside the cover 105, thereby changing the irradiation range of the light and improving the adjustability of the LED lamp beads.

[0088] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. LED bracket, including a bracket mechanism (1), and the bracket mechanism (1) includes a tray (101); A pad assembly formed by splicing is arranged in the middle of the bracket mechanism (1); The pad assembly includes a main frame mechanism (2), and the main frame mechanism (2) includes a main frame (201) fixedly connected to the tray (101). Pin slots (202) are respectively formed at both ends of the bottom surface of the main frame (201); Pin mechanisms (3) are adaptively inserted into the pin slots (202); It is characterized in that: A clamping frame mechanism (7) that tilts up is movably hinged in the pad assembly; Extrusion components are respectively arranged on the opposite sides of the main frame (201). The extrusion components include elastic pads (205) fixedly connected to the main frame (201). A sticker (206) is fixedly connected to the inner side of the elastic pad (205). The upper side of the sticker (206) is inclined, and a cut surface (208) is formed at one end of the sticker (206); The clamping frame mechanism (7) includes a clamping frame (701). A second connecting plate (702) is fixedly embedded on the surface of the clamping frame (701). A shaft block (703) is fixedly connected to one side of the clamping frame (701). Connecting shafts (704) are respectively fixedly connected to both ends of the shaft block (703). The connecting shafts (704) are movably connected to the main frame (201) through bearings. A baffle (705) is fixedly connected to the middle of the upper side of the shaft block (703). Pressing strips (706) with upturned ends are respectively fixedly connected to both ends of the upper side of the shaft block (703). Bottom strips (707) corresponding to the pressing strips (706) are respectively fixedly connected to both ends of the other side of the clamping frame (701). The outer edges of the bottom strips (707) are smooth.

2. The LED bracket according to claim 1, characterized in that: A through hole (102) is formed in the middle of the surface of the tray (101); Arc-shaped side frames (103) are respectively fixedly connected to the opposite sides of the upper surface of the tray (101). First card holes (104) for adaptively inserting the pin mechanisms (3) are formed through the side frames (103); A cover shell (105) is covered above the tray (101). Second card holes (106) for adaptively inserting the pin mechanisms (3) are respectively formed through the opposite sides of the cover shell (105). Inclined reflectors (107) are respectively fixedly embedded on the opposite inner walls of the cover shell (105). An adjustable angle adjustment mirror assembly is correspondingly arranged below the reflectors (107); The adjustment mirror assembly includes a reflector (108). Rotating shafts (109) are respectively fixedly connected to the middle parts of both ends of the reflector (108). The rotating shafts (109) penetrate and are movably connected to the cover shell (105).

3. The LED bracket according to claim 2, wherein: A first heat conducting plate (203) corresponding to the through hole (102) is fixedly embedded in the middle of the bottom surface of the main frame (201); First buckle grooves (204) with bulging inner ends are respectively formed at the corners of both ends of the side surface of the main frame (201).

4. The LED bracket according to claim 3, wherein: The pin mechanism (3) includes an outer plate (301). The outer end of the outer plate (301) is buckled on the edge of the tray (101). The outer plate (301) is adaptively inserted into the first card hole (104) and the second card hole (106); The inner end of the outer plate (301) is fixedly connected with a clamping plate (302) sunken at the side; The inner end of the clamping plate (302) is fixedly connected with a connecting plate (303) adapted to the plug-in pin slot (202).

5. The LED bracket according to claim 4, wherein: On the bottom surface of the main frame (201), there is a main board mechanism (4) that can be fitted with the clamping frame mechanism (7). The main board mechanism (4) includes a main board (401) fixedly connected to the main frame (201). In the middle of the surface of the main board (401), a second heat conducting plate (402) that fits the first heat conducting plate (203) is fixedly embedded; On the end side of the surface of the main board (401), a first connecting plate (403) that fits the connecting plate (303) is fixedly embedded.

6. The LED bracket according to claim 4, characterized in that: One end side of the main frame mechanism (2) is assembled with a first side plate mechanism (5), and the other end side of the main frame mechanism (2) is assembled with a second side plate mechanism (6); The first side plate mechanism (5) includes a first side plate (501) that fits the end face of the main frame (201). A second buckle groove (502) adapted to the plug-in buckle clamping plate (302) is opened on the lower side of the first side plate (501). At the two ends of the inner surface of the first side plate (501), first connecting blocks (503) adapted to the first buckle groove (204) are respectively fixedly connected. A limiting strip (504) is fixedly connected to the middle of the inner surface of the first side plate (501); The second side plate mechanism (6) includes a second side plate (601) that fits the end face of the main frame (201). A third buckle groove (602) adapted to the plug-in buckle clamping plate (302) is opened on the lower side of the second side plate (601). At the two ends of the inner surface of the second side plate (601), second connecting blocks (603) adapted to the first buckle groove (204) are respectively fixedly connected. The upper end of the inner end of the second side plate (601) is movably hinged through a rotating shaft with a pressing plate (604) adapted to the main frame (201).

7. LED lamp bead, characterized in that, Comprising: The LED bracket and the chip mechanism (8) according to any one of claims 1 to 6; The chip mechanism (8) includes an LED chip (801). Third connecting plates (802) are respectively fixedly embedded at both ends of the surface of the LED chip (801); The chip mechanism (8) is plugged on the clamping frame mechanism (7). One of the third connecting plates (802) is electrically connected to the second connecting plate (702), and the other third connecting plate (802) is electrically connected to the first connecting plate (403).

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